Liquid discharge apparatus and liquid discharge module

Abstract

A liquid ejecting apparatus includes a print head having an ejecting portion that ejects a liquid by displacement of a piezoelectric element and a first connector; a substrate unit having a second connector that is fitted to the first connector and a third connector that is different from the second connector, and electrically connected to the print head via the second connector; a first cable that transmits a first voltage signal supplied to the substrate unit; a second cable that transmits a second voltage signal supplied to the substrate unit; a fourth connector that is fitted to the third connector; and a relay substrate including a relay substrate surface to which the first cable and the second cable are electrically connected and a relay substrate back surface opposite to the relay substrate surface, the fourth connector being provided on the relay substrate back surface, the relay substrate transmitting the first voltage signal and the second voltage signal to the fourth connector.

Description

Technical Field

[0001] This application relates to a liquid ejection device and a liquid ejection module. Background Technology

[0002] More than half a century has passed since the invention of liquid ejection technology using piezoelectric elements. Liquid ejection devices utilizing this technology have been flexibly applied in a wide range of fields, including inkjet printers and color filter manufacturing equipment. In recent years, with the foundational technology of liquid ejection established, the core market demand for liquid ejection devices has shifted to increasing the productivity of the products generated using these devices. In response to this market demand, the focus of technological development in liquid ejection devices has become the diversification of nozzles for ejecting liquid and increasing the amount of ink ejected per unit time.

[0003] Patent document 1 discloses a printing apparatus (liquid ejection apparatus) that uses multiple heads with multiple nozzles to increase the ejection volume per unit time in order to improve the productivity of the product. The liquid ejection apparatus has multiple head units (liquid ejection heads) housed in a housing, multiple drive circuits that supply drive signals to the head units, and a cooling mechanism that cools the drive circuits.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2018-099835

[0005] However, while the liquid ejection device described in Patent Document 1 can improve productivity, it is not sufficient, at least from the point of view, and there is room for improvement. Summary of the Invention

[0006] The liquid ejection device includes:

[0007] The head has a first connector and sprays liquid;

[0008] The substrate unit includes a second connector that engages with the first connector, and a third connector that is different from the second connector; and

[0009] A relay substrate includes a relay substrate surface and a relay substrate back surface opposite to the relay substrate surface.

[0010] A first cable for transmitting a first voltage signal is connected to the surface of the relay substrate.

[0011] A fourth connector is provided on the back side of the relay substrate, which engages with the third connector of the substrate unit.

[0012] The liquid ejection module has the following features:

[0013] The head has a first connector and sprays liquid;

[0014] The substrate unit includes a second connector that engages with the first connector, and a third connector that is different from the second connector; and

[0015] A relay substrate includes a relay substrate surface and a relay substrate back surface opposite to the relay substrate surface.

[0016] A first cable for transmitting a first voltage signal is connected to the surface of the relay substrate.

[0017] A fourth connector is provided on the back side of the relay substrate, which engages with the third connector of the substrate unit. Attached Figure Description

[0018] Figure 1 This is a diagram showing a simplified structure of a liquid ejection device.

[0019] Figure 2 This is a diagram illustrating an example of the functional structure of the head unit.

[0020] Figure 3 This is a diagram showing the structure of the drive signal output circuit.

[0021] Figure 4 This is a diagram showing an example of the signal waveforms of the drive signals COMA and COMB.

[0022] Figure 5 This is a diagram showing an example of the signal waveform of the drive signal VOUT.

[0023] Figure 6 This is a diagram showing the functional structure of the drive signal selection circuit.

[0024] Figure 7 This is a diagram illustrating an example of the decoded content in the decoder.

[0025] Figure 8 This is a diagram showing the structure of the selection circuit.

[0026] Figure 9 This is a diagram used to illustrate the operation of the drive signal selection circuit.

[0027] Figure 10 This is a side view showing the structure of the carriage equipped with the head unit.

[0028] Figure 11 This is a perspective view showing the peripheral structure of the carriage equipped with the head unit.

[0029] Figure 12 This is an exploded perspective view showing an example of the construction of a liquid ejection module.

[0030] Figure 13 This is a perspective view showing an example of the internal structure of a printhead.

[0031] Figure 14 This is an exploded 3D view of the print head.

[0032] Figure 15 This is a diagram showing an example of the structure of the ejection section of the ejection module.

[0033] Figure 16 This is a top view of the drive circuit board.

[0034] Figure 17 It is to drive the circuit board along Figure 16 The cross-sectional view showing the case where line Aa is cut off.

[0035] Figure 18 It is to drive the circuit board along Figure 16 The cross-sectional view showing the case where line Bb is cut off.

[0036] Figure 19 This is a diagram showing an example of the construction of a drive circuit board that is generally box-shaped.

[0037] Figure 20 This is a diagram showing an example of the component arrangement in a drive circuit board in its unfolded state.

[0038] Figure 21 This is a diagram illustrating an example of a wiring pattern for transmitting voltage signals VHV, VMV, and VDD.

[0039] Figure 22 This is a diagram illustrating an example of a wiring pattern for transmitting the drive signal COM and the reference voltage signal VBS.

[0040] Figure 23 This is a diagram showing an example of the component configuration in a drive circuit board in an assembled state.

[0041] Figure 24 This is a diagram showing an example of the component configuration in a drive circuit board in an assembled state.

[0042] Figure 25 This is a top view showing an example of the structure of a relay substrate.

[0043] Figure 26 This is a side view showing an example of the structure of a relay substrate.

[0044] Figure 27 This is a diagram showing the drive circuit module viewed from the -x2 side along the x2 axis.

[0045] Figure 28This is a diagram showing the drive circuit module viewed from the +x2 side along the x2 axis.

[0046] Figure 29 This is a diagram showing the drive circuit module viewed from the -y2 side along the y2 axis.

[0047] Figure 30 This is a diagram showing the drive circuit module viewed from the +z2 side along the z2 axis.

[0048] Figure 31 This is a diagram showing a simplified structure of a modified liquid ejection device.

[0049] Figure 32 This is an exploded perspective view showing an example of the construction of a modified liquid ejection module.

[0050] Figure 33 This is a diagram showing an example of the component arrangement in a drive circuit board in a modified, unfolded state. Detailed Implementation

[0051] The preferred embodiments of this application will now be described in detail with the aid of accompanying drawings. The drawings used are for ease of explanation. It should be noted that the embodiments described below are not intended to unduly limit the scope of this application as defined in the claims. Furthermore, not all structures described below are necessarily essential components of this application.

[0052] 1. Functional structure of the liquid ejection device

[0053] 1.1 Functional Structure of Liquid Ejection Device

[0054] Figure 1 This is a diagram showing a simplified structure of the liquid ejection device 1. The liquid ejection device 1 of this embodiment is a so-called inkjet printer that ejects ink, an example of a liquid, from a conveyed medium P at a desired timing, thereby forming a desired image on the surface of the medium P. Here, in the following description, the direction in which the medium P is conveyed is referred to as the conveying direction.

[0055] like Figure 1 As shown, the liquid ejection device 1 includes a control unit 2, a head unit 3, a conveyor motor 4, a conveyor roller 5, a carriage motor 6, a carriage guide shaft 7, a carriage 8, and a liquid container 9.

[0056] The control unit 2 generates control signals for controlling various elements of the liquid ejection device 1 based on image data DATA supplied from an external machine such as a mainframe computer (not shown) located outside the liquid ejection device 1, and outputs these signals to the corresponding structures. Additionally, the control unit 2 generates voltage signals VDC for the power supply voltage of each part of the liquid ejection device 1 based on the commercial AC voltage VAC supplied to the liquid ejection device 1, and supplies these signals to each part of the liquid ejection device 1.

[0057] Specifically, the control unit 2 generates a conveying control signal Ctrl-T as a control signal to control various elements of the liquid ejection device 1, and outputs it to the conveying motor 4. The conveying motor 4 is driven based on the input conveying control signal Ctrl-T. The conveying roller 5 rotates in tandem with the drive of the conveying motor 4. Furthermore, based on the driving force generated by the rotation of the conveying roller 5, the medium P is conveyed along the conveying direction. That is, the conveying motor 4 and the conveying roller 5 convey the medium P according to the conveying control signal Ctrl-T output by the control unit 2.

[0058] Additionally, the control unit 2 generates a carriage control signal Ctrl-C as a control signal to control various elements of the liquid ejection device 1, and outputs it to the carriage motor 6. The carriage motor 6 is driven based on the input carriage control signal Ctrl-C. The driving force generated by the carriage motor 6 is transmitted to the carriage 8, which is supported on the carriage guide shaft 7, via a timing belt (not shown). The carriage guide shaft 7 extends in a direction intersecting the conveying direction and supports the carriage 8. Furthermore, based on the driving force generated by the carriage motor 6, the carriage 8, supported on the carriage guide shaft 7, moves along the carriage guide shaft 7. That is, the carriage motor 6 and the carriage guide shaft 7 move the carriage 8 along the carriage guide shaft 7 according to the carriage control signal Ctrl-C output by the control unit 2.

[0059] Additionally, the control unit 2 generates a printing data signal pDATA as a control signal to control various elements of the liquid ejection device 1, and outputs it to the head unit 3. The head unit 3 has an ejection control module 10 and multiple liquid ejection modules 20. Furthermore, each of the multiple liquid ejection modules 20 has a drive circuit module 50 and a print head 30. That is, the head unit 3 has multiple sets of drive circuit modules 50 and print heads 30. This head unit 3 is mounted on a carriage 8 and moves along the carriage guide shaft 7 as the carriage 8 moves.

[0060] The printing data signal pDATA output by control unit 2 is input to ejection control module 10. Based on the input printing data signal pDATA, ejection control module 10 generates a control signal to control the operation of each of the plurality of liquid ejection modules 20 and outputs it to the corresponding liquid ejection module 20. The control signal output by ejection control module 10 is input to the corresponding drive circuit module 50. Drive circuit module 50 is electrically connected to the corresponding printhead 30 and drives printhead 30 at a timing specified by the input control signal, so that printhead 30 ejects the amount of ink specified by the control signal. Thus, printhead 30 ejects a predetermined amount of ink at a predetermined timing. That is, printhead unit 3 ejects a predetermined amount of ink from printhead 30 at a predetermined timing according to the printing data signal pDATA output by control unit 2.

[0061] The liquid container 9 contains ink ejected from the printhead 30. The ink stored in the liquid container 9 is supplied to the printhead 30 via a tube (not shown). For example, an ink cartridge, a bag-shaped ink pouch formed of a flexible membrane, or an ink canister for refilling ink can be used as such a liquid container 9.

[0062] As described above, for the liquid ejection device 1, the control unit 2 controls the transport of the medium P, the movement of the carriage 8, and the timing of ink ejection from the printhead 30 mounted on the carriage 8. This allows the ink to be applied at the desired location on the medium P, resulting in the formation of the desired image on the medium P.

[0063] 1.2 Functional Structure of Head Unit

[0064] Next, the functional structure of the head unit 3 of the liquid ejection device 1 will be explained in detail. Figure 2 This is a diagram illustrating an example of the functional structure of head unit 3. (As shown...) Figure 2 As shown, the head unit 3 has a spray control module 10 and multiple liquid spray modules 20. Here, the multiple liquid spray modules 20 of the head unit 3 all have the same structure, but when describing the multiple liquid spray modules 20 separately, they may be referred to as liquid spray modules 20-1 to 20-n. That is, there are cases where... Figure 2 The head unit 3 shown is described as having n liquid ejection modules 20-1 to 20-n, which are liquid ejection modules 20.

[0065] in addition, Figure 2Based on the structure of the head unit 3, the diagram shows a portion of the structure included in the control unit 2, namely the main control circuit 16 and the power supply voltage output circuit 18. The main control circuit 16 of the control unit 2 includes processing circuits such as a CPU (Central Processing Unit), an FPGA (Field Programmable Gate Array), and storage circuits such as semiconductor memory. Furthermore, the main control circuit 16 applies predetermined signal processing to image data DATA supplied from an external machine such as a host computer (not shown) located outside the liquid ejection device 1, generates printing data signal pDATA, and outputs it to the ejection control module 10.

[0066] The power supply voltage output circuit 18 includes an AC / DC converter such as a flyback circuit, and a DC / DC converter such as a buck circuit or a boost circuit. Based on the commercial voltage VAC input from the liquid ejection device 1, the power supply voltage output circuit 18 generates the following signals as voltage signals VDC and outputs them to the ejection control module 10: a DC voltage signal with a voltage value of 42V, i.e., voltage signal VHV, and a DC voltage signal with a voltage value of 24V, i.e., voltage signal VMV. It should be noted that the voltage values ​​of voltage signals VHV and VMV are not limited to 42V and 24V. Alternatively, the power supply voltage output circuit 18 may replace voltage signals VHV and VMV, or output DC voltage signals with different voltage values ​​as voltage signal VDC based on voltage signals VHV and VMV.

[0067] The ejection control module 10 operates by using the voltage signals VHV and VMV output by the power supply voltage output circuit 18, or a DC voltage signal generated based on the voltage signals VHV and VMV, as the power supply voltage. Furthermore, based on the printing data signal pDATA output by the control unit 2, the ejection control module 10 generates control signals to control the operation of the n liquid ejection modules 20, and outputs these signals to the corresponding liquid ejection modules 20.

[0068] The ejection control module 10 includes a head control circuit 12 and a cooling fan drive circuit 14. Printing data signal pDATA is input to the head control circuit 12 included in the ejection control module 10. Based on the input printing data signal pDATA, the head control circuit 12 generates and outputs the following signals: a clock signal SCK that is commonly input to n liquid ejection modules 20; differential printing data signals Dp1 to Dpn corresponding to each of the n liquid ejection modules 20; and differential drive data signals Dd1 to Ddn corresponding to each of the n liquid ejection modules 20.

[0069] Specifically, the printing data signal pDATA is a differential signal generated based on the image data DATA, and includes a clock signal SCK, differential printing data signals Dp1 to Dpn, and differential drive data signals Dd1 to Ddn in a serial manner. The head control circuit 12 deserializes and restores the input printing data signal pDATA to generate a clock signal SCK that is commonly input to the n liquid ejection modules 20. The head control circuit 12 also deserializes the input printing data signal pDATA to generate differential printing data signals Dp1 to Dpn and differential drive data signals Dd1 to Ddn corresponding to each of the n liquid ejection modules 20. Then, the head control circuit 12 outputs the generated clock signal SCK, differential printing data signals Dp1 to Dpn, and differential drive data signals Dd1 to Ddn to the corresponding liquid ejection module 20.

[0070] In the following description, we will assume that the differential printing data signal Dp1 and the differential drive data signal Dd1 correspond to the liquid ejection module 20-1, and the differential printing data signal Dpn and the differential drive data signal Ddn correspond to the liquid ejection module 20-n. Specifically, we will assume that the clock signal SCK, the differential printing data signal Dp1, and the differential drive data signal Dd1 are input to the liquid ejection module 20-1, and the clock signal SCK, the differential printing data signal Dpn, and the differential drive data signal Ddn are input to the liquid ejection module 20-n. Conversely, we will assume that the clock signal SCK, the differential printing data signal Dp, and the differential drive data signal Dd are input to the liquid ejection module 20.

[0071] Additionally, the head control circuit 12 generates a fan control signal Fc to control the operation of the cooling fan drive circuit 14 and outputs it to the cooling fan drive circuit 14. Besides the fan control signal Fc, a voltage signal VMV is also input to the cooling fan drive circuit 14. Based on the input fan control signal Fc, the cooling fan drive circuit 14 switches whether to output the voltage signal VMV as fan drive signals Fp1 to Fpn. That is, the cooling fan drive circuit 14 has n switching circuits that switch whether to output the voltage signal VMV as fan drive signals Fp1 to Fpn, and switches the conduction state of each of the n switching circuits according to the input fan control signal Fc. In other words, the cooling fan drive circuit 14 switches whether to output the voltage signal VMV as fan drive signals Fp1 to Fpn.

[0072] The fan drive signals Fp1 to Fpn output from the cooling fan drive circuit 14 are output to the corresponding liquid spraying modules 20. In the following explanation, we will assume that fan drive signal Fp1 corresponds to liquid spraying module 20-1 and fan drive signal Fpn corresponds to liquid spraying module 20-n. That is, fan drive signal Fp1 is input to liquid spraying module 20-1, and fan drive signal Fpn is input to liquid spraying module 20-n. Alternatively, we will assume that fan drive signal Fp is input to liquid spraying module 20.

[0073] It should be noted that, alternatively, the cooling fan drive circuit 14 can convert the voltage signal VMV into a predetermined voltage value based on the input fan control signal Fc, and output the converted signal as the fan drive signal Fp1 to Fpn.

[0074] In addition, the ejection control module 10 transmits the voltage signals VHV and VMV supplied from the power supply voltage output circuit 18 and supplies them to each of the liquid ejection modules 20-1 to 20-n.

[0075] The clock signal SCK, differential printing data signal Dp1, differential drive data signal Dd1, fan drive signal Fp1, and voltage signals VHV and VMV output by the ejection control module 10 are input to the liquid ejection module 20-1. The liquid ejection module 20-1 then operates using the voltage signals VHV and VMV, or a DC voltage generated based on VHV and VMV, as its power supply voltage. At the timing specified by the differential printing data signal Dp1 and the differential drive data signal Dd1, it ejects the amount of ink specified by the differential printing data signal Dp1 and the differential drive data signal Dd1 onto the medium P.

[0076] The liquid ejection module 20-1 includes a drive circuit module 50 and a printhead 30. The drive circuit module 50 further includes an ejection control circuit 51, drive signal output circuits 52a-1 to 52a-m, 52b-1 to 52b-m, a capacitor 53, an abnormality detection circuit 54, an abnormality notification circuit 55, a temperature detection circuit 56, a voltage conversion circuit 58, and a cooling fan 59.

[0077] The clock signal SCK, the differential printing data signal Dp1, and the differential drive data signal Dd1 are input to the ejection control circuit 51. The ejection control circuit 51 then generates and outputs the following signals by analyzing the input differential printing data signal Dp1 and the differential drive data signal Dd1: a differential printing data signal Dpt that controls the operation of the printhead 30; base drive signals dA1 to dAm that form the basis of the drive signals COMA1 to COMAm (described later); and base drive signals dB1 to dBm that form the basis of the drive signals COMB1 to COMBm (described later). This ejection control circuit 51 is configured as an FPGA including circuitry for analyzing the input differential printing data signal Dp1 and the differential drive data signal Dd1.

[0078] That is, the drive circuit module 50 has an FPGA that implements the ejection control circuit 51, wherein the ejection control circuit 51 is input with differential printing data signal Dp1 and differential drive data signal Dd1, and based on the input differential printing data signal Dp1 and differential drive data signal Dd1, outputs differential printing data signal Dpt that controls the operation of the print head 30, and base drive signals dA1~dAm and dB1~dBm that form the basis of drive signals COMA1~COMAm and COMB1~COMBm.

[0079] Specifically, the ejection control circuit 51 analyzes the input differential printing data signal Dp1 based on the input clock signal SCK. Then, the ejection control circuit 51 generates a differential printing data signal Dpt corresponding to the analysis result of the differential printing data signal Dp1, and outputs it to the print head 30. At this time, the ejection control circuit 51 can output the differential printing data signal Dp1 as the differential printing data signal Dpt based on the analysis result of Dp1, or it can output the signal obtained after applying predetermined signal processing to the differential printing data signal Dp1 as the differential printing data signal Dpt. Furthermore, the ejection control circuit 51 can also output a signal including predetermined information read from a storage circuit (not shown) as the differential printing data signal Dpt based on the analysis result of the differential printing data signal Dp1.

[0080] Additionally, the ejection control circuit 51, based on the input clock signal SCK, restores the input differential drive data signal Dd1 to a single-ended signal and performs analysis. Then, the ejection control circuit 51 generates base drive signals dA1~dAm and dB1~dBm corresponding to the analysis result and outputs them to the corresponding drive signal output circuits 52a-1~52a-m and 52b-1~52b-m. Alternatively, the ejection control circuit 51, based on the analysis result of the single-ended signal obtained by restoring the differential drive data signal Dd1, reads information stored in a storage circuit (not shown), generates base drive signals dA1~dAm and dB1~dBm including the read information, and outputs them to the corresponding drive signal output circuits 52a-1~52a-m and 52b-1~52b-m. Alternatively, the ejection control circuit 51 can generate a single-ended signal by restoring the differential drive data signal Dd1, and generate base drive signals dA1~dAm and dB1~dBm by deserializing the single-ended signal, and output them to the corresponding drive signal output circuits 52a-1~52a-m and 52b-1~52b-m.

[0081] Here, we will explain by assuming that the base drive signal dA1 output by the ejection control circuit 51 corresponds to the drive signal output circuit 52a-1, and the base drive signal dAm output by the ejection control circuit 51 corresponds to the drive signal output circuit 52a-m. Similarly, we will explain by assuming that the base drive signal dB1 output by the ejection control circuit 51 corresponds to the drive signal output circuit 52b-1, and the base drive signal dBm output by the ejection control circuit 51 corresponds to the drive signal output circuit 52b-m. That is, the base drive signal dA1 is input to the drive signal output circuit 52a-1, the base drive signal dAm is input to the drive signal output circuit 52a-m, the base drive signal dB1 is input to the drive signal output circuit 52b-1, and the base drive signal dBm is input to the drive signal output circuit 52b-m.

[0082] The drive signal output circuit 52a-1 generates the drive signal COMA1 by converting the input base drive signal dA1 from digital to analog and amplifying it in Class D, and outputs it to the print head 30. The drive signal output circuit 52b-1 generates the drive signal COMB1 by converting the input base drive signal dB1 from digital to analog and amplifying it in Class D, and outputs it to the print head 30. Similarly, the drive signal output circuit 52a-m generates the drive signal COMAm by converting the input base drive signal dAm from digital to analog and amplifying it in Class D, and outputs it to the print head 30; the drive signal output circuit 52b-m generates the drive signal COMBm by converting the input base drive signal dBm from digital to analog and amplifying it in Class D, and outputs it to the print head 30.

[0083] That is, each of the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m generates drive signals COMA1 to COMAm and COMB1 to COMBm by digital-to-analog conversion and Class D amplification of the input base drive signals dA1 to dAm and dB1 to dBm, and outputs them to the print head 30. In other words, the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m each include a Class D amplification circuit, the drive signal output circuits 52a-1 to 52a-m output the drive signals COMA1 to COMAm, and the drive signal output circuits 52b-1 to 52b-m output the drive signals COMB1 to COMBm. At this time, each of the base drive signals dA1~dAm and dB1~dBm output by the ejection control circuit 51 is the basis for the drive signals COMA1~COMAm and COMB1~COMBm output by each of the drive signal output circuits 52a-1~52a-m and 52b-1~52b-m, and is a signal that defines the signal waveform of the drive signals COMA1~COMAm and COMB1~COMBm.

[0084] Here, the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m are described as generating drive signals COMA1 to COMAm and COMB1 to COMBm by amplifying the signal waveforms defined by the base drive signals dA1 to dAm and dB1 to dBm in Class D. However, the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m can also generate drive signals COMA1 to COMAm and COMB1 to COMBm by amplifying the signal waveforms defined by the base drive signals dA1 to dAm and dB1 to dBm in Class A, Class B, or Class AB. However, the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m consume a large amount of power, and therefore generate significant heat. From the perspective of reducing power consumption and suppressing heat generation, drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m are required to efficiently generate drive signals COMA1 to COMAm and COMB1 to COMBm.

[0085] In view of this, it is preferable to configure the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m as Class D amplifiers capable of efficiently amplifying the signal waveforms defined by the base drive signals dA1 to dAm and dB1 to dBm. It should be noted that detailed descriptions of the structure of the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m, including Class D amplification, will be provided later.

[0086] Additionally, drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m respectively generate and output reference voltage signals VBS. At this time, drive circuit module 50 stabilizes the voltage value of the reference voltage signal VBS output by drive signal output circuit 52a-1 through capacitor 53. That is, drive circuit module 50 has capacitor 53 for reducing fluctuations in the voltage value of reference voltage signal VBS. Then, after the reference voltage signal VBS stabilizes based on capacitor 53, it is branched and output to print head 30, leaving the wiring for transmitting the reference voltage signal VBS output by each of drive signal output circuits 52a-2 to 52a-m and 52b-1 to 52b-m in an open state. That is, drive circuit module 50 outputs the reference voltage signal VBS output by drive signal output circuit 52a-1 to print head 30, but does not output the reference voltage signal VBS output by each of drive signal output circuits 52a-2 to 52a-m and 52b-1 to 52b-m to print head 30.

[0087] The reference voltage signal VBS functions as a reference potential for driving the piezoelectric element 60, which will be described later, in the printhead 30. When the voltage value of the reference voltage signal VBS, which functions as a reference potential, fluctuates, the driving characteristics of the piezoelectric element 60 change. To address this, by setting the reference voltage signal VBS supplied to the piezoelectric element 60 only to the reference voltage signal VBS output by the drive signal output circuit 52a-1, even if circuit deviations or other factors cause deviations in the voltage value of the reference voltage signal VBS output by each of the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m, the risk of fluctuations in the voltage value of the reference voltage signal VBS supplied to the piezoelectric element 60 is reduced. Therefore, the driving accuracy of the piezoelectric element 60 is improved.

[0088] It should be noted that the reference voltage signal VBS output from the drive circuit module 50, i.e. the reference voltage signal VBS input to the print head 30, can be any reference voltage signal VBS output from any one of the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m, and is not limited to the reference voltage signal VBS output from the drive signal output circuit 52a-1.

[0089] Here, the drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m differ only in the input and output signals; they have the same structure. Therefore, in the following description, without needing to distinguish between drive signal output circuits 52a-1 to 52a-m and 52b-1 to 52b-m, they may be referred to simply as drive signal output circuit 52. In this case, we will assume that the base drive signal dO is input to drive signal output circuit 52, and drive signal output circuit 52 outputs drive signal COM.

[0090] The temperature detection circuit 56 acquires the ambient temperature of the drive circuit module 50. Here, the ambient temperature of the drive circuit module 50 is not the temperature of the components of the drive circuit module 50 itself, but rather includes the ambient temperature of the drive circuit module 50 as the temperature of those components increases. Furthermore, the temperature detection circuit 56 generates a temperature information signal Tt that includes temperature information corresponding to the acquired ambient temperature and outputs it to the head control circuit 12.

[0091] The head control circuit 12 estimates the temperature of the drive circuit module 50 based on the input temperature information signal Tt. Then, based on the estimated temperature of the drive circuit module 50, the head control circuit 12 corrects the clock signal SCK, the differential printing data signals Dp1 to Dpn, and the differential drive data signals Dd1 to Ddn, and outputs the corrected clock signal SCK, differential printing data signals Dp1 to Dpn, and differential drive data signals Dd1 to Ddn. That is, the head control circuit 12 controls the operation of the drive signal output circuits 52a-1 to 52a-m, 52b-1 to 52b-m, and the print head 30 based on the temperature information signal Tt corresponding to the ambient temperature obtained by the temperature detection circuit 56.

[0092] Furthermore, if the estimated temperature of the drive circuit module 50 is above a predetermined threshold, the head control circuit 12 determines that a temperature anomaly has occurred or there is a risk of a temperature anomaly occurring in the drive circuit module 50. In this case, the head control circuit 12 may generate a clock signal SCK, differential printing data signals Dp1 to Dpn, and differential drive data signals Dd1 to Ddn to stop the operation of the drive circuit module 50, and output them to the drive circuit module 50. That is, the head control circuit 12 may stop the operation of the drive signal output circuits 52a-1 to 52a-m, 52b-1 to 52b-m, and the print head 30 based on the temperature information signal Tt corresponding to the ambient temperature obtained by the temperature detection circuit 56.

[0093] Furthermore, the head control circuit 12 may also notify the user of information corresponding to the estimated temperature of the drive circuit module 50, i.e., the temperature information acquired by the temperature detection circuit 56, via a notification unit (not shown) such as a display. Alternatively, the head control circuit 12 may notify the user of a temperature information signal Tt based on the ambient temperature acquired by the temperature detection circuit 56.

[0094] As a temperature detection circuit 56 that detects the ambient temperature inside such a drive circuit module 50, for example, a thermistor element or an IC temperature sensor element can be used. That is, the temperature information signal Tt output by the temperature detection circuit 56 can include temperature information indicating the temperature of the drive circuit module 50 itself, or it can include voltage or current values ​​that change according to the temperature of the drive circuit module 50 as temperature information.

[0095] Additionally, the voltage signals VHV and VMV transmitted in the ejection control module 10 are input to the drive circuit module 50. The voltage signal VHV is transmitted internally within the drive circuit module 50, supplied to various structures within the drive circuit module 50, and also supplied to the printhead 30. The voltage signal VMV is transmitted internally within the drive circuit module 50, supplied to various structures within the drive circuit module 50, and also supplied to the voltage conversion circuit 58. The voltage conversion circuit 58 generates and outputs a voltage signal VDD by stepping down the input voltage signal VMV. The voltage signal VDD output by the voltage conversion circuit 58 is used as the power supply voltage for various circuits within the drive circuit module 50 and is also supplied to the printhead 30. For example, such a voltage signal VDD is a DC voltage such as 5V or 3.3V.

[0096] It should be noted that the voltage signal VDD output by the voltage conversion circuit 58 is not limited to one; it can also be multiple voltage signals VDD with different voltage values ​​output by the voltage conversion circuit 58. Alternatively, the voltage signal VMV can be supplied to the print head 30 together with the voltage signals VHV and VDD.

[0097] The anomaly detection circuit 54 detects anomalies generated in the drive circuit module 50 and generates an anomaly information signal Te and an anomaly notification signal De corresponding to the detection result. This anomaly detection circuit 54 can be configured to include a comparison device that compares whether the detected object is above a predetermined threshold; for example, the anomaly detection circuit 54 can be configured to include a comparator.

[0098] The abnormal information signal Te output by the abnormality detection circuit 54 is input to the head control circuit 12. When the input abnormal information signal Te includes information indicating an abnormality in the drive circuit module 50, the head control circuit 12 generates a clock signal SCK, differential printing data signals Dp1 to Dpn, and differential drive data signals Dd1 to Ddn to stop the operation of the drive circuit module 50, and outputs these signals to the drive circuit module 50. As a result, the operation of the drive circuit module 50 stops.

