Capacitive touch screen structure and manufacturing method, capacitive touch screen, touch device

Abstract

This invention provides a capacitive touchscreen structure and its manufacturing method, a capacitive touchscreen, and a touch device. The capacitive touchscreen structure includes, but is not limited to, a first substrate layer, a first adhesive layer, a first conductive layer, a second adhesive layer, and a cover plate. The first substrate layer includes a first substrate body portion and a first substrate extension portion extending from the first substrate body portion. The first adhesive layer is disposed on the first substrate layer and includes a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion. The first conductive layer is disposed on the first adhesive layer and includes a first conductive body portion and a first conductive extension portion extending from the first conductive body portion. The second adhesive layer is disposed on the first conductive body portion, and the cover plate is disposed on the second adhesive layer. This invention effectively avoids the dependence of capacitive touchscreens on flexible printed circuit boards, improves the reliability of capacitive touchscreen products, and reduces the cost of capacitive touchscreen products.

Description

Technical Field

[0001] This invention relates to the field of touch screen technology, and more specifically, this invention can provide a capacitive touch screen structure and its manufacturing method, a capacitive touch screen, and a touch control device. Background Technology

[0002] Currently, conventional capacitive touchscreen edge channel traces typically need to be connected to an FPC (Flexible Printed Circuit) via a bonding process, and then connected to an IC (Integrated Circuit) control board via the FPC. For example... Figure 15 As shown, the capacitive touchscreen located on the left side can be connected to other circuits via the first flexible printed circuit board 10 and the second flexible printed circuit board 20, for example, to an IC control board. Connecting to the IC control board via FPC requires separate procurement of the FPC and an FPC bonding process, which significantly impacts the production yield of the capacitive touchscreen product and increases its cost. Summary of the Invention

[0003] To address the issues of high yield and cost associated with conventional capacitive touchscreens due to reliance on FPC, this invention provides a capacitive touchscreen structure and its manufacturing method, a capacitive touchscreen, and a touch device, thereby improving product yield and reducing costs by eliminating the need for FPC.

[0004] To achieve the above-mentioned technical objectives, the present invention provides a capacitive touchscreen structure, comprising: a first substrate layer, including a first substrate body portion and a first substrate extension portion extending from the first substrate body portion, the first substrate body portion and the first substrate extension portion being integrally formed; a first adhesive layer disposed on the first substrate layer; the first adhesive layer including a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion, the first adhesive layer body portion and the first adhesive layer extension portion being integrally formed; wherein, the first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion; a first conductive layer disposed on the first adhesive layer; the first conductive layer including a first conductive body portion and a first conductive extension portion extending from the first conductive body portion, the first conductive body portion and the first conductive extension portion being integrally formed; wherein, the first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion; a second adhesive layer disposed on the first conductive body portion; and a cover plate disposed on the second adhesive layer. Compared with conventional technology, the present invention provides an integrated capacitive touch screen structure. It replaces the traditional FPC structure with a first substrate extension, a first adhesive layer extension, and a first conductive extension to achieve connection with other circuits. It can be seen that the present invention effectively avoids the problems of the production yield of capacitive touch screens being greatly affected and the cost of capacitive touch screen products being increased due to reliance on FPCs. It improves the reliability of capacitive touch screen structure and reduces the cost of capacitive touch screen products.

[0005] In at least one embodiment of the present invention, the surface of the first adhesive layer has a plurality of first strip-shaped grooves; the first strip-shaped grooves extend from the body portion of the first adhesive layer to the extension portion of the first adhesive layer; a first conductive line is disposed within the first strip-shaped groove, and all the first conductive lines form a first conductive layer. The embodiments of the present invention, by forming the first conductive line within the first strip-shaped groove, thereby forming the first conductive layer, help protect the conductive layer, improve the reliability of the first conductive layer, and thus improve the reliability of the capacitive touchscreen connection structure.

[0006] In at least one embodiment of the present invention, the first conductive line is a first metal paste line, which fills the first strip-shaped groove. Based on the first metal paste line, embodiments of the present invention help to improve the bending resistance of the first conductive layer.

[0007] In at least one embodiment of the present invention, a first substrate extension, a first adhesive layer extension, and a first conductive extension are used to form a first bending structure, and a first protective layer is disposed on the first bending structure; the first protective layer and the first adhesive layer extension are respectively located on both sides of the first conductive extension. Based on the above-mentioned improved technical solution, the embodiments of the present invention can effectively protect the first conductive extension in the first bending structure using the first protective layer, effectively reducing the risk of the first conductive extension in the bending state cracking or even breaking, improving the reliability of the connection structure used for capacitive touch screens, and achieving the goal of further improving the structural reliability of capacitive touch screens.

[0008] In at least one embodiment of the capacitive touchscreen structure of the present invention, a first reinforcing layer is further included, which is disposed on the extension of the first substrate; the first reinforcing layer and the first adhesive layer are respectively located on both sides of the extension of the first substrate. Based on the reinforcing layer, the reliability of the connection structure of the present invention can be further improved.

