Refrigeration device for scanning magnetic detection systems

Abstract

This disclosure provides a cooling device for a scanning magnetic detection system, including a first support plate; a first gas supply assembly and a second gas supply assembly mounted on the upper side of the first support plate; a first enclosed chamber disposed on the lower side of the first support plate and surrounded by the first support plate, a first chassis opposite to the first support plate, and a first cylinder sealed between the first support plate and the first chassis; at least one stage of series cooling assembly disposed in the first enclosed chamber, each stage of series cooling assembly being configured to receive compressed cooling gas from the first gas supply assembly, and to cool the at least one stage of series cooling assembly step by step through the adiabatic expansion process of the compressed cooling gas; and a terminal cooling assembly disposed inside the first enclosed chamber and located below the last stage of series cooling assembly to further cool by utilizing the throttling process of circulating cooling gas from the second gas supply assembly.

Description

Technical Field

[0001] At least one embodiment of this disclosure relates to a scanning magnetic detection system, and more particularly to a cooling device for a scanning magnetic detection system suitable for measuring the magnetic characteristics of a sample in an ultra-low temperature environment. Background Technology

[0002] In low-temperature environments, materials often exhibit novel and unusual magnetic properties, such as magnetic transitions, the emergence of magnetic structures, and superconductivity, attracting researchers' attention. To understand the magnetic structure of materials at the microscopic scale and elucidate the mechanisms of magnetic interactions, many low-temperature magnetometry techniques have been developed, such as the superconducting quantum interference device (SSQUID), which infers the magnitude of magnetic flux by detecting changes in current in a superconducting loop, but requires the measuring device and the sample to operate in a low-temperature superconducting state; a spin-polarized scanning tunneling microscope (SP-STM) has also been proposed, which obtains information on surface spin electronic states and surface morphology by detecting the tunneling current between the tip and the sample surface, but requires low-temperature, ultra-high vacuum environmental conditions and conductive samples.

[0003] In recent years, with the continuous in-depth research on diamond NV centers, a scanning magnetic imaging system based on the diamond NV center magnetic field measurement device combined with an atomic force microscope has been proposed—the Diamond NV Center Atomic Force Microscope (QDAFM). Compared with the above-mentioned magnetic field measurement methods, QDAFM achieves high spatial resolution and high sensitivity magnetic detection, while its operating environment spans from low temperature to room temperature and from vacuum to high pressure. At the same time, diamond NV centers have advantages such as long coherence time, easy initialization, and readout, giving QDAFM a significant advantage among many magnetic field measurement methods.

[0004] QDAFM at room temperature is a mature technology, but QDAFM operating at low and ultra-low temperatures still has some shortcomings in practical operation. For example, existing cryogenic QDAFM devices generally use liquid nitrogen or liquid helium for cooling, which consumes a large amount of liquid helium, and the cryogenic constant temperature environment can only be maintained for 3-6 days; if liquid helium recovery and recycling are considered, it will lead to a series of complex structural designs. Summary of the Invention

[0005] To address the technical problems in the prior art, this disclosure provides a cooling device for a scanning magnetic detection system, which cools the sample to be tested to an ultra-low temperature state through gas cooling, thus achieving liquid-free cooling operation.

[0006] As one aspect of this disclosure, a cooling device for a scanning magnetic detection system is provided, comprising a first support plate, a first gas supply assembly and a second gas supply assembly, a first enclosed chamber, at least one stage of series cooling assembly, and a terminal cooling assembly. The first and second gas supply assemblies are mounted on the upper side of the first support plate; the first enclosed chamber is disposed on the lower side of the first support plate and is enclosed by the first support plate, a first chassis opposite to the first support plate, and a first cylinder sealed between the first support plate and the first chassis; at least one stage of series cooling assembly is disposed in the first enclosed chamber, each stage of series cooling assembly being configured to receive compressed cooling gas from the first gas supply assembly, and the at least one stage of the series cooling assembly being configured to perform stepwise cooling through the adiabatic expansion process of the compressed cooling gas; the terminal cooling assembly is disposed inside the second enclosed chamber and below the last stage of the series cooling assembly, to further cool to an ultra-low temperature state using a throttling process of circulating cooling gas from the second gas supply assembly.

[0007] According to embodiments of this disclosure, the terminal cooling assembly includes a second chamber and a first cooling assembly. The second chamber is disposed within a first enclosed chamber and is enclosed by a second support plate suitable for separating the last stage of the series-connected cooling assembly and the terminal cooling assembly, a second chassis opposite to the second support plate, and a second cylindrical body sealed between the second support plate and the second chassis. A connecting tube suitable for transmitting optical signals extends from the optical module of the scanning magnetic detection system through the first enclosed chamber and the second chamber to a third enclosed chamber located below the second chassis. The first cooling assembly is disposed within the second chamber.

[0008] According to an embodiment of this disclosure, the first cooling assembly includes a first air duct and a cooler. The first air duct passes through the first enclosed chamber from the second air supply assembly and enters the second chamber; the cooler is mounted on the second chassis, and the first air duct is partially wrapped around the cooler, so that the first air duct further cools the second chassis to an ultra-low temperature state through the cooler.

[0009] According to embodiments of this disclosure, the terminal cooling assembly further includes a needle valve and an adjusting rod. The needle valve is disposed on a first gas duct located within the second chamber; the adjusting rod extends from the upper part of the first support plate through the first enclosed chamber to the second chamber, and the adjusting rod is configured to adjust the opening degree of the needle valve to regulate the rate of cooling to the cryogenic environment.

[0010] According to an embodiment of this disclosure, the connecting tube includes a light guide and a cavity wall. The light guide is configured to transmit optical signals between the optical module and the probe module of the scanning magnetic detection system, and the light guide passes through the second chassis. The cavity wall is sleeved around the light guide, and the lower end of the cavity wall is sealed to the second chassis.

[0011] According to embodiments of this disclosure, at least one of the aforementioned tandem cooling components includes a second cooling component and a third cooling component. The second cooling component is configured to cool the first cooling plate 4512 to a first temperature of 40K; the third cooling component is configured to cool the second cooling plate 4522 to a second temperature of 4K.

[0012] According to embodiments of this disclosure, the second cooling assembly includes a first cooling cavity, a first cooling plate, a first air inlet pipe, and a first air outlet pipe. The first cooling cavity is disposed below the first support plate; the first cooling plate is disposed below the first cooling cavity, and the first cooling cavity is configured to cool the first cooling plate; the first air inlet pipe delivers compressed cooling gas from the first air supply assembly to the first cooling cavity; and the first air outlet pipe delivers a portion of the compressed cooling gas from the first cooling cavity to the first air supply assembly.

[0013] According to embodiments of this disclosure, the second cooling assembly further includes a first cooling conduction device, which includes a first cylindrical portion and a plurality of first elastic fins. The first cylindrical portion is connected to the outside of the first cooling cavity; the plurality of first elastic fins extend from the first cylindrical portion to the surface of the first cooling plate, and the first elastic fins are configured to conduct the cold energy of the first cooling cavity to the first cooling plate and to dampen the vibration of the first cooling cavity on the first cooling plate.

[0014] According to an embodiment of this disclosure, the second cooling assembly further includes a first auxiliary cooler mounted on the first cooling plate. A first air duct from the second air supply assembly is partially wound around the first auxiliary cooler, so that the first cooling plate cools the circulating cooling gas in the first air duct through the first auxiliary cooler.

[0015] According to embodiments of this disclosure, the third cooling assembly includes a second cooling chamber, a second cooling plate, a second air inlet pipe, and a second air outlet pipe. The second cooling chamber is disposed below the first cooling plate; the second cooling plate is disposed below the second cooling chamber, and the second cooling chamber is configured to cool the second cooling plate, which serves as a second support plate for the terminal cooling assembly; the second air inlet pipe delivers compressed cooling gas from the first air supply assembly and pre-cooled by the second cooling assembly to the second cooling chamber; the second air outlet pipe delivers the compressed cooling gas from the second cooling chamber through the first cooling chamber to the first air supply assembly.

[0016] According to embodiments of this disclosure, the third cooling assembly further includes a second cooling conduction device, which includes a second cylindrical portion and a plurality of second elastic fins. The second cylindrical portion is connected to the outside of the second cooling cavity; the plurality of second elastic fins extend from the second cylindrical portion to the surface of the second cooling plate, and the second elastic fins are configured to conduct the cold energy of the second cooling cavity to the second cooling plate and to dampen the vibration of the second cooling cavity on the second cooling plate.

[0017] According to an embodiment of this disclosure, the third cooling assembly further includes a second auxiliary cooler mounted on the second cooling plate. A first air duct from the second air supply assembly is partially wound around the second auxiliary cooler, so that the second cooling plate cools the circulating cooling gas in the first air duct through the second auxiliary cooler.

[0018] According to an embodiment of this disclosure, the cooling device further includes a third support plate installed below the first support plate, the first enclosed chamber passing through the third support plate, and a plurality of first vibration damping devices provided between the first support plate and the second support plate.

[0019] According to embodiments of this disclosure, each first vibration damping device includes an active vibration isolation strip.

[0020] According to an embodiment of this disclosure, the first gas supply assembly includes a cold head and a second vibration damping device. The cold head is configured to receive compressed refrigerant gas and deliver the compressed refrigerant gas to the second and third cooling assemblies; the second vibration damping device is installed between the cold head and the first support plate.

[0021] According to embodiments of this disclosure, the second vibration damping device includes a bellows or a spring.

[0022] According to embodiments of the present disclosure, the cooling device for a scanning magnetic detection system provides compressed cooling gas to at least one stage of cascaded cooling components via a first gas supply assembly for step-by-step cooling, and provides circulating cooling gas to the terminal cooling components via a second gas supply assembly for further cooling, thereby maintaining the sample located below the second chassis in an ultra-low temperature environment. The first gas supply assembly enables the recycling of compressed cooling gas, and the second gas supply assembly enables the recycling of circulating cooling gas, eliminating the need for a liquid medium for cooling operations. A third enclosed chamber filled with a thermally conductive gas transfers the cold energy from the second chassis to the sample area, thus placing the sample under test in an ultra-low temperature environment. Attached Figure Description

[0023] Figure 1 The diagram schematically illustrates a first-view perspective perspective of a scanning magnetic detection system according to an embodiment of the present disclosure;

[0024] Figure 2 A second perspective view of the scanning magnetic detection system according to an embodiment of the present disclosure is schematically shown;

[0025] Figure 3 A first-view perspective perspective view of a cooling apparatus according to an embodiment of the present disclosure is shown schematically;

[0026] Figure 4 A perspective view of a cooling device according to an embodiment of the present disclosure is shown schematically from a second perspective.

