Sonar receiving electronic cabin, receiving device and assembly method thereof

Abstract

The present invention discloses a sonar receiving electronic cabin, a receiving device and an assembly method thereof, and relates to the field of underwater detection technology, wherein the assembly method comprises the following steps: (a) accommodating a receiving mainboard in a accommodating cavity of a bottom shell through a bottom shell opening of the bottom shell to obtain an electronic module, wherein an output flexible board with one end connected to the receiving mainboard extends to the outside of the bottom shell through a side notch of the bottom shell; (b) covering the bottom shell of the electronic module with a top cover so that the bottom shell opening of the bottom shell is closed by the top cover; (c) bending the output flexible board so that an output hard board connected to the other end of the output flexible board is overlapped on the top cover to obtain the receiving device.

Description

Technical Field

[0001] The invention relates to a sonar, belonging to the technical field of underwater detection, and in particular to a sonar receiving electronic cabin, a receiving device and an assembling method thereof. Background Art

[0002] The receiving electronic cabin is one of the main components of the sonar, which is connected to the receiving array of the sonar's transceiver array to realize the reception and amplification of echo signals, signal conditioning, data processing, etc. The existing receiving electronic cabin directly installs the receiving main board in the electronic cabin. For example, in the Chinese invention patent application with the announcement number CN117930248A, the peripheral wall of the electronic cabin is provided with extension columns, and slots are formed between the extension columns. The opposite sides of the circuit board are inserted into the slots from top to bottom, so that the receiving main board (circuit board) is directly installed in the electronic cabin, and the middle part of the receiving main board is suspended in the electronic cabin. The defects of this method are: first, the end of each receiving mainboard is a stress point. Since the circuit of each receiving mainboard is relatively fragile and the middle of the circuit board is suspended, when assembling the receiving electronic cabin, if the installed receiving mainboard is subjected to a slight collision, it may cause the receiving mainboard to deform significantly and affect the circuit of the circuit board, and even cause a short circuit; secondly, the heat generated by the chip on each receiving mainboard during operation needs to be radiated to the internal space of the electronic cabin first, and then to the electronic cabin, and then the heat is exchanged between the electronic cabin and the external environment to achieve heat dissipation, resulting in low heat dissipation efficiency and affecting the heat dissipation capacity of the receiving electronic cabin, thereby affecting the performance of the sonar. Summary of the invention

[0003] An object of the present invention is to provide a sonar receiving electronic cabin, a receiving device and an assembly method thereof, wherein the receiving device adopts a modular design, and more than two electronic modules can be stacked to form the receiving device to meet the performance requirements of the receiving device.

[0004] One object of the present invention is to provide a sonar receiving electronic cabin, a receiving device and an assembly method thereof, wherein the receiving device adopts a modular design, and a receiving mainboard is hidden between a top cover and a bottom shell, so that when the receiving electronic cabin is subsequently assembled, the receiving mainboard can be avoided from being collided, so as to ensure the reliability of the receiving mainboard.

[0005] One object of the present invention is to provide a sonar receiving electronic cabin, a receiving device and an assembly method thereof, wherein the receiving mainboard, the top cover and the bottom shell can have a smaller distance between them, so that the heat generated by the receiving mainboard during operation can be quickly radiated to the top cover and the bottom shell to achieve rapid heat dissipation of the receiving device.

[0006] One object of the present invention is to provide a sonar receiving electronic cabin, a receiving device and an assembly method thereof. Since the receiving device adopts a modular design, the receiving mainboard can be hidden between the top cover and the bottom shell, so that when the receiving electronic cabin is subsequently assembled, the top cover can be pressed against the inner wall of the electronic cabin without worrying about damaging the receiving mainboard. By allowing the top cover and the electronic cabin to fit tightly, the heat radiated to the top cover can be directly conducted to the electronic cabin, which is conducive to achieving rapid heat dissipation of the receiving electronic cabin.

[0007] According to one aspect of the present invention, the present invention provides an assembling method of a receiving device, wherein the assembling method comprises the following steps:

[0008] (a) accommodating a receiving mainboard in a receiving cavity of a bottom shell through a bottom shell opening of the bottom shell to obtain an electronic module, wherein a lead-out flexible board having one end connected to the receiving mainboard extends to the outside of the bottom shell through a side notch of the bottom shell;

[0009] (b) providing a top cover on the bottom shell of the electronic module so that the bottom shell opening of the bottom shell is closed by the top cover; and

[0010] (c) The lead-out flexible plate is bent so that a lead-out rigid plate connected to the other end of the lead-out flexible plate is overlapped with the top cover to obtain the receiving device.

[0011] According to an embodiment of the present invention, before step (b), the assembly method further comprises the step of: accommodating at least one heat-conducting element in the accommodating cavity of the bottom shell, wherein the middle portion of the heat-conducting element is adjacent to or attached to the chip of the receiving motherboard.

[0012] According to one embodiment of the present invention, before the step (b), the assembly method further comprises the step of: stacking one electronic module on another electronic module, wherein the bottom shell of the electronic module located above closes the bottom shell opening of the bottom shell of the electronic module located below, and in the step (b), the top cover is covered on the bottom shell of the electronic module located above.

[0013] According to one embodiment of the present invention, after step (b), the electronic module covered with the top cover is stacked on top of another electronic module, and the bottom shell opening of the bottom shell of another electronic module is closed by the bottom shell of the electronic module covered with the top cover.

[0014] According to an embodiment of the present invention, before the step (c), glue is poured into the receiving cavity of the bottom shell through the side notch of the bottom shell.

[0015] According to an embodiment of the present invention, before the step (c), glue is poured into the receiving cavity of each bottom shell through the side notch of each bottom shell.

[0016] According to an embodiment of the present invention, during the glue pouring process, the glue poured into the receiving cavity of the bottom shell of one electronic module is allowed to flow into the receiving cavity of the bottom shell of another electronic module.

[0017] According to one embodiment of the present invention, after step (c), the assembly method further comprises the steps of:

[0018] (d) overlapping one end of a connecting flexible board on the leading-out rigid board, and conducting the connecting flexible board and the leading-out rigid board;

[0019] (e) The cover plate is mounted on the top cover in such a manner that the cover plate and the top cover clamp the connecting flexible board and the leading-out rigid board.

