A core microwave amplifier chip application verification system and method for space applications

Abstract

This invention relates to a core microwave amplifier chip application verification system and method for aerospace applications, belonging to the field of electronic technology. The application verification method and system of this invention combine the inherent characteristics of the device with the requirements of aerospace applications, constructing a complete set of methods and systems for microwave amplifier application verification, which can meet the needs of microwave amplifier aerospace application verification. This invention develops targeted tests for the inherent characteristics, process features, and common failure modes of microwave amplifiers. For example, it designs stability evaluation for amplifier self-excited oscillation, hydrogen resistance evaluation for hydrogen effects, anti-mismatch capability evaluation for power reflection caused by output mismatch, and lifetime assessment for the impact of various operating conditions on lifetime, ensuring the efficiency and relevance of the verification.

Description

Technical Field

[0001] This invention relates to a core microwave amplifier chip application verification system and method for aerospace applications, belonging to the field of electronic technology. Background Technology

[0002] Microwave amplifiers, as crucial microwave devices, are widely used in radar, electronic countermeasures, and telemetry / remote sensing transceiver systems to amplify microwave signals. In recent years, with the development of integrated circuits, microwave amplifiers have gradually been integrated into transceiver systems such as TR components in bare-chip form. Because they are non-removable and replaceable during aerospace applications, and failure or performance degradation could have a fatal impact on spacecraft transceiver functionality, the bare chips of core microwave amplifiers for aerospace applications require extremely high reliability. Furthermore, due to the high integration density of core microwave amplifier chips and the difficulty in rejecting them during quality assurance processes, a series of targeted application verifications are necessary before their formal application in spacecraft.

[0003] In recent years, with the vigorous promotion of domestic production, the pressure to verify the application of domestically produced microwave amplifier bare chips as substitutes for imported products has been immense. However, there is no comprehensive set of verification methods and systems available for reference, leading to incomplete and insufficient verification experiments and low verification efficiency. Therefore, the need to develop an application verification method and system for core microwave amplifier bare chips used in aerospace is urgent.

[0004] Previously, the application verification of microwave amplifiers had the following problems: 1. There was no complete application verification method for microwave amplifiers. It was often fragmented and focused on a specific failure mode or quality problem. The application verification indicators for amplifiers were also limited to one or a few specific users, which was not comprehensive or universal enough; 2. During the verification implementation, different samples needed to be installed repeatedly, different instruments and equipment needed to be connected and different test and experimental platforms needed to be built for different tests. This was inefficient and prone to various errors; 3. Verification was not carried out for the common inherent failure modes of microwave amplifiers. Summary of the Invention

[0005] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide an application verification method and supporting application verification system for core microwave amplifier bare chips for aerospace applications, which can comprehensively, specifically and efficiently verify the application of core microwave amplifier bare chips for aerospace applications.

[0006] The technical solution of the present invention is: an application verification system for a core microwave amplifier chip for aerospace applications, comprising a host computer control system, a microwave verification equipment set, and microwave verification tooling;

[0007] The host computer control system, based on the needs of aerospace application verification and the amplifier to be verified, controls the microwave verification equipment set and the corresponding test equipment of the microwave verification tooling to complete the test, and receives the total microwave test input and total microwave test output sent by the microwave verification equipment set and microwave verification tooling to complete the data analysis of the test results;

[0008] The microwave verification equipment set includes the test equipment required for microwave amplifier application verification experiments. It is used to simulate the application peripheral matching environment of different aerospace users, receive control commands from the host computer control system, realize the control matrix for different test requirements, send the total microwave test input to the microwave verification fixture, and receive the total microwave test output sent by the microwave verification fixture. It displays the difference between the total microwave test output and the total microwave test input, and sends the total microwave test input and the total microwave test output to the host computer control system.

[0009] The microwave verification fixture is used to provide an installation and testing environment for multiple verification objects and to perform atmospheric environment tests, mechanical environment tests, and temperature environment tests on the verification objects based on the received total microwave test input, as well as various corresponding microwave tests, and to send the total microwave test output to the microwave verification equipment set.

[0010] Furthermore, the microwave verification equipment set includes an input matching network, an output matching network, a switch matrix, a vector network analyzer, a microwave signal source, a spectrum analyzer, a mismatch prevention device, and an oscilloscope; the total microwave test input is a set of different types of microwave signals determined according to the verification object; the total microwave test output is a set of different types of microwave signals generated after the total microwave test input passes through the verification object.

[0011] Furthermore, the vector network analyzer, microwave signal source, spectrum analyzer, mismatch prevention device, and oscilloscope are connected to one end of the input matching network and the output matching network through a switch matrix, and the other end of the input matching network and the output matching network is connected to the microwave verification fixture.

[0012] Furthermore, the microwave verification fixture includes an atmosphere sealing hood, a microwave verification matrix switching fixture, an atmosphere control console, an MCU control board, a power processing board, and a vibration temperature control console.

