X-band solid-state transmitter circuit, high-power radio frequency signal generation method, and transmitter

Abstract

The present invention discloses an X-band solid-state transmitter circuit, a high-power radio frequency signal generation method, and a transmitter. It includes: an upconverter, an X-band solid-state power amplifier circuit, a waveguide-microstrip conversion circuit, a coupled loop assembly, and a filter assembly connected in sequence. The upconverter is used to convert an externally input intermediate-frequency input signal to generate an X-band radio frequency signal. The X-band solid-state power amplifier circuit is used for power amplification of the radio frequency signal. The waveguide-microstrip conversion circuit is used for the transformation of the signal transmission mode from a microstrip line to a waveguide transmission medium. The coupled loop assembly is used for unidirectional transmission and radio frequency coupling of the radio frequency signal. The filter assembly includes a receive rejection filter and a harmonic filter to suppress the noise level within the receive band, and finally transmits the processed high-power radio frequency signal through an antenna. The present invention adopts a modular design, achieving an output of 200W of X-band radio frequency signals, and at the same time has a compact structure, perfect functions, stable operation, and excellent performance.

Description

Technical Field

[0001] The present invention belongs to the field of satellite communication transmitters, and particularly relates to an X-band solid-state transmitter circuit, a high-power radio frequency signal generation method, and a transmitter. Background Art

[0002] In recent years, with the rapid development of microwave communication and measurement and control related technologies, the product requirements for spectral density, spectral quality, channel width, miniaturization, low cost, and high reliability have been increasing day by day. As a key component of systems such as radar and satellite communication, the volume of the transmitter directly affects the volume of the entire system. For mobile measurement and control stations with relatively high mobility requirements, the system volume is even more important. The smaller the system volume, the more flexible the movement of the mobile station.

[0003] Chinese invention patent CN106961285B discloses a scattering communication high-frequency device operating in the full frequency band. This invention obtains a high-power transmission signal by up-converting, power amplifying, and duplex filtering the intermediate-frequency signal. Specifically, it operates in the C band and achieves a continuous wave transmission power of 100W. However, in the communication field, transmitters operating in the C band with a transmission power of 100W no longer meet the current high-quality communication requirements. Since the X-band solid-state transmitter has advantages such as a wide operating bandwidth and a large amount of loaded information compared with conventional low-frequency band transmitters such as L and S bands, it is necessary to design an X-band solid-state transmitter with excellent performance and high reliability, which will be of great significance for the development of fields such as aerospace measurement and control and satellite applications, especially for the layout of a flexible ground station communication network system. Summary of the Invention

[0004] The purpose of the present invention is to overcome the above-mentioned disadvantages of the prior art, improve the performance and reliability of the X-band solid-state transmitter, and at the same time meet the current needs of miniaturization and mobility of ground measurement and control communication stations, and provide an X-band solid-state transmitter circuit, a high-power radio frequency signal generation method, and a transmitter.

[0005] The technical solution adopted by the present invention to achieve the above purpose is as follows:

[0006] An X-band solid-state transmission circuit includes an up-converter, a coupled ring component, a filter component, a power supply, and further includes an X-band solid-state power amplifier circuit and a waveguide-microstrip conversion circuit.

[0007] The up-converter is used to convert the externally input intermediate-frequency input signal to generate an X-band radio frequency signal.

[0008] The input end of the X-band solid-state power amplifier circuit is connected to the output end of the up-converter and is used to amplify the power of the radio frequency signal.

[0009] The input end of the waveguide-microstrip conversion circuit is connected to the output end of the X-band solid-state power amplifier circuit, and is used for transforming the signal transmission mode from the microstrip line to the waveguide transmission medium;

[0010] The input end of the coupling ring assembly is connected to the output end of the waveguide-microstrip conversion circuit, and is used for unidirectional transmission and radio frequency coupling of radio frequency signals;

[0011] The input end of the filter assembly is connected to the output end of the coupling ring assembly. The filter assembly includes a receive rejection filter and a harmonic filter;

[0012] The output end of the filter assembly is used to connect to an antenna to transmit the processed radio frequency signal;

[0013] The power supply is respectively connected to the upconverter and the X-band solid-state power amplifier circuit to provide power.

[0014] As a further improvement of the present invention, it further includes a downconverter and a control and protection circuit. The downconverter is connected to the upconverter and is used for receiving radio frequency signals for downconversion to generate intermediate frequency signals. The control and protection circuit is respectively electrically connected to the upconverter, the downconverter, the X-band solid-state power amplifier circuit, and the coupling ring assembly, and is used for control and protection processing to realize monitoring and command control.

[0015] The upconverter includes a digital control attenuator, a local oscillator generation unit, an intermediate frequency mixing unit, a second local oscillator mixing unit, a radio frequency mixing unit, and a coupling sampling unit. The intermediate frequency input signal of the upconverter is input through the first coupling sampling unit. The output end of the first coupling sampling unit is connected to the digital control attenuator. The digital control attenuator is connected to the first input end of the intermediate frequency mixing unit. The intermediate frequency local oscillator output end of the local oscillator generation unit is connected to the second input end of the intermediate frequency mixing unit. The output end of the intermediate frequency mixing unit is connected to the first input end of the second local oscillator mixing unit. The second local oscillator output end of the local oscillator generation unit is connected to the second input end of the second local oscillator mixing unit. The output end of the second local oscillator mixing unit is connected to the first input end of the radio frequency mixing unit. The radio frequency local oscillator output end of the local oscillator generation unit is connected to the second input end of the radio frequency mixing unit. The output end of the radio frequency mixing unit is connected to the input end of the second coupling sampling unit. The output end of the second coupling sampling unit outputs radio frequency signals. The coupling output ends of the first coupling sampling unit and the second coupling sampling unit are both connected to the control and protection circuit.

[0016] The down-converter includes a radio-frequency mixer. The first input terminal of the radio-frequency mixer is used to input the radio-frequency signal. The second input terminal is connected to the radio-frequency local oscillator output terminal of the local oscillator generating unit. The output terminal of the radio-frequency mixer is connected to the first input terminal of the second local oscillator mixer. The second input terminal of the second local oscillator mixer is connected to the second local oscillator output terminal of the local oscillator generating unit. The output terminal of the second local oscillator mixer is connected to the first input terminal of the intermediate-frequency mixer. The second input terminal of the intermediate-frequency mixer is connected to the intermediate-frequency local oscillator output terminal of the local oscillator generating unit. The output terminal of the intermediate-frequency mixer is connected to an AGC amplifier. The output signal of the AGC amplifier is coupled and output through a third coupling and sampling unit.

[0017] Through reasonable frequency conversion times and local oscillator circuit design, the up-converter of the present invention reduces the overall volume of the transmitter on the one hand, and on the other hand, the up-conversion and down-conversion can share the local oscillator signal, reducing the equipment cost.

