Filters, structures, components and electronic devices

Abstract

The present invention discloses a filter, structure, component and electronic device, wherein the filter comprises a differential mode capacitor layer; a busbar metal layer, wherein the busbar metal layer is symmetrically arranged on both sides of the differential mode capacitor layer, and the busbar metal layer is used to connect a common mode suppression device; and the differential mode capacitor layer is used to cooperate with the busbar metal layer to form a differential mode suppression circuit. This technical solution makes it easy to rectify the common mode suppression device by means of an external common mode suppression device, while ensuring safety regulations and avoiding the generation of large leakage currents. The capacitance properties of the external common mode suppression device are also more stable, avoiding the problem of mutual conversion between common mode signals and differential mode signals, and improving the electromagnetic interference suppression effect of the filter component.

Description

Technical Field

[0001] The present invention relates to the field of filtering technology, and in particular to a filter, a structure, a component and an electronic device. Background Art

[0002] A power converter is an electronic device that can convert one type of current into another type of current. It is easy to generate electromagnetic interference during operation. The industry usually adopts the method of inserting a filter into the power port of the power transformer to suppress EMI (Electromagnetic Interference, electromagnetic interference, referred to as EMI).

[0003] Existing filters generally use a bus filter with a laminated design. However, since the existing bus filter with a laminated design is unstable during operation, there is a problem of mutual conversion between common-mode signals and differential-mode signals, resulting in poor electromagnetic interference suppression effect. Summary of the invention

[0004] The embodiments of the present invention provide a filter, a structure, a component and an electronic device to solve the problem that the electromagnetic interference suppression performance of the existing filter is poor.

[0005] A filter, comprising:

[0006] Differential mode capacitor layer;

[0007] A busbar metal layer, the busbar metal layer is symmetrically arranged on both sides of the differential mode capacitor layer, and the busbar metal layer is used to connect a common mode suppression device;

[0008] The differential mode capacitor layer is used to cooperate with the busbar metal layer to form a differential mode suppression circuit.

[0009] Optionally, the busbar metal layer includes a second metal layer, and the second metal layer is used to connect the common mode suppression device.

[0010] Optionally, the busbar metal layer further includes a dissipation layer, and the dissipation layer is stacked between the second metal and the differential mode capacitor layer.

[0011] Optionally, the dissipation layer includes a first dissipation layer, a first metal layer and a second dissipation layer which are stacked in sequence;

[0012] The first dissipative layer is adjacent to the differential mode capacitance layer;

[0013] The first metal layer is used to connect the busbar connection end;

[0014] The second dissipation layer is adjacent to the second metal layer.

[0015] Optionally, the differential mode capacitor layer includes a third metal layer, a dielectric layer and a fourth metal layer which are stacked in sequence.

[0016] Optionally, the differential mode capacitor layer further includes a first isolation layer and a second isolation layer, and the first isolation layer and the second isolation layer are respectively connected to one of the busbar metal layers.

[0017] Optionally, two busbar metal layers are included, and the two busbar metal layers are symmetrically arranged on both sides of the differential mode capacitor layer, and each busbar metal layer is used to connect a common mode suppression device.

[0018] A filtering structure 1, comprising a common mode suppression device and the above filter;

[0019] The common mode suppression device is connected to the busbar metal layers in a one-to-one correspondence.

[0020] Optionally, the common-mode suppression device includes a first capacitor, a first end of the first capacitor is connected to one of the busbar metal layers, and a second end of the first capacitor is grounded.

[0021] A filter assembly, comprising a low-frequency filter circuit and the above-mentioned filter structure;

[0022] The filtering structure is used to connect the bus connection end to suppress high-frequency noise signals;

[0023] The low-frequency filter circuit is connected to the filter structure and is used to suppress low-frequency noise signals.

[0024] Optionally, two filtering structures are included, the two filtering structures are symmetrically arranged, one filtering structure is used to connect to the bus input end, and the other filtering structure is used to connect to the bus output end;

[0025] The low-frequency filter circuit is arranged between the two symmetrically arranged filter structures.