[0099] Additionally, the abnormality notification signal De output by the abnormality detection circuit 54 is input to the abnormality notification circuit 55. For example, the abnormality notification circuit 55 includes a light-emitting element such as a light-emitting diode. Thus, the abnormality notification circuit 55 notifies the user whether an abnormality has occurred in the drive circuit module 50 by having the light-emitting element light up, turn off, or flash based on the input abnormality notification signal De.

[0100] Here, an example of the operation of the anomaly detection circuit 54 and the anomaly notification circuit 55 will be explained.

[0101] For example, if the anomaly detection circuit 54 detects that the voltage value of the voltage signal VHV is lower than the normal value, the anomaly detection circuit 54 determines that the voltage value of the voltage signal VHV is abnormal, generates an anomaly notification signal De to prompt the user's attention, and outputs it to the anomaly notification circuit 55. Based on the input anomaly notification signal De, the anomaly notification circuit 55 causes the light-emitting element to flash in order to notify the user that the voltage value of the voltage signal VHV has decreased.

[0102] Subsequently, if the voltage value of the voltage signal VHV decreases further, and the anomaly detection circuit 54 detects that the voltage value of the voltage signal VHV is lower than a predetermined threshold, the anomaly detection circuit 54 determines that the voltage value of the voltage signal VHV is abnormal, generates an anomaly notification signal De to notify the user of the anomaly, and outputs it to the anomaly notification circuit 55. Based on the input anomaly notification signal De, the anomaly notification circuit 55 illuminates the light-emitting element to notify that the voltage value of the voltage signal VHV is abnormal. At this time, the anomaly detection circuit 54 generates an anomaly information signal Te that includes an anomaly information indicating an anomaly in the drive circuit module 50, namely, an abnormal voltage value of the voltage signal VHV, and outputs it to the head control circuit 12.

[0103] Additionally, for example, if the anomaly detection circuit 54 detects that the voltage value of the voltage signal VDD, such as the power supply voltage of the FPGA constituting the ejection control circuit 51, is lower than the normal value, the anomaly detection circuit 54 determines that the voltage value of the voltage signal VDD is abnormal, generates an anomaly notification signal De to attract the user's attention, and outputs it to the anomaly notification circuit 55. Based on the input anomaly notification signal De, the anomaly notification circuit 55 causes the light-emitting element to flash in order to notify the user that the voltage value of the voltage signal VDD has decreased.

[0104] Subsequently, if the voltage value of the voltage signal VDD decreases further, and the anomaly detection circuit 54 detects that the voltage value of the voltage signal VDD is lower than a predetermined threshold, the anomaly detection circuit 54 determines that the voltage value of the voltage signal VDD is abnormal, generates an anomaly notification signal De to notify the user of the anomaly, and outputs it to the anomaly notification circuit 55. Based on the input anomaly notification signal De, the anomaly notification circuit 55 illuminates the light-emitting element to indicate that the voltage value of the voltage signal VDD is abnormal. At this time, the anomaly detection circuit 54 generates an anomaly information signal Te that includes an anomaly information indicating an anomaly in the drive circuit module 50, namely, an abnormal voltage value of the voltage signal VDD, and outputs it to the head control circuit 12.

[0105] Here, the number of light-emitting elements in the abnormality notification circuit 55 is not limited to one. For example, it may have separate light-emitting elements for notifying the presence or absence of abnormalities in the voltage signal VHV and for notifying the presence or absence of abnormalities in the voltage signal VDD. Furthermore, when the abnormality notification circuit 55 has multiple light-emitting elements, the presence or absence of abnormalities in the drive circuit module 50 can be notified to the user through a combination of the lighting, extinguishing, and flashing of these multiple light-emitting elements. In addition, in the above description, the detection of the presence or absence of abnormalities in the drive circuit module 50 by the abnormality detection circuit 54 is exemplified by detecting the presence or absence of abnormalities in the voltage values ​​of the voltage signal VHV and the voltage values ​​of the voltage signal VDD. However, the abnormality detection circuit 54 may also replace the detection of abnormalities in the voltage values ​​of the voltage signals VHV and VDD, or it may detect the presence or absence of abnormalities in the heating of the drive circuit module 50 based on the temperature information signal Tt output by the temperature detection circuit 56, or it may detect the presence or absence of abnormalities in the voltage of the voltage signal VMV.

[0106] The fan drive signal Fp1 output by the cooling fan drive circuit 14 is input to the cooling fan 59. The cooling fan 59 is then driven based on the input fan drive signal Fp1, causing the drive circuit module 50 to generate airflow. The drive circuit module 50 is cooled by the airflow generated by the cooling fan 59. Alternatively, the head control circuit 12 can output a fan control signal Fc based on the temperature information signal Tt output by the temperature detection circuit 56. Thus, the driving state of the cooling fan 59 is controlled according to the temperature detection result of the temperature detection circuit 56, i.e., the temperature condition of the drive circuit module 50, which is being cooled. As a result, the risk of increased power consumption due to excessive drive of the cooling fan 59 is reduced, thus reducing the power consumption of the liquid ejection device 1 and also reducing the risk of abnormal temperature in the drive circuit module 50.

[0107] The printhead 30 includes a recovery circuit 31 and ejection modules 32-1 to 32-m. The recovery circuit 31 operates using voltage signals VHV and VDD, or a DC voltage generated based on VHV and VDD, as its power supply voltage. The recovery circuit 31 recovers the differential printing data signal Dpt from the differential signal output by the ejection control circuit 51 into a single-ended signal. Specifically, the clock signal SCK and the differential printing data signal Dpt are input to the recovery circuit 31. Then, based on the clock signal SCK, the recovery circuit 31 recovers the input differential printing data signal Dpt into a single-ended signal and deserializes the recovered signal, thereby generating a latch signal LAT, a change signal CH, and printing data signals SI1 to SIm. The recovery circuit 31 then outputs the clock signal SCK, the generated latch signal LAT, the change signal CH, and the printing data signals SI1 to SIm to the corresponding ejection modules 32-1 to 32-m.

[0108] The ejection module 32-1 includes a drive signal selection circuit 200 and multiple ejection sections 600.

[0109] The latch signal LAT, change signal CH, printing data signal SI1, clock signal SCK, and drive signals COMA1 and COMB1 output from the recovery circuit 31 are input to the drive signal selection circuit 200. The drive signal selection circuit 200 operates by using voltage signals VHV and VDD, or a DC voltage generated based on voltage signals VHV and VDD, as the power supply voltage. Within each period defined by the latch signal LAT and the change signal CH, based on the printing data signal SI1, it sets the signal waveform included in the drive signal COMA1 to be selected or not selected, and sets the signal waveform included in the drive signal COMB1 to be selected or not selected, thereby generating and outputting a drive signal VOUT corresponding to each of the plurality of ejector sections 600. That is, when the ejector module 32-1 has p ejector sections 600, the drive signal selection circuit 200 generates p drive signals VOUT corresponding to each of the p ejector sections 600 and outputs them to the corresponding ejector section 600.

[0110] Each of the multiple ejector sections 600 includes a piezoelectric element 60. A corresponding drive signal VOUT output from the drive signal selection circuit 200 is supplied to one end of the piezoelectric element 60. Additionally, a reference voltage signal VBS is commonly supplied to the other end of each of the multiple piezoelectric elements 60 included in each of the multiple ejector sections 600. Then, each of the multiple piezoelectric elements 60 included in each of the multiple ejector sections 600 is displaced based on the potential difference between the drive signal VOUT and the reference voltage signal VBS. An amount of ink corresponding to the displacement of the piezoelectric element 60 is ejected from the corresponding ejector section 600. The ink ejected from the ejector section 600 then adheres to the medium P, forming an image on the medium P. It should be noted that the detailed operation of the drive signal selection circuit 200 for outputting the drive signal VOUT will be explained later.

[0111] Here, the ejection modules 32-2 to 32-m of the printhead 30 differ only in the input signals; they have the same structure as the ejection module 32-1 and perform the same operations. Therefore, a detailed description of the ejection modules 32-2 to 32-m is omitted. Specifically, each of the ejection modules 32-2 to 32-m includes a drive signal selection circuit 200 and multiple ejection sections 600. Then, the drive signal selection circuit 200 of each of the ejection modules 32-2 to 32-m, within each period specified by the input latch signal LAT and change signal CH, sets the signal waveforms of the corresponding drive signals COMA2 to COMAm to be selected or deselected based on the corresponding print data signals SI2 to SIm, thereby outputting a drive signal VOUT corresponding to each of the multiple ejection sections 600. As a result, each of the plurality of ejector sections 600 in each of the ejector modules 32-2 to 32-m ejects an amount of ink corresponding to the potential difference between the input drive signal VOUT and the reference voltage signal VBS.

[0112] In other words, the printhead 30 has ejection modules 32-1 to 32-m. Furthermore, ejection module 32-1 includes an ejection section 600 and a drive signal selection circuit 200. The ejection section 600 includes a piezoelectric element 60, which is displaced by receiving a drive signal VOUT based on drive signals COMA1 and COMB1. The ejection section 600 ejects ink based on the displacement of the piezoelectric element 60. The drive signal selection circuit 200 switches whether to supply drive signals COMA1 and COMB1 to the piezoelectric element 60. Ejection module 32-m includes an ejection section 600 and a drive signal selection circuit 200. The ejection section 600 includes a piezoelectric element 60, which is displaced by receiving a drive signal VOUT based on drive signals COMAm and COMBm. The ejection section 600 ejects ink based on the displacement of the piezoelectric element 60. The drive signal selection circuit 200 switches whether to supply drive signals COMAm and COMBm to the piezoelectric element 60.

[0113] In the following description, without needing to distinguish between the ejection modules 32-1 to 32-m, they may be referred to simply as ejection module 32. Furthermore, the description will assume that the printing data signal SI (SI1 to SIm), the drive signal COMA (COMA1 to COMAm), and the drive signal COMB (COMB1 to COMBm) are input to the ejection module 32. That is, the drive signal selection circuit 200 of the ejection module 32, within each period defined by the latch signal LAT and the change signal CH, selects or deselects the signal waveform included in the drive signal COMA based on the printing data signal SI, thereby outputting a drive signal VOUT corresponding to each of the plurality of ejection units 600.

[0114] As described above, the liquid ejection module 20-1 has a drive circuit module 50 and a printhead 30. It operates based on the clock signal SCK, differential printing data signal Dp1, differential drive data signal Dd1, fan drive signal Fp1, and voltage signals VHV and VMV output by the ejection control module 10. In this way, at the timing specified by the differential printing data signal Dp1 and the differential drive data signal Dd1, the amount of ink specified by the differential printing data signal Dp1 and the differential drive data signal Dd1 is ejected to the medium P.

[0115] Here, the liquid ejection modules 20-2 to 20-n differ only in the input signals; they have the same structure as liquid ejection module 20-1 and perform the same actions. Therefore, a detailed description of liquid ejection modules 20-2 to 20-n is omitted. That is, each of the liquid ejection modules 20-2 to 20-n has a drive circuit module 50 and a printhead 30. It operates based on the clock signal SCK output by the ejection control module 10, the corresponding differential printing data signals Dp2 to Dpn, the corresponding differential drive data signals Dd2 to Ddn, the corresponding fan drive signals Fp2 to Fpn, and the voltage signals VHV and VMV. At the timing specified by the corresponding differential printing data signals Dp2 to Dpn and the corresponding differential drive data signals Dd2 to Ddn, it ejects the amount of ink specified by the corresponding differential printing data signals Dp2 to Dpn and the corresponding differential drive data signals Dd2 to Ddn onto the medium P.

[0116] As described above, the liquid ejection device 1 includes a printhead 30 for ejecting ink, a drive circuit module 50 electrically connected to the printhead 30, a control unit 2 for controlling the operation of the printhead 30 and the drive circuit module 50, and a head control circuit 12. Furthermore, the head unit 3 of the liquid ejection device 1, which includes the ejection control module 10, the printhead 30, and the drive circuit module 50, is driven by voltage signals VHV and VMV input from the control unit 2 as a power supply voltage, ejecting ink at a timed interval based on the printing data signal pDATA, thereby forming an image corresponding to the printing data signal pDATA, i.e., an image corresponding to the image data DATA, on the medium P.

[0117] 1.3 Functional Structure of Drive Signal Output Circuit

[0118] Next, the structure and operation of the output circuit 52 for the output drive signal COM will be explained. Figure 3 This is a diagram showing the structure of the drive signal output circuit 52. The drive signal output circuit 52 includes an integrated circuit 500, an amplifier circuit 550, a demodulation circuit 560, feedback circuits 570 and 572, and other electronic components.

[0119] Integrated circuit 500 has multiple terminals including terminal In, terminal Bst, terminal Hdr, terminal Sw, terminal Gvd, terminal Ldr, terminal Gnd, terminal Vbs, terminal Vfb, and terminal Ifb. Integrated circuit 500 is electrically connected to an external substrate (not shown) via these terminals. Additionally, integrated circuit 500 includes a DAC (Digital to Analog Converter) 511, a modulation circuit 510, a gate drive circuit 520, and a reference power supply circuit 590.

[0120] The reference power supply circuit 590 generates voltage signals DAC_HV and DAC_LV and supplies them to DAC 511. Additionally, a digital base drive signal dO, which defines the waveform of the drive signal COM, is input to DAC 511. DAC 511 converts the input base drive signal dO into an analog signal, i.e., a base drive signal aO, representing the voltage value between the voltage values ​​of DAC_HV and DAC_LV, and outputs it to the modulation circuit 510. That is, the maximum value of the voltage amplitude of the base drive signal aO is defined by the voltage signal DAC_HV, and the minimum value is defined by the voltage signal DAC_LV. Furthermore, the signal obtained by amplifying the base drive signal aO output by DAC 511 is equivalent to the drive signal COM. In other words, the base drive signal aO is equivalent to the target signal before amplification of the drive signal COM, and the base drive signals dO and aO are signals that define the waveform of the drive signal COM.

[0121] The modulation circuit 510 generates a modulation signal Ms obtained by modulating the base drive signal aO and outputs it to the gate drive circuit 520. The modulation circuit 510 includes adders 512 and 513, comparator 514, inverter 515, integrator attenuator 516, and attenuator 517.

[0122] The integrator attenuator 516 attenuates and integrates the drive signal COM input via terminal Vfb, and outputs it to the - input terminal of adder 512. The base drive signal aO is input to the + input terminal of adder 512. Then, adder 512 outputs the voltage obtained by subtracting the voltage of the input terminal on the - side from the voltage of the input terminal on the + side and integrating it to the + input terminal of adder 513.

[0123] Attenuator 517 attenuates the high-frequency component of the drive signal COM input via terminal Ifb and outputs the resulting voltage to the - input terminal of adder 513. The voltage output from adder 512 is input to the + input terminal of adder 513. Then, adder 513 generates a voltage signal Os by subtracting the voltage from the - input terminal from the voltage input to the + input terminal and outputs it to comparator 514.

[0124] The comparator 514 outputs a modulated signal Ms obtained by pulse modulation of the voltage signal Os input from the adder 513. Specifically, the comparator 514 generates and outputs the modulated signal Ms. The modulated signal Ms reaches a predetermined threshold Vth1 (high level) when the voltage value of the voltage signal Os input from the adder 513 increases, and reaches a predetermined threshold Vth2 (low level) when the voltage value of the voltage signal Os decreases. Here, the thresholds Vth1 and Vth2 are set to a relationship where threshold Vth1 ≥ threshold Vth2.

[0125] The modulated signal Ms output by comparator 514 is input to gate driver 521, which is included in gate driver circuit 520, and further input to gate driver 522, which is included in gate driver circuit 520, via inverter 515. That is, signals with an exclusive logic level are input to gate driver 521 and gate driver 522. Here, the exclusive logic level means that the logic levels of the signals input to gate driver 521 and gate driver 522 are not simultaneously H level. Therefore, the modulation circuit 510 may replace inverter 515, or the inverter 515 may include a timing control circuit for controlling the timing between the modulated signal Ms input to gate driver 521 and the signal obtained by flipping the logic level of the modulated signal Ms input to gate driver 522.

[0126] The gate drive circuit 520 includes a gate driver 521 and a gate driver 522. The gate driver 521 generates an amplified control signal Hgd by shifting the level of the modulation signal Ms output from the comparator 514, and outputs it from the terminal Hdr.

[0127] Specifically, in the power supply voltage of the gate driver 521, the high-side voltage is supplied via terminal Bst, and the low-side voltage is supplied via terminal Sw. Terminal Bst is connected to one end of capacitor C5 and the cathode of diode D1 for reverse current prevention. Terminal Sw is connected to the other end of capacitor C5. Additionally, the anode of diode D1 is connected to terminal Gvd. Furthermore, a DC voltage, such as 7.5V, output from a power supply circuit (not shown), i.e., a voltage signal Vm, is supplied to terminal Gvd. That is, a voltage signal Vm is supplied to the anode of diode D1. Therefore, the potential difference between terminal Bst and terminal Sw becomes approximately equal to the voltage value of the voltage signal Vm. As a result, the gate driver 521 generates an amplified control signal Hgd at terminal Sw based on the input modulation signal Ms, with a voltage value exactly equal to the voltage value of the voltage signal Vm, and outputs it from terminal Hdr.

[0128] Gate driver 522 operates on the side with a lower potential than gate driver 521. Gate driver 522 generates an amplified control signal Lgd by shifting the signal level obtained by the inverter 515 flipping the logic level of the modulation signal Ms output from comparator 514, and outputs it from terminal Ldr.

[0129] Specifically, in the power supply voltage of the gate driver 522, a voltage signal Vm is supplied to the high-order side, and a ground potential GND is supplied to the low-order side via the terminal Gnd. Therefore, the gate driver 522 outputs an amplified control signal Lgd from the terminal Ldr to the terminal Gnd, based on the signal obtained by inverting the logic level of the input modulation signal Ms., with a voltage value exactly equal to the voltage value of the voltage signal Vm. Here, the ground potential GND refers to the reference potential of the drive signal output circuit 52, for example, 0V.

[0130] The amplifier circuit 550 includes transistor M1 and transistor M2.

[0131] Transistor M1 is a surface-mount FET (Field Effect Transistor). A voltage signal VHV is supplied to the drain of transistor M1 as the power supply voltage for amplifier circuit 550. Furthermore, the gate of transistor M1 is electrically connected to one end of resistor R1, and the other end of resistor R1 is electrically connected to terminal Hdr of integrated circuit 500. That is, the amplification control signal Hgd is input to the gate of transistor M1. Additionally, the source of transistor M1 is electrically connected to terminal Sw of integrated circuit 500.

[0132] Transistor M2 is a surface-mount FET. The drain of transistor M2 is electrically connected to terminal Sw of integrated circuit 500. That is, the drain of transistor M2 is electrically connected to the source of transistor M1. The gate of transistor M2 is electrically connected to one end of resistor R2, and the other end of resistor R2 is electrically connected to terminal Ldr of integrated circuit 500. In other words, the amplified control signal Lgd is input to the gate of transistor M2. Additionally, a ground potential GND is supplied to the source of transistor M2.

[0133] Furthermore, when the drain and source of transistor M1 are controlled to be non-conductive, and the drain and source of transistor M2 are controlled to be conductive, the potential of the node connected to terminal Sw becomes the ground potential GND. Therefore, a voltage signal Vm is supplied to terminal Bst. On the other hand, when the drain and source of transistor M1 are controlled to be conductive, and the drain and source of transistor M2 are controlled to be non-conductive, the potential of the node connected to terminal Sw becomes the voltage value of the voltage signal VHV. Therefore, the potential of the sum of the voltage values ​​of voltage signal VHV and voltage signal Vm is supplied to terminal Bst. That is, the gate driver 521 driven by transistor M1 uses capacitor C5 as a floating power source. According to the operation of transistors M1 and M2, the potential of terminal Sw changes to ground potential GND or voltage value of voltage signal VHV. In this way, an amplified control signal Hgd is generated, with L level being the voltage value of voltage signal VHV and H level being the sum of voltage values ​​of voltage signal VHV and voltage signal Vm, and is output to the gate of transistor M1.

[0134] On the other hand, the gate driver 522 driven by transistor M2 generates an amplified control signal Lgd with L level being ground potential GND and H level being the voltage value of voltage signal Vm in a manner independent of the operation of transistors M1 and M2, and outputs it to the gate of transistor M2.

[0135] The amplifier circuit 550, constructed as described above, generates an amplified modulation signal AMs at the connection point between the source of transistor M1 and the drain of transistor M2, which amplifies the modulation signal Ms based on the voltage signal VHV. Then, the amplifier circuit 550 outputs the generated amplified modulation signal AMs to the demodulation circuit 560.

[0136] Here, a capacitor C7 is provided in the transmission path of the voltage signal VHV input to the amplifier circuit 550. Specifically, one end of the capacitor C7 is connected to the drain of the transistor M1 via the transmission path for the voltage signal VHV, and the other end of the capacitor C7 is supplied with a ground potential GND. This reduces the risk of voltage value fluctuations in the voltage signal VHV input to the amplifier circuit 550, and also reduces the risk of noise overlap in the voltage signal VHV. As a result, the waveform accuracy of the amplified modulation signal AMs output by the amplifier circuit 550 is improved. Therefore, a high-voltage and large-capacity electrolytic capacitor is used. It should be noted that the capacitor C7 can be configured to correspond to one drive signal output circuit 52 or multiple drive signal output circuits 52.

[0137] The demodulation circuit 560 generates a drive signal COM by demodulating the amplified modulation signal AMs output from the amplifier circuit 550, and outputs it from the drive signal output circuit 52. The demodulation circuit 560 includes an inductor L1 and a capacitor C1. One end of the inductor L1 is connected to one end of the capacitor C1. The amplified modulation signal AMs is input to the other end of the inductor L1. Furthermore, the other end of the capacitor C1 is supplied with a ground potential GND. That is, in the demodulation circuit 560, the inductor L1 and the capacitor C1 constitute a low-pass filter. The demodulation circuit 560 demodulates the amplified modulation signal AMs by smoothing it using this low-pass filter, and outputs the demodulated signal as the drive signal COM. In other words, the drive signal output circuit 52 outputs the drive signal COM from one end of the inductor L1 and one end of the capacitor C1 included in the demodulation circuit 560.

[0138] The feedback circuit 570 includes resistors R3 and R4. One end of resistor R3 is supplied with a drive signal COM, and the other end is connected to terminal Vfb and one end of resistor R4. The other end of resistor R4 is supplied with a voltage signal VHV. Thus, the drive signal COM, passing through the feedback circuit 570, is fed back to terminal Vfb in a state where it is pulled up at the voltage value of the voltage signal VHV.

[0139] Feedback circuit 572 includes capacitors C2, C3, and C4, and resistors R5 and R6. The drive signal COM is input to one end of capacitor C2, and the other end of capacitor C2 is connected to one end of resistor R5 and one end of resistor R6. A ground potential GND is supplied to the other end of resistor R5. Thus, capacitor C2 and resistor R5 function as a high-pass filter. Additionally, the other end of resistor R6 is connected to one end of capacitor C4 and one end of capacitor C3. A ground potential GND is supplied to the other end of capacitor C3. Thus, resistor R6 and capacitor C3 function as a low-pass filter. In other words, feedback circuit 572 includes a high-pass filter and a low-pass filter, functioning as a band-pass filter that allows signals in a predetermined frequency domain included in the drive signal COM to pass through.

[0140] Furthermore, the other end of capacitor C4 is connected to terminal Ifb of integrated circuit 500. Thus, a signal whose DC component is cut off from the high-frequency component of the drive signal COM, which passes through the feedback circuit 572 (which functions as a bandpass filter), is fed back to terminal Ifb.

[0141] The drive signal COM is obtained by smoothing the amplified and modulated signal AMs based on the base drive signal dO using the demodulation circuit 560. Furthermore, the drive signal COM is integrated and subtracted via terminal Vfb and then fed back to adder 512. As a result, the drive signal output circuit 52 self-oscillates at a frequency determined by the feedback delay and the feedback transfer function. Since the feedback path via terminal Vfb has a relatively large delay, there is a possibility that the feedback via terminal Vfb alone cannot raise the self-oscillation frequency to a level sufficient to ensure the accuracy of the drive signal COM. Therefore, in addition to the path via terminal Vfb, a path is provided to feed back the high-frequency components of the drive signal COM via terminal Ifb to reduce the delay when viewed from the perspective of the entire circuit. Thus, compared to the case where the path via terminal Ifb does not exist, the frequency of the voltage signal Os can be raised to a level sufficient to ensure the accuracy of the drive signal COM.

[0142] Additionally, integrated circuit 500 includes a reference voltage signal output circuit 530. The reference voltage signal output circuit 530 outputs a reference voltage signal VBS. This reference voltage signal output circuit 530 uses a bandgap reference voltage generated in integrated circuit 500 as a reference potential, for example, generated by stepping down or boosting a voltage signal Vm based on this reference potential. The reference voltage signal output circuit 530 then outputs the generated reference voltage signal VBS from drive signal output circuit 52 via terminal Vbs.

[0143] As described above, after the input base drive signal dO is digitally converted to analog, the drive signal output circuit 52 amplifies the analog signal in Class D to generate the drive signal COM, and outputs the generated drive signal COM, thereby generating and outputting the reference voltage signal VBS. It should be noted that the reference voltage signal output circuit 530 that generates the reference voltage signal VBS can have a different structure from the drive signal output circuit 52, or it can have the same structure as the drive signal output circuit 52. By integrating it into a single integrated circuit 500, the circuit size of the drive circuit module 50, including the drive signal output circuit 52 and the drive signal output circuit 52, can be reduced.

[0144] That is, each of the drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 in the liquid ejection device 1 of this embodiment includes an integrated circuit 500, transistors M1 and M2, and an inductor L1. Furthermore, the drive signal output circuits 52a-m and 52b-m output drive signals COMAm and COMBm to the print head 30 to displace the piezoelectric element 60 in order to eject ink from the ejection module 32-m of the print head 30.

[0145] Furthermore, the reference voltage signal VBS supplied to the other end of the piezoelectric element 60 of each of the ejection modules 32-1 to 32-m is output from the integrated circuit 500 of the drive signal output circuit 52a-1. That is, the drive signal output circuit 52a-1 has a reference voltage signal output circuit 530 that outputs the reference voltage signal VBS to the printhead 30, and at least a portion of the reference voltage signal output circuit 530 is included in the integrated circuit 500 of the drive signal output circuit 52a-1.

[0146] 1.4 Functional Structure of Drive Signal Selection Circuit

[0147] Next, the structure and operation of the drive signal selection circuit 200 will be explained. When explaining the structure and operation of the drive signal selection circuit 200, examples of the signal waveforms of the drive signals COMA and COMB input to the drive signal selection circuit 200, and an example of the signal waveform of the drive signal VOUT output from the drive signal selection circuit 200 will be provided.

[0148] Figure 4 This is a diagram illustrating an example of the signal waveforms for the drive signals COMA and COMB. (See diagram for example.) Figure 4As shown, the drive signal COMA is a signal waveform that continuously generates trapezoidal waveform Adp1 during the period t1 from the rise of latch signal LAT to the rise of change signal CH, and trapezoidal waveform Adp2 during the period t2 from the rise of change signal CH to the rise of latch signal LAT. Furthermore, trapezoidal waveform Adp1 is a signal waveform that causes a predetermined amount of ink to be ejected from the ejection section 600 when supplied to the piezoelectric element 60 included in the ejection section 600, and trapezoidal waveform Adp2 is a signal waveform that causes a greater than predetermined amount of ink to be ejected from the ejection section 600 when supplied to the piezoelectric element 60 included in the ejection section 600. In the following description, the amount of ink ejected from the ejector section 600 when the trapezoidal waveform Adp1 is supplied to the piezoelectric element 60 included in the ejector section 600 is referred to as a small amount, and the amount of ink ejected from the ejector section 600 when the trapezoidal waveform Adp2 is supplied to the piezoelectric element 60 included in the ejector section 600 is referred to as a medium amount.

[0149] In addition, such as Figure 4 As shown, the drive signal COMB is a signal waveform that makes the trapezoidal waveform Bdp1 configured during period t1 and the trapezoidal waveform Bdp2 configured during period t2 continuous. Furthermore, trapezoidal waveform Bdp1 is a signal waveform that prevents ink from being ejected from the ejection section 600 when supplied to the piezoelectric element 60 included in the ejection section 600, and trapezoidal waveform Bdp2 is a signal waveform that causes a small amount of ink to be ejected from the ejection section 600 when supplied to the piezoelectric element 60 included in the ejection section 600. Here, trapezoidal waveform Bdp1 is a signal waveform used to vibrate the ink near the nozzle opening of the ejection section 600 to the point where ink is not ejected, thereby preventing an increase in ink viscosity. In the following description, there is a case where the operation of vibrating the ink near the nozzle opening when the trapezoidal waveform Bdp1 is supplied to the piezoelectric element 60 included in the ejection section 600 is referred to as micro-vibration.

[0150] Here, as Figure 4 As shown, the voltage values ​​at the start and end of the timing of each of the trapezoidal waveforms Adp1, Adp2, Bdp1, and Bdp2 are the same as the voltage Vc. That is, each of the trapezoidal waveforms Adp1, Adp2, Bdp1, and Bdp2 begins and ends with voltage Vc. Furthermore, the period tp, consisting of periods t1 and t2, corresponds to the printing period in which a new point is formed on the medium P.

[0151] It should be noted that, in Figure 4The diagram illustrates a case where trapezoidal waveforms Adp1 and Bdp2 are the same signal waveform. However, it is also possible for Adp1 and Bdp2 to be different signal waveforms. Furthermore, the explanation assumes that both Adp1 and Bdp2 are supplied to the piezoelectric element 60 included in the ejection section 600, resulting in a small amount of ink being ejected from the ejection section 600. However, this is not a limitation. That is, the signal waveforms of the drive signals COMA and COMB are not limited to... Figure 4 The signal waveform shown can also be used in various combinations of signal waveforms depending on the nature of the ink ejected from the ejection section 600, the material of the medium P to which the ejected ink is applied, etc.