[0018] As a further improvement of the present invention, the X-band solid-state power amplifier circuit includes a medium-power drive amplifier, a bias circuit, and a temperature and current detection circuit. The input terminal of the medium-power drive amplifier is used to input the radio-frequency signal. The output terminal of the medium-power drive amplifier is connected to the input terminal of a five-way power divider. Each output terminal of the five-way power divider is connected to a final power amplifier chip. The output terminal of the final power amplifier chip is connected to the five-way power combiner. The temperature and current detection circuit is respectively connected to the five-way power divider, the final power amplifier chip, and the five-way power combiner. The bias circuit is respectively connected to the medium-power drive amplifier and the final power amplifier chip. The final power amplifier chip is a gallium arsenide power amplifier chip. Both the five-way power divider and the five-way power combiner have a five-way waveguide bridge structure. The medium-power drive amplifier includes a single power amplifier chip and a power supply circuit.

[0019] The present invention uses a gallium arsenide final power amplifier chip with a large single-chip output power to reduce the synthesis network, lower the difficulty of design and debugging, and reduce the overall volume of the amplifier. It adopts a five-way power combining circuit structure with high isolation to withstand a large power, expands the flexibility of the power combining circuit, is beneficial to controlling and optimizing the overall volume and power consumption of the machine, can also greatly reduce the cost, and the overall design is relatively simple.

[0020] As a further improvement of the present invention, the waveguide-microstrip conversion circuit includes an overall gradual transition circuit structure that sequentially transitions from microstrip, coplanar waveguide, non-standard waveguide, transition waveguide, stub matching to standard waveguide.

[0021] The present invention realizes high-power transmission through the transformation from microstrip, coplanar waveguide, non-standard waveguide, transition waveguide, stub matching to standard waveguide. The non-standard waveguide is adopted to minimize the distance between the microstrip line probe and the waveguide cavity, reduce the self-heat dissipation pressure of the microstrip board at the probe, improve the power handling capacity, and adopt stub matching and transition waveguide to ensure good signal transmission, thereby realizing high-power transmission and solving the problems of signal transmission discontinuity and small power capacity introduced by the welding of traditional microstrip waveguide conversion.

[0022] The present invention also provides a method for generating X-band high-power radio frequency signals, including,

[0023] S1: Obtain an externally input intermediate-frequency input signal and a reference signal. The reference signal is power-divided by an upconverter to obtain multiple local oscillator signals, and the intermediate-frequency input signal is subjected to multi-stage frequency conversion based on the multiple local oscillator signals to obtain a first radio frequency signal in the X band;

[0024] S2: Power-amplify the first radio frequency signal through an X-band solid-state power amplifier circuit to obtain a first high-power radio frequency signal;

[0025] S3: Perform a transformation of the signal transmission mode of the first high-power radio frequency signal from a microstrip line to a waveguide transmission medium through a waveguide-microstrip conversion circuit to obtain a second high-power radio frequency signal. The waveguide-microstrip conversion includes a transformation from microstrip, coplanar waveguide, non-standard waveguide, transition waveguide, stub matching to standard waveguide in sequence;

[0026] S4: Perform unidirectional transmission and radio frequency coupling on the second high-power radio frequency signal through a coupling ring assembly to obtain a third high-power radio frequency signal. The coupling ring assembly includes: performing forward high-power transmission on the second high-power radio frequency signal through a circulator and restricting the reverse transmission of the reflected signal through a loop to obtain a third high-power radio frequency signal, coupling and outputting the third high-power radio frequency signal through a coupler, sampling the forward output power of the third high-power radio frequency signal to obtain a third radio frequency coupling signal, and extracting the reflected signal from the load end of the circulator to obtain a first radio frequency reflected signal;

[0027] S5: Perform in-band noise suppression and harmonic filtering on the third high-power radio frequency signal through a filter assembly to obtain a fourth high-power radio frequency signal and output it. The filter assembly includes: filtering and suppressing the in-band noise level through a receive stop filter, and performing second harmonic attenuation suppression through a harmonic filter.

[0028] The beneficial effects of the present invention are as follows: By frequency-converting and amplifying the power of the intermediate-frequency signal, a high-power radio-frequency signal output in the X band is achieved. By converting the microstrip line transmission medium into a waveguide transmission medium to expand the power capacity of transmission, high-power radio-frequency signal transmission is realized. By means of the ring coupling and filtering components, noise suppression and harmonic filtering within the receiving band are achieved, improving the performance of the high-power radio-frequency signal.

[0029] As a further improvement of the present invention, it further includes: S6: Performing first coupling and second coupling on the first radio-frequency signal to obtain a first radio-frequency coupling signal and a second radio-frequency coupling signal, collecting the temperature and current of the X-band solid-state power amplifier circuit through a temperature and current detection circuit to obtain a temperature collection signal and a current collection signal, down-converting the first radio-frequency coupling signal through a down-converter to obtain an intermediate-frequency output signal, and performing control and protection processing through a control and protection circuit according to the second radio-frequency coupling signal, the intermediate-frequency output signal, the first radio-frequency reflection signal, the temperature collection signal, and the current collection signal to achieve monitoring and command control.

[0030] An X-band solid-state transmitter includes a housing. A heat dissipation device is installed on the bottom plate of the housing. At the top of the heat dissipation device, there is an X-band solid-state power amplifier circuit, a waveguide-microstrip conversion circuit, a coupling ring assembly, and a filter assembly that are electrically connected in sequence. A power supply is installed on one side wall of the heat dissipation device, and a control and protection circuit and a frequency conversion component are arranged on another opposite side wall. The power supply is respectively connected to the frequency conversion component and the X-band solid-state power amplifier circuit. The frequency conversion component is electrically connected to the X-band solid-state power amplifier circuit. The control and protection circuit is respectively electrically connected to the frequency conversion component, the X-band solid-state power amplifier circuit, and the coupling ring assembly. On one side wall of the housing adjacent to the power supply, there is a fan fixing plate, and an axial fan is arranged on the fan fixing plate. On the side wall of the housing corresponding to the axial fan, there is an air outlet, and the position of the air outlet corresponds to the position of the axial fan. An airtight device, a power supply port, a communication port, an intermediate-frequency input port, an intermediate-frequency output port, a reference signal input port, and a radio-frequency coupling output port are also arranged on the outer wall where the fan fixing plate is located. The frequency conversion component includes an up-converter and a down-converter. The up-converter is respectively electrically connected to the intermediate-frequency input port and the reference signal input port. The control and protection circuit is electrically connected to the communication port. The down-converter is electrically connected to the intermediate-frequency output port. The coupling ring assembly is electrically connected to the radio-frequency coupling output port. The filter assembly is connected to the transmitter output port, and the transmitter output port is fixedly arranged on one side wall of the housing.

[0031] The present invention adopts an integrated design of up-conversion and down-conversion. Through reasonable frequency conversion times and local oscillator circuit design, on the one hand, the overall volume of the transmitter is reduced, and on the other hand, the up-conversion and down-conversion can share the local oscillator signal, reducing the equipment cost.