[0020] According to another aspect of the present invention, the present invention further provides a receiving device for assembling a receiving electronic cabin, wherein the receiving device comprises a top cover and at least one electronic module, wherein the electronic module further comprises:

[0021] A bottom shell, wherein the bottom shell has a receiving cavity and a bottom shell opening and at least one side notch respectively connected to the receiving cavity; and

[0022] An export circuit board, wherein the export circuit board includes a receiving main board, an export flexible board and an export hard board, the opposite ends of the export flexible board are respectively connected to the receiving main board and the export hard board, wherein the receiving main board is received in the receiving cavity of the bottom shell through the bottom shell opening of the bottom shell, the export flexible board extends to the outside of the bottom shell through the side notch of the bottom shell, the top cover is covered on the bottom shell to close the bottom shell opening of the bottom shell, and after the export flexible board is bent, the export hard board is stacked on the top cover.

[0023] According to one embodiment of the present invention, the electronic module further comprises at least one heat-conducting element, opposite ends of the heat-conducting element are respectively placed against the bottom shell, and the middle portion of the heat-conducting element is adjacent to or attached to the chip of the receiving motherboard.

[0024] According to an embodiment of the present invention, two opposite ends of the bottom shell respectively have at least one positioning groove, and the end of the heat conducting element is positioned in the positioning groove of the bottom shell.

[0025] According to an embodiment of the present invention, the number of the electronic modules is two, the two electronic modules are stacked, and the bottom case of the upper electronic module closes the bottom case opening of the bottom case of the lower electronic module.

[0026] According to one embodiment of the present invention, the bottom shell of the electronic module located above has at least one connecting channel, and the connecting channel connects the receiving cavity of the bottom shell of the electronic module located above and the receiving cavity of the bottom shell of the electronic module located below.

[0027] According to one embodiment of the present invention, the receiving device further includes a connecting circuit board and a cover plate, the connecting circuit board includes a connecting flexible board and a connecting hard board arranged at one end of the connecting flexible board, the other end of the connecting flexible board is stacked on the exporting hard board, and the connecting flexible board and the exporting hard board are connected, the cover plate is installed on the top cover, and the cover plate and the bottom cover clamp the connecting flexible board and the exporting hard board.

[0028] According to another aspect of the present invention, the present invention further provides a sonar receiving electronic cabin, which comprises an electronic cabin and a receiving device arranged in the cabin space of the watertight cabin, wherein the receiving device comprises a top cover and at least one electronic module, wherein the electronic module further comprises:

[0029] A bottom shell, wherein the bottom shell has a receiving cavity and a bottom shell opening and at least one side notch respectively connected to the receiving cavity; and

[0030] An export circuit board, wherein the export circuit board includes a receiving main board, an export flexible board and an export hard board, the opposite ends of the export flexible board are respectively connected to the receiving main board and the export hard board, wherein the receiving main board is received in the receiving cavity of the bottom shell through the bottom shell opening of the bottom shell, the export flexible board extends to the outside of the bottom shell through the side notch of the bottom shell, the top cover is covered on the bottom shell to close the bottom shell opening of the bottom shell, and after the export flexible board is bent, the export hard board is stacked on the top cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a three-dimensional schematic diagram of one of the assembly processes of a receiving device according to a preferred embodiment of the present invention.

[0032] Figure 2 It is a three-dimensional schematic diagram of the second assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0033] Figure 3 It is a three-dimensional schematic diagram of the third assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0034] Figure 4 It is a three-dimensional schematic diagram of the fourth assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0035] Figure 5 It is a three-dimensional schematic diagram of the fifth assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0036] Figure 6 It is a three-dimensional schematic diagram of the sixth assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0037] Figure 7 It is a three-dimensional schematic diagram of the seventh assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0038] Figure 8 It is a three-dimensional schematic diagram of the eighth assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0039] Figures 9 to 11 They are three-dimensional schematic diagrams of nine assembly processes of the receiving device according to the above preferred embodiments of the present invention, which respectively show the three-dimensional states of the receiving device at different viewing angles.

[0040] Fig.12 It is a schematic diagram of an exploded view of the receiving device according to the above preferred embodiment of the present invention from one perspective.

[0041] Fig.13 It is a schematic diagram of an exploded view of the receiving device according to the above preferred embodiment of the present invention from another perspective.

[0042] Fig.14 It is a schematic diagram of another perspective of the receiving device according to the above preferred embodiment of the present invention.

[0043] Fig.15 It is a cross-sectional schematic diagram of a position of the receiving device according to the above preferred embodiment of the present invention.

[0044] Fig.16 It is a cross-sectional schematic diagram of another position of the receiving device according to the above preferred embodiment of the present invention.

[0045] Fig.17 It is a cross-sectional schematic diagram of a position of a receiving electron cabin according to a preferred embodiment of the present invention.

[0046] Fig.18It is a cross-sectional schematic diagram of another position of the receiving electronics cabin according to the above preferred embodiment of the present invention.

[0047] Fig.19 It is a cross-sectional schematic diagram of another position of the receiving electron cabin according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0048] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0049] Furthermore, on the first aspect, in the disclosure of the present invention, the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0050] With reference to the accompanying drawings of the present invention Figures 1 to 16A receiving device 100 of a sonar receiving electronic cabin according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the receiving device 100 adopts a modular design and includes at least one electronic module 10 and a top cover 20. The electronic module 10 further includes a bottom shell 11 and an output circuit board 12, wherein the bottom shell 11 has a receiving cavity 111 and a bottom shell opening 112 and at least one side notch 113 respectively connected to the receiving cavity 111, and the output circuit board 12 includes a receiving main board 121, an output hard board 122, and an output flexible board 123 connecting the receiving main board 121 and the output hard board 122, wherein the receiving main board 121 is received in the receiving cavity 111 of the bottom shell 11 through the bottom shell opening 112 of the bottom shell 11, and the output flexible board 123 extends to the outside of the bottom shell 11 through the side notch 113 of the bottom shell 11, so that the bottom shell 11 and the output circuit board 12 form the electronic module 10. The top cover 20 is covered on the bottom shell 11, and the top cover 20 closes the bottom shell opening 112 of the bottom shell 11.

[0051] That is, the receiving main board 121 of the export circuit board 12 is hidden between the top cover 20 and the bottom shell 11, so that the receiving device 100 is assembled into Figures 17 to 19 When the receiving electronic compartment is shown, the receiving mainboard 121 can be prevented from being collided, thereby ensuring the reliability of the receiving mainboard 121.

