Dual UWB Antenna Module

Abstract

The present invention discloses a dual ultra-wideband antenna module, including a ceramic substrate, a first ultra-wideband antenna and a second ultra-wideband antenna. The ceramic substrate has a first side surface, a second side surface, a third side surface, a fourth side surface, a top surface and a bottom groove, and the top surface is provided with an isolation portion, the isolation portion is connected to a grounding portion, and the grounding portion is located on the second side surface. The bottom groove is used to accommodate a wireless module. The first ultra-wideband antenna has a first antenna portion, a first short-circuit portion and a first feeder portion. The first antenna portion and the first short-circuit portion are located on the second side surface and on the right side of the grounding portion. The first feeder portion is located on the first side surface, and the first short-circuit portion and the first feeder portion are both connected to the first antenna portion. The second ultra-wideband antenna has a second antenna portion, a second short-circuit portion and a second feeder portion. The second antenna portion and the second short-circuit portion are located on the second side surface and on the left side of the grounding portion. The second feeder portion is located on the third side surface, and the second short-circuit portion and the second feeder portion are both connected to the second antenna portion. The present invention can improve antenna performance.

Description

Technical Field

[0001] The invention relates to an antenna module, in particular to a dual ultra-wideband antenna module. Background Art

[0002] Industrial wireless devices, such as industrial wireless control devices, are very expensive. The reason is not only that the device reliability requirements are very high, but also that industrial devices have a wide range of application scenarios. This makes the designers of industrial wireless devices try to design models with a wide range of applications to reduce the number of development projects. This not only reduces R&D costs, but also reduces the production line layout costs after mass production, thereby being more economical.

[0003] Because industrial wireless devices have a higher service life than general consumer products, manufacturers often use the same wireless module public version for multiple models to improve reliability. The public version usually separates the circuit part and the antenna part. Figure 1 and Figure 2 , circuit 1 and antenna 2 are independent of each other, and antenna 2 usually requires an independent antenna clearance area. The public version is designed to reduce the mutual interference factors between circuit parameters when the product is updated. However, when the communication specifications need to be changed, the antenna used will also change due to the different wireless chips, so the final result is that the entire circuit board must be completely redesigned, which makes it difficult to significantly reduce the overall R&D cost of industrial wireless devices. Summary of the invention

[0004] In view of the above-mentioned defects in the prior art, the task of the present invention is to provide a dual ultra-wideband antenna module, the purpose of which is to replace the traditional wireless module, so as to achieve improved performance (or improvement) while reducing development costs.

[0005] The technical solution of the present invention is as follows: A dual ultra-wideband antenna module, comprising:

[0006] A ceramic substrate, comprising a first side surface, a second side surface, a third side surface, a fourth side surface, a top surface and a bottom groove, wherein the first side surface, the second side surface, the third side surface and the fourth side surface are connected around the top surface, wherein the first side surface is connected to the second side surface, the second side surface is connected to the third side surface, and the fourth side surface is connected to the third side surface and the first side surface, wherein the top surface is provided with an isolation portion, the isolation portion is connected to a grounding portion, and the grounding portion is located on the second side surface, wherein the bottom groove is used to accommodate a wireless module;

[0007] a first ultra-wideband antenna, comprising a first antenna portion, a first short-circuit portion, and a first feeder portion, wherein the first antenna portion and the first short-circuit portion are located on the second side surface and on the right side of the ground portion, wherein the first feeder portion is located on the first side surface, and the first short-circuit portion and the first feeder portion are both connected to the first antenna portion; and

[0008] The second ultra-wideband antenna comprises a second antenna portion, a second short-circuit portion and a second feeder portion, wherein the second antenna portion and the second short-circuit portion are located on the second side surface and on the left side of the grounding portion, wherein the second feeder portion is located on the third side surface, and the second short-circuit portion and the second feeder portion are both connected to the second antenna portion.

[0009] Further, the first feeder portion is connected to the first antenna portion through the intersection of the first side surface and the second side surface; wherein the second feeder portion is connected to the second antenna portion through the intersection of the third side surface and the second side surface.

[0010] Furthermore, the grounding portion, the first short-circuit portion, and the second short-circuit portion are connected to a bottom grounding area of ​​the bottom groove, and the first feeder portion and the second feeder portion are not connected to the bottom grounding area.

