Microfluidic chip pressure-resistant packaging method and device

Abstract

The application discloses a micro-fluidic chip pressure-resistant packaging method, which comprises the following steps: step 1, cleaning the micro-fluidic chip; step 2, bonding the bolt joint with the micro-fluidic chip; step 3, placing the connecting body in the silica gel mold, so that the bolt joint is located at the upper part and the micro-fluidic chip is kept horizontal; step 4, uniformly mixing the crystal drop glue; step 5, pouring the uniformly mixed crystal drop glue into the silica gel mold; step 6, using a hot air gun to sweep along the surface of the silica gel mold; step 7, completely covering the silica gel mold with a clean plastic film, so that the crystal drop glue is naturally solidified at room temperature; and step 8, after the solidification is completed, the silica gel mold is taken off. Without using a high-pressure bin, the micro-fluidic chip can bear 40MPa internal fluid pressure, the cost is greatly reduced compared with the high-pressure bin, and the high transparency of the crystal drop glue does not affect the direct observation of the fluid movement in the micro-channel.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of microfluidic chips, and particularly relates to a microfluidic chip pressure-resistant packaging method and device. BACKGROUND

[0002] In oil reservoir engineering, crude oil property analysis, oil production and enhanced oil recovery, microfluidic technology plays a key role. High-pressure microfluidic technology is a branch of microfluidic technology, which mainly combines high-pressure operating conditions to precisely control and manipulate high-pressure fluids in micron-scale channels using a microfluidic chip platform. This technology breaks through the limitations of conventional microfluidic systems due to insufficient fluid power, and is particularly suitable for biochemical reactions, nanoparticle synthesis, oil sample analysis, and deep-sea geological fluid simulation applications that require larger pressure driving.

[0003] Currently, in high-pressure microfluidic systems, the core components include high-pressure chambers, microfluidic chips, and corresponding pressure control and detection elements. The main function of the high-pressure chamber is to provide confining pressure to protect the microfluidic chip from damage caused by excessive internal and external pressure differences. However, the high-pressure chamber has high manufacturing costs, and the high-pressure chamber itself can block part or all of the microfluidic chip due to its physical volume, especially when the observation window is set near the microfluidic chip. The high-pressure chamber can hinder the direct illumination of the light source to the inside of the chip, affecting the direct observation of the fluid movement in the microchannel by the microscope or other optical detection equipment.

[0004] Based on the above defects of the high-pressure chamber, the present application proposes a microfluidic chip pressure-resistant packaging method and device, which enables the microfluidic chip to withstand an internal fluid pressure of 40MPa without using a high-pressure chamber, and has low cost and does not affect the direct observation of fluid movement in the microchannel. SUMMARY

[0005] The purpose of the present application is to overcome the shortcomings of the prior art and provide a microfluidic chip pressure-resistant packaging method and device.

[0006] To achieve the above purpose, the present application adopts the following technical solutions:

[0007] A microfluidic chip pressure-resistant packaging method, comprising the following steps:

[0008] Step 1: washing the microfluidic chip;

[0009] Step 2: aligning the internal channel of the bolt joint with the inlet and outlet of the microfluidic chip, and bonding the bolt joint and the microfluidic chip with epoxy resin adhesive;

[0010] Step 3: Place the connector composed of the bolt joint and the microfluidic chip in the silica gel mold, and support the bottom end of the four corners of the microfluidic chip, so that the bolt joint is located at the upper part and the microfluidic chip is kept horizontal;

[0011] Step 4: Mix the crystal drop glue evenly;

[0012] Step 5: Pour the mixed crystal drop glue into the silica gel mold until the crystal drop glue liquid surface is higher than the upper surface of the microfluidic chip and the distance between the crystal drop glue liquid surface and the upper surface of the microfluidic chip reaches the set distance;

[0013] Step 6: Use a hot air gun to sweep along the surface of the silica gel mold to remove the bubbles generated on the surface of the crystal drop glue;

[0014] Step 7: Cover the silica gel mold completely with a clean plastic film to allow the crystal drop glue to solidify naturally at room temperature;

[0015] Step 8: After solidification, remove the silica gel mold, and the solidified crystal drop glue forms a pressure-resistant body.