[0052] In addition, the extension direction of the bottom shell 11, the extension direction of the receiving mainboard 121 and the extension direction of the top cover 20 are consistent, and the bottom shell 11, the receiving mainboard 121 and the top cover 20 form a thin sheet structure, so that the receiving device 100 can have a smaller size. At the same time, there can be a smaller distance between the receiving mainboard 121 and the bottom shell 11, and there can be a smaller distance between the receiving mainboard 121 and the top cover 20, so that the heat generated by the receiving mainboard 121 during operation can be quickly radiated to the top cover 20 and the bottom shell 11, so as to achieve rapid heat dissipation of the receiving device 100.

[0053] In an embodiment where the receiving device 100 includes more than two electronic modules 10, for example, Figures 1 to 16In the specific example in which the number of the electronic modules 10 shown is two, the two electronic modules 10 are stacked, and the bottom shell 11 of the electronic module 10 located above closes the bottom shell opening 112 of the bottom shell 11 of the electronic module 10 located below, that is, the bottom shell 11 of the electronic module 10 located above is the cover of the electronic module 10 located below. This is not only conducive to reducing the parts of the receiving device 100, thereby reducing the cost of the receiving device 100 and making the receiving device 100 lightweight, but also can reduce the size of the receiving device 100. When the overall size of the receiving electronic cabin remains unchanged, a larger number of electronic modules 10 can be arranged in the receiving electronic cabin to improve the performance of the receiving electronic cabin. Since the receiving device 100 of the present invention adopts a modular design, more than two electronic modules 10 can be stacked to form the receiving device 100 to meet the performance requirements of the receiving device 100.

[0054] That is to say, in the attached Figures 1 to 16 In this specific example of the receiving device 100 of the present invention shown, the receiving device 100 includes two electronic modules 10 and a top cover 20, the bottom shell 11 of the electronic module 10 located above is stacked on the bottom shell 11 of the electronic module 10 located below, and the bottom shell 11 of the electronic module 10 located above closes the bottom shell opening 112 of the bottom shell 11 of the electronic module 10 located below, and the top cover 20 is stacked on the bottom shell 11 of the electronic module 10 located above, and the top cover 20 closes the bottom shell opening 112 of the bottom shell 11 of the electronic module 10 located above.

[0055] Reference Figures 12 to 16 , the electronic module 10 further includes at least one heat-conducting element 13, the opposite ends of the heat-conducting element 13 are respectively placed against the bottom shell 11, and the middle part of the heat-conducting element 13 is adjacent to or attached to the chip 1211 of the receiving mainboard 121, so that the heat generated by the chip 1211 of the receiving mainboard 121 during operation can be quickly transferred to the bottom shell 11 through the heat-conducting element 13, and dissipated outward through the bottom shell 11. Preferably, in some specific examples of the receiving device 100 of the present invention, the heat-conducting element 13 is a heat-conducting copper tube, which has good thermal conductivity, so that the heat generated by the chip 1211 of the receiving mainboard 121 during operation can be quickly transferred to the bottom shell 11, and dissipated outward through the bottom shell 11.

[0056] Continue to refer to the attached Fig.12The bottom shell 11 includes a shell plate 114, two end walls 115 and two side walls 116. The two end walls 115 extend from opposite ends of the shell plate 114 in a direction perpendicular to the shell plate 114, and the two side walls 116 extend from opposite sides of the shell plate 114 in a direction perpendicular to the shell plate 114. The opposite ends of one end wall 115 extend to one end of the two side walls 116, and the other end extends to the other end of the two side walls 116. The opposite ends of the end wall 115 extend to the other end of the two side walls 116 respectively, so that the bottom shell 11 forms the accommodating cavity 111 between the shell plate 114, the two side walls 116 and the two end walls 115, and the bottom shell opening 112 of the bottom shell 11 is surrounded by the two side walls 116 and the two end walls 115, and the side notch 113 of the bottom shell 11 is formed in one of the side walls 116.

[0057] In a specific example of the receiving device 100 of the present invention, the material of the bottom shell 11 is metal or alloy, which can be formed by milling through a milling process, so that the bottom shell 11 has good heat dissipation capability.

[0058] After the receiving mainboard 121 is received in the receiving cavity 111 through the bottom shell opening 112 of the bottom shell 11, the receiving mainboard 121 and the shell plate 114 of the bottom shell 11 are fitted together, and the receiving mainboard 121 is surrounded by the two end walls 115 and the two side walls 116 of the bottom shell 11. The opposite ends of the heat-conducting element 13 are respectively supported by the two end walls 115 of the bottom shell 11, so that the opposite ends of the heat-conducting element 13 are respectively placed against the bottom shell 11 and the middle of the heat-conducting element 13 is adjacent to or attached to the chip 1211 of the receiving mainboard 121. It can be understood that, since the middle part of the heat-conducting element 13 is adjacent to or attached to the chip 1211 of the receiving mainboard 121, and the end of the heat-conducting element 13 directly contacts the end wall 115 of the bottom shell 11, the heat-conducting element 13 can efficiently conduct the heat generated by the chip 1211 of the receiving mainboard 121 during operation to the bottom shell 11, and dissipate the heat outward through the bottom shell 11.

[0059] Further, see Attachment Fig.12 and Fig.16Each of the end walls 115 of the bottom shell 11 has a positioning groove 1151, and the distance D between the bottom of the positioning groove 1151 and the inner wall of the shell plate 114 is greater than or equal to the thickness T of the receiving main board 121 at the position of the chip 1211. The end of the heat-conducting element 13 is located in the positioning groove 1151 of the end wall 115. In this way, the position of the heat-conducting element 13 relative to the bottom shell 11 and the receiving main board 121 is stable, and the heat-conducting element 13 is prevented from being displaced relative to the receiving main board 121. The middle part of the heat-conducting element 13 can be adjacent to or attached to the chip 1211 of the receiving main board 121, which can not only prevent the middle part of the heat-conducting element 13 from applying pressure to the chip 1211 of the receiving main board 121, but also prevent the heat-conducting effect of the heat-conducting element 13 from being affected due to the excessive distance between the heat-conducting element 13 and the chip 1211 of the receiving main board 121.