[0009] In at least one embodiment of the present invention, the first conductive extension has a connection region, on which a first metal layer is disposed, and the first metal layer is connected to the first conductive extension. In this embodiment, the first metal layer facilitates the connection of the first conductive extension with other circuits, thereby improving the reliability of circuit connections.

[0010] In at least one embodiment of the present invention, the first adhesive layer is an ultraviolet-curable adhesive layer, and the second adhesive layer is an optical adhesive layer.

[0011] The capacitive touchscreen structure in at least one embodiment of the present invention further includes: a second substrate layer, comprising a second substrate body portion and a second substrate extension portion extending from the second substrate body portion, the second substrate body portion and the second substrate extension portion being integrally formed; a third adhesive layer disposed on the second substrate layer; the third adhesive layer comprising a third adhesive layer body portion and a third adhesive layer extension portion extending from the third adhesive layer body portion, the third adhesive layer body portion and the third adhesive layer extension portion being integrally formed; wherein the third adhesive layer body portion is disposed on the second substrate body portion, and the third adhesive layer extension portion is disposed on the second substrate extension portion; a second conductive layer disposed on the third adhesive layer; the second conductive layer comprising a second conductive body portion and a second conductive extension portion extending from the second conductive body portion, the second conductive body portion and the second conductive extension portion being integrally formed; wherein the second conductive body portion is disposed on the third adhesive layer body portion, and the second conductive extension portion is disposed on the third adhesive layer extension portion; a fourth adhesive layer disposed on the second conductive body portion; the fourth adhesive layer bonding the first substrate layer and the second conductive layer. Based on the improved technical solution described above, this embodiment can completely replace the FPC structure used in the capacitive touch screen, thereby completely avoiding the problem of conventional technology's dependence on FPC; for example, this embodiment of the invention can simultaneously form a sensing surface pattern layer and a driving surface pattern layer for the capacitive touch screen, thereby providing driving circuits and sensing circuits for the capacitive touch screen.

[0012] In at least one embodiment of the present invention, the second substrate layer has the same structure as the first substrate layer; the third adhesive layer has the same structure as the first adhesive layer; the second conductive layer has the same structure as the first conductive layer; and the fourth adhesive layer has the same structure as the second adhesive layer.

[0013] To achieve the above-mentioned technical objectives, the present invention can also provide a capacitive touch screen, which includes the capacitive touch screen structure in any embodiment of the present invention.

[0014] To achieve the above-mentioned technical objectives, the present invention also provides a touch device, which includes a capacitive touch screen or a capacitive touch screen structure in any embodiment of the present invention.

[0015] To achieve the above-mentioned technical objectives, the present invention also provides a method for manufacturing a capacitive touchscreen structure, comprising: forming a first substrate layer; the first substrate layer including a first substrate body portion and a first substrate extension portion extending from the first substrate body portion, the first substrate body portion and the first substrate extension portion being integrally formed; applying a first adhesive layer onto the first substrate layer; the first adhesive layer including a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion, the first adhesive layer body portion and the first adhesive layer extension portion being integrally formed; wherein, the first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion; forming a first conductive layer on the first adhesive layer; the first conductive layer including a first conductive body portion and a first conductive extension portion extending from the first conductive body portion, the first conductive body portion and the first conductive extension portion being integrally formed; wherein, the first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion; applying a second adhesive layer onto the first conductive body portion; and disposing a cover plate on the second adhesive layer. Compared to conventional solutions, the embodiments of the present invention replace FPC with a first substrate extension, a first adhesive layer extension, and a first conductive extension to achieve connection with other circuits. It can be seen that the present invention effectively avoids the problems of significantly affecting the production yield of capacitive touch screens and increasing the cost of capacitive touch screen products due to reliance on FPC, thereby improving the structural reliability of capacitive touch screens and reducing product costs.

[0016] In at least one embodiment of the present invention, forming a first conductive layer on a first adhesive layer may include: rolling the first adhesive layer with a toothed roller to form a plurality of first strip-shaped grooves on the first adhesive layer; the first strip-shaped grooves extending from the body portion of the first adhesive layer to the extension portion of the first adhesive layer; and forming first conductive lines within each of the first strip-shaped grooves to form the first conductive layer through all the conductive lines. Based on the above-described technical solution of forming the first strip-shaped grooves by rolling with a roller, the present invention can significantly improve the processing efficiency of capacitive touch screen structures and can form a first conductive layer with high reliability.

[0017] In at least one embodiment of the present invention, forming a first conductive line within each first strip-shaped groove includes: scraping metal paste into each first strip-shaped groove using a scraper, filling the first strip-shaped groove with metal paste; and solidifying the metal paste within the first strip-shaped groove, so that the first metal paste line formed within the first strip-shaped groove serves as the first conductive line. The embodiment of the present invention, by filling the grooves with metal paste, can protect the first conductive line, help increase the thickness of the first conductive line, and further improve the reliability of the circuit.

