Laser debonding method and apparatus for composite multilayer bonded assemblies

Abstract

The application discloses a kind of composite multilayer adhesive laser debonding method and device, it is related to debonding separation technical field, the debonding method is implemented using debonding device following steps: step S1, determine the impact surface of composite multilayer adhesive and the laser parameter of laser emitter;Step S2, obtain the length and width of sample laser impact debonding area;Step S3, determine laser impact spot lap rate and impact path;Step S4, the impact surface of composite multilayer adhesive is laser impacted, and the adhesive after impact is obtained;Step S5, compare the distribution position information and area of the area of non-debonding region;Step S6, determine whether the adhesive meets the separation debonding condition;Step S7, when meeting the condition, vacuum chuck mechanical arm is controlled by supercomputing server to separate the adhesive, and the debonding of entire adhesive is completed.The method and device of the application have the characteristics of not damaging matrix material, high efficiency and environmental protection.

Description

Technical Field

[0001] This invention relates to the field of debonding and separation technology, and in particular to a method and apparatus for debonding multilayer adhesive components made of composite materials. Background Technology

[0002] Compared to mechanical connections (bolts, riveting) or welding, bonding offers numerous advantages, including significantly reducing the number of fasteners, avoiding complex secondary structural designs, preserving fiber continuity, eliminating electrochemical corrosion issues, reducing stress concentration, and improving the fatigue performance of bonded composite structural components. It has been widely used in aerospace, wind power, automotive, shipbuilding, and rail transportation industries.

[0003] Multilayer composite adhesives are widely used in aircraft components such as skins, gratings, and wing ribs. However, inconsistent fiber placement can lead to a mismatch in stiffness between layers, resulting in high interlaminar stress. Since the weaker resin matrix is ​​susceptible to damage from interlaminar stress, delamination often occurs at the bond interface. During processing, assembly, and service, multilayer composite adhesives subjected to alternating loads can develop fatigue cracks, leading to delamination at the bond interface. This results in a sharp loss of material strength and stiffness, a significant reduction in load-bearing capacity, and ultimately, the multilayer composite adhesive will fail to meet performance requirements.

[0004] To make full use of resources, debonding treatment should be performed on multilayer composite adhesives that do not meet usage requirements. However, the commonly used methods for debonding multilayer composite adhesives are chemical reagent treatment and mechanical debonding treatment. Both of these methods can damage the matrix material and even pollute the environment. The processing is also cumbersome and inefficient.

[0005] Therefore, how to efficiently achieve debonding and separation of the bonding interface of multilayer composite adhesives is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide a laser debonding method for multilayer composite material bonding components that is efficient and environmentally friendly, without damaging the substrate material.

[0007] Another objective of this invention is to provide an apparatus for a laser debonding method for multilayer composite material bonding that is efficient and environmentally friendly, without damaging the substrate material.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0009] A laser debonding method for multilayer adhesive composite materials includes:

[0010] Step S1: Scan the multilayer adhesive component of composite material using an optical three-dimensional scanning measurement system and upload it to a supercomputing server for analysis to obtain the shape, size, area, and location of the interface to be debonded. The supercomputing server determines the impact surface of the multilayer adhesive component of composite material based on the location of the interface to be debonded, and determines the laser parameters of the laser emitter based on the thickness of the multilayer adhesive component of composite material and the location of the interface to be debonded.

[0011] Step S2: Adhere the black absorption layer to the impact surface, apply a transparent constraint layer to the surface of the black absorption layer, and perform a test laser impact on the impact surface. After the test laser impact is completed, remove the transparent constraint layer. By detecting the test laser impact area, obtain the length and width of the debonded area of ​​the test laser impact.

[0012] Step S3: The supercomputing server determines the laser shock spot overlap rate based on the length and width of the laser shock debonding area of ​​the sample in this test; and also determines the impact path based on the length and width of the multilayer adhesive of the composite material and the length and width of the laser shock debonding area of ​​the sample in this test.

[0013] Step S4: Apply a transparent constraint layer to the surface of the black absorption layer, and use a laser with determined laser parameters to perform laser impact on the impact surface of the composite multilayer adhesive along the impact path to obtain the impacted adhesive.