[0026] Optionally, the low-frequency filtering circuit includes a common-mode inductor.

[0027] An electronic device comprises the above-mentioned filter component.

[0028] The above-mentioned filter, structure, component and electronic device, the filter includes a differential mode capacitor layer; a busbar metal layer, the busbar metal layer is symmetrically arranged on both sides of the differential mode capacitor layer, and the busbar metal layer is used to connect the common mode suppression device; the differential mode capacitor layer is used to cooperate with the busbar metal layer to form a differential mode suppression circuit, and the common mode suppression device is replaced by the stacked common mode capacitor layer by an external common mode suppression device, so that the common mode suppression device is easy to rectify, and at the same time, safety regulations can be guaranteed to avoid generating large leakage currents, and the capacitance properties of the external common mode suppression device are also more stable, avoiding the problem of mutual conversion between common mode signals and differential mode signals, thereby improving the electromagnetic interference suppression effect of the filter component. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0030] Figure 1 is a schematic structural diagram of a filter in one embodiment of the present invention;

[0031] Figure 2 is a schematic structural diagram of a filter assembly in one embodiment of the present invention;

[0032] Figure 3 FIG. 4 is a circuit diagram of a filter circuit in an embodiment of the present invention.

[0033] In the figure: 1. filtering structure; 11. filter; 111. differential mode capacitance layer; 1111. first isolation layer; 1112. third metal layer; 1113. dielectric layer; 1114. fourth metal layer; 1115. second isolation layer; 112. busbar metal layer; 1121. first dissipative layer; 1122. first metal layer; 1123. second dissipative layer; 1124. second metal layer; 12. common mode suppression device; 2. low frequency filtering circuit; 3. high frequency filtering circuit; 31. first high frequency filtering circuit; 311. first differential mode suppression circuit; 312. first common mode suppression circuit; 32. second high frequency filtering circuit; 321. second differential mode suppression circuit; 322. second common mode suppression circuit. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0036] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0037] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0038] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0039] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0040] This embodiment provides a filter 11, which is applied in an electronic device. Optionally, the electronic device includes a power converter, and can also be applied in other electronic devices that need to suppress electromagnetic interference.

[0041] In the related art, the filter adopts a laminated design, including a differential mode capacitor layer, two common mode capacitor layers and two busbar metal layers; the differential mode capacitor layer is arranged between the two busbar metal layers, and each busbar metal layer is provided with a common mode capacitor layer, and the common mode capacitor layer is used for grounding. Among them, since each common mode capacitor layer in the related art includes two metal layers and a dielectric layer arranged between the two metal layers, the dielectric layer generally adopts ceramics with a high dielectric constant, and the temperature and frequency characteristics of ceramics are not stable. At the same time, due to the limitation of the lamination process, it is impossible to ensure that the equivalent common mode capacitance values ​​of the two common mode capacitor layers are consistent, so that the two common mode capacitor layers are asymmetric, which leads to the problem of mutual conversion between common mode signals and differential mode signals in the filter, resulting in poor electromagnetic interference suppression effect.

[0042] In order to solve the above problems, Figure 1 As shown, this embodiment provides a filter 11, a differential mode capacitor layer 111; a busbar metal layer 112, the busbar metal layer 112 is symmetrically arranged on both sides of the differential mode capacitor layer 111, and the busbar metal layer 112 is used to connect the common mode suppression device 12; the differential mode capacitor layer 111 is used to cooperate with the busbar metal layer 112 to form a differential mode suppression circuit.

[0043] As an example, the filter 11 includes a differential mode capacitor layer 111 and two busbar metal layers 112; the two busbar metal layers 112 are symmetrically arranged on both sides of the differential mode capacitor layer 111, and each busbar metal layer 112 is used to connect a common mode suppression device 12; the differential mode capacitor layer 111 and the two busbar metal layers 112 cooperate to form a differential mode suppression circuit.