[0013] An atmosphere-sealed enclosure is used to support the verification object and verification tooling.

[0014] The microwave verification matrix switching fixture is installed inside an atmosphere-sealed enclosure to install multiple verification objects, enabling simultaneous microwave testing and electrical experiments on multiple verification objects.

[0015] The atmosphere control console is used to receive control commands from the MCU control board to conduct atmospheric environment tests on the verification object. It verifies the hydrogen resistance by injecting hydrogen and monitoring the changes in device parameters through the host computer control system, and sends the test results to the microwave verification equipment set.

[0016] The MCU control board is used to receive control commands from the host computer control system and to control the atmosphere control console and power processing board.

[0017] The vibration temperature control console receives control commands from the MCU control board and is used to conduct mechanical and temperature environment tests on the verification sample, and send the test results to the microwave verification equipment set.

[0018] The power processing board receives instructions from the MCU control board and supplies power to the verification object.

[0019] Furthermore, the microwave verification matrix switching fixture includes a switching matrix and several amplifier fixtures that serve as verification objects.

[0020] Furthermore, the amplifier fixtures are all connected to the microwave verification equipment set via a switch matrix.

[0021] Furthermore, the power processing board has a protection circuit that first provides negative power and then positive power during operation, and first shuts off positive power and then negative power after verification is completed, thereby achieving electrical protection for the verification object.

[0022] The application verification method based on the application verification system for a core microwave amplifier chip for aerospace applications includes:

[0023] The verification object is installed in the microwave verification matrix switching fixture, and the microwave verification equipment set is configured according to the preset test specifications and the microwave amplifier characteristic parameters of the verification object.

[0024] The host computer control system controls the microwave verification equipment set and microwave verification fixtures to perform DC and microwave parameter tests on the verification object, stability factor tests of the process cutoff frequency, spectrum analysis of the process cutoff frequency, hydrogen resistance tests, mismatch resistance tests, lifetime tests under various operating conditions, device-level thermal environment tests, board-level functional tests, board-level electrical environment tests, and board-level thermodynamic environment tests, obtaining verification results of the bare microwave amplifier chip for aerospace applications.

[0025] Furthermore, the DC and microwave parameter testing of the verification object includes: the host computer control system calls the microwave verification equipment set through instructions, and performs DC and microwave parameter testing on the microwave amplifier of the verification object at 25℃, -55℃, and +125℃ according to preset conditions. The tested parameters include gain, amplitude frequency, output power, input and output standing wave ratio, 1dB gain compression point output power, and power-added efficiency; the parameters are interpreted, and the maximum, minimum, average, and standard deviation of each parameter are calculated to determine whether the parameters are qualified and consistent; the presence of abnormal points in gain and output power within the operating frequency band is identified, and if any are found, a warning is issued and the frequency points where they exist are recorded.

[0026] Furthermore, the stability factor test of the process cutoff frequency includes: the host computer control system controls the microwave amplifier of the verification object to perform stability factor tests covering the process cutoff frequency of the verification object chip from 10MHz to 110GHz at 25℃, -55℃ and +125℃ respectively using a vector network analyzer; during the test, the operating voltage is scanned between ±10%, and the S2P file is extracted and analyzed; the S2P file is sent to the host computer control system to determine the stability factor μ within the entire test band; if μ>1, the entire band is stable; if μ≤1 exists, the frequency at that position is recorded, and a prompt analysis report is generated for the amplifier application engineer's reference;

[0027] Furthermore, the spectrum analysis of the process cutoff frequency includes: the host computer control system controls the microwave amplifier chip of the verification object to perform spectrum analysis covering the process cutoff frequency band of the verification object chip from 10MHz to 110GHz at 25℃, -55℃ and +125℃ respectively using a spectrum analyzer; during the test process, the operating voltage is scanned between ±10%, and three loads are switched between open mode, short mode and 50Ω load mode respectively. The spectrum obtained by the test is sent to the host computer control system for analysis, and it is determined whether there is an abnormal spectrum in the die cutoff frequency band under the test conditions, which may cause microwave interference to the whole machine application, and a warning and analysis report are generated.

