A high-speed flexible board interconnect component for electronic chassis

Abstract

This invention relates to the field of electronic equipment technology, and particularly to a high-speed flexible board interconnect assembly for an electronic chassis, comprising: a main rigid zone, a flexible zone, and a secondary rigid zone; the main rigid zone is provided with a main rigid zone connector and other electronic components; the secondary rigid zone is provided with a secondary rigid zone connector; the main rigid zone is connected to the secondary rigid zone through the flexible zone; the main rigid zone is mounted on the top cover of the chassis, and the secondary rigid zone is mounted on the bottom plate of the chassis circuit board; the main rigid zone connector is used for connecting to external components, and the secondary rigid zone connector is used for connecting to the bottom plate of the chassis circuit board. This high-speed flexible board interconnect assembly for an electronic chassis uses a high-speed flexible board connection component to achieve cableless connection of the electrical interfaces from the backplane to the top cover of the chassis, featuring a compact structure, small size, and light weight. The assembly simultaneously includes multiple electrical interfaces such as high-speed signals, DC power supplies, and servo motor drive current. The assembly rationally designs and lays out multiple electrical interfaces in the rigid zone to improve signal integrity and enhance electromagnetic compatibility performance under the constraints of the backplane and top cover connector layout.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and in particular to a high-speed flexible board interconnect assembly for electronic chassis. Background Technology

[0002] VPX is a new generation high-speed serial bus standard proposed by VITA (VME International Trade Association) in 2007 based on its VME bus. The basic specifications, mechanical structure, and bus signals of the VPX bus are defined in the ANSI / VITA46 series of technical specifications. VPX is a new generation bus standard based on a high-speed serial bus. With the high integration of electronic devices and the widespread use of VPX high-speed backplanes, the types and number of electrical lines from the backplane to the external interfaces of the electronic chassis are increasing, and the electrical connections are becoming increasingly complex. Currently, the electrical wiring inside various electronic chassis is intersecting and overlapping, resulting in problems such as large space occupation, serious signal interference, and poor consistency of manual soldering. Summary of the Invention

[0003] This invention addresses the technical problems in existing electronic chassis where electrical wiring is crossed and overlapped, resulting in large space occupation, severe signal interference, and poor consistency of manual soldering. It provides a high-speed flexible board interconnect component for electronic chassis.

[0004] The technical solution of the present invention to solve the above-mentioned technical problems is as follows:

[0005] A high-speed flexible board interconnect assembly for electronic chassis includes: a main rigid zone, a flexible zone, and a secondary rigid zone;

[0006] The main rigid zone is equipped with a main rigid zone connector and other electronic components.

[0007] The rigid section is equipped with a rigid section connector; the main rigid section is connected to the rigid section through the flexible section; the main rigid section is installed on the top cover of the chassis, and the rigid section is installed on the bottom plate of the chassis circuit board; the main rigid section connector is used to connect with external devices, and the rigid section connector is used to connect with the bottom plate of the chassis circuit board.

[0008] Furthermore: there is one main rigid zone, and at least one main rigid zone connector is provided on the main rigid zone; there is at least one sub-rigid zone, and each sub-rigid zone is provided with at least one sub-rigid zone connector;

[0009] The main rigid region extends from at least one branch, and the flexible region extends from at least one branch. The number of branches extending from the main rigid region is the same as the number of sub-rigid regions and the number of branches extending from the flexible region. The branches extending from the main rigid region are connected to the sub-rigid regions one-to-one through independent flexible regions.

[0010] The main rigid area connector is electrically connected to the flexible area, and / or the main rigid area connector is electrically connected to the flexible area via a circuit element.

[0011] Furthermore: at least one slot is provided on the top cover of the chassis, and the number of slots is the same as the number of main rigid area connectors;

[0012] The main rigid area connectors pass through the slots one by one.

[0013] Furthermore: the main rigid area connector is installed on the top layer of the main rigid area, and the circuit elements are arranged on the bottom layer of the main rigid area.

[0014] Furthermore, the main rigid area is detachably and fixedly connected to the top cover of the chassis via a boss.

