Semiconductor test chamber

Abstract

The application relates to a semiconductor test box, which comprises a box body, a test cavity and a switching cavity in the box body, a first partition plate for separating the test cavity and the switching cavity is fixed in the box body, a guide rail for guiding an aging plate is fixed in the test cavity, a switching groove is formed in the first partition plate, a switching plate is arranged in the switching cavity, one end of the switching plate is provided with a first switching protrusion, the end of the switching plate provided with the first switching protrusion is inserted into the switching groove, the aging plate is provided with a second switching protrusion, and the end of the aging plate provided with the second switching protrusion can be inserted into the switching groove and connected with the first switching protrusion; a sealing piece is arranged in the switching groove, and the sealing piece is sleeved with the first switching protrusion. The application has the effect of reducing the leakage of internal water vapor in the process of testing the test box.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing, and in particular to a semiconductor test chamber. Background Technology

[0002] Semiconductor component test boards are used to perform aging tests on semiconductor components. They typically consist of a PCB (Printed Circuit Board) and multiple semiconductor component aging fixtures connected to it. These aging fixtures can be customized and configured as needed to meet the aging test requirements of semiconductor components with different packages.

[0003] In aging tests, the reliability and stability of the semiconductor components under test are tested by simulating various factors that may occur in actual use environments (such as the H3TRB high temperature and high humidity environment).

[0004] Currently, during testing, the aging board needs to be placed in a test chamber, and the aging board needs to be connected to the test board. Since semiconductor components are often kept away from the test chamber to reduce the high temperature and high pressure environment, they need to be connected to the aging board through an adapter board. However, moisture leakage is prone to occur at the connection between the aging board and the adapter board, which can easily affect the service life of the adapter board. Summary of the Invention

[0005] In order to reduce the leakage of moisture inside the test chamber during the test, this application provides a semiconductor test chamber.

[0006] The semiconductor test chamber provided in this application adopts the following technical solution:

[0007] A semiconductor testing chamber includes a housing with a testing chamber and a transfer chamber inside. A first partition is fixed inside the housing to separate the testing chamber and the transfer chamber. A guide rail for guiding an aging board is fixed inside the testing chamber. The first partition has a transfer groove. A transfer plate is provided inside the transfer chamber. One end of the transfer plate has a first transfer protrusion, which is inserted into the transfer groove. The aging board has a second transfer protrusion, which is inserted into the transfer groove and connected to the first transfer protrusion. A sealing element is provided inside the transfer groove and is fitted onto the first transfer protrusion.

[0008] By adopting the above technical solution, the test chamber can operate in a high-temperature and high-humidity environment, primarily providing testing space for the aging board. The guide rail facilitates support for the aging board and allows it to be pushed so that the first transition protrusion of the aging board can accurately connect with the second transition protrusion of the transition plate. The transition plate allows the test board to be positioned at a greater distance, thereby reducing the impact of high temperature and humidity on the test board. The sealing component fills the remaining space of the transition groove after the transition protrusion enters the transition groove, thus blocking the transition groove and preventing moisture from leaking from the transition groove into the transition chamber, thereby reducing the impact of moisture on the transition plate. Ultimately, this reduces moisture leakage from the aging board during testing.

[0009] Optionally, the seal is connected to the adapter plate via a first connector, and the seal is connected to the first partition plate via a second connector.

[0010] By adopting the above technical solution, the first connector can connect the seal and the adapter plate, making the seal and the adapter plate an integral unit; after the first adapter protrusion of the seal and the adapter plate moves into the adapter groove, the second connector can fix the seal and the first partition plate together, making the seal and the first partition plate an integral unit; through the combination of the first connector and the second connector, the adapter plate can be stably connected to the first partition plate, and when the first adapter protrusion of the aging plate is pushed to connect with the second adapter protrusion of the adapter plate, the adapter plate is not easy to loosen and has good stability.

[0011] Optionally, a partition plate for supporting the adapter plate is fixed inside the adapter cavity, and a temperature-controlled component for maintaining airflow in the adapter cavity is provided inside the adapter cavity.

[0012] By adopting the above technical solution, the partition plate can support the transfer plate, and the constant temperature component can keep the air in the transfer cavity flowing, achieving a constant temperature effect while maintaining dryness. This reduces the phenomenon of condensation caused by large temperature differences between the transfer plate and the transfer cavity, thereby reducing the occurrence of water mist condensation.