[0028] Furthermore, the hydrogen resistance test includes: after assembling the bare chip of the microwave amplifier to be verified, it is installed in the verification matrix switching fixture without sealing the cap. The host computer control system performs the following operations in sequence: sequentially supplying negative and positive power to the verification object; the host computer control system issues a command to first raise the temperature of the base plate of the verification matrix switching fixture to 150°C, and after the working current and temperature stabilize for 3 minutes, controls the closing of the atmosphere protection cover; the control atmosphere console gradually injects hydrogen into the sealed microwave verification equipment and monitors the internal hydrogen content. The timing starts after the hydrogen concentration reaches 20,000 ppm within 10 minutes; the computer monitors the working current of each verification object in real time and calculates the working current based on the initial value I. D0The rate of change and the time it takes for the rate of change to reach 10%, if the experiment lasts for 300 hours. D0 If the rate of change does not reach 10%, the experiment is stopped; hydrogen is withdrawn from the control atmosphere control console, the atmosphere protection cover is opened, the temperature of the verification matrix switching fixture base plate is reduced to room temperature, and then the positive and negative power supplies are turned off in sequence;

[0029] Furthermore, the mismatch resistance test includes: the host computer control system controls the mismatch resistance device to conduct tests under test conditions with test saturated output power parameters applied at frequencies from 10MHz to 110GHz, scanning a 360° phase; the return loss ratio is tested at 3:1, 5:1, 6:1, and ∞:1 respectively; after each test, microwave parameters such as gain, amplitude frequency, output power, input and output standing wave ratio, 1dB gain compression point output power, and power-added efficiency are tested; the test results are sent to the host computer control system for calculation and judgment. If the output power change |ΔPo| ≥ 1dB or the gain change |ΔGp| ≥ 1dB, or the rate of change of operating current |ID0 / ID0| ≥ 10%, the device fails; the mismatch ratio before the corresponding failure is the mismatch resistance capability of the verification object.

[0030] Furthermore, the lifespan test under each operating condition involves: heating the centralized amplifier of the microwave verification equipment; dividing the microwave amplifiers of the verification object into three groups; and controlling the upper computer control system to apply lifespan to the three groups of samples according to the constant power consumption mode of three different voltage and current intensities set by the computer; the duration of each temperature point is not less than 4 hours, with an interactive adjustment interval of Step = 25℃; the interactive adjustment is continuously stepped up until the die burns out or other failure modes appear; the upper computer control system calculates the corresponding lifespan based on the lifespan time of each group of samples, and analyzes and compares the chip lifespan under each operating condition;

[0031] Furthermore, the device-level thermal environment test includes: conducting a temperature cycling limit test on the core microwave amplifier chip for aerospace applications, with the lowest temperature set at -65℃ and the highest temperature set at 150℃, the limit temperature held for 30 minutes, and the number of cycles at 100, with each cycle incremented in 100-cycle increments. After each increment, the device is restored to room temperature to test the operating current and gain parameters. The test ends when 200 cycles are accumulated or when the parameters of one sample exceed the tolerance or fail.

[0032] Furthermore, the board-level functional testing includes: the host computer control system calling the microwave verification equipment set through instructions, controlling the input / output matching network to simulate the peripheral matching conditions of different users in various bias modes, and performing DC and microwave parameter tests on the verification object microwave amplifier at 25℃, -55℃ and +125℃, including gain, amplitude frequency, output power, input / output standing wave ratio, 1dB gain compression point output power, and power-added efficiency; interpreting the parameters; identifying whether there are abnormal points in gain and output power within the operating frequency band, issuing a warning if they exist, and recording the frequency points where they exist;

[0033] Furthermore, the board-level electrical environment test includes: simulating the peripheral matching conditions of different users in various bias modes by controlling the input / output matching network; the host computer control system controls the signal source to apply an input power of -30dBm to the verification object, with the input power in 1dBm increments, pulling the bias to near the 1dB compression point, and testing the verification object's gain, amplitude-frequency response, output power, input / output standing wave ratio, output power at the 1dB gain compression point, and power-added efficiency; the test results are returned to the host computer control system to generate test curves and perform analysis.

[0034] Furthermore, the plate-level thermodynamic environment test includes: the host computer control system calls the microwave verification equipment set matrix through instructions, controls the input-output matching network to simulate the peripheral matching conditions of different users in various bias modes, and conducts temperature change tests on the verification object from -40℃ to +70℃ at a temperature change rate of 3 to 5℃ / min. The test results are fed back to the host computer control system for processing to generate test curves and analysis reports. Sinusoidal vibration, random vibration, and shock tests are then conducted on the verification object according to the set magnitudes. After each test, the host computer control system controls the microwave verification equipment set to conduct microwave tests on the verification object and generates a test analysis report.

[0035] The advantages of this invention compared to the prior art are:

[0036] 1. The application verification method and system of the present invention combine the inherent characteristics of the device with the requirements of aerospace applications, and construct a complete set of methods and systems for application verification of microwave amplifiers, which can meet the requirements of aerospace application verification of microwave amplifiers.

[0037] 2. This invention provides targeted tests for the inherent characteristics, process features and common failure modes of microwave amplifiers. For example, it designs a stability evaluation for amplifier self-excited oscillation, a hydrogen resistance evaluation for hydrogen effect, a mismatch resistance evaluation for power reflection caused by output mismatch, and a lifetime assessment for the impact of various operating conditions on lifetime, ensuring the efficiency and relevance of the verification.