[0016] Preferably, in step 2, the epoxy adhesive is LOCTITE EA E-60HP epoxy structural adhesive.

[0017] Preferably, the bolt joint comprises a first joint and a second joint, an external thread for connecting a pipeline is arranged on the outer wall surface of the upper end of the first joint, an internal thread is arranged on the inner wall surface of the lower end of the first joint, an external thread matched with the internal thread of the lower end of the first joint is arranged on the outer wall surface of the upper end of the second joint, and an internal passage is arranged in the middle part of the first joint and the second joint.

[0018] Preferably, the outer wall surface of the lower end of the second joint is in the shape of a circular truncated cone, and the small end of the circular truncated cone faces the first joint.

[0019] Preferably, the bottom end of the second joint is provided with a sealing ring clamping groove in the shape of a ring, and an O-ring is clamped in the sealing ring clamping groove.

[0020] The central axis of the sealing ring clamping groove is collinear with the central axis of the internal passage.

[0021] Preferably, in step 2, the method for bonding the bolt joint and the microfluidic chip by using the epoxy adhesive is as follows:

[0022] Apply the mixed epoxy adhesive to the bottom end of the second joint and wait for half an hour at room temperature;

[0023] Align the internal passage of the bolt joint with the inlet and outlet of the microfluidic chip for bonding, and then wait for one hour at room temperature for complete solidification.

[0024] Preferably, in step 3, four stainless steel cylinders are placed at the bottom of the four corners of the microfluidic chip to support.

[0025] Preferably, in step 4, the water crystal glue is produced by Dongguan Feidi Process Material Co., Ltd., and the model is FD-1113.

[0026] Preferably, in step 4, the method for uniformly mixing the water crystal glue includes the following steps:

[0027] Step 41: A measuring cup is used to measure the A component and the B component of the water crystal glue in a volume ratio of 3:1;

[0028] Step 42: Pour the A component into a clean container, slowly pour the B component, and use a stirring rod to start stirring when pouring the B component, and stir until the mixture can pull out a thin filament;

[0029] Step 43: Add ethanol as a defoaming agent to the mixture of the water crystal glue, and continuously stir during the addition of ethanol to fully mix the ethanol with the mixture;

[0030] Step 44: Place the stirred mixture after adding ethanol in a dust-free environment for 30 minutes.

[0031] The application also provides a microfluidic chip pressure-resistant packaging device.

[0032] A microfluidic chip pressure-resistant packaging device is prepared by a microfluidic chip pressure-resistant packaging method.

[0033] The beneficial effects of the application are:

[0034] The microfluidic chip pressure-resistant packaging device prepared by the method of the application can withstand an internal fluid pressure of 40MPa without using a high-pressure bin, greatly reducing the cost compared to a high-pressure bin, and the high transparency of the water crystal glue does not affect the direct observation of fluid movement in the microchannel; the inlet and outlet of the microfluidic chip are packaged with a threaded joint made of stainless steel, which is suitable for connection with most pumps, and the application is suitable for secondary pressure-resistant packaging of new commercial microfluidic chips and idle microfluidic chips. The packaging process does not involve bonding, so there is no need to worry about damaging the internal structure of the chip, the packaging process is simple, and the operation is simple. BRIEF DESCRIPTION OF DRAWINGS

[0035] The drawings accompanying the specification of this application are used to provide a further understanding of the application, the illustrative embodiments of the application and their descriptions serve to explain the application, and do not constitute an improper limitation on the application.

[0036] Figure 1 is a structural schematic diagram of the microfluidic chip pressure-resistant packaging device of the application;

[0037] Wherein:

[0038] 1 - internal channel, 2 - O-ring, 3 - first joint, 4 - second joint, 5 - pressure-resistant body. DETAILED DESCRIPTION

[0039] It should be noted that the following detailed description is illustrative only and is intended to provide further description of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0040] It is to be understood that the terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0041] In the present application, the terms such as "upper", "lower", "bottom", "top" and the like indicate the orientation or positional relationship shown in the drawings, which are only the relationship words determined for the purpose of describing the structural relationship of the components or elements of the present application, and are not intended to specify any component or element in the present application, and cannot be understood as a limitation of the present application.