[0014] Step S5: Scan the debonded area of ​​the bonded part after impact using an ultrasonic phased array device to obtain C-scan image data and upload it to the supercomputing server. The supercomputing server compares the image data with the bonded part image data obtained in step S1 to obtain the distribution location information and area of ​​the undebonded area.

[0015] Step S6: Determine whether the bonded parts meet the separation and debonding conditions based on the area of ​​the unbonded area: If the ratio of the area of ​​the unbonded area to the area of ​​the bonded parts is greater than 5%, and the separation and debonding conditions are not met, replace the black absorption layer, reapply a transparent constraint layer on the surface of the black absorption layer, and use a laser with determined laser parameters to impact the unbonded area. After obtaining the bonded parts after impact, proceed to step S5; If the ratio of the area of ​​the unbonded area to the area of ​​the bonded parts is less than or equal to 5%, and the separation and debonding conditions are met, proceed to the next process step S7.

[0016] Step S7: The supercomputing server controls the vacuum suction cup robotic arm to separate the bonded parts, completing the debonding of the entire bonded part.

[0017] Preferably, in step S1, the laser parameters include the size of the laser spot and the laser pulse width, and the size of the square laser spot is determined based on the thickness of the multilayer composite material bond. The impact surface is determined based on the location of the interface to be debonded. The side with the shortest distance from the interface to be debonded to the surface of the multilayer composite adhesive is determined as the impact surface of the laser.

[0018] Determine the laser pulse width based on the location of the interface to be debonded:

[0019] ;

[0020] Where i represents the layup of the composite multilayer adhesive; n represents the position of the adhesive layer; j represents the position of the interface to be debonded, j=0 is the interface of the nth adhesive layer closest to the impact surface, j=1 is the interface far from the impact surface; m is the number of layups in the composite multilayer adhesive; H pi H represents the thickness of each layer in a multilayer composite adhesive; b C represents the thickness of the adhesive layer in a multilayer composite bonding component. pi C represents the propagation velocity of the shock wave in each layup of a multilayer composite bond; b This refers to the propagation speed of the shock wave in the adhesive layer of a multilayer composite adhesive.

[0021] If all layers of a multilayer composite bond are of equal thickness and made of the same material, the formula can be simplified as follows:

[0022] ;

[0023] Select the appropriate laser pulse energy based on the dynamic fracture strength of the interface to be debonded in the multilayer composite bonding component.

[0024] Preferably, in step S2, the method for obtaining the length and width of the debonding area of ​​the sample by laser shock is as follows: After the sample is subjected to laser shock, the transparent constraint layer is removed, and the bonded part after shock is C-scanned by an ultrasonic phased array device to obtain the image data of the debonding area generated by the shock and upload it to the supercomputing server for analysis. After determining the length and width of the debonding area of ​​the sample by laser shock, ...

[0025] Preferably, in step S3, the laser shock spot overlap rate includes the lateral spot overlap rate. and longitudinal beam overlap rate The calculation formula is as follows:

[0026] ;

[0027] ;

[0028] Where L is the size of the laser square spot, and x and y are the length and width of the laser-impacted debonding area of ​​the sample in this test.

[0029] Preferably, the black absorbent layer is a black adhesive tape layer, and the transparent constraint layer is a water flow layer.

[0030] Preferably, the application of the black tape layer is accomplished by an automatic tape-applying robotic arm; the application of the water layer is accomplished by a water-applying robotic arm.

[0031] An apparatus for a laser debonding method for multilayer composite adhesives includes:

[0032] The supercomputing server controls the vacuum suction cup robotic arm control system and the laser impact device based on the data information provided by the optical three-dimensional scanning measurement system and the ultrasonic phased array device, and provides the laser impact device with laser parameters, impact surface, laser impact spot overlap rate and impact path;

[0033] The laser impact device is used to perform laser impact on the multilayer adhesive composite material, causing the adhesive interface to debond.

[0034] The ultrasonic phased array device is used to acquire C-scan image data of the debonding area generated by the laser shock of the sample; it is also used to scan the bonded parts after the shock to acquire C-scan image data of the entire interface to be debonded.

[0035] The optical three-dimensional scanning measurement system is used to scan the shape, size, and area of ​​multilayer composite material adhesives.