[0152] in addition, Figure 4 The example illustrates a case where a single change signal CH specifies the timing of the switching between trapezoidal waveforms Adp1 and Adp2 included in the drive signal COMA, and the timing of the switching between trapezoidal waveforms Bdp1 and Bdp2 included in the drive signal COMB. However, it is also possible that the change signal CH specifying the timing of the switching between trapezoidal waveforms Adp1 and Adp2 included in the drive signal COMA and the change signal CH specifying the timing of the switching between trapezoidal waveforms Bdp1 and Bdp2 included in the drive signal COMB are different signals.

[0153] Figure 5 This is a diagram illustrating an example of the signal waveform of the drive signal VOUT when the size of each point formed on medium P is a large point LD, a medium point MD, a small point SD, and an unrecorded point ND.

[0154] like Figure 5 As shown, the driving signal VOUT for the formation of large dot LDs on medium P is a continuous signal waveform consisting of a trapezoidal waveform Adp1 during period t1 within a period tp and a trapezoidal waveform Adp2 during period t2 within a period tp. When this driving signal VOUT is supplied to the piezoelectric element 60 included in the ejection section 600, small and medium amounts of ink are ejected from the corresponding ejection section 600. Then, each ink adheres to medium P and combines, thereby forming large dot LDs on medium P within a period tp.

[0155] When the midpoint MD is formed on the medium P, the drive signal VOUT becomes a continuous signal waveform consisting of a trapezoidal waveform Adp1 during period t1 within the period tp and a trapezoidal waveform Bdp2 during period t2 within the period tp. When this drive signal VOUT is supplied to the piezoelectric element 60 included in the ejection section 600, two small amounts of ink are ejected from the corresponding ejection section 600. Then, each ink adheres to the medium P and combines, thereby forming the midpoint MD on the medium P within the period tp.

[0156] When small dots SD are formed on medium P, the driving signal VOUT becomes a continuous signal waveform consisting of a trapezoidal waveform Adp1 during period t1 within period tp and a signal waveform with a fixed voltage Vc during period t2 within period tp. When this driving signal VOUT is supplied to the piezoelectric element 60 included in the ejection section 600, a small amount of ink is ejected once from the corresponding ejection section 600. Then, this ink adheres to medium P, thereby forming small dots SD on medium P within period tp.

[0157] The drive signal VOUT, corresponding to the non-recording ND that does not form dots on the medium P, becomes a continuous signal waveform with a trapezoidal waveform Bdp1 during period t1 within the period tp and a fixed voltage Vc during period t2 within the period tp. When this drive signal VOUT is supplied to the piezoelectric element 60 included in the ejection section 600, the ink near the nozzle opening of the corresponding ejection section 600 only vibrates slightly, and no ink is ejected from the ejection section 600. Thus, no dots are formed on the medium P within the period tp.

[0158] Here, the signal waveform in the drive signal VOUT that is fixed as voltage Vc refers to the voltage Vc of the trapezoidal waveforms Adp1, Adp2, Bdp1, and Bdp2 that is equivalent to the voltage value maintained by the capacitance component of the piezoelectric element 60 included in the ejection section 600 when none of the trapezoidal waveforms Adp1, Adp2, Bdp1, and Bdp2 are selected as drive signal VOUT. That is, when none of the trapezoidal waveforms Adp1, Adp2, Bdp1, and Bdp2 are selected as drive signal VOUT, the previously supplied voltage Vc is supplied as drive signal VOUT to the piezoelectric element 60 included in the ejection section 600.

[0159] Here, as Figure 5As shown, the drive signal selection circuit 200 generates a drive signal VOUT corresponding to each of the plurality of ejector sections 600 by setting the trapezoidal waveforms Adp1 and Adp2 included in the drive signal COMA and the trapezoidal waveforms Bdp1 and Bdp2 included in the drive signal COMB to be selected or not selected, and outputs it to the piezoelectric element 60 included in the corresponding ejector section 600.

[0160] Figure 6 This is a diagram illustrating the functional structure of the drive signal selection circuit 200. (See diagram for example.) Figure 6 As shown, the drive signal selection circuit 200 includes a selection control circuit 210 and multiple selection circuits 230. Additionally, in Figure 6 The diagram also shows multiple ejector sections 600 supplied with the drive signal VOUT output from the drive signal selection circuit 200. It should be noted that in the following description, the ejector module 32, which includes the drive signal selection circuit 200 and the multiple ejector sections 600, is described as having p ejector sections 600.

[0161] Printing data signal SI, clock signal SCK, latch signal LAT, and change signal CH are input to selection control circuit 210. In selection control circuit 210, groups of registers 212, latch circuits 214, and decoders 216 are configured to correspond to each of the p ejector sections 600. That is, selection control circuit 210 includes groups of registers 212, latch circuits 214, and decoders 216 at least as many as the p ejector sections 600.

[0162] The printing data signal SI is a signal synchronized with the clock signal SCK. It is a 2p-bit signal serially comprising 2 bits of printing data [SIH, SIL] for selecting any one of the large dot LD, medium dot MD, small dot SD, and non-recording ND for each of the p ejector sections 600. The printing data signal SI corresponds to each of the p ejector sections 600, and the printing data [SIH, SIL] included in each printing data signal SI is stored in register 212.

[0163] Specifically, in the selection control circuit 210, registers 212 are cascaded together to form a p-segment shift register. Printing data [SIH, SIL], input serially as printing data signals SI, is then sequentially transmitted to the subsequent registers 212 according to the clock signal SCK. Then, the supply of the clock signal SCK stops, thereby storing the printing data [SIH, SIL] corresponding to each of the p ejector sections 600 in the register 212 corresponding to each of the p ejector sections 600. It should be noted that in the following description, to distinguish the p registers 212 constituting the shift register, they may be referred to as segment 1, segment 2, ..., segment p from the upstream side of the printing data signal SI transmission towards the downstream side.

[0164] Each of the p latch circuits 214 is configured to correspond to a p register 212. Each latch circuit 214 latches the printed data [SIH, SIL] of each of the p registers 212 together with the latch signal LAT as the latch signal rises, and outputs it to the corresponding decoder 216.

[0165] Figure 7 This is a diagram illustrating an example of the decoded content in decoder 216. Decoder 216 uses... Figure 7 The content shown decodes the printed data [SIH, SIL] latched by latch circuit 214 to generate and output selection signals S1 and S2. For example, when the input printed data [SIH, SIL] is [1, 0], decoder 216 sets the logic level of selection signal S1 to H and L levels during periods t1 and t2 and outputs it to selection circuit 230, and sets the logic level of selection signal S2 to L and H levels during periods t1 and t2 and outputs it to selection circuit 230.

[0166] The selection circuit 230 is configured to correspond to each of the p ejector sections 600. That is, the drive signal selection circuit 200 has at least p selection circuits 230, which is the same number as the p ejector sections 600. Figure 8 This diagram shows the structure of a selection circuit 230 corresponding to the ejector section 600. (See diagram for example.) Figure 8 As shown, the selection circuit 230 includes inverters 232a and 232b as NOT circuits and transmission gates 234a and 234b.

[0167] Selection signal S1 is input to the positive control terminal of transmission gate 234a (without the circular mark). Simultaneously, selection signal S1 is logically flipped by inverter 232a and input to the negative control terminal of transmission gate 234a (marked with the circular mark). A drive signal COMA is supplied to the input terminal of transmission gate 234a. Selection signal S2 is input to the positive control terminal of transmission gate 234b (without the circular mark). Simultaneously, selection signal S2 is logically flipped by inverter 232b and input to the negative control terminal of transmission gate 234b (marked with the circular mark). A drive signal COMB is supplied to the input terminal of transmission gate 234b. Furthermore, the output terminals of transmission gates 234a and 234b are connected in common. The signal at this common connection point between the output terminals of transmission gates 234a and 234b is output as the drive signal VOUT.

[0168] Specifically, when the selection signal S1 is at level H, the input and output of transmission gate 234a are connected; when the selection signal S1 is at level L, the input and output of transmission gate 234a are not connected. Similarly, when the selection signal S2 is at level H, the input and output of transmission gate 234b are connected; when the selection signal S2 is at level L, the input and output of transmission gate 234b are not connected. That is, the selection circuit 230 switches the connection state between the input and output of transmission gates 234a and 234b based on the selection signals S1 and S2, thereby setting the signal waveforms of the drive signals COMA and COMB supplied to the inputs of transmission gates 234a and 234b to either selected or unselected, and outputting the drive signal VOUT to the common connection terminal of the outputs of transmission gates 234a and 234b.

[0169] use Figure 9 The operation of the drive signal selection circuit 200 will be explained. Figure 9 This diagram illustrates the operation of the drive signal selection circuit 200. The printing data [SIH, SIL] included in the printing data signal SI is serially input in sync with the clock signal SCK. Then, the printing data [SIH, SIL], synchronized with the clock signal SCK and corresponding to p ejector sections 600, are sequentially transmitted in register 212, which constitutes the shift register. Afterward, the supply of the clock signal SCK stops, thus storing the printing data [SIH, SIL] in each of registers 212, corresponding to each of the p ejector sections 600. It should be noted that the printing data [SIH, SIL] included in the printing data signal SI is input in the order corresponding to the p-segment, ..., 2-segment, 1-segment ejector sections 600 of register 212, which constitutes the shift register.

[0170] Then, if the latch signal LAT rises, each of the latch circuits 214 will latch the printed data [SIH, SIL] held in register 212 together. It should be noted that in... Figure 9 In the diagram, LS1, LS2, ..., LSp show the printed data [SIH, SIL] latched by latch circuit 214 corresponding to register 212 of segment 1, segment 2, ..., p.

[0171] Decoder 216, based on the point size specified by the latched printed data [SIH, SIL], at each of periods t1 and t2, selects the logic levels of signals S1 and S2. Figure 7 The output will show the content shown.

[0172] Specifically, when the input printed data [SIH, SIL] is [1, 1], decoder 216 sets the logic level of selection signal S1 to H, H level during periods t1 and t2, and sets the logic level of selection signal S2 to L, L level during periods t1 and t2. In this case, selection circuit 230 selects trapezoidal waveform Adp1 during period t1 and trapezoidal waveform Adp2 during period t2. As a result, at the output of selection circuit 230, a [data structure is generated]. Figure 5 The driving signal VOUT corresponding to the large point LD is shown.

[0173] Furthermore, when the input printed data [SIH, SIL] is [1, 0], decoder 216 sets the logic level of selection signal S1 to H and L levels during periods t1 and t2, and sets the logic level of selection signal S2 to L and H levels during periods t1 and t2. In this case, selection circuit 230 selects trapezoidal waveform Adp1 during period t1 and trapezoidal waveform Bdp2 during period t2. As a result, at the output of selection circuit 230, a [data structure is generated]. Figure 5 The driving signal VOUT corresponding to the midpoint MD is shown.

[0174] Furthermore, when the input printed data [SIH, SIL] is [0, 1], decoder 216 sets the logic level of selection signal S1 to H and L levels during periods t1 and t2, and sets the logic level of selection signal S2 to L and L levels during periods t1 and t2. In this case, selection circuit 230 selects trapezoidal waveform Adp1 during period t1, and does not select either trapezoidal waveforms Adp2 or Bdp2 during period t2. As a result, at the output of selection circuit 230, a [data missing] is generated. Figure 5 The drive signal VOUT corresponding to the small dot SD is shown.

[0175] Furthermore, when the input printed data [SIH, SIL] is [0, 0], decoder 216 sets the logic level of selection signal S1 to L, L level during periods t1 and t2, and sets the logic level of selection signal S2 to H, L level during periods t1 and t2. In this case, selection circuit 230 selects trapezoidal waveform Bdp1 during period t1, and does not select either trapezoidal waveforms Adp2 or Bdp2 during period t2. As a result, at the output of selection circuit 230, a... Figure 5 The drive signal VOUT shown corresponds to the non-recorded ND.

[0176] As described above, the drive signal selection circuit 200 selects the signal waveforms of drive signals COMA and COMB based on the printed data signal SI, clock signal SCK, latch signal LAT, and change signal CH, thereby generating and outputting the drive signal VOUT.

[0177] 2. Construction of the head unit

[0178] 2.1 Construction of the Head Unit

[0179] Next, the structure of the head unit 3 of the liquid ejection device 1 will be described. Figure 10 This is a side view showing the structure of the carriage 8 equipped with the head unit 3. Figure 11 This is a perspective view showing the peripheral structure of the carriage 8 equipped with the head unit 3. Here, in the following description, the X-axis, Y-axis, and Z-axis, which are orthogonal to each other, are shown and explained. Furthermore, in the following description, the starting side of the arrow in the diagram along the X-axis is referred to as the -X side, and the front end side as the +X side; the starting side of the arrow in the diagram along the Y-axis is referred to as the -Y side, and the front end side as the +Y side; the starting side of the arrow in the diagram along the Z-axis is referred to as the -Z side, and the front end side as the +Z side. Further, in the following description, the plane formed by the X-axis and Y-axis is referred to as the XY plane, the plane formed by the X-axis and Z-axis is referred to as the XZ plane, and the plane formed by the Y-axis and Z-axis is referred to as the YZ plane.

[0180] like Figure 10 as well as Figure 11As shown, the carriage 8 includes a carriage body 81, a carriage cover 82, and a housing 83. The carriage body 81 includes a mounting portion 85 and a fixing portion 86. The mounting portion 85 is a plate-shaped component extending along the XY plane, and the fixing portion 86 is a plate-shaped component extending from the -Y side end of the mounting portion 85 toward the -Z side along the YZ plane. That is, the carriage body 81 has an L-shaped cross-section when viewed along the X-axis. The carriage cover 82 is located on the -Z side of the carriage body 81 and is assembled in a manner that allows it to be easily detached from the carriage body 81. At this time, the carriage body 81 and the carriage cover 82 form a closed space. The housing 83 is a generally cuboid shape that includes a receiving space capable of accommodating various structures. On the -Y side of the carriage body 81, the +Y side end of the housing 83 is fixed to the -Z side end of the fixing portion 86.

[0181] Furthermore, a carriage support portion 87 is formed on the -Y side surface of the fixing portion 86 included in the carriage body 81. A guide rail 72 formed on the +Y side of the carriage guide shaft 7 is fitted into the carriage support portion 87, and the carriage support portion 87 is movably supported on the carriage guide shaft 7. As a result, the carriage 8 can move along the carriage guide shaft 7.

[0182] Within the internal space of the carriage 8 constructed as described above—that is, the closed space formed by the carriage body 81 and the carriage cover 82, and the receiving space formed inside the receiving housing 83—a spray control module 10, multiple liquid spray modules 20, multiple FFC cables 21 corresponding to the multiple liquid spray modules 20, and FFC cables 22 are accommodated. Here, we will describe the liquid spray device 1 of this embodiment as having five liquid spray modules 20. That is, within the internal space of the carriage 8 of this embodiment, five liquid spray modules 20, five FFC cables 21, and five FFC cables 22 are accommodated. It should be noted that the number of liquid spray modules 20 provided in the liquid spray device 1 is not limited to five.

[0183] The ejection control module 10 is housed in a receiving space formed inside the receiving housing 83. The ejection control module 10 includes a control circuit board 100 and an integrated circuit 110 mounted on the control circuit board 100. In addition, the integrated circuit 110 constitutes part or all of the aforementioned head control circuit 12.

[0184] Five FFC cables 21 and five FFC cables 22 are configured to correspond to five liquid ejection modules 20. Specifically, one end of each of the five FFC cables 21 and one end of each of the five FFC cables 22 are electrically connected to the control circuit board 100. Furthermore, the other end of each of the five FFC cables 21 and the other end of each of the five FFC cables 22 are electrically connected to the corresponding liquid ejection module 20. That is, the other end of each of the five liquid ejection modules 20 is electrically connected to each of the five liquid ejection modules 20. For example, flexible flat cables (FFC) can be used as such FFC cables 21 and 22.

[0185] Five liquid ejection modules 20, each having a drive circuit module 50 and a printhead 30, are housed in a closed space formed by the carriage body 81 and the carriage cover 82. Furthermore, the five liquid ejection modules 20 are mounted at equal intervals along the X-axis on the mounting section 85.

[0186] On the -Z side of the drive circuit module 50 of the corresponding liquid ejection module 20, the other ends of FFC cable 21 and FFC cable 22 are electrically connected to the drive circuit module 50. Additionally, the printhead 30 is located on the +Z side of the drive circuit module 50. The printhead 30 is mounted on the mounting portion 85 at equal intervals along the X-axis. At this time, the plurality of ejection portions 600 of the printhead 30 are exposed from the -Z side of the mounting portion 85. Therefore, the ink ejected from the plurality of ejection portions 600 of the printhead 30 is ejected onto the medium P without obstruction by the carriage 8.

[0187] Additionally, in the liquid ejection module 20, the printhead 30 is electrically connected to the drive circuit module 50 via a connector CN1. Preferably, a board-to-board (BtoB) connector is used as such a connector CN1.

[0188] BtoB connectors enable electrical connection between structures with two connectors by directly mating two connectors, without the need for cables. Therefore, without adding any new structures, electrical connection can be established between structures with two connectors, and the relative configuration between these structures can be determined.

[0189] Specifically, when using a BtoB connector as connector CN1 to electrically connect the printhead 30 and the drive circuit module 50, the relative configuration between the printhead 30 and the drive circuit module 50 is fixed. Therefore, it is sufficient to ensure that at least one of the printhead 30 and the drive circuit module 50 is fixed in the carriage 8. That is, the mounting area of ​​the printhead 30 and the drive circuit module 50 in the carriage 8 can be reduced. As a result, the printhead 30 and the drive circuit module 50 can be configured at a high density, and the carriage 8 can be miniaturized. Furthermore, since the printhead 30 and the drive circuit module 50 are electrically connected using a BtoB connector as connector CN1, the impedance caused by the cable is no longer a possibility, resulting in improved signal accuracy transmitted between the printhead 30 and the drive circuit module 50. Consequently, the ink ejection accuracy from the printhead 30 is improved.

[0190] In the head unit 3 constructed as described above, the printing data signal pDATA, voltage signals VHV, and VMV output by the control unit 2 are transmitted in cables (not shown) and input to the ejection control module 10. Based on the input printing data signal pDATA, voltage signals VHV, and VMV, the ejection control module 10 generates a clock signal SCK, a differential printing data signal Dp, and a differential drive data signal Dd corresponding to each of the five liquid ejection modules 20, and generates a fan drive signal Fp corresponding to each liquid ejection module 20. Then, the ejection control module 10 outputs the generated clock signal SCK, differential printing data signal Dp, differential drive data signal Dd, fan drive signal Fp, and voltage signals VHV and VMV to FFC cables 21 and 22.

[0191] The clock signal SCK, differential printing data signal Dp, differential drive data signal Dd, fan drive signal Fp, and voltage signals VHV and VMV output by the ejection control module 10 are transmitted in FFC cables 21 and 22 and input to the drive circuit module 50 of the liquid ejection module 20. The drive circuit module 50 operates based on the input clock signal SCK, differential printing data signal Dp, differential drive data signal Dd, and voltage signals VHV and VMV to generate the clock signal SCK, differential printing data signal Dpt, and multiple drive signals COM for controlling the operation of the printhead 30, and supplies them to the printhead 30 via connector CN1. As a result, ink is ejected from the ejection section 600 of the printhead 30.

[0192] 2.2 Structure of the Liquid Ejection Module

[0193] 2.2.1 Schematic structure of liquid ejection module

[0194] Next, a specific example of the construction of the liquid ejection module 20 in the head unit 3 will be described. Figure 12 This is an exploded perspective view showing an example of the structure of the liquid ejection module 20. (See diagram below.) Figure 12 As shown, the liquid ejection module 20 includes a printhead 30 for ejecting liquid and a drive circuit module 50 electrically connected to the printhead 30. Here, we will describe the printhead 30 of this embodiment as having four ejection modules 32-1 to 32-4, but the number of ejection modules 32 in the printhead 30 is not limited to four. It should be noted that the positional relationship of the ejection modules 32-1 to 32-4 is not limited to... Figure 12 The positional relationship is shown.

[0195] like Figure 12 As shown, the drive circuit module 50 includes a relay substrate 150, a drive circuit substrate 700, an opening plate 160, heat sinks 170 and 180, and heat conduction components 175 and 185.

[0196] The relay substrate 150 is a plate-shaped component extending along the XY plane. The -Z side surface of the relay substrate 150 is electrically connected to the other end of the FFC cables 21 and 22. A connector CN2a is provided on the +Z side surface of the relay substrate 150. Furthermore, the relay substrate 150 has a through-hole 158 extending through it in the Z-axis direction. A cooling fan 59 is mounted in this through-hole 158. That is, the cooling fan 59 is fixed to the relay substrate 150 to generate airflow in the Z-axis direction.

[0197] The drive circuit board 700 is located on the +Z side of the relay board 150 and includes rigid wiring components 710, 730, 750, and 770. The rigid wiring components 710, 730, 750, and 770 included in the drive circuit board 700 are electrically connected to each other. Furthermore, various circuits, including the ejection control circuit 51, drive signal output circuit 52, capacitor 53, abnormal detection circuit 54, abnormal notification circuit 55, temperature detection circuit 56, and voltage conversion circuit 58 described above, as well as connectors CN1a and CN2b, are implemented in the rigid wiring components 710, 730, 750, and 770 included in the drive circuit board 700.

[0198] Rigid wiring component 710 is a plate-shaped component extending along the YZ plane, with its -Z side end located at its +X side end along the relay substrate 150. Rigid wiring component 730 is also a plate-shaped component extending along the YZ plane, with its -Z side end located at its -X side end along the relay substrate 150. That is, rigid wiring component 710 is located on the +X side of rigid wiring component 730, and the rigid wiring components 710 and 730 are positioned opposite each other along the X-axis.

[0199] Furthermore, the rigid wiring component 750 is a plate-shaped component extending along the XZ plane. Its -Z side end is located at the end along the +Y side of the relay substrate 150, its +X side end is located at the end along the +Y side of the rigid wiring component 710, and its -X side end is located at the end along the +Y side of the rigid wiring component 730. That is, the rigid wiring component 750 is located at the intersection with both the rigid wiring components 710 and 730.

[0200] Furthermore, the rigid wiring component 770 is a plate-shaped component extending along the XY plane. Its +X side end is located at the end along the +Z side of the rigid wiring component 710, its -X side end is located at the end along the +Z side of the rigid wiring component 730, and its +Y side end is located at the end along the +Z side of the rigid wiring component 750. That is, the rigid wiring component 770 is located at the intersection with the rigid wiring components 710, 730, and 750.

[0201] As described above, in the drive circuit board 700, rigid wiring component 710 and rigid wiring component 730 are located at opposite positions in the direction along the X-axis, and rigid wiring components 750 and 770 are located at positions covering at least a portion of the space generated between rigid wiring component 710 and rigid wiring component 730.

[0202] Connector CN2b is disposed on the -X side surface of the rigid wiring member 710 and is positioned along the -Z side end of the rigid wiring member 710. That is, connector CN2b is disposed near the relay substrate 150. Furthermore, connector CN2b engages with connector CN2a disposed on the +Z side surface of the relay substrate 150 to electrically connect the drive circuit board 700, including the rigid wiring member 710, and the relay substrate 150. In other words, connectors CN2a and CN2b are directly engaged to form a BtoB connector electrically connecting the drive circuit board 700 and the relay substrate 150. In the following description, the BtoB connector composed of connectors CN2a and CN2b may be referred to as connector CN2.

[0203] Connector CN1a is disposed on the +Z side surface of the rigid wiring component 770. Furthermore, the drive circuit board 700 is electrically connected to the printhead 30 via connector CN1a. That is, connector CN1a is equivalent to one side of the BtoB connector, i.e., connector CN1, that electrically connects the drive circuit board 700 and the printhead 30.

[0204] The heat sink 170 is located on the -X side of the rigid wiring component 730 and is mounted to the rigid wiring component 730 via the heat conduction component 175. The heat sink 170 and the heat conduction component 175 absorb heat generated in the rigid wiring component 730 and dissipate it into the atmosphere. Thus, the heat sink 170 cools the various circuits disposed on the rigid wiring component 730. From the viewpoints of thermal conductivity, material processability, and ease of material availability, such a heat sink 170 uses metals such as copper, copper alloys, aluminum, and aluminum alloys. Furthermore, the heat conduction component 175 improves the heat absorption efficiency of the heat sink 170 by increasing the tightness of contact between the heat sink 170 and the rigid wiring component 730, and from the viewpoint of ensuring the insulation performance of the metal heat sink 170 and the rigid wiring component 730, materials with flame retardancy and electrical insulation properties are used, such as thermally conductive gel sheets or rubber sheets including silicone resin and acrylic resin.

[0205] The heat sink 180 is located on the +X side of the rigid wiring component 710 and is mounted to the rigid wiring component 710 via the heat conduction component 185. The heat sink 180 and the heat conduction component 185 absorb the heat generated in the rigid wiring component 710 and dissipate it into the atmosphere. Thus, the heat sink 180 cools the various circuits disposed on the rigid wiring component 710. From the viewpoints of thermal conductivity, material processability, and ease of material availability, such a heat sink 180 uses metals such as copper, copper alloys, aluminum, and aluminum alloys. Furthermore, the heat conduction component 185 improves the heat absorption efficiency of the heat sink 180 by increasing the tightness of contact between the heat sink 180 and the rigid wiring component 710, and from the viewpoint of ensuring the insulation performance of the metal heat sink 180 and the rigid wiring component 710, materials with flame retardancy and electrical insulation properties are used, such as thermally conductive gel sheets or rubber sheets including silicone resin and acrylic resin.

[0206] The opening plate 160 is a plate-shaped component extending along the XZ plane. Its +X side end is located along the -Y side end of the rigid wiring component 710, its -X side end is located along the -Y side end of the rigid wiring component 730, its +Z side end is located along the -Y side end of the rigid wiring component 770, and its -Z side end is located along the -Y side end of the relay substrate 150. That is, the opening plate 160 is positioned to cover at least a portion of the space created between the rigid wiring components 710 and 730, which are located opposite each other along the X-axis.

[0207] The printhead 30 is located on the +Z side of the drive circuit module 50 and includes ejector modules 32-1 to 32-4 and a connector CN1b. The ejector modules 32-1 to 32-4, located on the +Z side of the printhead 30, are configured such that at least a portion of them are exposed on the +Z side surface of the printhead 30. At this time, among the four ejector modules 32, ejector modules 32-1 and 32-2 are arranged along the Y-axis with ejector module 32-1 on the -Y side and ejector module 32-2 on the +Y side. Among the four ejector modules 32, ejector modules 32-3 and 32-4 are arranged along the Y-axis on the +X side of the ejector modules 32-1 and 32-2 with ejector module 32-3 on the -Y side and ejector module 32-4 on the +Y side. That is, among the four ejection modules 32, ejection modules 32-1 and 32-2 are arranged along the -X side of the print head 30, and ejection modules 32-3 and 32-4 are arranged along the +X side of the print head 30.

[0208] Connector CN1b is located on the -Z side of printhead 30 and is configured to expose at least a portion of the surface on the -Z side of printhead 30. Connector CN1b engages with connector CN1a of drive circuit module 50. Thus, drive circuit board 700 is electrically connected to printhead 30. That is, connector CN1b is equivalent to the other party of the BtoB connector, i.e., connector CN1, that electrically connects drive circuit board 700 and printhead 30; connector CN1a and connector CN1b constitute the BtoB connector, i.e., connector CN1.

[0209] 2.2.2 Printhead Structure

[0210] A more specific description will be given of the liquid ejection module 20 constructed as described above. First, the specific construction of the printhead 30 of the liquid ejection module 20 will be described. Figure 13 This is a perspective view showing an example of the internal structure of the printhead 30. It should be noted that... Figure 13 In the diagram, the printhead 30's cover 350 is shown in dashed lines, while the internal structure of the cover 350 is shown in solid lines. That is, Figure 13 The middle image shows the state after the head cover 350 of the print head 30 has been removed.

[0211] like Figure 13As shown, the printhead 30 includes a head holder 310 and a head cover 350. A flange 315 is provided at the -Y side end of the head holder 310, and a flange 316 is provided at the +Y side end of the head holder 310. The head holder 310 is exposed from the +Z side of the mounting portion 85 of the carriage body 81. At this time, since the flanges 315 and 316 are supported on the mounting portion 85, the printhead 30 is supported on the carriage body 81 with multiple ejection portions 600 exposed from the -Z side of the mounting portion 85. Alternatively, such flanges 315 and 316 may be fixed to the mounting portion 85 by screws or the like (not shown).

[0212] The head cover 350 is located on the -Z side of the head holder 310 and has an internal receiving space. The head cover 350 functions as a protective component to protect the various structures of the printhead 30 from ink mist and impact by accommodating the various structures of the printhead 30 within this receiving space.

[0213] The head cover 350 contains a flow path component 340, a head substrate 360, head relay substrates 370 and 380, and FPCs 372, 374, 376, 382, ​​384, and 386.

[0214] The flow path component 340 has an ink flow path (not shown) for supplying ink from the liquid container 9 to a plurality of ejection sections 600. The printhead substrate 360 ​​is located on the -Z side of the flow path component 340 and extends along the XY plane. A connector CN1b is provided on the -Z side surface of the printhead substrate 360. At least a portion of the connector CN1b is exposed to the outside of the printhead 30 through a through-hole (not shown) formed in the printhead cover 350.

[0215] The head relay substrate 370 is located on the -X side of the flow path component 340 and extends along the YZ plane. The head relay substrate 370 is electrically connected to the head substrate 360 ​​via FPC 372. In addition, the head relay substrate 370 is connected to one end of FPC 374 and one end of FPC 376. The other end of FPC 374 is electrically connected to the ejection module 32-1, and the other end of FPC 376 is electrically connected to the ejection module 32-2.

