An electronic device

Abstract

The application relates to the electronic field and discloses an electronic device which comprises a shell, a loudspeaker module and at least two shock-absorbing connecting pieces; the shell is provided with a first connecting position and a second connecting position at intervals; the loudspeaker module comprises a loudspeaker shell and a loudspeaker body arranged on the loudspeaker shell; the two sides of the loudspeaker shell are connected with the first connecting position and the second connecting position of the shell through corresponding shock-absorbing connecting pieces respectively, so that the loudspeaker module is assembled on the shell in a suspended state. In the electronic device provided by the embodiment of the application, the loudspeaker module is assembled on the shell in a suspended state, vibration energy generated in the working process of the loudspeaker module can only be indirectly transmitted to the shell through the shock-absorbing connecting pieces, and since the shock-absorbing connecting pieces have a shock-absorbing effect, the vibration energy finally received by the shell is small or even zero, the resonance problem between the loudspeaker module and the shell is greatly reduced, and the product sound quality and user experience are improved.

Description

Technical Field

[0001] This invention relates to the field of electronic products, and more particularly to an electronic device. Background Technology

[0002] A laptop computer is a portable computer that integrates electronic components such as speakers, keyboards, and displays. Among them, the speaker, also known as a "loudspeaker," is a very common electroacoustic transducer that can be found in any electronic or electrical device that produces sound. Audio electrical energy generates piezoelectric or electrostatic effects through electromagnetic fields, causing the speaker cone or diaphragm to vibrate and resonate with the surrounding air to produce sound.

[0003] The speakers in existing laptops are usually embedded in the casing, meaning that the speakers are attached to the inside of the computer casing using plastic and silicone pads. Since the speakers are in direct contact with the computer casing, when the volume of the sound emitted by the speakers is high, the amplitude of speaker vibration increases. This vibration is directly transmitted to the computer casing, causing resonance between the speakers and the computer casing. When the vibration energy is high, it is easy to produce resonance sound, which affects the sound quality and user experience. This is a problem that is difficult to solve in the laptop industry. Summary of the Invention

[0004] The purpose of this invention is to provide an electronic device to solve the problem of resonance between the internal speaker and the casing of a computer in the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An electronic device includes: a housing, a speaker module, and at least two shock-absorbing connectors;

[0007] The outer casing is provided with a first connection position and a second connection position at intervals; the speaker module includes a speaker housing and a speaker body mounted on the speaker housing;

[0008] Both sides of the speaker housing are connected to the first and second connection positions of the outer shell through corresponding shock-absorbing connectors, so that the speaker module is mounted on the outer shell in a suspended state.

[0009] Optionally, the shock-absorbing connector includes: a fixed bracket and a shock-absorbing assembly;

[0010] The fixed bracket is installed at the first connection position or the second connection position, and the shock absorption component is connected between the speaker housing and the fixed bracket.

[0011] Optionally, the shock-absorbing assembly includes an upper spring sheet and a lower spring sheet with opposite phases; the upper spring sheet and the lower spring sheet are arranged vertically and parallel to each other in a direction perpendicular to the outer shell.

[0012] Optionally, the upper spring and / or the lower spring includes: an arc-shaped deformable portion, and two connecting portions respectively disposed at both ends of the arc-shaped deformable portion.

[0013] Optionally, the connecting portion is bonded or welded to the fixing bracket or the speaker housing on its corresponding side.

[0014] Optionally, the fixed bracket includes an integrally formed vertical support plate and a horizontal fixing part, the vertical support plate being connected to the vibration damping component, and the horizontal fixing part being connected to the first connection position or the second connection position.

[0015] Optionally, the lateral fixing part is connected to or welded to the nut of the first connecting position or the second connecting position.

[0016] Optionally, the speaker module is suspended at a height of 1.0 mm.

[0017] Optionally, a buffer pad is provided on the housing in the projection area of ​​the speaker module.

[0018] Optionally, the first connection position and the second connection position on the housing are arranged at intervals along the length direction of the speaker housing.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] Unlike traditional electronic devices that use an assembly structure where the speaker module is attached to the housing, the electronic device provided in this invention uses a suspended assembly on the housing. The vibration energy generated by the speaker module during operation can only be indirectly transmitted to the housing through the shock-absorbing connector. At the same time, since the shock-absorbing connector itself has a shock-absorbing effect, the vibration energy ultimately received by the housing is small or even zero, which greatly reduces the resonance problem between the speaker module and the housing, and improves the product's sound quality and user experience. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a perspective view of the speaker module and housing assembled according to an embodiment of the present invention.