[0011] Furthermore, it includes a Bluetooth antenna, which includes a Bluetooth radiator, a Bluetooth feed part and a Bluetooth short-circuit part, the Bluetooth radiator is located on the top surface, the Bluetooth feed part and the Bluetooth short-circuit part are located on the fourth side surface, the Bluetooth short-circuit part is connected to the Bluetooth feed part, and the Bluetooth feed part is connected to the Bluetooth radiator through the intersection of the fourth side surface and the top surface.

[0012] Furthermore, the dual ultra-wideband antenna module further includes a ground extension area located on the third side, and the ground extension area is located between the second ultra-wideband antenna and the Bluetooth antenna to improve the isolation between the second ultra-wideband antenna and the Bluetooth antenna, wherein the ground extension area is connected to the bottom ground area.

[0013] Furthermore, the first central frequency of the first ultra-wideband antenna is 6489.6 MHz, and the bandwidth is 500 MHz.

[0014] Furthermore, the second central frequency of the second ultra-wideband antenna is 7987.2 MHz, and the bandwidth is 500 MHz.

[0015] Furthermore, the wireless module is installed on a circuit board, and the bottom groove covers the wireless module and is installed on the circuit board.

[0016] Furthermore, the bottom groove is provided with a signal block and a power block, the signal block is used to lead the signal processed by the wireless module to the circuit board, and the power block is used to introduce power to the wireless module.

[0017] Furthermore, the dual ultra-wideband antenna module is a rectangular module, the wireless module has a first signal end, a second signal end and a ground end, the first signal end is connected to the first feeder part, the second signal end is connected to the second feeder part, and the ground end is connected to the ground part, the first short-circuit part and the second short-circuit part through the bottom grounding area.

[0018] The advantages of the present invention compared with the prior art are:

[0019] The present invention can integrate antennas and wireless modules in a three-dimensional stacking manner, and can make it possible for old wireless devices to avoid having to modify the circuit design of the main circuit board of the device. The dual ultra-wideband antenna module provided by the present invention can replace the traditional antenna and wireless module and provide the application of ultra-wideband working frequency band. Because when applied on the circuit board, only the occupied area of ​​the traditional wireless module is used, and the need to use the antenna clearance area can be directly eliminated, so that the traditional old wireless module can be easily upgraded to a new type of ultra-wideband wireless module. Therefore, the single module of the present invention can be widely used in a variety of different models of wireless device models, and can complete the update and upgrade of wireless models while reducing the design changes to the circuit board. Furthermore, even if it is applied to new product designs, it can reduce the occupied area of ​​the antenna module, and has a high industrial application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of a wireless module of a conventional industrial wireless device.

[0021] Figure 2 It is a schematic diagram of a wireless module of a conventional industrial wireless device.

[0022] Figure 3 Schematic diagram of the bottom groove of the dual ultra-wideband antenna module provided by an embodiment of the present invention.

[0023] Figure 4 It is a schematic diagram of the top surface of the dual ultra-wideband antenna module provided by an embodiment of the present invention.

[0024] Figure 5 It is a schematic diagram of a first side surface of a dual ultra-wideband antenna module provided by an embodiment of the present invention.

[0025] Figure 6 It is a schematic diagram of the second side of the dual ultra-wideband antenna module provided by an embodiment of the present invention.

[0026] Figure 7It is a schematic diagram of a third side of a dual ultra-wideband antenna module provided by an embodiment of the present invention.

[0027] Figure 8 It is a schematic diagram of a fourth side of a dual ultra-wideband antenna module provided by an embodiment of the present invention.

[0028] Fig. 9 It is a stereoscopic diagram of a dual ultra-wideband antenna module provided by an embodiment of the present invention from a first viewing angle.

[0029] Fig.10 It is a stereoscopic diagram of a dual ultra-wideband antenna module provided by an embodiment of the present invention from a second viewing angle.

[0030] Fig.11 It is a cross-sectional view of section AA of the dual ultra-wideband antenna module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The present invention will be further described below in conjunction with the embodiments, but are not intended to limit the present invention.