[0044] As an example, two busbar metal layers 112 are used to connect the busbar connection ends and are symmetrically arranged on both sides of the differential mode capacitor layer 111 to avoid mutual conversion between common mode signals and differential mode signals. Each busbar metal layer 112 is used to connect a common mode suppression device 12, which is used to cooperate with the common mode suppression device 12 to suppress the common mode signal. The differential mode capacitor layer and the two busbar metal layers 112 cooperate to form a differential mode suppression circuit for suppressing the differential mode signal. It can be understood that the common mode signal refers to the common mode electromagnetic interference signal, and the differential mode signal refers to the differential mode electromagnetic interference signal. In this example, each busbar metal layer 112 is used to connect a common mode suppression device 12, replacing the stacked common mode capacitor layer. By externally connecting the common mode suppression device 12, the common mode suppression device 12 is easy to rectify, and at the same time, safety regulations can be guaranteed to avoid generating large leakage currents, and the capacitance properties of the external common mode suppression device 12 are also more stable, avoiding the problem of mutual conversion between common mode signals and differential mode signals, and improving the electromagnetic interference suppression effect of the filter 11.

[0045] In one embodiment, the busbar metal layer 112 includes a second metal layer 1124 , which is used to connect the common mode suppression device 12 , so that the high-frequency common mode signal in the busbar metal layer 112 is suppressed by the common mode suppression device 12 connected to the second metal layer 1124 .

[0046] Optionally, the busbar metal layer 112 also includes a dissipation layer, which is stacked between the second metal layer 1124 and the differential mode capacitor layer 111, so that when the busbar metal layer 112 transmits load current, under the action of skin effect and proximity effect, it flows through the dissipation layer, and absorbs and dissipates high-frequency interference signals through the dissipation layer.

[0047] Optionally, the dissipation layer includes a first dissipation layer 1121, a first metal layer 1122, and a second dissipation layer 1123 which are stacked in sequence. Specifically, the busbar metal layer 112 includes a first dissipation layer 1121, a first metal layer 1122, a second dissipation layer 1123, and a second metal layer 1124 which are stacked in sequence; the first dissipation layer 1121 is connected to one side of the differential mode capacitor layer 111; the first metal layer 1122 is used to connect the busbar connection end; and the second metal layer 1124 is used to connect a common mode suppression device 12.

[0048] As an example, each busbar metal layer 112 includes a first dissipation layer 1121, a first metal layer 1122, a second dissipation layer 1123, and a second metal layer 1124 stacked in sequence. The first dissipation layer 1121 and the second dissipation layer 1123 are used to dissipate high-frequency interference signals, which include high-frequency differential mode signals and high-frequency common mode signals. In this example, when the first metal layer 1122 transmits the load current, under the action of the skin effect, part of the high-frequency differential mode current and high-frequency common mode current flowing through the first metal layer 1122 will flow to the second dissipation layer 1123 outside the first metal layer 1122. At the same time, under the action of the proximity effect, another part of the high-frequency differential mode current will flow to the first dissipation layer 1121 inside the first metal layer 1122, automatically realizing the separation of the high-frequency differential mode current and the load current, thereby absorbing and dissipating the high-frequency interference signal through the first dissipation layer 1121 and the second dissipation layer 1123. It can be understood that the high-frequency differential-mode signal not absorbed by the first dissipation layer 1121 and the second dissipation layer 1123 is suppressed by the differential-mode capacitance layer 111, and the high-frequency common-mode signal not absorbed by the first dissipation layer 1121 and the second dissipation layer 1123 is suppressed by the common-mode suppression device 12 connected to the second metal layer 1124.

[0049] Further, the resistivity and magnetic permeability of the first dissipation layer 1121 and the second dissipation layer 1123 are the same, and the resistivity and magnetic permeability of the first metal layer 1122 and the second metal layer 1124 are the same. The resistivity of the first dissipation layer 1121 is less than the resistivity of the first metal layer 1122, and the magnetic permeability of the first dissipation layer 1121 is greater than the magnetic permeability of the first metal layer 1122. Preferably, the first dissipation layer 1121 and the second dissipation layer 1123 are made of the same material, and the first dissipation layer 1121 is made of nickel. The first metal layer 1122 and the second metal layer 1124 are made of the same material, and the first metal layer 1122 is made of copper. Thus, the first dissipation layer 1121 and the second dissipation layer 1123 can absorb and dissipate high-frequency interference signals, and convert high-frequency interference signals into heat consumption.