[0060] It is worth mentioning that the number of the heat conducting elements 13 of the electronic module 10 is not limited in the receiving device 100 of the present invention. Figures 1 to 16 In the specific example of the receiving device 100 of the present invention shown, the receiving main board 121 has two columns of chips 1211, so the number of the heat-conducting elements 13 can be two, one heat-conducting element 13 is suspended above a column of chips 1211 of the receiving main board 121, so that the middle part of the heat-conducting element 13 can be adjacent to or attached to each chip 1211 in this column of chips 1211, and the other heat-conducting element 13 is suspended above another column of chips 1211 of the receiving main board 121, so that the middle part of the heat-conducting element 13 can be adjacent to or attached to each chip 1211 in this column of chips 1211. In this way, the heat generated by all the chips 1211 during operation can be quickly conducted to the bottom shell 11 through the heat-conducting element 13.

[0061] Reference Figure 12 to Figure 14The shell plate 114 of the bottom shell 11 has at least one positioning column 1141, and the positioning column 1141 protrudes toward the receiving cavity 111 of the bottom shell 11. The receiving main board 121 has at least one positioning hole 1212. When the receiving main board 121 is received in the receiving cavity 111 of the bottom shell 11 through the bottom shell opening 112 of the bottom shell 11, the positioning column 1141 of the shell plate 114 is inserted into the positioning hole 1212 of the receiving main board 121 to position the receiving main board 121 in the receiving cavity 111 of the bottom shell 11, so as to prevent the receiving main board 121 from moving in the length direction and / or width direction in the receiving cavity 111 of the bottom shell 11, wherein the length direction and the width direction are perpendicular to the thickness direction of the receiving device 100. Preferably, after the receiving mainboard 121 is received in the receiving cavity 111 of the bottom shell 11, a plurality of screws 30 are used to lock the receiving mainboard 121 on the shell plate 114 of the bottom shell 11 to prevent the receiving mainboard 121 from falling off from the receiving cavity 111 of the bottom shell 11.

[0062] Continue to refer to the attached Figures 10 to 16 , the bottom shell 11 of the electronic module 10 located below further includes two stops 117, and the two stops 117 extend upward from the outer sides of the two end walls 115, respectively. When the bottom shell 11 of the electronic module 10 located above is stacked on the bottom shell 11 of the electronic module 10 located below, the two stops 117 of the bottom shell 11 of the electronic module 10 located below are respectively abutted by the two end walls 115 of the bottom shell 11 of the electronic module 10 located above, so that the bottom shell 11 of the electronic module 10 located below limits the length direction of the electronic module 10 located above. In other words, the two stops 117 of the bottom shell 11 of the electronic module 10 located below can block the bottom shell 11 at the two ends of the bottom shell 11 of the electronic module 10 located above, so as to prevent the bottom shell 11 of the electronic module 10 located above from being displaced in the length direction.

[0063] Further, see Attachment Figures 12 to 15At least one of the side walls 116 of the bottom shell 11 of the electronic module 10 has at least one pin hole 1161, and the receiving device 100 includes at least one limiting pin 40, one end of the limiting pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located below, and the other end of the limiting pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located above, so that the limiting pin 40 can limit the width direction of the electronic module 10 located above.

[0064] In this specific example of the receiving device 100 of the present invention, the opposite ends of the side wall 116 of the bottom shell 11 are respectively provided with a pin hole 1161, and accordingly, the number of the limit pins 40 is two, and one end of the two limit pins 40 is respectively inserted into the two pin holes 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located below, and the other end of the two limit pins 40 is respectively inserted into the two pin holes 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located above.

[0065] Preferably, the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located below is a blind hole, and the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located above is a through hole, so that after the two electronic modules 10 are stacked, the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom shell 11 of the two electronic modules 10 to prevent the electronic module 10 located above from shifting in the width direction.

[0066] When the top cover 20 is stacked on the bottom shell 11 of the electronic module 10 located above, the two stops 117 of the bottom shell 11 of the electronic module 10 located below are respectively abutted by the opposite ends of the top cover 20, so that the top cover 20 is limited in the length direction by the bottom shell 11 of the electronic module 10 located below.

[0067] Reference Figures 10 to 14, the top cover 20, the bottom shell 11 of the electronic module 10 located above, and the bottom shell 11 of the electronic module 10 located below are locked by the screw 30. Specifically, the top cover 20 has at least one first assembly hole 21, and the bottom shell 11 of the electronic module 10 has at least one second assembly hole 118. After the bottom shell 11 of the electronic module 10 located above is stacked on the bottom shell 11 of the electronic module 10 located below and the top cover 20 is stacked on the bottom shell 11 of the electronic module 10 located above, the position of the first assembly hole 21 of the top cover 20, the position of the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located above, and the position of the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located below are fixed. The positions of the second assembly holes 118 correspond, wherein one end of the screw rod 30 extends to the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located below after passing through the first assembly hole 21 of the top cover 20 and the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located above, and the screw rod 30 and the bottom shell 11 of the electronic module 10 located below are screwed to allow the screw rod 30 to lock the top cover 20, the bottom shell 11 of the electronic module 10 located above, and the bottom shell 11 of the electronic module 10 located below.

[0068] Preferably, the top cover 20 has a first assembly hole 21 at each of the four corners, and the bottom shell 11 of the electronic module 10 has a second assembly hole 118 at each of the four corners, so that the four screws 30 cooperate with each other to reliably lock the top cover 20, the bottom shell 11 of the electronic module 10 located above, and the bottom shell 11 of the electronic module 10 located below.

[0069] After the top cover 20, the bottom shell 11 of the electronic module 10 located above, and the bottom shell 11 of the electronic module 10 located below are locked, the bottom shell opening 112 of the bottom shell 11 of the electronic module 10 located below is closed by the bottom shell 11 of the electronic module 10 located above, thereby allowing the receiving cavity 111 of the bottom shell 11 to form a roughly closed space. Correspondingly, the bottom shell opening 112 of the bottom shell 11 of the electronic module 10 located above is closed by the top cover 20, thereby allowing the receiving cavity 111 of the bottom shell 11 to form a roughly closed space. The receiving cavity 111 of the bottom shell 11 of the electronic module 10 located below and the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located above are both filled with thermal conductive glue, and the thermal conductive glue covers the receiving mainboard 121 and the thermal conductive element 13. In this way, the thermal conductive glue can not only prevent the thermal conductive element 13 from being displaced, but also can quickly conduct the heat generated by the receiving mainboard 121 during operation to the thermal conductive element 13 and the bottom shell 11, and dissipate the heat outward through the bottom shell 11.