[0032] The harmonic filter of the filter component realizes the attenuation and suppression of the second harmonic, reduces the noise level within the second harmonic frequency band of the operating frequency of the transmitter, filters out the second and higher harmonics parasitically output by the solid-state high-power amplifier to avoid interference, and the receive rejection filter realizes the suppression of the noise level within the receive band. In addition, the receive rejection filter and the harmonic filter adopt an integrated design to reduce the volume and ensure the overall performance. The overall design and processing of the two not only avoid the deterioration of indicators introduced by separate design and then assembly, as well as the poor signal transmission introduced by the mismatch after the filters are connected in series, but also can reduce the overall volume and facilitate the miniaturization of the transmitter. The waveguide-microstrip conversion circuit and the filter component not only further ensure the stability of the circuit operation, but also reduce the installation difficulty and greatly reduce the product cost.

[0033] As a further improvement of the present invention, the housing includes a lower housing and a U-shaped sealing cover plate. The heat dissipation module includes heat dissipation fins. The longitudinal section of the heat dissipation fins is parallel to the fan fixing plate. The U-shaped sealing cover plate is integrally processed from a rigid material. The side walls of the lower housing all adopt a structure imitating a plate-fin radiator, and the U-shaped sealing cover plate is hermetically connected to the lower housing.

[0034] The present invention adopts a multi-heat-source three-dimensional distributed layout structure to reduce the heat dissipation pressure. By means of the control and protection circuit, the fault weakening ability of the transmitter is improved, the applicability and reliability of the transmitter are also improved, and the task risk of the system is reduced.

[0035] The present invention has a perfect structural design and heat dissipation design, and an integrated design of frequency conversion, power amplification, filtering, control and protection, and power supply. The space is reasonably laid out, the structure is compact, and the overall indicators are excellent. Description of the Drawings

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the prior art and the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0037] Figure 1 is the principle block diagram of an X-band solid-state transmitter circuit provided by the present invention;

[0038] Figure 2 is the schematic diagram of the upconverter of an X-band solid-state transmitter circuit provided by the present invention;

[0039] Figure 3 is the schematic diagram of the downconverter of an X-band solid-state transmitter circuit provided by the present invention;

[0040] Figure 4It is the schematic diagram of the X-band solid-state power amplifier circuit of an X-band solid-state transmitter circuit provided by the present invention;

[0041] Figure 5 It is the structural schematic diagram of a five-way power divider / five-way power combiner of an X-band solid-state transmitter circuit provided by the present invention;

[0042] Figure 6 It is the power simulation diagram of a five-way power divider / five-way power combiner of an X-band solid-state transmitter circuit provided by the present invention;

[0043] Figure 7 It is the gain and power distribution diagram of an X-band solid-state transmitter circuit provided by the present invention;

[0044] Figure 8 It is the schematic diagram of a method for generating high-power RF signals in the X-band provided by the present invention;

[0045] Figure 9 It is the external front view of an X-band solid-state transmitter provided by the present invention;

[0046] Figure 10 It is the external rear view of an X-band solid-state transmitter provided by the present invention;

[0047] Figure 11 It is the internal left view of an X-band solid-state transmitter provided by the present invention;

[0048] Figure 12 It is the internal right view of an X-band solid-state transmitter provided by the present invention.

[0049] Explanation of reference numerals: 1 - U-shaped sealing cover plate, 2 - axial fan, 3 - fan fixing plate, 4 - axial fan, 5 - airtight device, 6 - power supply port, 7 - communication port, 8 - intermediate frequency input port, 9 - intermediate frequency output port, 10 - reference signal input port, 11 - RF coupling output port, 12 - small signal coupling output port, 13 - air outlet, 14 - transmitter output port, 15 - filter assembly, 16 - coupling ring assembly, 17 - waveguide-microstrip conversion circuit, 18 - X-band solid-state power amplifier circuit, 19 - power supply, 20 - control and protection circuit, 21 - frequency conversion assembly, 201 - local oscillator generation unit, 202 - intermediate frequency mixing unit, 203 - second local oscillator mixing unit, 204 - RF mixing unit. Detailed implementation manners

[0050] The core of the present invention is to provide an X-band solid-state transmitting circuit, a method for generating high-power RF signals and a transmitter device, which generate high-power RF signals in the X-band with excellent performance.

[0051] As Figure 1 shownFigure 1 The principle block diagram of an X-band solid-state transmitting circuit provided by the present invention. The circuit includes an upconverter, a coupled loop assembly, a filter assembly, a power supply, and also includes an X-band solid-state power amplifier circuit and a waveguide-microstrip conversion circuit;

[0052] The upconverter is used to convert the externally input intermediate-frequency input signal to generate an X-band radio-frequency signal;

[0053] The input end of the X-band solid-state power amplifier circuit is connected to the output end of the upconverter, and is used for power amplification of the radio-frequency signal;

[0054] The input end of the waveguide-microstrip conversion circuit is connected to the output end of the X-band solid-state power amplifier circuit, and is used for transforming the signal transmission mode from a microstrip line to a waveguide transmission medium;

[0055] The input end of the coupled loop assembly is connected to the output end of the waveguide-microstrip conversion circuit, and is used for unidirectional transmission and radio-frequency coupling of the radio-frequency signal;

[0056] The input end of the filter assembly is connected to the output end of the coupled loop assembly. The filter assembly includes a receive-blocking filter and a harmonic filter;

[0057] The output end of the filter assembly is used to connect to an antenna to transmit the processed radio-frequency signal;

[0058] The power supply is respectively connected to the upconverter and the X-band solid-state power amplifier circuit, and is used to provide power.

[0059] In order to obtain RF signals in the X band, it is necessary to complete the frequency conversion of the intermediate-frequency input signal to the X band through an X-band upconverter and output the required RF signals. After the frequency conversion by upconversion, the RF signals are used as drive signals and sent to the X-band solid-state power amplifier circuit to amplify the RF signals to the required power level while ensuring the frequency response characteristics within the frequency band. High-power RF signals require high-power transmission media for transmission. The transmission power capacity of ordinary microstrip lines is relatively small and needs to be further increased to ensure the transmission quality of high-power RF signals. In order to further improve the performance of high-power RF signals, on the one hand, it is necessary to enable the forward high-power RF signals to pass smoothly, and on the other hand, it is necessary to limit the reverse transmission of the reflected signals caused by the link mismatch between the antenna and the circulator. Therefore, the high-power RF signals are passed through a coupled circulator assembly, which specifically includes a coupler and a circulator. The coupler can achieve accurate sampling of the forward output power. The high-power RF signals are further sent to a filter assembly, which mainly includes a receive rejection filter and a harmonic filter. The receive rejection filter can suppress the noise level within the receive band of the transmitter and reduce the interference to the received signals. The harmonic filter can attenuate and suppress the second harmonic, reduce the noise level within the second harmonic frequency band of the operating frequency of the transmitter, and filter out the second and higher harmonics parasitically output by the X-band solid-state high-power amplifier circuit to avoid signal interference to communication satellites and the receiving devices of other harmonic high-frequency band systems. Finally, high-power RF signals are output to the antenna.

