A micro-LED chip board and a preparation method thereof

Abstract

The present invention discloses a micro-led chip board and a preparation method thereof. Among them, the preparation method of the micro-led chip board includes: coating a filter layer on the encapsulation area of the carrier board; embedding a white light source in the carrier board; and forming micro-led chips on the filter layer irradiated by the white light source. The micro-led chip board and the preparation method thereof provided by the present invention achieve the effect of micro-led chips through the setting of the filter layer and the white light source. The preparation method of the present application is simple, the equipment cost is low, the encapsulation cost of micro-led chips can be effectively reduced, and the application range of micro-led display technology can be expanded.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor carrier plates, and in particular to a micro-led backlight core board and a preparation method thereof. Background Art

[0002] Micro-led display technology refers to a display technology that uses self-luminous micron-scale LEDs as light-emitting pixel units and assembles them onto a driving panel to form a high-density LED array. Due to the characteristics of small size, high integration, and self-luminance of micro-led chips, it has greater advantages in terms of brightness, resolution, contrast, energy consumption, service life, response speed, and thermal stability compared with LCD and OLED in terms of display.

[0003] In order to improve the production efficiency and product yield of micro-led, in the prior art, the mass transfer method is used to transfer device chips to a carrier board. Mass transfer refers to the transfer of a large number of micro-led grains, chips, or devices to a target carrier board or circuit through specific high-precision equipment. Mass transfer mainly includes physical transfer, chemical transfer, and laser transfer technologies. Among them, the physical transfer method is mainly the electrostatic adsorption transfer technology; the chemical transfer method is mainly the micro-transfer printing technology (μTP technology); the laser transfer method uses the laser lift-off technology (LLO) to separate the finished μLED from the sapphire growth wafer; and then the μLED is transferred from the donor to the substrate through mass transfer (LIFT).

[0004] The mass transfer in the prior art requires specific high-precision equipment, with high costs and great operation difficulties, resulting in high packaging costs. In order to promote the wide use of micro-led display technology, it is necessary to find a packaging method that can replace mass transfer. Summary of the Invention

[0005] The present invention aims to solve at least one of the problems in the related art to some extent. For this purpose, the object of the present invention is to provide a micro-led core board and a preparation method thereof. Through the setting of a filter layer and a white light source, the effect of a micro-led chip is achieved. The preparation method of the present application is simple, with low equipment costs, and can effectively reduce the packaging cost of micro-led chips and expand the application scope of micro-led display technology.

[0006] In order to achieve the above object, the present application adopts the following technical solution: A preparation method of a micro-led core board, comprising: coating a filter layer on the packaging area of a carrier board; embedding a white light source in the carrier board; and forming a micro-led chip by irradiating the filter layer with the white light source.

[0007] Further, different types of filter layers are respectively coated on different types of encapsulation areas in the carrier board, and different types of micro-led chips are formed by different filter layers irradiated by a white light source.

[0008] Further, the method for forming the filter layer includes: coating a hot melt adhesive on a protective film, forming through holes corresponding one by one to the encapsulation areas in the hot melt adhesive; filling the through holes with the filter layer; and transferring the filter layer pattern in the protective film to the encapsulation areas of the carrier board.

[0009] Further, the method for forming through holes in the hot melt adhesive includes: forming through holes by a laser process, or forming through holes by an exposure and development method, or forming through holes by a laser etching process.

[0010] Further, the depth of the through hole is any value between 0.1 micrometer and 0.2 micrometers.

[0011] Further, the encapsulation areas include a first encapsulation area, a second encapsulation area, and a third encapsulation area, and the filter layers include a first filter layer, a second filter layer, and a third filter layer; the first encapsulation area is coated with the first filter layer, the second encapsulation area is coated with the second filter layer, and the third encapsulation area is coated with the third filter layer.

[0012] Further, the first filter layer is a red filter layer, the second filter layer is a blue filter layer, and the third filter layer is a green filter layer; the white light source shows red after passing through the red filter layer, forming a red micro-led chip; the white light source shows blue after passing through the blue filter layer, forming a blue micro-led chip; the white light source shows green after passing through the green filter layer, forming a green micro-led chip.