[0070] In order to facilitate the glue filling into the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located above and the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located below, refer to the attached Figure 12 to Figure 14 The bottom shell 11 of the electronic module 10 located at the top has at least one communication channel 119, and the communication channel 119 communicates the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located at the top and the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located at the bottom, so that after the glue is poured into the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located at the top, the glue can flow to the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located at the bottom through the communication channel 119. Preferably, the number of the communication channels 119 of the bottom shell 11 is two to improve the glue pouring efficiency.

[0071] Preferably, the top cover 20 has at least one glue injection port 22 , and the glue injection port 22 is connected to the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located above, and glue is allowed to be injected through the glue injection port 22 of the top cover 20 .

[0072] During the glue pouring process, in order to prevent the glue poured into the receiving cavity 111 of the bottom shell 11 from overflowing through the side notch 113 of the bottom shell 11, the electronic module 10 further includes a notch cover 14, the notch cover 14 has an avoidance groove 141, the notch cover 14 is installed on the side wall 116 of the bottom shell 11, so that the side notch 113 of the bottom shell 11 is covered by the notch cover 14, the position of the avoidance groove 141 of the notch cover 14 corresponds to the position of the export flexible board 123, and the size of the avoidance groove 141 of the notch cover 14 is slightly larger than the size of the export flexible board 123 corresponding to the position of the avoidance groove 141 of the notch cover 14, so that the notch cover 14 can prevent the glue from overflowing through the side notch 113 of the bottom shell 11 while avoiding applying pressure to the export flexible board 123.

[0073] In a specific example of the receiving device 100 of the present invention, the screw 30 can be used to install the notch cover 14 and the side wall 116 of the bottom shell 11. Specifically, the notch cover 14 has at least one first screw hole 142, and the side wall 116 of the bottom shell 11 has at least one first threaded hole 1162, and the position of the first screw hole 142 of the notch cover 14 corresponds to the position of the first threaded hole 1162 of the side wall 116 of the bottom shell 11, wherein one end of the screw 30 extends to the first threaded hole 1162 of the side wall 116 of the bottom shell 11 after passing through the first screw hole 142 of the notch cover 14, and the screw 30 and the side wall 116 of the bottom shell 11 are screwed together, so that the notch cover 14 and the side wall 116 of the bottom shell 11 are installed by the screw 30.

[0074] Continue to refer to the attached Figures 10 to 12 The receiving device 100 further includes a connecting circuit board 50, which includes a connecting flexible board 51 and a connecting hard board 52 arranged at one end of the connecting flexible board 51, and the other end of the connecting flexible board 51 is connected to the export hard board 122.

[0075] In order to facilitate the connection between the connecting flexible board 51 and the exporting hard board 122, in this specific example of the receiving device 100 of the present invention, the exporting flexible board 123 is bent so that the exporting hard board 122 is overlapped on the outer surface of the top cover 20, and the end of the connecting flexible board 51 away from the connecting hard board 52 is overlapped on the exporting hard board 122, and the connecting flexible board 51 and the exporting hard board 122 can be welded or inserted to conduct the connecting flexible board 51 and the exporting hard board 122.

[0076] Preferably, after the connecting flexible plate 51 is stacked on the leading-out rigid plate 122 , the screw 30 may be used to fix the connecting flexible plate 51 and the leading-out rigid plate 122 to the top cover 20 . Specifically, the connecting flexible plate 51 has at least one second screw hole 511, the export hard plate 122 has at least one third screw hole 1221, and the top cover 20 has at least one second threaded hole 23. The position of the second screw hole 511 of the connecting flexible plate 51, the position of the third screw hole 1221 of the export hard plate 122 and the position of the second threaded hole 23 of the top cover 20 correspond to each other. One end of the screw 30 extends to the second threaded hole 23 of the top cover 20 after passing through the second screw hole 511 of the connecting flexible plate 51 and the third screw hole 1221 of the export hard plate 122 respectively, and the screw 30 and the top cover 20 are screwed together so that the connecting flexible plate 51 and the export hard plate 122 are fixed to the top cover 20 by the screw 30.

[0077] Furthermore, the receiving device 100 includes a cover plate 60, which is installed on the top cover 20, and the cover plate 60 and the top cover 20 clamp the export hard board 122 and the connecting flexible board 51 and are stacked on the end of the export hard board 122, so that the cover plate 60 prevents the connecting flexible board 51 from falling off from the export hard board 122, thereby ensuring the reliability of the connection relationship between the connecting circuit board 50 and the export circuit board 12.

[0078] In a specific example of the receiving device 100 of the present invention, the screw rod 30 can be used to install the cover plate 60 and the top cover 20. Specifically, the cover plate 60 has at least one fourth screw rod hole 61, and the top cover 20 has at least one third threaded hole 24. The position of the fourth screw rod hole 61 of the cover plate 60 corresponds to the position of the third threaded hole 24 of the top cover 20. One end of the screw rod 30 extends to the third threaded hole 24 of the top cover 20 after passing through the fourth screw rod hole 61 of the cover plate 60, and the screw rod 30 and the top cover 20 are screwed together so that the cover plate 60 is installed on the top cover 20 by the screw rod 30.

[0079] Reference Fig.12One side of the top cover 20 has two plate grooves 25 and a cover plate groove 26, the export hard plate 122 of the export circuit board 12 of the electronic module 10 located below is arranged in one of the plate grooves 25 of the top cover 20, and the export hard plate 122 of the export circuit board 12 of the electronic module 10 located above is arranged in the other plate groove 25 of the top cover 20, and the cover plate 60 is arranged in the cover plate groove 26 of the top cover 20, so that the surface of the other side of the top cover 20 and the surface of the cover plate 60 can be flush, so that the appearance of the receiving device 100 is more regular, thereby facilitating the subsequent assembly of the receiving device 100 into the receiving electronic cabin.

[0080] Furthermore, the receiving device 100 includes a filter part 70, and the filter part 70 is installed on one of the end walls 115 of the bottom case 11. In the receiving device 100 of the present invention, the screw rod 30 can be used to install the filter part 70 and the bottom case 11. Specifically, the filter part 70 has at least one fifth screw hole 71, and one of the end walls 115 of the bottom shell 11 has at least one fourth threaded hole 1152. The position of the fifth screw hole 71 of the filter part 70 corresponds to the position of the fourth threaded hole 1152 of the end wall 115 of the bottom shell 11. After passing through the fifth screw hole 71 of the filter part 70, one end of the screw 30 extends to the fourth threaded hole 1152 of the end wall 115 of the bottom shell 11, and the screw 30 and the end wall 115 of the bottom shell 11 are screwed together so that the filter part 70 is installed on one of the end walls 115 of the bottom shell 11 by the screw 30.