[0013] Optionally, the partition plate divides the transfer cavity into a heat insulation area and a constant temperature area. The heat insulation area is filled with heat insulation cotton. The constant temperature component is located in the constant temperature area. The constant temperature component includes a fan and a constant temperature tube. The fan is fixedly connected to the partition plate. The constant temperature tube is located in the air outlet direction of the fan. The housing has an air inlet located in the air inlet direction of the fan.

[0014] By adopting the above technical solution, the partition plate can divide the transfer cavity into a heat insulation area and a constant temperature area. When the test cavity is conducting aging tests on the aging plate, it will be in a high temperature and high humidity environment. Therefore, the first partition plate will also be at a high temperature. Setting heat insulation cotton in the heat insulation area can reduce the impact of high temperature on the transfer plate in the transfer cavity and reduce the problem of condensation. Setting a fan and a constant temperature pipe in the constant temperature area can maintain a certain temperature in the constant temperature area, thereby reducing the phenomenon of condensation caused by a large temperature difference between the transfer plate and the transfer cavity, and thus reducing the problem of water mist condensation.

[0015] Optionally, the partition plate is fixed with a support plate for supporting the adapter plate, and the support plate has a protective plate on one side.

[0016] By adopting the above technical solution, the partition plate can support the support plate, and the support plate is used to support the adapter plate. After the adapter plate is placed on the protective plate, the adapter plate is moved so that one end of the adapter plate abuts against the protective plate, which can realize the centering of the adapter plate and facilitate pushing one end of the adapter plate into the adapter groove.

[0017] Optionally, the support plate has a first receiving groove, in which a rotating plate is provided. The support plate also has an elastic element that can push the rotating plate to rotate away from the first receiving groove. When the rotating plate rotates out of the first receiving groove, the rotating plate is in a flipped state. The adapter plate can press down on the rotating plate, so that the rotating plate is located in the first receiving groove. When the rotating plate is located in the first receiving groove, the rotating plate is in a retracted state. The first partition plate also has a second receiving groove communicating with the adapter groove. A sealing plate is slidably disposed in the second receiving groove. One end of the sealing plate can enter the adapter groove to block the adapter groove. A pull rope is connected to the end of the sealing plate away from the adapter groove. One end of the pull rope is fixedly connected to the rotating end of the rotating plate. When the rotating plate is in the retracted state, the pull rope can pull the sealing plate, so that the sealing plate is located in the second receiving groove. When the rotating plate is in the flipped state, one end of the sealing plate can move into the adapter groove.

[0018] By adopting the above technical solution, the first receiving groove can accommodate the rotating plate. When the rotating plate enters the first receiving groove, the adapter plate can be kept horizontal. When a small number of aging plates need to be tested, the adapter plate will not be installed in the other positions where aging plates are not placed. Since no adapter plate is installed, the rotating plate is in a flipped state under the push of the elastic element. At this time, the pull rope will not pull the sealing plate, so the sealing plate will move downward under its own weight and block the adapter groove. Thus, when a small number of aging plates are tested, the adapter grooves in other positions can be blocked, making it difficult for moisture to leak from the adapter groove into the adapter cavity. When more aging plates need to be tested, simply place the adapter plate on the support plate in the corresponding position. The adapter plate will press the rotating plate, and the rotating plate will enter a retracted state. During the rotation of the rotating plate, the pull rope will pull the sealing plate to move, thereby automatically opening the connecting groove, making it convenient to install one end of the adapter plate into the connecting groove.

[0019] Optionally, the support plate may also have a mounting groove.

[0020] By adopting the above technical solution, when testing a small number of aging boards, the support slot can support the remaining adapter boards. The adapter boards can be in the adapter cavity while in an inclined state, so as not to interfere with the adapter boards. The adapter boards are in a flipped state, which can block the connection slot. There is no need for the staff to take the adapter boards out of the adapter cavity, which makes it convenient and quick to block and open the connection slot.

[0021] Optionally, the temperature control component includes a fan connected to the first partition on one side of the transfer cavity and a temperature control tube located in the air outlet direction of the fan. The housing has an air inlet located in the air inlet direction of the fan.

[0022] By adopting the above technical solution, the fan and thermostatic tube can maintain a certain temperature inside the adapter cavity, reduce condensation on the adapter plate, and improve the service life of the adapter plate.

