The present pressure bonding system and the present pressure bonding method

Abstract

The pressure bonding system and the pressure bonding method provided by the embodiment relate to the technical field of display. In the pressure bonding system, the lifting driving structure is used to control the coplanar of the array driving backboard placed on the bearing table and the side of the moving platform away from the fixed platform, and the moving platform is used to move from the peripheral area to the array driving backboard, so that the pressure membrane layer covering the display device during the pressure bonding process is evenly distributed at the edge of the array driving backboard, thereby weakening the influence of the non-vertical direction force of the pressure membrane layer on the display device at the edge, avoiding the displacement of the display device at the edge caused by the non-vertical direction force; the pressure membrane layer does not form non-vertical direction force on the side trace, which can avoid the side trace from falling off. It can be seen that the above design can reduce the adverse effects caused by the displacement of the display device at the edge and the falling off of the side trace, and improve the yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a self-bonding system and self-bonding method. Background Technology

[0002] Micro-LED display technology, with its high color gamut, high brightness, high contrast, and long lifespan, is hailed by the industry as the next-generation display technology. To meet market demand, Micro-LED display technology is widely used in large-size display panels. Taking the solution of achieving full-color display through mass transfer of RGB three-color display devices as an example, this solution is greatly limited by the maturity of the transfer technology and transfer capacity. Therefore, for large-size display panels, the current mainstream approach is to use a splicing method, combining small panels with medium ones, and medium ones with large ones, to achieve the production of large-size display panels. This reduces the demand for large-area display devices and the difficulty of subsequent repairs. However, when using a splicing method, the challenges of achieving narrow bezels and side wiring must be addressed. Furthermore, the production of display panels for splicing suffers from low panel yield rates. Summary of the Invention

[0003] In order to overcome the technical problems mentioned in the above technical background, this application provides a self-bonding system and self-bonding method.

[0004] A first aspect of this application provides a local bonding system for local bonding of display devices on an array driver backplane, the local bonding system comprising:

[0005] A fixed platform, wherein the fixed platform has a central area and a peripheral area surrounding the central area;

[0006] A lifting device is located in the central area of ​​the fixed platform. The lifting device includes a support platform and a lifting drive structure for controlling the vertical movement of the support platform relative to the fixed platform.

[0007] A mobile platform is slidably disposed in the peripheral area of ​​the fixed platform, wherein the mobile platform can move in a direction close to or away from the central area;

[0008] The lifting drive structure is used to control the lifting height of the support platform so that the side of the array drive backplate placed on the support platform away from the fixed platform and the side of the mobile platform away from the fixed platform are coplanar.

[0009] The moving platform is used to move closer to the array drive backplate from the peripheral area so that the pressure-bearing film layer covering the display device during the bonding process is evenly distributed at the edge of the array drive backplate.

[0010] In one possible embodiment of this application, the central region is provided with a plurality of through holes, and the lifting drive structure includes a support rod correspondingly disposed in each of the through holes and a drive member for driving the support rod to extend or retract relative to the fixed platform;

[0011] The support rod is fixed to the side of the bearing platform facing the fixed platform.

[0012] In one possible embodiment of this application, the pressure bonding system further includes a control device and a drive device corresponding to the mobile platform.

[0013] The control device is electrically connected to the drive device and is used to control the corresponding mobile platform to move closer to or away from the central area via the drive device.

[0014] In one possible embodiment of this application, the pressure bonding system further includes multiple image acquisition devices, which respectively acquire image information of different mobile platforms and array drive backplanes placed on the carrier platform;

[0015] The control device is electrically connected to the image acquisition device and is used to calculate the distance between the corresponding mobile platform and the array drive backplane placed on the support platform based on the image information, so as to control the movement of the corresponding mobile platform based on the distance.

[0016] In one possible embodiment of this application, during the movement of the mobile platform toward the central region, the control device is used to control the mobile platform to stop moving when the distance between the mobile platform and the array drive backplane placed on the support platform is equal to a preset distance value.