[0015] Furthermore, the rigid zone and the rigid zone are stacked sequentially from top to bottom as a top cover film, a top conductor layer, a first insulating layer, a first planar layer, a second insulating layer, a second planar layer, a third insulating layer, a first conductor layer, a fourth insulating layer, a third planar layer, a fifth insulating layer, a bottom conductor layer, and a bottom cover film.

[0016] Furthermore: the top conductor layer, the first insulating layer, and the first planar layer of the main rigid zone and the secondary rigid zone are the first sheet material;

[0017] The second planar layer, the third insulating layer, and the first conductive layer constitute the second sheet material;

[0018] The third planar layer, the fifth insulating layer, and the bottom conductor layer constitute the third sheet material.

[0019] Furthermore, the different branches of the flexible region have different stacking structures;

[0020] At least one flexible branch is stacked from top to bottom as a top cover film, a top conductor layer, a first insulating layer, a first planar layer and a bottom cover film;

[0021] At least one flexible zone branch is stacked from top to bottom as follows: top cover film, second planar layer, third insulating layer, first conductor layer, bottom cover film, top cover film, third planar layer, fifth insulating layer, bottom conductor layer and bottom cover film.

[0022] Furthermore: at least two branches of the flexible region intersect or overlap in space;

[0023] The different branches of the intersecting or overlapping flexible zones are extensions of different plates.

[0024] Furthermore: the rigid zones do not intersect or overlap with each other, nor do they intersect or overlap with the flexible zones.

[0025] The high-speed flexible circuit board interconnect assembly for electronic chassis provided by this invention has at least the following beneficial effects or advantages:

[0026] This invention provides a high-speed flexible board interconnect assembly for electronic chassis. The main rigid area is equipped with a main rigid area connector and other electronic components; the sub-rigid areas are equipped with sub-rigid area connectors; the main rigid area is connected to the sub-rigid areas via a flexible area; the main rigid area is mounted on the top cover of the chassis, and the sub-rigid areas are mounted on the bottom plate of the chassis circuit board; the main rigid area connectors are used for connecting to external components, and the sub-rigid area connectors are used for connecting to the bottom plate of the chassis circuit board. This high-speed flexible board interconnect assembly for electronic chassis uses a high-speed flexible board connection to achieve cableless connection of the electrical interfaces from the backplane to the top cover of the chassis, featuring a compact structure, small size, and light weight. The assembly also includes multiple electrical interfaces such as high-speed signals, DC power supply, and servo motor drive current. The assembly rationally designs and lays out these multiple electrical interfaces in the rigid area to improve signal integrity and enhance electromagnetic compatibility performance under the constraints of the backplane and top cover connector layout. Attached Figure Description

[0027] Figure 1 A schematic diagram of the high-speed flexible board interconnect assembly for electronic chassis provided in an embodiment of the present invention;

[0028] Figure 2 A front plan view of the high-speed flexible board interconnect assembly for an electronic chassis provided in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the chassis three-dimensional structure provided in an embodiment of the present invention;

[0030] Figure 4 This is a top view of the installed chassis top cover provided in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the stacking of various regions of the high-speed flexible board interconnect assembly for an electronic chassis provided in an embodiment of the present invention. Detailed Implementation

[0032] This invention addresses the technical problems in existing electronic chassis where electrical wiring is crossed and overlapped, resulting in large space occupation, severe signal interference, and poor consistency of manual soldering. It provides a high-speed flexible board interconnect component for electronic chassis.

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1

[0035] Figure 1 This is a principle block diagram of Example 1.

[0036] The high-speed flexible board interconnection assembly for electronic chassis provided in Example 1 includes a main rigid zone 1, a secondary rigid zone (including a first secondary rigid zone 2, a second secondary rigid zone 3, a third secondary rigid zone 4 and a fourth secondary rigid zone 5), and a flexible zone (including a first flexible zone 6, a second flexible zone 7, a third flexible zone 8 and a fourth flexible zone 9). Figure 1 The arrows in the diagram indicate "installation," and the dotted lines indicate "electrical connection traces on the printed circuit board."

