Ultrasonic particle reduction system for acoustic microvalves

Abstract

The present disclosure relates to an ultrasonic particle reduction system for acoustic microvalves. A portable electronic device comprising: a housing having a housing wall forming an internal chamber that houses a transducer and a valve operable to open or close a vent to the internal chamber; and a particle removal mechanism coupled to the valve, the particle removal mechanism operable to dislodge particles from the valve when a current is applied.

Description

[0001] Related patent applications

[0002] This application claims priority to U.S. Provisional Application No. 63 / 486,603, filed February 23, 2023, which is incorporated herein by reference. Technical Field

[0003] One aspect of this disclosure relates to a particle reduction system for a valve, and more specifically, a particle reduction system comprising an ultrasonic actuator that deforms the valve to different mechanical modes to remove particles from the valve. Other aspects are also described and protection thereof is claimed. Background Technology

[0004] Portable communication or monitoring devices (e.g., smartphones, headsets, etc.) have one or more transducers located therein that convert an input electro-audio signal into a sound pressure level (SPL) wave output audible to a user, or convert an SPL input into an electro-audio signal. The transducer (e.g., a speaker) can be used to output SPL waves corresponding to the voice of a remote user (such as during a phone call), or to output SPL waves corresponding to sounds associated with a game the user wants to play or music they want to play. Due to the relatively low profile of portable devices, the transducers also have a relatively low profile, which in turn reduces the acoustic volume coupled to the transducers and makes it difficult to maintain optimal sound quality. In some aspects, valves can be provided for opening and / or closing vents or openings leading to the acoustic volume coupled to the transducers to improve sound quality. Summary of the Invention

[0005] One aspect of this disclosure relates to a particle reduction or removal mechanism that can be used to reduce or remove particles that may interfere with the operation of a valve located between, for example, an internal chamber or acoustic volume of a device and the environment surrounding the inner device housing. In other aspects, particles can be removed from a valve located between internal volumes of the housing. For example, in some aspects, the internal chamber or acoustic volume may be coupled to a transducer within the device, and the valve may be used to open / close the internal chamber to another chamber to increase / decrease the internal chamber volume, or to open / close the chamber to the surrounding environment. Typically, in the case of headphones, in some cases a perfect seal (high impedance) is desired, while in others a very open path (low impedance) is desired. Typically, in some cases where the headphones fit relatively tightly within the ear and form a seal or at least a partial seal with the ear canal, the user may experience an undesirable blocking effect. For example, during active noise control (ANC) or noise cancellation, the user may want to isolate the in-ear device by passive isolation and ANC (closing the valve), but in other cases, transparency (opening the valve) is desired to allow for a more natural and less blocking effect when speaking. Furthermore, it is expected that the open valve state will provide thermo-physical comfort through moisture evaporation, extending wear time and improving overall wear comfort. However, the valve can be susceptible to contamination by small particles that may interfere with valve performance. For example, in some cases, small particles can accumulate on the valve's moving parts or vanes, causing them to become sticky. This can then prevent the moving parts or vanes from transitioning between open and closed states, or require a larger DC bias voltage than the system can provide to transition between states.

[0006] Therefore, the aspects disclosed herein propose a particle removal mechanism coupled to a valve to reduce or remove particles that may interfere with the valve's operation. Typically, this particle removal mechanism may include actuators, such as AC circuitry components that add an existing DC bias voltage required for the valve's primary operation. At specified intervals, such as in the case of placing earbuds in a case, the AC voltage can be applied to the valve to cause the valve surface to transition between multiple mechanical modes (or configurations) for removing adhered particles. For example, the AC voltage may cause different regions or areas of the valve's moving parts or vanes to vibrate in different modes. Some modes may have greater acceleration at different areas of the valve than others, allowing these modes to be selected based on which areas of the vanes need to be removed as required. Typically, in some aspects, the valve may be an electrostatic microelectromechanical system (MEMS) bistable valve with vanes that are prone to particle accumulation. The vanes may have a primary bending mode in the frequency range of 1 kHz to 3 kHz and a higher torsional mode in the ultrasonic frequency range of approximately 25 kHz to 40 kHz. Therefore, AC circuit components can be used to clean or remove particles by applying frequencies within the 1kHz to 3kHz and / or ultrasonic frequency range. For example, if cleaning is desired when the in-ear earbuds are not in use (e.g., in the case), frequencies from 1kHz to 3kHz can be used, as there is no concern that applying frequencies within the audible range (e.g., <20kHz) would interfere with the user experience. However, cleaning is also possible when the in-ear earbuds are in the ear by applying frequencies within the ultrasonic frequency range (e.g., approximately 25kHz to 40kHz), since the user cannot hear this ultrasonic frequency range. In this respect, the particle reduction or removal mechanism can be used to remove particles from the valve at any time desired by the user (e.g., inside or outside the user's ear). Additionally, in some aspects, the cycle time can be between approximately 500 milliseconds and 1000 milliseconds. Once the particles are removed from the valve or fin, they can be completely discharged from the system, or an adhesive can be provided inside the device for capturing the removed particles. In some aspects, the effectiveness of the vibration can be enhanced by matching the drive frequency to or near the structural resonance of the fin or moving part from which the particles are removed.

