Electroforming method and electroforming system for u-shaped composite forming mold
By using an electroforming method with a U-shaped composite molding die, a conformal nozzle and nickel sulfamate electroforming liquid are used to form the material in an electroforming tank. Combined with the non-stop electroforming connection between the support base and the metal panel, the problem of time-consuming, labor-intensive, and poor-quality composite material mold processing is solved. This method achieves a high-surface-quality and cost-effective mold forming method, and solves the problems of thermal deformation and production cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
- Filing Date
- 2023-08-07
- Publication Date
- 2026-04-14
AI Technical Summary
Existing composite material molding die processing is time-consuming and labor-intensive, and the quality of the molds produced is poor, especially when forming large-sized thin-walled components, which suffers from thermal deformation and high production costs.
The electroforming method using a U-shaped composite molding die involves setting a contour nozzle in the electroforming tank and using nickel sulfamate electroforming liquid for electroforming. During the electroforming process, a support base is introduced to connect with the metal panel, achieving electroforming connection without stopping the machine. A flat titanium basket and anode bag structure are used, and the contour nozzle performs reciprocating linear motion above the cathode.
It effectively solves the forming problem of large-size thin-walled components. The formed U-shaped composite forming mold has high surface quality and good thickness uniformity, simplifies the connection process between the support base and the molded panel, achieves high-strength connection, and reduces production costs.
Smart Images

Figure CN117385424B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electroforming technology, and in particular to an electroforming method and system for a U-shaped composite molding die. Background Technology
[0002] Composite materials, with their high specific strength and excellent fatigue resistance, are highly favored by aircraft designers, and their proportion in various aircraft components is increasing. Currently, composite material components are mainly formed by autoclave hot pressing, and after forming, they are often not subjected to secondary processing. Therefore, the forming quality and dimensional accuracy of these parts mainly rely on mold control.
[0003] Commonly used composite material molding dies include tool steel dies, aluminum alloy dies, and Invar dies. Traditional sheet metal processing of the die surface results in a thickness of approximately 12-20mm, leading to significant weight, slow heating, and uneven heating of the composite material. Composite materials exhibit springback during hot pressing, requiring continuous sheet metal adjustments to the die surface to compensate for this springback. This process is time-consuming and labor-intensive, and the sheet metal adjustments can cause irreversible damage to the die surface.
[0004] Composite molding molds can use thin-walled panels with a thickness of 4-6mm. However, if the traditional welding method is used to fix the support and adjustment parts, the welding heat will cause the panel to undergo large thermal deformation or even weld through cracks. If the vapor deposition method is used, a special vapor deposition furnace is required. The equipment is more complex, the processing energy consumption is higher, and as the size of the component increases, a larger vapor deposition furnace is required, which greatly increases the production cost. Summary of the Invention
[0005] This invention provides an electroforming method and system for U-shaped composite molding dies, which solves the defects of existing composite molding die processing being time-consuming and labor-intensive, and producing dies of poor quality.
[0006] The electroforming method for the U-shaped composite molding die provided by this invention includes:
[0007] A contour nozzle outlet is set in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank;
[0008] The metal panel is electroformed in the electroforming tank. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As the electroforming is deposited, the support base and the metal panel are integrated.
[0009] Electroforming is stopped when the thickness of the metal panel reaches the second dimension.
[0010] The metal panel is removed from the electroforming tank and demolded.
[0011] According to the electroforming method of the U-shaped composite molding die provided by the present invention, the metal panel is electroformed in the cathode of the electroforming tank, and a flat titanium basket is provided at the anode of the electroforming tank, and an anode bag is provided outside the flat titanium basket.
[0012] According to the electroforming method of the U-shaped composite molding die provided by the present invention, the electroforming tank is provided with a contour nozzle, which performs reciprocating linear motion above the cathode.
[0013] According to the electroforming method of the U-shaped composite molding die provided by the present invention, the contour nozzle is prepared by offsetting the cathode profile, and the offset distance is the gap between the contour nozzle and the cathode.
[0014] According to the electroforming method of the U-shaped composite molding die provided by the present invention, the contour nozzle reciprocates linearly along the axial direction of the cathode, the distance of the movement is the length of the axial direction of the cathode, and the speed of the movement is a first speed.