[0081] Preferably, the opposite ends of the end wall 115 of the bottom shell 11 have a support arm 1153 and a protective space 1154 formed between the support arms 1153 , and the filter part 70 is located in the protective space 1154 so that the filter part 70 is protected by the two support arms 1153 of the bottom shell 11 .

[0082] Attached Figures 1 to 11 The assembly process of the receiving device 100 of the present invention is shown. Figures 9 to 11 The three-dimensional state of the receiving device 100 is shown from different viewing angles.

[0083] Specifically, refer to the attached Figure 1 and Figure 2, the receiving main board 121 is received in the receiving cavity 111 of the bottom shell 11 through the bottom shell opening 112 of the bottom shell 11 in such a manner that the positioning column 1141 of the shell plate 114 of the bottom shell 11 passes through the positioning hole 1212 of the receiving main board 121, wherein the export flexible board 123 extends to the outside of the bottom shell 11 through the side notch 113 of the bottom shell 11, and the export hard board 122 is located outside the bottom shell 11, wherein the plurality of screws 30 are used to lock the receiving main board 121 on the bottom shell 11.

[0084] Reference Figure 3 , the two ends of the heat-conducting element 13 are respectively placed in the positioning grooves 1151 of the end wall 115 of the bottom shell 11, so that the ends of the heat-conducting element 13 are placed on the bottom shell 11, and the middle part of the heat-conducting element 13 is adjacent to or attached to the chip 1211 of the receiving motherboard 121, so as to obtain an electronic module 10.

[0085] Reference Figure 4 , one electronic module 10 is stacked on top of another electronic module 10. At this time, the bottom shell 11 of the electronic module 10 located on the upper side closes the bottom shell opening 112 of the bottom shell 11 of the electronic module 10 located on the lower side, so that the receiving cavity 111 of the bottom shell 11 of the electronic module 10 located on the lower side forms a roughly closed space.

[0086] When one electronic module 10 is stacked on top of another electronic module 10, the stopper 117 of the bottom shell 11 of the electronic module 10 located below can block the bottom shell 11 at two ends of the bottom shell 11 of the electronic module 10 located above, thereby preventing the bottom shell 11 of the electronic module 10 located above from being displaced in the length direction.

[0087] In some examples of the present invention, before stacking one electronic module 10 on top of another electronic module 10, one end of the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom shell 11 of one electronic module 10, so that when stacking another electronic module 10 on top of this electronic module 10, the other end of the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located above, so that the limit pin 40 can limit the width direction of the electronic module 10 located above. In other examples of the present invention, after stacking the two electronic modules 10, the limiting pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located below through the pin hole 1161 of the side wall 116 of the bottom shell 11 of the electronic module 10 located above, so that the limiting pin 40 can limit the width direction of the electronic module 10 located above.

[0088] It can be understood that since the two stacked electronic modules 10 are limited in both the length and width directions, the position of the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located above is aligned with the position of the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located below.

[0089] Reference Figure 5 After the top cover 20 is placed on the bottom shell 11 of the electronic module 10 located above, the screw 30 is allowed to extend to the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located below after passing through the first assembly hole 21 of the top cover 20 and the second assembly hole 118 of the bottom shell 11 of the electronic module 10 located above in sequence, and the screw 30 is screwed on the bottom shell 11 of the electronic module 10 located below, so that the top cover 20 and the two electronic modules 10 are locked by the screw 30.

[0090] Reference Figure 6 , the notch cover 14 is installed on the side wall 116 of the bottom shell 11, so that the notch cover 14 covers the side notch 113 of the bottom shell 11. Optionally, before stacking the two electronic modules 10, the notch cover 14 can be installed on the side wall 116 of the bottom shell 11.

[0091] After the notch cover 14 is installed on the side wall 116 of the bottom shell 11, glue is poured into the receiving cavity 111 of the bottom shell 11 of the two electronic modules 10 through the glue pouring port 22 of the top cover 20, and the glue wraps the receiving mainboard 121 and the thermal conductive element 13. The glue can be cured after the glue pouring is completed.

[0092] Reference Figure 7 , bend the export flexible board 123 of the export circuit board 12 of the electronic module 10 located below, so that the export hard board 122 connected to the export flexible board 123 is superimposed on the surface of the top cover 20 and is located in one of the plate grooves 25 of the top cover 20, and bend the export flexible board 123 of the export circuit board 12 of the electronic module 10 located above, so that the export hard board 122 connected to the export flexible board 123 is superimposed on the surface of the top cover 20 and is located in another plate groove 25 of the top cover 20.

[0093] Reference Figure 8 , overlap the end of the connecting flexible board 51 away from the connecting rigid board 52 on the export rigid board 122, and make the connecting flexible board 51 and the export rigid board 122 conductive, then, allow one end of the screw 30 to extend to the second threaded hole 23 of the top cover 20 after passing through the second screw hole 511 of the connecting flexible board 51 and the third screw hole 1221 of the export rigid board 122 in sequence, and screw the screw 30 on the top cover 20, so that the connecting flexible board 51 and the export rigid board 122 are locked to the top cover 20 by the screw 30.

[0094] Reference Figures 9 to 11 After the cover plate 60 covers the connection position of the connecting flexible plate 51 and the export hard plate 122, one end of the screw 30 is allowed to pass through the fourth screw hole 61 of the cover plate 60 and extend to the third threaded hole 24 of the top cover 20, and the screw 30 is screwed on the top cover 20, so that the cover plate 60 is reliably installed on the top cover 20 by the screw 30.

[0095] That is to say, another aspect of the present invention further provides an assembly method of the receiving device 100, wherein the assembly method comprises the following steps:

[0096] (a) The receiving mainboard 121 is received in the receiving cavity 111 of the bottom shell 11 through the bottom shell opening 112 of the bottom shell 11 to obtain the electronic module 10, wherein the lead-out flexible board 123, one end of which is connected to the receiving mainboard 121, extends to the outside of the bottom shell 11 through the side notch 113 of the bottom shell 11;

[0097] (b) placing the top cover 20 on the bottom shell 11 of the electronic module 10 so that the bottom shell opening 112 of the bottom shell 11 is closed by the top cover 20 ; and

[0098] (c) The lead-out flexible plate 123 is bent so that the lead-out hard plate 122 connected to the other end of the lead-out flexible plate 123 is overlapped with the top cover 20 , thereby obtaining the receiving device 100 .