[0013] Further, when the voltage or current applied to the filter layer is different, the color brightness shown by the filter layer is different.

[0014] Further, when the temperature of the filter layer is different, the color brightness shown by the filter layer is different.

[0015] This application also provides a micro-led chip board, which is prepared based on the preparation method of a micro-led chip board as described above.

[0016] The above technical solution provided by the embodiments of the present application has the following advantages compared with the prior art: In the present application, a filter layer is coated on the encapsulation area of the carrier board. Under the irradiation of a white light source, the filter layer allows light of a specific color to pass through, achieving the effect of a micro-led chip. In the prior art, different micro-led chips need to be placed in the corresponding encapsulation area by means of mass transfer. In the present application, instead of placing micro-led chips, a filter layer is coated in the encapsulation area, and a white light source is embedded in the carrier board. When the white light source irradiates the filter layer, only light of a specific color can pass through the filter layer. For example, when a red micro-led chip is required in the encapsulation area, the present application irradiates a red filter layer with a white light source to emit red light; at this time, the white light source and the red filter layer cooperate together to achieve the effect of a red micro-led chip. Similarly, when other colors of micro-led chips are required in the encapsulation area, the present application only needs to change the filter layer to combine with the white light source to form micro-led chips of the corresponding color. Compared with the mass transfer scheme in the prior art, the method of the present application is simpler, with lower operation difficulty and lower required cost, effectively reducing the encapsulation cost of micro-led chips and expanding the application scope of micro-led display technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present invention and used together with the specification to explain the principles of the present invention.

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0019] In the drawings:

[0020] Figure 1 It is a flowchart for forming the filter layer in Embodiment 3. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to have a clearer understanding of the technical features, objectives, and effects of the present invention, the specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientation or positional relationships indicated by terms such as "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are based on the orientation or positional relationships shown in the accompanying drawings and are constructed and operated in a specific orientation, and are only for the convenience of describing the present technical solution, rather than indicating that the indicated mechanism or element must have a specific orientation, and thus should not be construed as a limitation to the present invention.

[0022] It should also be noted that unless otherwise clearly defined and limited, terms such as "install", "connect", "join", "fix", "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located above the other element, or there may also be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation in order to thoroughly understand the embodiments of the present invention. However, those skilled in the art should clearly understand that the present invention can also be implemented in other embodiments without these specific details. In other cases, the detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present invention.

[0024] Embodiment 1

[0025] A method for preparing a micro-led chip board provided in the present application includes: coating a filter layer in the encapsulation area of a carrier board; embedding a white light source in the carrier board; and forming micro-led chips on the filter layer irradiated by the white light source.

[0026] In this application, the micro-led chip is no longer a traditional micro-led chip. Instead, a white light source irradiates the filter layer, and only light of a specific color can pass through the filter layer to achieve the function of the micro-led chip.

[0027] Correspondingly, in the prior art, micro-led chips need to be placed one by one in the encapsulation area. In this application, only a filter layer needs to be formed in the encapsulation area and cooperate with the white light source embedded in the carrier board to achieve the function of the micro-led chip.

[0028] In this application, the encapsulation area refers to the position where the micro-led chip needs to be placed. The type of the filter layer is determined according to the type of the micro-led chip to be placed. For example, if the micro-led chip to be placed is a green micro-led chip, the filter layer corresponding to this position needs to transmit green light under the irradiation of the white light source. Similarly, when the micro-led chip to be placed is a chip of other colors, the filter layer corresponding to this position needs to transmit the corresponding color under the irradiation of the white light source.

[0029] In this application, the white light source is built into the carrier board, and it cooperates with the filter layer to achieve the function of the micro-led chip in the prior art. Specifically, in this application, multiple encapsulation areas can correspond to the same white light source or each can correspond to a white light source one by one.