[0060] In this embodiment, a downconverter and a control and protection circuit are further included. The downconverter is connected to the upconverter and is used to receive RF signals for downconversion to generate intermediate-frequency signals. The control and protection circuit is electrically connected to the upconverter, the downconverter, the X-band solid-state power amplifier circuit, and the coupled circulator assembly respectively and is used to perform control and protection processing to achieve monitoring and command control.

[0061] After being upconverted to RF signals, the coupled RF signals are sent to the downconverter through a coupling branch. The downconverter completes the downconversion of the uplink signals to the intermediate frequency for remote control command verification to check the correctness of the remote control command transmission channel. The RF signals are sent to the control and protection circuit through another coupling branch to monitor the signal status in real time and perform protection when necessary. At the same time, the reflected signals can also be accurately extracted at the load end of the circulator and sent to the control and protection circuit to monitor the device status in real time and perform protection when necessary.

[0062] In this embodiment, the upconverter includes a digital controlled attenuator ATT, a local oscillator generation unit 201, an intermediate frequency mixing unit 202, a second local oscillator mixing unit 203, a radio frequency mixing unit 204, and a coupling and sampling unit. The intermediate frequency input signal of the upconverter is input through the first coupling and sampling unit. The output end of the first coupling and sampling unit is connected to the digital controlled attenuator ATT. The digital controlled attenuator ATT is connected to the first input end of the intermediate frequency mixing unit 202. The intermediate frequency local oscillator output end of the local oscillator generation unit 201 is connected to the second input end of the intermediate frequency mixing unit 202. The output end of the intermediate frequency mixing unit 202 is connected to the first input end of the second local oscillator mixing unit 203. The second local oscillator output end of the local oscillator generation unit 201 is connected to the second input end of the second local oscillator mixing unit 203. The output end of the second local oscillator mixing unit 203 is connected to the first input end of the radio frequency mixing unit 204. The radio frequency local oscillator output end of the local oscillator generation unit 201 is connected to the second input end of the radio frequency mixing unit 204. The output end of the radio frequency mixing unit 204 is connected to the input end of the second coupling and sampling unit. The output end of the second coupling and sampling unit outputs a radio frequency signal. The coupling output ends of the first coupling and sampling unit and the second coupling and sampling unit are both connected to the control and protection circuit.

[0063] As Figure 2 shown, the coupling and sampling unit includes a first coupling and sampling unit and a second coupling and sampling unit. The first coupling and sampling unit includes a first coupler C1. The second coupling and sampling unit includes an eighth coupler C8. The local oscillator generation unit 201 includes: a power divider P1, and second coupler C2, third coupler C3, fourth coupler C4, fifth coupler C5, sixth coupler C6, and seventh coupler C7. The 10 MHz reference signal is input from the input end of the power divider P1 and is divided by the power divider P1 into an intermediate frequency local oscillator signal, a second local oscillator signal, and a radio frequency local oscillator signal. The intermediate frequency local oscillator signal is output from the output end of the second coupler C2. The coupling end of the second coupler C2 is connected to the input end of the third coupler C3. The second local oscillator signal is output from the output end of the fourth coupler C4. The coupling end of the fourth coupler C4 is connected to the input end of the fifth coupler C5. The radio frequency local oscillator signal is output through the sixth coupler C6. The coupling end of the sixth coupler C6 is connected to the input end of the seventh coupler C7. The coupling ends of the third coupler C3, fifth coupler C5, and seventh coupler C7 are all connected to the control and protection circuit. The intermediate frequency mixing unit 202 includes a first amplifier A1 and a first mixer UC1. The second local oscillator mixing unit 203 includes a first band-pass filter F1, a second amplifier A2, and a second mixer UC2. The radio frequency mixing unit 204 includes a first isolator G1, a second band-pass filter F2, a third mixer UC3, a second isolator G2, a third amplifier A3, and a third isolator G3.

[0064] The input end of the first coupler C1 is used to input an intermediate-frequency input signal. The coupled end of the first coupler C1 is connected to the control and protection circuit. The output end of the first coupler C1 is connected to the first input end of the first mixer UC1 through a digital controlled attenuator ATT and a first amplifier A1. The intermediate-frequency local oscillator signal output end of the power splitter P1 is connected to the input end of the second coupler C2. The coupled end of the second coupler C2 is connected to the input end of the third coupler C3. The output end of the second coupler C2 is connected to the second input end of the first mixer UC1. The output end of the third coupler C3 outputs an intermediate-frequency local oscillator sampling signal to the downconverter, and the coupled end of the third coupler C3 is connected to the control and protection circuit. The output end of the first mixer UC1 is connected to the first input end of the second mixer UC2 through a first bandpass filter F1 and a second amplifier A2. The second local oscillator signal output end of the power splitter P1 is connected to the input end of the fourth coupler C4. The coupled end of the fourth coupler C4 is connected to the input end of the fifth coupler C5. The output end of the fourth coupler C4 is connected to the second input end of the second mixer UC2. The output end of the fifth coupler C5 outputs a second local oscillator sampling signal to the downconverter, and the coupled end of the fifth coupler C5 is connected to the control and protection circuit. The output end of the second mixer UC2 is connected to the first input end of the third mixer UC3 through a first isolator G1 and a second bandpass filter F2. The radio-frequency local oscillator signal output end of the power splitter P1 is connected to the input end of the sixth coupler C6. The coupled end of the sixth coupler C6 is connected to the input end of the seventh coupler C7. The output end of the sixth coupler C6 is connected to the second input end of the third mixer UC3. The output end of the seventh coupler C7 outputs a radio-frequency local oscillator sampling signal to the downconverter, and the coupled end of the seventh coupler C7 is connected to the control and protection circuit. The output end of the third mixer UC3 is connected to the input end of the third isolator G3 through a second isolator G2 and a third amplifier A3. The output end of the third isolator G3 is connected to the eighth coupler C8. The coupled end of the eighth coupler C8 outputs a first radio-frequency coupled signal to the downconverter, and the output end of the eighth coupler C8 is used to output a radio-frequency signal in the X band.

[0065] As Figure 3 shown, the downconverter includes a radio-frequency mixer UC4. The first input end of the radio-frequency mixer UC4 is used to input a radio-frequency signal. The second input end is connected to the radio-frequency local oscillator output end of the local oscillator generating unit. The output end of the radio-frequency mixer UC4 is connected to the first input end of the second local oscillator mixer UC5. The second input end of the second local oscillator mixer UC5 is connected to the second local oscillator output end of the local oscillator generating unit. The output end of the second local oscillator mixer UC5 is connected to the first input end of the intermediate-frequency mixer UC6. The second input end of the intermediate-frequency mixer UC6 is connected to the intermediate-frequency local oscillator output end of the local oscillator generating unit. The output end of the intermediate-frequency mixer UC6 is connected to the AGC amplifier, and the output signal of the AGC amplifier is coupled and output through the third coupling sampling unit C13.