[0036] The vacuum suction cup robotic arm control system is used to adsorb multilayer composite material adhesives for laser debonding, and to separate multilayer composite material adhesives that have undergone interface debonding.

[0037] Preferably, the laser shock device includes a laser emitting device, which includes a laser emitter, a reflector, a focusing lens, and an optical diffraction element. The laser emitted by the laser emitter is reflected by the reflector and focused by the focusing lens. After passing through the optical diffraction element, it forms a laser beam. The laser beam passes through the transparent constraint layer and the black absorption layer in sequence and forms a high-level tensile stress wave at the bonding interface of the composite multilayer adhesive.

[0038] Preferably, the laser impact device further includes a cooling tank, an automatic water coating system, and an automatic tape-applying robotic arm. The automatic water coating system includes a water tank and a water coating robotic arm, and the water coating robotic arm is equipped with a water supply pipe connected to the water tank. The supercomputing server controls the operation of the automatic water coating robotic arm and the automatic tape-applying robotic arm. The supercomputing server controls the circulation and cooling of the water in the cooling tank into the laser emitter.

[0039] Preferably, the laser emitter is a rubidium glass laser emitter.

[0040] The beneficial effects of this invention are as follows: Compared with existing chemical reagent treatment and mechanical debonding treatment, the laser debonding method adopted by this invention not only improves the efficiency of debonding, but also does not damage the substrate material. Furthermore, it does not cause pollution to the surrounding environment during the debonding process, making it more environmentally friendly. Attached Figure Description

[0041] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort:

[0042] Figure 1 This is a flowchart of the present invention;

[0043] Figure 2 This is a schematic diagram of a multilayer composite material adhesive structure provided in an embodiment of this application;

[0044] Figure 3 This is a schematic diagram of the laser shock path provided in an embodiment of this application;

[0045] Figure 4 This is a schematic diagram of the apparatus used in the laser debonding method for multilayer composite material bonding components in this application.

[0046] Figure 5 for Figure 4 The diagram shows the structure of the laser emitting device.

[0047] Figure 6 for Figure 4 The diagram shows the structure of the vacuum suction cup robotic arm.

[0048] In the diagram: 1. Supercomputing server; 2. Laser shock device; 3. Ultrasonic phased array device; 4. Optical 3D scanning measurement system; 5. Vacuum suction cup robotic arm control system; 6. Composite material multilayer adhesive component; 7. Worktable; 21. Water tank; 22. Automatic tape application robotic arm; 23. Water coating robotic arm; 24. Laser emitting device; 31. Ultrasonic phased array board; 32. Probe encoder connector; 33. Phased array probe; 41. CCD camera; 42. Projection lens; 43. Three-degree-of-freedom automation device; 51. Vacuum suction cup robotic arm; 71. Suction cup; 201. Laser emitter; 202. Reflector; 203. Focusing lens; 204. Optical diffraction element; 205. Laser beam; 206. Transparent constraint layer; 207. Black absorption layer; 208. High-level tensile stress wave; 241. Cooling box; 511. Suction cup; 512. Guide rail; 513. Stepper motor; 514. Pneumatic system; 515. DuPont wire; 516. Base; 517. Robotic arm body; 518. Vacuum generator; 519. Controller unit. Detailed Implementation

[0049] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0050] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper surface," "lower surface," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "forward," "reverse," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0051] like Figure 1 As shown, combined with Figure 2 A piece of glass fiber reinforced polymer with a length a = 600 mm, a width b = 300 mm, and a thickness w = 22 mm has 4 layups and 3 adhesive layers. The layups are glass fiber reinforced polymer layups with a thickness Hp = 4 mm, and the adhesive layers are H... b Taking a multilayer composite material bonded part formed by a 2mm thick epoxy resin adhesive as an example, it is now necessary to address the interface where n=2 and j=0 (as shown in the attached diagram). Figure 2 As shown in Figure 3, P is the bonding interface. Debonding and separation are performed to illustrate the implementation process of a laser debonding and separation method for multilayer composite material adhesives according to the present invention, which includes the following steps:

[0052] Step S1: Using an optical three-dimensional scanning measurement system, scan the multilayer adhesive component of the composite material and upload the data to a supercomputing server for analysis to obtain the shape, size, area, and location of the debonding interface of the adhesive component. In this embodiment, the obtained shape of the adhesive component is a flat plate with dimensions of 600mm × 300mm × 22mm and an area of ​​0.18m². 2 The adhesive has four plies. The interface to be debonded is the adhesive layer between the first and second plies on the upper surface. The impact surface is determined based on the location of the interface to be debonded. The side with the shortest distance from the interface to be debonded to the surface of the composite multilayer adhesive is determined as the laser impact surface. In this embodiment, the upper surface of the composite multilayer adhesive is the shortest distance from the interface to be debonded, so the upper surface of the composite multilayer adhesive is the laser impact surface.