[0030] The types of the encapsulation areas in the carrier board of this application can be the same or different. When the filter layers coated on all the encapsulation areas in the carrier board are the same, a micro-led chip board product with a single micro-led chip is formed. When the encapsulation areas in the carrier board are divided into multiple types, the filter layers corresponding to each type are different, forming a micro-led chip board product with multiple micro-led chips, and the micro-led chips of different types are arranged in the carrier board according to a certain rule.

[0031] Compared with the massive transfer solution in the prior art, the method for forming a micro-led chip in this application is simpler, with lower operation difficulty and lower required cost, effectively reducing the encapsulation cost of the micro-led chip and expanding the application range of the micro-led display technology.

[0032] Embodiment 2

[0033] A method for preparing a micro-led chip board provided in this application includes: coating a filter layer on the encapsulation area of the carrier board; embedding a white light source in the carrier board; and forming a micro-led chip by irradiating the filter layer with the white light source.

[0034] In this application, the encapsulation area refers to the position where the micro-LED chips need to be placed. In this embodiment, the encapsulation areas on the carrier board are divided into multiple types, and the corresponding filter layers for each type are different, forming a micro-LED chip board product with multiple micro-LED chips. And different types of micro-LED chips are arranged on the carrier board according to certain rules.

[0035] Among them, different types of filter layers can allow different lights in the white light source to pass through. Then, different types of micro-LED chips are formed by different filter layers irradiated by the white light source. The materials of different filter layers are different, and each filter layer only allows a single color of light to pass through.

[0036] In this application, the type of the filter layer is specifically determined according to the type of the micro-LED chips to be placed. For example, if the micro-LED chip to be placed is a green micro-LED chip, the corresponding filter layer at this position needs to transmit green light under the irradiation of the white light source. Similarly, when the micro-LED chip to be placed is a chip of other colors, the corresponding filter layer at this position needs to transmit the corresponding color under the irradiation of the white light source.

[0037] Specifically, the encapsulation area includes a first encapsulation area, a second encapsulation area, and a third encapsulation area, and the filter layer includes a first filter layer, a second filter layer, and a third filter layer; the first encapsulation area is coated with the first filter layer, the second encapsulation area is coated with the second filter layer, and the third encapsulation area is coated with the third filter layer. Among them, the lights projected by the first filter layer, the second filter layer, and the third filter layer under the irradiation of the white light source are different. Similarly, the encapsulation area can be the above three types, or four types, five types, etc., which are specifically determined according to the arrangement rules of different types of encapsulation areas on the carrier board.

[0038] In this application, the encapsulation areas are of multiple types, and multiple types of encapsulation areas are distributed at regular intervals. If the filter layer is directly coated on the encapsulation area, it is necessary to coat each encapsulation area one by one, and the coating efficiency is relatively low. In order to improve the coating efficiency of the filter layer, in this application, a filter layer pattern is formed on the outside of the carrier board, and then the filter layer pattern is transferred to the carrier board.

[0039] Specifically, the method for forming the filter layer includes:

[0040] S1: Coat a hot melt adhesive on the protective film, and form through holes corresponding to the encapsulation areas one by one in the hot melt adhesive. Among them, the specific method for forming the through holes can adopt any one of the following: the first one is to form through holes by using a laser process. That is, after the coated hot melt adhesive is cured, use the laser process to form through holes in the hot melt adhesive.

[0041] Second, via holes are formed by exposure and development. A dry film is used to cover the hot melt adhesive, and through exposure and development, the corresponding positions of the encapsulation area are exposed, and other areas are covered by the dry film. After etching the exposed part, via holes can be formed.

[0042] Third, laser etching is used to etch via holes on the cured hot melt adhesive.

[0043] Note: The via holes formed in this step have a one-to-one correspondence with the encapsulation areas in the carrier board in terms of size, quantity, and position.

[0044] S2: Fill the via holes with a filter layer to form a filter layer pattern on the protective film;

[0045] S3: Transfer the filter layer pattern in the protective film to the encapsulation area of the carrier board.