[0050] As an example, assuming that the conductivity of the first dissipative layer 1121 is σ, the magnetic permeability is μ, the frequency of the high-frequency interference signal is f, and the width of the first metal layer 1122 is t, the dissipation capacity of the first dissipative layer 1121 for the high-frequency interference signal can be represented by the impedance Z; wherein, It can be understood that the dissipation capacity of the second dissipation layer 1123 can also be represented by impedance Z, which will not be described in detail here.

[0051] In one embodiment, the differential mode capacitor layer 111 includes a first isolation layer 1111, a third metal layer 1112, a dielectric layer 1113, a fourth metal layer 1114 and a second isolation layer 1115 which are stacked in sequence; the first isolation layer 1111 and the second isolation layer 1115 are respectively connected to a busbar metal layer 112.

[0052] As an example, the first isolation layer 1111 and the second isolation layer 1115 are made of insulating materials. Optionally, the insulating material can be a polymer, ceramic or glass. In this example, the first isolation layer 1111 and the second isolation layer 1115 are used to prevent the high-frequency interference signal of the first dissipation layer 1121 in the busbar metal layer 112 from flowing to the third metal layer 1112 or the fourth metal layer 1114.

[0053] As an example, the material of the dielectric layer 1113 may be the same as the material of the first isolation layer 1111 or the second isolation layer 1115, or may be different from the material of the first isolation layer 1111 or the second isolation layer 1115. Preferably, the dielectric layer 1113 is made of a material with a dielectric constant greater than 2000 F / m. Exemplarily, the dielectric layer 1113 is ceramic.

[0054] As an example, the third metal layer 1112 and the fourth metal layer 1114 constitute the positive and negative electrodes of the differential mode capacitor. Preferably, the material of the third metal layer 1112 and the fourth metal layer 1114 is silver. It should be noted that the third metal layer 1112 and the first dissipative layer 1121 in the busbar metal layer 112 are connected at both ends of the first metal layer 1122 in the busbar metal layer 112, or the fourth metal layer 1114 and the first dissipative layer 1121 in the busbar metal layer 112 are connected at both ends of the first metal layer 1122 in the busbar metal layer 112.

[0055] As an example, in the filter 11 of this example, two busbar metal layers 112 are symmetrically arranged with the differential mode capacitor layer 111 as the center. Assume that the width of the first metal layer 1122 in each busbar metal layer 112 is t, the length of the first metal layer 1122 is l, the thickness of the dielectric layer 1113 in the differential mode capacitor layer 111 is d, the relative dielectric constant of the dielectric layer 1113 in the differential mode capacitor layer 111 is εr, the dielectric constant of the dielectric layer 1113 in the vacuum of the differential mode capacitor layer 111 is ε0, the equivalent differential mode capacitance of the differential mode capacitor layer 111 is Cdm, and the differential mode capacitance of the differential mode capacitor layer 111 is: In this example, the first dissipative layer 1121, the second dissipative layer 1123 and the differential mode capacitor layer 111 in the busbar metal layer 112 work together to suppress the differential mode signal.