[0053] Based on the thickness of the multilayer composite bond (22mm), determine the size of the laser square spot: The size of the light spot is taken .

[0054] Determine the laser pulse width based on the location of the interface to be debonded:

[0055] ;

[0056] Where i represents the layup of the composite multilayer adhesive; n represents the position of the adhesive layer; j represents the position of the interface to be debonded, j=0 is the interface of the nth adhesive layer closest to the impact surface, j=1 is the interface far from the impact surface; m is the number of layups in the composite multilayer adhesive; H pi H represents the thickness of each layer in a multilayer composite adhesive; b C represents the thickness of the adhesive layer in a multilayer composite bonding component. pi C represents the propagation velocity of the shock wave in each layup of a multilayer composite bond; b This refers to the propagation speed of the shock wave in the adhesive layer of a multilayer composite adhesive.

[0057] If all layers of a multilayer composite bond are of equal thickness and made of the same material, the formula can be simplified as follows:

[0058] ;

[0059] In this embodiment: m=4, n=2, Hp=0.004m, H b =0.002m,C pi =3000m / s,

[0060] C b =3000m / s, j=0 interface, substitute the above variables into the above formula:

[0061] Laser pulse width ;

[0062] The appropriate laser pulse energy is selected based on the dynamic fracture strength of the interface to be debonded in the multilayer composite material bond, and the laser pulse energy is set to 10J.

[0063] Step S2: The black absorbent layer is adhered to the impact surface, and a transparent constraint layer is applied to the surface of the black absorbent layer. The impact surface is subjected to a test laser shock. The length and width of the debonded area of ​​the test laser shock are obtained by detecting the area of ​​the test laser shock. The black absorbent layer is a black adhesive tape layer, and the transparent constraint layer is a water flow layer. The application of the black adhesive tape layer is completed by an automatic tape application robot arm. The application of the water flow layer is completed by a water coating robot arm.

[0064] Specifically, the method for obtaining the length and width of the debonding area of ​​the sample by laser shock is as follows: After the laser shock of the sample is completed, the transparent constraint layer is removed, and the bonded part after the shock is C-scanned by an ultrasonic phased array device to obtain the image data of the debonding area generated by the shock and upload it to the supercomputing server for analysis. The length x of the debonding area of ​​the sample by laser shock is determined to be 35mm and the width y is 34mm.

[0065] Step S3: The supercomputing server determines the laser shock spot overlap rate based on the length and width of the laser shock debonding area of ​​the sample in this test; and also determines the impact path based on the length and width of the multilayer adhesive of the composite material and the length and width of the laser shock debonding area of ​​the sample in this test.

[0066] Specifically, the laser shock beam overlap rate includes the lateral beam overlap rate. and longitudinal beam overlap rate The calculation formula is as follows:

[0067] ;

[0068] ;

[0069] Where L is the size of the laser square spot, and x and y are the length and width of the laser-impacted debonding area of ​​the sample in this test.

[0070] In this embodiment: x=35mm, y=34mm, and L in the above formula refers to the size of the light spot. After substituting the above variables into the above formula, the supercomputing server analyzes and calculates the laser shock spot overlap rate. , .

[0071] Step S4: Apply a transparent constraint layer to the surface of the black absorption layer, and use a laser with determined laser parameters to perform laser impact on the impact surface of the multilayer composite adhesive along the impact path to obtain the impacted adhesive. The impact path is as follows: Figure 3 As shown;

[0072] Step S5: The debonding area of ​​the bonded component after impact is scanned using an ultrasonic phased array device to obtain C-scan image data, which is then uploaded to the supercomputing server. The supercomputing server compares this image data with the bonded component image data obtained in step S1 using ICMeasure software for layer overlay comparison. Figure 3 In the process, the distribution location information and area G of the undebonded regions are obtained. Figure 3 In the diagram, F is the dividing line, and E is the area that has detached from the adhesive.