[0038] 3. To improve the reliability of microwave amplifier applications, this invention integrates a circuit board that simulates actual applications, which can cover the user's operating conditions to a certain extent and complete the board-level application verification work.

[0039] 4. By using the application verification system designed in this invention alone, the application verification of microwave amplifiers can be completed comprehensively, systematically and in a targeted manner, and the inherent reliability, inherent reliability and application adaptability and reliability of the verification object can be obtained. Attached Figure Description

[0040] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0041] Figure 1 This invention provides an application verification system for the core microwave amplifier chip used in aerospace.

[0042] Figure 2 This is a schematic block diagram illustrating the application verification method of the aerospace core microwave amplifier chip in this invention. Detailed Implementation

[0043] To better understand the above technical solutions, the technical solutions of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this application and the specific features in the embodiments are detailed descriptions of the technical solutions of this application, rather than limitations on the technical solutions of this application. In the absence of conflict, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0044] The following, in conjunction with the accompanying drawings, provides a detailed description of the application verification method and supporting application verification system for a core microwave amplifier bare chip based on aerospace applications, as provided in this application. The specific implementation may include: a host computer control system, a microwave verification equipment set matrix, a microwave verification matrix switching fixture, an atmosphere-sealed enclosure, an atmosphere control console, a vibration and temperature control console, an MCU control board, and a power processing board. The host computer control system controls other parts, completing a full set of microwave tests, electrical tests, and environmental tests according to the needs of aerospace application verification and the characteristics of the amplifier, and performing data analysis on the test results. The microwave verification equipment set matrix, while integrating vector network analyzers, microwave signal sources, spectrum analyzers, oscilloscopes, etc., required for microwave parameter testing, also integrates input matching networks and output matching networks. It can simulate the peripheral matching environment of different aerospace users to a certain extent, while also serving as a control matrix for different testing requirements. Multiple verification objects are installed in the microwave verification matrix switching fixture, enabling simultaneous different microwave tests and electrical tests on multiple verification objects. The atmosphere control console performs atmospheric environment tests on the verification objects according to the application environment and characteristics of the model. The vibration and temperature control console can perform mechanical and temperature environment tests on the verification samples.

[0045] In the solutions provided in the embodiments of this application, such as Figure 1 As shown, it consists of a host computer control system, a microwave verification equipment set matrix, a microwave verification matrix switching fixture, an atmosphere control console, and a vibration and temperature control console.

[0046] 1) Host Computer Control System: This system consists of a computer and an FPGA-based overall control system, internally embedding the pre-designed verification test program of this patented design. Simultaneously, it sends control commands to the microwave verification equipment set matrix, atmosphere control console, and vibration and temperature control console via the device control bus, and acquires test / experiment data from the microwave verification switching matrix. Based on the requirements of aerospace application verification and the characteristics of the amplifier, it completes a full set of microwave tests, electrical tests, and environmental tests, and analyzes the test results. The host computer control system interconnects and interacts with the microwave verification equipment set and the microwave verification tooling via a serial control bus. Device control interaction uses interfaces such as GPIB (General Purpose Interface Bus), LAN (Local Area Network), and RS232, with instrument and device control statements as the interactive information flow. The host computer sends control commands, the equipment set receives the commands, performs the corresponding operations, and returns information on whether the operation was successful and the test data after a successful operation. Microwave device control interaction uses interfaces such as RS232 and SPI (Serial Peripheral Interface), with hexadecimal numbers as the interactive information flow. The host computer sends control commands, the microwave device control system receives the commands, performs the corresponding operations, and returns information on whether the operation was successful.

[0047] 2) Microwave verification equipment set matrix: This matrix consists of test equipment required for microwave amplifier application verification tests. It includes vector network analyzers, microwave signal sources, spectrum analyzers, mismatch protection devices, oscilloscopes, etc. It integrates input matching networks and output matching networks, which can simulate the application peripheral matching environment of different aerospace users to a certain extent, and also has the function of control matrix for different test requirements.

[0048] 3) Microwave verification matrix switching fixture: Multiple verification objects are installed in the microwave verification matrix switching fixture to enable simultaneous microwave testing and electrical experiments on multiple verification objects.

[0049] 4) Atmosphere Control Console: This console consists of a control matrix, hydrogen tank, hydrogen concentration monitoring meter, and safety explosion-proof hydrants. Since most GaAs and GaN microwave amplifiers exhibit hydrogen-induced failure modes, meaning that continuous hydrogen infiltration during application leads to chip parameter deterioration and even failure, the integrated atmosphere control console is used to conduct atmospheric environment tests on the tested devices. Hydrogen is injected through the console, and the host computer control system monitors changes in device parameters to verify their hydrogen resistance.

[0050] 5) Vibration and Temperature Control Console: Consists of an MCU control board, vibration table, temperature control chamber, and central power processing board. It can perform mechanical and temperature environment tests on the verification sample and supply power to the verification object via the central power processing board according to instructions.