[0037] The main rigid area connectors (including the first main connector 10, the second main connector 11, and the third main connector 12) are installed and soldered to the top layer of the main rigid area 1. The main rigid area 1 is installed below the chassis top cover 20. The main rigid area connectors pass through the slots 18 on the chassis top cover 20 for connection to external devices. The main rigid area connectors have neither electrical nor structural connection with the chassis top cover 20. During the assembly and disassembly of the main rigid area 1 and the chassis top cover 20, the solder joints of the main rigid area connectors are protected from stress. The chassis top cover 20 and the chassis circuit board base plate are perpendicular in space. In this embodiment, the slots 18 on the chassis top cover 20 are not unique slots, but are slots cut according to the respective positions and sizes of the main rigid area connectors. This embodiment does not limit the slot design and implementation method. Other circuit components 17 of the main rigid area are installed and soldered to the bottom layer of the main rigid area. During maintenance and testing, it is not necessary to separate the main rigid area 1 from the chassis top cover 20, improving maintainability and testability.

[0038] The segmented connectors (including the first segmented connector 13, the second segmented connector 14, the third segmented connector 15, and the fourth segmented connector 16) are respectively installed and soldered to the first segmented connector 2, the second segmented connector 3, the third segmented connector 4, and the fourth segmented connector 5. The segmented connectors are respectively mated and fixed to the base plate connector 19. The base plate connector 19 on the base plate 21 does not represent a single connector, but rather multiple connectors installed according to the base plate design; therefore, this invention does not limit the design and implementation method of the base plate connectors. The model number of the segmented connector is based on the model number that mats with the base plate connector 19.

[0039] The electrical connection logic between the first main connector 10 and the first sub-rigid zone connector 13 is a direct connection. The printed circuit board traces are connected to the first sub-rigid zone 2 via the first flexible zone 6. The signals from the second main rigid zone connector 11 and the third main rigid zone connector 12 are converted by other circuit elements 17 in the main rigid zone and divided into three paths, which are respectively connected to the second sub-rigid zone 3, the third sub-rigid zone 4, and the fourth flexible zone 5 via the second flexible zone 7, the third flexible zone 8, and the fourth flexible zone 9. The specific circuit logic of the other circuit elements 17 in the main rigid zone does not limit the implementation of this invention, and therefore is represented by a multi-input multi-output black box.

[0040] Example 2

[0041] Figure 2 This is a front plan view of Embodiment 2 of the present invention.

[0042] The high-speed flexible board interconnect assembly for electronic chassis provided in Example 2 includes 13 flexible zone branches. Some branches have similar characteristics; only a few representative branches are described here. The first main rigid zone connector 10, the first flexible zone 6, and the first sub-rigid zone 2 form one servo drive line, with the first sub-rigid zone connector 13 mounted on the back of the first sub-rigid zone 2. The second main rigid zone connector 11, the second flexible zone 7, and the second sub-rigid zone 3 form another servo drive line, with the second sub-rigid zone connector 14 mounted on the front of the first sub-rigid zone 2. The electrical characteristics of these two branches are high current and strong current fluctuation. The third main rigid zone connector 12, the third flexible zone 8, and the third sub-rigid zone 4 form one signal line, with the third sub-rigid zone connector 15 mounted on the back of the third sub-rigid zone 4. The electrical characteristics of this branch are high speed and poor anti-interference capability. The third main rigid zone connector 12, the fourth flexible zone 9, and the fourth sub-rigid zone 5 form one DC power supply line, with the fourth sub-rigid zone connector 16 mounted on the back of the fourth sub-rigid zone 5. The electrical characteristics of this branch are high current, connection to the signal ground plane, and strong anti-interference capability.

[0043] Figure 5 This is a schematic diagram of the layering of various regions in Embodiment 2 of the present invention.