[0027] Figure 5 A side view of a cooling apparatus according to an embodiment of the present disclosure is shown schematically;

[0028] Figure 6 Schematic illustration based on Figure 5 A cross-sectional view of the refrigeration device AA shown;

[0029] Figure 7 A first-view perspective perspective view of the internal structure of the cooling device according to an embodiment of the present disclosure is shown schematically;

[0030] Figure 8 A second perspective view schematically illustrates the internal structure of the cooling device according to an embodiment of the present disclosure;

[0031] Figure 9 A third-view perspective view schematically illustrates the internal structure of the cooling device according to an embodiment of the present disclosure;

[0032] Figure 10 The diagram illustrates the three-stage cooling process of the refrigeration apparatus according to an embodiment of the present disclosure.

[0033] Figure 11A perspective view of the connecting pipe and the third chamber according to an embodiment of the present disclosure is shown schematically;

[0034] Figure 12 A schematic side view of the connecting pipe and the third chamber according to an embodiment of the present disclosure is shown.

[0035] Figure 13 Schematic illustration Figure 12 The connecting pipe and the third chamber are shown in a cross-sectional view.

[0036] Figure 14 A partial perspective view of the cavity wall interior of an embodiment of this disclosure is schematically shown;

[0037] Figure 15 A perspective view of the probe module and sample stage according to an embodiment of the present disclosure is shown schematically;

[0038] Figure 16 A first-view perspective perspective view of a probe module according to an embodiment of the present disclosure is schematically shown;

[0039] Figure 17 Schematic illustration Figure 16 A partial enlarged view of part A of the probe module shown;

[0040] Figure 18 A perspective view of the probe module according to an embodiment of the present disclosure is shown schematically from a second perspective.

[0041] Figure 19 A third-view perspective perspective view of a probe module according to an embodiment of the present disclosure is schematically shown;

[0042] Figure 20 A perspective view of a probe module according to an embodiment of the present disclosure is schematically shown from a fourth perspective.

[0043] Figure 21 A schematic block diagram illustrating the working principle of the launching component according to an embodiment of the present disclosure is shown.

[0044] Figure 22 A first-view perspective perspective view of the sample stage according to an embodiment of the present disclosure is shown schematically;

[0045] Figure 23 A perspective view of the sample stage according to an embodiment of the present disclosure is shown schematically from a second perspective.

[0046] Figure 24 A third-view perspective view of a sample stage according to an embodiment of the present disclosure is shown schematically;

[0047] Figure 25 A perspective view of an optical module according to an embodiment of the present disclosure is shown schematically;

[0048] Figure 26A first-view perspective perspective view of the internal structure of an optical module according to an embodiment of the present disclosure is shown schematically;

[0049] Figure 27 A second-view perspective perspective view schematically illustrates the internal structure of an optical module according to an embodiment of the present disclosure;

[0050] Figure 28 A first-view perspective perspective view of the internal structure of the optical module of an embodiment of the present disclosure, showing the components located on the sixth support disk;

[0051] Figure 29 The diagram schematically shows a second perspective view of the internal structure of the optical module of an embodiment of the present disclosure, with elements located on the sixth support disk.

[0052] Figure 30 A first-view perspective perspective view of the components located on the tenth support disk of the internal structure of the optical module according to an embodiment of the present disclosure is shown;

[0053] Figure 31 The diagram schematically illustrates a second perspective view of the internal structure of an optical module according to an embodiment of the present disclosure, showing elements located on a tenth support disk.

[0054] Figure 32 Schematic illustration Figure 31 A partial enlarged view of the components located on the tenth support disk of the internal structure of the optical module shown;

[0055] Figure 33 A block diagram illustrating the optical path of an embodiment of the present disclosure is shown schematically; and

[0056] Figure 34 A perspective view of an eddy current damping device according to an embodiment of the present disclosure is shown schematically.

[0057] Explanation of reference numerals in the attached figures:

[0058] 1-Magnetic field generation module;

[0059] 2-Optical module;

[0060] 21-Laser transmission unit;

[0061] 211 - First optical component;

[0062] 2111-First reflecting mirror; 2112-First dichroic mirror; 2113-Fourth optical coupler;

[0063] 212-Fiber optic flange; 213-Reflector assembly;

[0064] 22-Fluorescence detection unit;

[0065] 221 - Second optical component;

[0066] 2211-Second reflecting mirror; 2212-Fiber optic connector; 2213-Collider; 2214-Fourth adjustment assembly; 2215-Third reflecting mirror; 2216-Second convex lens; 2217-Fiber optic Z-axis displacement stage; 2218-Fiber optic X-axis displacement stage; 2219-Fiber optic Y-axis displacement stage; 2220-Second dichroic mirror; 2221-Fourth reflecting mirror; 2222-First filter;

[0067] 2223 - First convex lens; 2224 - Fifth reflecting mirror;

[0068] 222-Fluorescence detector;

[0069] 23-Light-emitting component; 24-Beam splitter; 25-Sixth reflecting mirror; 26-Fluorescence; 27-Imaging unit; 3-Sample stage;

[0070] 31 - Sample support stage;

[0071] 32 - Third Adjustment Component;

[0072] 321 - Second cantilever; 322 - Ninth support plate; 323 - Sample support frame;

[0073] 324-Third Z-axis driver; 3241-Second actuator; 3242-Second moving block;

[0074] 325 - Third elastic component; 326 - First Z-axis scanning stage; 327 - First XY-axis scanning stage; 328 - First XY-axis displacement stage;

[0075] 4-Refrigeration unit;

[0076] 41 - Third enclosed chamber;

[0077] 411 - First barrel; 412 - Second barrel;

[0078] 42-Connecting pipe;

[0079] 421 - Light guide tube;

[0080] 422 - Cavity wall; 4221 - Heat-conducting gas inlet / outlet;

[0081] 423 - Sealing joint;

[0082] 4231 - Corrugated pipe; 4232 - Joint;

[0083] 424 - Annular heat sink; 425 - Positioning block; 426 - Lifting sling;

[0084] 43-Cold head;

[0085] 44 - First enclosed chamber;

[0086] 441 - First chassis; 442 - First cylinder;

[0087] 45 - Series cooling unit;

[0088] 451 - Second cooling assembly;

[0089] 4511 - First cooling chamber; 4512 - First cooling plate; 4513 - First air intake pipe;

[0090] 4514 - First exhaust pipe; 4515 - First cooling device; 4516 - First cylindrical section;

[0091] 4517 - First elastic fin; 4518 - First auxiliary cooler;

[0092] 452 - Third cooling component;

[0093] 4521 - Second cooling chamber; 4522 - Second cooling plate; 4523 - Second air intake pipe;

[0094] 4524 - Second exhaust pipe; 4525 - Second cooling device; 4526 - Second cylinder section;

[0095] 4527 - Second elastic fin; 4528 - Second auxiliary cooler;

[0096] 46 - Terminal cooling components;

[0097] 461 - Second chamber;

[0098] 462-First cooling assembly; 4621-First air duct; 4622-Cooler;

[0099] 463 - Second cylinder; 464 - Needle valve; 465 - Adjusting rod;

[0100] 466 - Second Chassis;

[0101] 48-Second vibration damping device; 49-Circulation pump;

[0102] 5-Probe module;

[0103] 51-First support frame; 511-First elastic component;

[0104] 52-Second support frame; 521-Eighth support plate; 522-First cantilever;

[0105] 53-Probe assembly; 531-Objective lens;

[0106] 54 - Probe assembly;

[0107] 541-NV color center;

[0108] 542 - First Adjustment Component;

[0109] 5421 - First Z-axis displacement stage; 5422 - First Y-axis displacement stage; 5423 - First X-axis displacement stage; 5424 - Second elastic component; 5425 - First moving block; 5426 - First actuator;

[0110] 544 - Electrical connector; 545 - Quartz tuning fork; 546 - Objective lens XY axis scanning stage;

[0111] 55 - Electromagnetic wave transmitting assembly; 551 - Transmitting antenna;

[0112] 552 - Second Adjustment Component;

[0113] 5521 - Second Y-axis displacement stage; 5522 - Second Z-axis driver; 5523 - Second X-axis driver;

[0114] 6-Supporting device;

[0115] 61-First support plate; 62-Third support frame; 63-Fourth support frame; 64-Third support plate; 65-Fourth support plate; 66-Fifth support plate; 67-Sixth support plate; 68-Seventh support plate; 69-Fifth support frame; 610-Coupled plate; 611-Third elastic component; 612-Third cylinder;

[0116] 613-Eleventh support plate; 614-Base; 615-Sixth support frame; 616-Tenth support plate; 7-Eddy current vibration damping device;

[0117] 71-Metallic damping component; 72-Magnet;

[0118] 8-First vibration damping device. Detailed Implementation

[0119] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings. However, this disclosure can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art. In the accompanying drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated, and the same reference numerals denote the same elements throughout.

[0120] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0121] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0122] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0123] To facilitate understanding of the technical solutions disclosed herein by those skilled in the art, the following technical terms are explained.

[0124] When using expressions such as "at least one of A, B, and C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). Similarly, when using expressions such as "at least one of A, B, or C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0125] Figure 1 A first-view perspective perspective view of a scanning magnetic detection system according to an embodiment of the present disclosure is schematically shown. Figure 2 A second-view perspective perspective view of a scanning magnetic detection system according to an embodiment of the present disclosure is shown schematically.

[0126] The cooling device disclosed herein is suitable for scanning magnetic detection systems, such as... Figure 1 and Figure 2As shown, the scanning magnetic detection system includes a magnetic field generating module 1, an optical module 2, a sample stage 3, a cooling device 4, and a probe module 5. The magnetic field generating module 1 is used to generate a reference magnetic field. The optical module 2 is used to generate an excitation laser beam. The sample stage 3 is positioned in the reference magnetic field and is used to support the sample under test. The cooling module 4 is used to maintain the sample supported on the sample stage at any temperature within the range of ultra-low temperature to room temperature, in order to study the magnetic behavior of the sample during temperature changes; and the probe module 5 is used to detect the magnetic field information on the sample surface.