[0018] The manufacturing method of the capacitive touchscreen structure in at least one embodiment of the present invention further includes: coating a first protective layer onto a first conductive extension; wherein the first protective layer and the first adhesive layer extension are respectively located on both sides of the first conductive extension. The embodiments of the present invention can effectively protect the first conductive extension in the first bending structure using the first protective layer, effectively reducing the risk of cracking or even wire breakage of the first conductive extension in the bending state, improving the reliability of the connection structure used in the capacitive touchscreen, and achieving the goal of further improving the reliability of the capacitive touchscreen structure.

[0019] In at least one embodiment of the present invention, before setting the cover plate on the second adhesive layer, the method further includes: forming a second substrate layer, applying a third adhesive layer onto the second substrate layer, forming a first conductive layer on the third adhesive layer, applying a fourth adhesive layer onto the second conductive layer, and bonding the first substrate layer and the second conductive layer through the fourth adhesive layer; wherein the second substrate layer and the first substrate layer have the same structure, the third adhesive layer and the first adhesive layer have the same structure, the second conductive layer and the first conductive layer have the same structure, and the fourth adhesive layer and the second adhesive layer have the same structure. Based on the above-mentioned improved technical solution, this embodiment can completely replace the FPC structure used in capacitive touch screens, thereby completely avoiding the problems of conventional technology's dependence on FPCs; for example, this embodiment of the present invention can simultaneously form a sensing surface pattern layer and a driving surface pattern layer for a capacitive touch screen, thereby providing driving circuits and sensing circuits for the capacitive touch screen. Attached Figure Description

[0020] Figure 1 A schematic diagram of a side cross-section of a capacitive touchscreen according to one or more embodiments of the present invention is shown.

[0021] Figure 2 A schematic cross-sectional view of a plurality of first strip grooves disposed on the surface of a first adhesive layer is shown in one or more embodiments of the present invention.

[0022] Figure 3 A schematic diagram of the side cross section of the first bending structure in one or more embodiments of the present invention is shown.

[0023] Figure 4 A schematic diagram of a first adhesive layer coated on a first substrate layer is shown in one or more embodiments of the present invention.

[0024] Figure 5 A schematic diagram is shown illustrating the use of a toothed roller to roll a first adhesive layer in one or more embodiments of the present invention.

[0025] Figure 6 A schematic diagram of forming a plurality of first strip grooves on a first adhesive layer is shown in one or more embodiments of the present invention.

[0026] Figure 7 This diagram illustrates a process of scraping metal slurry into a first groove using a scraper in one or more embodiments of the present invention.

[0027] Figure 8 A schematic diagram is shown in one or more embodiments of the present invention, in which a first metal paste wire formed in a first strip groove serves as a first conductive wire.

[0028] Figure 9 A schematic cross-sectional view of a first protective layer applied to a first bending region is shown in one or more embodiments of the present invention.

[0029] Figure 10 A schematic diagram of a side cross-section structure in one or more embodiments of the present invention is shown, in which a first protective layer is applied to the first bending region separately.

[0030] Figure 11 This diagram illustrates the determination of the area to be cut off when forming an external connection structure for a touchscreen in one or more embodiments of the present invention.

[0031] Figure 12 A schematic diagram of the side cross-sectional structure of the first reinforcing layer and the first metal layer in one or more embodiments of the present invention is shown.

[0032] Figure 13 A schematic diagram of a side cross-section of another capacitive touchscreen according to one or more embodiments of the present invention is shown.

[0033] Figure 14 A schematic diagram of the overall structure of an integrated capacitive touchscreen according to one or more embodiments of the present invention is shown.

[0034] Figure 15 This diagram illustrates the circuit connections of a conventional capacitive touchscreen based on a flexible printed circuit board.

[0035] In the picture,

[0036] 100, First substrate layer; 200, First adhesive layer; 300, First conductive layer; 400, Second adhesive layer; 500, Cover plate; 600, First protective layer; 700, First reinforcing layer; 800, First metal layer;

[0037] 201. First groove; 202. Roller; 203. Scraper; 601. First bending structure; 602. Cut-off area;

[0038] 110, Second substrate layer; 210, Third adhesive layer; 310, Second conductive layer; 410, Fourth adhesive layer; 610, Second protective layer; 710, Second reinforcing layer; 810, Second metal layer;

[0039] 900, Electrode pattern layer; 901, Trace area;

[0040] 10. First flexible printed circuit board; 20. Second flexible printed circuit board. Detailed Implementation

[0041] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of the invention. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0042] The accompanying drawings illustrate various structural schematics according to embodiments of the present invention. These drawings are not to scale, and some details have been enlarged for clarity, and some details may be omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed. In the context of the embodiments of the present invention, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "on" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0043] Compared to the traditional approach of bonding FPC to the circuit and then connecting it to the IC control board, one or more embodiments of the present invention provide a capacitive touch screen structure, including but not limited to a first substrate layer, a first adhesive layer, a first conductive layer, a second adhesive layer, and a cover plate. A first substrate layer includes a first substrate body portion and a first substrate extension portion extending from the first substrate body portion, the first substrate body portion and the first substrate extension portion being integrally formed; a first adhesive layer is disposed on the first substrate layer; the first adhesive layer includes a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion, the first adhesive layer body portion and the first adhesive layer extension portion being integrally formed; wherein, the first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion; a first conductive layer is disposed on the first adhesive layer; the first conductive layer includes a first conductive body portion and a first conductive extension portion extending from the first conductive body portion, the first conductive body portion and the first conductive extension portion being integrally formed; wherein, the first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion; a second adhesive layer is disposed on the first conductive body portion; a cover plate is disposed on the second adhesive layer.