[0017] In one possible embodiment of this application, the number of mobile platforms is four, and the mobile platforms are respectively arranged in four directions around the central area;

[0018] The number of image acquisition devices is four. The orthographic projection of each image acquisition device on the fixed platform is located between the orthographic projection of the mobile platform on the fixed platform and the orthographic projection of the carrier platform on the fixed platform. The image acquisition device is located above the mobile platform and the carrier platform.

[0019] In one possible embodiment of this application, the fixed platform is provided with a slide groove, and the mobile platform is provided with a slider on the side facing the fixed platform. The slider extends into the slide groove and can slide along the slide groove, wherein the slide groove extends from the edge of the fixed platform toward the central region.

[0020] In one possible embodiment of this application, the pressure bonding system further includes a collision avoidance member disposed on the side of the mobile platform near the central region, the collision avoidance member being used to prevent the mobile platform from rigidly contacting the array drive backplane placed on the support platform.

[0021] A second aspect of this application provides a self-bonding method applied to the self-bonding system of any of the foregoing possible embodiments, the method comprising:

[0022] An array driving backplane is placed on the support platform, wherein display devices are distributed on the array driving backplane;

[0023] Control the mobile platform to move toward the central area, and control the mobile platform to stop moving when a preset condition is met;

[0024] The height of the support platform is adjusted by controlling the movement of the lifting drive structure, so that the side of the array drive back plate on the support platform away from the fixed platform and the side of the moving platform away from the fixed platform are coplanar.

[0025] A pressure-bearing film layer is covered on the display device of the array driving backplane, and the display device is pressure-bonded by applying atmospheric pressure to the pressure-bearing film layer.

[0026] In one possible embodiment of this application, the step of controlling the mobile platform to move toward the central region and controlling the mobile platform to stop moving when a preset condition is met includes:

[0027] Control the mobile platform to move toward the central region and acquire image information between the mobile platform and the array drive backplane on the support platform;

[0028] Based on the image information, a first distance is calculated between the mobile platform and the array drive backplane on the carrier platform;

[0029] Based on the first distance and a preset distance threshold, a second distance that the mobile platform needs to move is calculated, and the mobile platform is controlled to move the second distance. The preset distance threshold is the distance between adjacent pixels formed by the display device on the array driving backplane.

[0030] The bonding system and method provided in this application include a fixed platform, a lifting device, and a movable platform. The lifting device is located in the central area of ​​the fixed platform and includes a support platform for carrying the array driver backplane and a lifting drive structure for controlling the vertical movement of the support platform relative to the fixed platform. The movable platform is slidably disposed in the peripheral area of ​​the fixed platform. The lifting drive structure controls the lifting height of the support platform so that the side of the array driver backplane placed on the support platform away from the fixed platform and the side of the movable platform away from the fixed platform are coplanar. The movable platform moves closer to the array driver backplane from the peripheral area, so that the pressure-bearing film layer covering the display device during the bonding process is evenly distributed at the edge of the array driver backplane, thereby weakening the influence of the non-perpendicular force exerted by the pressure-bearing film layer on the display device at the edge, and preventing displacement of the display device at the edge due to non-perpendicular forces. Furthermore, the pressure-bearing film layer does not exert non-perpendicular forces on the side traces, preventing side traces from detaching. Therefore, the above design can reduce defects caused by display device displacement at the edge and side trace detachment, thereby improving the manufacturing yield of display panels. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram illustrating the bonding of a display device with an array driver backplane is provided.

[0033] Figure 2 A possible structural schematic diagram of the pressure bonding system provided in this embodiment is illustrated.

[0034] Figure 3 Example Figure 2 Top view of the Nakamoto bonding system;

[0035] Figure 4 A schematic diagram illustrating the structure for timing the bonding process in this scheme is provided.

[0036] Figure 5 This example illustrates another possible structural diagram of the pressure bonding system provided in this embodiment;

[0037] Figure 6 Example Figure 3 A schematic diagram of the cross-section along the AA direction;

[0038] Figure 7This example illustrates another possible structural diagram of the pressure bonding system provided in this embodiment;

[0039] Figure 8 A schematic flowchart of the bonding method provided in this embodiment is illustrated.