[0066] Specifically, the downconverter further includes a ninth coupler C9. The first radio frequency coupling signal is input through the input end of the ninth coupler C9. The output end of the ninth coupler C9 is connected to the first input end of the radio frequency mixer UC4. The coupling end of the ninth coupler C9 is connected to the control and protection circuit. The radio frequency local oscillator sampling signal is input through the input end of the tenth coupler C10. The output end of the tenth coupler C10 is connected to the second input end of the radio frequency mixer UC4. The coupling end of the tenth coupler C10 is connected to the control and protection circuit. The output end of the radio frequency mixer UC4 is connected to the first input end of the second local oscillator mixer UC5. The second local oscillator sampling signal is input through the input end of the eleventh coupler C11. The output end of the eleventh coupler C11 is connected to the second input end of the second local oscillator mixer UC5. The coupling end of the eleventh coupler C11 is connected to the control and protection circuit. The output end of the second local oscillator mixer UC5 is connected to the first input end of the intermediate frequency mixer UC6. The intermediate frequency local oscillator sampling signal is input through the input end of the twelfth coupler C12. The output end of the twelfth coupler C12 is connected to the second input end of the intermediate frequency mixer UC6. The coupling end of the twelfth coupler C12 is connected to the control and protection circuit. The output end of the intermediate frequency mixer UC6 is connected to the input end of the AGC amplifier. The output end of the AGC amplifier is connected to the input end of the thirteenth coupler C13. The coupling end of the thirteenth coupler C13 is connected to the control and protection circuit. The output end of the thirteenth coupler C13 is used to output the intermediate frequency output signal. The intermediate frequency output signal is used for remote control command verification to check the correctness of the remote control command transmission channel. The radio frequency local oscillator sampling signal, the second local oscillator sampling signal, and the intermediate frequency local oscillator sampling signal share the same local oscillator source with the upconverter. After three times of downconversion to a 70 MHz intermediate frequency signal, the 70 MHz signal is sent to the baseband device for demodulation of the uplink remote control data.

[0067] As Figure 4 shown, the X-band solid-state power amplifier circuit includes a medium-power drive amplifier, a bias circuit, and a temperature and current detection circuit. The input end of the medium-power drive amplifier is used to input the radio frequency signal. The output end of the medium-power drive amplifier is connected to the input end of the five-way power divider. Each output end of the five-way power divider is connected to the final power amplifier chip. The output end of the final power amplifier chip is connected to the five-way power combiner. The temperature and current detection circuit is respectively connected to the five-way power divider, the final power amplifier chip, and the five-way power combiner. The bias circuit is respectively connected to the medium-power drive amplifier and the final power amplifier chip. The final power amplifier chip is a gallium arsenide power amplifier chip. Both the five-way power divider and the five-way power combiner have a five-way waveguide bridge structure. The medium-power drive amplifier includes a single power amplifier chip and a power supply circuit.

[0068] For the frequency band of 7.145 - 7.25 GHz, in order to obtain better linearity indicators, a gallium arsenide power amplifier chip is used as the final - stage power amplifier chip. To reduce the synthesis network and the heat dissipation pressure, a single - chip power amplifier chip with a relatively high output power is selected. At present, the continuous - wave working output power of gallium arsenide in this frequency band can reach up to 60 W. Using this MMIC can minimize the design, assembly, and debugging difficulties and reduce the overall volume of the amplifier. A gallium arsenide final - stage power amplifier chip with a large single - chip output power is used to shrink the synthesis network, reduce the difficulty of design and debugging, and reduce the overall volume of the amplifier. A five - way power combining circuit structure with high isolation is adopted to withstand a large power, expand the flexibility of the power combining circuit, facilitate the control and optimization of the overall volume and power consumption of the machine, can also greatly reduce the cost, and the overall design is relatively simple. Its structure is as Figure 5 shown, and the simulation results are as Figure 6 shown. It can be seen from the simulation results that the amplitude consistency of each branch is good, the maximum branch insertion loss is 7.2 dB (7 dB in the ideal case), and it has a relatively high combining efficiency.

[0069] In this embodiment, the waveguide - microstrip conversion circuit includes an overall tapered transition circuit structure that sequentially transitions from microstrip, coplanar waveguide, non - standard waveguide, transition waveguide, stub matching to standard waveguide.

[0070] High - power transmission is achieved through the transformation from microstrip, coplanar waveguide, non - standard waveguide, transition waveguide, stub matching to standard waveguide. The non - standard waveguide is used to minimize the distance between the microstrip line probe and the waveguide cavity, reduce the self - heat dissipation pressure of the microstrip board at the probe, improve the power handling capacity, and the stub matching and transition waveguide are used to ensure good signal transmission, thus achieving high - power transmission and solving the problems of signal transmission discontinuity and small power capacity introduced by the welding of traditional microstrip - waveguide conversion.

[0071] In this embodiment, the externally input intermediate - frequency input signal is 70 MHz, the uplink signal level is - 15 dBm, the output power of the X - band solid - state transmitter circuit is greater than 200 W (53 dBm, at the chassis output port), the uplink gain is greater than 65 dB, and the specific distribution of the uplink gain and power of each part is expected to be as Figure 7As shown, the upconverter has a gain of 20 dB and a maximum output level of 10 dBm. After passing through the upconverter, the output signal is 5 dBm. The X-band solid-state power amplifier circuit is connected to the upconverter through a 1601 coaxial cable. The cable loss is 0.5 dB. The signal sent to the solid-state amplifier through the cable is 4.5 dBm, and the gain at this time is 19.5 dB. The solid-state power amplifier has a gain of 52 dB, and the maximum output power can reach 54.5 dBm. After passing through the solid-state power amplifier circuit, the output power is 54.5 dBm, and the gain is 71.5 dB. The waveguide-microstrip conversion circuit can be realized through various structural transformations such as microstrip-coplanar waveguide-non-standard waveguide-transition waveguide-stub matching-standard waveguide, and can achieve high-power transmission with a loss of 0.2 dB. After waveguide-microstrip conversion, the output power and gain are 54.3 dBm and 71.3 dB respectively. The circulator is a three-port network device that can achieve unidirectional signal transmission. In addition, the reflected signal at the antenna end can be accurately extracted at the load end of the circulator. The loss of the coupled circulator assembly is 0.2 dB. After passing through the coupled circulator assembly, the output power and gain are 54.1 dBm and 71.1 dB respectively. The filter assembly includes a receive-blocking filter and a harmonic filter, with a loss of 0.4 dB. After passing through the filter assembly, the output power and gain are 53.7 dBm and 70.7 dB respectively. The final output power and gain are 53.7 dBm and 70.7 dB respectively.