[0023] Optionally, the housing also has a connecting cavity, and a second partition is fixed inside the housing to separate the adapter cavity and the connecting cavity. The second partition has a through groove for the adapter plate to pass through, and a detection plate connected to the adapter plate is provided inside the connecting cavity.

[0024] By adopting the above technical solution, the connecting cavity is used to place the detection plate, and the second partition separates the connecting cavity from the transfer cavity, further reducing the impact of the high temperature and high humidity detection plate.

[0025] Optionally, the housing is also provided with a maintenance door for opening the transfer chamber, a test door for opening the detection chamber, and a connection door for opening the connection chamber.

[0026] By adopting the above technical solutions, the maintenance door can be easily opened to open the adapter cavity, making it convenient for staff to install the adapter plate into the adapter cavity; the testing door can be easily opened to open the testing cavity, making it convenient for staff to put the aging board into the testing cavity; and the connection door can be easily opened to open the connection cavity, making it convenient for staff to connect the test board to the adapter plate.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. The sealing element can fill the remaining space of the transfer groove after the transfer protrusion enters the transfer groove, thereby blocking the transfer groove, reducing water vapor leakage, and adding a constant temperature component to keep the transfer cavity at a constant temperature, reducing the occurrence of condensation or dew due to large temperature differences between the transfer plate and the transfer cavity.

[0029] 2. When a small number of aging boards are being tested, simply remove the other adapter boards from the adapter slot and place them on the placement slot. The adapter boards will flip up, allowing the sealing plate to block the adapter interface, thereby reducing moisture leakage. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the test chambers in Examples 1 and 2.

[0031] Figure 2 This is a cross-sectional structural diagram of the test chamber in Example 1.

[0032] Figure 3 yes Figure 2 A magnified structural diagram of point A in the middle.

[0033] Figure 4 This is a partial structural diagram of the test chamber in Example 1.

[0034] Figure 5 These are schematic diagrams of the adapter plate and seal in Embodiments 1 and 2.

[0035] Figure 6 This is a cross-sectional structural diagram of the test chamber in Example 2.

[0036] Figure 7 This is a partial structural schematic diagram of the test chamber in Example 2.

[0037] Figure 8 yes Figure 6 A magnified structural diagram at point B in the middle.

[0038] Figure 9 yes Figure 6 A magnified structural diagram at point C.

[0039] Explanation of reference numerals in the attached drawings: 1. Enclosure; 11. Test door; 12. Maintenance door; 13. Connecting door; 14. Test chamber; 141. Support plate; 142. Guide rail; 15. Adapter chamber; 151. Divider plate; 152. Fan; 153. Thermostatic tube; 154. Air inlet; 155. Insulated area; 156. Thermostatic area; 157. Heating wire; 16. Connecting chamber; 2. First partition plate; 21. Adapter groove; 22. Second receiving groove; 23. Sealing plate; 24. Pull rope; 3. Adapter plate; 31. First adapter protrusion; 4. Aging plate; 41. Second adapter protrusion; 5. Sealing element; 51. First connecting element; 52. Second connecting element; 53. Sealing ring; 6. Support plate; 61. Protective plate; 62. First receiving groove; 63. Turning plate; 64. Elastic element; 65. Resting groove; 7. Second partition plate; 71. Through groove. Detailed Implementation

[0040] The directional terms such as up, down, left, right, front, back, front, back, top, and bottom mentioned or possibly used in this specification are defined relative to the structures shown in the accompanying drawings. These are relative concepts and may therefore vary depending on their location and usage. Therefore, these or other directional terms should not be interpreted as restrictive. Furthermore, the terms "first," "second," "third," and similar expressions are used for descriptive and distinguishing purposes only and should not be construed as indicating or implying the relative importance of the corresponding components.

[0041] The following is in conjunction with the appendix Figure 1 - Appendix Figure 9 This application will be described in further detail.

[0042] This application discloses a semiconductor test chamber.

[0043] Example 1, refer to Figure 1 and Figure 2 A semiconductor test chamber includes a chamber 1, which has a test chamber 14, a transfer chamber 15 and a connection chamber 16 in sequence. A first partition 2 and a second partition 7 are fixedly arranged inside the chamber 1. The first partition 2 is used to separate the test chamber 14 and the transfer chamber 15; the second partition 7 is used to separate the transfer chamber 15 and the connection chamber 16.