[0042] In the present application, the terms such as "connected", "connected" and the like should be understood broadly, which means that it can be fixedly connected, integrally connected or detachably connected; it can be directly connected or indirectly connected through an intermediate medium. For relevant researchers or technicians in the art, the specific meaning of the above terms in the present application can be determined according to the specific circumstances, and cannot be understood as a limitation of the present application.

[0043] The present application will be further described below in conjunction with the drawings and examples.

[0044] Example 1:

[0045] A microfluidic chip pressure-resistant packaging method, comprising the following steps:

[0046] Step 1: washing treatment of the microfluidic chip;

[0047] Specifically, in step 1, the method for washing treatment of the microfluidic chip is:

[0048] Step 11: pretreatment;

[0049] The surface dust of the microfluidic chip is wiped off using a lens cleaning paper, and then the residual impurities on the surface of the microfluidic chip are blown off using an ear bulb.

[0050] In the pretreatment process, avoid scratching the surface of the microfluidic chip;

[0051] Step 12: solvent cleaning;

[0052] Put the microfluidic chip into a container containing petroleum ether for solvent cleaning;

[0053] Petroleum ether can effectively remove grease and some organic pollutants. Considering the secondary packaging of idle microfluidic chips, the residual organic substances in the previous use are cleaned by petroleum ether;

[0054] Step 13: ultrasonic cleaning;

[0055] Soak the microfluidic chip in petroleum ether and put it into an ultrasonic cleaner for ultrasonic cleaning;

[0056] During ultrasonic cleaning, the shock wave generated by the collapse of bubbles produced by high-frequency sound waves is used to remove contaminants on the surface of the microfluidic chip and in the microchannel;

[0057] Specifically, in step 13, the ultrasonic cleaning time is 30 minutes;

[0058] Step 14: deionized water flushing;

[0059] Remove the residual petroleum ether on the microfluidic chip, and then put the microfluidic chip into a plasma machine for plasma discharge treatment;

[0060] The plasma machine uses PTL-VM500 vacuum plasma surface treatment machine;

[0061] Step 15: drying treatment;

[0062] Put the microfluidic chip into an oven for heating and drying;

[0063] Step 16: observe the cleaning effect;

[0064] Use an optical microscope to inspect the surface of the microfluidic chip. If there are residues or the microfluidic chip is not completely dried, go to step 11;

[0065] Otherwise, go to step 2.

[0066] Step 2: align the inner channel 1 of the bolt joint with the inlet and outlet of the microfluidic chip, and use epoxy adhesive to bond the bolt joint and the microfluidic chip;

[0067] Specifically, in step 2, the epoxy adhesive uses LOCTITE EA E-60HP epoxy structural adhesive.

[0068] Specifically, the bolt joint comprises a first joint 3 and a second joint 4, an outer thread for connecting a pipeline is arranged on the upper end outer wall surface of the first joint 3, an inner thread is arranged on the lower end inner wall surface of the first joint 3, an outer thread matched with the inner thread of the lower end of the first joint 3 is arranged on the upper end outer wall surface of the second joint 4, and an internal passage 1 is arranged in the middle part of the first joint 3 and the second joint 4.

[0069] Preferably, the lower end outer wall surface of the second joint 4 is in a circular truncated cone structure, and the small end of the circular truncated cone structure faces the first joint 3. After the crystal glue is poured, the circular truncated cone structure of the lower end outer wall surface of the second joint 4 forms a mortise-tenon structure, which reinforces the connection between the bolt joint and the microfluidic chip.

[0070] Specifically, the angle between the generatrix and the central axis in the circular truncated cone structure of the lower end outer wall surface of the second joint 4 is 15°.

[0071] Specifically, the bottom end of the second joint 4 is provided with a sealing ring clamping groove in a ring structure, and an O-ring 2 is clamped in the sealing ring clamping groove.