[0051] Based on the same inventive concept, this invention also provides an application verification test method for a core microwave amplifier chip, the method of which is described below. Figure 2 As shown, it includes: component-level evaluation, board-level verification evaluation, and comprehensive evaluation. The component-level evaluation includes functional performance verification, limit assessment, and lifespan stress testing. The board-level verification includes board-level functional performance verification, electrical environment adaptability verification, and thermal and mechanical environment adaptability verification. The method specifically includes the following steps:

[0052] Step 1: Install the verification object in the microwave verification matrix switching fixture, input the microwave amplifier characteristic parameters of the verification object according to the detailed specifications, including recommended positive and negative operating levels and limit protection levels, frequency range, recommended and limit input power, and FPGA settings for the control instructions of other parts such as the microwave verification equipment set matrix, microwave verification matrix, MCU control board and power processing board.

[0053] Step 2: Perform component-level functional performance analysis. According to the recommended conditions set above, test the DC and microwave parameters of several verification microwave amplifiers at room temperature, recommended minimum operating temperature, and recommended maximum operating temperature. Extract the S2P file, calculate the maximum, minimum, average, and standard deviation of the parameters, and determine whether the parameters are qualified and consistent. Identify any abnormal points such as gain and output power spikes or glitches within the operating frequency band. If any are found, issue a warning and record the frequency points where they exist.

[0054] Step 3: Amplifier Stability Factor Testing, Analysis, and Judgment: The microwave amplifier under computer control is subjected to stability factor testing using a vector network analyzer at room temperature, recommended minimum operating temperature, and recommended maximum operating temperature. The test band must cover the process cutoff frequency of the core chip inside the microwave amplifier. During the test, the operating voltage is scanned within ±10%, and the S2P file is extracted and analyzed. The S2P file is analyzed through the host computer control system, and the stability factor μ across the entire test band is determined. If μ > 1, the entire band is stable; if μ ≤ 1, the frequency at that location is recorded, and a prompt analysis report is generated for the amplifier's application engineers' reference.

[0055] Step 4, Amplifier Stability Spectrum Analysis: The host computer control system controls the microwave amplifier being tested to perform spectrum analysis using a spectrum analyzer at room temperature, recommended minimum operating temperature, and recommended maximum operating temperature. The test band must cover the process cutoff frequency of the core chip inside the microwave amplifier. During the test, the operating voltage is scanned within ±10%. The FPGA control system automatically switches between open, short, and 50Ω loads. The spectrum obtained by the spectrum analyzer is sent to the host computer control system for analysis. The system determines whether there are any abnormal spectra within the die cutoff frequency band under the test conditions, which could cause microwave interference to the overall application, and generates warnings and analysis reports.

[0056] Step 5, hydrogen resistance evaluation and analysis, employing a dual-stress accelerated life test using both temperature-accelerated and hydrogen concentration-accelerated methods. This includes the following steps:

[0057] After the verification object is uncapped or assembled, it is installed in the verification matrix switching fixture without being capped. The host computer control system performs the following operations in sequence: The power processing board sequentially supplies negative and positive power to the verification object. After the computer indicates that the power supply is normal, it monitors the current. The host computer control system issues a command to first raise the temperature of the fixture base plate to the recommended maximum operating temperature of the verification object. After the operating current and temperature stabilize for 3 minutes (the operating current at this time is taken as the initial value ID0), the MCU controls the closing of the transparent atmosphere protection cover. The MCU controls the atmosphere control console to slowly inject hydrogen into the sealed verification matrix and monitors the internal hydrogen content. After a certain concentration is reached, timing begins. The computer monitors the operating current of each verification object in real time and calculates the rate of change of the operating current based on the initial value ID0 and the time it takes for the rate of change to reach 10%. If the rate of change of ID0 does not reach 10% after 300 hours of the test, the test is stopped. The MCU control board controls the atmosphere control console to slowly withdraw hydrogen, open the atmosphere protection cover, and after the temperature of the fixture base plate is reduced to room temperature, the power processing board sequentially shuts off the positive and negative power supplies. The computer calculates the lifespan of the verification object based on the collected data and the following formula:

[0058] The following formula (1) characterizes the relationship between device lifetime and hydrogen concentration:

[0059] t=APnexp(Ea / KT) (1)

[0060] In the formula, t is the average lifespan (in hours) when the operating current decreases by 10%; A is a positive constant; P is the partial pressure of hydrogen; n is a negative constant; Ea is called the activation energy; K is the Boltzmann constant (8.615×10-5); and T is the ambient temperature (in K).