[0044] Reference Figure 1 and Figure 2 The housing 1 has a test door 11, which allows the test chamber 14 to be opened easily and the aging board 4 to be placed inside the test chamber 14. The test chamber 14 is used to test the aging of the aging board 4. A support plate 141 is vertically fixed inside the test chamber 14, and multiple guide rails 142 are fixedly connected to the support plate 141. The guide rails 142 can guide the aging board 4 and facilitate the sliding of the aging board 4. In this embodiment, the test door 11 is located on the front side of the housing 1.

[0045] Reference Figure 1 and Figure 2 The first partition 2 has multiple transfer slots 21. One end of the transfer slot 21 is connected to the test chamber 14, and the other end of the transfer slot 21 is connected to the transfer chamber 15. The aging board 4 is placed on the guide rail 142, and then the aging board 4 is pushed so that one end of the aging board 4 can enter the transfer slot 21.

[0046] Reference Figure 1 and Figure 2 The housing 1 is provided with a maintenance door 12, which allows the adapter cavity 15 to be opened easily. In this embodiment, there are two maintenance doors 12, located on the left and right sides of the housing 1 respectively.

[0047] Reference Figure 1 and Figure 2 The housing 1 has a connecting door 13, which allows for easy opening of the connecting cavity 16. A detection board is installed inside the connecting cavity 16, and semiconductor components are mounted on the detection board. The detection board is existing technology and will not be described in detail. It is also not shown in the figure.

[0048] Reference Figure 1 and Figure 2 The adapter plate 3 is detachably installed in the adapter cavity 15. The second partition plate 7 has multiple through slots 71. The size of the through slots 71 is the same as the transverse cross section of the adapter plate 3, allowing one end of the adapter plate 3 to enter the connecting cavity 16 through the through slots 71. This facilitates connecting the test plate in the connecting cavity 16 with the adapter plate 3 to collect and test the test data of the aging plate.

[0049] Reference Figure 3 and Figure 4 The end of the adapter board 3 away from the second partition 7 has a first adapter protrusion 31, and the first adapter protrusion 31 is provided with gold fingers. The first adapter protrusion 31 can be inserted into the adapter groove 21 of the first partition 2. The end of the aging board 4 inserted into the adapter groove 21 has a second adapter protrusion 41, and the second adapter protrusion 41 can be inserted into the first adapter protrusion 31. The second adapter protrusion 41 is a data output terminal. When the second adapter protrusion 41 contacts the gold fingers in the first adapter protrusion 31, the aging board 4 and the adapter board 3 conduct the circuit and can perform data transmission and analysis.

[0050] Reference Figure 4 and Figure 5A sealing element 5 is detachably installed in the adapter groove 21. The sealing element 5 is a long strip-shaped U-shape, with an opening in the middle that allows the first adapter protrusion 31 to be inserted, so that the sealing element 5 is fitted onto the first adapter protrusion 31 of the adapter plate 3. During installation, the sealing element 5 is first connected to the adapter plate 3 via the first connector 51, so that the sealing element 5 and the adapter plate 3 form a whole. Then, the first adapter protrusion 31 is inserted into the adapter groove 21, so that the sealing element 5 also enters the adapter groove 21. A sealing ring 53 is provided on the side of the sealing element 5 away from the adapter plate. Then, the sealing element 5 is connected to the first partition plate 2 via the second connector 52, so that the sealing ring 53 abuts against the first partition plate 2 to achieve a seal. The first connector 51 is a screw, and the second connector 52 is also a screw. Threaded holes are provided symmetrically on the top, bottom and left and right sides of the adapter groove 21. The second connector 52 can pass through the threaded holes and connect with the seal 5. As the second connector 52 is tightened, the sealing ring 53 of the seal 5 can press against the groove wall of the adapter groove 21. Water vapor in the test chamber 14 is not easy to pass through the adapter groove 21 and enter the adapter chamber 15.

[0051] Reference Figure 4 and Figure 5 The adapter board 3 contains the circuitry. The adapter board 3 keeps the detection board away from areas with high moisture content. The adapter board 3 mainly serves as a connection between the aging board 4 and the detection board. Waterproof adhesive is applied to the adapter board 3. After moisture condenses on the adapter board 3, the waterproof adhesive can prevent moisture from seeping into the adapter board 3. The waterproof adhesive is available on the market and is existing technology, so it will not be described in detail.