[0073] Step S6: Determine whether the bonded parts meet the separation and debonding conditions based on the area of ​​the unbonded area: If the ratio of the area of ​​the unbonded area to the area of ​​the bonded parts is greater than 5%, and the separation and debonding conditions are not met, replace the black absorption layer, reapply a transparent constraint layer on the surface of the black absorption layer, and use a laser with determined laser parameters to impact the unbonded area. After obtaining the bonded parts after impact, proceed to step S5; If the ratio of the area of ​​the unbonded area to the area of ​​the bonded parts is less than or equal to 5%, and the separation and debonding conditions are met, proceed to the next process step S7.

[0074] Step S7: The supercomputing server controls the vacuum suction cup robotic arm to separate the bonded parts, completing the debonding of the entire bonded part.

[0075] like Figure 4 As shown, an apparatus for a laser debonding method for multilayer composite adhesives includes a supercomputing server 1, a laser shock device 2, an ultrasonic phased array device 3, an optical three-dimensional scanning measurement system 4, and a vacuum suction cup robotic arm control system 5. The supercomputing server 1 controls the vacuum suction cup robotic arm control system 5 and the laser shock device 2 based on the data information provided by the optical three-dimensional scanning measurement system 4 and the ultrasonic phased array device 3, and provides the laser shock device 2 with laser parameters, impact surface, laser shock spot overlap rate, and impact path.

[0076] like Figure 5 As shown, the laser shock device 2 applies laser shock to multilayer composite material adhesives, causing debonding at the adhesive interface. The laser shock device 2 includes a laser emitting device 24, which comprises a laser emitter 201, a reflector 202, a focusing lens 203, and an optical diffraction element 204. The laser emitted by the laser emitter 201 is reflected by the reflector 202, focused by the focusing lens 203, and then passes through the optical diffraction element 204 to form a laser beam 205. This laser beam 205 passes sequentially through a transparent constraint layer 206 and a black absorption layer 207, forming a high-level tensile stress wave 208 at the adhesive interface of the multilayer composite material adhesive. The laser emitter 201 is a rubidium glass laser emitter.

[0077] like Figure 4 As shown, the laser shock device 2 also includes a cooling tank 241, an automatic water coating system, and an automatic tape-applying robotic arm 22. The automatic water coating system includes a water tank 21 and a water coating robotic arm 23. The water coating robotic arm 23 is equipped with a water supply pipe connected to the water tank 21. The supercomputing server controls the operation of the automatic water coating robotic arm 23 and the automatic tape-applying robotic arm 22. The supercomputing server controls the circulation cooling of the water in the cooling tank 241 into the laser emitter 201.

[0078] The ultrasonic phased array device 3 is used to acquire C-scan image data of the debonding area generated by the laser shock of the sample; it is also used to scan the bonded parts after the shock to acquire C-scan image data of the entire interface to be debonded.

[0079] The supercomputing server 1 controls the ultrasonic phased array board 31 of the ultrasonic phased array device 3 to control the phased array probe 33 to detect the composite multilayer adhesive 6 through the probe encoder connector 32.

[0080] The ultrasonic phased array device 3 has a detection range of 0~5000 mm, a sound velocity range of 900~9000 m / s, a tube voltage adjustment range of 25 KV ~ 300 KV, and a radiation angle of 10°~45°.

[0081] The optical 3D scanning measurement system 4 is used to scan the shape, size, and area of ​​multilayer composite material adhesives. The light source of the optical 3D scanning measurement system 4 is an LED light source; the measurement area is 200×130 mm² ~ 800×800 mm²; the point spacing is 0.013 mm ~ 0.278 mm; the working distance is 750 mm ~ 1050 mm; and the large 3D scanning field measurement range can reach 2000 mm. The optical 3D scanning measurement system includes two CCD cameras 41 positioned left and right, a projection lens 42 positioned in the middle between the two CCD cameras, and a three-degree-of-freedom automated device 43, and is connected to the supercomputing server 1.

[0082] The vacuum suction cup robotic arm control system 5 is used to adsorb multilayer composite material adhesives for laser debonding and to separate multilayer composite material adhesives with debonded interfaces.