[0023] Figure 2 This is a side view of the speaker module and housing after assembly, as provided in an embodiment of the present invention.

[0024] Figure 3 This is a structural diagram of the vibration damping component provided in an embodiment of the present invention;

[0025] Illustration:

[0026] 1. Outer shell, 2. Speaker module, 3. Shock-absorbing connector, 31. Fixing bracket, 32. Shock-absorbing assembly, 321. Upper spring, 322. Detailed Implementation

[0027] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0028] Please see Figures 1 to 3 The present invention provides an electronic device, including: a housing 1, a speaker module 2, and at least two shock-absorbing connectors 3;

[0029] The outer casing 1 is provided with a first connection position and a second connection position at intervals; the speaker module 2 includes a speaker housing and a speaker body mounted on the speaker housing;

[0030] Both sides of the speaker housing are connected to the first and second connection positions of the outer shell 1 through corresponding shock-absorbing connectors 3, so that the speaker module 2 is mounted on the outer shell 1 in a suspended state.

[0031] Unlike traditional electronic devices that use an assembly structure where the speaker module 2 is attached to the housing 1, in the electronic device provided in this embodiment of the invention, the speaker module 2 is mounted on the housing 1 in a suspended manner. The vibration energy generated by the speaker module 2 during operation can only be indirectly transmitted to the housing 1 through the shock-absorbing connector 3. At the same time, since the shock-absorbing connector 3 itself has a shock-absorbing effect, the vibration energy ultimately received by the housing 1 is small or even zero, which greatly reduces the resonance problem between the speaker module 2 and the housing 1, and improves the product's sound quality and user experience.

[0032] In this embodiment, the shock-absorbing connector 3 serves two purposes: one is to support the speaker module 2 so that it remains suspended on the outer shell 1, thus preventing hard contact between the two; the other is to dampen the speaker module 2 under vibration, thereby further reducing the vibration energy transmitted to the outer shell 1.

[0033] In one optional embodiment, the damping connector 3 includes a fixed bracket 31 and a damping component 32. The fixed bracket 31 is installed at a first connection position or a second connection position, and the damping component 32 is connected between the speaker housing and the fixed bracket 31.

[0034] The shock absorption assembly 32 may include an upper spring sheet 321 and a lower spring sheet 322 with opposite phases; the upper spring sheet 321 and the lower spring sheet 322 are arranged vertically and parallel to each other in a direction perpendicular to the outer shell 1.

[0035] Compared with conventional damping structures, the damping component 32 provided in this embodiment has an upper spring 321 and a lower spring 322 with opposite phases. During the transmission of vibration energy from top to bottom, the upper and lower springs can cancel out some of the energy. Therefore, it can further reduce the vibration energy received by the housing 1 and further reduce the resonance problem between the speaker module 2 and the housing 1.

[0036] Specifically, the upper spring piece 321 and the lower spring piece 322 can have the same or different shapes and structures. For example, to reduce design complexity and manufacturing costs, the upper spring piece 321 and / or the lower spring piece 322 include an arc-shaped deformable portion and two connecting portions located at both ends of the arc-shaped deformable portion. Based on this, when assembling the damping assembly 32, simply reversing the structure of the upper spring piece 321 and the lower spring piece 322 can achieve the effect of reversed phase.

[0037] The upper spring 321 / lower spring 322 connecting part and its corresponding side fixing bracket 31 or speaker housing can be connected by various methods such as bonding or welding, which can reduce the assembly space.

[0038] The fixed bracket 31 includes an integrally formed vertical support plate and a horizontal fixing part. The vertical support plate is connected to the vibration damping component, and the horizontal fixing part is connected to a first connecting position or a second connecting position. The connection method between the horizontal fixing part and the first connecting position or the second connecting position can be a nut connection or a welding method, etc.

[0039] It is understood that the fixing bracket 31 can also adopt any other conventional structure with fixing and support functions, and the embodiments of the present invention do not specifically limit it in this regard.