[0052] Reference Figure 4 and Figure 5A partition plate 151 for supporting the adapter plate 3 is fixed inside the adapter cavity 15. The partition plate 151 divides the adapter cavity 15 into a heat-insulating area 155 and a constant-temperature area 156. The heat-insulating area 155 is located near the first partition plate 2 and is filled with heat-insulating cotton (not shown in the figure). Heating wires 157 are laid on the side of the first partition plate 2 facing the adapter cavity 15. The heating wires are U-shaped and there are multiple of them, located near the adapter groove 21. The heating wires 157 are energized and generate a certain amount of heat. In this embodiment, the test cavity 14 is located in a high temperature and high humidity environment of 85°C. Therefore, the temperature of the heating wires 157 is also controlled at around 85°C to keep the temperature difference between the two sides of the first partition plate 2 small, thereby reducing the occurrence of condensation. The temperature control component is located within the temperature control zone 156, which is near the second heat insulation plate. The temperature control component includes a fan 152 and temperature control pipes 153. The fan 152 is fixedly connected to the partition plate 151, and the temperature control pipes 153 are located in the air outlet direction of the fan 152. The housing 1 has an air inlet 154 located in the air inlet direction of the fan 152. There are two pairs of temperature control pipes 153. After the fan 152 sends air into the transfer chamber 15, the air is heated by the two pairs of temperature control pipes 153, filling the entire transfer chamber 15 and maintaining a certain temperature for the transfer plate 3. Furthermore, with the flow of hot air, the transfer chamber remains dry.

[0053] Example 2

[0054] Reference Figure 6 and Figure 7 The difference between this embodiment and embodiment one is that the structure of the partition plate 151 is different, and the heat insulation cotton and heating wire 157 are removed from the transfer cavity 15, leaving only a constant temperature component. The constant temperature component includes a fan 152 and a constant temperature tube 153. The fan 152 and the constant temperature tube 153 are connected to the first partition plate 2 on one side of the transfer cavity 15. The constant temperature tube 153 has a long strip-shaped U-shaped structure and is placed vertically. The bottom of the constant temperature tube 153 extends into the bottom wall of the transfer cavity 15 and is connected to a power supply and controller through wires. Power can be supplied to keep the constant temperature tube 153 constant. The fan 152 is located above the constant temperature tube 153, so that the constant temperature tube 153 is in the direction of the fan 152's air outlet. The enclosure 1 has an air inlet 154, which is located directly above the fan 152, so that the air inlet 154 is in the air intake direction of the fan 152. When the fan 152 is turned on, the outside air of the enclosure 1 can enter the transfer chamber 15 under the suction of the fan 152, which can keep the transfer chamber 15 at a certain temperature and reduce the phenomenon of water vapor condensing when it comes into contact with the colder transfer plate 3.

[0055] Reference Figure 6 and Figure 7The transfer cavity 15 is fixed with a partition plate 151, which can divide the transfer cavity 15 into two areas, left and right, corresponding to the two maintenance doors 12 on the left and right sides of the housing 1. There are two thermostatic tubes 153, one near the left side and the other near the right side. After the fan 152 sends the air into the transfer cavity 15, the air can be heated by the two thermostatic tubes 153 and fill the entire transfer cavity 15, so that the transfer plate 3 maintains a certain temperature.

[0056] Reference Figure 6 and Figure 7 The partition plate 151 is fixed with a support plate 6 for supporting the adapter plate 3. The side of the support plate 6 away from the partition plate 151 has a protective plate 61. The protective plate 61 and the through groove 71 (e.g.) Figure 6 The right or left side wall of the channel is flush with the support plate 6 and the bottom wall of the channel 71 is flush with the support plate 6; the support plate 6 and the protective plate 61 are integrally formed to form a structure with an L-shaped cross section.