[0072] As Figure 8 shown, Figure 8 A method for generating an X-band high-power radio frequency signal provided by the present invention includes,

[0073] S1: Obtain an externally input intermediate-frequency input signal and a reference signal. The reference signal is power-divided by an upconverter to obtain multiple local oscillator signals. Based on the multiple local oscillator signals, the intermediate-frequency input signal is subjected to multi-stage frequency conversion to obtain a first radio frequency signal in the X band;

[0074] S2: Amplify the power of the first radio frequency signal through an X-band solid-state power amplifier circuit to obtain a first high-power radio frequency signal;

[0075] S3: Through a waveguide-microstrip conversion circuit, perform a transformation on the signal transmission mode of the first high-power radio frequency signal from a microstrip line to a waveguide transmission medium to obtain a second high-power radio frequency signal. The waveguide-microstrip conversion includes successive transformations from microstrip, coplanar waveguide, non-standard waveguide, transition waveguide, stub matching to standard waveguide;

[0076] S4: Unidirectionally transmit and RF-couple the second highest power RF signal through a coupled loop component to obtain a third highest power RF signal. The coupled loop component includes: forwardly transmit the second highest power RF signal with high power through a circulator and limit the reverse transmission of the reflected signal through a loop to obtain a third highest power RF signal, couple and output the third highest power RF signal through a coupler, sample the forward output power of the third highest power RF signal to obtain a third RF coupled signal, extract the reflected signal from the load end of the circulator to obtain a first RF reflected signal;

[0077] S5: Suppress the in-band noise and filter the harmonics of the third highest power RF signal through a filter component to obtain and output a fourth highest power RF signal. The filter component includes: filter and suppress the in-band noise level of the received signal through a receive blocking filter, and suppress the second harmonic attenuation through a harmonic filter.

[0078] In this embodiment, it further includes: S6: Perform first coupling and second coupling on the first RF signal to obtain a first RF coupled signal and a second RF coupled signal, collect the temperature and current of the X-band solid-state power amplifier circuit through a temperature and current detection circuit to obtain a temperature acquisition signal and a current acquisition signal, down-convert the first RF coupled signal through a down-converter to obtain an intermediate frequency output signal, and perform control and protection processing through a control and protection circuit based on the second RF coupled signal, the intermediate frequency output signal, the first RF reflected signal, the temperature acquisition signal and the current acquisition signal to achieve monitoring and command control.

[0079] For the introduction of a method for generating an X-band high-power RF signal provided by the present invention, please refer to the above circuit embodiment, and the present invention will not be elaborated here.

[0080] The present invention also provides an X-band solid-state transmitter, as Figures 9 - 12As shown in the figure, it includes a housing. A heat dissipation device is installed on the bottom plate of the housing. At the top of the heat dissipation device, there are an X-band solid-state power amplifier circuit 18, a waveguide-microstrip conversion circuit 17, a coupling ring assembly 16, and a filter assembly 15 that are electrically connected in sequence. A power supply 19 is installed on one side wall of the heat dissipation device, and a control and protection circuit 20 and a frequency conversion component 21 are arranged on another opposite side wall. The power supply is respectively connected to the frequency conversion component 21 and the X-band solid-state power amplifier circuit 18. The frequency conversion component 21 is electrically connected to the X-band solid-state power amplifier circuit 18. The control and protection circuit is respectively electrically connected to the frequency conversion component, the X-band solid-state power amplifier circuit, and the coupling ring assembly. On one side wall of the housing adjacent to the power supply 19, there is a fan fixing plate 3. An axial fan 2 is arranged on the fan fixing plate 3. On the side wall of the housing corresponding to the axial fan 2, there are an air outlet 13 and a transmitter output port 14. The position of the air outlet 13 corresponds to the position of the axial fan 2. An airtight device 5, a power supply port 6, a communication port 7, an intermediate frequency input port 8, an intermediate frequency output port 9, a reference signal input port 10, and a radio frequency coupling output port 11 are also arranged on the outer wall where the fan fixing plate 3 is located. The frequency conversion component 21 includes an upconverter and a downconverter. The upconverter is respectively electrically connected to the intermediate frequency input port 8 and the reference signal input port 10. The control and protection circuit is electrically connected to the communication port 7. The downconverter is electrically connected to the intermediate frequency output port 9. The coupling ring assembly 16 is electrically connected to the radio frequency coupling output port 11. The filter assembly 15 is connected to the transmitter output port 14. The transmitter output port 14 is fixedly arranged on one side wall of the housing.

[0081] In this embodiment, as Figure 9As shown, the airtight device 5 is a one-way valve, which can prevent rainwater from entering the transmitter while ensuring the internal air pressure balance of the transmitter. The power supply port 6 is a three-core aviation plug, which sends external power supply to the internal power supply 19 of the transmitter to provide 220V power supply for the transmitter. The communication port 7 is a seven-core aviation plug, which is connected to the internal control and protection circuit 20 of the transmitter, reports the working status of the transmitter to the external server in real time, and at the same time sends the server instructions to the transmitter to ensure real-time two-way communication between the transmitter and the server. The intermediate frequency input port 8 provides a 70MHz intermediate frequency signal with modulated and loaded information for the internal frequency conversion component 21 of the transmitter to perform frequency conversion and signal amplification. The intermediate frequency output port 9 sends out the 70MHz signal after frequency conversion by the internal down-converter in the internal frequency conversion component 21 to the outside for calibration to ensure accurate frequency. The reference signal input port 10 provides an external reference 10Mhz reference signal for the internal frequency conversion component 21 of the transmitter. The radio frequency coupling output port 11 outputs the third radio frequency coupling signal output by the coupling ring component 16 to the outside for real-time frequency and signal strength monitoring. A small signal coupling output port 12 connected to the output port of the up-converter is also provided. Another coupling branch is provided on the output side of the up-converter for coupling and outputting the fourth radio frequency coupling signal. The small signal coupling output port 12 is connected to an external detection device to output the fourth radio frequency coupling signal output by the internal up-converter 21 of the transmitter to the outside of the transmitter for real-time frequency and signal strength monitoring. As Figure 9 and Figure 10 shown, in order to provide sufficient air volume, two axial fans 2 and 4 are arranged on the fan fixing plate 3 in this embodiment, and the air flows through the air outlet 13 to provide forced air cooling for the transmitter. As Figure 11 and Figure 12 shown, the filter component 15, the circulator 16, the waveguide-microstrip conversion circuit 17, the X-band solid-state power amplifier circuit 18, the power supply 19, the control and protection circuit 20, and the frequency conversion component 21 are distributed on three surfaces inside the transmitter.

[0082] In the frequency conversion component of this embodiment, the up-converter and the down-converter adopt an integrated design. Through reasonable frequency conversion times and local oscillator circuit design, on the one hand, the overall volume of the transmitter is reduced, and on the other hand, the up-conversion and down-conversion can share the local oscillator signal, reducing the equipment cost.