[0044] Compared to the traditional FPC solution, this invention provides an integrated capacitive touchscreen structure. The traditional flexible printed circuit board structure is replaced by a first substrate extension, a first adhesive layer extension, and a first conductive extension to achieve connection with other circuits (such as IC control boards). It can be seen that the solution of this invention can effectively avoid the problems of poor production yield and increased cost of capacitive touchscreen products caused by reliance on FPC, thereby improving the reliability of the capacitive touchscreen structure and reducing product cost.

[0045] like Figure 1 As shown, at least one embodiment of the present invention can provide a capacitive touch screen structure, which may include, but is not limited to, a first substrate layer 100, a first adhesive layer 200, a first conductive layer 300, a second adhesive layer 400, and a cover plate 500.

[0046] The first substrate layer 100 includes a first substrate body portion and a first substrate extension portion extending from the first substrate body portion, wherein the first substrate body portion and the first substrate extension portion are integrally formed; the first substrate layer 100 may be, for example, a PET (Polyethylene terephthalate) material layer. This invention improves the reliability of the connection between the capacitive touchscreen and the IC control board by leveraging the advantages of high stability and good insulation of the polyethylene terephthalate material layer.

[0047] A first adhesive layer 200 is disposed on a first substrate layer 100. The first adhesive layer 200 includes a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion, the first adhesive layer body portion and the first adhesive layer extension portion being integrally formed. The first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion. In this embodiment of the invention, the first adhesive layer 200 is an ultraviolet (UV) curable adhesive layer.

[0048] like Figure 2 As shown, and can be combined Figure 8 In at least one embodiment of the present invention, the surface of the first adhesive layer 200 has a plurality of first strip-shaped grooves 201, the first strip-shaped grooves 201 extending from the body portion of the first adhesive layer to the extension portion of the first adhesive layer; a first conductive line is disposed within the first strip-shaped groove 201, and all the first conductive lines form a first conductive layer 300; the first conductive line in at least one embodiment of the present invention can be, for example, a silver wire or a copper wire. This embodiment forms a first conductive layer by forming a first conductive line within the first strip-shaped groove. This structure helps to protect the conductive layer, thereby improving the reliability of the conductive layer and thus improving the reliability of the capacitive touchscreen connection structure.

[0049] The first conductive layer 300 is disposed on the first adhesive layer 200. The first conductive layer 300 includes a first conductive body portion and a first conductive extension portion extending from the first conductive body portion. The first conductive body portion and the first conductive extension portion are integrally formed. The first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion.

[0050] In an optional embodiment of the present invention, the first conductive line is a first metal paste line, which fills the first strip-shaped groove 201. Based on the first metal paste line, embodiments of the present invention help improve the bending resistance of the first conductive layer.

[0051] The second adhesive layer 400 is disposed on the first conductive body portion. In at least one embodiment of the present invention, the second adhesive layer 400 is an optically clear adhesive layer (OCA).

[0052] The cover plate 500 is placed on the second adhesive layer 400.

[0053] like Figure 3 As shown, at least one embodiment of the present invention provides an improved capacitive touchscreen structure. Specifically, the first substrate extension, the first adhesive layer extension, and the first conductive extension are used to form a first bending structure 601, for example... Figure 3The bent portion shown has a first protective layer 600 on the first bending structure 601. The first protective layer 600 and the first adhesive layer extension are located on both sides of the first conductive extension, wherein the first protective layer is a UV-curable adhesive layer. The first conductive extension within the range of the first bending structure 601 is easily affected by internal tension. In this embodiment, the first protective layer can block the first conductive extension with an outward bending tendency, that is, the first protective layer effectively protects the first conductive extension in the first bending structure, effectively reducing the risk of the first conductive extension in the bent state cracking or even breaking due to internal tension, thereby significantly improving the reliability of the connection structure used for capacitive touch screens, and thus achieving the goal of further improving the structural reliability of capacitive touch screens.

[0054] like Figure 1 and Figure 12 As shown, the capacitive touchscreen structure in an optional embodiment of the present invention further includes a first reinforcing layer 700, which is disposed on the first substrate extension. Specifically, the first reinforcing layer 700 and the first adhesive layer 200 are located on opposite sides of the first substrate extension. In this embodiment, the first reinforcing layer 700 is disposed at the end of the first substrate extension to help improve the reliability of the capacitive touchscreen connection structure. Optionally, the first reinforcing layer 700 can be set to the difference between the connector-compatible thickness and the thickness of the first substrate layer, thereby better adapting the total thickness of the connection structure to the connector, further improving the reliability and stability of the connection between the leads and the IC control board.