[0057] Reference Figure 8 and Figure 9 The support plate 6 has a first receiving groove 62 at one end facing the transition groove 21. A rotating plate 63 is provided in the first receiving groove 62. The rotating shaft of the rotating plate 63 is close to the through groove 71, and the rotating end of the rotating plate 63 is close to the transition groove 21. The support plate 6 is also provided with an elastic element 64, which is a spring. The bottom of the elastic element 64 is connected to the support plate 6, and the top of the elastic element 64 abuts against the lower surface of the rotating plate 63. The elastic element 64 can push the rotating plate 63 to rotate away from the transition groove 21 and towards the through groove 71. The first partition plate 2 also has a second receiving groove 22 communicating with the upper wall of the transition groove 21. A sealing plate 23 is slidably provided in the second receiving groove 22. The lower end of the sealing plate 23 can enter the transition groove 21 to block the transition groove 21. A pull rope 24 is connected to the upper end of the sealing plate 23. One end of the pull rope 24 is fixedly connected to the rotating end of the rotating plate 63. As the rotating plate 63 rotates, the sealing plate 23 can slide up and down.

[0058] Reference Figure 8 and Figure 9 The rotating plate 63 has two states: a flipped state and a folded state. When the adapter plate 3 is not placed on the support plate 6, the elastic element 64 can push against the rotating plate 63, allowing the rotating plate 63 to rotate out into the first receiving groove 62. At this time, the rotating plate 63 is in the flipped state. When the rotating plate 63 is in the flipped state, the pull rope 24 is no longer taut, and the sealing plate 23 will slide downward under its own weight, causing one end of it to move from the second receiving groove 22 to the adapter groove 21, thus blocking the adapter groove 21. Since the sealing plate 23 slides downward under its own weight to block the adapter groove 21, although the sealing performance is not strong, it still reduces the occurrence of water vapor leakage.

[0059] Reference Figure 8 and Figure 9 When the adapter plate 3 is placed on the support plate 6, the bottom of the adapter plate 3 will press against the rotating plate 63, causing the rotating plate 63 to flip and enter the first receiving groove 62. At this time, the rotating plate 63 is in a retracted state. When the rotating plate 63 switches to the retracted state, the pull rope 24 is pulled and can pull the sealing plate 23 upward, so that the sealing plate 23 is fully inserted into the second receiving groove 22.

[0060] Reference Figure 8 and Figure 9 The support plate 6 also has a mounting groove 65, which is horizontally located on the upper surface of the support plate 6. The mounting groove 65 has a triangular cross-section. If the adapter plate 3 is not needed, the adapter plate 3 can be tilted so that one end of the adapter plate 3 rests against the mounting groove 65 and the other end rests against the first partition plate 2. At this time, the adapter plate 63 will be in a flipped state because it is not under the pressure of the adapter plate 3, so that the sealing plate 23 can keep blocking the adapter groove 21.

[0061] The implementation principle of Example 2 is as follows:

[0062] Preparation steps: First, put the sealing element 5 on the first transition protrusion 31 of the adapter plate 3. The first connector 51 fixes the sealing element 5 to the adapter, so that the sealing element 5 can form an integral part with the adapter plate 3.

[0063] Installation steps: When connecting the two ends of the adapter plate 3 to the adapter groove 21 and the through groove 71 respectively, first open the maintenance door 12. Place the adapter plate 3 with the end near the through groove 71 facing down and the end near the adapter groove 21 facing up into the adapter cavity 15 at an angle. Place one side of the adapter plate 3 against the protective plate 61. Since the protective plate 61 is flush with the groove wall of the through groove 71, it will also be flush after contact. At this time, the adapter plate 3 can be aligned with the through groove 71. First, let one end of the adapter plate 3 pass through the through groove 71 into the connection cavity 16. The adapter plate 3 gradually changes from tilted to horizontal. During the process of becoming horizontal, the bottom of the adapter plate 3 will press the rotating plate 63, allowing the rotating plate 63 to switch from the flipped state to the folded state. When the rotating plate 63 rotates, it will pull the pull rope 24, allowing the pull rope 24 to pull the sealing plate 23 upward, so as not to block the adapter groove 21. After the adapter plate 3 is horizontal, push the adapter plate 3 so that the seal 5 and the first adapter protrusion 31 enter the adapter groove 21 together. Then, the seal 5 is fixedly connected to the first partition plate 2 through the second connector 52 so that the first adapter protrusion 31 can be fixed. The other end of the adapter plate 3 passes through the through groove 71 of the second partition plate 7 and is located in the connecting cavity 16. Connect the electronic components and power supply to the adapter plate 3 so that the adapter plate 3 is powered on.