[0083] In addition, the receive blocking filter and the harmonic filter adopt an integrated design to reduce the volume and ensure the overall performance. The overall design and processing of the two can not only avoid the deterioration of indicators introduced by separate design and then assembly, and the poor signal transmission introduced by the mismatch after the filters are connected in series, but also reduce the overall volume, facilitating the miniaturization of the transmitter. The waveguide-microstrip conversion circuit and the filter component not only further ensure the stability of the circuit operation, but also reduce the installation difficulty and greatly reduce the product cost.

[0084] Meanwhile, a multi-heat-source three-position distributed layout structure is adopted. The X-band solid-state power amplifier circuit with the largest internal heat generation is placed at the top with the largest heat dissipation area to reduce the heat dissipation pressure. The frequency conversion module, power supply, and X-band solid-state power amplifier circuit are placed on different heat dissipation end faces to solve the heat dissipation problem inside the box. A finned heat dissipation structure is adopted. By reasonably setting the fin pitch, the influence on convective heat transfer and dust blockage is avoided to increase the vertical heat dissipation area. At the same time, when the X-band solid-state power amplifier circuit 18 is installed, it is directly fixed at the top of the heat dissipation fins. The flatness and roughness of the fixing surface are ensured through the process. When assembling, thermal grease is applied between the X-band solid-state power amplifier circuit 18 and the heat dissipation fins to minimize the thermal resistance. Similarly, the power supply module is directly fixed on the longitudinal section of the side end of the heat dissipation fins. In this way, the heat dissipation plate conducts the heat generated by the components to the external space to the maximum extent and radiates it to the space through the heat dissipation fins. Finally, to enhance the heat dissipation effect, an axial fan with three-proof functions is set up to centrally blow air forcibly at the high-heat part of the heat dissipation teeth at the bottom of the X-band solid-state power amplifier circuit 18, so that the heat of the power amplifier module is quickly taken away.

[0085] In this embodiment, the housing includes a lower housing and a U-shaped sealing cover plate 1. The heat dissipation module includes heat dissipation fins. The longitudinal section of the fins of the heat dissipation fins is parallel to the fan fixing plate 3. The U-shaped sealing cover plate 1 is integrally processed from a rigid material. The side walls of the lower housing all adopt a structure imitating a plate-fin radiator and are buckled on the upper part of the transmitter main structure, as Figure 9 shown. The U-shaped sealing cover plate 1 is hermetically connected to the lower housing. The hermetic connection includes opening grooves around the joint surface between the U-shaped sealing cover plate 1 and the lower housing, and using fillers to be embedded and filled in the grooves. The fillers include conductive silicone rubber and conductive sealing rings. Screws are provided on the U-shaped sealing cover plate 1 to fix the connection with the lower housing. At the same time, due to the extrusion effect, the fillers are deformed to achieve the sealing effect.

[0086] By setting the U-shaped sealing cover plate 1, its function is to form a space-sealed air outlet with the heat dissipation teeth, block the air flow short circuit, form a certain cold air pressure and flow rate inside the air outlet, accelerate the heat exchange of the air inside the air outlet, and thus take away the heat to achieve the purpose of heat dissipation.

[0087] In this embodiment, the bottom plate is made of aluminum material with high heat dissipation efficiency, and the four side walls of the box body are preferably made of rust-proof aluminum alloy material with a thickness of 6 mm and good corrosion resistance. To dissipate as much heat as possible into the air, it is necessary to increase the heat dissipation area. Therefore, all four side walls are processed into the shape of plate fin radiators. The bottom plate and the four side plates are welded by argon arc welding. After welding, the box body is heat-treated to eliminate the stress generated by welding and improve the corrosion resistance. Grooves are opened around the joint surface of the U-shaped sealing upper cover and the lower shell. Conductive silicone rubber and conductive sealing rings are used as fillers and embedded in the grooves. Through the screws on the cover plate, the fillers are mechanically pressed to deform to achieve the sealing effect. This sealing structure can maintain a good sealing effect under normal pressure or high altitude and low air pressure. It can maximize the isolation of the influence of the external harsh environment on the equipment and improve the adaptability of the equipment. The final size of the X-band outdoor solid-state transmitter is 300 mm (length) × 215 mm (width) × 115 mm (height).

[0088] For other introductions to a kind of X-band solid-state transmitter provided by the present invention, please refer to the above circuit embodiment, and the present invention will not be elaborated here again.

[0089] The above are only the preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. An X-band solid-state transmitter circuit, comprising an upconverter, a coupled ring component, a filter component, and a power supply, characterized in that: It also includes an X-band solid-state power amplifier circuit and a waveguide-microstrip conversion circuit. The upconverter is used to convert the externally input intermediate-frequency input signal to generate an X-band radio frequency signal. The input end of the X-band solid-state power amplifier circuit is connected to the output end of the upconverter and is used for power amplification of the radio frequency signal. The input end of the waveguide-microstrip conversion circuit is connected to the output end of the X-band solid-state power amplifier circuit and is used for transforming the signal transmission mode from a microstrip line to a waveguide transmission medium. The waveguide-microstrip conversion circuit includes an overall gradual transition circuit structure that sequentially goes from a microstrip, a coplanar waveguide, a non-standard waveguide, a transition waveguide, stub matching to a standard waveguide. The input end of the coupled ring assembly is connected to the output end of the waveguide-microstrip conversion circuit and is used for unidirectional transmission and radio frequency coupling of the radio frequency signal. The input end of the filter assembly is connected to the output end of the coupled ring assembly. The filter assembly includes a receive rejection filter and a harmonic filter. The output end of the filter assembly is used to connect to an antenna to transmit the processed radio frequency signal. The power supply is respectively connected to the upconverter and the X-band solid-state power amplifier circuit and is used to provide power.

2. The X-band solid-state transmitter circuit according to claim 1, characterized in that It also includes a downconverter and a control and protection circuit. The downconverter is connected to the upconverter and is used to receive the radio frequency signal generated by the upconverter for downconversion to generate an intermediate-frequency signal. The control and protection circuit is respectively electrically connected to the upconverter, the downconverter, the X-band solid-state power amplifier circuit, and the coupled ring assembly and is used for control and protection processing to achieve monitoring and command control.

3. The X-band solid-state transmitter circuit according to claim 2, characterized in that The upconverter includes a digital control attenuator, a local oscillator generation unit, an intermediate-frequency mixing unit, a second local oscillator mixing unit, a radio frequency mixing unit, and a coupling and sampling unit. The intermediate-frequency input signal of the upconverter is input through the first coupling and sampling unit. The output end of the first coupling and sampling unit is connected to the digital control attenuator. The digital control attenuator is connected to the first input end of the intermediate-frequency mixing unit. The intermediate-frequency local oscillator output end of the local oscillator generation unit is connected to the second input end of the intermediate-frequency mixing unit. The output end of the intermediate-frequency mixing unit is connected to the first input end of the second local oscillator mixing unit. The second local oscillator output end of the local oscillator generation unit is connected to the second input end of the second local oscillator mixing unit. The output end of the second local oscillator mixing unit is connected to the first input end of the radio frequency mixing unit. The radio frequency local oscillator output end of the local oscillator generation unit is connected to the second input end of the radio frequency mixing unit. The output end of the radio frequency mixing unit is connected to the input end of the second coupling and sampling unit. The output end of the second coupling and sampling unit outputs a radio frequency signal. The coupling output ends of the first coupling and sampling unit and the second coupling and sampling unit are both connected to the control and protection circuit.