[0099] Attached Figures 17 to 19 The specific structure of the receiving electronic cabin of the present invention is shown, and the receiving electronic cabin includes the receiving device 100, a signal processing device 200 and a watertight cabin 300. The receiving device 100 and the signal processing device 200 are arranged in the watertight cabin 300, and the receiving device 100 and the signal processing device 200 are connected.

[0100] Specifically, the watertight cabin 300 includes a cabin body 310 and a wiring terminal 320, the cabin body 310 has a cabin space 311 and a terminal through-hole 312 connected to the cabin space 311 at the bottom of the cabin body 310, the wiring terminal 320 is watertightly arranged in the terminal through-hole 312 of the cabin body 310, wherein the receiving device 100 and the signal processing device 200 are arranged in the cabin space 311 of the cabin body 310, and the signal processing device 200 is connected to the wiring terminal 320.

[0101] More specifically, the signal processing device 200 includes a first housing 210, a second housing 220, a first processing board 230, a second processing board 240, a connecting board 250, and a packaging portion 260. The packaging portion 260 packages the first processing board 230 in the first housing 210, the second processing board 240 is installed in the first housing 210, and there is a gap between the second processing board 240 and the first processing board 230. The second housing 220 is installed in the first housing 210 so that the first processing board 230 and the second processing board 240 are in contact with each other. The first housing 210 and the second housing 220 are located between the first housing 210 and the second housing 220, so that the first housing 210 and the second housing 220 can protect the first processing board 230 and the second processing board 240. The connecting board 250 is a flexible board, wherein one end of the connecting board 250 extends to the space between the first housing 210 and the second housing 220 for connecting the first processing board 230 and the second processing board 240, and the other end of the connecting board 250 is used to connect the export hard board 52 of the export circuit board 50 of the receiving device 100. The connecting terminal 320 is connected to the second processing board 240.

[0102] In the receiving electronic cabin of the present invention, the packaging part 260 can be formed by heat-conductive glue. The packaging part 260 directly encapsulates the first processing board 230 with a larger heat generation in the first shell 210, and sets a gap between the second processing board 240 with a smaller heat generation and the first processing board 230. In this way, on the one hand, the heat generated by the first processing board 230 during operation can be directly conducted to the first shell 210, and on the other hand, the second processing board 240 is not easily affected by the heat generated by the first processing board 230.

[0103] In order to fixedly install the receiving device 100 and the signal processing device 200 in the cabin space 311 of the cabin 310 and improve the heat dissipation capacity of the receiving electronic cabin, the receiving electronic cabin of the present invention further includes an assembly device 400, and the assembly device 400 includes an assembly frame 410, an assembly pin 420 and two assembly rods 430.

[0104] The assembly frame 410 includes an assembly cover 411 and two extension legs 412, and the assembly frame 410 has two frame body through holes 413, the two extension legs 412 respectively extend downward from opposite ends of one side of the assembly cover 411, and the two frame body through holes 413 respectively extend from opposite ends of one side of the assembly cover 411 to the bottom of the two extension legs 412, and the assembly cover 411 has a pin groove 4111. The cabin body 310 has two screw holes 313.

[0105] The receiving device 100 and the signal processing device 200 are respectively placed under the assembly cover 411 on opposite sides of the assembly cover 411, and the pin groove 4111 of the assembly cover 411 corresponds to the space between the receiving device 100 and the signal processing device 200. The receiving device 100, the signal processing device 200 and the assembly frame 410 are placed in the cabin space 311 of the cabin 310, and the bottoms of the two assembly rods 430 extend to the two screw holes 313 of the cabin 310 after passing through the two frame through holes 413 of the assembly frame 410 respectively, and the bottoms of the assembly rods 430 and the cabin 310 are screwed so that the receiving device 100 and the signal processing device 200 are pressed toward the bottom of the cabin 310 by the assembly cover 411.

[0106] When the assembly pin 420 is inserted from top to bottom into the space between the receiving device 100 and the signal processing device 200 through the pin groove 4111 of the assembly pressure cover 411, the assembly pin 420 pushes the receiving device 100 and the signal processing device 200 toward opposite sides, and makes the top cover 20 and the cover plate 60 of the receiving device 100 close to one side of the inner wall of the cabin 310, and makes the first shell 210 of the signal processing device 200 close to the other side of the inner wall of the cabin 310. In this way, the heat generated by the receiving device 100 during operation can be directly conducted to the cabin 310, and the heat generated by the signal processing device 200 can also be directly conducted to the cabin 310, thereby improving the heat dissipation capacity of the receiving electronic cabin. At the same time, since the assembly cover 411 presses the receiving device 100 and the signal processing device 200 toward the bottom of the cabin 310 and the assembly pin 420 presses the receiving device 100 and the signal processing device 200 toward the side wall of the cabin 310, the receiving device 100 and the signal processing device 200 are fixedly installed in the cabin space 311 of the cabin 310.

[0107] It is understandable that when the assembly pin 420 is inserted from top to bottom into the space between the receiving device 100 and the signal processing device 200 through the pin slot 4111 of the assembly cover 411, in order to ensure that the assembly pin 420 can push the receiving device 100 and the signal processing device 200 toward opposite sides, the thickness dimension of the bottom of the assembly pin 420 is smaller than the width of the space between the receiving device 100 and the signal processing device 200, and the thickness dimension of the middle portion of the assembly pin 420 is larger than the width dimension between the receiving device 100 and the signal processing device 200. After the bottom and middle portion of the assembly pin 420 are inserted into the space between the receiving device 100 and the signal processing device 200, the top of the assembly pin 420 can be locked to the assembly cover 411 by the screw rod 30.

[0108] In addition, after the receiving device 100, the signal processing device 200 and the assembly frame 410 are placed in the cabin space 311 of the cabin 310, the bottom shell 11 of the receiving device 100 and the second shell 220 of the signal processing device 200 face each other so that there is space between the receiving device 100 and the signal processing device 200. Therefore, when the assembly pin 420 is inserted, the side of the assembly pin 420 always contacts the bottom shell 11 and the second shell 220, so that damage to the receiving device 100 and the signal processing device 200 can be avoided.