[0072] The central axis of the sealing ring clamping groove is collinear with the central axis of the internal passage 1.

[0073] Specifically, the O-ring 2 has an outer diameter of 3 mm, an inner diameter of 1 mm, and a height of 1 mm. The inner diameter of the O-ring 2 is greater than the diameter of the internal passage 1.

[0074] Specifically, in step 2, the method for bonding the bolt joint and the microfluidic chip by using the epoxy resin adhesive is as follows:

[0075] The uniformly mixed epoxy resin adhesive is applied to the bottom end of the second joint 4, and the room temperature is waited for half an hour. At this time, the epoxy resin adhesive is in a semi-dry state, that is, it maintains its viscosity and is in a semi-solid state, and will not block the internal passage 1 of the bolt joint. The O-ring 2 is not coated with the epoxy resin adhesive.

[0076] The internal passage 1 of the bolt joint is aligned with the inlet and outlet of the microfluidic chip for bonding, and then the room temperature is waited for one hour to make it completely solidified.

[0077] Step 3: Place the connection body composed of the bolt joint and the microfluidic chip in the silica gel mold, and support the four corner bottom ends of the microfluidic chip, so that the bolt joint is located at the upper part and the microfluidic chip remains horizontal.

[0078] Specifically, in step 3, four stainless steel cylinders are placed at the four corner bottom ends of the microfluidic chip for support.

[0079] Specifically, the diameter of the stainless steel cylinder is 3.5 mm, and the height is 5 mm.

[0080] Step 4: Mix the water crystal drop glue evenly;

[0081] Specifically, in the step 4, the water crystal drop glue is produced by Dongguan Feidi Process Material Co., Ltd., and the model is FD-1113.

[0082] Specifically, in the step 4, the method for mixing the water crystal drop glue evenly includes the following steps:

[0083] Step 41: Use a measuring cup to measure the A component and the B component in the water crystal drop glue in a volume ratio of 3:1 respectively;

[0084] Step 42: Pour the A component into a clean container, slowly pour the B component, and use a stirring rod to start stirring when pouring the B component, and stir until the mixture can pull out a thin filament, indicating that the A component and the B component of the water crystal drop glue have been fully mixed;

[0085] Step 43: Add ethanol as a defoaming agent to the mixture of the water crystal drop glue, and continuously stir during the addition of ethanol to fully mix the ethanol with the mixture;

[0086] Specifically, in the step 43, the mass ratio of ethanol to the mixture is 1:10.

[0087] Step 44: Place the stirred mixture after adding ethanol in a dust-free environment for 30 minutes to allow the bubbles to rise and break and disappear.

[0088] Step 5: Pour the mixed water crystal drop glue into the silicone mold until the water crystal drop glue liquid surface is higher than the upper surface of the microfluidic chip and the distance between the water crystal drop glue liquid surface and the upper surface of the microfluidic chip reaches a set distance;

[0089] Specifically, in the step 5, the set distance is 5mm.

[0090] Step 6: Use a heat gun to sweep along the surface of the silicone mold to remove the bubbles generated on the surface of the water crystal drop glue;

[0091] Step 7: Completely cover the silicone mold with a clean plastic film to allow the water crystal drop glue to naturally solidify at room temperature for 12 hours;

[0092] Step 8: After solidification, remove the silicone mold, and the solidified water crystal drop glue forms a pressure-resistant body 5.

[0093] Wherein, the surface of the solidified water crystal drop glue can be polished or polished to obtain a smoother surface.

[0094] Example 2:

[0095] As Figure 1As shown, a microfluidic chip pressure-resistant packaging device is prepared by using the microfluidic chip pressure-resistant packaging method in Embodiment 1.

[0096] The microfluidic chip pressure-resistant packaging device in the application can make the microfluidic chip bear 40 MPa internal fluid pressure without using a high-pressure bin, greatly reduces the cost relative to the high-pressure bin, and the high transparency of the crystal drop glue does not affect the direct observation of the fluid movement in the microchannel. The inlet and outlet of the microfluidic chip are packaged with a stainless steel threaded joint in the application, which is suitable for connection of most pumps, and the application is suitable for secondary pressure-resistant packaging of new microfluidic chips and idle microfluidic chips. The packaging process does not involve a bonding process, so there is no need to worry about damaging the internal structure of the chip, the packaging process is simple, and the operation is simple.