[0127] According to the scanning magnetic detection system of this disclosure, the magnetic field generation module is suitable for generating a reference magnetic field; the optical module is suitable for generating an excitation laser beam and collecting fluorescent photons emitted by nitrogen-vacancy centers and wide-field illumination imaging; the sample stage has a moving and leveling function, is set in the reference magnetic field, and is suitable for supporting the sample under test; the cooling module is suitable for providing a temperature environment in the range of low temperature to room temperature to study the magnetic behavior of the sample under test at different temperatures; and the probe module is suitable for receiving the excitation laser beam to excite nitrogen-vacancy centers in diamond, using a microwave antenna to radiate electromagnetic waves to modulate the quantum state of nitrogen-vacancy centers, using the optical module to detect the number of fluorescent photons emitted by nitrogen-vacancy centers, thereby obtaining the optical detection magnetic resonance spectrum of nitrogen-vacancy centers, and thus obtaining magnetic field information.

[0128] According to embodiments of this disclosure, cryogenic temperature refers to the final cooling temperature of the refrigeration device. The refrigeration module can provide a constant temperature environment within the range of cryogenic temperature to room temperature, such as 1.5 Kelvin (K), 4K, 70K, 200K, etc.

[0129] According to embodiments of this disclosure, the optically detected magnetic resonance (ODMR) spectrum of the NV color center is obtained by radiating electromagnetic waves through a microwave antenna and detecting the number of fluorescent photons emitted by the NV color center through an optical module, thereby obtaining the magnetic field information of the surface of the sample to be tested.

[0130] According to embodiments of this disclosure, the magnetic field generating module 1 includes a superconducting magnet for generating a uniform reference magnetic field in space that is adjustable in size and direction.

[0131] In one illustrative embodiment, optical module 2 generates a green excitation laser beam, and the NV color center emits red fluorescent photons, which are collected and counted by a fluorescence detection unit.

[0132] According to embodiments of this disclosure, the sample under test undergoes physical phenomena such as magnetic phase transition, magnetic structure generation, and superconductivity during temperature variation, resulting in changes in the stray magnetic field around the sample.

[0133] Figure 3 The illustration schematically shows a first-view perspective perspective view of a cooling apparatus according to an embodiment of the present disclosure. Figure 4The illustration schematically shows a second perspective view of the cooling apparatus according to an embodiment of the present disclosure. Figure 5 A side view of a cooling apparatus according to an embodiment of the present disclosure is shown schematically. Figure 6 Schematic illustration Figure 5 A cross-sectional view of the refrigeration device AA shown.

[0134] As one aspect of this disclosure, such as Figures 1 to 6 As shown, a cooling device 4 for a scanning magnetic detection system is provided, such as... Figures 3-6 As shown, the system includes a first support plate 61, a first gas supply assembly and a second gas supply assembly, a first enclosed chamber 44, at least one stage of series-connected cooling assembly 45, and a terminal cooling assembly 46. The first and second gas supply assemblies are mounted on the upper side of the first support plate 61. The first enclosed chamber 44 is located on the lower side of the first support plate 61 and is enclosed by the first support plate 61, a first chassis 441 opposite to the first support plate 61, and a first cylinder 442 sealed between the first support plate 61 and the first chassis 441. At least one stage of series-connected cooling assembly 45 is disposed in the first enclosed chamber 44. Each stage of series-connected cooling assembly is configured to receive compressed cooling gas from the first gas supply assembly and cool it step by step through the adiabatic expansion of the gas. The terminal cooling assembly 46 is disposed inside the first enclosed chamber 44 and below the last stage of series-connected cooling assembly to further cool the system to an ultra-low temperature state using a throttling process of circulating cooling gas from the second gas supply assembly.

[0135] According to embodiments of the present disclosure, the cooling device for a scanning magnetic detection system provides compressed cooling gas to at least one stage of cascaded cooling components via a first gas supply assembly to progressively cool a first enclosed chamber. A second gas supply assembly provides circulating cooling gas to the final cooling component for further cooling, thereby maintaining the sample located in a third enclosed chamber at an ultra-low temperature. The first gas supply assembly enables the recycling of compressed cooling gas, and the second gas supply assembly enables the recycling of circulating cooling gas, eliminating the need for a liquid medium for cooling operations and ensuring the sample under test in the scanning magnetic detection system remains in an ultra-low temperature environment.

[0136] Figure 7 This schematically illustrates a first-view perspective view of the internal structure of a cooling device according to an embodiment of the present disclosure. Figure 8 This schematically illustrates a second perspective view of the internal structure of the cooling device according to an embodiment of the present disclosure. Figure 9 A third-view perspective view of the internal structure of the cooling device according to an embodiment of the present disclosure is shown schematically.

[0137] According to embodiments of this disclosure, such as Figures 3 to 9As shown, the refrigeration device 4 also includes a cold head 43, which is mounted on the upper part of the first support plate 61 and is configured to receive compressed refrigerated gas. Furthermore, each stage of the series refrigeration assembly is configured to receive compressed refrigerated gas from the cold head 43.

[0138] According to an embodiment of this disclosure, the first sealed chamber 44 is in a vacuum state to prevent external heat from being transferred to the third sealed chamber 41.

[0139] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the terminal cooling assembly includes a second chamber 461 and a first cooling assembly 462. The second chamber 461 is disposed in a first enclosed chamber 44, and the first cooling assembly is disposed in the second chamber 461. The first cooling assembly 462 includes a first gas guide pipe 4621 and a cooler 4622. The second chamber 461 is surrounded by a second support plate (i.e., a second cooling plate 4522) suitable for separating the last-stage tandem cooling assembly and the terminal cooling assembly, a second base plate 466 opposite to the second support plate, and a second cylinder 463 sealed between the second support plate and the second base plate 466. The light guide pipe 421 of the connecting pipe 42 (described in detail later) extends through a first through hole formed on the second base plate 467 to a third enclosed chamber 41 (described in detail later). The lower end of the cavity wall 422 of the connecting pipe 42 (described in detail later) is sealed to the upper edge of the first through hole. The heat-conducting gas flows into the third enclosed chamber through the first through hole outside the light guide pipe. The first air guide pipe 4621 passes through the first closed chamber 44 from the first support plate 61 and enters the second chamber 461. The cooler 4622 is mounted on the second chassis 466, and the first air guide pipe 4621 is partially wrapped around the cooler 4622.

[0140] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the terminal cooling assembly 46 also includes a needle valve 464 and an adjusting rod 465. The needle valve 464 is disposed on a first air duct 4621 located in the second chamber, and the adjusting rod 465 extends from the upper part of the first support plate 61 through the first enclosed chamber 44 to the second chamber 461. The adjusting rod 465 is configured to adjust the opening of the needle valve 464 to regulate the rate at which the second chassis 466 is cooled to an ultra-low temperature.

[0141] According to an embodiment of the present disclosure, the second chamber 461 is connected to the first closed chamber 44 and is disposed within the first closed chamber 44.

[0142] According to an embodiment of this disclosure, the circulating cooling gas located in the first gas guide pipe is liquefied due to the action of at least one series cooling component. The opening of the regulating needle valve 464 increases, and the liquefied circulating cooling gas is rapidly cooled to an ultra-low temperature state by the degree of throttling. The cooling capacity of the first gas guide pipe is transferred to the second chassis 466 through the cooler, so that the second chassis 466 is cooled to an ultra-low temperature state.

[0143] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, at least one series cooling assembly 45 includes a second cooling assembly 451 and a third cooling assembly 452. The second cooling assembly 451 is configured to cool the first cooling plate 4521 to a first temperature of 40K, and the third cooling assembly is configured to cool the second cooling plate 4522 to a second temperature of 4K.

[0144] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the second cooling assembly 451 includes a first cooling chamber 4511, a first cooling plate 4512, a first air inlet pipe 4513, and a first air outlet pipe 4514. The first cooling chamber 4511 is disposed below the first support plate 61, and the first cooling plate 4512 is disposed below the first cooling chamber 4511. The first cooling chamber 4511 is configured to cool the first cooling plate 4512. The first air inlet pipe 4513 delivers compressed cooling gas from the first air supply assembly to the first cooling chamber 4511, and the first air outlet pipe 4514 delivers a portion of the compressed cooling gas from the first cooling chamber 4511 to the first air supply assembly.

[0145] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the second cooling assembly 451 further includes a first cooling conduction device 4515, which includes a first cylindrical portion 4516 and a plurality of first elastic fins 4517. The first cylindrical portion 4516 is connected to the outside of the first cooling cavity 4511, and the plurality of first elastic fins 4517 extend from the first cylindrical portion 4516 to the surface of the first cooling plate 4512. The first elastic fins 4517 are configured to conduct the cold energy of the first cooling cavity 4511 to the first cooling plate 4512 and to dampen the vibration of the first cooling cavity 4511 on the first cooling plate 4512.

[0146] In one illustrative embodiment, the first elastic fin 4517 is a soft copper braided strip that flexibly connects the first cooling cavity 4511 to the first cooling plate 4512.

[0147] According to embodiments of this disclosure, such as Figures 6 to 9As shown, the second cooling assembly 451 also includes a first auxiliary cooler 4518, which is installed on the first cooling plate 4512. The first air guide pipe 464 from the second air supply assembly is partially wrapped around the first auxiliary cooler 4518, so that the first cooling plate 4512 cools the first air guide pipe 464 through the first auxiliary cooler 4518.

[0148] In one illustrative embodiment, the first auxiliary cooler 4518 is made of a metal with good thermal conductivity (e.g., copper), is configured in a cylindrical shape, and is mounted on the first cooling plate to conduct the cooling energy of the first cooling plate 4512 to the first air duct, thereby cooling the circulating cooling gas in the first air duct.

[0149] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the third cooling assembly 452 includes a second cooling chamber 4521, a second cooling plate 4522, a second air inlet pipe 4523, and a second air outlet pipe 4524. The second cooling chamber 4521 is located below the first cooling plate 4512, and the second cooling plate 4522 is located below the second cooling chamber. The second cooling chamber 4521 is configured to cool the second cooling plate 4522, which serves as a second support plate for the terminal cooling assembly. The second air inlet pipe 4523 delivers compressed cooling gas from the second cooling assembly 451 to the second cooling chamber 4521, and the second air outlet pipe 4524 delivers the compressed cooling gas from the second cooling chamber 4521 through the first cooling chamber 4511 to the first air supply assembly.

[0150] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the first air guide pipe 4621 is partially wrapped around the second air intake pipe 4523, so that the second air intake pipe 4523 cools the first air guide pipe 4621, thereby further cooling the circulating cooling gas located in the first air guide pipe 4621.

[0151] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the third cooling assembly 452 also includes a second cooling device 4525, which includes a second cylindrical portion 4526 and a plurality of second elastic fins 4527. The second cylindrical portion 4526 is connected to the outside of the second cooling cavity 4521, and the plurality of second elastic fins 4527 extend from the second cylindrical portion 4526 to the surface of the second cooling plate 4522. The second elastic fins 4527 are configured to conduct the cold energy of the second cooling cavity 4521 to the second cooling plate 4522 and to reduce the vibration of the second cooling cavity 4521 on the second cooling plate 4522.