[0055] In an optional embodiment of the present invention, the first conductive extension has a connection region, on which a first metal layer 800 is disposed. The first metal layer 800 is connected to the first conductive extension to form a metal pad for connecting other circuits (e.g., an IC control board). In at least one embodiment of the present invention, the first metal layer facilitates the connection of the first conductive extension to other circuits, improving the reliability of circuit connections.

[0056] The capacitive touchscreen structure in one or more embodiments of the present invention may further include a second substrate layer 110, a third adhesive layer 210, a second conductive layer 310, and a fourth adhesive layer 410. The second substrate layer 110 includes a second substrate body portion and a second substrate extension portion extending from the second substrate body portion. The second substrate body portion and the second substrate extension portion are integrally formed. The second substrate layer 110 is, for example, a PET (Polyethylene terephthalate) material layer. The third adhesive layer 210 is disposed on the second substrate layer 110. The third adhesive layer 210 includes a third adhesive layer body portion and a third adhesive layer extension portion extending from the third adhesive layer body portion. The third adhesive layer body portion and the third adhesive layer extension portion are integrally formed. The third adhesive layer body portion is disposed on the second substrate body portion, and the third adhesive layer extension portion is disposed on the second substrate extension portion. A second conductive layer 310 is disposed on a third adhesive layer 210. The second conductive layer 310 includes a second conductive body portion and a second conductive extension portion extending from the second conductive body portion, the second conductive body portion and the second conductive extension portion being integrally formed. The second conductive body portion is disposed on the third adhesive layer body portion, and the second conductive extension portion is disposed on the third adhesive layer extension portion. A fourth adhesive layer 410 is disposed on the second conductive body portion. The fourth adhesive layer 410 bonds the first substrate layer 100 and the second conductive layer 310.

[0057] like Figure 13 As shown, in an optional embodiment of the present invention, the second substrate layer 110 has the same structure as the first substrate layer 100, and the third adhesive layer 210 has the same structure as the first adhesive layer 200. The third adhesive layer 210 has a plurality of second strip-shaped grooves on its surface, which extend from the body portion of the third adhesive layer to the extension portion of the third adhesive layer. The second conductive layer 310 has the same structure as the first conductive layer 300. Second conductive lines are disposed in the second strip-shaped grooves, and all the second conductive lines form the second conductive layer 310. The second conductive lines are second metal paste lines, which fill the second strip-shaped grooves. The fourth adhesive layer 410 has the same structure as the second adhesive layer 400. The second substrate extension portion, the second adhesive layer 400 extension portion, and the second conductive extension portion are used to form a second bent structure, and a second protective layer 610 is disposed on the second bent structure; the second protective layer 610 and the second adhesive layer 400 extension portion are respectively located on both sides of the second conductive extension portion. A second reinforcing layer 710 is disposed on the second substrate extension; the second reinforcing layer 710 and the second adhesive layer 400 are respectively located on both sides of the second substrate extension. The second conductive extension has a connection area, on which a second metal layer 810 is disposed, and the second metal layer 810 is connected to the second conductive extension. The third is a UV-curable adhesive layer, and the fourth adhesive layer 410 is an optical adhesive layer.

[0058] like Figure 4As shown, based on the same inventive concept as the capacitive touchscreen structure, at least one embodiment of the present invention can also provide a method for manufacturing a capacitive touchscreen structure, for forming the capacitive touchscreen structure provided in the embodiments of the present invention. This method may include, but is not limited to, the following processes.

[0059] First, a first substrate layer 100 is formed, for example, a first substrate layer is formed on a semiconductor substrate, and then the semiconductor substrate is removed. The specific implementation process can be selected as needed in this embodiment, and will not be described in detail here. The first substrate layer 100 includes a first substrate body portion and a first substrate extension portion extending from the first substrate body portion. The first substrate body portion and the first substrate extension portion are integrally formed. In this embodiment, the first substrate layer is a PET material layer.

[0060] Next, a first adhesive layer 200 is coated onto the first substrate layer 100. The first adhesive layer 200 is, for example, a UV-curable adhesive layer. For example, the first adhesive layer 200 is coated onto the upper surface of the first substrate layer 100. The first adhesive layer 200 includes a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion. The first adhesive layer body portion and the first adhesive layer extension portion are integrally formed. The first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion.

[0061] Next, a first conductive layer 300 is formed on the first adhesive layer 200; the first conductive layer 300 includes a first conductive body portion and a first conductive extension portion extending from the first conductive body portion, the first conductive body portion and the first conductive extension portion being integrally formed.

[0062] In this embodiment of the invention, the first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion.

[0063] like Figure 5 and Figure 6 As shown, in this embodiment of the invention, forming a first conductive layer 300 on a first adhesive layer 200 includes: based on imprinting technology, this embodiment uses a roller 202 with protruding teeth to roll the first adhesive layer 200 to form a plurality of first strip-shaped grooves 201 on the first adhesive layer 200; this embodiment selects or designs a corresponding roller with protruding teeth based on the conductive layer pattern and circuit to be formed, for rolling the UV adhesive surface, while heating and curing demolding, this process is automatically completed by the processing equipment, so that the first strip-shaped grooves correspond to the first conductive layer pattern; the first strip-shaped grooves 201 extend from the body portion of the first adhesive layer to the extension portion of the first adhesive layer; a first conductive line is formed in each of the first strip-shaped grooves 201, so that the first conductive layer 300 is formed through all the conductive lines.