[0044] The main rigid zone 1 and the secondary rigid zone are stacked from top to bottom as follows: top cover film 22, top conductor layer 23, first insulation layer 24, first planar layer 25, second insulation layer 26, second planar layer 27, third insulation layer 28, first conductor layer 29, fourth insulation layer 30, third planar layer 31, fifth insulation layer 32, bottom conductor layer 33, and bottom cover film 34. A total of three double-sided boards are used (the first board 35, the second board 36, and the third board 37, respectively), with a copper thickness of 1 oz.

[0045] The first flexible zone 6 is stacked from top to bottom as follows: top cover film 22, top conductor layer 23, first insulating layer 24, first planar layer 25, and bottom cover film 34. The first board 35 is used, with a copper thickness of 10 oz and a conductor width of 90 mil.

[0046] The second flexible zone 7 is stacked from top to bottom as follows: top cover film 22, second planar layer 27, third insulating layer 28, first conductor layer 29, bottom cover film 34, top cover film 22, third planar layer 31, fifth insulating layer 32, bottom conductor layer 33, and bottom cover film 34. It uses second board 35 and third board 36, with a copper thickness of 10 oz and a conductor width of 90 mil.

[0047] The third flexible zone 8 is stacked from top to bottom as follows: top cover film 22, fourth insulation layer 30, third planar layer 31, fifth insulation layer 32, bottom conductor layer 33, and bottom cover film 34. It uses a second board 35 and a third board 36 with a copper thickness of 1 oz and a conductor width of 5 mil.

[0048] The fourth flexible zone 9 is stacked from top to bottom as follows: top cover film 22, second planar layer 27, third insulating layer 28, first conductor layer 29, and bottom cover film 34. It uses second board 35 and third board 36, with copper thickness of 10 oz and conductor width of 100 mil.

[0049] Figure 3 This is a schematic diagram of the chassis structure according to Embodiment 2 of the present invention. The main rigid area 1 of Embodiment 2 is installed below the chassis top cover 20. A top view of the installed chassis top cover is shown below. Figure 4 As shown. The flexible branch is bent downwards by 90° and parallel to the base plate 21, then bent again to mate with the base plate connector 19. The ends of the first flexible section 6 and the second flexible section 7 that are connected to the main rigid section 1 overlap, but the first flexible section 6 and the second flexible section 7 are not connected. During installation, the second flexible section 7 is first bent backwards by 90° so that the second rigid section 3 is perpendicular to the base plate 21, and the second rigid section connector 14 is located to the right of the second rigid section 3 and mates with the corresponding base plate connector 19; then the first flexible section 6 is bent backwards by 90° so that the first rigid section 2 is perpendicular to the base plate 21, and the first rigid section connector 13 is located to the right of the first rigid section 2 and mates with the corresponding base plate connector 19. The ends of the third flexible section 8 and the fourth flexible section 9 that are connected to the main rigid section 1 partially overlap, but the third flexible section 8 and the fourth flexible section 9 are not connected. During installation, first bring the third flexible zone 8 close to the base plate 21 so that the second rigid zone 3 is parallel to the base plate 21. The connector 15 of the third rigid zone is located below the third rigid zone 4 and is inserted into the corresponding base plate connector 19 of the base plate. Then bend the fourth flexible zone 9 backward by 90° so that the fourth rigid zone 5 is perpendicular to the base plate 21. The connector 16 of the fourth rigid zone is located to the right of the fourth rigid zone 5 and is inserted into the corresponding base plate connector 19 of the base plate.

[0050] The high-speed flexible circuit board interconnect assembly for electronic chassis provided in this embodiment of the invention has at least the following beneficial effects or advantages:

[0051] The high-speed flexible board interconnect assembly for electronic chassis provided in this invention includes a main rigid area with main rigid area connectors and other electronic components; and a sub-rigid area with sub-rigid area connectors. The main rigid area is connected to the sub-rigid areas via a flexible area. The main rigid area is mounted on the top cover of the chassis, and the sub-rigid areas are mounted on the bottom plate of the chassis circuit board. The main rigid area connectors are used to connect to external components, and the sub-rigid area connectors are used to connect to the bottom plate of the chassis circuit board. This high-speed flexible board interconnect assembly for electronic chassis uses a high-speed flexible board connection to achieve cableless connection of the electrical interfaces from the backplane to the top cover of the chassis, featuring a compact structure, small size, and light weight. The assembly also includes multiple electrical interfaces such as high-speed signals, DC power supplies, and servo motor drive current. The assembly rationally designs and lays out multiple electrical interfaces in the rigid area to improve signal integrity and enhance electromagnetic compatibility performance under the constraints of the backplane and top cover connector layout.