[0040] Figure 9 The process diagram corresponding to the bonding method provided in this embodiment is illustrated.

[0041] Icons: 1-Pressure bonding system; 11-Fixed platform; 11A-Central area; 11B-Surrounding area; 111-Slide groove; 1101-Through hole; 12-Lifting device; 121-Bearing platform; 122-Lifting drive structure; 1221-Support rod; 1222-Drive component; 13-Moving platform; 131-Sliding component; 14-Control device; 15-Drive device; 16-Image acquisition equipment; 17-Anti-collision component; 100-Array drive backplate; 200-Display device; 300-Side wiring; 20-Pressure-bearing membrane layer. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0045] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0046] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0047] In response to the technical problems mentioned in the background section, the inventors discovered through analysis of defective display panel structures that the displacement of edge display devices near the side traces and the detachment of side traces are important reasons for display panel defects.

[0048] Further analysis by the inventors revealed that the electrical connection between the display device and the array driver backplane can include metal bonding, ACF bonding, etc. Regardless of the connection method used, this bonding method is required. Please refer to... Figure 1 , Figure 1 A schematic diagram illustrating the pressure bonding between a display device 200 located at the edge of an array driving backplane and an array driving backplane 100 is provided. A pressure-bearing film layer 20 converts air pressure into pressure and applies it to the display device 200 to achieve electrical connection between the display device 200 and the array driving backplane 100. However, due to the exposed narrow bezel (the portion between the display device 200 at the edge and the side traces 300) and the exposed side traces 300, the pressure-bearing film layer 20 comes into contact with the narrow bezel and the side traces 300. Because of the height difference between the display device 200 at the edge and the narrow bezel, the pressure-bearing film layer 20 exhibits significant flatness variations on the side of the display device 200 closer to the narrow bezel at the edge. As shown in the figure, the display device 200 at the edge may be misaligned by a non-perpendicular force F1 acting at point A along the extension direction of the pressure-bearing film layer 20 (mainly caused by the horizontal component of force F1 along the X direction). Meanwhile, the side trace 300 may also be pulled off by the non-perpendicular force F2 at point B along the extension direction of the pressure-bearing film layer 20 (mainly the horizontal component of force F2 along the X direction pulls the side trace 300), which will cause the display device 200 at the edge to shift and the side trace 300 to fall off, thereby reducing the manufacturing yield of the display panel.

[0049] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0050] Please refer to Figure 2 and Figure 3 , Figure 2 A schematic diagram of the structure of the pressure bonding system provided in this embodiment is illustrated. Figure 3 Example Figure 2 A top view of the local bonding system. The local bonding system 1 can be used to perform local bonding of the display device 200 on the array driving backplane 100. In this embodiment, the local bonding system 1 may include a fixed platform 11, a lifting device 12, and a moving platform 13. The fixed platform 11 may include a central region 11A and a peripheral region 11B, wherein the peripheral region 11B surrounds the central region 11A.

[0051] The lifting device 12 can be located in the central area 11A of the fixed platform 11. The lifting device 12 can include a support platform 121 and a lifting drive structure 122. The lifting drive structure 122 is used to control the support platform 121 to move up and down relative to the fixed platform 11.

[0052] The mobile platform 13 is slidably disposed in the peripheral area 11B of the fixed platform 11, wherein the mobile platform 12 can move in a direction close to the central area 11A or away from the central area 11A.

[0053] In this embodiment, the lifting drive structure 122 can control the lifting height of the support platform 121 so that the side of the array drive backplate 100 placed on the support platform 121 away from the fixed platform 11 and the side of the mobile platform 13 away from the fixed platform 11 are coplanar. The lifting drive structure 122 can control the lifting height of the support platform 121 to be equal to the difference between the thickness of the mobile platform 13 and the thickness of the array drive backplate 100.

[0054] The mobile platform 13 can move closer to the array driving backplane 100 from the surrounding area 11B and stop moving when the distance from the array driving backplane 100 is a preset distance threshold, wherein the preset distance threshold can be the distance between adjacent pixels formed by the display device on the array driving backplane 100.