[0064] like Figure 7As shown, in this embodiment of the invention, forming a first conductive line within each first strip groove 201 includes: scraping metal paste into each first strip groove 201 using a scraper 203, thereby filling the first strip groove 201 with the metal paste. The metal paste in this embodiment is, for example, a silver paste or copper paste with good ductility, to achieve the formation of a highly reliable conductive line. The silver paste with good ductility is made by mixing metallic silver, a binder, a solvent, and additives together. The silver particles have strong adhesion and elasticity, which helps improve the bending resistance of the circuit, thereby greatly reducing the risk of the silver wire cracking when bent.

[0065] like Figure 8 As shown, the metal paste in the first groove 201 is solidified, for example, the filled silver paste or copper paste is solidified, so that the first metal paste line formed in the first groove 201 serves as the first conductive line.

[0066] Then, a second adhesive layer 400 is applied to the first conductive body portion, the second adhesive layer being, for example, a cured adhesive layer.

[0067] like Figure 9 and Figure 10 As shown, the manufacturing method of the capacitive touchscreen structure in at least one embodiment of the present invention further includes: after forming a first conductive layer pattern, coating a first protective layer 600 onto the first conductive extension portion, specifically coating the first conductive extension portion within the range of the first bending structure 601; wherein, the first protective layer 600 and the first adhesive layer extension portion are respectively located on both sides of the first conductive extension portion, and the first protective layer is, for example, an ultraviolet-cured adhesive layer. In this embodiment, a first metal layer 800 can be plated on the connection area of ​​the first conductive extension portion (e.g., the connection area with the IC control board), and the first metal layer 800 is connected to the first conductive extension portion, thereby better connecting with the pins on the connector, and thus connecting with the IC control board. Figure 12 As shown, this embodiment can also provide a first reinforcing layer 700 on the first substrate extension to improve the reliability of the capacitive touch screen connection structure.

[0068] Finally, a cover plate 500 is placed on the second adhesive layer 400.

[0069] like Figure 13As shown, the manufacturing method of the capacitive touch screen structure in one or more embodiments of the present invention further includes, before the cover plate 500 is disposed on the second adhesive layer 400: forming a second substrate layer 110, the second substrate layer 110 being, for example, a PET material layer; coating a third adhesive layer 210 on the second substrate layer 110, forming a first conductive layer 300 on the third adhesive layer 210, coating a fourth adhesive layer 410 on the second conductive layer 310, and bonding the first substrate layer 100 and the second conductive layer 310 through the fourth adhesive layer 410; wherein, in this embodiment, the process of forming the second substrate layer 110 is the same as that of forming the first substrate layer 100, and the second substrate layer 110 and the first substrate layer 100 have the same structure; coating the third adhesive layer 210... The process of layer 210 is the same as that of the first adhesive layer 200, and the third adhesive layer 210 has the same structure as the first adhesive layer 200; the process of forming the second conductive layer 310 is the same as that of forming the first conductive layer 300, and the second conductive layer 310 has the same structure as the first conductive layer 300; the process of coating the fourth adhesive layer 410 is the same as that of coating the second adhesive layer 400, and the fourth adhesive layer 410 has the same structure as the second adhesive layer 400; based on the detailed description of the manufacturing process and results of the first substrate layer, the first adhesive layer, the first conductive layer and the second adhesive layer in this specification, the manufacturing process and specific structure of the second substrate layer, the third adhesive layer, the second conductive layer and the fourth adhesive layer in this embodiment will not be described again.

[0070] Combination Figure 13 As shown, after forming the second conductive layer pattern in this embodiment, a second protective layer 610 is coated on the second conductive extension, specifically coated on the second conductive extension within the range of the second bending structure. The second protective layer 610 and the second adhesive layer extension are located on opposite sides of the second conductive extension, and the second protective layer is, for example, a UV-curable adhesive layer. In this embodiment, a second metal layer 810 can be plated on the connection area of ​​the second conductive extension (e.g., the connection area with the IC control board). The second metal layer 810 connects to the second conductive extension, thereby better connecting with the pins on the connector, and thus connecting with the IC control board. This embodiment can also provide a second reinforcing layer 710 on the second substrate extension to improve the reliability of the capacitive touchscreen connection structure.

[0071] like Figure 11 As described above, after the first conductive layer pattern and the second conductive layer pattern are formed in this embodiment, they can be cut, that is, removed after each material layer is processed. Figure 11 The area 602 shown is the region that needs to be cut off to obtain a touch screen connection structure, which can be used to connect to an IC control board. In this embodiment, the first conductive layer pattern is used as the driving surface pattern (TX) layer and the second conductive layer pattern is used as the sensing surface pattern (RX) layer, or the first conductive layer pattern is used as the sensing surface pattern (RX) layer and the second conductive layer pattern is used as the driving surface pattern (TX) layer.