[0052] In the description of this invention, it should be noted that the terms used in the various embodiments, such as "upper," "lower," "front," "rear," "left," and "right," which indicate orientation, are only used to simplify the description of the positional relationships based on the accompanying drawings and do not mean that the components and devices referred to must be operated in accordance with the specific orientations and defined operations, methods, and structures in the specification. Such directional terms do not constitute a limitation of this invention.

[0053] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention in light of the specific circumstances.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-speed flexible circuit board interconnect assembly for electronic chassis, characterized in that: include: Main rigid zone, flexible zone, and secondary rigid zone; The main rigid zone is equipped with a main rigid zone connector and other electronic components. The rigid section is equipped with a rigid section connector; the main rigid section is connected to the rigid section through the flexible section; the main rigid section is installed on the top cover of the chassis, and the rigid section is installed on the bottom plate of the chassis circuit board; the main rigid section connector is used to connect with external devices, and the rigid section connector is used to connect with the bottom plate of the chassis circuit board. The main rigid zone is provided with one, and at least one main rigid zone connector is provided on the main rigid zone; the sub-rigid zone is provided with at least one, and each sub-rigid zone is provided with at least one sub-rigid zone connector. The main rigid region extends from at least one branch, and the flexible region extends from at least one branch. The number of branches extending from the main rigid region is the same as the number of sub-rigid regions and the number of branches extending from the flexible region. The branches extending from the main rigid region are connected to the sub-rigid regions one-to-one through independent flexible regions. The main rigid area connector is electrically connected to the flexible area, and / or the main rigid area connector is electrically connected to the flexible area via a circuit element; The different branches of the flexible region have different stacking structures; At least one flexible branch is stacked from top to bottom as a top cover film, a top conductor layer, a first insulating layer, a first planar layer and a bottom cover film; At least one flexible zone branch is stacked from top to bottom as follows: top cover film, second planar layer, third insulating layer, first conductor layer, bottom cover film, top cover film, third planar layer, fifth insulating layer, bottom conductor layer and bottom cover film.

2. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 1, characterized in that: The top cover of the chassis has at least one slot, and the number of slots is the same as the number of main rigid area connectors. The main rigid area connectors pass through the slots one by one.

3. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 1, characterized in that: The main rigid zone connector is installed on the top layer of the main rigid zone, and the circuit elements are arranged on the bottom layer of the main rigid zone.

4. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 1, characterized in that: The main rigid area is detachably and fixedly connected to the top cover of the chassis via a boss.

5. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 1, characterized in that: The rigid zone and the rigid zone are stacked from top to bottom as follows: top cover film, top conductor layer, first insulating layer, first planar layer, second insulating layer, second planar layer, third insulating layer, first conductor layer, fourth insulating layer, third planar layer, fifth insulating layer, bottom conductor layer and bottom cover film.

6. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 5, characterized in that: The top conductor layer, the first insulation layer, and the first planar layer of the main rigid zone and the secondary rigid zone are the first sheet material; The second planar layer, the third insulating layer, and the first conductive layer constitute the second sheet material; The third planar layer, the fifth insulating layer, and the bottom conductor layer constitute the third sheet material.

7. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 6, characterized in that: The flexible region has at least two branches that intersect or overlap in space; The different branches of the intersecting or overlapping flexible zones are extensions of different plates.

8. The high-speed flexible circuit board interconnect assembly for electronic chassis according to claim 1, characterized in that: The rigid zones do not intersect or overlap with each other, nor do they intersect or overlap with the flexible zones.

Images