[0015] According to the electroforming method of the U-shaped composite molding die provided by the present invention, the electroforming tank is filled with electroforming liquid, which is nickel aminosulfonate electroforming liquid, and the electroforming liquid includes: 300-500 g / L nickel aminosulfonate, 30-45 g / L boric acid, 0-30 g / L nickel chloride, and 0.1-0.3 g / L sodium dodecyl sulfate.
[0016] According to the electroforming method of the U-shaped composite molding die provided by the present invention, the support base is an inverted stainless steel screw, and a through hole is provided at the central axis of the support base.
[0017] The present invention also provides an electroforming system for a U-shaped composite molding die, comprising:
[0018] The first electroforming module is used to set the contour nozzle outlet in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank.
[0019] The second electroforming module is used to electroform the metal panel in the electroforming tank. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As the electroforming is deposited, the support base and the metal panel are integrated.
[0020] The electroforming stop module is used to stop electroforming when the thickness of the metal panel reaches the second dimension.
[0021] The demolding module is used to remove the metal panel from the electroforming tank for demolding.
[0022] The present invention also provides an electroforming tank, comprising a cathode, an anode, and a contour nozzle;
[0023] The anode includes a flat titanium basket and an anode bag;
[0024] The contour nozzle is positioned above the cathode and performs reciprocating linear motion above the cathode.
[0025] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement an electroforming method for any of the U-shaped composite molding dies described above.
[0026] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements an electroforming method for any of the U-shaped composite molding dies described above.
[0027] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements an electroforming method for any of the U-shaped composite molding dies described above.
[0028] The electroforming method for U-shaped composite molding dies provided by this invention effectively solves the forming problem of large-sized thin-walled components by sweeping blasting with a contour nozzle without the use of additives. The formed U-shaped composite molding die has high surface quality and good thickness uniformity. The non-stop electroforming connection between the support base and the mold panel during the electroforming process simplifies the connection process between the support base and the mold panel and achieves a high-strength connection between the support base and the metal panel. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0030] Figure 1 This is a schematic flowchart of the electroforming method for the U-shaped composite molding die provided in this embodiment of the invention;
[0031] Figure 2 This is a schematic diagram of the electroforming system for the U-shaped composite molding die provided in this embodiment of the invention;
[0032] Figure 3 This is a schematic diagram of the structure of the U-shaped composite molding die provided in an embodiment of the present invention;
[0033] Figure 4 This is a schematic diagram of the structure of the electroforming tank provided in an embodiment of the present invention;
[0034] Figure 5 This is a schematic diagram of the structure of the electronic device provided in an embodiment of the present invention.
[0035] in:
[0036] 1-Cathode; 2-Contouring nozzle; 3-Anode; 4-Electroforming tank; 5-Metal panel; 6-Support base. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.
[0038] Figure 1 This is a schematic flowchart of the electroforming method for the U-shaped composite molding die provided in this embodiment of the invention.
[0039] like Figure 1 As shown, this embodiment provides an electroforming method for a U-shaped composite molding die, including:
[0040] Step 101: Set the outlet of the contour nozzle 2 in the electroforming tank 4. The outlet of the contour nozzle 2 reciprocates above the cathode 1 of the electroforming tank 4.
[0041] Step 102: Electroform the metal panel 5 in the electroforming tank 4. When the thickness of the metal panel 5 reaches the first dimension, place the support base 6 into the electroforming tank 4. As the electroforming is deposited, the support base 6 and the metal panel 5 become one.
[0042] Step 103: When the thickness of the metal panel 5 reaches the second dimension, stop electroforming.
[0043] Step 104: Remove the metal panel 5 from the electroforming tank 4 and demold it.
[0044] In practice, the first dimension can be 2 millimeters (mm), and the second dimension can be 4-6 millimeters.
[0045] In practical applications, there can be multiple support bases 6. When the thickness of the metal panel 5 reaches the first dimension, the support bases 6 can be placed into the electroforming tank 4 at one time using a clamp. Specifically, they can be placed on the surface of the deposition layer of the metal panel 5. All support bases 6 will undergo nickel electrodeposition at the same time and become integrated with the metal panel 5 as electroforming proceeds.
[0046] In an exemplary embodiment, the metal panel 5 is electroformed in the cathode 1 of the electroforming tank 4, and a flat titanium basket is provided on the anode 3 of the electroforming tank 4, with an anode 3 bag provided outside the flat titanium basket.
[0047] In practice, the anode bags can be vertically suspended on the side wall of the electroforming tank 4, and the anode bags can be filled with sulfur-free nickel balls.