[0083] like Figure 6As shown, the vacuum suction cup robotic arm 51 in the vacuum suction cup robotic arm control system 5 includes six suction cups 511, a guide rail 512, a stepper motor 513, an air circuit system 514, DuPont wires 515, a base 516, a robotic arm body 517, a vacuum generator 518, and a controller unit 519. The six suction cups 511 are slidably adjusted via the guide rail 512. The controller unit 519 controls the operation of the stepper motor 513 via the DuPont wires 515. The air circuit system 514 controls the movement direction, speed, and force of the suction cups to ensure precise control of the suction-type end effector. The vacuum generator 518 uses a solenoid valve or vacuum pump to generate negative pressure. By connecting the suction cups and the cylinder, it realizes the suction and release of the suction cups. The base 516 and the robotic arm body 517 maintain the overall device. Using lasers with the same parameters, the unbonded areas are impacted sequentially until the ratio of the area of ​​the unbonded area to the area of ​​the bonded component is less than or equal to 5%. Then, the supercomputing server 1 controls the vacuum suction cup robotic arm 51 to separate the multi-layer composite material bonded component 6. The bottom surface of the multi-layer composite material bonded component 6 is placed on the worktable 7. The suction cups 71 on the worktable 7 adsorb and fix the multi-layer composite material bonded component 6. During separation, the vacuum suction cup robotic arm 51 moves the six suction cups 511 to the upper surface of the multi-layer composite material bonded component 6 and adsorbs the upper surface of the multi-layer composite material bonded component 6. When the vacuum suction cup robotic arm 51 lifts the upper surface of the multi-layer composite material bonded component 6, it separates at the bonding interface of the multi-layer composite material bonded component 6 that has been heated and melted by the laser, thus completing the debonding work of the entire bonded component.

[0084] Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described herein, as well as the features of those embodiments or examples, without contradiction. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A laser debonding method for multilayer composite material adhesives, characterized in that, Includes the following steps: Step S1: Scan the multilayer adhesive component of composite material using an optical three-dimensional scanning measurement system and upload it to a supercomputing server for analysis to obtain the shape, size, area, and location of the interface to be debonded. The supercomputing server determines the impact surface of the multilayer adhesive component of composite material based on the location of the interface to be debonded, and determines the laser parameters of the laser emitter based on the thickness of the multilayer adhesive component of composite material and the location of the interface to be debonded. Laser parameters include the spot size and pulse width. The size of the square laser spot is determined based on the thickness of the multilayer composite adhesive. The impact surface is determined based on the location of the interface to be debonded. The side with the shortest distance from the interface to be debonded to the surface of the multilayer composite adhesive is determined as the impact surface of the laser. Determine the laser pulse width based on the location of the interface to be debonded: ； Where i represents the layup of the composite multilayer adhesive; n represents the position of the adhesive layer; j represents the position of the interface to be debonded, j=0 is the interface of the nth adhesive layer closest to the impact surface, j=1 is the interface far from the impact surface; m is the number of layups in the composite multilayer adhesive; H pi H represents the thickness of each layer in a multilayer composite adhesive; b C represents the thickness of the adhesive layer in a multilayer composite bonding component. pi C represents the propagation velocity of the shock wave in each layup of a multilayer composite bond; b This refers to the propagation speed of the shock wave in the adhesive layer of a multilayer composite adhesive. If all layers of a multilayer composite bond are of equal thickness and made of the same material, the formula can be simplified as follows: ； Select the appropriate laser pulse energy based on the dynamic fracture strength of the interface to be debonded in the multilayer composite material bond; Step S2: Adhere the black absorption layer to the impact surface, apply a transparent constraint layer to the surface of the black absorption layer, and perform a test laser impact on the impact surface. After the test laser impact is completed, remove the transparent constraint layer. By detecting the test laser impact area, obtain the length and width of the debonded area of ​​the test laser impact. The method for obtaining the length and width of the debonding area of ​​the sample by laser shock in this test is as follows: After the laser shock of the sample is completed and the transparent constraint layer is removed, the bonded part after the shock is C-scanned by an ultrasonic phased array device to obtain the image data of the debonding area generated by this shock and upload it to the supercomputing server for analysis to determine the length and width of the debonding area of ​​the sample by laser shock in this test. Step S3: The supercomputing server determines the laser shock spot overlap rate based on the length and width of the laser shock debonding area of ​​the sample in this test; and also determines the impact path based on the length and width of the multilayer adhesive of the composite material and the length and width of the laser shock debonding area of ​​the sample in this test. Laser shock beam overlap rate includes lateral beam overlap rate and longitudinal light spot overlap rate The calculation formula is as follows: ； ； Where L is the size of the laser square spot, and x and y are the length and width of the laser-impacted debonding area of ​​the sample in this test. Step S4: Apply a transparent constraint layer to the surface of the black absorption layer, and use a laser with determined laser parameters to perform laser impact on the impact surface of the composite multilayer adhesive along the impact path to obtain the impacted adhesive. Step S5: Scan the debonded area of ​​the bonded part after impact using an ultrasonic phased array device to obtain C-scan image data and upload it to the supercomputing server. The supercomputing server compares the image data with the bonded part image data obtained in step S1 to obtain the distribution location information and area of ​​the undebonded area. Step S6: Determine whether the bonded parts meet the separation and debonding conditions based on the area of ​​the unbonded area: If the ratio of the area of ​​the unbonded area to the area of ​​the bonded parts is greater than 5%, and the separation and debonding conditions are not met, replace the black absorption layer, reapply a transparent constraint layer on the surface of the black absorption layer, and use a laser with determined laser parameters to impact the unbonded area. After obtaining the bonded parts after impact, proceed to step S5; If the ratio of the area of ​​the unbonded area to the area of ​​the bonded parts is less than or equal to 5%, and the separation and debonding conditions are met, proceed to the next process step S7. Step S7: The supercomputing server controls the vacuum suction cup robotic arm to separate the bonded parts, completing the debonding of the entire bonded part.