[0216] The head relay substrate 380 is located on the +X side of the flow path component 340 and extends along the YZ plane. The head relay substrate 380 is electrically connected to the head substrate 360 ​​via FPC 382. Additionally, the head relay substrate 380 is connected to one end of FPC 384 and one end of FPC 386. The other end of FPC 384 is electrically connected to the ejection module 32-3, and the other end of FPC 386 is electrically connected to the ejection module 32-4.

[0217] Various signals output from the drive circuit module 50 are input to the printhead 30 configured as described above via connector CN1b. The signals input via connector CN1b are then branched by the head substrate 360 ​​and head relay substrates 370 and 380, and supplied to each of the ejection modules 32-1 to 32-4. Here, for example, the recovery circuit 31 of the printhead 30 is provided on the head substrate 360.

[0218] Figure 14 This is an exploded perspective view of the print head 30, observed from the +Z side along the Z-axis. (See image below.) Figure 14 As shown, the printhead 30 has a head holder 310 with a reinforcing plate 320, a fixing plate 330, and ejection modules 32-1 to 32-4.

[0219] For example, the head holder 310 is made of a conductive material such as a metal that has greater strength than the reinforcing plate 320. On the +Z side surface of the head holder 310, there are four receiving portions 318 for accommodating each of the ejection modules 32-1 to 32-4.

[0220] Each of the four receiving portions 318 has a concave shape with an opening on the +Z side, and individually accommodates the ejection modules 32-1 to 32-4 fixed by the fixing plate 330. At this time, the opening of the receiving portion 318 is sealed by the fixing plate 330. That is, the ejection modules 32-1 to 32-4 are individually accommodated within the space formed by the receiving portion 318 and the fixing plate 330. It should be noted that the receiving portion 318 can be individually configured to correspond to each of the ejection modules 32-1 to 32-4, or it can be a shape that uniformly accommodates all the ejection modules 32-1 to 32-4.

[0221] On the surface of the head retainer 310 where the receiving portion 318 is provided, the reinforcing plate 320 and the fixing plate 330 are stacked sequentially along the Z-axis from the -Z side to the +Z side.

[0222] The fixing plate 330 is composed of a plate-shaped component made of a conductive material such as metal. Furthermore, in the fixing plate 330, an opening 335 exposing the nozzles 651 of the plurality of ejection portions 600 of each of the ejection modules 32-1 to 32-4 is configured to extend through the Z-axis. This opening 335 is individually configured to correspond to each of the ejection modules 32-1 to 32-4.

[0223] Preferably, the reinforcing plate 320 is made of a material with greater strength than the fixing plate 330. In the reinforcing plate 320, for each of the ejection modules 32-1 to 32-4 that engage with the fixing plate 330, an opening 325 having an inner diameter larger than the outer periphery of each of the ejection modules 32-1 to 32-4 is provided to extend through along the Z-axis. Each of the ejection modules 32-1 to 32-4 through which the opening 325 of the reinforcing plate 320 is inserted engages with the fixing plate 330.

[0224] Furthermore, the ejection modules 32-1 to 32-4 of the printhead 30 are arranged in an alternating pattern on the +Z side surface of the printhead holder 310. Also, in each of the ejection modules 32-1 to 32-4, the nozzles 651 included in the ink ejection section 600 are arranged in two rows along the X-axis, arranged along the Y-axis.

[0225] Here, the structure of the ejection section 600, including the nozzle 651, will be described. Figure 15 This is a diagram showing an example of the structure of the ejection section 600 of the ejection module 32. Figure 15 In the figure, based on the ejection section 600, the nozzle plate 632, the reservoir 641, and the supply port 661 are shown.

[0226] like Figure 15 As shown, the ejection section 600 includes a piezoelectric element 60, a vibrating plate 621, a cavity 631, and a nozzle 651. The piezoelectric element 60 includes a piezoelectric body 601 and electrodes 611 and 612. The electrodes 611 and 612 are positioned to sandwich the piezoelectric body 601, thus forming the piezoelectric element 60. This piezoelectric element 60 is driven by a vertical displacement of its central portion based on the potential difference between the voltage supplied to electrode 611 and the voltage supplied to electrode 612. Specifically, a drive signal VOUT based on a drive signal COM is supplied to electrode 611, and a reference voltage signal VBS is supplied to electrode 612. Furthermore, if the voltage value of the drive signal VOUT supplied to electrode 611 changes, the potential difference between the drive signal VOUT supplied to electrode 611 and the reference voltage signal VBS supplied to electrode 612 changes, causing the piezoelectric element 60 to be driven by a vertical displacement of its central portion.

[0227] Vibrating plate 621 is located Figure 15 The piezoelectric element 60 is located below the vibrating plate 621. In other words, the piezoelectric element 60 is formed on the vibrating plate 621. Figure 15 The upper surface of the plate. Such a vibrating plate 621 is displaced in the vertical direction along with the upward and downward drive of the piezoelectric element 60.

[0228] Cavity 631 is located in the vibrating plate 621 Figure 15The ink is supplied from the reservoir 641 to the cavity 631. Additionally, ink stored in the liquid container 9 is introduced into the reservoir 641 via the supply port 661. That is, the cavity 631 is filled with ink stored in the liquid container 9. The internal volume of such a cavity 631 expands or contracts with the vertical displacement of the vibrating plate 621. In other words, the vibrating plate 621 functions as a diaphragm that changes the internal volume of the cavity 631, and the cavity 631 functions as a pressure chamber whose internal pressure changes with the vertical displacement of the vibrating plate 621.

[0229] Nozzle 651 is an opening provided in nozzle plate 632 and communicates with cavity 631. Furthermore, if the internal volume of cavity 631 changes, the ink filling the cavity 631 is ejected from nozzle 651 according to the change in internal volume.

[0230] In the ejection section 600 configured as described above, when the piezoelectric element 60 is driven to flex upwards, the vibrating plate 621 is displaced upwards. This increases the internal volume of the cavity 631, resulting in ink stored in the reservoir 641 being drawn into the cavity 631. Conversely, when the piezoelectric element 60 is driven to flex downwards, the vibrating plate 621 is displaced downwards. This decreases the internal volume of the cavity 631, resulting in an amount of ink ejected from the nozzle 651 corresponding to the degree of reduction in the internal volume of the cavity 631. In other words, an amount of ink corresponding to the voltage value of the drive signal VOUT is ejected from each of the plurality of ejection sections 600 included in the ejection module 32 of the printhead 30.

[0231] It should be noted that the piezoelectric element 60 can be constructed to eject ink from the nozzle 651 by being driven by a drive signal VOUT corresponding to the drive signal COM, and is not limited to this configuration. Figure 15 The structure shown.

[0232] As described above, the printhead 30 has a connector CN1b that is electrically connected to the ejection modules 32-1 to 32-4 and the drive circuit module 50. Furthermore, the ejection module 32-1 has an ejection section 600, which includes a piezoelectric element 60 and ejects liquid based on the displacement of the piezoelectric element 60. The piezoelectric element 60 receives a drive signal VOUT supplied to the electrode 611 based on voltage changes of drive signals COMA1 and COMB1, and a reference voltage signal VBS supplied to the electrode 612 with a fixed voltage value, and is displaced accordingly. The ejection module 32-2 also has an ejection section 600, which includes a piezoelectric element 60 and ejects liquid based on the displacement of the piezoelectric element 60. The piezoelectric element 60 receives a drive signal VOUT supplied to the electrode 611 based on voltage changes of drive signals COMA2 and COMB2, and a reference voltage signal VBS supplied to the electrode 612 with a fixed voltage value, and is displaced accordingly. The ejection module 32-3 has an ejection section 600, which includes a piezoelectric element 60 and ejects liquid based on the displacement of the piezoelectric element 60. The piezoelectric element 60 receives a drive signal VOUT supplied to the electrode 611 based on the voltage value changes of drive signals COMA3 and COMB3, and a reference voltage signal VBS supplied to the electrode 612 with a fixed voltage value, and is thus displaced. The ejection module 32-4 has an ejection section 600, which includes a piezoelectric element 60 and ejects liquid based on the displacement of the piezoelectric element 60. The piezoelectric element 60 receives a drive signal VOUT supplied to the electrode 611 based on the voltage value changes of drive signals COMA4 and COMB4, and a reference voltage signal VBS supplied to the electrode 612 with a fixed voltage value, and is thus displaced.

[0233] 2.2.3 Structure of the drive circuit module of the liquid ejection module

[0234] Next, the structure of the drive circuit module 50 of the liquid ejection module 20 will be described. Figure 12 As shown, the drive circuit module 50 includes a relay substrate 150, a drive circuit substrate 700, an opening plate 160, heat sinks 170 and 180, and heat conduction components 175 and 185.

[0235] 2.2.3.1 Structure of the driving circuit board

[0236] First, the structure of the drive circuit board 700 will be explained. Figure 16This is a top view of the drive circuit board 700. In the following description, the X-axis, Y-axis, and Z-axis are independent axes. The x1-axis, y1-axis, and z1-axis, which are orthogonal to each other, are shown in the diagram. Furthermore, in the following description, the starting point of the arrow in the diagram along the x1-axis is referred to as the -x1 side, and the leading edge as the +x1 side; the starting point of the arrow in the diagram along the y1-axis is referred to as the -y1 side, and the leading edge as the +y1 side; the starting point of the arrow in the diagram along the z1-axis is referred to as the -z1 side, and the leading edge as the +z1 side. Further, the plane formed by the x1-axis and y1-axis is called the x1y1 plane, the plane formed by the x1-axis and z1-axis is called the x1z1 plane, and the plane formed by the y1-axis and z1-axis is called the y1z1 plane.

[0237] As described above, the drive circuit board 700 has rigid wiring components 710, 730, 750, and 770. The rigid wiring components 710, 730, and 750 are arranged along the y1 axis from the -y1 side towards the +y1 side in the order of rigid wiring component 710, rigid wiring component 750, and rigid wiring component 730. Furthermore, the rigid wiring component 770 is located on the -x1 side of the arranged rigid wiring components 710, 750, and 730; specifically, it is located on the -x1 side of the rigid wiring component 730.

[0238] The rigid wiring component 710 includes a face 723 on the +z1 side, a face 724 on the -z1 side, edges 711 and 712, and edges 713 and 714 that are longer than edges 711 and 712. Edges 711 and 712 are positioned along the y1 axis and opposite to each other in the direction along the x1 axis, with edge 711 located on the +x1 side and edge 712 located on the -x1 side. Furthermore, edges 713 and 714 intersect with both sides of edges 711 and 712 and are positioned along the x1 axis and opposite to each other in the direction along the y1 axis, with edge 713 located on the -y1 side and edge 714 located on the +y1 side. In other words, the rigid wiring component 710 includes edges 711 and 712 located opposite to each other, edges 713 and 714 intersecting with edges 711 and 712 and located opposite to each other, and a face 723. In other words, the rigid wiring component 710 includes a surface 723, a surface 724 opposite to the surface 723, and an edge 711, and is a generally rectangular plate-shaped component extending along the x1y1 plane.

[0239] The rigid wiring component 730 includes a face 743 on the +z1 side, a face 744 on the -z1 side, edges 731 and 732, and edges 733 and 734 that are longer than edges 731 and 732, and is located on the +y1 side of the rigid wiring component 710. Edges 731 and 732 are positioned to extend along the y1 axis and are opposite to each other in the direction along the x1 axis, with edge 731 located on the +x1 side and edge 732 located on the -x1 side. Furthermore, edges 733 and 734 intersect with both sides of edges 731 and 732, and are positioned to extend along the x1 axis and are opposite to each other in the direction along the y1 axis, with edge 733 located on the -y1 side and edge 734 located on the +y1 side. That is, the rigid wiring component 730 includes edges 731 and 732 located opposite each other, edges 733 and 734 intersecting edges 731 and 732 and located opposite each other, and a surface 743. In other words, the rigid wiring component 730, including surface 743, surface 744 opposite to surface 743, and edge 731, is a generally rectangular plate-shaped component extending along the x1y1 plane.

[0240] The rigid wiring component 750 includes a face 763 on the +z1 side, a face 764 on the -z1 side, edges 751 and 752, and edges 753 and 754 that are longer than edges 751 and 752, and is located between the rigid wiring components 710 and 730 in the direction along the y1 axis. Edges 751 and 752 are positioned to extend along the y1 axis and are opposite to each other in the direction along the x1 axis, with edge 751 located on the +x1 side and edge 752 located on the -x1 side. Furthermore, edges 753 and 754 intersect with both sides of edges 751 and 752, and are positioned to extend along the x1 axis and are opposite to each other in the direction along the y1 axis, with edge 753 located on the -y1 side and edge 754 located on the +y1 side. That is, the rigid wiring component 750 includes edges 751 and 752 located opposite each other, edges 753 and 754 intersecting edges 751 and 752 and located opposite each other, and a surface 763. In other words, the rigid wiring component 750, including surface 763, surface 764 opposite to surface 763, and edge 751, is a generally rectangular plate-shaped component extending along the x1y1 plane.

[0241] The rigid wiring component 770 includes a +z1 side surface 783, a -z1 side surface 784, edges 771 and 772, and edges 773 and 774 that are shorter than edges 771 and 772, and are located on the -x1 side of the rigid wiring component 770 along the x1 axis. Edges 771 and 772 are positioned along the y1 axis and opposite to each other in the x1 axis direction, with edge 771 located on the +x1 side and edge 772 located on the -x1 side. Furthermore, edges 773 and 774 intersect with both sides of edges 771 and 772, and are positioned along the x1 axis and opposite to each other in the y1 axis direction, with edge 773 located on the -y1 side and edge 774 located on the +y1 side. That is, the rigid wiring component 770 includes edges 771 and 772 located opposite each other, edges 773 and 774 intersecting edges 771 and 772 and located opposite each other, and a surface 783. In other words, the rigid wiring component 770, including surface 783, surface 784 opposite to surface 783, and edge 771, is a generally rectangular plate-shaped component extending along the x1y1 plane.

[0242] Each of these rigid wiring components 710, 730, 750, and 770 comprises a base material and a so-called multilayer rigid substrate with multiple wiring layers. The base material is obtained by stacking multiple layers of a rigid composite material such as epoxy glass in the direction along the z1 axis. The multiple wiring layers are located between the layers of the base material and form wiring patterns for various signal transmissions.

[0243] Here, as Figure 16As shown, in the drive circuit board 700, edges 711, 731, and 751 are located in a generally straight line along the y1 axis, and edges 712, 732, and 752 are located in a generally straight line along the y1 axis. That is, the lengths of edges 713 and 714 included in the rigid wiring member 710 along the x1 axis, the lengths of edges 733 and 734 included in the rigid wiring member 730 along the x1 axis, and the lengths of edges 753 and 754 included in the rigid wiring member 750 along the x1 axis are approximately equal. In addition, the lengths of edges 711 and 712 along the y1 axis are approximately equal to the lengths of edges 731 and 732 along the y1 axis, while the lengths of edges 751 and 752 along the y1 axis are shorter than the lengths of edges 711 and 712 along the y1 axis and the lengths of edges 731 and 732 included in the rigid wiring member 730 along the y1 axis. That is, the size of the rigid wiring component 710 when viewed along the z1 axis of the drive circuit board 700 is approximately equal to the size of the rigid wiring component 730 when viewed along the z1 axis of the drive circuit board 700, and the size of the rigid wiring component 750 when viewed along the z1 axis of the drive circuit board 700 is smaller than the size of the rigid wiring component 710 and the size of the rigid wiring component 730 when viewed along the z1 axis of the drive circuit board 700.

[0244] Furthermore, in the drive circuit board 700, edges 733 and 773 are located in a generally straight line along the x1 axis, and edges 734 and 774 are located in a generally straight line along the x1 axis. That is, the lengths of edges 731 and 732 included in the rigid wiring member 730 along the y1 axis are approximately equal to the lengths of edges 771 and 772 included in the rigid wiring member 770 along the y1 axis. In addition, the lengths of edges 773 and 774 along the x1 axis are shorter than the lengths of edges 733 and 734 along the x1 axis, and are approximately equal to the lengths of edges 751 and 752 along the y1 axis. That is, the size of the rigid wiring member 770 when viewed along the z1 axis of the drive circuit board 700 is smaller than the size of the rigid wiring members 710, 730, and 750. That is, the size of the rigid wiring component 770 when viewed along the z1 axis of the drive circuit board 700 is smaller than the size of the rigid wiring component 710 when viewed along the z1 axis of the drive circuit board 700, and smaller than the size of the rigid wiring component 730 when viewed along the z1 axis of the drive circuit board 700.

[0245] The rigid wiring components 710, 730, 750, and 770 configured as described above are electrically connected to each other via the flexible wiring component 790. That is, the rigid wiring components 710, 730, 750, and 770 are electrically connected to each other. Here, the configuration of the rigid wiring components 710, 730, 750, and 770, and the flexible wiring component 790 that electrically connects the rigid wiring components 710, 730, 750, and 770, will be described.

[0246] Figure 17 It is to drive the circuit board 700 along Figure 16 The cross-sectional view showing the case where line Aa is cut off. Figure 18 It is to drive the circuit board 700 along Figure 16 The cross-sectional view showing the case where line Bb is cut off.

[0247] Here, in the following description, the flexible wiring component 790 is divided into the following... Figure 17 as well as Figure 18 The seven regions 701 to 707 shown will be explained. Additionally, as... Figure 17 as well as Figure 18 As shown, the flexible wiring component 790 includes a surface 791 on the +z1 side and a surface 792 on the -z1 side. That is, the flexible wiring component 790 will be described with surface 791, surface 792 opposite to surface 791, and regions 701 to 707.

[0248] like Figure 17 As shown, regions 701 to 705 of the flexible wiring component 790 are arranged along the y1 axis from the -y1 side towards the +y1 side in the order of region 701, region 702, region 703, region 704, and region 705. That is, region 702 is located between region 701 and region 703, and region 704 is located between region 703 and region 705. Therefore, regions 702, 703, and 704 are located between region 701 and region 705.

[0249] A portion of the rigid wiring component 710, namely rigid component 721, is stacked on surface 791 of region 701, and a different portion of the rigid wiring component 710, namely rigid component 722, is stacked on surface 792 of region 701. That is, the rigid wiring component 710 includes both rigid component 721 and rigid component 722. Rigid component 721 includes a surface 723 corresponding to the +z1 side of the rigid wiring component 710. Furthermore, rigid component 721 is stacked on surface 791 of region 701 of the flexible wiring component 790 such that surface 723 extends along surface 791 of the flexible wiring component 790. Additionally, rigid component 722 includes a surface 724 corresponding to the -z1 side of the rigid wiring component 710. Furthermore, rigid component 722 is stacked on surface 792 of region 701 of the flexible wiring component 790 such that surface 724 extends along surface 792 of the flexible wiring component 790.

[0250] A portion of the rigid wiring component 750, namely rigid component 761, is stacked on surface 791 of region 703, and a different portion of the rigid wiring component 750, namely rigid component 762, is stacked on surface 792 of region 703. That is, the rigid wiring component 750 includes both rigid component 761 and rigid component 762. Rigid component 761 includes a surface 763 corresponding to the +z1 side of the rigid wiring component 750. Furthermore, rigid component 761 is stacked on surface 791 of region 703 of the flexible wiring component 790 such that surface 763 extends along surface 791 of the flexible wiring component 790. Rigid component 762 includes a surface 764 corresponding to the -z1 side of the rigid wiring component 750. Furthermore, rigid component 762 is stacked on surface 792 of region 703 of the flexible wiring component 790 such that surface 764 extends along surface 792 of the flexible wiring component 790.

[0251] A portion of the rigid wiring component 730, namely rigid component 741, is stacked on surface 791 of region 705, and a different portion of the rigid wiring component 730, namely rigid component 742, is stacked on surface 792 of region 705. That is, the rigid wiring component 730 includes both rigid component 741 and rigid component 742. Rigid component 741 includes a surface 743 corresponding to the +z1 side of the rigid wiring component 730. Furthermore, rigid component 741 is stacked on surface 791 of region 705 of the flexible wiring component 790 such that surface 743 extends along surface 791 of the flexible wiring component 790. Rigid component 742 includes a surface 744 corresponding to the -z1 side of the rigid wiring component 730. Furthermore, rigid component 742 is stacked on surface 792 of region 705 of the flexible wiring component 790 such that surface 744 extends along surface 792 of the flexible wiring component 790.

[0252] In regions 702 and 704, no rigid composite materials such as epoxy glass are used. That is, region 702 is located between rigid wiring component 710 and rigid wiring component 750, and is used to separate rigid wiring component 710 and rigid wiring component 750; region 704 is located between rigid wiring component 750 and rigid wiring component 730, and is used to separate rigid wiring component 750 and rigid wiring component 730.

[0253] In addition, such as Figure 18 As shown, regions 705 to 707 of the flexible wiring component 790 are arranged along the x1 axis from the +x1 side toward the -x1 side in the order of region 705, region 706, and region 707. That is, region 706 is located between region 705 and region 707, i.e., between region 701, 702, 703, 704, 705, and region 707.

[0254] On surface 791 of region 707, a portion of rigid wiring component 770, namely rigid component 781, is stacked. On surface 792 of region 707, a different portion of rigid wiring component 770, namely rigid component 782, is stacked. That is, rigid wiring component 770 includes rigid component 781 and rigid component 782. Rigid component 781 includes a surface 783 corresponding to the +z1 side of rigid wiring component 770. Furthermore, rigid component 781 is stacked on surface 791 of region 707 of flexible wiring component 790 such that surface 783 extends along surface 791 of flexible wiring component 790. Rigid component 782 includes a surface 784 corresponding to the -z1 side of rigid wiring component 770. Furthermore, rigid component 782 is stacked on surface 792 of region 707 of flexible wiring component 790 such that surface 784 extends along surface 792 of flexible wiring component 790.

[0255] In region 706, similar to regions 702 and 704, no rigid composite materials such as epoxy glass are used. That is, region 706 is located between rigid wiring component 730 and rigid wiring component 770, and is the region used to separate rigid wiring component 730 and rigid wiring component 770.

[0256] In the drive circuit board 700 configured as described above, the flexible wiring component 790 constitutes at least one layer of each wiring layer of the rigid wiring components 710, 730, 750, and 770. Thus, the flexible wiring component 790 electrically connects each of the rigid wiring components 710, 730, 750, and 770, and transmits signals generated in each of the rigid wiring components 710, 730, 750, and 770. Specifically, the flexible wiring component 790 constitutes at least one layer of the plurality of wiring layers included in the rigid wiring component 710, at least one layer of the plurality of wiring layers included in the rigid wiring component 730, at least one layer of the plurality of wiring layers included in the rigid wiring component 750, and at least one layer of the plurality of wiring layers included in the rigid wiring component 770, thereby electrically connecting each of the rigid wiring components 710, 730, 750, and 770. Such a flexible wiring component 790 includes a base material having one or more layers of plastic film, polyimide, etc., and one or more wiring layers having wiring patterns for transmitting various signals, and is a so-called flexible substrate with flexibility.

[0257] That is, the driving circuit board 700 includes rigid wiring components 710, 730, 750, 770, and rigid components 721, 722, 741, 742, 761, 762, 781, 782 as a plurality of rigid substrates. The driving circuit board 700 is a so-called rigid-flexible board that includes the plurality of rigid substrates and a flexible wiring component 790 as a flexible substrate that is more flexible than the rigid wiring components 710, 730, 750, 770.

[0258] Furthermore, in the liquid ejection device 1 of this embodiment, the aforementioned drive circuit board 700 is generally box-shaped and electrically connected to the print head 30. This reduces the mounting area of ​​the drive circuit board 700 in the liquid ejection device 1, enabling a denser arrangement of the drive circuit board 700, resulting in miniaturization of the liquid ejection device 1.

[0259] Figure 19 This is a diagram illustrating an example of the structure of a drive circuit board 700, which is generally box-shaped. (See diagram below.) Figure 19 As shown, for the drive circuit board 700, due to the bending of the flexible wiring component 790, each of the rigid wiring components 710, 730, 750, and 770 constitutes one side of the drive circuit board 700, which is generally box-shaped.

[0260] Specifically, region 702 of the flexible wiring component 790 is bent at approximately a right angle, such that surface 723 of the rigid wiring component 710 and surface 763 of the rigid wiring component 750 form the inner surface of the drive circuit board 700, which is approximately box-shaped, and surface 724 of the rigid wiring component 710 and surface 764 of the rigid wiring component 750 form the outer surface of the drive circuit board 700, which is approximately box-shaped. Additionally, region 704 of the flexible wiring component 790 is bent at approximately a right angle, such that surface 763 of the rigid wiring component 750 and surface 743 of the rigid wiring component 730 form the inner surface of the drive circuit board 700, which is approximately box-shaped, and surface 764 of the rigid wiring component 750 and surface 744 of the rigid wiring component 730 form the outer surface of the drive circuit board 700, which is approximately box-shaped. Furthermore, region 706 of the flexible wiring component 790 is bent at approximately a right angle, such that the surface 743 of the rigid wiring component 730 and the surface 783 of the rigid wiring component 770 form the inner surface of the drive circuit board 700, which is approximately box-shaped, and the surface 744 of the rigid wiring component 730 and the surface 784 of the rigid wiring component 770 form the outer surface of the drive circuit board 700, which is approximately box-shaped.

[0261] That is, in the liquid ejection device 1 of this embodiment, for the drive circuit board 700 which is generally box-shaped, the surface 723 of the rigid wiring member 710, the surface 763 of the rigid wiring member 750, the surface 743 of the rigid wiring member 730, and the surface 783 of the rigid wiring member 770 constitute the inner surface of the generally box-shaped structure, and the surface 724 of the rigid wiring member 710, the surface 764 of the rigid wiring member 750, the surface 744 of the rigid wiring member 730, and the surface 784 of the rigid wiring member 770 constitute the outer surface of the generally box-shaped structure. At this time, because the flexible wiring component 790 is bent in regions 702 and 704, the rigid wiring component 710 and the rigid wiring component 730 are located opposite each other on the surfaces 723 and 743 of the rigid wiring component 710 and 730, respectively. Because the flexible wiring component 790 is bent in regions 702 and 704, the rigid wiring component 750 is located at the intersection of the normal direction of the surface 763 of the rigid wiring component 750 and the normal direction of the surface 723 of the rigid wiring component 710 and the normal direction of the surface 743 of the rigid wiring component 730. Because the flexible wiring component 790 is bent in region 706, the rigid wiring component 770 is located at the intersection of the normal direction of the surface 783 of the rigid wiring component 770 and the normal direction of the surface 723 of the rigid wiring component 710 and the normal direction of the surface 743 of the rigid wiring component 730.

[0262] In other words, rigid member 721 and rigid member 741 are located at positions where the face 723 of rigid member 721 and the face 743 of rigid member 741 are opposite each other due to the bending of flexible wiring member 790 in regions 702 and 704. Rigid member 761 is located at a position where the normal direction of face 763 of rigid member 761 intersects with the normal direction of face 723 of rigid member 721 and the normal direction of face 743 of rigid member 741 due to the bending of flexible wiring member 790 in regions 702 and 704. Rigid member 781 is located at a position where the normal direction of face 783 of rigid member 781 intersects with the normal direction of face 723 of rigid member 721 and the normal direction of face 743 of rigid member 741 due to the bending of flexible wiring member 790 in region 706.

[0263] It should be noted that the term "drive circuit board 700" being roughly box-shaped does not necessarily mean that all surfaces of the roughly box-shaped board are made of a rigid substrate with a rigid-flexible substrate. That is, it can be considered as a box shape, or something else entirely. Figure 19 As shown, one or more faces are open.

[0264] In the following description, using a drive circuit board 700 that is approximately box-shaped, the x1, y1, and z1 axes are described as independent axes. The x2, y2, and z2 axes, which are orthogonal to each other, are illustrated. Furthermore, in the following description, the starting point of the arrow in the illustration along the x2 axis is referred to as the -x2 side, and the leading edge as the +x2 side; the starting point of the arrow in the illustration along the y2 axis is referred to as the -y2 side, and the leading edge as the +y2 side; the starting point of the arrow in the illustration along the z2 axis is referred to as the -z2 side, and the leading edge as the +z2 side. Additionally, the plane formed by the x2 and y2 axes is called the x2y2 plane, the plane formed by the x2 and z2 axes is called the x2z2 plane, and the plane formed by the y2 and z2 axes is called the y2z2 plane. Here, in the drive circuit board 700 which is generally box-shaped, the surface 723 of the rigid member 721 and the surface 743 of the rigid member 741 are located opposite each other along the x2 axis. The normal direction of the surface 723 of the rigid member 721 is along the x2 axis from the -x2 side to the +x2 side. The normal direction of the surface 743 of the rigid member 741 is along the x2 axis from the +x2 side to the -x2 side. The normal direction of the surface 763 of the rigid member 761 is along the y2 axis from the +y2 side to the -y2 side. The normal direction of the surface 783 of the rigid member 781 is along the z2 axis from the -z2 side to the +z2 side.

[0265] Additionally, in the following explanation, the following situations will be as follows: Figure 16 , Figure 17 , Figure 18 The drive circuit board 700 in its unfolded state, as shown, is referred to as the unfolded drive circuit board 700. Figure 19 The drive circuit board 700 assembled on the general housing as shown is called the drive circuit board 700 in the assembled state.

[0266] 2.2.3.2 Component Configuration in the Drive Circuit Board

[0267] Next, the component configuration of the electronic components constituting the various circuits in the drive circuit board 700 will be described. Figure 20 This is a diagram showing an example of the component arrangement in the drive circuit board 700 in its unfolded state.

[0268] like Figure 20 As shown, the rigid wiring component 710 is provided with multiple circuit components, including drive signal output circuits 52a-1, 52b-1, 52a-2, 52b-2, ejection control circuit 51 composed of FPGA, capacitor C7a, and connectors CN2b and CN3a.

[0269] The drive signal output circuit 52a-1 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1, and is disposed on surface 723 of the rigid wiring member 710 of the drive circuit substrate 700. At this time, the transistors M1 and M2 included in the drive signal output circuit 52a-1 are arranged in the order of transistors M1 and M2 along the direction from side 713 to side 714. The integrated circuit 500 included in the drive signal output circuit 52a-1 is located on the side of side 711 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52a-1 is located on the side of side 712 of the arranged transistors M1 and M2.