[0152] In one illustrative embodiment, the second elastic fin 4527 is a soft copper braided strip that flexibly connects the second cooling plate to the second cooling device.

[0153] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the third cooling assembly 452 also includes a second auxiliary cooler 4528, which is installed on the second cooling plate 4522. The first air duct 4621 from the second air supply assembly is partially wrapped around the second auxiliary cooler 4528, so that the second cooling plate cools the first air duct 4621 through the second auxiliary cooler 4518.

[0154] In one illustrative embodiment, the second auxiliary cooler 4528 is made of a metal with good thermal conductivity (e.g., copper), is constructed in a cylindrical shape, and is mounted on the second cooling plate 4522 to conduct the cooling capacity of the second cooling plate 4522 to the first air duct, so that the circulating cooling gas in the first air duct 4621 is further cooled and liquefied.

[0155] According to embodiments of this disclosure, the first gas supply assembly includes a compressor (not shown), a heat exchanger (not shown), and a rotary valve. The compressor and heat exchanger can be installed on the ground. The rotary valve is mounted on a first support plate 61, positioned between the cold head 43 and the compressor. The rotary valve serves as an inlet for high-pressure compressed refrigerant gas and an outlet for low-pressure compressed refrigerant gas, circulating the compressed refrigerant gas through the cold head 43 in at least one stage of series-connected refrigeration assembly. The second gas supply assembly includes a circulation pump 49 (e.g., a scroll pump). The circulating refrigerant gas is driven by the circulation pump. The circulating refrigerant gas liquefies after entering at least the last stage of series-connected refrigeration assembly, is further cooled after being throttled by a needle valve 464, and enters a cooler 4622 to cool the second chassis 466 to an ultra-low temperature state. After passing through the cooler 4622, the circulating refrigerant gas returns to the circulation pump 49 to begin the next cycle. After multiple cycles, the temperature of the final refrigeration assembly stabilizes and remains at an ultra-low temperature state.

[0156] According to embodiments of this disclosure, such as Figures 1 to 2 As shown, the second air supply assembly also includes a bellows, through which the circulation pump and the first air guide pipe 4621 are connected to reduce the impact of external vibrations on the scanning magnetic detection system. Furthermore, the first support plate 61 is also provided with multiple support blocks, which are used to support the bellows between the circulation pump 49 and the first air guide pipe.

[0157] Figure 10 The diagram illustrates a three-stage cooling process curve of the cooling device according to an embodiment of the present disclosure.

[0158] In one illustrative embodiment, the cooling device for the scanning magnetic detection system includes a two-stage tandem cooling assembly and a terminal cooling assembly. The first gas supply assembly provides compressed cooling gas of high-purity helium (99.999% purity). High-purity helium (99.999% purity), compressed by an external compressor, enters the cold head 43 through a high-pressure helium pipe, undergoes adiabatic expansion cooling, and then low-pressure helium returns from the cold head 43 to the compressor through a low-pressure helium pipe. After compression, the heat generated is carried away by an external heat exchanger, and after multiple cycles, it is cooled to a cryogenic state. The second gas supply assembly provides circulating cooling gas of helium, driven by a circulating pump 49. The circulating cooling gas liquefies upon entering the final tandem cooling assembly and is further cooled to an ultra-low temperature state by throttling through a needle valve 464. Figure 10 As shown, the horizontal axis represents time (h), and the vertical axis represents temperature (K). The cooling temperature of the first cooling plate 4512 is stable at 54.8K, the cooling temperature of the second cooling plate 4522 is stable at 3.6K, and the cooling temperature of the second chassis 466 is stable at 1.5K. Additionally, sealed heat-conducting gas is contained in the connecting pipe and the third enclosed chamber. Thus, the scanning magnetic detection system has three independently circulating or independently encapsulated cooling gas streams.

[0159] According to embodiments of this disclosure, a dry cooling method is provided for the cooling module, which consists of a multi-stage series cooling assembly and a terminal cooling assembly. The multi-stage series cooling assembly further cools the temperature based on the temperature state of the preceding stage cooling assembly, and the terminal cooling assembly further cools the temperature to an ultra-low temperature state based on the temperature state of the last stage series cooling assembly. Since dry cooling involves gas circulation, which can cause significant vibration, vibration damping measures are also designed into the cooling module.

[0160] In one illustrative experiment, the multi-stage series cooling assembly uses a two-stage pulse tube refrigerator, with each stage using helium as the cooling gas and utilizing the adiabatic expansion process of helium to cool down; the terminal cooling assembly uses a throttling circulation device, using helium as the circulating cooling gas and utilizing the throttling process of helium to cool down.

[0161] According to embodiments of this disclosure, such as Figures 1 to 2 As shown, the scanning magnetic detection system also includes a support device 6. The support device 6 further includes a base 614 and a sixth support frame 615. The magnetic field generating module 1 is mounted on the base 614. The optical module 2, sample stage 3, cooling device 4, and probe module 5 are mounted on the base 614 via the sixth support frame 615.

[0162] Furthermore, such as Figures 1 to 2As shown, the sixth support frame 615 is configured as a liftable support, and the sample stage 3 and probe module 5 are configured to extend or extend into the magnetic field generating module 1 as the sixth support frame 615 rises or falls.

[0163] According to embodiments of this disclosure, such as Figures 1 to 2 As shown, the scanning magnetic detection system also includes a limiting device suitable for limiting the maximum rising height of the sixth support frame 615.

[0164] Figure 11 A perspective view of the connecting pipe and the third enclosed chamber according to an embodiment of the present disclosure is shown schematically. Figure 12 A schematic side view of the connecting pipe and the third enclosed chamber according to an embodiment of the present disclosure is shown. Figure 13 Schematic illustration Figure 8 The diagram shows a cross-sectional view of the connecting pipe and the third enclosed chamber.

[0165] According to embodiments of this disclosure, such as Figures 3 to 6 As shown, the cooling device also includes a third sealed chamber 41, in which the probe module and the sample stage are disposed, and the third sealed chamber 41 contains a sealed heat-conducting gas.

[0166] According to an embodiment of this disclosure, the connecting tube 42 includes a light guide tube 421 and a cavity wall 422. The light guide tube 421 is configured to pass through the first support plate 61 to deliver the excitation laser beam to the probe module 5 and to deliver the fluorescence generated by the probe module 5 to the optical module 2. The cavity wall 422 is sleeved around the light guide tube 421, and an annular cooling space communicating with the third enclosed cavity 41 is formed between the cavity wall 422 and the light guide tube 421.

[0167] According to an embodiment of the present disclosure, the light guide tube 421 of the connecting tube 42 extends through a first through hole formed on the second chassis to a third closed chamber 41. The lower end of the chamber wall is sealed to the upper edge of the first through hole, and the heat-conducting gas flows into the third closed chamber 41 through the first through hole outside the light guide tube.

[0168] Figure 14 A partial perspective view of the cavity wall interior of an embodiment of the present disclosure is shown schematically.

[0169] According to embodiments of this disclosure, such as Figures 11 to 14 As shown, the connecting tube 42 also includes a sealing joint 423, suitable for sealing the upper end of the cavity wall 422 to the periphery of the light guide tube 421. Figures 6 to 9 As shown, the lower end of the light guide tube 421 extends from the cavity wall 422 into the closed probe module 5. The annular cooling space is connected to the interior of the probe module 5. The terminal cooling component transfers the cooling energy to the sample stage through the closed gas, so that the sample to be tested on the sample stage 3 is cooled to an ultra-low temperature.

[0170] According to embodiments of this disclosure, such as Figures 11 to 14 As shown, the sealing joint 423 includes a bellows 4231 and a connecting portion 4232. The upper end of the bellows 4231 is sealed to the seventh support plate 68 of the optical module 2 (described in detail later). The upper end of the connecting portion 4232 is sealed to the lower end of the bellows 4231, and the lower end of the connecting portion 4232 is sealed to the upper end of the cavity wall 422.

[0171] According to embodiments of this disclosure, such as Figure 13 and Figure 14 As shown, the connecting tube 42 also includes at least one annular heat sink 424, which is disposed between the light guide tube 421 and the cavity wall 422. The annular heat sink, which is shaped like a petal, is connected to the terminal cooling assembly by a soft copper braided strip to cool it down. This effectively prevents heat from the upper part of the annular heat sink in the third closed chamber from radiating to its lower part.

[0172] According to embodiments of this disclosure, such as Figure 13 and Figure 14 As shown, the connecting tube 42 also includes at least one annular positioning block 425, which is disposed between the light guide tube 421 and the cavity wall 422 to keep the cavity wall 422 and the light guide tube 421 coaxially arranged.

[0173] According to embodiments of this disclosure, such as Figure 13 and Figure 14 As shown, the connecting tube 42 also includes multiple slings 426 configured to suspend the annular heat sink 424 and the positioning block 425 onto the joint 4232. This allows the annular heat sink 424 and the positioning block 425 to correspond to the light guide tube 421 and / or the cavity wall 422, while maintaining the annular heat sink 424 and the positioning block 425 within a predetermined height range.

[0174] According to embodiments of this disclosure, such as Figures 7 to 9 As shown, the cavity wall 422 is provided with a cooling gas inlet / outlet 4221.

[0175] According to embodiments of this disclosure, optical signals are transmitted between the optical module and the probe module via a light guide. In an illustrative experiment, the optical signals refer to the green laser generated by the optical module, the yellow illumination light generated by the illumination component, the red fluorescent photons emitted by the nitrogen-vacancy color center in the probe module, and the yellow light reflected by the object to be illuminated.

[0176] In one illustrative experiment, carbon fiber was chosen as the material for the light guide tube. On the one hand, the high rigidity of the carbon fiber tube ensures a rigid connection between the optical module and the probe module, preventing the relative positions of the two modules from shifting during the cooling process. On the other hand, the poor thermal conductivity of the carbon fiber tube prevents heat from being conducted along the carbon fiber tube wall to the probe module, thus affecting the temperature state of the sample under test.

[0177] According to embodiments of this disclosure, at least a portion of the optical module, probe module, and sample stage are located within a third enclosed chamber. The third enclosed chamber is filled with a thermally conductive gas that conducts the cooling energy of the terminal cooling components to the sample stage, thereby cooling the sample to be tested located on the sample stage.

[0178] According to embodiments of this disclosure, the positioning block, the limiting sling, and the light guide tube are used to make the sling parallel to the light guide tube, which is beneficial for adjusting the light guide tube to be coaxial with the cavity wall.