4. The X-band solid-state transmitter circuit according to claim 3, characterized in that The down-converter includes a radio frequency mixer. The first input end of the radio frequency mixer is used to input the radio frequency signal generated by the up-converter. The second input end is connected to the radio frequency local oscillator output end of the local oscillator generating unit. The output end of the radio frequency mixer is connected to the first input end of the second local oscillator mixer. The second input end of the second local oscillator mixer is connected to the second local oscillator output end of the local oscillator generating unit. The output end of the second local oscillator mixer is connected to the first input end of the intermediate frequency mixer. The second input end of the intermediate frequency mixer is connected to the intermediate frequency local oscillator output end of the local oscillator generating unit. The output end of the intermediate frequency mixer is connected to an AGC amplifier. The output signal of the AGC amplifier is coupled and output through a third coupling and sampling unit.

5. The X-band solid-state transmitter circuit according to claim 1, characterized in that The X-band solid-state power amplifier circuit includes a medium-power driving amplifier, a bias circuit, and a temperature and current detection circuit. The input end of the medium-power driving amplifier is used to input the radio frequency signal. The output end of the medium-power driving amplifier is connected to the input end of a five-way power divider. Each output end of the five-way power divider is connected to a final power amplifier chip. The output end of the final power amplifier chip is connected to a five-way power combiner. The temperature and current detection circuit is respectively connected to the five-way power divider, the final power amplifier chip, and the five-way power combiner. The bias circuit is respectively connected to the medium-power driving amplifier and the final power amplifier chip. The final power amplifier chip is a gallium arsenide power amplifier chip. Both the five-way power divider and the five-way power combiner have a five-way waveguide bridge structure. The medium-power driving amplifier includes a single power amplifier chip and a power supply circuit.

6. An X-band high-power radio frequency signal generation method, characterized in that Including S1: Obtain an externally input intermediate frequency input signal and a reference signal. The reference signal is power-divided by an up-converter to obtain multiple local oscillator signals. Based on the multiple local oscillator signals, perform multi-stage frequency conversion on the intermediate frequency input signal to obtain a first radio frequency signal in the X band. S2: Power-amplify the first radio frequency signal through an X-band solid-state power amplifier circuit to obtain a first high-power radio frequency signal. S3: Perform a transformation on the signal transmission mode of the first high-power radio frequency signal from a microstrip line to a waveguide transmission medium through a waveguide-microstrip conversion circuit to obtain a second high-power radio frequency signal. The waveguide-microstrip conversion includes a transformation from a microstrip, a coplanar waveguide, a non-standard waveguide, a transition waveguide, a stub matching to a standard waveguide in sequence. S4: Perform unidirectional transmission and radio frequency coupling on the second high-power radio frequency signal through a coupling ring assembly to obtain a third high-power radio frequency signal. The coupling ring assembly includes: performing forward high-power transmission on the second high-power radio frequency signal through a circulator and restricting the reverse transmission of the reflected signal through a loop to obtain a third high-power radio frequency signal, coupling and outputting the third high-power radio frequency signal through a coupler, sampling the forward output power of the third high-power radio frequency signal to obtain a third radio frequency coupling signal, and extracting the reflected signal from the load end of the circulator to obtain a first radio frequency reflected signal. S5: The third highest-power RF signal is subjected to in-band noise suppression and harmonic filtering through a filter assembly to obtain and output a fourth highest-power RF signal. The filter assembly includes: filtering and suppressing the in-band noise level through a receive-blocking filter, and suppressing the second harmonic attenuation through a harmonic filter.

7. The X-band high-power radio frequency signal generation method according to claim 6, characterized in that It further includes: S6: The first RF signal is subjected to first coupling and second coupling to obtain a first RF coupled signal and a second RF coupled signal. The temperature and current of the X-band solid-state power amplifier circuit are collected through a temperature and current detection circuit to obtain a temperature acquisition signal and a current acquisition signal. The first RF coupled signal is down-converted through a down-converter to obtain an intermediate-frequency output signal. According to the second RF coupled signal, the intermediate-frequency output signal, the first RF reflection signal, the temperature acquisition signal, and the current acquisition signal, control and protection processing is performed through a control and protection circuit to achieve monitoring and command control.

8. An X-band solid-state transmitter, comprising the X-band solid-state transmitter circuit according to any one of claims 1-5, characterized in that It includes a housing. A heat dissipation device is installed on the bottom plate of the housing. At the top of the heat dissipation device, there are sequentially electrically connected an X-band solid-state power amplifier circuit (18), a waveguide-microstrip conversion circuit (17), a coupling ring assembly (16), and a filter assembly (15). A power supply (19) is installed on one side wall of the heat dissipation device, and a control and protection circuit (20) and a frequency conversion assembly (21) are provided on another opposite side wall. The power supply is respectively connected to the frequency conversion assembly (21) and the X-band solid-state power amplifier circuit (18). The frequency conversion assembly (21) is electrically connected to the X-band solid-state power amplifier circuit (18). The control and protection circuit (20) is respectively electrically connected to the frequency conversion assembly (21), the X-band solid-state power amplifier circuit (18), and the coupling ring assembly (16). On one side wall of the housing adjacent to the power supply (19), there is a fan fixing plate (3). An axial fan (2) is provided on the fan fixing plate (3). On the side wall of the housing corresponding to the axial fan, there is an air outlet (13). The position of the air outlet (13) corresponds to the position of the axial fan. An airtight device (5), a power supply port (6), a communication port (7), an intermediate-frequency input port (8), an intermediate-frequency output port (9), a reference signal input port (10), and a RF coupling output port (11) are further provided on the outer wall where the fan fixing plate (3) is located. The frequency conversion assembly (21) includes an up-converter and a down-converter. The up-converter is respectively electrically connected to the intermediate-frequency input port (8) and the reference signal input port (10). The control and protection circuit is electrically connected to the communication port (7). The down-converter is electrically connected to the intermediate-frequency output port (9). The coupling ring assembly (16) is electrically connected to the RF coupling output port (11). The filter assembly (15) is connected to the transmitter output port (14). The transmitter output port (14) is fixedly provided on one side wall of the housing.

9. The X-band solid-state transmitter according to claim 8, characterized in that The housing includes a lower housing and a U-shaped sealing cover plate (1). The heat dissipation module includes heat dissipation fins. The longitudinal section of the fins of the heat dissipation fins is parallel to the fan fixing plate (3). The U-shaped sealing cover plate (1) is integrally processed from a rigid material. The side walls of the lower housing all adopt a structure similar to a plate-fin radiator. The U-shaped sealing cover plate (1) is hermetically connected to the lower housing.

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