[0055] In this embodiment, the lifting device 12 and the mobile platform 13 can be controlled in a fully automatic manner, or by an operator in a semi-automatic or manual manner.

[0056] Please refer to Figure 4The above-described solution provided in this embodiment can ensure that the pressure-bearing film layer 20 covering the display device 200 is evenly distributed at the edge of the array driving backplate 100 during the pressing and bonding process. This reduces the influence of the non-perpendicular force exerted by the pressure-bearing film layer 20 on the display device 200 at the edge, and avoids displacement of the display device 200 at the edge due to the non-perpendicular force. In addition, the pressure-bearing film layer 20 will not exert a non-perpendicular force on the side traces 300, which can prevent the side traces 300 from falling off.

[0057] Furthermore, please refer to again Figure 2 The fixed platform 11 located in the central region 11A may also be provided with multiple through holes 1101. The lifting drive structure 122 may include a support rod 1221 correspondingly disposed in each through hole 1101 and a drive member 1222 that can drive the support rod 1221 to extend or retract relative to the fixed platform 11. The support rod 1221 may be fixed to the side of the support platform 121 facing the fixed platform 11. Exemplarily, the drive member 1222 may drive the support rod 1221 to move by means of pneumatic pressure, hydraulic pressure, or elastic pressure.

[0058] Further, please refer to Figure 5 In this embodiment, the pressure bonding system 1 may further include a control device 14 and a drive device 15 corresponding to the moving platform 13. The control device 14 may be electrically connected to the drive device 15 and control the corresponding moving platform 13 to move closer to or away from the central region 11A via the drive device 15. For example, the control device may be a computer device, and the drive device may include an electric motor and a linkage. The electric motor can control the moving platform 13 to move closer to or away from the central region 11A via the linkage. The control device 14 may also be electrically connected to a drive member 1222, and the control device 14 drives the support rod 1221 to extend or retract relative to the fixed platform 11 via the drive member 1222.

[0059] Please refer to this again. Figure 5The bonding system 1 may further include multiple image acquisition devices 16, which can acquire image information of different mobile platforms 13 and the array drive backplane 100 placed on the support platform 121. A control device 14 can be electrically connected to the image acquisition devices 16 and used to control the movement of the mobile platforms 13 based on distance information. For example, the image acquisition devices 16 may be charge-coupled devices (CCD) cameras. Specifically, the control device 14 can acquire the image information acquired by the image acquisition devices 16, process the image information to calculate the distance between different mobile platforms 13 and the array drive backplane 100 placed on the support platform 121, and calculate the distance each mobile platform 13 needs to move towards the central region 11A based on this distance. For example, if the distance A between a current mobile platform 13 and the array drive backplane 100 placed on the support platform 121 is a preset distance threshold of A0, then the distance the mobile platform 13 needs to move towards the central region 11A can be calculated as A-A0. The control device 14 can control the drive device 15 via an electrical signal to move the mobile platform 13 to the central region 11A by the aforementioned distance, and control the mobile platform 13 to stop moving when the distance between the mobile platform 13 and the array drive backplate 100 is a preset distance threshold.

[0060] In this embodiment, the number of mobile platforms 13 and the number of image acquisition devices 16 can both be four. The four mobile platforms 13 can be located in the four directions surrounding the central region 11A, for example, Figure 3 The central area 11A is positioned above, below, to the left, and to the right. The orthographic projections of the four image acquisition devices 16 onto the fixed platform 11 lie between the orthographic projections of the different mobile platforms 13 onto the fixed platform 11 and the orthographic projection of the support platform 121 onto the fixed platform 11. The image acquisition devices 16 are located above the mobile platforms 13 and the support platform 121. This arrangement allows for capturing images of the mobile platforms 13 and the support platform 121 from above, facilitating the calculation of the distance between them based on these images.