[0179] According to embodiments of this disclosure, such as Figure 6 As shown, the probe module 5 and the sample stage 3 are disposed in the third sealed chamber 41, which contains sealed thermally conductive gas input through the thermally conductive gas inlet / outlet 4221. In this way, both the connecting pipe and the third sealed chamber 41 contain sealed thermally conductive gas, and the terminal cooling component conducts cold energy through the sealed thermally conductive gas to create an ultra-low temperature environment (e.g., 1.5K) in the third sealed chamber 41.

[0180] In one illustrative embodiment, helium, due to its excellent thermal conductivity, is used as the sealing heat-conducting gas. The helium transfers the cooling energy of the second chassis to the third sealed chamber 41, keeping the sample within the third sealed chamber 41 in an ultra-low temperature state. At room temperature, the pressure of the helium filling the third sealed chamber 41 is approximately 10 mbar. As the series cooling components and the terminal cooling components operate, the helium gradually cools to a stable state, maintaining the cryogenic constant temperature environment within the third sealed chamber 41.

[0181] According to embodiments of this disclosure, such as Figure 6 As shown, the third enclosed chamber 41 is formed by the second chassis 466 and the first barrel 411, and the first barrel 411 is configured to be detachably connected to the second chassis 466.

[0182] According to embodiments of this disclosure, such as Figure 6 As shown, the first barrel 411 is wrapped with multiple detachable second barrels 412. The second barrels 412 and the first barrel 411 are in a vacuum state. The multiple layers of second barrels can effectively prevent external heat from being conducted into the third closed chamber 41.

[0183] According to an embodiment of this disclosure, before using a scanning magnetic detection system to detect a sample, it is necessary to remove multiple second barrels 412 from the first barrel 411, place the sample on the sample stage 3, and then seal and install the first barrel 411 and multiple second barrels 412 in sequence.

[0184] According to embodiments of this disclosure, such as Figures 1 to 2As shown, the scanning magnetic detection system also includes a third support plate 616, which is installed below the first support plate 61. The third chamber 41 passes through the third support plate 616. A plurality of first vibration damping devices 8 are provided between the first support plate 61 and the third support plate 616 to prevent external vibrations (such as ground vibrations) from being transmitted to the optical module 2.

[0185] In one illustrative embodiment, each first damping device includes an active vibration isolation strip.

[0186] According to embodiments of this disclosure, such as Figures 6 to 9 As shown, the cold head 43 is connected to the first support plate 61 by a second vibration damping device 48 to isolate the vibration of the cold head 43 from the first support plate 61.

[0187] In one illustrative embodiment, the second damping device includes a bellows or a spring.

[0188] Figure 15 A perspective view of the probe module and sample stage according to an embodiment of the present disclosure is schematically shown.

[0189] According to embodiments of this disclosure, such as Figure 15 As shown, the probe module includes a first support frame 51, a second support frame 52, and a probe assembly 53. The first support frame 51 is mounted on the lower part of the second chassis 462, the second support frame 52 is mounted below the first support frame, and the sample stage 3 is movably mounted on the lower part of the second support frame 52. The probe assembly 53 is mounted on the second support frame 52 and located above the sample stage 3. A light guide tube 421 extends to the second support frame 52, and the probe assembly 53 includes an objective lens 531 attached to the lower end of the light guide tube 421.

[0190] According to an embodiment of this disclosure, the second support frame 52 is connected to the first support frame 51 via a plurality of first elastic members 511, and the lower end of the light guide tube is attached to the second support frame 52.

[0191] Figure 16 The diagram schematically illustrates a first-view perspective perspective view of a probe module according to an embodiment of the present disclosure. Figure 17 Schematic illustration Figure 16 A partially enlarged view of part A of the probe module shown. Figure 18 A perspective view of the probe module according to an embodiment of the present disclosure is schematically shown from a second angle. Figure 19 This schematically illustrates a third-view perspective view of a probe module according to an embodiment of the present disclosure. Figure 20 A fourth-view perspective perspective view of a probe module according to an embodiment of the present disclosure is schematically shown.

[0192] According to embodiments of this disclosure, such as Figures 15 to 20As shown, the probe assembly 53 also includes a probe assembly 54 and an electromagnetic wave emitting assembly 55. The probe assembly 54 is movably mounted on the second support frame 52, as shown... Figure 17 As shown, the NV color center 541 of the probe assembly 54 is located at the focal point of the objective lens 531. The electromagnetic wave emitting assembly 55 is movably mounted on the second support 52 and is configured to emit electromagnetic waves toward the NV color center 541 to manipulate the spin state of the NV color center.

[0193] A diamond nitrogen-vacancy (NV-) center is a structure in which one of two adjacent carbon (C) sites is replaced by a nitrogen (N) atom, while the other is missing. The N atom provides two electrons, and the three adjacent C atoms each provide one unpaired electron, plus one additional captured electron, for a total of six electrons. This structure carries a negative charge and is also denoted as NV-. In this disclosure, NV- centers specifically refer to NV-.

[0194] According to embodiments of this disclosure, the optical module can detect the number of fluorescent photons emitted by the NV color center, and the electromagnetic wave emitting component can emit electromagnetic waves of different frequencies to the NV color center via a microwave antenna. By recording the electromagnetic wave frequency and the corresponding number of fluorescent photons at that frequency, the photodetector magnetic resonance spectrum of the NV color center can be obtained, thereby obtaining magnetic field information.

[0195] According to embodiments of this disclosure, such as Figure 17 As shown, the probe assembly 54 consists of a diamond containing an NV color center 541 bonded to a quartz tuning fork 545. The NV color center 541 serves as a spin sensing unit to detect the magnetic field. The quartz tuning fork is a piezoelectric material. Applying an excitation voltage to the quartz tuning fork through electrode leads can achieve the vibration of the quartz tuning fork. At the same time, monitoring the feedback voltage can determine the amplitude of the quartz tuning fork's vibration.

[0196] According to embodiments of this disclosure, such as Figures 15 to 20 As shown, the second support frame 52 includes an eighth support plate 521 and a plurality of first cantilever arms 522. The eighth support plate is mounted on the light guide tube 421, and the plurality of first cantilever arms 522 extend downward from the lower part of the eighth support plate 521. The lower end of the first elastic member 511 is connected to the first cantilever arms 522.

[0197] According to embodiments of this disclosure, such as Figures 15 to 20 As shown, the probe assembly 54 also includes a first adjustment assembly 542, mounted on a plurality of first cantilever 522 of the second support 52, and configured to adjust the position of the NV color center according to the objective focal position shown in the image.

[0198] According to embodiments of this disclosure, such as Figures 15 to 20As shown, the first adjustment assembly includes a first Z-axis displacement stage 5421, a first Y-axis displacement stage 5422, and a first X-axis displacement stage 5423. The first Z-axis displacement stage 5421 is mounted on the second support frame 52 and configured to generate displacement in the Z-axis direction relative to the second support plate. The first Y-axis displacement stage 5422 is mounted on the first Z-axis displacement stage to move along with it in the Z-axis direction, and is configured to generate displacement in the Y-axis direction relative to the second support plate. The first X-axis displacement stage 5423 is mounted on the first Y-axis displacement stage to move along with it in the Y-axis direction, and is configured to generate displacement in the X-axis direction relative to the second support plate. The first support assembly is mounted on the first X-axis displacement stage to move along with it in the X-axis direction.

[0199] According to embodiments of this disclosure, such as Figure 16 As shown, the X-axis and Y-axis represent two mutually perpendicular directions in a plane that is horizontal to the second chassis 466, and the Z-axis represents a direction perpendicular to the second chassis 466.

[0200] According to embodiments of the present disclosure, each of the first Y-axis displacement stage and the first X-axis displacement stage includes a piezoelectric ceramic component.

[0201] According to embodiments of this disclosure, such as Figures 15 to 20 As shown, the first Z-axis displacement stage includes a first moving block 5425 and a first actuator 5426. The first moving block 5425 is suspended below the second support frame 52 by a second elastic member 5424, and the first Y-axis displacement stage is mounted on the first moving block 5425. The first actuator 5426 is mounted on the second support frame 52 and is configured to drive the first moving block 5425 to move in the Z-axis direction against the elastic force of the second elastic member 5424.

[0202] According to embodiments of this disclosure, the first actuator includes an electromagnetic driver.

[0203] According to embodiments of this disclosure, such as Figures 15 to 20 As shown, the second elastic component 5424 is installed on both sides of the first moving block 5425. Due to the heavy load of the first moving block 5425, it will be unable to move even at the maximum driving voltage. Therefore, the second elastic component 5424 is connected to both sides of the first moving block. The second elastic component is in a stretched state to balance the load. A first actuator 5426 is added. The extension and retraction of the first actuator 5426 realizes the movement of the color center in the Z-axis direction and moves with the first moving block as the guide.

[0204] According to embodiments of this disclosure, such as Figures 15 to 20As shown, the probe assembly also includes a second adjustment assembly 552, mounted on a plurality of first cantilever 522 of the second support frame 52, and configured to adjust the position of the transmitting antenna 551 of the electromagnetic wave transmitting assembly 55 relative to the NV color center according to the position state of the transmitting antenna 551 of the electromagnetic wave transmitting assembly 55 shown in the image.

[0205] According to embodiments of this disclosure, such as Figures 15 to 20 As shown, the second adjustment assembly 552 includes a second Y-axis displacement stage 5521, a second Z-axis displacement stage 5522, and a second X-axis displacement stage 5523. The second Y-axis displacement stage 5521 is mounted on the second support frame 52 and configured to cause displacement of the electromagnetic wave emitting assembly in the Y-axis direction relative to the second support frame 52. The second Z-axis displacement stage 5522 is mounted on the second Y-axis displacement stage to cause displacement of the electromagnetic wave emitting assembly in the Z-axis direction. The second X-axis displacement stage 5523 is mounted on the second Z-axis displacement stage to cause displacement of the electromagnetic wave emitting assembly in the X-axis direction. The second support assembly is mounted on the second X-axis displacement stage.

[0206] According to embodiments of this disclosure, each of the second Z-axis driver, the second Y-axis driver, and the second X-axis driver includes a piezoelectric ceramic component.

[0207] According to embodiments of this disclosure, such as Figures 15 to 20 As shown, the probe assembly also includes: an objective lens XY-axis scanning stage 546, which is mounted on the lower part of the second support frame 52 and axially aligned with the light guide tube 421; an objective lens 531 is mounted on the lower part of the objective lens XY-axis scanning stage 546; and the objective lens XY-axis scanning stage is configured to drive the objective lens to move in the XY-axis direction.