[0032] Please refer to Figures 3 to 11 The dual ultra-wideband antenna module provided by the embodiment of the present invention is mainly applied to industrial wireless devices. The dual ultra-wideband antenna module includes a ceramic substrate 30 , a first ultra-wideband antenna 31 and a second ultra-wideband antenna 32 . Figures 3 to 8 It is a picture from various perspectives. Fig. 9 and Fig.10 It is a stereogram. Fig.11 30 is a cross-sectional view of a ceramic substrate 30. The ceramic substrate 30 has a first side surface 301, a second side surface 302, a third side surface 303, a fourth side surface 304, a top surface 305 and a bottom groove 306. The dual ultra-wideband antenna module has a roughly rectangular shape. Figure 3 is a schematic diagram of the bottom groove 306, Figure 4 305 is a schematic diagram of a top surface 305 . The top surface 305 has four sides, and a first side surface 301 , a second side surface 302 , a third side surface 303 and a fourth side surface 304 connect the four sides of the top surface 305 . Figure 1 The first side 301 is shown as connecting Figure 6 The second side 302 shown, Figure 6 The second side 302 is shown connected Figure 7 The third side surface 303 shown in the figure, the fourth side surface 304 connects the third side surface 303 and the first side surface 301, wherein the top surface 305 is provided with an isolation portion 33, the isolation portion 33 is connected to the grounding portion 34, and the grounding portion 34 is located on the second side surface 302. The bottom groove 306 is used to accommodate the wireless module 4. Figure 3 The wireless module 4 is located in the space of the bottom groove 306. Fig. 9 and Fig.10In order to show the three-dimensional space of the bottom groove 306, the body of the wireless module 4 is not shown. The wireless module 4 is, for example, a system on a chip (SoC) with a chip-like appearance. Fig.11 The cross section AA is shown, also indicating the depth H of the groove.

[0033] In the above figures, the metal structures (such as antenna patterns or lines) on each surface of the ceramic substrate 30 are all illustrated with their thickness close to zero, which is only for the convenience of drawing. In fact, with the conventional ceramic process, the relevant antenna patterns (or line states) described in this embodiment have a certain thickness on the surface of the ceramic substrate 30, but the thickness can be roughly ignored relative to the size of the ceramic substrate 30, and no further description is given. The first ultra-wideband antenna 31 has a first antenna portion 311, a first short-circuit portion 312 and a first feeder portion 313, wherein the first antenna portion 311 and the first short-circuit portion 312 are located on the second side 302 and on the right side of the grounding portion 34, wherein the first feeder portion 313 is located on the first side 301, and the first short-circuit portion 312 and the first feeder portion 313 are both connected to the first antenna portion 311. In detail, the first feeder portion 313 is connected to the first antenna portion 311 through the intersection of the first side 301 and the second side 302.

[0034] The second ultra-wideband antenna 32 has a second antenna portion 321, a second short-circuit portion 322 and a second feeder portion 323, wherein the second antenna portion 321 and the second short-circuit portion 322 are located on the second side surface 302 and on the left side of the grounding portion 34, wherein the second feeder portion 323 is located on the third side surface 303, and the second short-circuit portion 322 and the second feeder portion 323 are both connected to the second antenna portion 321. In detail, the second feeder portion 323 is connected to the second antenna portion 321 through the intersection of the third side surface 303 and the second side surface 302. The grounding portion 34, the first short-circuit portion 312 and the second short-circuit portion 322 are connected to the bottom grounding region G of the bottom groove 306, and the first feeder portion 313 and the second feeder portion 323 are not connected to the bottom grounding region G.

[0035] In order to integrate the commonly used Bluetooth function, the dual ultra-wideband antenna module further includes a Bluetooth antenna 5, which includes a Bluetooth radiator 51, a Bluetooth feeding portion 52 and a Bluetooth short-circuit portion 53. The Bluetooth radiator 51 is located on the top surface 305, the Bluetooth feeding portion 52 and the Bluetooth short-circuit portion 53 are located on the fourth side surface 304, the Bluetooth short-circuit portion 53 is connected to the Bluetooth feeding portion 52, and the Bluetooth feeding portion 52 is connected to the Bluetooth radiator 51 through the intersection of the fourth side surface 304 and the top surface 305. In addition, in order to improve the isolation between the second ultra-wideband antenna 32 and the Bluetooth antenna 5, a ground extension area EG located on the third side surface 303 is also used, so that the ground extension area EG is located between the second ultra-wideband antenna 32 and the Bluetooth antenna 5. The ground extension area EG is connected to the ground area G on the bottom surface.