[0061] Step 6: Evaluation and Analysis of Mismatch Resistance. Because amplifier chips experience power reflection under output mismatch conditions, which can cause device failure or even burn out peripheral circuits, it is necessary to conduct experiments to examine the reflected power the device can withstand, providing a reference for the design and use of the amplifier's overall application circuit. This system adopts this approach. The steps include: The host computer control system controls the mismatch resistance device to conduct tests at recommended frequency points, applying test conditions to measure the saturated output power parameters, scanning a 360° phase. Tests are performed under different return loss ratio conditions. Microwave parameter tests are performed after each test. The computer calculates and determines whether the device fails if the output power, gain, or operating current changes exceed the required range. The mismatch ratio preceding the failure is the mismatch resistance of the tested object.

[0062] Step 7: Lifetime assessment and analysis under various operating conditions. For the failure mechanisms and lifespan of amplifiers under different biases, the lifetime assessment and analysis includes the following steps: The MCU control board heats the amplifiers in the verification matrix. The amplifiers in the verification matrix are divided into three groups. The FPGA master controller, controlled by the host computer control system, applies lifetimes to the three groups of samples according to the computer settings: low voltage high current, medium voltage medium current, and high voltage low current, respectively. The duration of each temperature point is ≥4 hours. Then, the host computer control system and the MCU control board interact to issue commands to adjust Tc, Step = 25℃; Tc is continuously stepped until the die burns out or other failure modes appear. During this process, the MCU monitors the temperature of each verification object, while the FPGA bus monitors the current. If a thermal collapse phenomenon occurs (e.g., unable to stabilize within 0.5 hours, gate current continuously and rapidly increasing, etc.), it may be that the heat dissipation density exceeds the limit of heat dissipation capacity (the chip's heat dissipation capacity decreases with increasing temperature). The host computer control system calls commands to compare and judge by adjusting the heat dissipation test. This prevents misjudgment caused by improper test conditions during the test.

[0063] Step 8, Device-level thermal environment adaptability evaluation and analysis: The host computer control system sends instructions, and the MCU control board controls the temperature chamber system in sequence to complete the temperature cycle test of the verification object. After each cycle, microwave parameter tests are performed, and the results are sent to the computer to generate test curves and test reports.

[0064] Step 9, Board-level functional performance evaluation and analysis: Adjust the input matching network and output matching network through the host computer control system, set the peripheral matching conditions for different users, start the power processing board and microwave test equipment set matrix according to the recommended conditions set above, and perform DC parameter and microwave parameter tests on several verification object microwave amplifiers at room temperature, recommended minimum operating temperature and recommended maximum operating temperature, and extract the S2P file.

[0065] Step 10: Board-level electrical environment application reliability verification. By controlling the input / output matching network in various bias modes, simulate the peripheral matching conditions of different users. The MCU controls the power processing board, using the recommended power supply voltage as a reference, and symmetrically biases the power supply voltage by ±10%. Test the board-level microwave parameters of the verification object to verify the chip's board-level electrical adaptability. The host computer controls the signal source to bias the input power of the verification object, shifting the input power from the recommended small-signal input power value to near the 1dB compression point. Test the board-level microwave parameters of the verification object to verify the chip's board-level functional performance adaptability under different input power conditions.

[0066] Step 11, Plate-level thermal and mechanical environment verification and analysis. By controlling the input-output matching network, simulate the peripheral matching conditions of different users under various bias modes, and conduct temperature cycling tests, sinusoidal vibration, random vibration and shock tests on the verification object. Produce computer system production test curves and analysis reports;

[0067] Step 12, Comprehensive Evaluation: Combining the verification and evaluation results at the component level and board level, and based on the weight of each verification item, a comprehensive evaluation result of the microwave amplifier bare chip for aerospace applications is given.

[0068] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

[0069] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. An application verification system for a core microwave amplifier chip used in aerospace applications, characterized in that, This includes a host computer control system, a microwave verification equipment set, and microwave verification tooling; The host computer control system, based on the needs of aerospace application verification and the amplifier to be verified, controls the microwave verification equipment set and the corresponding test equipment of the microwave verification tooling to complete the test, and receives the total microwave test input and total microwave test output sent by the microwave verification equipment set and microwave verification tooling to complete the data analysis of the test results; The microwave verification equipment set includes the test equipment required for microwave amplifier application verification experiments. It is used to simulate the application peripheral matching environment of different aerospace users, receive control commands from the host computer control system, realize the control matrix for different test requirements, send the total microwave test input to the microwave verification fixture, and receive the total microwave test output sent by the microwave verification fixture. It displays the difference between the total microwave test output and the total microwave test input, and sends the total microwave test input and the total microwave test output to the host computer control system. The microwave verification fixture is used to provide an installation and testing environment for multiple verification objects and to perform atmospheric environment tests, mechanical environment tests, and temperature environment tests on the verification objects according to the received total microwave test input, as well as various corresponding microwave tests, and to send the total microwave test output to the microwave verification equipment set. The microwave verification fixture includes an atmosphere sealing chamber, a microwave verification matrix switching fixture, an atmosphere control console, an MCU control board, a power supply processing board, and a vibration temperature control console. An atmosphere-sealed enclosure is used to support the verification object and verification tooling. The microwave verification matrix switching fixture is installed inside an atmosphere-sealed enclosure to install multiple verification objects, enabling simultaneous microwave testing and electrical experiments on multiple verification objects. The atmosphere control console is used to receive control commands from the MCU control board to conduct atmospheric environment tests on the verification object. It verifies the hydrogen resistance by injecting hydrogen and monitoring the changes in device parameters through the host computer control system, and sends the test results to the microwave verification equipment set. The MCU control board is used to receive control commands from the host computer control system and to control the atmosphere control console and power processing board. The vibration temperature control console receives control commands from the MCU control board and is used to conduct mechanical and temperature environment tests on the verification sample, and send the test results to the microwave verification equipment set. The power processing board receives instructions from the MCU control board and supplies power to the verification object.