[0072] In summary, compared to conventional capacitive touchscreen manufacturing methods, the embodiments of the present invention can reduce the production steps of capacitive touchscreen structures, quickly form capacitive touchscreen traces and patterns, and replace FPC with a first substrate extension, a first adhesive layer extension, and a first conductive extension to achieve connection with other circuits. The entire manufacturing process of the capacitive touchscreen structure is based on imprinting technology to achieve an integrated molding structure. It can be seen that the present invention effectively avoids the problems of significantly affecting the yield of capacitive touchscreen production and increasing the cost of capacitive touchscreen products due to reliance on FPC, thereby improving the reliability of capacitive touchscreen structures and reducing product costs.

[0073] like Figure 14 As shown, based on the same inventive concept as the capacitive touchscreen structure, one or more embodiments of the present invention can also provide a capacitive touchscreen, which includes the capacitive touchscreen structure in any embodiment of the present invention. Figure 14 The diagram illustrates an electrode pattern layer 900 and a wiring area 901 included in a capacitive touchscreen. The electrode pattern layer 900 is used to detect touch signals, and the wiring area 901 is used to provide space for accommodating leads. The leads may include leads at the edge of the capacitive touchscreen structure formed by the first substrate extension, the first adhesive layer extension, and the first conductive extension, as well as leads at the edge of the capacitive touchscreen structure formed by the second substrate extension, the second adhesive layer extension, and the second conductive extension. Several embodiments of the capacitive touchscreen structure provided by this invention have been described in detail in this specification and will not be repeated here. The capacitive touchscreens involved in one or more embodiments of this invention are, for example, OLED (Organic Light-Emitting Diode), Micro LED (Micron-Emitting Diode), MiniLED (Sub-Millimeter Light-Emitting Diode), etc.

[0074] Based on the same inventive concept as the capacitive touchscreen structure, one or more embodiments of the present invention can also provide a touch device, which includes the capacitive touchscreen or the capacitive touchscreen structure of any embodiment of the present invention. The specific structure of the integrated capacitive touchscreen structure involved in the present invention, and its various embodiments, have been described in detail in this specification and will not be repeated here. The touch devices provided by the present invention include, but are not limited to, the following categories: mobile phones, smartwatches, tablet computers, laptops, desktop monitors, televisions, digital cameras, smart bracelets, smart glasses, automotive displays, medical devices, industrial control equipment, smart interactive flat panels, and touch interactive terminals, etc.

[0075] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0077] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0078] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0079] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and simple improvements made on the substantive content of the present invention should be included within the protection scope of the present invention.

Claims

1. A capacitive touchscreen structure, characterized in that, include: The first substrate layer (100) includes a first substrate body portion and a first substrate extension portion extending from the first substrate body portion, wherein the first substrate body portion and the first substrate extension portion are integrally formed. A first adhesive layer (200) is disposed on the first substrate layer (100); the first adhesive layer (200) includes a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion, the first adhesive layer body portion and the first adhesive layer extension portion are integrally formed; wherein, the first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion. A first conductive layer (300) is disposed on the first adhesive layer (200); the first conductive layer (300) includes a first conductive body portion and a first conductive extension portion extending from the first conductive body portion, the first conductive body portion and the first conductive extension portion being integrally formed; wherein, the first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion; the first substrate extension portion, the first adhesive layer extension portion and the first conductive extension portion are used to form a first bending structure (601), and a first protective layer (600) is disposed on the first bending structure (601) to block the first conductive extension portion which has an outward bending tendency due to internal tension. A second adhesive layer (400) is disposed on the first conductive body portion; A cover plate (500) is disposed on the second adhesive layer (400); The second substrate layer (110) includes a second substrate body portion and a second substrate extension portion extending from the second substrate body portion, wherein the second substrate body portion and the second substrate extension portion are integrally formed. A third adhesive layer (210) is disposed on the second substrate layer (110); the third adhesive layer (210) includes a third adhesive layer body portion and a third adhesive layer extension portion extending from the third adhesive layer body portion, the third adhesive layer body portion and the third adhesive layer extension portion are integrally formed; wherein, the third adhesive layer body portion is disposed on the second substrate body portion, and the third adhesive layer extension portion is disposed on the second substrate extension portion; A second conductive layer (310) is disposed on the third adhesive layer (210); the second conductive layer (310) includes a second conductive body portion and a second conductive extension portion extending from the second conductive body portion, the second conductive body portion and the second conductive extension portion being integrally formed; wherein, the second conductive body portion is disposed on the third adhesive layer body portion, and the second conductive extension portion is disposed on the third adhesive layer extension portion. A fourth adhesive layer (410) is disposed on the second conductive body portion; the fourth adhesive layer (410) bonds the first substrate layer (100) and the second conductive layer (310).

2. The capacitive touchscreen structure according to claim 1, characterized in that, The first adhesive layer (200) has a plurality of first strip grooves (201) on its surface; the first strip grooves (201) extend from the body portion of the first adhesive layer to the extension portion of the first adhesive layer; The first strip groove (201) is provided with a first conductive line, and all the first conductive lines form the first conductive layer (300).