[0061] Further, please refer to Figure 6 , Figure 6 Example Figure 3 A cross-sectional view along the AA direction shows that the fixed platform 11 is provided with a groove 111, and the movable platform 13 is provided with a slider 131 on the side facing the fixed platform 11. The slider 131 extends into the groove 111 and can slide along the groove 111. The groove 111 extends from the edge of the fixed platform 11 towards the central region 11A. For example, the slider 131 can slide in the groove 111 using a roller, thus reducing the friction between the two during the sliding process.

[0062] Further, please refer to Figure 7 , Figure 7 Another schematic diagram of the pressure bonding system is illustrated. The pressure bonding system 1 may further include a shock absorber 17, which may be disposed on the side of the moving platform 13 near the central region 11A. The shock absorber 17 can be used to prevent the moving platform 13 from rigidly contacting the array drive backplane 100 placed on the support platform 121. Exemplarily, the shock absorber 17 may be an airbag, balloon, or sponge, etc.

[0063] This embodiment also provides a self-bonding method that can be applied to the aforementioned self-bonding system 1. Please refer to [link / reference]. Figure 8 and Figure 9 , Figure 8 A flowchart illustrating this bonding method is provided. Figure 9 Example Figure 8 The corresponding manufacturing process diagram. (See below for details.) Figure 8 and Figure 9 The bonding method provided in this embodiment will be described in detail.

[0064] Step S11: Place the array drive backplane 100 on the support platform 121.

[0065] Display devices 200 are distributed on the array driving backplane 100, and the display devices 200 can be transferred onto the array driving backplane 100 using mass transfer technology. In one possible implementation of this embodiment, the display devices 200 can be transferred onto the array driving backplane 100 before step S11; in another possible implementation of this embodiment, the display devices 200 can be transferred onto the array driving backplane 100 after it has been placed on the support stage 121. Preferably, in this embodiment, the display devices 200 are transferred onto the array driving backplane 100 before step S11.

[0066] Step S12: Control the mobile platform 13 to move toward the central region 11A, and control the mobile platform 13 to stop moving when the preset conditions are met.

[0067] For example, step S12 can be implemented by the following steps.

[0068] First, control the mobile platform 13 to move toward the central region 11A and acquire image information between the mobile platform 13 and the array drive backplane 100 on the carrier stage 121.

[0069] Next, the first distance between the mobile platform 13 and the array drive backplane 100 on the carrier platform 121 is calculated based on the image information.

[0070] Then, based on the first distance and the preset distance threshold, the second distance that the mobile platform 13 needs to move is calculated, and the mobile platform 13 is stopped after moving the second distance.

[0071] Step S13: By controlling the movement of the lifting drive structure 122 to adjust the height of the support platform 121, the side of the array drive backplate 100 on the support platform 121 away from the fixed platform 11 and the side of the moving platform 13 away from the fixed platform 11 are coplanar.

[0072] The lifting drive structure 122 controls the lifting height of the carrier platform 121 to be equal to the difference between the thickness of the moving platform 13 and the thickness of the array drive backplate 100.

[0073] Step S14: A pressure-bearing film layer 20 is covered on the display device 200 of the array driving backplane 100, and the display device 200 is pressure-bonded by applying atmospheric pressure to the pressure-bearing film layer 20.

[0074] The bonding system and method provided in this embodiment, in the bonding system, a lifting drive structure is used to control the lifting height of the support platform so that the side of the array drive backplate placed on the support platform away from the fixed platform and the side of the moving platform away from the fixed platform are coplanar. The moving platform is used to move closer to the array drive backplate from the peripheral area, so that the pressure-bearing film layer covering the display device during the bonding process is evenly distributed at the edge of the array drive backplate, thereby weakening the influence of the non-perpendicular force of the pressure-bearing film layer on the display device at the edge, and avoiding displacement of the display device at the edge due to non-perpendicular force. In addition, the pressure-bearing film layer does not exert non-perpendicular force on the side traces, which can prevent the side traces from falling off. It can be seen that the above design can reduce defects caused by display device displacement at the edge and side trace falling off, and improve the manufacturing yield of display panels.