[0046] It should be noted that when the encapsulation areas in the carrier board include multiple types, the via holes corresponding to all the encapsulation areas can be formed in the carrier board first; when filling the via holes corresponding to one type of encapsulation area, mask the other via holes so that only one type of encapsulation area is exposed for filling the filter layer; when filling the via holes corresponding to the second type of encapsulation area, mask the other via holes so that only the second type of encapsulation area is exposed for filling the filter layer; and so on until all types of via holes are filled.

[0047] Or, when the encapsulation areas in the carrier board include multiple types, the via holes corresponding to the first type of encapsulation area can be formed in the cured hot melt adhesive by exposure and development; fill the formed via holes with a filter layer. Then remove the dry film at the position of the via holes corresponding to the second type of encapsulation area in the hot melt adhesive, etch to form the via holes corresponding to the second type of encapsulation area, and fill the formed via holes with a filter layer. And so on, via holes are formed in multiple times by one exposure and development and multiple removals of the dry film, and the corresponding filter layer is filled each time the via holes are formed.

[0048] The depth of the via holes formed in this application is any value between 0.1 micrometer and 0.2 micrometers. Correspondingly, the thickness of the formed filter layer is also any value between 0.1 micrometer and 0.2 micrometers.

[0049] Compared with the existing mass transfer solutions, the method for forming micro-led chips in this application is simpler. The filter layer pattern is formed outside the carrier board and then transferred to the corresponding encapsulation area in the carrier board, so that the assembly of micro-led chips in the carrier board can be formed. The operation difficulty of this application is lower and the required cost is also lower, effectively reducing the packaging cost of micro-led chips and expanding the application scope of micro-led display technology.

[0050] Example 3

[0051] A method for preparing a micro-led chip board provided in this embodiment, wherein, there are three types of micro-led chips in the micro-led chip board product, and correspondingly, there are also three types of filter layers and encapsulation areas. Specifically, the first filter layer is a red filter layer, the second filter layer is a blue filter layer, and the third filter layer is a green filter layer; the white light source shows red after passing through the red filter layer, forming a red micro-led chip; the white light source shows blue after passing through the blue filter layer, forming a blue micro-led chip; the white light source shows green after passing through the green filter layer; forming a green micro-led chip. The red micro-led chips, blue micro-led chips and green micro-led chips are distributed in the carrier board in a regular pattern such as a Bayer matrix.

[0052] The specific preparation method includes:

[0053] S1: Define a red encapsulation area, a blue encapsulation area and a green encapsulation area in the carrier board. Among them, the encapsulation area can be a relatively sunken structure, which is convenient for the filter layer to be coated in the sunken structure. At the bottom of the encapsulation area, that is, on the side of the encapsulation area close to the center of the carrier board, a white light source is embedded. The white light source can be a white light source emitted after tungsten metal or the like is electrified, or can be a white light source formed after a specific chip or gemstone is electrified. It should be noted that: one or more white light sources can be set, and all the encapsulation areas need to be covered.

[0054] S2: Coat hot melt adhesive on the protective film, and form through holes in the hot melt adhesive that are in one-to-one correspondence with the red encapsulation area, the blue encapsulation area and the green encapsulation area in terms of size, quantity and position, and fill the red filter layer, the blue filter layer and the green filter layer correspondingly in the through holes.

[0055] As Figure 1 shown, the formation method of the filter layer specifically includes:

[0056] S21: Coat hot melt adhesive on the protective film and carry out a curing treatment;

[0057] S22: Use the exposure and development method to define the area corresponding to the red through hole. At this time, the position where the red through hole needs to be formed is exposed, and other areas are protected by the dry film. Etch the area corresponding to the red through hole to form a red through hole. The red through hole is in one-to-one correspondence with the red encapsulation area in the carrier board in terms of size, quantity and position. The depth of the red through hole is 0.1 to 0.2 microns.

[0058] S23: Fill the red filter layer in the red through hole to form a red filter layer pattern on the protective film.

[0059] S24: Remove the dry film in the area corresponding to the blue through-holes in the hot melt adhesive. At this time, the positions where the blue through-holes need to be formed are exposed, and the other areas are still protected by the dry film. Etch the area corresponding to the blue through-holes to form blue through-holes. The blue through-holes correspond one-to-one with the blue encapsulation areas in the carrier board in terms of size, quantity, and position. The depth of the blue through-holes is from 0.1 micrometer to 0.2 micrometers.