[0270] The drive signal output circuit 52b-1 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1, and is disposed on the side 714 of the drive signal output circuit 52a-1 on the surface 723 of the rigid wiring member 710 of the drive circuit substrate 700. At this time, the transistors M1 and M2 included in the drive signal output circuit 52b-1 are arranged in the order of transistors M1 and M2 along the direction from side 713 to side 714, the integrated circuit 500 included in the drive signal output circuit 52b-1 is located on the side 711 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52b-1 is located on the side 712 of the arranged transistors M1 and M2.

[0271] The drive signal output circuit 52a-2 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1, and is disposed on the side 714 of the drive signal output circuit 52b-1 on the surface 723 of the rigid wiring member 710 of the drive circuit substrate 700. At this time, the transistors M1 and M2 included in the drive signal output circuit 52a-2 are arranged in the order of transistors M1 and M2 along the direction from side 713 to side 714, the integrated circuit 500 included in the drive signal output circuit 52a-2 is located on the side 711 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52a-2 is located on the side 712 of the arranged transistors M1 and M2.

[0272] The drive signal output circuit 52b-2 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1, and is disposed on the side 714 of the drive signal output circuit 52a-2 on the surface 723 of the rigid wiring member 710 of the drive circuit substrate 700. At this time, the transistors M1 and M2 included in the drive signal output circuit 52b-2 are arranged in the order of transistors M1 and M2 along the direction from side 713 to side 714, the integrated circuit 500 included in the drive signal output circuit 52b-2 is located on the side 711 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52b-2 is located on the side 712 of the arranged transistors M1 and M2.

[0273] That is, the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-1 are arranged on surface 723 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 711 to edge 712. Similarly, the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-1 are arranged on surface 723 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 711 to edge 712. The integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-2 are arranged on surface 723 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 711 to edge 712. The integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-2 are arranged on surface 723 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 711 to edge 712.

[0274] Furthermore, the drive signal output circuits 52a-1, 52a-2, 52b-1, and 52b-2 are located on the surface 723 of the rigid wiring member 710 of the drive circuit substrate 700, arranged adjacently from side 713 toward side 714 in the order of drive signal output circuit 52a-1, drive signal output circuit 52b-1, drive signal output circuit 52a-2, and drive signal output circuit 52b-2.

[0275] In this case, all the electronic components constituting the drive signal output circuits 52a-1, 52a-2, 52b-1, and 52b-2 are disposed on surface 723 of the rigid wiring member 710. That is, the electronic components constituting the drive signal output circuits 52a-1, 52a-2, 52b-1, and 52b-2 are not disposed on surface 724 of the rigid wiring member 710.

[0276] Furthermore, the drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2 are arranged in an alternating pattern from edge 713 toward edge 714. Specifically, in the direction from edge 711 toward edge 712, drive signal output circuits 52a-1 and 52a-2 are arranged in approximately the same position, drive signal output circuits 52b-1 and 52b-2 are arranged in approximately the same position, drive signal output circuits 52a-1 and 52b-1, 52b-2 are arranged in different positions, and drive signal output circuits 52a-2 and 52b-1, 52b-2 are arranged in different positions.

[0277] In detail, the drive signal output circuit 52a-1 is configured to overlap with at least a portion of the drive signal output circuit 52b-1, at least a portion of the drive signal output circuit 52a-2, and at least a portion of the drive signal output circuit 52b-2 when viewed along the direction from edge 713 toward edge 714. The integrated circuit 500 included in the drive signal output circuit 52a-1 is configured to not overlap with the integrated circuit 500 included in the drive signal output circuit 52b-1 and the integrated circuit 500 included in the drive signal output circuit 52b-2 when viewed along the direction from edge 713 toward edge 714, and to overlap with at least a portion of the integrated circuit 500 included in the drive signal output circuit 52a-2.

[0278] In this case, the transistors M1 and M2 included in the drive signal output circuit 52a-1 may be configured such that, when viewed along the direction from side 713 to side 714, they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52b-1 and the drive signal output circuit 52b-2, but overlap with at least a portion of the transistors M1 and M2 included in the drive signal output circuit 52a-2. Further, the inductor L1 included in the drive signal output circuit 52a-1 may be configured such that, when viewed along the direction from side 713 to side 714, it does not overlap with the inductor L1 included in the drive signal output circuit 52b-1 and the drive signal output circuit 52b-2, but overlaps with at least a portion of the inductor L1 included in the drive signal output circuit 52a-2.

[0279] Similarly, the drive signal output circuit 52b-1 is configured to overlap with at least a portion of the drive signal output circuit 52a-1, at least a portion of the drive signal output circuit 52a-2, and at least a portion of the drive signal output circuit 52b-2 when viewed along the direction from edge 713 toward edge 714. The integrated circuit 500 included in the drive signal output circuit 52b-1 is configured to not overlap with the integrated circuit 500 included in the drive signal output circuit 52a-1 and the integrated circuit 500 included in the drive signal output circuit 52a-2 when viewed along the direction from edge 713 toward edge 714, and to overlap with at least a portion of the integrated circuit 500 included in the drive signal output circuit 52b-2.

[0280] In this case, the transistors M1 and M2 included in the drive signal output circuit 52b-1 may be configured such that, when viewed along the direction from side 713 to side 714, they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52a-1 and the drive signal output circuit 52a-2, but overlap with at least a portion of the transistors M1 and M2 included in the drive signal output circuit 52b-2. Furthermore, the inductor L1 included in the drive signal output circuit 52b-1 may be configured such that, when viewed along the direction from side 713 to side 714, it does not overlap with the inductor L1 included in the drive signal output circuit 52a-1 and the drive signal output circuit 52a-2, but overlaps with at least a portion of the inductor L1 included in the drive signal output circuit 52b-2.

[0281] Here, "configured to overlap with at least a portion of drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2 when viewed along the direction from edge 713 to edge 714" means, when viewed along the direction from edge 713 to edge 714, overlapping with at least one of the electronic components included in drive signal output circuit 52a-1, at least one of the electronic components included in drive signal output circuit 52b-1, at least one of the electronic components included in drive signal output circuit 52a-2, and at least one of the electronic components included in drive signal output circuit 52b-2. The overlap of at least one component includes, for example, the following: the overlap of at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-1, the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-1, the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-2, and the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-2 when viewed along the direction from side 713 toward side 714.

[0282] Capacitor C7a is located on the surface 723 of the rigid wiring member 710, on the side 711 of the drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2, which are arranged from side 713 toward side 714. This capacitor C7a corresponds to the aforementioned capacitor C7 in the drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2, reducing the risk of voltage value fluctuations in the voltage signal VHV supplied to each of the drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2, and reducing the risk of noise overlap in the voltage signal VHV.

[0283] The ejection control circuit 51, which is composed of FPGA, is located on the side 711 of the drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2 arranged from side 713 toward side 714 on the surface 723 of the rigid wiring component 710, that is, on the side 714 of the capacitor C7a.

[0284] The connector CN2b includes multiple terminals TM2b, located closer to the edge 711 than the capacitor C7a and the ejection control circuit 51 disposed on the surface 723 of the rigid wiring member 710. At this time, the connector CN2b is positioned such that the multiple terminals TM2b are arranged along the edge 711 of the rigid wiring member 710.

[0285] The connector CN3a includes multiple terminals TM3a, located closer to the edge 712 than the capacitor C7a and the ejection control circuit 51 disposed on the surface 723 of the rigid wiring member 710. At this time, the connector CN3a is positioned such that the multiple terminals TM3a are arranged along the edge 712 of the rigid wiring member 710.

[0286] The rigid wiring component 730 includes drive signal output circuits 52a-3, 52b-3, 52a-4, 52b-4, capacitor C7b, abnormal detection circuits 54a and 54b serving as abnormal detection circuits 54, and abnormal notification circuits 55a and 55b serving as abnormal notification circuits 55.

[0287] The drive signal output circuit 52a-3 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1, and is disposed on surface 743 of the rigid wiring member 730 of the drive circuit substrate 700. At this time, the transistors M1 and M2 included in the drive signal output circuit 52a-3 are arranged in the order of transistors M1 and M2 along the direction from side 733 to side 734. The integrated circuit 500 included in the drive signal output circuit 52a-3 is located on side 731 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52a-3 is located on side 732 of the arranged transistors M1 and M2.

[0288] The drive signal output circuit 52b-3 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1. It is disposed on the side 734 of the rigid wiring member 730 of the drive circuit substrate 700, on the side of the drive signal output circuit 52b-3. At this time, the transistors M1 and M2 included in the drive signal output circuit 52b-3 are arranged in the order of transistors M1 and M2 along the direction from side 733 to side 734. The integrated circuit 500 included in the drive signal output circuit 52b-3 is located on the side of the arranged transistors M1 and M2 on side 731, and the inductor L1 included in the drive signal output circuit 52b-3 is located on the side of the arranged transistors M1 and M2 on side 732.

[0289] The drive signal output circuit 52a-4 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1. It is disposed on the side 734 of the rigid wiring member 730 of the drive circuit substrate 700, next to the drive signal output circuit 52b-1. At this time, the transistors M1 and M2 included in the drive signal output circuit 52a-4 are arranged in the order of transistors M1 and M2 along the direction from side 733 to side 734. The integrated circuit 500 included in the drive signal output circuit 52a-4 is located on the side 731 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52a-4 is located on the side 732 of the arranged transistors M1 and M2.

[0290] The drive signal output circuit 52b-4 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1. It is disposed on the side 734 of the rigid wiring member 730 of the drive circuit substrate 700. At this time, the transistors M1 and M2 included in the drive signal output circuit 52b-4 are arranged in the order of transistors M1 and M2 along the direction from side 733 to side 734. The integrated circuit 500 included in the drive signal output circuit 52b-4 is located on the side 731 of the arranged transistors M1 and M2, and the inductor L1 included in the drive signal output circuit 52b-4 is located on the side 732 of the arranged transistors M1 and M2.

[0291] That is, the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-3 are arranged on surface 743 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 731 to edge 732. Similarly, the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-3 are arranged on surface 743 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 731 to edge 732. The integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-4 are arranged on surface 743 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 731 to edge 732. The integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-4 are arranged on surface 743 in the order of integrated circuit 500, transistors M1, M2, and inductor L1 along the direction from edge 731 to edge 732.

[0292] Furthermore, the drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4 are located on the rigid wiring component 730 of the drive circuit substrate 700, on the surface 743, arranged adjacently from the edge 733 toward the edge 734 in the order of drive signal output circuit 52a-3, drive signal output circuit 52b-3, drive signal output circuit 52a-4, and drive signal output circuit 52b-4.

[0293] In this case, all the electronic components constituting the drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4 are disposed on surface 743 of the rigid wiring member 730. In other words, the electronic components constituting the drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4 are not disposed on surface 744 of the rigid wiring member 730.

[0294] Furthermore, the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4 are arranged in an alternating pattern from edge 733 toward edge 734. Specifically, in the direction from edge 731 toward edge 732, drive signal output circuits 52a-3 and 52a-4 are arranged in approximately the same position, drive signal output circuits 52b-3 and 52b-4 are arranged in approximately the same position, drive signal output circuits 52a-3 and 52b-3, 52b-4 are arranged in different positions, and drive signal output circuits 52a-4 and 52b-3, 52b-4 are arranged in different positions.

[0295] In detail, the drive signal output circuit 52a-3 is configured to overlap with at least a portion of the drive signal output circuit 52b-3, at least a portion of the drive signal output circuit 52a-4, and at least a portion of the drive signal output circuit 52b-4 when viewed along the direction from edge 733 to edge 734. The integrated circuit 500 included in the drive signal output circuit 52a-3 is configured to not overlap with the integrated circuit 500 included in the drive signal output circuit 52b-3 and the integrated circuit 500 included in the drive signal output circuit 52b-4 when viewed along the direction from edge 733 to edge 734, and to overlap with at least a portion of the integrated circuit 500 included in the drive signal output circuit 52a-4.

[0296] In this case, the transistors M1 and M2 included in the drive signal output circuit 52a-3 may be configured such that, when viewed along the direction from edge 733 to edge 734, they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52b-3 and the drive signal output circuit 52b-4, but overlap with at least a portion of the transistors M1 and M2 included in the drive signal output circuit 52a-4. Further, the inductor L1 included in the drive signal output circuit 52a-3 may be configured such that, when viewed along the direction from edge 733 to edge 734, it does not overlap with the inductor L1 included in the drive signal output circuit 52b-3 and the drive signal output circuit 52b-4, but overlaps with at least a portion of the inductor L1 included in the drive signal output circuit 52a-4.

[0297] Similarly, the drive signal output circuit 52b-3 is configured to overlap with at least a portion of the drive signal output circuit 52a-3, at least a portion of the drive signal output circuit 52a-4, and at least a portion of the drive signal output circuit 52b-4 when viewed along the direction from edge 733 toward edge 734. The integrated circuit 500 included in the drive signal output circuit 52b-3 is configured to not overlap with the integrated circuit 500 included in the drive signal output circuit 52a-3 and the integrated circuit 500 included in the drive signal output circuit 52a-4 when viewed along the direction from edge 733 toward edge 734, and to overlap with at least a portion of the integrated circuit 500 included in the drive signal output circuit 52b-4.

[0298] In this case, the transistors M1 and M2 included in the drive signal output circuit 52b-3 may be configured such that, when viewed along the direction from edge 733 to edge 734, they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52a-3 and the drive signal output circuit 52a-4, and overlap with at least a portion of the transistors M1 and M2 included in the drive signal output circuit 52b-4. Further, the inductor L1 included in the drive signal output circuit 52b-3 may be configured such that, when viewed along the direction from edge 733 to edge 734, it does not overlap with the inductor L1 included in the drive signal output circuit 52a-3 and the drive signal output circuit 52a-4, and overlaps with at least a portion of the inductor L1 included in the drive signal output circuit 52b-2.

[0299] Here, "configured to overlap with at least a portion of drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4 when viewed along the direction from edge 733 to edge 734" means, when viewed along the direction from edge 733 to edge 734, overlapping with at least one of the electronic components included in drive signal output circuit 52a-3, at least one of the electronic components included in drive signal output circuit 52b-3, at least one of the electronic components included in drive signal output circuit 52a-4, and at least one of the electronic components included in drive signal output circuit 52b-4. The overlap of at least one component includes, for example, the following cases where the component overlaps with at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-3, at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-3, at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-4, and at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-4 when viewed along the direction from edge 733 toward edge 734.

[0300] Capacitor C7b is located on the surface 743 of the rigid wiring member 730, on the side 731 of the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, which are arranged from side 733 toward side 734. This capacitor C7b corresponds to the aforementioned capacitor C7 in the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, reducing the risk of voltage value fluctuations in the voltage signal VHV supplied to each of the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, and reducing the risk of noise overlap in the voltage signal VHV.

[0301] The anomaly detection circuits 54a and 54b are located on the surface 743 of the rigid wiring member 730, on the side 731 of the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, which are arranged from side 733 toward side 734, i.e., on the side 734 of the capacitor C7b. Furthermore, the anomaly detection circuit 54a detects whether the voltage value of the voltage signal VHV is normal, and the anomaly detection circuit 54b detects whether the voltage value of the voltage signal VDD generated based on the voltage signal VMV is normal.

[0302] The anomaly notification circuits 55a and 55b are located on the surface 744 of the rigid wiring component 730, on the side 731 of the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, which are arranged from side 733 toward side 734, i.e., near the anomaly detection circuits 54a and 54b. The anomaly notification circuit 55a lights up, turns off, or flashes based on the result of anomaly detection in the anomaly detection circuit 54a. The anomaly notification circuit 55b lights up, turns off, or flashes based on the result of anomaly detection in the anomaly detection circuit 54b.

[0303] The rigid wiring component 750 is equipped with a temperature detection circuit 56 and a voltage conversion circuit 58.

[0304] The temperature detection circuit 56 is located approximately at the center of the rigid wiring component 750 on surface 763. Specifically, the temperature detection circuit 56 is configured to overlap at least partially with the intersection of two virtual lines: a virtual line whose distance to edge 751 is equal to the distance to edge 752, and a virtual line whose distance to edge 753 is equal to the distance to edge 754. The temperature detection circuit 56 detects the ambient temperature of the drive circuit module 50, generates a temperature information signal Tt including temperature information corresponding to the ambient temperature, and outputs it to the head control circuit 12. In such a temperature detection circuit 56, it is necessary to comprehensively detect the temperature information of multiple circuits disposed on the drive circuit board 700.

[0305] In the liquid ejection device 1 of this embodiment, the temperature detection circuit 56 is disposed on a rigid wiring component 750, which is different from the rigid wiring components 710 and 730, which are provided with a drive signal output circuit 52 that generates a large amount of heat. Furthermore, it is located approximately in the center of the rigid wiring component 750. As a result, the contribution of the drive signal output circuit 52, which generates a large amount of heat, is reduced, and consequently, the accuracy of obtaining the overall ambient temperature of the drive circuit module 50 is improved.

[0306] The voltage conversion circuit 58 is located on the side of the temperature detection circuit 56 at the surface 763 of the rigid wiring member 750. Furthermore, the voltage conversion circuit 58 generates and outputs a voltage signal VDD by converting the voltage value of the voltage signal VMV. The voltage signal VDD is used in various structures provided on the drive circuit board 700, and its voltage value is smaller than that of the voltage signals VHV and VMV, therefore it is easily affected by noise. By placing the voltage conversion circuit 58 that outputs such a voltage signal VDD in a rigid wiring member 750 located between a rigid wiring member 710 which includes multiple circuits including drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2, and a rigid wiring member 730 which includes multiple circuits including drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, the wiring length for transmitting the voltage signal VDD can be shortened. As a result, the risk of voltage value fluctuations in the voltage signal VDD is reduced, and the risk of noise superimposed in the voltage signal VDD is also reduced.

[0307] The rigid wiring component 770 is provided with a capacitor 53, a connector CN3b, and a connector CN1a.

[0308] Connector CN3b includes multiple terminals TM3b. Furthermore, connector CN3b is located on face 783 of rigid wiring member 770 such that the multiple terminals TM3b are arranged along edge 772.

[0309] Capacitor 53 is located at face 783 of the rigid wiring component 770. Capacitor 53 stabilizes the voltage value of the reference voltage signal VBS output by the drive signal output circuit 52a-1.

[0310] Connector CN1a is located at face 784 of the rigid wiring component 770. Connector CN1a engages with connector CN1b of the printhead 30, thereby supplying various signals generated in the drive circuit board 700 to the printhead 30.

[0311] As described above, on the surface 723 of the rigid wiring component 710 (i.e., the surface 723 of the rigid component 721) of the drive circuit board 700, drive signal output circuits 52a-1, 52b-1, 52a-2, 52b-2, an ejection control circuit 51 composed of an FPGA, a capacitor C7a, and connectors CN2b and CN3a are provided. On the surface 743 of the rigid wiring component 730 (i.e., the surface 743 of the rigid component 741), drive signal output circuits 52a-3, 52b-3, 52a-4, 52b-4, a capacitor C7b, and an abnormality detection circuit are provided. Measurement circuits 54a and 54b are provided. Abnormal notification circuits 55a and 55b are provided on the surface 744 of the rigid wiring component 730, which is the surface 744 of the rigid component 742. Temperature detection circuit 56 and voltage conversion circuit 58 are provided on the surface 763 of the rigid wiring component 750, which is the surface 763 of the rigid component 761. Capacitor 53 and connector CN3b are provided on the surface 783 of the rigid wiring component 770, which is the surface 784 of the rigid component 782. Connector CN1a is provided on the surface 784 of the rigid wiring component 770.

[0312] Here, an example of the wiring pattern formed on the drive circuit board 700 constructed as described above will be described, namely, an example of the wiring pattern for transmitting voltage signals VHV, VMV, and VDD that function as power supply voltages for various circuits provided on the drive circuit board 700, and an example of the wiring pattern for transmitting drive signals COMA1~COMA4, COMB1~COMB4, and reference voltage signal VBS generated in the drive circuit board 700.

[0313] Figure 21 This diagram illustrates an example of the wiring pattern for transmitting voltage signals VHV, VMV, and VDD. As described above, the voltage signals VHV and VMV transmitted in the drive circuit board 700 are output by the power supply voltage output circuit 18 of the control unit 2. Furthermore, the voltage signals VHV and VMV are input to the drive circuit board 700 via connector CN2b.

[0314] The voltage signal VHV input via connector CN2b is transmitted in the wiring wh1 to wh5 of the flexible wiring component 790 provided on the drive circuit board 700, the wiring wh6 provided on the rigid wiring component 710, and the wiring wh7 provided on the rigid wiring component 730, and is input to the drive signal selection circuit 200 provided on various structures of the drive circuit board 700 and the printhead 30.

[0315] For wiring wh1, one end is electrically connected to terminal TM2b of connector CN2b and extends along the x1 axis to the -x1 side, and the other end is electrically connected to wiring wh2.

[0316] The wiring wh2 is configured to be continuous across regions 701, 702, 703, 704, and 705. That is, the flexible wiring component 790 includes wiring wh2 for transmitting the voltage signal VHV supplied to the drive signal selection circuit 200 and the drive signal output circuit 52, and wiring wh2 is configured to be continuous across regions 701, 702, 703, 704, and 705. Preferably, wiring wh2 is configured to be a straight line along the y1 axis across regions 701, 702, 703, 704, and 705. Furthermore, after the voltage signal VHV is transmitted in wiring wh2, it is branched in each of regions 701, 703, and 705, and supplied via through-holes (not shown) to various circuits provided in the rigid wiring components 710, 730, and 750.

[0317] For example, wiring wh2 branches off to wiring wh3 in region 701. Wiring wh3 is supplied to capacitor C7a provided in rigid wiring member 710 via a through-hole (not shown). Furthermore, the voltage signal VHV supplied to capacitor C7a is transmitted in wiring wh6 provided in rigid wiring member 710 and supplied to each of drive signal output circuits 52a-1, 52a-2, 52b-1, and 52b-2.

[0318] Additionally, for example, wiring wh2 branches to wiring wh4 in region 705. Wiring wh4 is supplied to capacitor C7b provided in rigid wiring member 730 via a through-hole (not shown). Furthermore, the voltage signal VHV supplied to capacitor C7b is transmitted in wiring wh7 provided in rigid wiring member 730 and supplied to each of drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4.

[0319] Additionally, for example, wiring wh2 branches to wiring wh5 in region 705. Wiring wh5 is transmitted in regions 706 and 707 and is provided via a through-hole (not shown) to terminal TM1a of connector CN1a provided on rigid wiring member 770. Thus, voltage signal VHV is supplied to drive signal selection circuit 200 of printhead 30.

[0320] As described above, the voltage signal VHV is input to the drive circuit board 700 via wiring wh1 and transmitted in wiring wh2, thereby being supplied to various circuit structures of the drive circuit board 700 and the print head 30. Therefore, in wiring wh2, due to the transmission of the voltage signal VHV to various circuit structures of the drive circuit board 700 and the print head 30, a relatively large current is generated. In the flexible wiring component 790, this wiring wh2 is made continuous across regions 701, 702, 703, 704, and 705, thus eliminating the need for via wiring and reducing the risk of impedance variations in wiring wh2. As a result, the risk of voltage value variations in the voltage signal VHV transmitted in wiring wh2 is reduced, and the stability of the operation of various circuits that operate using the voltage signal VHV as a power supply voltage is improved.

[0321] Furthermore, by setting the wiring wh2 across regions 701, 702, 703, 704, and 705 as a straight line, the risk of current density deviations at the bends of wiring wh2 is reduced. As a result, the risk of voltage value fluctuations in the voltage signal VHV transmitted in wiring wh2 is further reduced, and the stability of various circuits operating using the voltage signal VHV as a power supply voltage is further improved. It should be noted that, alternatively, multiple branch wirings can be electrically connected within wiring wh2, in addition to wirings wh3, wh4, and wh5.

[0322] In addition, the voltage signal VMV input via connector CN2b is transmitted in the wiring wm1 to wm3 of the flexible wiring component 790 provided on the drive circuit board 700, and is input to various structures provided on the drive circuit board 700.

[0323] For wiring wm1, one end is electrically connected to terminal TM2b of connector CN2b and extends along the x1 axis to the -x1 side, and the other end is electrically connected to wiring wm2.

[0324] The wiring wm2, spanning regions 701, 702, 703, 704, and 705, is configured to be continuous. Preferably, the wiring wm2 spanning regions 701, 702, 703, 704, and 705 is configured to be a straight line along the y1 axis. Furthermore, after the voltage signal VMV is transmitted in the wiring wm2, it is branched in each of regions 701, 703, and 705, and supplied via through-holes (not shown) to various circuits provided in the rigid wiring components 710, 730, and 750.

[0325] For example, wiring wm2 is branched into wiring wm3 in region 703. Wiring wm3 is supplied to voltage conversion circuit 58 via a via (not shown). And, voltage conversion circuit 58 generates and outputs voltage signal VDD based on the supplied voltage signal VMV.

[0326] As described above, the voltage signal VMV is input to the drive circuit board 700 via wiring wm1, transmitted in wiring wm2, and thus supplied to various circuit structures of the drive circuit board 700. Therefore, in wiring wm2, due to the transmission of the voltage signal VMV supplied to various circuit structures of the drive circuit board 700, a relatively large current is generated. In the flexible wiring component 790, this wiring wm2 is made continuous across regions 701, 702, 703, 704, and 705, eliminating the need for via wiring, thus reducing the risk of impedance variations in wiring wm2. As a result, the risk of voltage value variations in the voltage signal VMV transmitted in wiring wm2 is reduced, and the stability of the operation of various circuits that operate using the voltage signal VMV as a power supply voltage is improved.

[0327] Furthermore, by setting the wiring wm2 across regions 701, 702, 703, 704, and 705 as a straight line, the risk of current density deviations occurring at the bends of wiring wm2 is reduced. As a result, the risk of voltage value fluctuations in the voltage signal VMV transmitted in wiring wm2 is further reduced, and the stability of the operation of various circuits that operate using the voltage signal VMV as a power supply voltage is further improved.

[0328] In addition, the voltage signal VDD output by the voltage conversion circuit 58 is transmitted in the wiring wd1 and wd2 of the flexible wiring component 790 provided on the drive circuit board 700 and is input to various structures provided on the drive circuit board 700.

[0329] For wiring wd1, one end is electrically connected to voltage conversion circuit 58 and extends along x1 axis to the +x1 side, and the other end is electrically connected to wiring wd2.

[0330] Wiring wd2 is configured to be continuous across regions 701, 702, 703, 704, and 705. Preferably, wiring wd2 is configured to be a straight line along the y1 axis across regions 701, 702, 703, 704, and 705. Furthermore, after the voltage signal VDD is transmitted in wiring wd2, it is branched in each of regions 701, 703, and 705, and supplied via vias (not shown) to various circuits provided in the rigid wiring components 710, 730, and 750.

[0331] For example, wiring wd2 is branched into wiring wd3 in region 701. Wiring wd3 is supplied to the FPGA including ejection control circuitry 51 via a via (not shown). And ejection control circuitry 51 operates based on the supplied voltage signal VDD.

[0332] As described above, the voltage signal VDD is input to the drive circuit board 700 via wiring wd1, transmitted in wiring wd2, and thus supplied to various circuit structures of the drive circuit board 700. Therefore, in wiring wd2, due to the transmission of the voltage signal VDD to various circuit structures of the drive circuit board 700, a relatively large current is generated. In the flexible wiring component 790, this wiring wd2 is made continuous across regions 701, 702, 703, 704, and 705, eliminating the need for via wiring, thus reducing the risk of impedance variations in wiring wd2. As a result, the risk of voltage value variations in the voltage signal VDD transmitted in wiring wd2 is reduced, and the stability of the operation of various circuits that operate using the voltage signal VDD as a power supply voltage is improved.

[0333] Furthermore, by setting the wiring wd2 across regions 701, 702, 703, 704, and 705 as a straight line, the risk of current density deviations occurring at the bends of wiring wd2 is reduced. As a result, the risk of voltage value fluctuations in the voltage signal VDD transmitted in wiring wd2 is further reduced, and the stability of the operation of various circuits that operate using the voltage signal VDD as a power supply voltage is further improved.

[0334] Next, an example of a wiring pattern for transmitting drive signals COMA1~COMA4, COMB1~COMB4, and reference voltage signal VBS generated in the drive circuit board 700 will be described. Figure 22 This is a diagram illustrating an example of a wiring pattern for transmitting the drive signal COM and the reference voltage signal VBS.

[0335] The drive signal COMA1 output by drive signal output circuit 52a-1 is transmitted in wiring wca1 and input to terminal TM1a of connector CN1a. Similarly, the drive signal COMB1 output by drive signal output circuit 52b-1 is transmitted in wiring wcb1 and input to terminal TM1a of connector CN1a. Furthermore, drive signals COMA1 and COMB1 are input to the drive signal selection circuit 200 of ejection module 32-1 via the corresponding terminals TM1a of connector CN1a.

[0336] Similarly, the drive signal COMA2 output by drive signal output circuit 52a-2 is transmitted in wiring wca2 and input to the drive signal selection circuit 200 of the ejection module 32-2 via terminal TM1a of connector CN1a. The drive signal COMB2 output by drive signal output circuit 52b-2 is transmitted in wiring wcb2 and input to the drive signal selection circuit 200 of the ejection module 32-2 via terminal TM1a of connector CN1a. Similarly, the drive signal COMA3 output by drive signal output circuit 52a-3 is transmitted in wiring wca3 and input to the drive signal selection circuit 200 of the ejection module 32-3 via terminal TM1a of connector CN1a. The drive signal COMB3 output by drive signal output circuit 52b-3 is transmitted in wiring wcb3 and input to the drive signal selection circuit 200 of the ejection module 32-3 via terminal TM1a of connector CN1a. Similarly, the drive signal COMA4 output by the drive signal output circuit 52a-4 is transmitted in the wiring wca4 and input to the drive signal selection circuit 200 of the ejection module 32-4 via the terminal TM1a of the connector CN1a. The drive signal COMB4 output by the drive signal output circuit 52b-4 is transmitted in the wiring wcb4 and input to the drive signal selection circuit 200 of the ejection module 32-4 via the terminal TM1a of the connector CN1a.