[0056] During the operation of the filter 11, the load current is transmitted through the first metal layer 1122 in the busbar metal layer 112. The high-frequency common-mode current and high-frequency differential-mode current in the load current are concentrated in the first dissipation layer 1121 and the second dissipation layer 1123 due to the skin effect and the proximity effect. The first dissipation layer 1121 and the second dissipation layer 1123 through which the high-frequency common-mode current and the high-frequency differential-mode current flow respectively can be equivalent to differential-mode inductance and common-mode inductance to absorb and dissipate the high-frequency common-mode current and the high-frequency differential-mode current. At the same time, the high-frequency common-mode current and the high-frequency differential-mode current in the differential-mode capacitor layer 111 are respectively connected to the first dissipation layer 1121 and the second dissipation layer 1123. The high-frequency interference signal of the first isolation layer 1111 and the second isolation layer 1115 directly flows into the third metal layer 1112 and the fourth metal layer 1114 of the differential mode capacitor layer 111, driving it to flow through the first dissipation layer 1121 and the second dissipation layer 1123 first, and then flows to the third metal layer 1112 and the fourth metal layer 1114 through the end of the first metal layer 1122 in the busbar metal layer 112, achieving high dissipation of the first dissipation layer 1121 and the second dissipation layer 1123, and achieving the dual function of filtering of the differential mode capacitor layer 111. In addition, part of the high-frequency differential mode signal is reflected back to the source end through the differential mode capacitor layer 111, and part of the high-frequency common mode signal is transmitted to the ground through the common mode suppression device 12 connected to the busbar metal layer 112, thereby achieving the suppression of high-frequency interference signals.

[0057] This embodiment provides a filtering structure 1, such as Figure 1 and Figure 2 As shown, it includes two common-mode suppression devices 12 and the above-mentioned filter 11 ; each common-mode suppression device 12 is connected to a busbar metal layer 112 .

[0058] In this embodiment, the filtering structure 1 includes two common-mode suppression devices 12 and the above-mentioned filter 11; each common-mode suppression device 12 is connected to a busbar metal layer 112, replacing the stacked common-mode capacitor layer. By externally connecting the common-mode suppression device 12, the common-mode suppression device 12 is easy to modify, and at the same time, safety regulations can be guaranteed to avoid generating large leakage currents. In addition, the capacitance properties of the external common-mode suppression device 12 are more stable, avoiding the problem of mutual conversion between common-mode signals and differential-mode signals, thereby improving the electromagnetic interference suppression effect of the filtering structure 1.

[0059] In one embodiment, the common mode suppression device 12 includes a first capacitor, a first end of the first capacitor is connected to a busbar metal layer 112, and a second end of the first capacitor is grounded.

[0060] As an example, the first capacitor is a Y capacitor, the first end of the first capacitor is connected to the second metal layer 1124 in a busbar metal layer 112, and the second end of the first capacitor is grounded. In this example, the selection of the first capacitor can be selected according to the leakage current requirement and the common mode suppression requirement, which is not limited here. In this example, by connecting the first end of the first capacitor to a busbar metal layer 112 and the second end of the first capacitor to the ground, the high-frequency common mode signal is transmitted to the ground, thereby achieving high-frequency common mode signal suppression.

[0061] This embodiment provides a filter component, such as Figure 2 As shown, it includes a low-frequency filter circuit 2 and a filter structure 1; the filter structure 1 is used to connect the bus connection end to suppress high-frequency noise signals; the low-frequency filter circuit 2 is connected to the filter to suppress low-frequency noise signals.

[0062] In the filtering structure 1, when the high-frequency interference signal in the load current flows through the busbar metal layer, due to the skin effect and the proximity effect, the high-frequency interference signal can be absorbed and dissipated by the first dissipation layer 1121 and the second dissipation layer 1123 in the busbar metal layer, but the low-frequency interference signal in the load current cannot be suppressed.

[0063] Therefore, in this embodiment, the low-frequency filter circuit 2 is connected to two symmetrically arranged filter structures 1 to suppress low-frequency noise signals, so that the low-frequency filter circuit 2 can suppress the low-frequency interference signal flowing through, thereby achieving a wider bandwidth electromagnetic interference suppression effect through the cooperation of the low-frequency filter circuit 2 and the filter structure 1.

[0064] In one embodiment, the filter component includes two filter structures 1, which are symmetrically arranged, one filter structure 1 is used to connect the bus input end, and the other filter structure 1 is used to connect the bus output end; the low-frequency filter circuit 2 is arranged between the two symmetrically arranged filters 11.

[0065] The bus input end is used to connect to the power supply end, and the bus output end is used to connect to the load end.