2. The application verification system for a core microwave amplifier chip for aerospace applications according to claim 1, characterized in that, The microwave verification equipment set includes an input matching network, an output matching network, a switch matrix, a vector network analyzer, a microwave signal source, a spectrum analyzer, a mismatch prevention device, and an oscilloscope; the total microwave test input is a set of different types of microwave signals determined according to the verification object; the total microwave test output is a set of different types of microwave signals generated after the total microwave test input passes through the verification object.

3. The application verification system for a core microwave amplifier chip for aerospace applications according to claim 2, characterized in that, The vector network analyzer, microwave signal source, spectrum analyzer, mismatch prevention device, and oscilloscope are connected to one end of the input matching network and the output matching network via a switch matrix, and the other end of the input matching network and the output matching network is connected to the microwave verification fixture.

4. The application verification system for a core microwave amplifier chip for aerospace applications according to claim 1, characterized in that, The microwave verification matrix switching fixture includes a switching matrix and several amplifier fixtures that serve as verification objects.

5. The application verification system for a core microwave amplifier chip for aerospace applications according to claim 3, characterized in that, The amplifier fixtures are all connected to the microwave verification equipment set via a switch matrix.

6. The application verification system for a core microwave amplifier chip for aerospace applications according to claim 1, characterized in that, The power processing board provides a protection circuit that first supplies negative power and then positive power during operation, and first shuts off positive power and then negative power after verification, thereby achieving electrical protection for the verification object.

7. The application verification method for the application verification system of a core microwave amplifier chip for aerospace applications according to any one of claims 1 to 6, characterized in that, include: The verification object is installed in the microwave verification matrix switching fixture, and the microwave verification equipment set is configured according to the preset test specifications and the microwave amplifier characteristic parameters of the verification object. The host computer control system controls the microwave verification equipment set and microwave verification fixtures to perform DC and microwave parameter tests on the verification object, stability factor tests of the process cutoff frequency, spectrum analysis of the process cutoff frequency, hydrogen resistance tests, mismatch resistance tests, lifetime tests under various operating conditions, device-level thermal environment tests, board-level functional tests, board-level electrical environment tests, and board-level thermodynamic environment tests, obtaining verification results of the bare microwave amplifier chip for aerospace applications.