[0337] The reference voltage signal VBS output by the reference voltage signal output circuit 530 of the integrated circuit 500 included in the drive signal output circuit 52a-1 is transmitted in wiring wb1 and input to wiring wb2, which is electrically connected to the capacitor 53. After the reference voltage signal VBS is input to the capacitor 53, it is transmitted in wiring wb4 and wiring wb6 and supplied to the electrode 612 of the piezoelectric element 60 included in the ejection module 32-1 via terminal TM1a of connector CN1a. In addition, the reference voltage signal VBS input to the capacitor 53 is transmitted in wiring wb4 and wiring wb5 and supplied to the electrode 612 of the piezoelectric element 60 included in the ejection module 32-2 via terminal TM1a of connector CN1a. In addition, the reference voltage signal VBS input to the capacitor 53 is transmitted in wiring wb3 and wiring wb7 and supplied to the electrode 612 of the piezoelectric element 60 included in the ejection module 32-3 via terminal TM1a of connector CN1a. Furthermore, after the reference voltage signal VBS is input to capacitor 53, it is transmitted in wiring wb3 and wiring wb8, and supplied to the electrode 612 of the piezoelectric element 60 included in the ejection module 32-4 via terminal TM1a of connector CN1a. That is, the reference voltage signal VBS is spun after being input to capacitor 53 and supplied to the electrode 612 of the piezoelectric element 60 of each of the ejection modules 32-1 to 32-4.

[0338] At this time, the wiring wb6 for transmitting the reference voltage signal VBS supplied to the ejection module 32-1 is located between a portion of the wiring wca1 for transmitting the drive signal COMA1 supplied to the ejection module 32-1 and a portion of the wiring wcb1 for transmitting the drive signal COMB1 supplied to the ejection module 32-1; the wiring wg for transmitting the ground signal is located between a different portion of the wiring wca1 for transmitting the drive signal COMA1 supplied to the ejection module 32-1 and a different portion of the wiring wcb1 for transmitting the drive signal COMB1 supplied to the ejection module 32-1.

[0339] Similarly, the wiring wb5 for transmitting the reference voltage signal VBS supplied to the ejection module 32-2 is located between a portion of the wiring wca2 for transmitting the drive signal COMA2 supplied to the ejection module 32-2 and a portion of the wiring wcb2 for transmitting the drive signal COMB2 supplied to the ejection module 32-2; the wiring wg for transmitting the ground signal is located between a different portion of the wiring wca2 for transmitting the drive signal COMA2 supplied to the ejection module 32-2 and a different portion of the wiring wcb2 for transmitting the drive signal COMB2 supplied to the ejection module 32-2.

[0340] Similarly, the wiring wb7 for transmitting the reference voltage signal VBS supplied to the ejection module 32-3 is located between a portion of the wiring wca3 for transmitting the drive signal COMA3 supplied to the ejection module 32-3 and a portion of the wiring wcb3 for transmitting the drive signal COMB3 supplied to the ejection module 32-3; the wiring wg for transmitting the ground signal is located between a different portion of the wiring wca3 for transmitting the drive signal COMA3 supplied to the ejection module 32-3 and a different portion of the wiring wcb3 for transmitting the drive signal COMB3 supplied to the ejection module 32-3.

[0341] Similarly, the wiring wb8 for transmitting the reference voltage signal VBS supplied to the ejection module 32-4 is located between a portion of the wiring wca4 for transmitting the drive signal COMA4 supplied to the ejection module 32-4 and a portion of the wiring wcb4 for transmitting the drive signal COMB4 supplied to the ejection module 32-4; ​​the wiring wg for transmitting the ground signal is located between a different portion of the wiring wca4 for transmitting the drive signal COMA4 supplied to the ejection module 32-4 and a different portion of the wiring wcb4 for transmitting the drive signal COMB4 supplied to the ejection module 32-4.

[0342] That is, the drive circuit board 700 has wiring wca1, wiring wcb1, wiring wca2, wiring wcb2, wiring wca3, wiring wcb3, wiring wca4, wiring wcb4, wiring wb1, wiring wb6, wiring wb5, wiring wb7, wiring wb8, and wiring wg. Wiring wca1 electrically connects the drive signal output circuit 52a-1 to terminal TM1a of connector CN1a; wiring wcb1 electrically connects the drive signal output circuit 52b-1 to terminal TM1a of connector CN1a; wiring wc... Wiring a2 electrically connects the drive signal output circuit 52a-2 to terminal TM1a of connector CN1a; wiring wcb2 electrically connects the drive signal output circuit 52b-2 to terminal TM1a of connector CN1a; wiring wca3 electrically connects the drive signal output circuit 52a-3 to terminal TM1a of connector CN1a; wiring wcb3 electrically connects the drive signal output circuit 52b-3 to terminal TM1a of connector CN1a; wiring wca4 electrically connects the drive signal output circuit 52a-4 to terminal TM1a of connector CN1a. Wiring wb4 electrically connects the drive signal output circuit 52b-4 to terminal TM1a of connector CN1a; wiring wb1 electrically connects the reference voltage signal output circuit 530 to capacitor 53; wiring wb6 electrically connects capacitor 53 to connector CN3a, and from wiring wb1, transmits the reference voltage signal VBS supplied to the electrode 612 of the piezoelectric element 60 of the ejection module 32-1; wiring wb5 electrically connects capacitor 53 to connector CN3a, and from wiring wb1, transmits the reference voltage signal VBS supplied to the ejection module 32-1. -2 The reference voltage signal VBS of the electrode 612 of the piezoelectric element 60 of the ejection module 32-3 is transmitted via wiring wb7, which connects capacitor 53 to connector CN3a and is branched from wiring wb1 to transmit the reference voltage signal VBS supplied to the electrode 612 of the piezoelectric element 60 of the ejection module 32-4; ​​wiring wb8 connects capacitor 53 to connector CN3a and is branched from wiring wb1 to transmit the reference voltage signal VBS supplied to the electrode 612 of the piezoelectric element 60 of the ejection module 32-4; ​​wiring wg transmits the ground signal.

[0343] Furthermore, for wiring wca1, a portion is set to be adjacent to wiring wb6, and a different portion is set to be adjacent to wiring wg; for wiring wcb1, a portion is set to be adjacent to wiring wb6, and a different portion is set to be adjacent to wiring wg; for wiring wca2, a portion is set to be adjacent to wiring wb5, and a different portion is set to be adjacent to wiring wg; for wiring wcb2, a portion is set to be adjacent to wiring wb5, and a different portion is set to be adjacent to wiring wg; for wiring wca3, a portion is set to be adjacent to wiring wb7, and a different portion is set to be adjacent to wiring wg; for wiring wcb3, a portion is set to be adjacent to wiring wb7, and a different portion is set to be the same as wiring wg; for wiring wca4, a portion is set to be adjacent to wiring wb8, and a different portion is set to be adjacent to wiring wg; for wiring wcb4, a portion is set to be adjacent to wiring wb8, and a different portion is set to be adjacent to wiring wg.

[0344] By configuring the circuit as described above, the current generated by the drive signals COMA1 and COMB1 supplied to the ejection module 32-1 is fed back via wiring wb6, which supplies the reference voltage signal VBS to the ejection module 32-1. Therefore, the magnetic field generated by the current from the drive signals COMA1 and COMB1 supplied to the ejection module 32-1 is canceled out by the magnetic field generated by the current fed back via wiring wb6, which supplies the reference voltage signal VBS to the ejection module 32-1. As a result, the waveform accuracy of the drive signals COMA1 and COMB1 supplied to the ejection module 32-1 is improved. Furthermore, regarding the wiring wca1 and wcb1 that transmits the drive signals COMA1 and COMB1 to the ejection module 32-1, in the interval that is not adjacent to the wiring wb6 that supplies the reference voltage signal VBS to the ejection module 32-1, the wiring wg that transmits the ground signal is set to be adjacent to the wiring wca1 and wcb1 that transmits the drive signals COMA1 and COMB1 to the ejection module 32-1. This reduces the risk of noise overlap in the drive signals COMA1 and COMB1 supplied to the ejection module 32-1, and further improves the waveform accuracy of the drive signals COMA1 and COMB1.

[0345] Similarly, the magnetic field generated by the current produced when the drive signals COMA2 and COMB2 are supplied to the ejection module 32-2 is canceled by the magnetic field generated by the current fed back through the wiring wb5 that supplies the reference voltage signal VBS to the ejection module 32-2. Therefore, the waveform accuracy of the drive signals COMA2 and COMB2 supplied to the ejection module 32-2 is improved. Furthermore, for the wiring wca2 and wcb2 that transmit the drive signals COMA2 and COMB2, in the intervals that are not adjacent to the wiring wb5, the wiring wg is set to be adjacent to the wiring wca2 and wcb2, thereby reducing the risk of noise overlap in the drive signals COMA2 and COMB2 and further improving the waveform accuracy of the drive signals COMA2 and COMB2.

[0346] Similarly, the magnetic field generated by the current produced when the drive signals COMA3 and COMB3 are supplied to the ejection module 32-3 is canceled by the magnetic field generated by the current fed back from the wiring wb7 that supplies the reference voltage signal VBS to the ejection module 32-3. Therefore, the waveform accuracy of the drive signals COMA3 and COMB3 supplied to the ejection module 32-3 is improved. Furthermore, for the wiring wca3 and wcb3 that transmit the drive signals COMA3 and COMB3, in the intervals that are not adjacent to the wiring wb7, the wiring wg is set to be adjacent to the wiring wca3 and wcb3, thereby reducing the risk of noise overlap in the drive signals COMA3 and COMB3 and further improving the waveform accuracy of the drive signals COMA3 and COMB3.

[0347] Similarly, the magnetic field generated by the current produced when the drive signals COMA4 and COMB4 are supplied to the ejection module 32-4 is canceled by the magnetic field generated by the current fed back from the wiring wb8 that supplies the reference voltage signal VBS to the ejection module 32-4. Therefore, the waveform accuracy of the drive signals COMA4 and COMB4 supplied to the ejection module 32-4 is improved. Furthermore, for the wiring wca4 and wcb4 that transmit the drive signals COMA4 and COMB4, in the intervals that are not adjacent to the wiring wb8, the wiring wg is set to be adjacent to the wiring wca4 and wcb4, thereby reducing the risk of noise overlap in the drive signals COMA4 and COMB4 and further improving the waveform accuracy of the drive signals COMA4 and COMB4.

[0348] Next, the component configuration of the drive circuit board 700 with various circuits in its assembled state will be described. Figure 23 This is a diagram showing an example of the component configuration of the drive circuit board 700 when viewed from the +x2 side along the x2 axis in its assembled state. Figure 24 This is a diagram showing an example of the component configuration of the drive circuit board 700 in its assembled state as viewed from the -y2 side along the y2 axis.

[0349] As mentioned above, in the assembled drive circuit board 700, the surface 723 of the rigid wiring component 710, which houses the drive signal output circuits 52a-1, 52a-2, 52b-1, and 52b-2, and the surface 743 of the rigid wiring component 730, which houses the drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4, are positioned opposite each other along the x2 axis. At this time, as... Figure 23 As shown, they are configured such that, when the drive circuit board 700 in its assembled state is viewed along the x2 axis, the drive signal output circuit 52a-1 provided on the surface 723 of the rigid wiring member 710 and the drive signal output circuit 52b-4 provided on the surface 743 of the rigid wiring member 730 overlap at least partially, and the integrated circuit 500 included in the drive signal output circuit 52a-1 does not overlap with the integrated circuit 500 included in the drive signal output circuit 52b-4.

[0350] Alternatively, in this case, the transistors M1 and M2 included in the drive signal output circuit 52a-1 may be configured such that they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52b-4 when viewed along the x2 axis. Furthermore, the inductor L1 included in the drive signal output circuit 52a-1 may be configured such that it does not overlap with the inductor L1 included in the drive signal output circuit 52b-4 when viewed along the x2 axis.

[0351] Here, the so-called drive signal output circuit 52a-1 and drive signal output circuit 52b-4 are configured such that at least a portion overlaps when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis. This means that when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis, at least one of the electronic components included in drive signal output circuit 52a-1 overlaps with at least one of the electronic components included in drive signal output circuit 52b-4. For example, this includes the following cases: at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in drive signal output circuit 52a-1 overlaps with at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in drive signal output circuit 52b-4.

[0352] Similarly, the drive signal output circuit 52b-1 disposed on the surface 723 of the rigid wiring member 710 and the drive signal output circuit 52a-4 disposed on the surface 743 of the rigid wiring member 730 are configured such that at least a portion overlaps when the drive circuit substrate 700 in the assembled state is viewed along the x2 axis, and the integrated circuit 500 included in the drive signal output circuit 52b-1 and the integrated circuit 500 included in the drive signal output circuit 52a-4 are configured not to overlap.

[0353] Alternatively, in this case, the transistors M1 and M2 included in the drive signal output circuit 52b-1 may be configured so that they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52a-4 when viewed along the x2 axis. Furthermore, the inductor L1 included in the drive signal output circuit 52b-1 may be configured so that it does not overlap with the inductor L1 included in the drive signal output circuit 52a-4 when viewed along the x2 axis.

[0354] Here, the so-called drive signal output circuit 52b-1 and drive signal output circuit 52a-4 are configured such that at least a portion overlaps when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis. This means that when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis, at least one of the electronic components included in the drive signal output circuit 52b-1 overlaps with at least one of the electronic components included in the drive signal output circuit 52a-4. For example, this includes the following cases: at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-1 overlaps with at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-4.

[0355] Similarly, the drive signal output circuit 52a-2 disposed on the surface 723 of the rigid wiring member 710 and the drive signal output circuit 52b-3 disposed on the surface 743 of the rigid wiring member 730 are configured such that at least a portion overlaps when the drive circuit substrate 700 in the assembled state is viewed along the x2 axis, and the integrated circuit 500 included in the drive signal output circuit 52a-2 and the integrated circuit 500 included in the drive signal output circuit 52b-3 are configured not to overlap.

[0356] Alternatively, in this case, the transistors M1 and M2 included in the drive signal output circuit 52a-2 may be configured such that they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52b-3 when viewed along the x2 axis. Furthermore, the inductor L1 included in the drive signal output circuit 52a-2 may be configured such that it does not overlap with the inductor L1 included in the drive signal output circuit 52b-3 when viewed along the x2 axis.

[0357] Here, the so-called drive signal output circuit 52a-2 and drive signal output circuit 52b-3 are configured such that at least a portion overlaps when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis. This means that when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis, at least one of the electronic components included in the drive signal output circuit 52a-2 overlaps with at least one of the electronic components included in the drive signal output circuit 52b-3. For example, this includes the following cases: at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-2 overlaps with at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-3.

[0358] Similarly, the drive signal output circuit 52b-2 disposed on the surface 723 of the rigid wiring member 710 and the drive signal output circuit 52a-3 disposed on the surface 743 of the rigid wiring member 730 are configured such that at least a portion overlaps when the drive circuit substrate 700 in the assembled state is viewed along the x2 axis, and the integrated circuit 500 included in the drive signal output circuit 52b-2 and the integrated circuit 500 included in the drive signal output circuit 52a-3 are configured not to overlap.

[0359] Alternatively, in this case, the transistors M1 and M2 included in the drive signal output circuit 52b-2 may be configured such that they do not overlap with the transistors M1 and M2 included in the drive signal output circuit 52a-3 when viewed along the x2 axis. Furthermore, the inductor L1 included in the drive signal output circuit 52b-2 may be configured such that it does not overlap with the inductor L1 included in the drive signal output circuit 52a-3 when viewed along the x2 axis.

[0360] Here, the so-called drive signal output circuit 52b-2 and drive signal output circuit 52a-3 are configured such that at least a portion overlaps when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis. This means that when the drive circuit substrate 700 in its assembled state is viewed along the x2 axis, at least one of the electronic components included in the drive signal output circuit 52b-2 overlaps with at least one of the electronic components included in the drive signal output circuit 52a-3. For example, this includes the following cases: at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52b-2 overlaps with at least one of the integrated circuit 500, transistors M1, M2, and inductor L1 included in the drive signal output circuit 52a-3.

[0361] In addition, such as Figure 23 As shown, in the assembled state of the drive circuit board 700, connector CN3a provided on the rigid wiring member 710 and connector CN3b provided on the rigid wiring member 770 engage, thereby fixing the rigid wiring member 710 to the rigid wiring member 770. Thus, the assembled state of the generally box-shaped drive circuit board 700 is maintained by connectors CN3a and CN3b. That is, the drive circuit board 700 has connector CN3a provided on the rigid wiring member 710 and connector CN3b provided on the rigid wiring member 770; connectors CN3a and CN3b engage, and the rigid wiring member 710 is fixed to the rigid wiring member 770, thereby maintaining the assembled state of the drive circuit board 700. In other words, connector CN3, including connectors CN3a and CN3b, functions as a holding member for maintaining the assembled state of the drive circuit board 700.

[0362] Therefore, for the drive circuit board 700, there is no need to set up a frame to maintain the assembly state of the general box shape. Thus, the mounting area of ​​the drive circuit board 700 in the liquid ejection device 1 can be further reduced, and the drive circuit board 700 can be further densely arranged and the liquid ejection device 1 can be further miniaturized.

[0363] Furthermore, connectors CN3a and CN3b are fitted together to form a BtoB connector, namely connector CN3, that electrically connects rigid wiring component 710 and rigid wiring component 770. That is, rigid wiring component 710 and rigid wiring component 770 are electrically connected via connectors CN3a and CN3b. Therefore, signals generated in the circuit of rigid wiring component 710 can be supplied to rigid wiring component 770 via connectors CN3a and CN3b without passing through rigid wiring components 730 and 750. This shortens the transmission path of signals generated in the circuit of rigid wiring component 710 to rigid wiring component 770, reduces the risk of noise overlap in the signal, and consequently improves the accuracy of the signal.

[0364] At this time, the signals transmitted via connectors CN3a and CN3b are preferably part of the signals generated in the rigid wiring component 710, namely the clock signal SCK output by the ejection control circuit 51 composed of FPGA and the differential printing data signal Dpt. In other words, the clock signal SCK and the differential printing data signal Dpt are preferably transmitted to the printhead 30 via connectors CN3a and CN3b.

[0365] The clock signal SCK and differential printing data signal Dpt output by the FPGA-based ejection control circuit 51 are susceptible to low-voltage signals, i.e., noise. Furthermore, since these are signals controlling the operation of the printhead 30, overlapping noise can directly affect the ink ejection accuracy from the printhead 30. Transmitting these signals via connectors CN3a and CN3b improves the accuracy of the clock signal SCK and differential printing data signal Dpt input to the printhead 30, thereby improving ink ejection accuracy.

[0366] 2.2.3.3 Structure of the relay substrate

[0367] Next, the structure of the relay substrate 150 of the drive circuit module 50 will be described. Figure 25 This is a top view showing an example of the structure of the relay substrate 150. Figure 26 This is a side view showing an example of the structure of the relay substrate 150. (See attached image.) Figure 25 as well as Figure 26 As shown, the relay substrate 150 includes a surface 151, a surface 152 opposite to surface 151, and edges 153, 154, 155, and 156. Furthermore, in the relay substrate 150, edges 153 and 154 are located opposite each other, edges 155 and 156 are located opposite each other, edge 153 is located at a position intersecting both edges 155 and 156, and edge 154 is located at a position intersecting both edges 155 and 156.

[0368] On surface 151 of the relay substrate 150, the other end of FFC cable 21 is electrically connected to the other end of FFC cable 22. FFC cable 21 transmits voltage signals VHV and VMV supplied to the drive circuit substrate 700, while FFC cable 22 transmits clock signal SCK, differential printed data signal Dp, and differential drive data signal Dd supplied to the drive circuit substrate 700. Specifically, FFC cable 21 includes multiple signal traces, including those for transmitting voltage signal VHV and voltage signal VMV; FFC cable 22 includes multiple signal traces, including those for transmitting clock signal SCK, differential printed data signal Dp, and differential drive data signal Dd. Here, FFC cables 21 and 22 can be electrically connected to the relay substrate 150 via an FFC connector (not shown) or via solder or the like.

[0369] A connector CN2a is provided on surface 152 of the relay substrate 150. The connector CN2a engages with a connector CN2b provided on the drive circuit substrate 700. Thus, the relay substrate 150 and the drive circuit substrate 700 are electrically connected. That is, the connector CN2a and the connector CN2b constitute a BtoB connector, namely connector CN2, that directly electrically connects the relay substrate 150 and the drive circuit substrate 700 without a cable.

[0370] The voltage signals VHV and VMV transmitted in FFC cable 21, and the clock signal SCK, differential printed data signal Dp, and differential drive data signal Dd transmitted in FFC cable 22 are input to the relay board 150 configured as described above. The relay board 150 transmits the input voltage signals VHV, VMV, SCK, Dp, and Dd to connector CN2a. Furthermore, the voltage signals VHV, VMV, SCK, Dp, and Dd transmitted to connector CN2a are input to the drive circuit board 700 via connector CN2b.

[0371] As described above, multiple signals are transmitted through FFC cables 21 and 22 and then input to the repeater board 150. The repeater board 150 transmits the input signals and outputs them to the drive circuit board 700 via a BtoB connector, i.e., connector CN2. That is, the repeater board 150 transmits signals input via multiple cables. Furthermore, the repeater board 150 outputs via a fewer number of connectors than the number of cables used for signal transmission, preferably via a single connector.

[0372] Therefore, even with an increased number of cables connected to the liquid ejection module 20, only the connector CN1a on the relay board 150 and the connector CN1b on the drive circuit board 700 need to be detached or reattached. This allows for easy detachment and reattachment of the drive circuit board 700, which is part of the liquid ejection module 20, and the printhead 30 electrically connected to the drive circuit board 700, from the liquid ejection device 1. Consequently, the operability of exchanging, repairing, and assembling the drive circuit board 700 and the printhead 30 electrically connected to it is improved. As a result, the convenience of the liquid ejection device 1 is enhanced.

[0373] Furthermore, the disassembly and assembly of the drive circuit board 700 and the printhead 30 in the liquid ejection module 20 become easy, thereby reducing the space required for such disassembly and assembly. As a result, a more compact arrangement of the liquid ejection module 20 in the liquid ejection device 1 can be achieved, resulting in further miniaturization of the liquid ejection device 1.

[0374] In the liquid ejection device 1 configured as described above, among the BtoB connectors CN2 that electrically connect the relay board 150 and the drive circuit board 700, it is preferable that the connector CN2a provided on the relay board 150 is a linear connector, and the connector CN2b provided on the drive circuit board 700 is a right-angle connector. Therefore, when detaching or detaching the connector CN2b from the drive circuit board 700 from the connector CN2a of the relay board 150, the relay board 150 can be moved along the normal direction of the surface 152, further reducing the space required for detachment and reattachment. As a result, a more compact arrangement of the liquid ejection modules 20 in the liquid ejection device 1 can be achieved, and the liquid ejection device 1 can be further miniaturized.

[0375] In such a relay substrate 150, the number of times that connector CN2a and connector CN2b can be disassembled and assembled is greater than that of the FFC cable 21 electrically connected to the relay substrate 150, and greater than that of the FFC cable 22 electrically connected to the relay substrate 150.

[0376] Here, the term "removable / removable count" refers to the number of times the electrical connection can be disassembled and reassembled to meet the expected reliability. This can be based on factors such as the wear condition of the terminal plating at the contact points that may result from disassembly and reassembly, or the exposure condition of the substrate on which the terminal plating is applied. Specifically, the removable / removable count of connectors CN2a and CN2b can also be based on the number of insertions and removals specified in the designs of connectors CN2a and CN2b. Furthermore, the removable / removable count of FFC cables 21 and 22 can be the number of insertions and removals of the FFC connector when they are electrically connected to the relay board 150 via an FFC connector, or the number of solderings based on the soldering conditions of the FFC cables 21 and 22 when they are directly electrically connected to the relay board 150 via solder.

[0377] In this embodiment, the relay board 150 outputs signals transmitted via FFC cables 21 and 22 from connector CN2a, allowing the liquid ejection module 20 to be assembled and disassembled simply by assembling and disassembling connector CN2a. By setting the number of times connector CN2a can be assembled and disassembled to be greater than the number of times FFC cables 21 and 22 can be assembled and disassembled, the risk of loss of reliability in the electrical connection between the relay board 150, the drive circuit board 700, and the printhead 30 is reduced, even with repeated assembly and disassembly of the relay board 150. As a result, the stability of the operation of the liquid ejection module 20 and the reliability of the liquid ejection device 1 are improved.

[0378] Furthermore, the relay substrate 150 has a through hole 158 that passes through surfaces 151 and 152. A portion of the cooling fan 59 is inserted through the through hole 158. Thus, the cooling fan 59 is fixed to the relay substrate 150 with at least a portion inserted through the through hole 158. That is, the relay substrate 150 and the cooling fan 59 are an integral structure. Therefore, when the relay substrate 150 is detached from the drive circuit board 700, the cooling fan 59 is also separated from the drive circuit board 700 along with the relay substrate 150; when the relay substrate 150 is mounted on the drive circuit board 700, the cooling fan 59 is also mounted on the drive circuit board 700 along with the relay substrate 150.

[0379] Therefore, even when a cooling fan 59 is used to cool the drive circuit board 700, the risk of the cooling fan 59 obstructing the relay board 150 from being mounted or dismounted from the drive circuit board 700 and the printhead 30 is reduced. It should be noted that, in this embodiment, the cooling fan 59 is described as being fixed to the relay board 150 by inserting it through a through hole 158 formed in the relay board 150. However, it is also possible to fix the cooling fan 59 to the relay board 150 by using a retaining member (not shown) or similar means.

[0380] Furthermore, when the cooling fan 59 is fixed on the relay board 150, it is preferable that the fan drive signal Fp driving the cooling fan 59 is supplied to the cooling fan 59 instead of the drive circuit board 700. Specifically, the fan drive signal Fp driving the cooling fan 59 is transmitted along with voltage signals VHV and VMV in the FFC cable 21 and supplied to the relay board 150. Then, the fan drive signal Fp is transmitted in the relay board 150 and supplied to the cooling fan 59. In other words, the FFC cable 21 includes signal wiring for transmitting the voltage signal VHV driving the drive circuit board 700, signal wiring for transmitting the voltage signal VMV driving the drive circuit board 700, and signal wiring for transmitting the fan drive signal Fp driving the cooling fan 59. The signal wiring for transmitting the fan drive signal Fp driving the cooling fan 59 is electrically connected to the relay board 150, and the fan drive signal Fp is transmitted in the relay board 150 and input to the cooling fan 59.

[0381] When the relay board 150 and the cooling fan 59 are integrated, the fan drive signal Fp that drives the cooling fan 59 is transmitted in the relay board 150 and supplied to the cooling fan 59. This eliminates the need for wiring for transmitting the fan drive signal Fp in the drive circuit board 700, thus reducing the risk of the drive circuit board 700 becoming larger. In other words, the risk of the drive circuit board 700 becoming larger is reduced, and the ease of installation and removal of the liquid ejection device 1 can be maintained.

[0382] Alternatively, although the illustration is omitted, it is also possible that, with the cooling fan 59 fixed to the relay board 150, the fan drive signal Fp that drives the cooling fan 59 is not transmitted in the relay board 150 but is supplied to the cooling fan 59. Specifically, the fan drive signal Fp that drives the cooling fan 59 is transmitted together with the voltage signals VHV and VMV in the FFC cable 21. At this time, the signal wiring that transmits the fan drive signal Fp is branched from the FFC cable 21, and the branched signal wiring is directly electrically connected to the cooling fan 59. Thus, the fan drive signal Fp is supplied to the cooling fan 59 without being transmitted in the relay board 150. In other words, the FFC cable 21 may include signal wiring for transmitting a voltage signal VHV that drives the drive circuit board 700, signal wiring for transmitting a voltage signal VMV that drives the drive circuit board 700, and signal wiring for transmitting a fan drive signal Fp that drives the cooling fan 59. The signal wiring for transmitting the fan drive signal Fp that drives the cooling fan 59 is electrically connected to the cooling fan 59, and the fan drive signal Fp is input to the cooling fan 59 without being transmitted in the relay board 150.

[0383] When the relay board 150 and the cooling fan 59 are integrated, even if the fan drive signal Fp that drives the cooling fan 59 is directly supplied to the cooling fan 59 without being transmitted in the relay board 150, it is not necessary to provide wiring for transmitting the fan drive signal Fp in the drive circuit board 700. As a result, the risk of the drive circuit board 700 becoming larger is reduced. That is, even if the cooling fan 59 is used when cooling the drive circuit board 700, the risk of the drive circuit board 700 becoming larger is reduced, and the detachability of the liquid ejection device 1 can be maintained.

[0384] As described above, whether the relay board 150 and the cooling fan 59 are integrated and the fan drive signal Fp that drives the cooling fan 59 is transmitted in the relay board 150 and supplied to the cooling fan 59, or the relay board 150 and the cooling fan 59 are integrated and the fan drive signal Fp that drives the cooling fan 59 is not transmitted in the relay board 150 and is directly supplied to the cooling fan 59, the following effects are achieved: the risk of the drive circuit board 700 becoming larger is reduced, and the detachability of the liquid ejection device 1 can be maintained.

[0385] Furthermore, when the relay board 150 and the cooling fan 59 are integrated, and the fan drive signal Fp that drives the cooling fan 59 is transmitted in the relay board 150 and supplied to the cooling fan 59, by providing a predetermined circuit in the relay board 150, the voltage value of the fan drive signal Fp and the removal of noise included in the fan drive signal Fp can be realized. This improves the driving accuracy of the cooling fan 59 and enhances the stability of the operation of the various circuits in the drive circuit board 700. As a result, the ink ejection accuracy from the printhead 30 is improved.

[0386] On the other hand, when the relay board 150 and the cooling fan 59 are integrated, and the fan drive signal Fp that drives the cooling fan 59 is directly supplied to the cooling fan 59 without being transmitted in the relay board 150, it is not necessary to provide wiring for transmitting the fan drive signal Fp in the relay board 150. Therefore, the relay board 150 can be miniaturized. As a result, a more dense configuration of the liquid ejection module 20 can be achieved, and the liquid ejection device 1 can be further miniaturized.