[0040] To avoid excessive space occupation due to excessive assembly height of speaker module 2, which does not meet the miniaturization design requirements of electronic devices, the suspension height of speaker module 2 can be designed according to the normal vibration amplitude of speaker module 2. Preferably, the suspension height of speaker module 2 is 1.0mm.

[0041] In practical applications, besides the vibrations generated by the speaker module 2 itself, the speaker module 2 may also experience unexpected and significant vibrations due to external factors (such as collisions with electronic devices). If the maximum amplitude exceeds the suspension height, the speaker module 2 will collide with the outer casing 1, causing some damage to the speaker module 2. Therefore, in this embodiment of the invention, a buffer pad is also provided on the outer casing 1 in the projection area of ​​the speaker module 2. Since the bottom of the speaker module 2 is equipped with a buffer pad, when a collision occurs, the speaker module 2 will be buffered by the buffer pad before colliding with the outer casing 1. The buffer pad greatly reduces the collision force between the two, effectively preventing damage to the speaker module 2 due to the collision.

[0042] Furthermore, the first and second connection positions on the housing 1 are preferably arranged at intervals along the length of the speaker housing. Based on this, the speaker housing is connected to the housing 1 on both sides of its length direction by a shock-absorbing connector 3 to ensure the assembly stability and reliability of the speaker module 2 on the housing 1.

[0043] It should be noted that the electronic device provided in this embodiment of the invention can be any device with a speaker, such as a laptop computer. The speaker module 2 of the laptop computer is a component of the audio system, responsible for outputting audio signals and converting the digital audio signals in the computer into sound signals that can be heard by humans.

[0044] In this embodiment of the invention, the speaker module 2 is installed inside the laptop's chassis, typically in the keyboard area (specifically, shell C) or the bottom (specifically, shell D). Some models integrate the speaker module 2 into the display frame (specifically, shell B). The installation position of the speaker module 2 varies across different laptop models; the general design principle is to direct the sound from the speaker module 2 towards the user as much as possible to maximize the auditory experience. This embodiment of the invention does not limit the specific installation position of the speaker module 2 on the outer shell 1.

[0045] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that, include: The enclosure (1), the speaker module (2), and at least two shock-absorbing connectors (3); The outer casing (1) is provided with a first connection position and a second connection position at intervals; the speaker module (2) includes a speaker housing and a speaker body mounted on the speaker housing; Both sides of the speaker housing are connected to the first and second connection positions of the outer shell (1) through corresponding shock-absorbing connectors (3) to make the speaker module (2) mounted on the outer shell (1) in a suspended state. The shock-absorbing connector (3) includes: a fixed bracket (31) and a shock-absorbing component (32); The fixed bracket (31) is installed at the first connection position or the second connection position, and the shock absorption component (32) is connected between the speaker housing and the fixed bracket (31); The shock-absorbing assembly (32) includes an upper spring sheet (321) and a lower spring sheet (322) with opposite phases; the upper spring sheet (321) and the lower spring sheet (322) are arranged vertically and parallel to each other in a direction perpendicular to the outer shell (1).

2. The electronic device according to claim 1, characterized in that, The upper spring piece (321) and / or the lower spring piece (322) include: an arc-shaped deformable portion, and two connecting portions disposed at both ends of the arc-shaped deformable portion.

3. The electronic device according to claim 2, characterized in that, The connecting part is bonded or welded to the fixing bracket (31) on its corresponding side or to the speaker housing.

4. The electronic device according to claim 1, characterized in that, The fixed bracket (31) includes an integrally formed vertical support plate and a horizontal fixing part. The vertical support plate is connected to the shock absorption component (32), and the horizontal fixing part is connected to the first connection position or the second connection position.

5. The electronic device according to claim 4, characterized in that, The lateral fixing part is connected to or welded to the nut of the first connecting position or the second connecting position.

6. The electronic device according to claim 1, characterized in that, The speaker module (2) has a suspension height of 1.0 mm.

7. The electronic device according to claim 1, characterized in that, The housing (1) has a buffer pad on the projection area of ​​the speaker module (2).

8. The electronic device according to claim 7, characterized in that, The first connection position and the second connection position on the outer casing (1) are arranged at intervals along the length direction of the speaker housing.

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