[0060] S25: Fill the blue through-holes with a blue filter layer to form a blue filter layer pattern on the protective film.

[0061] S26: Remove the dry film in the area corresponding to the green through-holes in the hot melt adhesive. At this time, the positions where the green through-holes need to be formed are exposed, and the other areas are still protected by the dry film. Etch the area corresponding to the green through-holes to form green through-holes. The green through-holes correspond one-to-one with the green encapsulation areas in the carrier board in terms of size, quantity, and position. The depth of the green through-holes is from 0.1 micrometer to 0.2 micrometers.

[0062] S27: Fill the green through-holes with a green filter layer to form a green filter layer pattern on the protective film.

[0063] S28: Transfer the filter layer pattern in the protective film to the encapsulation area of the carrier board, so that a protective layer correspondingly covers the encapsulation area on the carrier board.

[0064] Specifically, in this step, the filter layer patterns in the protective film and the hot melt adhesive are arranged regularly. The arrangement patterns of the red filter layer, blue filter layer, and green filter layer in the filter layer pattern are the same as those of the red encapsulation area, blue encapsulation area, and green encapsulation area in the carrier board, and the sizes and positions are also the same. Just embed the filter layer matrix into the encapsulation area of the carrier board.

[0065] In this application, the red filter layer contains a red photosensitive resin composition. The red photosensitive resin composition contains a red colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, etc. After the red photosensitive resin composition is filled in the red through-holes, it is heated and dried to remove volatile components to obtain a smooth coating film. For the subsequent blue filter layer and green filter layer, only the red colorant needs to be replaced with a blue colorant and a green colorant.

[0066] In this application, the red filter layer, blue filter layer, and green filter layer can be led out to the electrical control terminal through leads or an interconnection structure. The electrical control terminal is used to control the power on / off status of each filter layer, as well as the magnitude of the voltage or current applied to each filter layer. When the filter layer is powered on, when the voltage or current applied to the filter layer is different, the color brightness displayed by the filter layer is different. For example, when the voltage or current applied to the red filter layer is different, the red brightness transmitted by the red filter layer under the illumination of a white light source is different. By controlling the magnitude of the voltage or current applied to the filter layer, the color degree presented by the finally formed micro-led chip board product can be controlled.

[0067] At the same time, this application can also control the luminous intensity of the white light source to control the color degree presented by the finally formed micro-led chip board product. When the voltage or current applied to the filter layer is constant, different luminous intensities of the white light source will also result in different color brightnesses displayed by the filter layer.

[0068] Therefore, this application can make the corresponding micro-led chips have different brightnesses by controlling the luminous intensity of the white light source and / or controlling the voltage or current intensity applied to the filter layer, thereby controlling the color degree presented by the finally formed micro-led chip board product.

[0069] When the voltage or current applied to the filter layer is different, it will not affect the light filtering effect of the filter layer on the light in the white light source, but it will affect the intensity of the light passing through the filter layer in the white light source, thereby making the micro-led chips have different brightnesses.

[0070] When the voltage or current applied to the filter layer is constant, the color brightness displayed by the white light source passing through the filter layer can also be made different by controlling the temperature of the filter layer. Temperature control can be achieved by controlling the temperature of the entire carrier board.

[0071] In the prior art, a large amount of transfer method is required to place different micro-led chips in the corresponding packaging area. In this application, the micro-led chips are no longer placed, but a filter layer is coated in the packaging area, and a white light source is embedded in the carrier board. When the white light source irradiates the filter layer, only light of a specific color can pass through the filter layer. That is to say, in this application, the white light source is built into the carrier board, and it works together with the filter layer to realize the functions of the micro-led chips in the prior art.