[0097] Although the specific embodiments of the application are described above with reference to the drawings, the application is not limited thereto. Those skilled in the art should understand that various modifications or changes made on the basis of the technical solutions of the application without creative labor are still within the protection scope of the application.

Claims

1. A method for packaging a microfluidic chip with high voltage resistance, characterized in that, Includes the following steps: Step 1: Clean the microfluidic chip; Step 2: Align the internal channel of the bolt joint with the inlet and outlet of the microfluidic chip, and use epoxy resin adhesive to bond the bolt joint to the microfluidic chip; Step 3: Place the connector consisting of the bolt joint and the microfluidic chip in the silicone mold, and support the four bottom corners of the microfluidic chip so that the bolt joint is on top and the microfluidic chip is kept horizontal; Step 4: Mix the crystal epoxy resin evenly; Step 5: Pour the well-mixed crystal epoxy resin into the silicone mold until the surface of the crystal epoxy resin is higher than the surface of the microfluidic chip and the distance between the surface of the crystal epoxy resin and the surface of the microfluidic chip reaches the set distance. Step 6: Use a hot air gun to sweep along the surface of the silicone mold to remove air bubbles generated on the surface of the crystal epoxy resin; Step 7: Completely cover the silicone mold with a clean plastic film and allow the crystal epoxy resin to cure naturally at room temperature; Step 8: After curing, remove the silicone mold; the cured crystal epoxy resin forms a pressure-resistant body. The bolted joint includes a first joint and a second joint. The upper outer wall of the first joint is provided with an external thread for connecting a pipe, and the lower inner wall of the first joint is provided with an internal thread. The upper outer wall of the second joint is provided with an external thread that matches the lower internal thread of the first joint. Both the first joint and the second joint are provided with an internal channel in the middle.

2. The microfluidic chip pressure-resistant packaging method as described in claim 1, characterized in that, In step 2, the epoxy resin adhesive used is LOCTITE EA E-60HP epoxy structural adhesive.

3. The microfluidic chip pressure-resistant packaging method as described in claim 1, characterized in that, The lower outer wall of the second connector has a frustum structure, with the small end of the frustum structure facing the first connector.

4. The microfluidic chip pressure-resistant packaging method as described in claim 3, characterized in that, The bottom end of the second connector is provided with a sealing ring groove with an annular structure, and an O-ring is clamped in the sealing ring groove; The central axis of the sealing ring groove is collinear with the central axis of the internal channel.

5. The microfluidic chip pressure-resistant packaging method as described in claim 2, characterized in that, In step 2, the method of bonding the bolt joint to the microfluidic chip using epoxy resin adhesive is as follows: Apply the well-mixed epoxy resin adhesive to the bottom of the second joint and wait at room temperature for half an hour. Align and bond the internal channels of the bolt joint with the inlet and outlet of the microfluidic chip, then wait at room temperature for one hour to allow it to fully cure.

6. The microfluidic chip pressure-resistant packaging method as described in claim 1, characterized in that, In step 3, four stainless steel cylinders are placed at the four corners of the microfluidic chip for support.

7. The microfluidic chip pressure-resistant packaging method as described in claim 1, characterized in that, In step 4, the method for uniformly mixing the crystal epoxy resin includes the following steps: Step 41: Use a measuring cup to measure component A and component B of the crystal epoxy resin in a volume ratio of 3:1; Step 42: Pour component A into a clean container, slowly pour in component B, and start stirring with a stirring rod while pouring in component B until the mixture can be pulled into thin strands; Step 43: Add ethanol as an antifoaming agent to the crystal epoxy resin mixture, and stir continuously during the addition of ethanol to ensure that the ethanol is fully mixed with the mixture. Step 44: Place the mixture after adding ethanol and stirring in a dust-free environment and let it stand for 30 minutes.

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