[0075] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A self-bonding system, characterized in that, For local bonding of display devices on an array driver backplane, the local bonding system includes: A fixed platform, wherein the fixed platform has a central area and a peripheral area surrounding the central area; A lifting device is located in the central area of ​​the fixed platform. The lifting device includes a support platform and a lifting drive structure for controlling the vertical movement of the support platform relative to the fixed platform. A mobile platform is slidably disposed in the peripheral area of ​​the fixed platform, wherein the mobile platform can move in a direction close to or away from the central area; The lifting drive structure is used to control the lifting height of the support platform so that the side of the array drive backplate placed on the support platform away from the fixed platform and the side of the mobile platform away from the fixed platform are coplanar. The moving platform is used to move closer to the array drive backplate from the peripheral area so that the pressure-bearing film layer covering the display device during the bonding process is evenly distributed at the edge of the array drive backplate.

2. The pressure bonding system as described in claim 1, characterized in that, The central area is provided with multiple through holes, and the lifting drive structure includes a support rod correspondingly disposed in each of the through holes and a drive component for driving the support rod to extend or retract relative to the fixed platform. The support rod is fixed to the side of the bearing platform facing the fixed platform.

3. The pressure bonding system as described in claim 1, characterized in that, The pressure bonding system also includes a control device and a drive device corresponding to the mobile platform; The control device is electrically connected to the drive device and is used to control the corresponding mobile platform to move closer to or away from the central area via the drive device.

4. The pressure bonding system as described in claim 3, characterized in that, The bonding system further includes multiple image acquisition devices, which acquire image information of different mobile platforms and array drive backplanes placed on the carrier platform. The control device is electrically connected to the image acquisition device and is used to calculate the distance between the corresponding mobile platform and the array drive backplane placed on the support platform based on the image information, so as to control the movement of the corresponding mobile platform based on the distance.

5. The pressure bonding system as described in claim 4, characterized in that, During the movement of the mobile platform toward the central region, the control device is used to control the mobile platform to stop moving when the distance between the mobile platform and the array drive backplate placed on the support platform is equal to a preset distance value.

6. The pressure bonding system as described in claim 5, characterized in that, The number of mobile platforms is four, and the mobile platforms are respectively set in the four directions around the central area; The number of image acquisition devices is four. The orthographic projection of each image acquisition device on the fixed platform is located between the orthographic projection of the mobile platform on the fixed platform and the orthographic projection of the carrier platform on the fixed platform. The image acquisition device is located above the mobile platform and the carrier platform.

7. The bonding system according to any one of claims 1-6, characterized in that, The fixed platform is provided with a slide groove, and the mobile platform is provided with a slider on the side facing the fixed platform. The slider extends into the slide groove and can slide along the slide groove, wherein the slide groove extends from the edge of the fixed platform toward the central region.

8. The bonding system according to any one of claims 1-6, characterized in that, The bonding system further includes a collision avoidance component disposed on the side of the mobile platform near the central region, the collision avoidance component being used to prevent the mobile platform from rigidly contacting the array drive backplane placed on the support platform.

9. A bonding method for this product, characterized in that, Applied to the bonding system according to any one of claims 1-8, the method comprises: An array driving backplane is placed on the support platform, wherein display devices are distributed on the array driving backplane; Control the mobile platform to move toward the central area, and control the mobile platform to stop moving when a preset condition is met; The height of the support platform is adjusted by controlling the movement of the lifting drive structure, so that the side of the array drive back plate on the support platform away from the fixed platform and the side of the moving platform away from the fixed platform are coplanar. A pressure-bearing film layer is covered on the display device of the array driving backplane, and the display device is pressure-bonded by applying atmospheric pressure to the pressure-bearing film layer.

10. The bonding method as described in claim 9, characterized in that, The step of controlling the mobile platform to move toward the central area and stopping the movement of the mobile platform when a preset condition is met includes: Control the mobile platform to move toward the central region and acquire image information between the mobile platform and the array drive backplane on the support platform; Based on the image information, a first distance is calculated between the mobile platform and the array drive backplane on the carrier platform; Based on the first distance and a preset distance threshold, the second distance that the mobile platform needs to move is calculated, and the mobile platform is controlled to move the second distance.

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