[0109] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. The sonar receiving electronic cabin is characterized by: include: watertight compartments; Signal processing device; A receiving device, wherein the receiving device comprises a top cover and at least one electronic module, the electronic module further comprises a bottom shell and an export circuit board, the bottom shell has a receiving cavity and a bottom shell opening and at least one side notch respectively connected to the receiving cavity, the export circuit board comprises a receiving main board, an export flexible board and an export hard board, the opposite ends of the export flexible board are respectively connected to the receiving main board and the export hard board, wherein the receiving main board is received in the receiving cavity of the bottom shell through the bottom shell opening of the bottom shell, the export flexible board extends to the outside of the bottom shell through the side notch of the bottom shell, the top cover is covered on the bottom shell to close the bottom shell opening of the bottom shell, after the export flexible board is bent, the export hard board is superimposed on the top cover, wherein the receiving device and the signal processing device are respectively arranged in the cabin space of the watertight cabin; as well as An assembly device, wherein the assembly device includes an assembly frame, an assembly pin and two assembly rods, the assembly frame includes an assembly cover and two extension legs, and the assembly frame has two frame through holes, the two extension legs extend downward from opposite ends of one side of the assembly cover, and the two frame through holes extend from opposite ends of one side of the assembly cover to the bottom of the two extension legs, the assembly cover has a pin groove, wherein the receiving device and the signal processing device are respectively placed below the assembly cover on opposite sides of the assembly cover, and the pin groove of the assembly cover corresponds to the space between the receiving device and the signal processing device, and the thickness of the bottom of the assembly pin is smaller than the width of the space between the receiving device and the signal processing device. The thickness dimension of the middle part of the assembly pin is larger than the width dimension of the space between the receiving device and the signal processing device. When the assembly pin is inserted from top to bottom into the space between the receiving device and the signal processing device through the pin groove of the assembly pressure cover, the assembly pin pushes the receiving device and the signal processing device toward opposite sides, and makes the receiving device close to one side of the inner wall of the cabin and makes the signal processing device close to the other side of the inner wall of the cabin. The bottoms of the two assembly rods extend to the two screw holes of the cabin after passing through the two through holes of the assembly frame respectively, and the bottoms of the assembly rods and the cabin are screwed so that the receiving device and the signal processing device are pressed to the bottom of the cabin by the assembly pressure cover.

2. The receiving electronic compartment according to claim 1, wherein the electronic module further comprises at least one heat-conducting element, opposite ends of the heat-conducting element are respectively placed against the bottom shell, and the middle part of the heat-conducting element is adjacent to or attached to the chip of the receiving mainboard. 3 . The receiving electronic cabin according to claim 2 , wherein two opposite ends of the bottom shell respectively have at least one positioning groove, and the end of the heat conducting element is positioned in the positioning groove of the bottom shell.

4. The receiving electronic cabin according to any one of claims 1 to 3, wherein the number of the electronic modules is two, the two electronic modules are stacked, and the bottom shell of the upper electronic module closes the bottom shell opening of the bottom shell of the lower electronic module.

5. The receiving electronic cabin according to claim 4, wherein the bottom shell of the electronic module located above has at least one connecting channel, and the connecting channel connects the receiving cavity of the bottom shell of the electronic module located above and the receiving cavity of the bottom shell of the electronic module located below.

6. A receiving electronic cabin according to any one of claims 1 to 3, wherein the receiving device further includes a connecting circuit board and a cover plate, the connecting circuit board includes a connecting flexible board and a connecting hard board arranged at one end of the connecting flexible board, the other end of the connecting flexible board is stacked on the exporting hard board, and the connecting flexible board and the exporting hard board are connected, the cover plate is installed on the top cover, and the cover plate and the bottom shell clamp the connecting flexible board and the exporting hard board. 7 . The receiving electronic cabin according to claim 5 , wherein the top cover has at least one glue injection port, and the glue injection port is connected to the receiving cavity of the bottom shell of the electronic module located above.

8. A receiving electronic cabin according to claim 3, wherein the bottom shell comprises a shell plate, two end walls and two side walls, the two end walls extend from opposite ends of the shell plate in a direction perpendicular to the shell plate, the two side walls extend from opposite sides of the shell plate in a direction perpendicular to the shell plate, the opposite ends of one end wall extend to one end of the two side walls, and the opposite ends of the other end wall extend to the other end of the two side walls, the bottom shell forms the accommodating cavity between the shell plate, the two side walls and the two end walls, and the bottom shell opening of the bottom shell is surrounded by the two side walls and the two end walls, and the side notch of the bottom shell is formed in one side wall.

9. The receiving electronic cabin according to claim 8, wherein the opposite ends of the heat-conducting element are respectively supported by the two end walls of the bottom shell, so that the opposite ends of the heat-conducting element are respectively resting on the bottom shell and the middle part of the heat-conducting element is adjacent to or attached to the chip of the receiving mainboard.

10. The receiving electronic cabin according to claim 9, wherein the positioning groove of the bottom shell is formed on the end wall, and the distance D between the bottom of the positioning groove and the inner wall of the shell plate is greater than or equal to the thickness T of the receiving mainboard at the position of the chip.

11. A receiving electronic cabin according to claim 8, wherein the side wall of the bottom shell has at least one pin hole, and the receiving device includes at least one limit pin, one end of the limit pin is inserted into the pin hole of the side wall of the bottom shell of the electronic module located below, and the other end is inserted into the pin hole of the side wall of the bottom shell of the electronic module located above.

12. A receiving electronic cabin according to any one of claims 1 to 3, wherein the top cover has at least one first assembly hole, the bottom shell of the electronic module has at least one second assembly hole, and after the bottom shell of the electronic module located above is stacked on the bottom shell of the electronic module located below and the top cover is stacked on the bottom shell of the electronic module located above, the position of the first assembly hole of the top cover, the position of the second assembly hole of the electronic module located above, and the position of the second assembly hole of the bottom shell of the electronic module located below correspond, wherein the receiving electronic cabin includes at least one screw, one end of the screw extends to the second assembly hole of the bottom shell of the electronic module located below after passing through the first assembly hole of the top cover and the second assembly hole of the electronic module located above, and the screw and the bottom shell of the electronic module located below are screwed together.

13. The receiving electronics compartment of claim 8, wherein said receiving device comprises a filter portion, said filter portion being mounted to one of said end walls of said bottom housing.

14. The receiving electronic cabin according to claim 13, wherein the opposite ends of the end wall of the bottom shell have a support arm and a protective space formed between the support arms, and the filter part is located in the protective space so that the filter part is protected by the two support arms of the bottom shell.

Images