[0208] According to embodiments of this disclosure, the objective lens XY-axis scanning stage 546 employs piezoelectric ceramic components, enabling nanometer-scale movement.

[0209] According to embodiments of this disclosure, the objective lens is used to converge the excitation laser beam and collect the fluorescence emitted by the NV color center. Since the NV color center is atomically small, the objective lens is precisely moved using the objective lens XY axis scanning stage 546 so that the focal point of the objective lens coincides with the NV color center.

[0210] Figure 21 A block diagram illustrating the working principle of the transmitting component according to an embodiment of the present disclosure is shown.

[0211] According to embodiments of this disclosure, such as Figure 21As shown, the electromagnetic wave transmitting assembly 55 also includes an external wave source, an external microwave switch, an external amplifier, and an external matching resistor. The output waveform, amplitude, and frequency parameters of the external wave source are set, and the external microwave switch controls the on / off state of the electromagnetic wave transmitting assembly 55. After being amplified by the external amplifier, the wave passes through the electrical flange interface on the first support plate 61 into the second chamber 44. From the second chamber 44, it passes through the first cooling plate 4512, the second cooling plate 4522, and the second chassis 466 into the third chamber 41, reaching the electromagnetic wave transmitting assembly 55. It then exits the second chamber 44 through the electrical flange interface on the first support plate 61. An external matching resistor (e.g., 50Ω) is connected to enable the transmitting antenna 551 to emit electromagnetic waves to modulate the quantum state of the NV color center.

[0212] According to embodiments of this disclosure, such as Figure 16 and Figure 17 As shown, the transmitting antenna 551 consists of a semi-circular copper wire with a diameter of tens of micrometers wound around the two electrodes of a printed circuit board (PCB). The radius of the semi-circle can be, for example, 1 mm. The PCB is fixed on the second support frame 52. The spatial position of the transmitting antenna 551 relative to the NV color center is adjusted by the second adjustment component 552, so that the transmitting antenna generates a uniformly distributed electromagnetic wave in the region where the NV color center is located, thereby modulating the quantum state of the NV color center. Figure 22 The illustration schematically shows a first-view perspective perspective view of the sample stage according to an embodiment of the present disclosure. Figure 23 The diagram schematically illustrates a second perspective view of the sample stage according to an embodiment of the present disclosure. Figure 24 A third-view perspective view of a sample stage according to an embodiment of the present disclosure is shown schematically.

[0213] According to embodiments of this disclosure, such as Figures 22 to 24 As shown, the sample stage 3 includes a sample support stage 31 and a third adjustment assembly 32. The third adjustment assembly 32 is mounted on the second support frame 52 and is configured to adjust the orientation of the sample support stage according to the orientation of the sample shown in the image.

[0214] According to embodiments of this disclosure, such as Figures 22 to 24As shown, the third adjustment assembly 32 includes multiple second cantilever arms 321, a ninth support plate 322, a sample support frame 323, and three third Z-axis actuators 324. The multiple second cantilever arms 321 are detachably connected to the lower ends of the first cantilever arms 522. The ninth support plate 322 is mounted on the lower ends of the second cantilever arms. The sample support frame 323 is movably disposed inside the second cantilever arms 321. A sample support stage 31 is mounted on the sample support frame to support the sample to be tested. The three third Z-axis actuators 324 are mounted on the ninth support plate and arranged in an equilateral triangle in a horizontal spatial plane. The three third Z-axis actuators are located at the three vertices of the equilateral triangle. The third Z-axis actuators 324 respectively drive the sample support frame 323 to move in the Z-axis direction, thereby adjusting the position and angle of the sample to be tested in the Z-axis direction.

[0215] According to an embodiment of this disclosure, the sample stage is connected to the probe module via a second cantilever, enabling the diamond nitrogen-vacancy color centers located in the probe module to detect the magnetic field information on the sample surface.

[0216] According to an embodiment of this disclosure, the displacement stage and scanning stage in the third adjustment assembly are supported by a ninth support plate.

[0217] According to embodiments of this disclosure, the Z-axis position and spatial angle of the sample are adjusted by a third Z-axis actuator. In an illustrative experiment, the third Z-axis actuator consists of three second actuators arranged in an equilateral triangle. The three second actuators move simultaneously to adjust the Z-axis position of the sample; individual second actuators move to change the tilt state of the sample.

[0218] According to embodiments of this disclosure, each third Z-axis driver 324 includes a second actuator 3241 and a second moving block. The second actuator is mounted on a ninth support plate 322, and the second actuator adjusts the position of the sample support frame via the second moving block.

[0219] According to an embodiment of this disclosure, a second actuator presses against a second moving block, and movement in a single-axis direction is achieved by using a guide rail in the second moving block as a guide.

[0220] According to an embodiment of the present disclosure, a plurality of third elastic members 325 are provided between the ninth support plate 322 and the sample support frame 323, each adjacent to the second moving block.

[0221] In one illustrative embodiment, the sample support frame 323 and the ninth support plate 322 are connected by three springs.

[0222] According to embodiments of this disclosure, such as Figures 22 to 24As shown, the third adjustment assembly further includes a first Z-axis scanning stage 326, a first XY-axis scanning stage 327, and a first XY-axis displacement stage 328. The stacked first Z-axis scanning stage 326, first XY-axis scanning stage 327, and first XY-axis displacement stage 328 are installed between the sample support stage 31 and the sample support frame 323. The first Z-axis scanning stage 326 is configured to drive the sample support stage to move in the Z-axis direction with a first preset accuracy, the first XY-axis scanning stage 327 is configured to drive the sample support stage to move in the XY-axis direction with a first preset accuracy, and the first XY-axis displacement stage 328 is configured to drive the sample support stage to move in the XY-axis direction with a second preset accuracy. In one illustrative embodiment, the first preset accuracy is at the nanometer level, and the second preset accuracy is at the hundred-micrometer level. According to embodiments of this disclosure, adjusting the spatial position and placement angle of the sample using the third adjustment assembly includes 5D movement and 3D scanning, namely: XYZ-axis movement and two-angle position adjustment, and XYZ-axis scanning.

[0223] According to an embodiment of this disclosure, the sample stage consists of a sample support platform and a third adjustment component. The sample support platform supports the sample to be tested, and the third adjustment component adjusts the spatial position and placement angle of the sample.

[0224] According to embodiments of this disclosure, such as Figures 22 to 24 As shown, each third Z-axis driver contains a piezoelectric ceramic component that moves guided by the second moving block.

[0225] According to embodiments of this disclosure, such as Figures 22 to 24 As shown, a plurality of electrical connectors 544 are also provided on the second support frame 52, which are respectively suitable for electrical connection of the first adjustment component, the second adjustment component and the third adjustment component.

[0226] Figure 25 A perspective view of an optical module according to an embodiment of the present disclosure is shown schematically. Figure 26 This schematically illustrates a first-view perspective perspective view of the internal structure of an optical module according to an embodiment of the present disclosure. Figure 27 A second-view perspective perspective view of the internal structure of an optical module according to an embodiment of the present disclosure is shown schematically.

[0227] According to embodiments of this disclosure, such as Figures 25 to 27As shown, optical module 2 includes a laser transmission unit 21, a fluorescence detection unit 22, and an imaging unit 27. The laser transmission unit 21 includes a first optical component 211, adapted to transmit the excitation laser beam generated by the laser to the light guide tube. The fluorescence detection unit 22 includes a second optical component 221 and a fluorescence detector 222. The second optical component 221 is adapted to further transmit the fluorescence transmitted via the objective lens 531 and the light guide tube 421, and the fluorescence detector 222 is adapted to detect the fluorescence transmitted via the second optical component 221. The imaging unit 27 is adapted to obtain images of the sample, the NV color center, and the position of the electromagnetic wave emitting component through the light guide tube 421 and the objective lens.

[0228] According to embodiments of this disclosure, fluorescent photons emitted from diamond nitrogen-vacancy color centers and transmitted through the first and second optical components are detected by a fluorescence detector to obtain the number of photons detected per second.

[0229] According to embodiments of this disclosure, such as Figures 25 to 27 As shown, the optical module 2 also includes a light-emitting component 23, which emits illumination light to light up a portion of the area inside the vacuum cavity. In one illustrative experiment, the light-emitting component is selected to emit yellow light based on the excitation wavelength of the diamond nitrogen-vacancy color center and the wavelength of the emitted fluorescent photons.

[0230] According to embodiments of this disclosure, the light-emitting component includes an LED lamp.

[0231] According to embodiments of this disclosure, an image is displayed on a portion of the vacuum cavity illuminated by the light-emitting component using a camera unit, so as to adjust the position of each component in the scanning magnetic detection experiment based on the image information.

[0232] According to embodiments of this disclosure, such as Figures 1 to 2 and Figures 25-26As shown, the support device also includes a third support frame 62, a fourth support frame 63, a tenth support plate 64, a fourth support plate 65, a fifth support plate 66, and a sixth support plate 67. The third support frame 62 is mounted on the first support plate 61, the fourth support frame 63 is disposed on the third support frame 62, the tenth support plate 64 is mounted on the upper end of the fourth support frame 63, the fourth support plate 65 is disposed above the tenth support plate 64, the fifth support plate 66 is mounted on the lower end of the fourth support frame 63, and the sixth support plate 67 is mounted on the fourth support frame 63 between the upper and lower ends. The laser transmission unit also includes an optical fiber flange 212, which is mounted on the fourth support plate 65. One end of the optical fiber flange 212 is connected to an external laser through a first optical fiber (not shown in the figure) to receive the excitation laser beam generated by the laser. The other end of the optical fiber flange 212 is connected to the first reflector 2111 of the first optical component 211, which is located on the sixth support plate 67, through a second optical fiber (not shown in the figure), so that the excitation laser beam generated by the laser is input into the light guide tube 421 through the first optical component 211.

[0233] In one illustrative embodiment, the first and second optical fibers may include single-mode fiber patch cords.

[0234] According to an embodiment of this disclosure, a first optical fiber in an atmospheric environment and a second optical fiber in a vacuum environment are connected by an optical fiber flange 212, thereby enabling the transmission of an excitation laser beam from the first optical fiber into the vacuum cavity.

[0235] According to embodiments of this disclosure, fluorescent photons emitted from diamond nitrogen-vacancy color centers are transmitted to the detector target surface via a second optical component.

[0236] Figure 28 This schematically illustrates a first-view perspective perspective view of the internal structure of the optical module of an embodiment of the present disclosure, showing the components located on the sixth support disk. Figure 29 The diagram schematically shows a second perspective view of an element located on a sixth support disk representing the internal structure of an optical module according to an embodiment of the present disclosure.