2. The laser debonding method for multilayer composite material adhesives according to claim 1, characterized in that: The black absorbent layer is a black adhesive tape layer, and the transparent constraint layer is a water flow layer.

3. The laser debonding method for multilayer composite material adhesives according to claim 2, characterized in that: The application of the black tape layer is accomplished by an automated tape-applying robotic arm; the application of the water flow layer is accomplished by a water-applying robotic arm.

4. An apparatus for laser debonding method of composite multilayer adhesive parts according to any one of claims 1-3, comprising: The supercomputing server controls the vacuum suction cup robotic arm control system and the laser impact device based on the data information provided by the optical three-dimensional scanning measurement system and the ultrasonic phased array device, and provides the laser impact device with laser parameters, impact surface, laser impact spot overlap rate and impact path; The laser impact device is used to emit laser light and perform laser impact on the multilayer adhesive composite material to cause the adhesive interface to debond. The ultrasonic phased array device is used to acquire C-scan image data of the debonding area generated by the laser shock of the sample; it is also used to scan the bonded parts after the shock to acquire C-scan image data of the entire interface to be debonded. The optical three-dimensional scanning measurement system is used to scan the shape, size, and area of ​​multilayer composite material adhesives. The vacuum suction cup robotic arm control system is used to adsorb multilayer composite material adhesives for laser debonding, and to separate multilayer composite material adhesives with interface debonding. The laser shock device includes a laser emitting device, which includes a laser emitter, a reflector, a focusing lens, and an optical diffraction element. The laser emitted by the laser emitter is reflected by the reflector and then focused by the focusing lens. After passing through the optical diffraction element, it forms a laser beam. The laser beam passes through the transparent constraint layer and the black absorption layer in sequence and forms a high-level tensile stress wave at the bonding interface of the composite multilayer adhesive. The laser impact device also includes a cooling tank, an automatic water coating system, and an automatic tape-applying robotic arm. The automatic water coating system includes a water tank and a water coating robotic arm, and the water coating robotic arm is equipped with a water supply pipeline connected to the water tank. The supercomputing server controls the operation of the automatic water coating robotic arm and the automatic tape-applying robotic arm. The supercomputing server controls the circulation and cooling of the water in the cooling tank into the laser emitter.

5. The apparatus used in the laser debonding method for multilayer composite material adhesives according to claim 4, characterized in that: The laser emitter is a rubidium glass laser emitter.

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