[0066] In this embodiment, two filter structures 1 are symmetrically arranged, one filter structure 1 is used to connect the bus input end, and the other filter structure 1 is used to connect the bus output end; the low-frequency filter circuit 2 is arranged between the two symmetrically arranged filter structures 1, so that the two filter structures 1 are symmetrical with the low-frequency filter circuit 2 as the center, constructing a high impedance structure in the center and a low impedance structure at both ends to avoid impedance mismatch and ensure the filtering performance of the filter component.

[0067] In one embodiment, the low-frequency filter circuit 2 includes a common-mode inductor.

[0068] As an example, Figure 2As shown, the two filter structures 1 include a first filter structure and a second filter structure, the first filter structure is used to connect the bus input end, the second filter structure is used to connect the bus output end, the first filter structure includes a first bus metal layer (1122) and a second bus metal layer (1122), and the second filter structure includes a third bus metal layer (1122) and a fourth bus metal layer (1122). The first filter structure and the second filter structure are respectively arranged on the left and right sides of the low-frequency filter circuit 2. The common-mode inductor is a common-mode choke coil, the first input end of the common-mode choke coil is connected to the first bus metal layer, the second input end of the common-mode choke coil is connected to the second bus metal layer, the first output end of the common-mode choke coil is connected to the third bus metal layer, and the second output end of the common-mode choke coil is connected to the fourth bus metal layer. In this example, the common-mode inductor has a suppressive effect when a low-frequency interference signal flows through, but the high-frequency parasitic parameters reduce the suppressive effect of the common-mode inductor on the high-frequency interference signal. Therefore, the common-mode inductor and the filter structure 1 for suppressing high-frequency interference signals complement each other to achieve a wider bandwidth electromagnetic interference suppression effect.

[0069] This embodiment provides a filter circuit such as Figure 3 As shown, it includes a high-frequency filter circuit 3 and a low-frequency filter circuit 2; the high-frequency filter circuit 3 is used to connect the bus connection end to suppress high-frequency noise signals; the low-frequency filter circuit 2 is connected to the high-frequency filter circuit 3 to suppress low-frequency noise signals.

[0070] In this embodiment, the high-frequency filter circuit 3 is used to connect the bus connection end to suppress the high-frequency noise signal; the low-frequency filter circuit 2 is connected to the high-frequency filter circuit 3 to suppress the low-frequency noise signal, so that the filter circuit can achieve a wide-band electromagnetic interference suppression effect.

[0071] In one embodiment, the high-frequency filter circuit 3 includes a first high-frequency filter circuit 31 and a second high-frequency filter circuit 32; the input end of the first high-frequency filter circuit 31 is used to connect to the bus input end, the output end of the first high-frequency filter circuit 31 is connected to the input end of the low-frequency filter circuit 2, the output end of the low-frequency filter circuit 2 is connected to the input end of the second high-frequency filter circuit 32, and the output end of the second high-frequency filter circuit 32 is used to connect to the bus output end; wherein, the first high-frequency filter circuit 31 and the second high-frequency filter circuit 32 are used to suppress high-frequency noise signals, and the low-frequency filter circuit 2 is used to suppress low-frequency noise signals.

[0072] As an example, the first high-frequency filter circuit 31 and the second high-frequency filter circuit 32 can be equivalent to the two filter structures 1 in the above embodiment. In this embodiment, the low-frequency filter circuit 2 is arranged between the output end of the first high-frequency filter circuit 31 and the input end of the second high-frequency filter circuit 32, so that the low-frequency filter circuit 2 is used as the center to form a symmetrical structure at both ends of the first high-frequency filter circuit 31 and the second high-frequency filter circuit 32, which is convenient for impedance matching of the filter circuits. At the same time, the first high-frequency filter circuit 31 and the second high-frequency filter circuit 32 are used to suppress high-frequency noise signals, and the low-frequency filter circuit 2 is used to suppress low-frequency noise signals, so as to ensure the electromagnetic interference suppression effect of a wide band.