[0387] 2.2.3.4 Construction of the drive circuit module

[0388] The structure of the drive circuit module 50 having the drive circuit board 700 and the relay board 150 configured as described above will be explained. Figure 27This is a diagram showing the drive circuit module 50 viewed from the -x2 side along the x2 axis. Figure 28 This is a diagram showing the drive circuit module 50 viewed from the +x2 side along the x2 axis. Figure 29 This is a diagram showing the drive circuit module 50 viewed from the -y2 side along the y2 axis. Figure 30 This is a diagram showing the drive circuit module 50 viewed from the +z2 side along the z2 axis. Here, in... Figures 27-30 In the image, a portion of the printhead 30 connected to the drive circuit module 50 is shown in dashed lines, based on the drive circuit module 50.

[0389] like Figure 27 as well as Figure 29 As shown, the heat sink 180 is located on the outer surface side of the -x2 side of the drive circuit board 700, that is, on the side of the surface 724 of the rigid wiring member 710 of the drive circuit board 700. The heat sink 180 is mounted on the rigid wiring member 710. At this time, as... Figure 29 As shown, the heat conduction component 185 is located between the heat sink 180 and the surface 724 of the rigid wiring component 710. This improves the adhesion between the heat sink 180 and the surface 724, enabling efficient heat dissipation from the rigid wiring component 710, including the surface 724, and also improves the insulation performance between the heat sink 180 and the surface 724. Specifically, the heat sink 180 is located closer to the surface 724 than the surface 723 of the rigid wiring component 710, i.e., closer to the rigid component 722 than the rigid components 721, 741, and 742 along the x2 axis, and is mounted on the rigid wiring component 710. The heat conduction component 185 is located between the heat sink 180 and the surface 724 of the rigid wiring component 710, contacting both the heat sink 180 and the surface 724 of the rigid wiring component 710. Thus, the heat sink 180 and the heat conduction component 185 dissipate heat generated in the various circuits provided in the rigid wiring component 710 to the atmosphere.

[0390] Here, the heat sink 180 and the heat conduction component 185 are located at least partially overlapping with the drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2 disposed on the rigid wiring component 710 when the drive circuit module 50 is viewed along the x2 axis from the -x2 side towards the +x2 side. The drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2 are the circuits in the rigid wiring component 710 that generate a large amount of heat. The heat sink 180 and the heat conduction component 185 are located overlapping with such drive signal output circuits 52a-1, 52b-1, 52a-2, and 52b-2, thereby enabling efficient dissipation of heat generated in the rigid wiring component 710 to the atmosphere.

[0391] In addition, such as Figure 28 as well as Figure 29 As shown, the heat sink 170 is located on the outer surface of the drive circuit board 700 on the +x2 side, that is, on the surface 744 side of the rigid wiring member 730 of the drive circuit board 700. The heat sink 170 is mounted on the rigid wiring member 730. At this time, as... Figure 29 As shown, the heat conduction component 175 is located between the heat sink 170 and the surface 744 of the rigid wiring component 730. This improves the fit between the heat sink 170 and the surface 744, enabling efficient heat dissipation from the rigid wiring component 730 including the surface 744, and also improves the insulation performance between the heat sink 170 and the surface 744.

[0392] That is, the heat sink 170 is located closer to the surface 744 than the surface 743 of the rigid wiring component 730, specifically closer to the rigid component 742 than the rigid components 721, 722, and 741 along the x2 axis, and is mounted on the rigid wiring component 730. The heat conduction component 175 is located between the heat sink 170 and the surface 744 of the rigid wiring component 730, and is in contact with both the heat sink 170 and the surface 744 of the rigid wiring component 730. Thus, the heat sink 170 and the heat conduction component 175 dissipate the heat generated in the various circuits provided in the rigid wiring component 730 to the atmosphere.

[0393] Here, the heat sink 170 and the heat conduction component 175 are located at least partially overlapping with the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4 disposed on the rigid wiring component 730 when the drive circuit module 50 is viewed along the x2 axis from the +x2 side towards the -x2 side. The drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4 are circuits in the rigid wiring component 730 that generate a large amount of heat. The heat sink 170 and the heat conduction component 175 are located overlapping with such drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4, thereby enabling efficient dissipation of heat generated in the rigid wiring component 730 to the atmosphere.

[0394] Furthermore, the abnormality notification circuits 55a and 55b are located on the surface 744 of the rigid wiring component 730, where the heat sink 170 and the heat conduction component 175 are located. In other words, the abnormality notification circuits 55a and 55b are located on the surface 744 of the rigid wiring component 730, that is, on the rigid component 742.

[0395] Here, as mentioned above, the anomaly notification circuit 55a lights up, turns off, or flashes based on the anomaly detection result in the anomaly detection circuit 54a, which detects whether the voltage value of the voltage signal VHV is normal. Similarly, the anomaly notification circuit 55b lights up, turns off, or flashes based on the anomaly detection result in the anomaly detection circuit 54b, which detects whether the voltage value of the voltage signal VDD generated based on the voltage signal VMV is normal. That is, the anomaly notification circuit 55a detects the presence or absence of anomalies in the voltage value of the voltage signal VHV, which functions as the power supply voltage for the drive signal output circuits 52a-1 to 52a-4, 52b-1 to 52b-4, and the printhead 30; and the anomaly notification circuit 55b detects the presence or absence of anomalies in the power supply voltage supplied to the FPGA constituting the ejection control circuit 51. Therefore, the heat sink 170 and the heat conduction component 175 are mounted on the rigid wiring component 730 so that the user can visually confirm the lighting status of the anomaly notification circuits 55a and 55b. It should be noted that, in addition to detecting the abnormalities of the voltage signals VHV and VDD, the abnormality detection circuits 54a and 54b can also detect various abnormalities of the drive circuit module 50. Alternatively, in addition to detecting the abnormalities of the voltage signals VHV and VDD, the abnormality notification circuits 55a and 55b can also notify the drive circuit module 50 of various abnormalities.

[0396] Specifically, such as Figure 28 as well as Figure 29 As shown, the heat sink 170 has an opening 172. When the heat sink 170 is mounted on the rigid wiring member 730, the opening 172 is positioned to overlap with the fault notification circuits 55a and 55b provided on the surface 744 of the rigid wiring member 730. That is, when viewing the drive circuit board 700 along the direction from the rigid member 742 toward the rigid member 741, the fault notification circuits 55a and 55b are located at a position that overlaps with at least a portion of the opening 172. This reduces the risk of reduced heat dissipation efficiency of the rigid wiring member 730 based on the heat sink 170 and the heat conduction member 175, and allows for visual notification to the user of whether a fault has occurred in the drive circuit module 50. It should be noted that the opening 172 may not be positioned at the location where the fault notification circuits 55a and 55b are provided, for example, it may be a cutout.

[0397] Here, as mentioned above, it is acceptable if the heat sink 170 and the heat conduction component 175 are located at least partially overlapping with the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4. Therefore, when viewed along the direction from the rigid component 742 toward the rigid component 741, the abnormality notification circuits 55a and 55b are located in positions that do not overlap with the drive signal output circuits 52a-3, 52b-3, 52a-4, and 52b-4. This reduces the risk of reduced heat dissipation efficiency of the rigid wiring component 730 based on the heat sink 170 and the heat conduction component 175, and allows for visual notification to the user of any abnormalities occurring in the drive circuit module 50.

[0398] In addition, such as Figure 27 , Figure 28 ,as well as Figure 30As shown, the relay substrate 150 is located on the +z2 side of the drive circuit substrate 700 and is electrically connected to the drive circuit substrate 700 via connector CN2. At this time, the relay substrate 150 is disposed on the +z2 side of the drive circuit substrate 700 such that edge 153 is located along edge 711 of the rigid wiring member 710, edge 154 is located along edge 731 of the rigid wiring member 730, and the normal direction of surface 152 of the relay substrate 150 intersects with both the normal direction of surface 723 and the normal direction of surface 743 of the rigid wiring member 710. That is, the relay substrate 150 is configured to form a generally box-shaped structure of the drive circuit substrate 700. At this time, surface 151 of the relay substrate 150 forms the outer surface of this generally box-shaped structure, and surface 152 of the relay substrate 150 forms the inner surface of this generally box-shaped structure. At this time, the cooling fan 59 fixed to the relay substrate 150 blows air from the surface 151 side of the relay substrate 150 to the surface 152 side of the relay substrate 150, or blows air from the surface 152 side of the relay substrate 150 to the surface 151 side of the relay substrate 150. As a result, the cooling fan 59 generates an airflow towards the surface 783 of the rigid wiring member 770 inside the generally box-shaped drive circuit substrate 700, that is, in the space between the surface 723 included in the rigid wiring member 710 and the surface 743 included in the rigid wiring member 730 of the drive circuit substrate 700. In other words, the drive circuit board 700, which is generally box-shaped, has a gas flow path. This gas flow path is configured to include a surface 723 included by the rigid wiring member 710, a surface 743 included by the rigid wiring member 730, and a surface 783 included by the rigid wiring member 770. A cooling fan 59 disposed on the relay board 150 generates airflow in this gas flow path. Furthermore, the cooling fan 59 cools the drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 by means of this airflow. In other words, the cooling fan 59 generates airflow to cool the drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4. Therefore, even when the drive circuit board 700 is assembled in a generally box-shaped configuration, the gas circulation inside this generally box-shaped configuration can further improve the cooling efficiency of the drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 disposed inside this generally box-shaped configuration.

[0399] In this case, it is preferable to place the capacitor C7a, which is disposed on the rigid wiring member 710, and the capacitor C7b, which is disposed on the rigid wiring member 730, near the cooling fan 59. Compared to the integrated circuit 500 and transistors M1 and M2, which are surface-mount components, the capacitors C7a and C7b, configured as electrolytic capacitors, have a larger component height and a smaller contact area with the drive circuit board 700. Therefore, less heat generated in the capacitors C7a and C7b is discharged to the drive circuit board 700. By placing such capacitors C7a and C7b near the cooling fan 59, the capacitors C7a and C7b can be effectively cooled by the airflow generated by the cooling fan 59. This improves the cooling efficiency of the capacitors C7a and C7b and reduces the temperature rise of the drive circuit module 50.

[0400] In other words, the shortest distance between capacitor C7a and cooling fan 59 is smaller than the shortest distance between transistors M1 and M2 and cooling fan 59, and the shortest distance between capacitor C7b and cooling fan 59 is smaller than the shortest distance between transistors M1 and M2 and cooling fan 59. As a result, the cooling efficiency of capacitors C7a and C7b is improved, and consequently, the temperature rise of drive circuit module 50 is reduced.

[0401] In addition, such as Figure 27 , Figure 28 ,as well as Figure 29 As shown, the opening plate 160 is located on the -y2 side of the assembled drive circuit board 700. The opening plate 160 is a plate-shaped component extending in the x2z2 plane, and it has openings 161, 162, 163, and 164 through which it passes. Furthermore, as... Figure 29 As shown, the opening plate 160 forms one side of the generally box-shaped drive circuit board 700 in the assembled state. Furthermore, the opening plate 160 is positioned such that, when viewed along the normal direction of the opening plate 160 as a plate-shaped component, opening 161 overlaps with at least a portion of the inductor L1 of drive signal output circuit 52a-1 and at least a portion of the inductor L1 of drive signal output circuit 52a-2; opening 162 overlaps with at least a portion of the inductor L1 of drive signal output circuit 52b-4 and at least a portion of the inductor L1 of drive signal output circuit 52b-3; opening 163 overlaps with at least a portion of capacitor C7a; and opening 164 overlaps with at least a portion of capacitor C7b.

[0402] Airflow generated by cooling fan 59 inside the assembled drive circuit board 700 passes through openings 161, 162, 163, and 164. At this time, the airflow velocity generated inside the drive circuit board 700 is fastest near openings 161, 162, 163, and 164. The inductors L1 and capacitors C7a and C7b of each of the drive signal output circuits 52a-1, 52a-2, 52b-4, and 52b-3, which have relatively large component heights, are located near these openings 161, 162, 163, and 164, where the airflow velocity is high, thus enabling efficient cooling of the inductors L1 and capacitors C7a and C7b by the airflow generated by cooling fan 59.

[0403] The inductors L1 and capacitors C7a and C7b in the drive signal output circuit 52, which are relatively tall electronic components, have a smaller contact area with the drive circuit substrate 700 compared to surface-mount components such as integrated circuits 500 and transistors M1 and M2. Therefore, less heat is dissipated to the drive circuit substrate 700. Consequently, there is a possibility that the heat sinks 170 and 180 mounted on the drive circuit substrate 700 may not be sufficient to adequately cool the inductors L1 and capacitors C7a and C7b in the relatively tall drive signal output circuit 52.

[0404] By placing the relatively tall inductor L1 and capacitors C7a and C7b near the openings 161, 162, 163, and 164 where the airflow velocity is high, even the relatively tall inductor L1 and capacitors C7a and C7b can be cooled efficiently by the airflow generated by the cooling fan 59. As a result, the temperature rise of the drive circuit module 50 is reduced.

[0405] In this case, the opening plate 160 is preferably configured such that the inductor L1 of the drive signal output circuit 52a-1 does not cover the entire opening 161, the inductor L1 of the drive signal output circuit 52b-4 does not cover the entire opening 162, the capacitor C7a does not cover the entire opening 163, and the capacitor C7b does not cover the entire opening 164.

[0406] That is, preferably, the opening plate 160 is positioned such that, when viewed along the normal direction of the opening plate 160 as a plate-shaped member, at least a portion of the opening 161 does not overlap with the inductor L1 of the drive signal output circuit 52a-1, at least a portion of the opening 162 does not overlap with the inductor L1 of the drive signal output circuit 52b-4, at least a portion of the opening 163 does not overlap with the capacitor C7a, and at least a portion of the opening 164 does not overlap with the capacitor C7b.

[0407] As a result, the risk of airflow passing through openings 161, 162, 163, and 164 being blocked by inductor L1 of drive signal output circuit 52a-1, inductor L1 of drive signal output circuit 52b-4, capacitor C7a, and capacitor C7b is reduced, and the risk of localized temperature rise in drive circuit module 50 is reduced.

[0408] As described above, the drive circuit module 50 includes a drive circuit board 700, a relay board 150, an opening plate 160, and heat sinks 170 and 180 mounted on the drive circuit board 700. Furthermore, the drive circuit module 50 operates based on various signals input via the relay board 150 to generate various control signals for controlling the operation of the print head 30, and outputs these signals to the print head 30 via connector CN1.

[0409] The size of such a drive circuit module 50, viewed along the z2 axis, is smaller than the size of the printhead 30, viewed from the connector CN1b toward the ejector 600. Figure 30 As shown, with connector CN1a installed on printhead 30, drive circuit module 50 is disposed inside printhead 30. That is, in drive circuit board 700 included in drive circuit module 50, the size of rigid member 781 and rigid member 782 when viewed from the direction of rigid member 781 toward rigid member 782 is smaller than the size of printhead 30 when viewed from the direction of connector CN1b toward ejection portion 600. When drive circuit board 700 is electrically connected to printhead 30 via connectors CN1a and CN1b, drive circuit board 700 included in drive circuit module 50 is located inside printhead 30.

[0410] Therefore, when the liquid ejection module 20, which includes a drive circuit board 700 and a printhead 30 electrically connected to the drive circuit board 700, is installed in the liquid ejection device 1, the risk of limitations in the configuration of the liquid ejection module 20 due to the size of the drive circuit board 700, which is provided with multiple circuit components, is reduced. As a result, a more dense configuration of the liquid ejection module 20 in the liquid ejection device 1 can be achieved, reducing the risk of the liquid ejection device 1 becoming larger.

[0411] Furthermore, as described above, for the drive circuit board 700 of this embodiment, the size of the rigid wiring member 710 when viewed along the z1 axis is approximately equal to the size of the rigid wiring member 730 when viewed along the z1 axis. The size of the rigid wiring member 750 when viewed along the z1 axis is smaller than the sizes of the rigid wiring member 710 and the rigid wiring member 730 when viewed along the z1 axis. The size of the rigid wiring member 770 when viewed along the z1 axis is smaller than the sizes of the rigid wiring member 710 and the rigid wiring member 730 when viewed along the z1 axis. In other words, the size of the rigid member 781 when viewed along the direction from the rigid member 781 toward the rigid member 782 is smaller than the size of the rigid member 721 when viewed along the direction from the rigid member 721 toward the rigid member 722, and is also smaller than the size of the rigid member 741 when viewed along the direction from the rigid member 741 toward the rigid member 742.

[0412] This allows for an increase in the mounting area of ​​electronic components in the drive circuit board 700 of the liquid ejection module 20. Consequently, the number of ejection sections 600 in the printhead 30 increases, enabling a denser arrangement of the liquid ejection module 20 in the liquid ejection device 1 even with an increased number of components mounted on the drive circuit board 700, thus reducing the risk of increasing the size of the liquid ejection device 1.

[0413] Here, connector CN1b is an example of a first connector, connector CN1a is an example of a second connector, connector CN2b is an example of a third connector, and connector CN2a is an example of a fourth connector. Furthermore, the structure including the drive circuit board 700 and various circuits disposed on the drive circuit board 700 is an example of a board unit; the drive signal output circuit 52 disposed on the drive circuit board 700 is an example of a drive circuit; the drive signal COM output by the drive signal output circuit 52 and the drive signal VOUT based on the drive signal COM are examples of drive signals; and the base drive signal dO, which forms the basis of the drive signal COM, is an example of a base drive signal. In addition, surface 151 of relay substrate 150 is an example of the surface of relay substrate 150, surface 152 of relay substrate 150 is an example of the back side of relay substrate 150, edge 153 of relay substrate 150 is an example of the first edge, edge 154 of relay substrate 150 is an example of the second edge, FFC cable 21 electrically connected to surface 151 of relay substrate 150 is an example of the first cable, FFC cable 22 electrically connected to surface 151 of relay substrate 150 is an example of the second cable, one of the voltage signal VHV and voltage signal VMV transmitted in FFC cable 21 is an example of the first voltage signal, and one of the clock signal SCK, differential printed data signal Dp, and differential drive data signal Dd transmitted in FFC cable 22 is an example of the second voltage signal. Furthermore, the fan drive signal Fp is an example of the cooling fan drive voltage. Among the multiple signal wirings included in the FFC cable 21, the signal wiring for transmitting the voltage signal VHV or the signal wiring for transmitting the voltage signal VMV is an example of the first wiring, and the signal wiring for transmitting the fan drive signal Fp is an example of the second wiring. In addition, the rigid wiring component 710 is an example of the first substrate, the surface 723 of the rigid wiring component 710 is an example of the surface of the first substrate, the surface 724 of the rigid wiring component 710 is an example of the back side of the first substrate, the edge 711 of the rigid wiring component 710 is an example of the third edge, the rigid wiring component 730 is an example of the second substrate, the surface 743 of the rigid wiring component 730 is an example of the surface of the second substrate, the surface 744 of the rigid wiring component 730 is an example of the back side of the second substrate, and the edge 731 of the rigid wiring component 730 is an example of the fourth edge.

[0414] 3. Effects

[0415] As described above, the liquid ejection device 1 of this embodiment includes a printhead 30 for ejecting ink and a drive circuit board 700 electrically connected to the printhead 30. The drive circuit board 700 includes: a rigid wiring component 710 including rigid components 721 and 722 with multiple circuit members; a rigid wiring component 730 including rigid components 741 and 742; a rigid wiring component 750 including rigid components 761 and 762; a rigid wiring component 770 including rigid components 781 and 782; and a flexible wiring component 790 that is more flexible than the rigid wiring components 710, 730, 750, and 770. Furthermore, the rigid components 721, 722, 741, 742, 761, 762, 781, and 782 are stacked on the flexible wiring component 790, thereby electrically connecting the rigid wiring components 710, 730, 750, and 770 to each other through the flexible wiring component 790.

[0416] At this time, the rigid wiring component 710 and the rigid wiring component 730, namely the rigid component 721 included in the rigid wiring component 710 and the rigid component 741 included in the rigid wiring component 730, are configured such that surfaces 723 and 743 face each other due to the bending of the flexible wiring component 790 in regions 702 and 704. Therefore, in the liquid ejection module 20, the area occupied by the drive circuit board 700 electrically connected to the print head 30 can be reduced, enabling a denser arrangement of the liquid ejection modules 20 and miniaturization of the liquid ejection device 1 having multiple liquid ejection modules 20.

[0417] Furthermore, the rigid wiring member 770 of the drive circuit board 700 is located such that the normal direction of the surface 783 of the rigid member 781 included in the rigid wiring member 770 intersects with the normal direction of the surface 723 of the rigid member 721 included in the rigid wiring member 710 and the normal direction of the surface 743 of the rigid member 741 included in the rigid wiring member 730. That is, the rigid wiring member 770 is located in a position that covers at least a portion of the area between the opposing rigid wiring members 710 and 730. As a result, the risk of ink mist intruding into the area between the rigid wiring members 710 and 730 is reduced. Consequently, the risk of ink mist adhering to the various circuits provided on the drive circuit board 700 is reduced, the stability of the operation of the various circuits provided on the drive circuit board 700 is improved, and the stability of the operation of the print head 30, which operates based on the output signals of the various circuits provided on the drive circuit board 700, is also improved. As a result, the ink ejection accuracy from the print head 30 is improved.

[0418] Furthermore, the rigid wiring component 770 is provided with a connector CN1a that is electrically connected to the printhead 30. Connector CN1a connects the drive circuit board 700 to the printhead 30 by engaging with connector CN1b provided on the printhead 30. That is, the drive circuit board 700 and the printhead 30 are electrically connected via connector CN1, which functions as a B2B connector. This reduces the impedance of the transmission path for signals output from the drive circuit board 700 and input to the printhead 30. As a result, the accuracy of the signals input to the printhead 30 is improved, and the ink ejection accuracy from the printhead 30 is also improved.

[0419] In the drive circuit board 700 configured as described above, the circuit composed of various circuit components provided on the rigid members 721, 722, 741, 742, 761, 762, 781, and 782, and the wiring wh2 that transmits the voltage signal VHV, which is the power supply voltage of the drive signal selection circuit 200 included in the printhead 30, are configured to be continuous in the flexible wiring member 790, spanning the regions 701 (where the rigid members 721 and 722 are stacked), 703 (where the rigid members 761 and 762 are stacked), 705 (where the rigid members 741 and 742 are stacked), 702 (located between regions 701 and 703), and 704 (located between regions 703 and 705). That is, the voltage signal VHV is transmitted in the wiring wh2 without passing through via wiring and is supplied to the rigid wiring members 710, 730, and 750. Therefore, the risk of signal overlap due to noise from different wiring layers is reduced in the voltage signals VHV supplied to rigid wiring components 710, 730, and 750. That is, the accuracy of the voltage signals VHV supplied to the various circuits in rigid wiring components 710, 730, and 750 is improved, and the stability of their operation is enhanced. As a result, the accuracy of the output signals from the various circuits in rigid wiring components 710, 730, and 750 is improved, and the operation of the printhead 30 based on these output signals is more stable, resulting in improved ink ejection accuracy from the printhead 30.

[0420] Furthermore, in the liquid ejection device 1 of this embodiment, the wiring wh2 for transmitting the voltage signal VHV is configured to be continuous and linear, spanning regions 701, 703, and 705 in the direction from region 701 of the flexible wiring member 790 toward region 705. The voltage signal VHV functions as the power supply voltage for the circuit composed of various circuit components provided in the rigid members 721, 722, 741, 742, 761, 762, 781, and 782, and the drive signal selection circuit 200 of the printhead 30. Therefore, a greater current flows through the wiring wh2 for transmitting the voltage signal VHV. By making the wiring wh2 linear, the risk of deviation based on the current density of the voltage signal VHV transmitted in the wiring wh2 is reduced, and the risk of voltage value fluctuation of the voltage signal VHV is reduced. As a result, the accuracy of the voltage signal VHV supplied to the various circuits provided in the rigid wiring components 710, 730, and 750 is improved, and the stability of the operation of the various circuits provided in the rigid wiring components 710, 730, and 750 is improved. Consequently, the accuracy of the output signal output by the various circuits provided in the rigid wiring components 710, 730, and 750 is further improved, and the operation of the print head 30, which operates based on the output signal, is more stable, and the ink ejection accuracy from the print head 30 is further improved. Here, the so-called straight line includes the case where, in the unfolded state of the drive circuit board 700, the wiring wh2 is set along a virtual straight line from region 701 toward region 705.

[0421] Furthermore, drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 are provided in the rigid component 721 of the rigid wiring component 710 and the rigid component 741 of the rigid wiring component 730. The drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 amplify the voltage signal VHV in Class D to generate drive signals COMA1 to COMA4 and COMB1 to COMB4. The accuracy of the voltage signal VHV input to the rigid components 721 and 741 equipped with such drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 is improved, thereby also improving the accuracy of the drive signals COMA1 to COMA4 and COMB1 to COMB4 output by the drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4. As a result, the ink ejection accuracy from printhead 30 is further improved.

[0422] Furthermore, the rigid wiring component 770 of the connector CN1a, which is electrically connected to the connector CN1b of the printhead 30, is configured such that its size when viewed from the direction from the rigid component 781 toward the rigid component 782 is smaller than the size of the printhead 30 when viewed from the direction from the connector CN1b toward the ejection section 600. This enables a dense arrangement of the liquid ejection module 20, including the drive circuit board 700 and the printhead 30, and as a result, further miniaturization can be achieved in the liquid ejection device 1 equipped with multiple liquid ejection modules 20.

[0423] At this time, the drive circuit board 700 has connectors CN3a and CN3b, with connector CN3a disposed on the rigid wiring member 710 and connector CN3b disposed on the rigid wiring member 770. Furthermore, in the assembled state of the drive circuit board 700, connectors CN3a and CN3b are engaged to maintain a general housing shape. Therefore, a shape-holding member for maintaining the shape of the assembled drive circuit board 700 is not required, enabling further miniaturization of the drive circuit module 50 including the drive circuit board 700. As a result, a further denser arrangement of the liquid ejection module 20 including the drive circuit module 50 is possible, further miniaturization is achieved in the liquid ejection device 1 having multiple liquid ejection modules 20.

[0424] Furthermore, the connectors CN3a and CN3b of the drive circuit board 700 are fitted together to electrically connect the rigid wiring component 710 and the rigid wiring component 770. This allows signals generated in the rigid wiring component 710 to be transmitted to the rigid wiring component 770 without passing through the rigid wiring components 730 and 750. As a result, the wiring pattern on the drive circuit board 700 can be reduced, enabling further miniaturization of the drive circuit board 700. Consequently, a more dense arrangement of the liquid ejection module 20, including the drive circuit module 50, is possible, further enabling miniaturization of the liquid ejection device 1 equipped with multiple liquid ejection modules 20.

[0425] At this time, the clock signal SCK and the differential printing data signal Dpt output by the ejection control circuit 51 of the FPGA located on the drive circuit board 700 are input to the print head 30 via connectors CN1a and CN1b and rigid wiring component 770. Since the clock signal SCK and the differential printing data signal Dpt are signals with relatively small voltage values, transmitting these signals via connectors CN3a and CN3b to the rigid wiring component 770 instead of via the rigid wiring components 730 and 750 improves the signal accuracy of the clock signal SCK and the differential printing data signal Dpt input to the print head 30. As a result, the ink ejection accuracy from the print head 30 is further improved.

[0426] Furthermore, in the drive circuit module 50, the rigid wiring components 710 and 730 included in the drive circuit board 700 are positioned such that surfaces 723 and 743 are opposite each other. The heat sink 180 is located at surface 724 of the rigid wiring component 710, and the heat sink 170 is located at surface 744 of the rigid wiring component 730. Within the area formed between the rigid wiring components 710 and 730, which are positioned opposite each other, the cooling fan 59 generates airflow. As a result, due to the combined cooling effect of the airflow generated by the cooling fan 59 and the heat dissipation effect of the heat sinks 170 and 180, the drive circuit board 700 is cooled from both sides, improving its heat dissipation efficiency (i.e., cooling efficiency) and further enhancing the stability of the operation of the various circuits provided on the drive circuit board 700. Consequently, the signal accuracy of the output signal from the drive circuit board 700 is improved, and the ink ejection accuracy from the printhead 30, which ejects ink based on the output signal of the various circuits provided on the drive circuit board 700, is also improved.

[0427] At this time, the heat-conducting component 185 with insulating properties is located between the heat sink 180 and the surface 724 of the rigid wiring component 710, and the heat-conducting component 175 with insulating properties is located between the heat sink 170 and the surface 744 of the rigid wiring component 730. The heat-conducting component 185 is in contact with both the surface 724 and the heat sink 180, and the heat-conducting component 175 is in contact with both the surface 744 and the heat sink 170. As a result, the adhesion and insulation performance between the heat sink 170 and the rigid wiring component 730 are improved, and the adhesion and insulation performance between the heat sink 180 and the rigid wiring component 710 are also improved. As a result, the heat dissipation performance of the heat sinks 170 and 180 is further improved, the heat dissipation efficiency (i.e., cooling efficiency) of the drive circuit board 700 is further improved, and the insulation performance between the heat sinks 170 and 180 and the drive circuit board 700 is improved, further improving the stability of the operation of various circuits provided on the drive circuit board 700.

[0428] Furthermore, in the drive circuit board 700 of this embodiment, the rigid wiring member 770 is located at a position where the normal direction of the surface 783 of the rigid member 781 included in the rigid wiring member 770 intersects with the normal direction of the surface 723 of the rigid member 721 included in the rigid wiring member 710 and the normal direction of the surface 743 of the rigid member 741 included in the rigid wiring member 730, thus forming part of the gas flow path of the gas generated by the cooling fan 59. At this time, the cooling fan 59 generates an airflow that blows toward the rigid wiring member 770. As a result, the cooling fan 59 can cool the electronic components constituting the circuit provided on the rigid wiring member 770. As a result, the stability of the operation of various circuits provided on the drive circuit board 700 is further improved.