[0048] In practical applications, the cathode 1 can be made using 316L stainless steel. A ring of microgrooves can be set on the surface of the cathode 1. The microgrooves can be formed into a ring of micro-protrusions on the metal panel 5 by electroforming reverse copying. The micro-protrusions can serve as the outline lines of the U-shaped composite molding die obtained by electroforming.
[0049] For example, the cross-sectional profile of the microgroove can be 0.2-0.4 mm deep and 0.2-0.5 mm wide, and the depth direction of the microgroove can be consistent with the curvature direction of the cathode 1. The microgroove can be machined using a 60° engraving tool.
[0050] In an exemplary embodiment, the electroforming tank 4 is provided with a contour nozzle 2, which performs reciprocating linear motion above the cathode 1.
[0051] In practice, the electroforming tank 4 can also be equipped with a motion mechanism, which may include a motor. The contour nozzle 2 can be connected to the motion mechanism. Driven by the motion mechanism, the contour nozzle 2 performs reciprocating linear motion above the cathode 1.
[0052] In an exemplary embodiment, the contour nozzle 2 is prepared by biasing the profile of the cathode 1, and the biasing distance is the gap between the contour nozzle 2 and the cathode 1.
[0053] In practice, the design process of the contour nozzle 2 involves intersecting the cathode normal plane with the cathode profile, and the intersecting line is the cathode cross-sectional contour line. The cathode cross-sectional contour line is offset outward by a certain distance to obtain the shape of the liquid outlet of the contour nozzle. The position of the line obtained by offsetting the cathode cross-sectional contour line is the relative position of the liquid outlet of the contour nozzle and the cathode surface during the actual processing.
[0054] In practical applications, the offset distance can be 5-10mm, and preferably, the offset distance can be 8mm.
[0055] In the exemplary embodiment, the contour nozzle 2 reciprocates linearly along the axial direction of the cathode 1, the distance of the movement is the length of the axial direction of the cathode 1, and the speed of the movement is a first speed.
[0056] In practice, the first speed can be 200-400 mm / min, preferably 300 mm / min.
[0057] In an exemplary embodiment, the electroforming tank 4 is filled with electroforming liquid, which is nickel aminosulfonate electroforming liquid, and the electroforming liquid includes 300-500 g / L nickel aminosulfonate.
[0058] In practice, the electroforming solution may also include 30-45 g / L of boric acid, 0-30 g / L of nickel chloride, and 0.1-0.3 g / L of sodium dodecyl sulfate.
[0059] During implementation, the conformal nozzle 2 can spray the electroforming liquid filtered by the filter onto the surface of the cathode 1 to promote timely renewal of ions at various points on the surface of the cathode 1.
[0060] In the exemplary embodiment, the support base 6 is an inverted stainless steel screw, and a through hole is provided at the central axis of the support base 6.
[0061] The electroforming system for the U-shaped composite molding die provided by the present invention will be described below. The electroforming system for the U-shaped composite molding die described below can be referred to in correspondence with the electroforming method for the U-shaped composite molding die described above.
[0062] Figure 2 This is a schematic diagram of the electroforming system for the U-shaped composite molding die provided in an embodiment of the present invention.
[0063] like Figure 2 As shown, the electroforming system for the U-shaped composite molding die provided in this embodiment includes:
[0064] The first electroforming module 201 is used to set the outlet of the contour nozzle 2 in the electroforming tank 4. The outlet of the contour nozzle 2 reciprocates above the cathode 1 of the electroforming tank 4.
[0065] The second electroforming module 202 is used to electroform the metal panel 5 in the electroforming tank 4. When the thickness of the metal panel 5 reaches the first dimension, the support base 6 is placed into the electroforming tank 4. As the electroforming is deposited, the support base 6 and the metal panel 5 are integrated.
[0066] The electroforming stop module 203 is used to stop electroforming when the thickness of the metal panel 5 reaches the second dimension.
[0067] The demolding module 204 is used to remove the metal panel 5 from the electroforming tank 4 for demolding.
[0068] The specific implementation method of the electroforming system for the U-shaped composite molding die provided in this embodiment can be implemented with reference to the above embodiment, and will not be repeated here.
[0069] Figure 3 This is a schematic diagram of the structure of the U-shaped composite molding die provided in an embodiment of the present invention.
[0070] like Figure 3 As shown, this embodiment of the invention also provides a U-shaped composite molding die, which is obtained by electroforming using the electroforming method of the U-shaped composite molding die as described in any of the above embodiments or the electroforming system of the U-shaped composite molding die described above.