[0237] According to embodiments of this disclosure, such as Figures 25 to 28 As shown, the first optical component 211 also includes a first dichroic mirror 2112 and a fourth optical coupler 2113, respectively disposed on the sixth support disk 67. The fourth optical coupler 2113 receives the excitation laser beam transmitted through the second optical fiber and combines the excitation laser beam with the first reflector 2111. The first reflector 2111 reflects the excitation laser beam to the first dichroic mirror 2112, which is configured to reflect almost entirely the excitation laser beam and transmit almost entirely the fluorescence. It is understood that a through-hole is provided on the sixth support disk 67 below the first dichroic mirror 2112 to allow the fluorescence and / or excitation laser beam to pass through.

[0238] Figure 30 This schematically illustrates a first-view perspective perspective view of the components located on the tenth support disk of the internal structure of the optical module according to an embodiment of the present disclosure. Figure 31 The diagram schematically illustrates a second perspective view of the internal structure of an optical module according to an embodiment of the present disclosure, showing elements located on a tenth support disk.

[0239] Figure 32 Schematic illustration Figure 31 A partial enlarged view of the components located on the tenth support disk of the internal structure of the optical module shown.

[0240] According to embodiments of this disclosure, such as Figures 25 to 31 As shown, the second optical component 221 includes a second reflector 2211, an optical fiber connector 2212, and a collimator 2213. The second reflector 2211 is mounted on the tenth support disk 64 and is configured to reflect fluorescence transmitted by the light guide tube 421. The optical fiber connector 2212 is mounted on the tenth support disk 64, and its first end receives the fluorescence reflected by the second reflector 2211. The collimator 2213 is mounted on the fourth support disk 65, and its upper end is coupled to the fluorescence detector 222. The lower end of the collimator 2213 is optically coupled to the second end of the optical fiber connector 2212 via a third optical fiber.

[0241] According to embodiments of this disclosure, fluorescent photons emitted from the diamond nitrogen-vacancy color center are first transmitted through the reverse optical path of the first optical component, then transmitted through the first dichroic mirror into the second optical component. The second mirror then reflects the fluorescent photons transmitted through the first dichroic mirror.

[0242] According to embodiments of this disclosure, fluorescent photons are received and transmitted via optical fiber connectors and optical fiber guidance, which can effectively avoid photon loss during transmission.

[0243] According to embodiments of this disclosure, a collimator receives fluorescent photons transmitted from a third optical fiber and collimates and outputs them as parallel light.

[0244] In one illustrative embodiment, the third optical fiber may include an SMA fiber.

[0245] According to embodiments of this disclosure, such as Figures 25 to 32As shown, the second optical component 221 also includes a third reflecting mirror 2215 and a transmission channel, respectively mounted on the fourth support disk 65. The fluorescence transmitted via the collimator 2213 is reflected by the third reflecting mirror 2215 and then focused onto the target surface of the fluorescence detector by the second convex lens 2216, where it is detected by the fluorescence detector. In one illustrative embodiment, the second optical component may further include a long-pass filter disposed between the second convex lens 2216 and the fluorescence detector, suitable for filtering out stray light below the wavelength of the fluorescence photons emitted by the NV color center, thereby improving the signal-to-noise ratio of the measurement.

[0246] According to embodiments of this disclosure, the fluorescence detector includes a single-photon detector.

[0247] According to embodiments of this disclosure, such as Figures 26 to 31 As shown, the laser transmission unit 21 also includes a reflector group 213, which is disposed on the fifth support disk 66 and / or the sixth support disk 67. It is suitable for reflecting the excitation laser beam, fluorescence and illumination light multiple times, so that the excitation laser beam and illumination light enter the light guide tube 421 and the fluorescence transmitted by the light guide tube 421 enters the second reflector 2211.

[0248] In one illustrative embodiment, the mirror assembly 213 includes three mirrors, which are mounted on the fifth support plate 65 and the sixth support plate 67 via brackets, respectively.

[0249] According to an embodiment of this disclosure, the excitation laser reflected by the first dichroic mirror is transmitted into the light guide tube through a reflector group, and the optical path is adjusted to be concentric with the light guide tube.

[0250] Figure 33 A block diagram of the optical path according to an embodiment of the present disclosure is shown schematically.

[0251] According to embodiments of this disclosure, such as Figure 33 As shown, G01 represents the path of the excitation laser beam, G02 represents the path of the fluorescence optical path, and G03 represents the optical path of the camera unit.

[0252] According to embodiments of this disclosure, such as Figures 25 to 33 As shown, an external laser transmits the excitation laser beam to the fiber optic flange 212 located on the fourth support plate 65 via a first optical fiber. It then connects to the fourth optical coupler 2113 located on the sixth support plate 67 via a second optical fiber. After reflection by the first reflecting mirror 2111 and the first dichroic mirror 2112 mounted on the sixth support plate 67, the excitation laser beam is reflected to the mirror assembly 213 located on the fifth support plate 66. After multiple reflections by the mirror assembly 213, the excitation laser beam is transmitted to the light guide tube 421. Finally, after being focused by the objective lens 531 located below the light guide tube 421, the excitation laser beam illuminates the NV color center 541 located below the objective lens 531.

[0253] According to embodiments of this disclosure, such as Figures 25 to 33 As shown, after receiving the excitation laser beam, the NV color center emits fluorescence with a wavelength different from that of the excitation laser beam. The fluorescence is transmitted through the objective lens 531 located in the probe module 5 and the light guide tube 421 located above the objective lens 531. After multiple reflections by the reflector group 213 located on the fifth support disk 66, it is transmitted to the first dichroic mirror 2112 on the sixth support disk 67. The first dichroic mirror 2112 transmits almost all of the fluorescence, allowing it to be transmitted to the second reflector 2211 located on the tenth support disk 64. After being reflected by the second reflector 2211, the fluorescence is almost entirely transmitted by the second dichroic mirror 2220, reflected by the fourth reflector 2221, filtered by the first filter 2222, focused by the first convex lens 2223, and reflected by two fifth reflectors 2224 to the fiber optic connector 2212. Then, the fluorescence is transmitted through the third optical fiber to the collimator 2213 located on the fourth support disk 65, and then to the third reflector 2215. After being converged by the second convex lens 2216, it is detected by the fluorescence detector.

[0254] According to embodiments of this disclosure, a first filter is used to filter out light below the wavelength of fluorescent photons, thereby improving the signal-to-noise ratio of the detector.

[0255] According to embodiments of this disclosure, such as Figures 25 to 27 As shown, the support assembly 6 also includes an eleventh support disk 613, which is disposed on the fourth support disk 65. The light-emitting component 23 and the camera unit 27 are respectively mounted on the eleventh support disk 613.

[0256] In one illustrative embodiment, the camera unit 27 is a CCD camera.

[0257] According to embodiments of this disclosure, such as Figures 25 to 27 As shown, the optical module 2 includes a third convex lens (not shown in the figure), a beam splitter 24, and a sixth reflecting mirror 25, which are respectively mounted on the eleventh support disk 613.

[0258] According to embodiments of this disclosure, such as Figures 25 to 33As shown, the detection light emitted by the light-emitting component is reflected by the beam splitter 24 and the sixth reflector 25 on the eleventh support disk 613, and passes through the second dichroic mirror 2220 on the tenth support disk 64, the first dichroic mirror 2112 on the sixth support disk 67, and then reflected by the reflector group on the fifth support disk 66. It then illuminates the sample stage, part of the probe assembly, and part of the electromagnetic wave emitting assembly via the light guide tube 421 and the objective lens 531. The illumination light is reflected by the above-mentioned area, passes through the objective lens 531 and the light guide tube 421, and then by the reflector group on the fifth support disk 66. It then passes through the first dichroic mirror 2112 on the sixth support disk 67, the second dichroic mirror 2220 on the tenth support disk 64, and the sixth reflector 25 on the eleventh support disk 613. It then passes through the beam splitter 24 on the eleventh support disk 613 and is focused by the third convex lens onto the imaging unit 27 to acquire and image the area.

[0259] According to embodiments of this disclosure, the beam splitter reflects 50% of the transmitted light and transmits 50%. In an illustrative experiment, the beam splitter reflects the yellow light emitted by the light-emitting component and transmits the light reflected back from the object to be illuminated.

[0260] According to an embodiment of this disclosure, the light reflected from the object to be illuminated is reflected into the beam splitter via a sixth reflecting mirror.

[0261] According to embodiments of this disclosure, such as Figure 30 and Figure 31 As shown, the second optical component also includes a fourth adjustment component 2214, which is mounted on the tenth support plate 64 and configured to adjust the orientation of the fiber optic connector 2212 so that all the fluorescence reflected from the second reflector 2211 is input into the fiber optic connector 2212.

[0262] In one illustrative embodiment, such as Figures 30 to 32 As shown, the fourth adjustment component includes a fiber optic Z-axis displacement stage 2217, a fiber optic X-axis displacement stage 2218, and a fiber optic Y-axis displacement stage 2219, which are respectively used to adjust the orientation of the fiber optic connector 2212 in the Z-axis, X-axis, and Y-axis directions. The fiber optic X-axis displacement stage 2218 and the fiber optic Y-axis displacement stage 2219 are stacked on the tenth support disk 64. The fiber optic Z-axis displacement stage 2217 is mounted on the tenth support disk 64 via a fiber optic bracket located on top of the fiber optic X-axis displacement stage 2218 and the fiber optic Y-axis displacement stage 2219. The fiber optic connector 2212 is mounted on the fiber optic Z-axis displacement stage 2217 to move with the fiber optic Z-axis displacement stage 2217, the fiber optic X-axis displacement stage 2218, and the fiber optic Y-axis displacement stage 2219, so that all the fluorescence 26 reflected from the second reflector 2211 enters the fiber optic connector 2212.

[0263] According to embodiments of this disclosure, the second optical component further includes a light shield (not shown in the figure). The light shield covers the first filter 2222, the first convex lens 2223, the two fifth reflectors 2224, the fourth adjustment component 2214, and the fiber optic connector 2212 to block external stray light (e.g., ambient light) and improve the efficiency of the fiber optic connector 2219 in receiving the fluorescence 26. It is understood that the light shield has a through-hole at the position of the second reflector 2211 to allow the fluorescence 26 reflected by the second reflector 2211 to enter the light shield and then the fiber optic connector 2212.