3. The capacitive touchscreen structure according to claim 2, characterized in that, The first conductive line is a first metal paste line, which fills the first strip groove (201).

4. The capacitive touchscreen structure according to claim 1, characterized in that, The first protective layer (600) and the first adhesive layer extension are located on both sides of the first conductive extension.

5. The capacitive touchscreen structure according to claim 1, characterized in that, Also includes: A first reinforcing layer (700) is disposed on the first substrate extension; the first reinforcing layer (700) and the first adhesive layer (200) are respectively located on both sides of the first substrate extension.

6. The capacitive touchscreen structure according to claim 1, characterized in that, The first conductive extension has a connection area, on which a first metal layer (800) is disposed, and the first metal layer (800) is connected to the first conductive extension.

7. The capacitive touchscreen structure according to claim 1, characterized in that, The first adhesive layer (200) is a UV-curable adhesive layer; The second adhesive layer (400) is an optical adhesive layer.

8. The capacitive touchscreen structure according to claim 1, characterized in that, The second substrate layer (110) has the same structure as the first substrate layer (100); The third adhesive layer (210) has the same structure as the first adhesive layer (200); The second conductive layer (310) has the same structure as the first conductive layer (300); The fourth adhesive layer (410) has the same structure as the second adhesive layer (400).

9. A capacitive touchscreen, characterized in that, Includes the capacitive touchscreen structure as described in any one of claims 1 to 8.

10. A touch device, characterized in that, It includes the capacitive touch screen as described in claim 9 or the capacitive touch screen structure as described in any one of claims 1 to 8.

11. A method for manufacturing a capacitive touchscreen structure, characterized in that, The manufacturing method, applied to the capacitive touchscreen structure according to any one of claims 1 to 8, comprises: A first substrate layer (100) is formed; the first substrate layer (100) includes a first substrate body portion and a first substrate extension portion extending from the first substrate body portion, wherein the first substrate body portion and the first substrate extension portion are integrally formed. A first adhesive layer (200) is applied to the first substrate layer (100); the first adhesive layer (200) includes a first adhesive layer body portion and a first adhesive layer extension portion extending from the first adhesive layer body portion, the first adhesive layer body portion and the first adhesive layer extension portion are integrally formed; wherein, the first adhesive layer body portion is disposed on the first substrate body portion, and the first adhesive layer extension portion is disposed on the first substrate extension portion. A first conductive layer (300) is formed on the first adhesive layer (200); the first conductive layer (300) includes a first conductive body portion and a first conductive extension portion extending from the first conductive body portion, the first conductive body portion and the first conductive extension portion being integrally formed; wherein, the first conductive body portion is disposed on the first adhesive layer body portion, and the first conductive extension portion is disposed on the first adhesive layer extension portion; the first substrate extension portion, the first adhesive layer extension portion and the first conductive extension portion are used to form a first bending structure (601). A first protective layer (600) is applied to the first conductive extension within the range of the first bending structure (601) to block the first conductive extension from bending outward due to internal tension. A second adhesive layer (400) is applied to the first conductive body portion; A cover plate (500) is provided on the second adhesive layer (400).

12. The method for manufacturing a capacitive touchscreen structure according to claim 11, characterized in that, The formation of the first conductive layer (300) on the first adhesive layer (200) includes: The first adhesive layer (200) is rolled using a toothed roller (202) to form a plurality of first strip grooves (201) on the first adhesive layer (200); the first strip grooves (201) extend from the body portion of the first adhesive layer to the extension portion of the first adhesive layer; First conductive lines are formed within each of the first strip grooves (201) to form the first conductive layer (300) through all the conductive lines.

13. The method for manufacturing a capacitive touchscreen structure according to claim 12, characterized in that, The formation of the first conductive line within each of the first strip grooves (201) includes: The metal paste is scraped into each of the first strip grooves (201) by a scraper (203), and the metal paste fills the first strip grooves (201). The metal paste in the first strip groove (201) is solidified to form the first conductive line through the first metal paste line formed in the first strip groove (201).

14. The method for manufacturing a capacitive touchscreen structure according to claim 11, characterized in that, The first protective layer (600) and the first adhesive layer extension are located on both sides of the first conductive extension.

15. A method for manufacturing a capacitive touchscreen structure according to any one of claims 11 to 14, characterized in that, Before setting the cover plate (500) on the second adhesive layer (400), the method further includes: A second substrate layer (110) is formed, a third adhesive layer (210) is applied to the second substrate layer (110), a second conductive layer (310) is formed on the third adhesive layer (210), a fourth adhesive layer (410) is applied to the second conductive layer (310), and the first substrate layer (100) and the second conductive layer (310) are bonded together by the fourth adhesive layer (410). The second substrate layer (110) has the same structure as the first substrate layer (100), the third adhesive layer (210) has the same structure as the first adhesive layer (200), the second conductive layer (310) has the same structure as the first conductive layer (300), and the fourth adhesive layer (410) has the same structure as the second adhesive layer (400).

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