[0073] In one embodiment, the first high-frequency filter circuit 31 includes a first differential mode suppression circuit 311 and a first common mode suppression circuit 312; the input end of the first differential mode suppression circuit 311 is used to connect to the bus input end, and the output end of the first differential mode suppression circuit 311 is connected to the input end of the low-frequency filter circuit 2; the first end of the first common mode suppression circuit 312 is coupled to the first differential mode suppression circuit 311, and the second end of the first common mode suppression circuit 312 is grounded; the second high-frequency filter circuit 32 includes a second differential mode suppression circuit 321 and a second common mode suppression circuit 322; the input end of the second differential mode suppression circuit 321 is connected to the output end of the low-frequency filter circuit 2, and the output end of the second differential mode suppression circuit 321 is used to connect to the bus output end; the first end of the second common mode suppression circuit 322 is coupled to the second differential mode suppression circuit 321, and the second end of the second common mode suppression circuit 322 is grounded.

[0074] As an example, the first differential mode suppression circuit 311 includes a first inductor L1, a second inductor L2, and a second capacitor C1; the first end of the first inductor L1 is used to connect the first bus input end, and the second end of the first inductor L1 is connected to the first input end of the low-frequency filter circuit 2; the first end of the second inductor L2 is used to connect the second bus input end, and the second end of the first inductor L1 is connected to the second input end of the low-frequency filter circuit 2; the first end of the second capacitor C1 is connected to the second end of the first inductor L1, and the second end of the second capacitor C1 is connected to the second end of the second inductor L2. In this example, the first inductor L1 can be equivalent to the first dissipative layer 1121 and the second dissipative layer 1123 in a busbar metal layer 112, the second inductor L2 can be equivalent to the first dissipative layer 1121 and the second dissipative layer 1123 in another busbar metal layer 112, and the second capacitor C1 can be equivalent to the differential mode capacitor layer 111. In this example, the first inductor L1 , the second inductor L2 , and the second capacitor C1 cooperate to form an LC filter circuit for suppressing high-frequency differential mode signals.

[0075] As an example, the first common mode suppression circuit 312 includes a third capacitor C3 and a fourth capacitor C4, the first end of the third capacitor C3 is connected to any end of the first inductor L1, and the second end of the third capacitor C3 is grounded; the first end of the fourth capacitor C4 is connected to any end of the second inductor L2, and the second end of the fourth capacitor C4 is grounded. In this example, the connection position of the first end of the third capacitor C3 and the first end of the fourth capacitor C4 can be set according to the size of the internal resistance of the interference source. For example, when the internal resistance of the interference source is small, the first end of the third capacitor C3 is connected to the second end of the first inductor L1, and the first end of the fourth capacitor C4 is connected to the second end of the second inductor L2. When the internal resistance of the interference source is large, the first end of the third capacitor C3 is connected to the first end of the first inductor L1, and the first end of the fourth capacitor C4 is connected to the first end of the second inductor L2. In this embodiment, the first inductor L1, the second inductor L2, the third capacitor C3 and the fourth capacitor C4 are used to transmit the high-frequency common mode signal to the ground.

[0076] As an example, the second differential mode suppression circuit 321 includes a third inductor L4, a fourth inductor L5 and a fifth capacitor C2; the first end of the third inductor L4 is connected to the first output end of the low-frequency filter circuit 2, and the second end of the third inductor L4 is used to connect the first bus output end; the first end of the fourth inductor L5 is connected to the second output end of the low-frequency filter circuit 2, and the second end of the fourth inductor L5 is used to connect the second bus output end; the first end of the fifth capacitor C2 is connected to the first end of the third inductor L4, and the second end of the fifth capacitor C2 is connected to the first end of the fourth inductor L5. In this example, the third inductor L4 can be equivalent to the first dissipative layer 1121 and the second dissipative layer 1123 in a busbar metal layer 112, the fourth inductor L5 can be equivalent to the first dissipative layer 1121 and the second dissipative layer 1123 in another busbar metal layer 112, and the fifth capacitor C2 can be equivalent to the differential mode capacitor layer 111. In this example, the third inductor L4, the fourth inductor L5 and the fifth capacitor C2 cooperate to form an LC filter circuit for suppressing high-frequency differential mode signals.