[0036] The wireless module 4 is mounted on a circuit board (such as Figure 1 or Figure 2 The circuit substrate where the circuit 1 is shown is mounted, for example, by using surface mount technology to mount the wireless module 4 on the printed circuit board, and the bottom groove 306 is mounted on the circuit board while completely covering the wireless module 4. Fig.11 In the cross section AA, the depth H of the bottom groove 306 is greater than the thickness of the wireless module 4. Therefore, the wireless module 4 is located between the ceramic substrate 30 and the circuit board, and the wireless module 4 is completely covered by the ceramic substrate 30 to complete the stacking of the three-dimensional structure. Furthermore, the bottom groove 306 is further provided with a signal block S and a power block P. The signal block S is used to lead the signal processed by the wireless module 4 to the circuit board, and the power block P is used to introduce the power to the wireless module 4. The signal block S, the power block P and the bottom surface grounding area G are independent of each other, and are independently connected to the circuit board without affecting each other. Therefore, after the ceramic substrate 30 covers the wireless module 4, it does not affect the signal or power transmitted by the pin (pin) of the wireless module 4 on the circuit board. In detail, the signal block S and the corresponding signal line on the circuit board are connected to the signal pin of the wireless module 4, so that it transmits the signal; the power block P and the corresponding power line on the circuit board are connected to the power pin of the wireless module 4, so that it transmits the power; and the bottom surface grounding area G is divided into multiple, and all are connected to the ground on the circuit board to maintain the stability of the grounding state. The selected positions of the signal block S and the power block P in the figure are only for example, and the present invention is not limited thereto.

[0037] As for the structure of the ceramic substrate 30, the dual ultra-wideband antenna module is a rectangular parallelepiped module. In this embodiment, when the dielectric constant (Dk) is 6.2 and the dielectric loss (Df) is 0.015, its appearance size is approximately 16 mm in length, 16 mm in width, and 6.2 mm in height. It only occupies the circuit space originally designed on the circuit board for placing the wireless module 4, so that the ceramic substrate 30 is similar to a cover set on the wireless module 4, and the antenna clearance area on the circuit board is no longer required. In other words, the wireless module 4 and the dual ultra-wideband antenna module share the same circuit block. The wireless module 4 has a first signal terminal, a second signal terminal and a ground terminal (not shown in the figure), the first signal terminal is connected to the first feeder part 313, and the second signal terminal is connected to the second feeder part 323. In the case of having a Bluetooth antenna 5, the wireless module 4 further has a Bluetooth signal terminal to connect to the Bluetooth feed-in part 52. The structures of the first feeder part 313, the second feeder part 323 and the Bluetooth feed-in part 52 mentioned above each have a portion extending to the bottom groove 306. The first signal end, the second signal end and the Bluetooth signal end can be respectively conducted to the corresponding position of the bottom groove 306 via the trace on the circuit board, or each can directly contact the first feeder part 313, the second feeder part 323 or the Bluetooth feed-in part 52 that has been extended to the bottom groove 306 in a pin manner, and can use a pressing or snap mechanism to stabilize its conduction state. The grounding end is connected to the grounding part 34, the first short-circuit part 312 and the second short-circuit part 322 through the bottom grounding area G. The bottom grounding area G is connected to the grounding surface of the circuit board (not shown), and the shape of the bottom grounding area G can be designed to match the grounding surface of the circuit board without changing the circuit board design. Similarly, the signal block S and the power block P can also match the design of the circuit board without changing the routing of the circuit board, which can greatly increase the application range of this dual ultra-wideband antenna module.

[0038] Furthermore, the first center frequency of the first ultra-wideband antenna 31 is 6489.6 MHz, and the bandwidth is 500 MHz. The second center frequency of the second ultra-wideband antenna 32 is 7987.2 MHz, and the bandwidth is 500 MHz. This dual ultra-wideband antenna module can be particularly applied to industrial wireless devices, and can enable this dual ultra-wideband antenna module to have the function of ultra-wideband communication and also have the function of Bluetooth communication. In other words, this dual ultra-wideband antenna module can carry two or more wireless communication systems at the same time.