[0429] Furthermore, in the drive circuit module 50 configured as described above, drive signal output circuits 52a-1, 52a-2, 52b-1, and 52b-2 for outputting drive signals COMA1, COMA2, COMB1, and COMB2 are provided on surface 723 of the rigid wiring member 710, and drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4 for outputting drive signals COMA3, COMA4, COMB3, and COMB4 are provided on surface 743 of the rigid wiring member 730. The drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 supply drive signals COMA1 to COMA4 and COMB1 to COMB4 based on voltage signals VHV to each of the plurality of ejection sections 600, thus generating a large amount of heat. Even when the drive circuit board 700 is equipped with drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 that generate a large amount of heat, the drive circuit board 700 of this embodiment further improves the stability of the operation of drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4 by cooling both the heat dissipation effect based on the airflow generated by the cooling fan 59 and the heat dissipation effect based on the heat sinks 170 and 180.

[0430] Furthermore, the drive circuit board 700 is provided with capacitors C7a and C7b, which are electrolytic capacitors. The capacitors C7a and C7b are positioned on the drive circuit board 700 such that the shortest distance between the capacitors C7a and C7b and the cooling fan 59 is shorter than the shortest distance between the transistors M1 and M2 included in the drive signal output circuit 52 and the cooling fan 59. The component height of the electrolytic capacitors C7a and C7b is larger than that of the surface-mount transistors M1 and M2; therefore, the cooling effect via the drive circuit board 700, i.e., the dissipation of heat from the heat sinks 170 and 180, is smaller. The capacitors C7a and C7b can be cooled by placing them close to the cooling fan 59. As a result, the stability of the operation of the various circuits provided on the drive circuit board 700 is further improved.

[0431] Furthermore, the drive circuit module 50 has a plate-shaped opening plate 160, which has openings 161 and 162 through which airflow generated by the cooling fan 59 passes. The opening plate 160 is positioned such that, when viewed along the normal direction of the opening plate 160, at least a portion of opening 161 overlaps with at least a portion of the inductor L1 of the drive signal output circuit 52a-1, and opening 162 also overlaps with at least a portion of the inductor L1 of the drive signal output circuit 52a-1. When the airflow generated in the cooling fan 59 passes through openings 161 and 162, the airflow velocity increases. By placing the inductor L1, which has a relatively large component height, within such an area where the airflow velocity generated in the cooling fan 59 is increased, the cooling efficiency of the inductor L1 can be improved, and the stability of the operation of various circuits provided on the drive circuit board 700 can be improved. As a result, the signal accuracy of the output signal from the drive circuit board 700 is improved, and the ink ejection accuracy of the printhead 30 that ejects ink based on the output signals of various circuits provided on the drive circuit board 700 is also improved.

[0432] Furthermore, since the airflow velocity generated in the cooling fan 59 can be increased as it passes through the openings 161 and 162, even a small cooling fan 59 can achieve sufficient cooling capacity. As a result, the risk of reduced ink ejection accuracy from the printhead 30 due to vibrations that may be generated by driving the cooling fan 59 is reduced.

[0433] Furthermore, the drive circuit module 50 is electrically connected to FFC cables 21 and 22 on surface 151. FFC cable 21 transmits voltage signals VHV and VMV, while FFC cable 22 transmits clock signal SCK, differential printed data signal Dp, and differential drive data signal Dd. A relay board 150 is located on surface 152 opposite to surface 151, and the relay board 150 is equipped with a connector CN2a that is electrically connected to the drive circuit board 700. That is, after the signal is transmitted through FFC cables 21 and 22, it is input to the relay board 150 and output to the drive circuit board 700 via connector CN2a. Therefore, the drive circuit board 700 can be disassembled and assembled relative to the liquid ejection device 1 simply by removing and installing connectors CN2a and CN2b, improving the efficiency of maintenance, replacement, and assembly operations of the drive circuit board 700.

[0434] Furthermore, the drive circuit board 700 can be assembled and disassembled relative to the liquid ejection device 1 simply by assembling and disassembling connectors CN2a and CN2b, thus reducing the space required for such assembly and disassembly. As a result, a more compact arrangement of the liquid ejection module 20 can be achieved, which in turn enables further miniaturization of the liquid ejection device 1.

[0435] Furthermore, a cooling fan 59 is fixed in the relay board 150. Therefore, the cooling fan 59 can be installed and removed along with the liquid ejection device 1 when the drive circuit board 700 is installed or removed. As a result, it is not necessary to provide wiring for transmitting the fan drive signal Fp to drive the cooling fan 59 in the drive circuit board 700, thus enabling miniaturization of the drive circuit board 700.

[0436] Furthermore, the drive circuit module 50 includes a temperature detection circuit 56, which detects the ambient temperature of the drive circuit module 50, i.e., the internal space temperature of the drive circuit module 50. The control unit 2 and the head control circuit 12 control the operation of the drive circuit module 50 and the print head 30 based on the ambient temperature detected by the temperature detection circuit 56. That is, the liquid ejection device 1 of this embodiment does not detect the temperature of the various circuits in the drive circuit module 50 individually; instead, the temperature detection circuit 56 detects the internal space temperature of the drive circuit module 50, which changes according to the operating state of the drive circuit module 50, as the ambient temperature. Then, the control unit 2 and the head control circuit 12 control the operation of the drive circuit module 50 and the print head 30 based on the ambient temperature detected by the temperature detection circuit 56. Therefore, it is not necessary to separately install temperature detectors such as sensor elements on the electronic components of the drive circuit module 50, thus enabling miniaturization of the drive circuit module 50. As a result, further denser configuration of the liquid ejection module 20 is possible, and further miniaturization of the liquid ejection device 1 is achieved.

[0437] In the drive circuit board 700, such a temperature detection circuit 56 is disposed in a rigid wiring member 750 located between the rigid wiring member 710, which is provided with drive signal output circuits 52a-1, 52a-2, 52b-1, 52b-2, and the rigid wiring member 730, which is provided with drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4. Therefore, the risk of an extremely high contribution of temperature changes generated in the drive signal output circuits 52a-1 to 52a-4, 52b-1 to 52b-4, which generate significant heat, to the ambient temperature detected by the temperature detection circuit 56 is reduced. That is, the detection accuracy of the ambient temperature detected by the temperature detection circuit 56 is improved. Consequently, the accuracy of the control unit 2 and the head control circuit 12 in controlling the operation of the drive circuit module 50 and the print head 30 based on the ambient temperature detected by the temperature detection circuit 56 is improved, and the ink ejection accuracy from the print head 30 is improved.

[0438] Furthermore, in the drive circuit board 700, the drive signal output circuits 52a-1 and 52b-1, which are disposed on the rigid wiring member 710, each have an integrated circuit 500, transistors M1 and M2, and an inductor L1, respectively. Along the direction from edge 713 to edge 714, the drive signal output circuits 52a-1 and 52b-1 are located at least partially overlapping. At this time, along the direction from edge 713 to edge 714, the integrated circuits 500 of the drive signal output circuits 52a-1 and 52b-1 are configured not to overlap. Therefore, the risk of localized high-temperature areas forming in the drive circuit board 700 due to the concentration of heat generated in the drive signal output circuits 52a-1 and 52b-1 is reduced.

[0439] Furthermore, in the drive circuit board 700 of this embodiment, the drive signal output circuit 52b-4 disposed on the rigid wiring member 730 includes an integrated circuit 500, transistors M1 and M2, and an inductor L1. Along the x2 axis, the drive signal output circuit 52a-1 and the drive signal output circuit 52b-4 are located at least partially overlapping, and along the x2 axis, the integrated circuit 500 of the drive signal output circuit 52a-1 and the integrated circuit 500 of the drive signal output circuit 52b-4 are configured not to overlap. Therefore, even in the assembled drive circuit board 700, the risk of localized high-temperature areas being generated in the drive circuit board 700 due to the concentration of heat generated in the drive signal output circuit 52a-1 and the drive signal output circuit 52b-4 is reduced.

[0440] That is, in the liquid ejection device 1 of this embodiment, the drive signal output circuits 52a-1 to 52a-4 and 52b-1 to 52b-4, which generate a large amount of heat, are arranged in an interleaved manner. As a result, the risk of localized heat concentration in the drive circuit board 700 is reduced, and consequently, the waveform accuracy of the drive signals COMA1 to COMA4 and COMB1 to COMB4 output by the drive circuit board 700 to the print head 30 is improved, and the ejection accuracy of the ink ejected from the print head 30 is improved.

[0441] In this configuration, along the direction from edge 713 to edge 714, transistors M1 and M2 of drive signal output circuit 52a-1 and drive signal output circuit 52b-1 are configured to not overlap. Similarly, along the x2 axis, transistors M1 and M2 of drive signal output circuit 52a-1 and drive signal output circuit 52b-4 are configured to not overlap, thereby further reducing heat concentration in the drive circuit substrate 700. Furthermore, along the direction from edge 713 to edge 714, inductor L1 of drive signal output circuit 52a-1 and drive signal output circuit 52b-1 are configured to not overlap. Similarly, along the x2 axis, inductor L1 of drive signal output circuit 52a-1 and drive signal output circuit 52b-4 are configured to not overlap, thereby further reducing heat concentration in the drive circuit substrate 700.

[0442] Furthermore, an electrolytic capacitor, namely capacitor C53, for stabilizing the voltage value of the reference voltage signal VBS is provided in surface 783 of the rigid wiring member 770 of the drive circuit board 700, and a connector CN1a electrically connected to the print head 30 is provided in surface 784 of the rigid wiring member 770 of the drive circuit board 700. That is, the voltage value of the reference voltage signal VBS is stabilized in the rigid wiring member 770 where the connector CN1a electrically connected to the print head 30 is provided. As a result, the stability of the voltage value of the reference voltage signal VBS supplied to the print head 30 is improved, the displacement accuracy of the piezoelectric element 60 of the print head 30 is improved, and the ejection accuracy of the ink ejected based on the displacement of the piezoelectric element 60 is improved.

[0443] Furthermore, the reference voltage signal VBS supplied to the electrode 612 of the piezoelectric element 60 is commonly supplied to: piezoelectric elements 60 supplied with drive signals VOUT based on drive signals COMA1 and COMB1, piezoelectric elements 60 supplied with drive signals VOUT based on drive signals COMA2 and COMB2, piezoelectric elements 60 supplied with drive signals VOUT based on drive signals COMA3 and COMB3, and piezoelectric elements 60 supplied with drive signals VOUT based on drive signals COMA4 and COMB4. This reference voltage signal VBS is supplied from a single reference voltage signal output circuit 530. Therefore, even if the piezoelectric element 60 is supplied with drive signals VOUT based on different drive signals COM, it can be driven based on a common reference potential, improving the displacement accuracy of the piezoelectric element 60 in the printhead 30, and improving the ejection accuracy of the ink ejected based on the displacement of the piezoelectric element 60.

[0444] Furthermore, the drive circuit module 50 includes fault notification circuits 55a and 55b, which are disposed on the surface 744 of the rigid wiring member 730 of the drive circuit board 700, specifically on the surface 744 of the rigid member 742 included in the rigid wiring member 730. In other words, the fault notification circuit 55 is disposed on the outer surface of the drive circuit board 700 in its assembled state, which is generally configured as a housing. This allows the user to visually confirm any faults in the liquid ejection module 20, thus improving the reliability of both the liquid ejection module 20 and the liquid ejection device 1.

[0445] At this time, as described above, the heat sink 170 is located on the surface 744 of the rigid wiring member 730 of the drive circuit board 700, that is, on the surface 744 of the rigid member 742 included in the rigid wiring member 730. In this surface 744 of the rigid wiring member 730 of the drive circuit board 700, that is, on the surface 744 of the rigid member 742 included in the rigid wiring member 730, along the direction from the rigid member 742 towards the rigid member 741, the abnormality notification circuits 55a and 55b are located in a position that does not overlap with the drive signal output circuit 52, and the heat sink 170 is located in a position that does not overlap with the drive signal output circuit 52. Thus, without sacrificing the visual confirmability of the abnormality notification circuits 55a and 55b, heat generated in the drive signal output circuit 52 can be dissipated. Therefore, the accuracy of the signal output by the drive circuit board 700 is improved, and the reliability of the liquid ejection module 20 and the liquid ejection device 1 is enhanced.

[0446] Furthermore, the heat sink 170 has an opening 172. Along the direction from the rigid member 742 toward the rigid member 741, the abnormality notification circuits 55a and 55b are located at a position overlapping with the opening 172. This allows for efficient heat dissipation from the drive signal output circuit 52 without compromising the visual confirmability of the abnormality notification circuits 55a and 55b. As a result, the accuracy of the signal output by the drive circuit board 700 is improved, and the reliability of the liquid ejection module 20 and the liquid ejection device 1 is enhanced.

[0447] 4. Variations

[0448] Next, the liquid ejection device 1 of the modified example will be described. Figure 31This is a diagram showing a simplified structure of a modified liquid ejection device 1. In the liquid ejection device 1 described above, the liquid ejection module 20 has a drive circuit module 50 with a cooling fan 59. The cooling fan 59 generates airflow in a gas flow path formed by the rigid wiring components 710, 730, 750, and 770 of the drive circuit board 700, thereby cooling the drive circuit board 700. However, in the modified liquid ejection device 1, instead of the cooling fan 59 or based on the cooling fan 59, a compressor CP is provided. The airflow generated by the compressor CP is supplied to the gas flow path formed by the rigid wiring components 710, 730, 750, and 770 of the drive circuit board 700, thereby cooling the drive circuit board 700.

[0449] That is, the modified liquid ejection device 1 includes a printhead 30 that ejects ink, which is an example of liquid, a drive circuit module 50 electrically connected to the printhead 30, a compressor CP that delivers compressed air AR, and a pipe TB that connects the drive circuit module 50 and the compressor CP. The compressor CP supplies compressed air AR to the area opposite to the surface 723 of the rigid wiring member 710 (i.e., the surface 723 of the rigid member 721) and the surface 743 of the rigid wiring member 730 (i.e., the surface 743 of the rigid member 741) of the drive circuit board 700 via the pipe TB.

[0450] like Figure 31 As shown, the compressor CP and the head unit 3 are respectively provided. The compressor CP is located outside the printing area where the head unit 3 ejects ink from the medium P to form an image, preferably in a space separated from the printing area. The compressor CP, by driving, draws in and compresses the air in this space, outputting it as compressed air AR. The compressed air AR output by the compressor CP is then supplied to the liquid ejection module 20 via pipe TB.

[0451] Figure 32 This is an exploded perspective view showing an example of the structure of the modified liquid ejection module 20. (See attached image.) Figure 32 As shown, the tube TB is connected to a through hole 159, which penetrates surfaces 151 and 152 of the relay substrate 150. Compressed air AR is thus supplied to the liquid ejection module 20. Furthermore, the compressed air AR is supplied via the through hole 159 of the relay substrate 150 to the region where surfaces 723 (i.e., the surface 723 of the rigid wiring member 710) and 743 (i.e., the surface 743 of the rigid wiring member 730) of the drive circuit substrate 700 of the drive circuit module 50 face each other. The liquid ejection device 1 of the modified example configured as described above can also achieve the same effects as the embodiment described above.

[0452] Furthermore, in the modified liquid ejection device 1, as described above, the compressor CP is located in a space separated from the printing area. Therefore, the compressed air AR output by the compressor CP will not mix with ink mist ejected from the printhead 30 onto the media P, nor with dust such as paper dust or feathers that may be generated during the transport of the media P. Thus, the risk of ink mist and dust adhering to the various electronic components mounted on the drive circuit board 700, which are cooled by the compressed air AR, is reduced. Consequently, the stability of the operation of the drive circuit board 700 is further improved, and the ink ejection accuracy from the printhead 30, which operates based on the output signal from the drive circuit board 700, is further improved.

[0453] That is, in the modified liquid ejection device 1, in the case of a so-called inkjet printer for printing and dyeing where the risk of dust floating in the printing area is high due to the use of a cloth as a medium P, the stability of the operation of the drive circuit board 700 is further improved, and the ink ejection accuracy of the print head 30, which operates based on the output signal output from the drive circuit board 700, is further improved. From this point of view, a particularly large effect is achieved.

[0454] In addition, in the above embodiment, it was described that the temperature detection circuit 56, which detects the ambient temperature of the drive circuit module 50, generates a temperature information signal Tt including temperature information corresponding to the ambient temperature, and outputs it to the head control circuit 12, is provided in the rigid wiring component 750. However, it is also possible that the temperature detection circuit 56 is provided in the rigid wiring component 730 in a region away from the drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4.

[0455] Figure 33 This is a diagram showing an example of the component arrangement in the drive circuit board 700 in its unfolded state, as a modified example. Figure 33As shown, in the modified example of the drive circuit board 700, the temperature detection circuit 56 is disposed in a region away from the drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4. Specifically, the temperature detection circuit 56 is disposed along the edge 731 of the rigid wiring member 730, and the drive signal output circuits 52a-3, 52a-4, 52b-3, and 52b-4 are disposed in the rigid wiring member 730 along the edge 732 located opposite the edge 731. That is, in the rigid wiring component 730, each of the temperature detection circuit 56 and the drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4 is configured such that the shortest distance between the temperature detection circuit 56 and the edge 731 is smaller than the shortest distance between the temperature detection circuit 56 and the edge 732, and the shortest distance between the transistors M1, M2 of each of the drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4 and the edge 732 is smaller than the shortest distance between the transistors M1, M2 of each of the drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4 and the edge 731.

[0456] Even when the temperature detection circuit 56 is configured in this way, since the temperature detection circuit 56 is located separately from the drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4, the contribution of heat generated in the drive signal output circuits 52a-3, 52a-4, 52b-3, 52b-4 to the temperature detection circuit 56 is reduced, and the same effect as the above-described embodiment can be achieved.

[0457] The above description covers the implementation methods and variations, but this application is not limited to these implementation methods and can be implemented in various ways without departing from its spirit. For example, the above implementation methods can also be appropriately combined.

[0458] This application includes structures that are substantially identical to those described in the embodiments (e.g., structures with the same function, method, and result, or structures with the same purpose and effect). Additionally, this application includes structures that replace non-essential parts of the structures described in the embodiments. Furthermore, this application includes structures that achieve the same effects as those described in the embodiments or structures capable of achieving the same purpose. Additionally, this application includes structures to which known techniques have been added to the structures described in the embodiments.

[0459] Alternatively, the 30 printheads can be recorded as "heads", the 59 cooling fans as "fans", and the cooling fan drive voltage as "fan drive voltage", etc.

[0460] The following content is derived from the above implementation method.

[0461] One method of liquid ejection device includes:

[0462] The printhead has an ejection section that ejects liquid by displacement of a piezoelectric element, and a first connector;

[0463] The substrate unit has a second connector that engages with the first connector and a third connector that is different from the second connector, and the substrate unit is electrically connected to the printhead via the second connector;

[0464] The first cable transmits a first voltage signal supplied to the substrate unit;

[0465] The second cable transmits the second voltage signal supplied to the substrate unit;

[0466] The fourth connector, which engages with the third connector; and

[0467] A relay substrate includes a relay substrate surface and a relay substrate back surface opposite to the relay substrate surface. The first cable and the second cable are electrically connected to the relay substrate surface, and the fourth connector is disposed on the relay substrate back surface. The relay substrate transmits the first voltage signal and the second voltage signal to the fourth connector.

[0468] According to this liquid ejection device, the relay board relays signals input via the first and second cables and supplies them to the base unit via the fourth connector. That is, the relay board aggregates signals transmitted through multiple cables and outputs them to the base unit. This simplifies the assembly and disassembly of the base unit and improves the interchangeability of the base unit, and the printhead electrically connected to the base unit, the second connector, and the first connector. As a result, the area that must be ensured for the interchangeability of the base unit and printhead can be reduced. This allows for a denser arrangement of the base unit and printhead. Consequently, the liquid ejection device can be miniaturized.

[0469] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0470] The relay substrate includes a first side and a second side.

[0471] The substrate unit has:

[0472] The first substrate includes a first substrate surface, a first substrate back surface opposite to the first substrate surface, and a third side; and

[0473] The second substrate includes a second substrate surface, a second substrate back surface opposite to the second substrate surface, and a fourth side.

[0474] The first substrate is electrically connected to the second substrate.

[0475] The third connector is disposed on the surface of the first substrate, located along the third side.

[0476] The relay substrate is configured such that the first side is located along the third side of the first substrate, the second side is located along the fourth side of the second substrate, and the normal direction of the back surface of the relay substrate intersects both the normal direction of the surface of the first substrate and the normal direction of the surface of the second substrate.

[0477] According to the liquid ejection device, the relay substrate can be configured using the third side of the first substrate and the fourth side of the second substrate, thereby improving the stability of the relay substrate.

[0478] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0479] The first side and the second side are located opposite each other in the relay substrate.

[0480] The first substrate and the second substrate are located at a position such that the surface of the first substrate is opposite to the surface of the second substrate.

[0481] According to the liquid ejection device, the first substrate and the second substrate are located in opposite positions, so the stability of the relay substrate configured using the third side of the first substrate and the fourth side of the second substrate is further improved.

[0482] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0483] The liquid ejection device includes a cooling fan that generates airflow in a gas flow path, the gas flow path being configured to include the surface of the first substrate and the surface of the second substrate.

[0484] The cooling fan is fixed to the relay base plate.

[0485] According to this liquid ejection device, a cooling fan that generates airflow between the surface of the first substrate and the surface of the second substrate is fixed to the relay substrate. Therefore, when performing disassembly or assembly involving the replacement of substrate units and printheads, the cooling fan and the relay substrate are removed together. Thus, the cooling fan can cool the circuit components disposed on the surfaces of the first substrate and the second substrate without obstructing the interchangeability of the printheads via the substrate units and the substrate units electrically connected to the second connector and the first connector.

[0486] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0487] The first cable includes a first wiring and a second wiring. The first wiring transmits a first voltage signal that drives the substrate unit, and the second wiring transmits a cooling fan drive voltage that drives the cooling fan.

[0488] The second wiring is electrically connected to the relay substrate, and the cooling fan drive voltage is transmitted in the relay substrate and input to the cooling fan.

[0489] According to the liquid ejection device, in the relay board of the fixed cooling fan, it is possible to remove noise superimposed on the cooling fan drive voltage and correct the voltage value, thereby improving the driving accuracy of the cooling fan.

[0490] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0491] The first cable includes a first wiring and a second wiring. The first wiring transmits a first voltage signal that drives the substrate unit, and the second wiring transmits a cooling fan drive voltage that drives the cooling fan.

[0492] The second wiring is electrically connected to the cooling fan, and the cooling fan drive voltage is not transmitted in the relay board, but is input to the cooling fan.

[0493] According to this liquid ejection device, the cooling fan drive voltage that drives the cooling fan fixed to the relay board is supplied to the cooling fan without passing through the relay board. Therefore, it is not necessary to set up wiring for transmitting the cooling fan drive voltage in the relay board. As a result, the miniaturization of the relay board can be achieved.

[0494] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0495] The third connector is a right-angle connector.

[0496] The fourth connector is a linear connector.

[0497] According to this liquid ejection device, the relay substrate can be detached and mounted from the substrate unit along the normal direction of the relay substrate, further reducing the area that needs to be ensured for the exchange of the substrate unit and the print head. This allows for a more dense arrangement of the substrate unit and the print head. As a result, the liquid ejection device can be further miniaturized.

[0498] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0499] The substrate unit has:

[0500] FPGA, for input of the second voltage signal; and

[0501] The driving circuit outputs a driving signal that displaces the piezoelectric element.

[0502] The FPGA outputs a base drive signal to the drive circuit based on the second voltage signal, which will become the basis of the drive signal.

[0503] According to this liquid ejection device, the substrate unit has an FPGA, so the second voltage signal can be encoded by the FPGA. This reduces the number of signals input to the relay substrate and enables miniaturization of the third and fourth connectors.

[0504] In one embodiment of the aforementioned liquid ejection device, it is also possible that...

[0505] The number of times the third connector and the fourth connector can be disassembled and assembled is greater than the number of times the first cable can be disassembled and assembled with the relay substrate, and greater than the number of times the second cable can be disassembled and assembled with the relay substrate.

[0506] According to this liquid ejection device, the reliability of the electrical connection between the third connector and the fourth connector that connects the relay substrate and the substrate unit is improved, and the reliability of the liquid ejection device is improved.

Claims

1. A liquid ejection device, characterized in that, have: The head has a first connector and sprays liquid; The substrate unit has a second connector that engages with the first connector, and a third connector that is different from the second connector; as well as A relay substrate includes a relay substrate surface and a relay substrate back surface opposite to the relay substrate surface. A first cable for transmitting a first voltage signal is connected to the surface of the relay substrate. A fourth connector is provided on the back side of the relay substrate, which engages with the third connector of the substrate unit. The relay substrate includes a first side and a second side. The substrate unit has: The first substrate includes a first substrate surface, a first substrate back surface opposite to the first substrate surface, and a third side; as well as The second substrate includes a second substrate surface, a second substrate back surface opposite to the second substrate surface, and a fourth side. The first substrate is electrically connected to the second substrate. The first edge of the relay substrate is located along the third edge of the first substrate. The second side of the relay substrate is located along the fourth side of the second substrate. The normal direction on the back side of the relay substrate intersects both the normal direction on the surface of the first substrate and the normal direction on the surface of the second substrate.

2. The liquid ejection device according to claim 1, characterized in that, The first side and the second side are located opposite each other in the relay substrate. The first substrate and the second substrate are located at a position such that the surface of the first substrate is opposite to the surface of the second substrate.

3. The liquid ejection device according to claim 1, characterized in that, The liquid ejection device includes a fan that generates airflow in a gas flow path formed by the surface of the first substrate and the surface of the second substrate. The fan is fixed to the relay base plate.

4. The liquid ejection device according to claim 3, characterized in that, The first cable includes a first wiring and a second wiring. The first wiring transmits a first voltage signal that drives the substrate unit, and the second wiring transmits a fan drive voltage that drives the fan. The second wiring is electrically connected to the relay substrate, and the fan drive voltage is transmitted in the relay substrate and input to the fan.

5. The liquid ejection device according to claim 3, characterized in that, have: The first cable includes a first wiring and a second wiring. The first wiring transmits a first voltage signal that drives the substrate unit, and the second wiring transmits a fan drive voltage that drives the fan. The second wiring is electrically connected to the fan, and the fan drive voltage is not transmitted in the relay board, but is input to the fan.

6. The liquid ejection device according to claim 1, characterized in that, The third connector is a right-angle connector. The fourth connector is a linear connector.

7. The liquid ejection device according to claim 1, characterized in that, A second cable for transmitting a second voltage signal is electrically connected to the surface of the relay substrate.

8. The liquid ejection device according to claim 7, characterized in that, The head receives a drive signal and ejects liquid. The substrate unit has: FPGA, providing the second voltage signal input; as well as The driving circuit outputs the driving signal. The FPGA outputs a base drive signal to the drive circuit based on the second voltage signal, which will become the basis of the drive signal.

9. The liquid ejection device according to claim 7, characterized in that, The number of times the third connector and the fourth connector can be disassembled and assembled is greater than the number of times the first cable can be disassembled and assembled with the relay substrate, and greater than the number of times the second cable can be disassembled and assembled with the relay substrate.

10. A liquid ejection module, characterized in that, have: The head has a first connector and sprays liquid; The substrate unit has a second connector that engages with the first connector, and a third connector that is different from the second connector; as well as A relay substrate includes a relay substrate surface and a relay substrate back surface opposite to the relay substrate surface. A first cable for transmitting a first voltage signal is connected to the surface of the relay substrate. A fourth connector is provided on the back side of the relay substrate, which engages with the third connector of the substrate unit. The relay substrate includes a first side and a second side. The substrate unit has: The first substrate includes a first substrate surface, a first substrate back surface opposite to the first substrate surface, and a third side; as well as The second substrate includes a second substrate surface, a second substrate back surface opposite to the second substrate surface, and a fourth side. The first substrate is electrically connected to the second substrate. The first edge of the relay substrate is located along the third edge of the first substrate. The second side of the relay substrate is located along the fourth side of the second substrate. The normal direction on the back side of the relay substrate intersects both the normal direction on the surface of the first substrate and the normal direction on the surface of the second substrate.

11. The liquid ejection module according to claim 10, characterized in that, The first side and the second side are located opposite each other in the relay substrate. The first substrate and the second substrate are located at a position such that the surface of the first substrate is opposite to the surface of the second substrate.

12. The liquid ejection module according to claim 10, characterized in that, The liquid ejection module includes a fan that generates airflow in a gas flow path formed by the surface of the first substrate and the surface of the second substrate. The fan is fixed to the relay base plate.

13. The liquid ejection module according to claim 12, characterized in that, The first cable includes a first wiring and a second wiring. The first wiring transmits a first voltage signal that drives the substrate unit, and the second wiring transmits a fan drive voltage that drives the fan. The second wiring is electrically connected to the relay substrate, and the fan drive voltage is transmitted in the relay substrate and input to the fan.

14. The liquid ejection module according to claim 12, characterized in that, The first cable includes a first wiring and a second wiring. The first wiring transmits a first voltage signal that drives the substrate unit, and the second wiring transmits a fan drive voltage that drives the fan. The second wiring is electrically connected to the fan, and the fan drive voltage is not transmitted in the relay board, but is input to the fan.

15. The liquid ejection module according to claim 10, characterized in that, The third connector is a right-angle connector. The fourth connector is a linear connector.

16. The liquid ejection module according to claim 10, characterized in that, A second cable for transmitting a second voltage signal is electrically connected to the surface of the relay substrate.

17. The liquid ejection module according to claim 16, characterized in that, The head receives a drive signal and ejects liquid. The substrate unit has: FPGA, for input of the second voltage signal; and The driving circuit outputs the driving signal. The FPGA outputs a base drive signal to the drive circuit based on the second voltage signal, which will become the basis of the drive signal.

18. The liquid ejection module according to claim 16, characterized in that, The number of times the third connector and the fourth connector can be disassembled and assembled is greater than the number of times the first cable can be disassembled and assembled with the relay substrate, and greater than the number of times the second cable can be disassembled and assembled with the relay substrate.

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