[0077] As an example, the second common mode suppression circuit 322 includes a sixth capacitor C5 and a seventh capacitor C6; the first end of the sixth capacitor C5 is connected to any end of the third inductor L4, and the second end of the sixth capacitor C5 is grounded; the first end of the seventh capacitor C6 is connected to any end of the fourth inductor L5, and the second end of the seventh capacitor C6 is grounded. In this example, the connection position of the first end of the sixth capacitor C5 and the first end of the seventh capacitor C6 can be set according to the size of the internal resistance of the interference source. For example, when the internal resistance of the interference source is small, the first end of the sixth capacitor C5 is connected to the first end of the third inductor L4, and the first end of the seventh capacitor C6 is connected to the first end of the fourth inductor L5. When the internal resistance of the interference source is large, the first end of the sixth capacitor C5 is connected to the second end of the third inductor L4, and the first end of the seventh capacitor C6 is connected to the second end of the fourth inductor L5. In this embodiment, the third inductor L4, the fourth inductor L5, the sixth capacitor C5 and the seventh capacitor C6 are used to transmit the high-frequency common mode signal to the ground.

[0078] Furthermore, the low-frequency filtering circuit 2 includes a common-mode inductor L3 for suppressing low-frequency noise signals.

[0079] This embodiment provides an electronic device, including the above-mentioned filter component.

[0080] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A filter, characterized in that: include: Differential mode capacitor layer; A busbar metal layer, the busbar metal layer is symmetrically arranged on both sides of the differential mode capacitor layer, and the busbar metal layer is used to connect a common mode suppression device; The differential mode capacitor layer is used to cooperate with the busbar metal layer to form a differential mode suppression circuit; The busbar metal layer includes a second metal layer, and the second metal layer is used for connecting the common mode suppression device.

2. The filter according to claim 1, characterized in that The busbar metal layer further includes a dissipation layer, and the dissipation layer is stacked between the second metal layer and the differential mode capacitor layer.

3. The filter according to claim 2, characterized in that The dissipation layer comprises a first dissipation layer, a first metal layer and a second dissipation layer which are stacked in sequence; The first dissipative layer is adjacent to the differential mode capacitance layer; The first metal layer is used to connect the busbar connection end; The second dissipation layer is adjacent to the second metal layer.

4. The filter according to claim 1, characterized in that The differential mode capacitor layer includes a third metal layer, a dielectric layer and a fourth metal layer which are stacked in sequence.

5. The filter according to claim 4, characterized in that The differential mode capacitor layer further includes a first isolation layer and a second isolation layer, wherein the first isolation layer and the second isolation layer are respectively connected to one of the busbar metal layers.

6. The filter according to any one of claims 1 to 5, characterized in that: It comprises two busbar metal layers, which are symmetrically arranged on both sides of the differential mode capacitor layer, and each busbar metal layer is used to connect a common mode suppression device.

7. A filtering structure, characterized in that: A common mode suppression device and a filter as claimed in any one of claims 1 to 6; The common mode suppression device is connected to the busbar metal layers in a one-to-one correspondence.

8. The filtering structure according to claim 7, characterized in that: The common mode suppression device comprises a first capacitor, a first end of the first capacitor is connected to one of the busbar metal layers, and a second end of the first capacitor is grounded.

9. A filter component, characterized in that: Comprising a low-frequency filtering circuit and a filtering structure as claimed in claim 7 or 8; The filtering structure is used to connect the bus connection end to suppress high-frequency noise signals; The low-frequency filter circuit is connected to the filter structure and is used to suppress low-frequency noise signals.

10. The filter assembly according to claim 9, characterized in that It comprises two filtering structures, which are symmetrically arranged, one filtering structure is used to connect to the bus input end, and the other filtering structure is used to connect to the bus output end; The low-frequency filter circuit is arranged between the two symmetrically arranged filter structures.

11. The filter assembly according to claim 9, characterized in that The low-frequency filtering circuit includes a common-mode inductor.

12. An electronic device, characterized in that: Comprising the filter component as claimed in any one of claims 9 to 11.

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