[0264] According to embodiments of this disclosure, such as Figures 25 to 31 As shown, the support device 6 also includes a seventh support plate 68, a fifth support frame 69, and a coupling plate 610. The seventh support plate 68 is mounted on the third support frame 62, the fifth support frame 69 is mounted on the seventh support plate 68, the fourth support plate 65 is mounted on the upper end of the fifth support frame 69, and the fourth support frame 63 is disposed within the space defined by the fifth support frame 69 and suspended from the fifth support frame 69 by multiple third elastic members 611. The coupling plate 610 is disposed on the seventh support plate 68, and the coupling plate 610 is provided with a second through hole. The upper end of the light guide tube 421 passes through the second through hole from the lower part of the coupling plate 610 and is formed on the fifth support plate 66, so that the light guide tube 421 is sealed to the second through hole. The upper end of the cavity wall 422 is sealed to the lower side of the coupling plate 610 around the second through hole.

[0265] According to embodiments of this disclosure, a third elastic member securely connects the sample support frame and its lower portion. In an illustrative experiment, the third elastic member refers to a spring.

[0266] In one illustrative embodiment, the excitation laser beam is green light, and the fluorescence generated by the NV color center is red light.

[0267] According to embodiments of this disclosure, such as Figure 25 As shown, the third cylinder 612 supports the fourth support plate 65 on the seventh support plate 68, and together with the fourth support plate 65 and the seventh support plate, they form a third chamber, which is connected to the light guide tube 421.

[0268] In one illustrative embodiment, the third chamber and the light guide tube 421 are in a vacuum state.

[0269] According to embodiments of this disclosure, such as Figures 1 to 2 As shown, the scanning magnetic detection system also includes a removable light shield to enclose the optical module and prevent ambient light from entering the optical module.

[0270] Figure 34 A perspective view of an eddy current damping device according to an embodiment of the present disclosure is shown schematically.

[0271] According to an embodiment of this disclosure, the optical module 2 and the probe module 5 are connected via a light guide tube 421. Since vibration can cause the light guide tube to shake for an extended period, such as... Figures 26 to 34 As shown, an eddy current damping device 7 is provided between the fifth support plate 66 and the coupling plate 610 to quickly restore balance when the connecting pipe 42 is subjected to vibration.

[0272] According to embodiments of this disclosure, such as Figures 26 to 34 As shown, the eddy current damping device 7 includes multiple metal damping elements 71 and multiple magnets 72. The multiple metal damping elements 71 are mounted on one of the fifth support disk 66 and the coupling disk 610. The multiple magnets are mounted on the other of the fifth support disk 66 and the coupling disk 610, each magnet inserted into the space formed by the corresponding metal damping element 71. The multiple magnets 72 are arranged in a circle on the fifth support disk 66 or the coupling disk 610 at equal intervals in an adjacent and mutually exclusive manner. Figure 33 and Figure 9 As shown, a connecting flange is installed at one end of the light guide tube 421. The light guide tube 421 is installed on the fifth support plate 66 through the connecting flange, and the axis of the light guide tube 421 is located at the center. When the fifth support plate 66 shakes relative to the coupling plate 610, the magnetic flux in the metal damping element 71 changes, generating an induced current. It is subjected to a damping force in the magnetic field generated by the magnet, so that the fifth support plate 66 and the coupling plate 610 can be restored to balance.

[0273] In one illustrative embodiment, such as Figure 34 As shown, the eddy current damping device includes 18 small magnets arranged in a circle at equal intervals on the coupling disk 610 in an adjacent repulsive manner. On the fifth support disk 66, there are 18 damping copper plates corresponding to the small magnets, with each small magnet inserted into the space formed by the corresponding damping copper plate.

[0274] According to embodiments of this disclosure, the structure of the damping metal element 71 may include a "U" shape.

[0275] According to embodiments of this disclosure, when it is necessary to detect the magnetic field of a sample at different temperatures, resistance wires for generating heat can be arranged around the sample support stage to change the temperature value inside the third chamber 41.

[0276] According to embodiments of this disclosure, magnet 72 includes a magnet.

[0277] It is understandable that the scanning magnetic detection system provided in this disclosure can detect the magnetic field strength of the sample at room temperature even when the cooling device is not working, that is, at room temperature.

[0278] It should be noted that implementations not illustrated or described in the accompanying drawings or the main text of the specification are all forms known to those skilled in the art and are not described in detail. Furthermore, the definitions of the various elements and methods described above are not limited to the specific structures, shapes, or methods mentioned in the embodiments, and those skilled in the art can easily modify or substitute them.

[0279] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure, and the shapes and dimensions of the components in the drawings do not reflect actual size and proportion, but are only schematic representations of the embodiments of this disclosure.

[0280] Unless otherwise stated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to desired characteristics derived from the content of this disclosure. Specifically, all figures used in the specification and claims to indicate composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that a specific amount varies by ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0281] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0282] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0283] The specific embodiments described above further illustrate the purpose, technical solutions, and beneficial effects of this disclosure. It should be understood that the above descriptions are merely specific embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A cooling device for a scanning magnetic detection system, comprising: First support level; The first air supply assembly and the second air supply assembly are installed on the upper side of the first support plate; The first enclosed chamber is located on the lower side of the first support plate and is formed by the first support plate, the first base plate opposite to the first support plate, and the first cylinder sealed between the first support plate and the first base plate. At least one series-connected cooling assembly is disposed in the first enclosed chamber. Each series-connected cooling assembly is configured to receive compressed refrigerant gas from the first gas supply assembly, and to progressively cool the at least one series-connected cooling assembly through the adiabatic expansion of the compressed refrigerant gas; and A terminal cooling assembly is disposed inside the first enclosed chamber and below the last stage of the series cooling assembly to further cool to an ultra-low temperature state by utilizing the throttling process of the circulating cooling gas.

2. The refrigeration apparatus according to claim 1, wherein, The terminal cooling component includes: The second chamber, disposed within the first enclosed chamber, is formed by a second support plate suitable for separating the last-stage tandem cooling assembly and the terminal cooling assembly, a second chassis opposite to the second support plate, and a second cylinder sealed between the second support plate and the second chassis. A connecting pipe suitable for transmitting optical signals extends from the optical module of the scanning magnetic detection system through the first enclosed chamber and the second chamber to a third enclosed chamber located below the second chassis. A first cooling assembly is disposed within the second chamber.

3. The refrigeration apparatus according to claim 2, wherein, The first cooling component includes: A first air supply tube extends from the second air supply assembly through the first enclosed chamber into the second chamber; and A cooler is mounted on the second chassis, and the first air duct is partially wrapped around the cooler, so that the first air duct further cools the second chassis to an ultra-low temperature state through the cooler.

4. The refrigeration apparatus according to claim 3, wherein, The terminal cooling component also includes: A needle valve is disposed on the first air guide tube located in the second chamber; and An adjusting rod extends from the upper part of the first support plate through the first enclosed chamber to the second chamber. The adjusting rod is configured to adjust the opening of the needle valve to regulate the rate of cooling to the cryogenic environment.

5. The refrigeration apparatus according to claim 2, wherein, The connecting pipe includes: A light guide tube, configured to transmit optical signals between the optical module and the probe module of the scanning magnetic detection system, passes through the second chassis; and The cavity wall is fitted around the light guide tube, and the lower end of the cavity wall is sealed to the second chassis.

6. The refrigeration apparatus according to any one of claims 1-5, wherein, At least one of the series cooling components includes: The second cooling assembly is configured to cool the first cooling plate to a first temperature of 40K; and The third cooling component is configured to cool the second cooling plate to a second temperature of 4K.

7. The refrigeration apparatus according to claim 6, wherein, The second cooling component includes: The first cooling chamber is located below the first support plate; A first cooling plate is disposed below the first cooling cavity, and the first cooling cavity is configured to cool the first cooling plate. The first intake pipe delivers compressed refrigerant gas from the first air supply assembly to the first cooling chamber; and The first exhaust pipe delivers compressed cooling gas from the first cooling chamber to the first air supply assembly.

8. The refrigeration apparatus according to claim 7, wherein, The second cooling assembly further includes a first cooling conduction device, the first cooling conduction device comprising: The first cylindrical section is connected to the outside of the first cooling cavity; and Multiple first elastic fins extend from the first cylindrical portion to the surface of the first cooling plate. The first elastic fins are configured to conduct the cooling energy of the first cooling cavity to the first cooling plate and to reduce the vibration of the first cooling cavity on the first cooling plate.

9. The refrigeration apparatus according to claim 7, wherein, The second cooling assembly further includes a first auxiliary cooler, which is mounted on the first cooling plate. A first air duct from the second air supply assembly is partially wrapped around the first auxiliary cooler, so that the first cooling plate cools the circulating cooling gas in the first air duct through the first auxiliary cooler.

10. The refrigeration apparatus according to claim 7, wherein, The third cooling component includes: The second cooling chamber is located below the first cooling plate; The second cooling plate is disposed below the second cooling cavity, the second cooling cavity is configured to cool the second cooling plate, and the second cooling plate serves as the second support plate of the terminal cooling assembly; The second intake pipe delivers the compressed refrigerant gas, cooled by the first cooling plate, to the second cooling chamber; and The second exhaust pipe delivers the compressed cooling gas from the second cooling chamber through the first cooling chamber to the first air supply assembly.

11. The refrigeration apparatus according to claim 10, wherein, The third cooling assembly further includes a second cooling conductive device, the second cooling conductive device comprising: The second cylindrical section is connected to the outside of the second cooling chamber; and Multiple second elastic fins extend from the second cylindrical portion to the surface of the second cooling plate. The second elastic fins are configured to conduct the cold energy of the second cooling cavity to the second cooling plate and to dampen the vibration of the second cooling cavity on the second cooling plate.

12. The refrigeration apparatus according to claim 10, wherein, The third cooling assembly also includes a second auxiliary cooler, which is installed on the second cooling plate. A first air duct from the second air supply assembly is partially wrapped around the second auxiliary cooler, so that the second cooling plate further cools the circulating cooling gas from the first air duct through the second auxiliary cooler.

13. The refrigeration device according to any one of claims 1-5, further comprising a third support plate installed at the lower part of the first support plate, the first enclosed chamber passing through the third support plate, and a plurality of first vibration damping devices provided between the first support plate and the second support plate; Preferably, each first vibration damping device includes an active vibration isolation strip.

14. The refrigeration apparatus according to any one of claims 10, wherein, The first gas supply component includes: A cold head is configured to receive compressed refrigerant gas and deliver the compressed refrigerant gas to the second and third cooling components; and A second vibration damping device is installed between the cold head and the first support plate; Preferably, the second vibration damping device includes a bellows or a spring.

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