[0071] Figure 4 This is a schematic diagram of the structure of the electroforming tank provided in an embodiment of the present invention.
[0072] like Figure 4 As shown, the electroforming tank includes: a cathode, an anode, and a contour nozzle;
[0073] The anode includes a flat titanium basket and an anode bag;
[0074] The contour nozzle is positioned above the cathode and performs reciprocating linear motion above the cathode.
[0075] Figure 5 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 5 As shown, the electronic device may include: a processor 510, a communication interface 520, a memory 530, and a communication bus 540, wherein the processor 510, the communication interface 520, and the memory 530 communicate with each other via the communication bus 540. The processor 510 can call logical instructions in the memory 530 to execute an electroforming method for a U-shaped composite forming mold, the method including:
[0076] A contour nozzle outlet is set in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank;
[0077] The metal panel is electroformed in the electroforming tank. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As the electroforming is deposited, the support base and the metal panel are integrated.
[0078] Electroforming is stopped when the thickness of the metal panel reaches the second dimension.
[0079] The metal panel is removed from the electroforming tank and demolded.
[0080] Furthermore, the logical instructions in the aforementioned memory 530 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0081] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer is able to execute the electroforming method for the U-shaped composite molding die provided by the above methods, the method comprising:
[0082] A contour nozzle outlet is set in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank;
[0083] The metal panel is electroformed in the electroforming tank. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As the electroforming is deposited, the support base and the metal panel are integrated.
[0084] Electroforming is stopped when the thickness of the metal panel reaches the second dimension.
[0085] The metal panel is removed from the electroforming tank and demolded.
[0086] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements an electroforming method for the U-shaped composite molding die provided by the methods described above, the method comprising:
[0087] A contour nozzle outlet is set in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank;
[0088] The metal panel is electroformed in the electroforming tank. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As the electroforming is deposited, the support base and the metal panel are integrated.
[0089] Electroforming is stopped when the thickness of the metal panel reaches the second dimension.
[0090] The metal panel is removed from the electroforming tank and demolded.
[0091] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.
[0092] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.
[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An electroforming method for a U-shaped composite molding die, characterized in that, include: A contour nozzle outlet is provided in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank; In the electroforming tank, the metal panel is electroformed. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As the electroforming is deposited, the support base and the metal panel become integrated. Electroforming is stopped when the thickness of the metal panel reaches the second dimension. The metal panel is removed from the electroforming tank and demolded. The support base is an inverted stainless steel screw, and a through hole is provided at the central axis of the support base.
2. The electroforming method for the U-shaped composite molding die according to claim 1, characterized in that, The metal panel is formed by cathode electroforming in the electroforming tank, and a flat titanium basket is provided at the anode of the electroforming tank, with an anode bag provided outside the flat titanium basket.
3. The electroforming method for the U-shaped composite molding die according to claim 2, characterized in that, The electroforming tank is equipped with a contour nozzle, which performs reciprocating linear motion above the cathode.
4. The electroforming method for the U-shaped composite molding die according to claim 3, characterized in that, The contour nozzle is fabricated by offsetting the cathode profile, and the offset distance is the gap between the contour nozzle and the cathode.
5. The electroforming method for the U-shaped composite molding die according to claim 3, characterized in that, The contour nozzle reciprocates linearly along the axial direction of the cathode, the distance traveled is the length of the axial direction of the cathode, and the speed of the movement is a first speed.
6. The electroforming method for the U-shaped composite molding die according to claim 1, characterized in that, The electroforming tank contains an electroforming solution, which is a nickel aminosulfonate electroforming solution, comprising 300-500 g / L nickel aminosulfonate.
7. An electroforming system for a U-shaped composite molding die, applied to the electroforming method for the U-shaped composite molding die according to any one of claims 1-6, characterized in that, include: The first electroforming module is used to set a contour nozzle outlet in the electroforming tank, and the contour nozzle outlet reciprocates above the cathode of the electroforming tank. The second electroforming module is used to electroform a metal panel in an electroforming tank. When the thickness of the metal panel reaches the first dimension, the support base is placed into the electroforming tank. As electroforming deposition occurs, the support base and the metal panel become integrated. The electroforming module is stopped when the thickness of the metal panel reaches the second dimension. The demolding module is used to remove the metal panel from the electroforming tank for demolding.
Citation Information
Patent Citations
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