[0064] Test steps: Open the test door 11, push the aging board 4 to be tested into the test chamber 14 through the track, connect the first transition protrusion 31 of the aging board 4 with the second transition protrusion 41 of the transition board 3 to achieve communication, then close the test door 11 to make the test chamber 14 a high temperature and high humidity environment, and perform aging tests on the semiconductor components on the aging board 4.

[0065] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, based on the technical solutions of this invention, those skilled in the art can propose various interchangeable structural methods and implementation methods without changing the essential spirit of this invention. Therefore, the above specific embodiments and accompanying drawings are merely illustrative descriptions of the technical solutions of this invention and should not be considered as the entirety of this invention or as a limitation or restriction of the technical solutions of this invention. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor test chamber, characterized in that: Includes a housing (1), which has a test chamber (14) and a transfer chamber (15). A first partition (2) is fixed inside the housing (1) to separate the test chamber (14) and the transfer chamber (15). A guide rail (142) is fixed inside the test chamber (14), and an aging plate (4) is slidably mounted on the guide rail (142). The first partition (2) has a transfer groove (21). A transfer plate (3) is provided inside the transfer chamber (15). One end of the adapter plate (3) has a first adapter protrusion (31), and the end of the adapter plate (3) with the first adapter protrusion (31) is inserted into the adapter groove (21). The aging plate (4) has a second adapter protrusion (41), and the end of the aging plate (4) with the second adapter protrusion (41) can be inserted into the adapter groove (21) and connected to the first adapter protrusion (31). A sealing element (5) is provided in the adapter groove (21), and the sealing element (5) is sleeved on the first adapter protrusion (31). The transfer cavity (15) is fixed with a partition plate (151) for supporting the transfer plate (3), and the transfer cavity (15) is provided with a constant temperature component to keep the air flowing in the transfer cavity (15). The partition plate (151) is fixed with a support plate (6) for supporting the adapter plate (3), and the support plate (6) has a protective plate (61) on one side. The support plate (6) has a first receiving groove (62), and a rotating plate (63) is provided in the first receiving groove (62). The support plate (6) is also provided with an elastic element (64), which can push the rotating plate (63) to rotate away from the first receiving groove (62). When the rotating plate (63) rotates out of the first receiving groove (62), the rotating plate (63) is in a flipped state. The adapter plate (3) can press the rotating plate (63) so that the rotating plate (63) is located in the first receiving groove (62). When the rotating plate (63) is located in the first receiving groove (62), the rotating plate (63) is in a retracted state. The first partition plate (2) is also provided with a connection to the adapter groove (2). 1) A connected second receiving groove (22) is provided with a sealing plate (23) which is slidably disposed in the second receiving groove (22). One end of the sealing plate (23) can enter the transition groove (21) and block the transition groove (21). A pull rope (24) is connected to the end of the sealing plate (23) away from the transition groove (21). One end of the pull rope (24) is fixedly connected to the rotating end of the rotating plate (63). When the rotating plate (63) is in the retracted state, the pull rope (24) can pull the sealing plate (23) so that the sealing plate (23) is located in the second receiving groove (22). When the rotating plate (63) is in the flipped state, one end of the sealing plate (23) can move into the transition groove (21).

2. A semiconductor test chamber according to claim 1, characterized in that: The sealing element (5) is connected to the adapter plate (3) via the first connector (51), and the sealing element (5) is connected to the first partition plate (2) via the second connector (52).

3. A semiconductor test chamber according to claim 1, characterized in that: The support plate (6) is also provided with a mounting groove (65).

4. A semiconductor test chamber according to claim 3, characterized in that: The thermostatic component includes a fan (152) connected to the first partition (2) on one side of the transfer cavity (15) and a thermostatic tube (153) located in the air outlet direction of the fan (152). The housing (1) has an air inlet (154) located in the air inlet direction of the fan (152).

5. A semiconductor test chamber according to claim 2, characterized in that: The housing (1) also has a connecting cavity (16), and a second partition (7) is fixed inside the housing (1) to separate the adapter cavity (15) and the connecting cavity (16). The second partition has a through groove (71) for the adapter plate (3) to pass through. A detection plate connected to the adapter plate (3) is provided inside the connecting cavity (16).

6. A semiconductor test chamber according to claim 5, characterized in that: The housing (1) is also provided with a maintenance door (12) for opening the transfer chamber (15), a test door (11) for opening the test chamber (14), and a connection door (13) for opening the connection chamber (16).

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