[0072] Compared with the massive transfer solutions in the prior art, the method of forming micro-led chips in this application is simpler. A filter layer pattern is formed outside the carrier board, and then the filter layer pattern is transferred to the corresponding packaging area in the carrier board, and the assembly of micro-led chips in the carrier board can be formed. The operation difficulty of this application is relatively low, and the required cost is also relatively low, effectively reducing the packaging cost of micro-led chips and expanding the application scope of micro-led display technology.

[0073] This application also provides a micro-led core board, which is prepared by using the preparation method of a micro-led core board described in Embodiments 1-3. The finally formed micro-led core board product includes a filter layer and a white light source, and after the white light source passes through the filter layer, the filter layer has the same structure as the micro-led chips in the prior art.

[0074] It can be understood that the above embodiments only represent the preferred implementation modes of the present invention, and the description is relatively specific and detailed, but it cannot be construed as a limitation on the scope of the invention patent; it should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can also be made, which all belong to the protection scope of the present invention; therefore, all equivalent transformations and modifications made to the scope of the claims of the present invention shall fall within the scope covered by the claims of the present invention.

Claims

1. A method for preparing a micro-led core board, characterized in that, it includes: Coating a filter layer on the encapsulation area of the carrier board; embedding a white light source in the carrier board; The filter layer irradiated by the white light source forms micro-led chips; The white light source is an integral body covering all encapsulation areas; the formation method of the filter layer includes: coating a hot melt adhesive on a protective film, forming through holes corresponding one by one to the encapsulation areas in the hot melt adhesive; filling the filter layer in the through holes; transferring the filter layer pattern in the protective film to the encapsulation area of the carrier board; The red filter layer contains a red photosensitive resin composition, and the red photosensitive resin composition contains a red colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator and a solvent; after the red photosensitive resin composition is filled in the red through hole, it is heated and dried to remove volatile components to obtain a smooth coating film; The blue filter layer contains a blue photosensitive resin composition, and the blue photosensitive resin composition contains a blue colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator and a solvent; after the blue photosensitive resin composition is filled in the blue through hole, it is heated and dried to remove volatile components to obtain a smooth coating film; The green filter layer contains a green photosensitive resin composition, and the green photosensitive resin composition contains a green colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator and a solvent; after the green photosensitive resin composition is filled in the green through hole, it is heated and dried to remove volatile components to obtain a smooth coating film; When the voltage or current applied to the filter layer is different, the color brightness shown by the filter layer is different; when the temperature of the filter layer is different, the color brightness shown by the filter layer is different; by controlling the light emission intensity of the white light source and / or controlling the voltage or current intensity applied to the filter layer, the corresponding micro-led chips have different brightnesses.

2. The method for preparing a micro-led core board according to claim 1, characterized in that, Different types of filter layers are respectively coated on different types of encapsulation areas in the carrier board, and different types of micro-led chips are formed by different filter layers irradiated by the white light source.

3. The method for preparing a micro-led core board according to claim 1, characterized in that, The method for forming through holes in the hot melt adhesive includes: forming through holes by a laser process, or forming through holes by an exposure and development method, or forming through holes by a laser etching process.

4. The method for preparing a micro-led core board according to claim 1, characterized in that, The depth of the through hole is any value between 0.1 micron and 0.2 micron.

5. The method for preparing a micro-led core board according to claim 1, characterized in that, The encapsulation area includes a first encapsulation area, a second encapsulation area and a third encapsulation area, and the filter layer includes a first filter layer, a second filter layer and a third filter layer; the first encapsulation area is coated with the first filter layer, the second encapsulation area is coated with the second filter layer, and the third encapsulation area is coated with the third filter layer.

6. A method for preparing a micro-led chip board according to claim 5, wherein, the first filter layer is a red filter layer, the second filter layer is a blue filter layer, and the third filter layer is a green filter layer; after the white light source passes through the red filter layer, it shows red, forming a red micro-led chip; after the white light source passes through the blue filter layer, it shows blue, forming a blue micro-led chip; after the white light source passes through the green filter layer, it shows green, forming a green micro-led chip.

7. A micro-led chip board, wherein, it is prepared based on the method for preparing a micro-led chip board according to any one of claims 1-6.

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