[0039] In summary, the dual ultra-wideband antenna module provided by the embodiment of the present invention can integrate the antenna and the wireless module in a three-dimensional stacking manner. It can make it possible for old wireless devices (especially those for industrial use) to not need to modify the circuit design of the main circuit board of the device, and the bottom surface grounding area of ​​the bottom groove, and even the signal block and the power block can be replaced with the pattern in accordance with the application model. The dual ultra-wideband antenna module provided by the present invention can replace the traditional antenna and wireless module and provide at least two ultra-wideband working frequency band applications and a new Bluetooth antenna application. Because when applied on the circuit board, only the occupied area of ​​the traditional wireless module is used, and the need to use the antenna clearance area can be directly eliminated, so that the wireless module (especially for industrial use) can be easily upgraded to a new type of ultra-wideband wireless module, and can be accompanied by the newly added Bluetooth wireless function. Therefore, the single module of the present invention can be widely used in a variety of different models of wireless device models, and can complete the update and upgrade of wireless models (especially for industrial use) by reducing the design changes to the circuit board. Furthermore, even if it is applied to new product designs, it can reduce the occupied area of ​​the antenna module, and has a high industrial application value.

Claims

1. A dual ultra-wideband antenna module, characterized in that: include: A ceramic substrate, comprising a first side surface, a second side surface, a third side surface, a fourth side surface, a top surface and a bottom groove, wherein the first side surface, the second side surface, the third side surface and the fourth side surface are connected around the top surface, wherein the first side surface is connected to the second side surface, the second side surface is connected to the third side surface, and the fourth side surface is connected to the third side surface and the first side surface, wherein the top surface is provided with an isolation portion, the isolation portion is connected to a grounding portion, and the grounding portion is located on the second side surface, wherein the bottom groove is used to accommodate a wireless module; a first ultra-wideband antenna, comprising a first antenna portion, a first short-circuit portion and a first feeder portion, wherein the first antenna portion and the first short-circuit portion are located on the second side surface and on the right side of the ground portion, wherein the first feeder portion is located on the first side surface, the first short-circuit portion and the first feeder portion are both connected to the first antenna portion, and the first feeder portion is connected to the first antenna portion through the intersection of the first side surface and the second side surface; and The second ultra-wideband antenna comprises a second antenna portion, a second short-circuit portion and a second feeder portion, wherein the second antenna portion and the second short-circuit portion are located on the second side surface and on the left side of the grounding portion, wherein the second feeder portion is located on the third side surface, the second short-circuit portion and the second feeder portion are both connected to the second antenna portion, and the second feeder portion is connected to the second antenna portion through the intersection of the third side surface and the second side surface.

2. The dual ultra-wideband antenna module according to claim 1, characterized in that: The grounding portion, the first short-circuit portion, and the second short-circuit portion are connected to a bottom grounding region of the bottom groove, and the first feeder portion and the second feeder portion are not connected to the bottom grounding region.

3. The dual ultra-wideband antenna module according to claim 2, characterized in that: It includes a Bluetooth antenna, which includes a Bluetooth radiator, a Bluetooth feeding part and a Bluetooth short-circuit part. The Bluetooth radiator is located on the top surface, the Bluetooth feeding part and the Bluetooth short-circuit part are located on the fourth side surface, the Bluetooth short-circuit part is connected to the Bluetooth feeding part, and the Bluetooth feeding part is connected to the Bluetooth radiator through the intersection of the fourth side surface and the top surface.

4. The dual ultra-wideband antenna module according to claim 3, characterized in that: The dual ultra-wideband antenna module further includes a ground extension area located on the third side surface, wherein the ground extension area is located between the second ultra-wideband antenna and the Bluetooth antenna to improve the isolation between the second ultra-wideband antenna and the Bluetooth antenna, wherein the ground extension area is connected to the bottom ground area.

5. The dual ultra-wideband antenna module according to claim 1, characterized in that: The first central frequency of the first ultra-wideband antenna is 6489.6 MHz, and the bandwidth is 500 MHz.

6. The dual ultra-wideband antenna module according to claim 1, characterized in that: The second central frequency at which the second ultra-wideband antenna operates is 7987.2 MHz, and the bandwidth is 500 MHz.

7. The dual ultra-wideband antenna module according to claim 2, characterized in that: The wireless module is installed on the circuit board, and the bottom groove covers the wireless module and is installed on the circuit board.

8. The dual ultra-wideband antenna module according to claim 7, characterized in that: The bottom groove is provided with a signal block and a power block. The signal block is used to lead the signal processed by the wireless module to the circuit board, and the power block is used to introduce power to the wireless module.

9. The dual ultra-wideband antenna module according to claim 8, characterized in that: The dual ultra-wideband antenna module is a rectangular module. The wireless module has a first signal end, a second signal end and a ground end. The first signal end is connected to the first feeder part, the second signal end is connected to the second feeder part, and the ground end is connected to the ground part, the first short-circuit part and the second short-circuit part through the bottom grounding area.

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