8. The method according to claim 7, characterized in that, The DC and microwave parameter tests of the verification object include: the host computer control system calls the microwave verification equipment set through instructions to conduct DC and microwave parameter tests on the microwave amplifier of the verification object at 25℃, -55℃, and +125℃ according to preset conditions. The tested parameters include gain, amplitude frequency, output power, input and output standing wave ratio, 1dB gain compression point output power, and power-added efficiency; the parameters are interpreted, and the maximum, minimum, average, and standard deviation of each parameter are calculated to determine whether the parameters are qualified and consistent; the presence of abnormal points in gain and output power within the operating frequency band is identified, and if any are found, a warning is issued and the frequency points where they exist are recorded. The stability factor test of the process cutoff frequency includes: the host computer control system controls the microwave amplifier of the verification object to perform stability factor tests on the process cutoff frequency of the verification object chip from 10MHz to 110GHz at 25℃, -55℃ and +125℃ respectively using a vector network analyzer; during the test, the operating voltage is scanned within ±10%, and the S2P file is extracted and analyzed; the S2P file is sent to the host computer control system to determine the stability factor μ within the test full frequency band; if μ>1, the full frequency band is stable; if μ≤1, the frequency is recorded and a prompt analysis report is generated for the amplifier application engineer's reference; The spectrum analysis of the process cutoff frequency includes: the host computer control system controls the microwave amplifier chip of the verification object to perform spectrum analysis covering the process cutoff frequency band of the verification object chip from 10MHz to 110GHz at 25℃, -55℃ and +125℃ respectively using a spectrum analyzer; during the test, the operating voltage is scanned between ±10%, and three load modes are switched between open mode, short mode and 50Ω load mode respectively. The spectrum obtained by the test is sent to the host computer control system for analysis, and it is determined whether there is an abnormal spectrum in the die cutoff frequency band under the test conditions, which may cause microwave interference to the whole machine application, and a warning and analysis report are generated. The hydrogen resistance test includes: After assembling the bare chip of the microwave amplifier to be tested, it is installed without capping in the verification matrix switching fixture. The host computer control system performs the following operations sequentially: Negative and positive currents are supplied to the test object sequentially; the host computer control system issues a command to first raise the temperature of the base plate of the verification matrix switching fixture to 150°C, and after the operating current and temperature stabilize for 3 minutes, the atmosphere protection cover is closed; the atmosphere control console gradually injects hydrogen into the sealed microwave verification equipment and monitors the internal hydrogen content; timing begins after the hydrogen concentration reaches 20,000 ppm within 10 minutes; the computer monitors the operating current of each test object in real time and calculates the operating current based on the initial value I. D0 The rate of change and the time it takes for the rate of change to reach 10%, if the experiment lasts for 300 hours. D0 If the rate of change does not reach 10%, the experiment is stopped; hydrogen is withdrawn from the control atmosphere control console, the atmosphere protection cover is opened, the temperature of the verification matrix switching fixture base plate is reduced to room temperature, and then the positive and negative power supplies are turned off in sequence; The mismatch resistance test includes: the host computer control system controls the mismatch resistance device to conduct tests under test conditions with test saturated output power parameters at frequencies ranging from 10MHz to 110GHz, scanning a 360° phase; the return loss ratio is tested at 3:1, 5:1, 6:1, and ∞:1 respectively; after each test, microwave parameters such as gain, amplitude frequency, output power, input and output standing wave ratio, 1dB gain compression point output power, and power-added efficiency are tested; the test results are sent to the host computer control system for calculation and judgment. If the output power change |ΔPo| ≥ 1dB or the gain change |ΔGp| ≥ 1dB, or the rate of change of operating current |ID0 / ID0| ≥ 10%, the device fails; the mismatch ratio before the failure is the mismatch resistance capability of the tested object. The lifespan test under various operating conditions involves heating the centralized amplifier of the microwave verification equipment. The microwave amplifiers of the verification objects in the centralized microwave verification equipment are divided into three groups. Under the control of the host computer control system, lifespan is applied to the three groups of samples according to the constant power consumption mode of three different voltage and current intensities set by the computer. The duration of each temperature point is not less than 4 hours, and the interactive adjustment interval is Step=25℃. The stepping is continuously accelerated through interactive adjustment until the die burns out or other failure modes appear. The host computer control system calculates the corresponding lifespan based on the lifespan time of each group of samples and analyzes and compares the chip lifespan under various operating conditions. The device-level thermal environment test includes: conducting a temperature cycling limit test on the core microwave amplifier chip for aerospace applications, with the lowest temperature set at -65℃ and the highest temperature set at 150℃, the limit temperature held for 30 minutes, and the number of cycles 100. The test is performed in 100-cycle increments, and after each increment, the device is restored to room temperature to test the operating current and gain. The test ends when the cumulative cycle reaches 200 cycles or when the parameter of one sample exceeds the tolerance or fails. The board-level functional testing includes: the host computer control system calling the microwave verification equipment set through instructions, controlling the input / output matching network to simulate the peripheral matching conditions of different users in various bias modes, and performing DC and microwave parameter tests on the verification object microwave amplifier at 25℃, -55℃ and +125℃, including gain, amplitude frequency, output power, input and output standing wave ratio, 1dB gain compression point output power and power-added efficiency; interpreting the parameters; identifying whether there are abnormal points in gain and output power within the operating frequency band, issuing a warning if they exist, and recording the frequency points where they exist; The board-level electrical environment test includes: simulating the peripheral matching conditions of different users in various bias modes by controlling the input / output matching network; the host computer control system controls the signal source to apply an input power of -30dBm to the verification object, with the input power increments in 1dBm steps, pulling the bias to near the 1dB compression point, and testing the verification object's gain, amplitude-frequency response, output power, input / output standing wave ratio, output power at the 1dB gain compression point, and power-added efficiency; the test results are returned to the host computer control system to generate test curves and perform analysis. The plate-level thermodynamic environment test includes: the host computer control system calls the microwave verification equipment set matrix through instructions, controls the input-output matching network to simulate the peripheral matching conditions of different users in various bias modes, and conducts temperature change tests on the verification object from -40℃ to +70℃ at a temperature change rate of 3 to 5℃ / min. The test results are fed back to the host computer control system for processing to generate test curves and analysis reports. Sinusoidal vibration, random vibration, and shock tests are then conducted on the verification object according to the set magnitudes. After each test, the host computer control system controls the microwave verification equipment set to conduct microwave tests on the verification object and generates a test analysis report.

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