[0007] Typically, in one aspect, this disclosure relates to a portable electronic device comprising: a housing having a housing wall forming an internal chamber housing a transducer and a valve operable to open or close a vent leading to the internal chamber; and a particle removal mechanism coupled to the valve, operable to repel particles from the valve upon application of an electric current. In some aspects, the particle removal mechanism includes an AC circuit operable to apply an electric current that deforms a moving part of the valve to at least one of a plurality of mechanical modes operable to remove solid particles from the valve. In some aspects, the current is in the ultrasonic frequency range. In some aspects, the current includes a plurality of frequencies in the ultrasonic frequency range applied sequentially to deform the vane. In some aspects, the current includes a plurality of frequencies in the ultrasonic frequency range applied simultaneously to deform the moving part. In some aspects, the valve includes an electrostatic valve having vanes that deform upon application of the current. In some aspects, the particle removal mechanism includes a Fourier horn that connects the vent to the surrounding environment and a piezoelectric actuator that expels liquid particles from the Fourier horn into the surrounding environment. In some aspects, the actuator is attached to a side wall of the Fourier horn or a moving part of the valve.

[0008] In another aspect, this disclosure relates to a portable electronic device comprising: a housing having a housing wall forming an internal chamber and a port leading to the surrounding environment; a transducer positioned within the internal chamber and dividing the internal chamber into a front volume chamber connecting a first side of the transducer to the port and a rear volume chamber connecting a second side of the transducer; a valve including a movable member operable to open and close a vent to the internal chamber, the front volume chamber, or the rear volume chamber; and an actuator coupled to the valve and operable to actuate the movable member to deform into at least one of a plurality of mechanical modes operable to remove particles from the valve. In some aspects, the actuator includes an AC circuit operable to generate an AC frequency in an ultrasonic frequency range that deforms the movable member. In some aspects, the AC circuit sequentially applies a plurality of frequencies in the ultrasonic frequency range that deform the movable member. In some aspects, the AC circuit simultaneously applies multiple frequencies within the ultrasonic frequency range that deform the moving part. In some aspects, the multiple mechanical modes include a first mechanical mode actuated by applying AC current in the frequency range of 20 kHz to 30 kHz. In some aspects, the multiple mechanical modes include a second mechanical mode actuated by applying AC current in the frequency range of 30 kHz to 40 kHz. In some aspects, the multiple mechanical modes include a third mechanical mode actuated by applying AC current in the frequency range of 40 kHz to 100 kHz. In some aspects, the multiple mechanical modes include a fourth mechanical mode actuated by applying AC current in the frequency range of 100 kHz to 150 kHz. In some aspects, the multiple mechanical modes include a fifth mechanical mode actuated by applying AC current in the frequency range of 150 kHz to 200 kHz. In some aspects, the valve includes an electrostatic valve. In some aspects, the device also includes: a Fourier horn that connects the vent to the surrounding environment; and a piezoelectric actuator operable to expel liquid from the Fourier horn into the surrounding environment. The piezoelectric actuator may be attached to a sidewall of the Fourier horn and cause displacement of the sidewall, which expels the liquid into the surrounding environment.

[0009] In another aspect, this disclosure includes a microelectromechanical device comprising: a valve operable to open or close a vent to a housing chamber coupled to a transducer; and a particle removal mechanism coupled to the valve, operable to displace particles from the valve upon application of an electric current. In some aspects, the particle removal mechanism includes an AC circuit operable to apply an electric current that deforms a moving part of the valve to at least one of a plurality of mechanical modes operable to displace solid particles from the valve. The electric current may be in the ultrasonic frequency range. In another aspect, the electric current includes a plurality of frequencies in the ultrasonic frequency range applied sequentially or simultaneously to deform the valve and / or the moving part. In some aspects, the valve includes an electrostatic valve having vanes that deform upon application of the electric current. In some aspects, the particle removal mechanism includes a Fourier horn connecting the vent to the surrounding environment and a piezoelectric actuator displacing liquid particles within the Fourier horn into the surrounding environment. The actuator is attached to the side wall of the Fourier horn or the moving part of the valve.

[0010] The above overview does not include an exhaustive list of all aspects of this disclosure. It is contemplated that the invention encompasses all systems and methods that can be implemented by all suitable combinations of the aspects outlined above and the various aspects disclosed in the detailed embodiments below and specifically pointed out in the claims filed with this patent application. Such combinations have specific advantages not specifically described in the above overview. Attached Figure Description

[0011] Several aspects are illustrated in the accompanying drawings by way of example rather than limitation, and similar reference numerals in the drawings indicate similar elements. It should be noted that references to “a” or “an” aspect in this disclosure do not necessarily refer to the same aspect, and that they mean at least one.

[0012] Figure 1 A cross-sectional side view of one aspect of a portable electronic device and / or transducer assembly with valves and particle removal mechanisms is shown.

[0013] Figure 2 It shows Figure 1 A cross-sectional side view of one aspect of a portable electronic device and / or transducer assembly in a closed configuration of a particle removal mechanism and valve.

[0014] Figure 3 It shows Figure 1 A cross-sectional side view of one aspect of a particle removal mechanism and valve in a closed configuration of a portable electronic device and / or transducer assembly.

[0015] Figure 4 It shows Figure 1A cross-sectional side view of one aspect of a portable electronic device and / or transducer assembly in an open configuration of a particle removal mechanism and valve.

[0016] Figure 5A It shows Figures 1 to 4 A top perspective view of one aspect of the movable component of the valve in its first mechanical mode.

[0017] Figure 5B It shows Figures 1 to 4 Top perspective view of one aspect of the movable component of the valve in its second mechanical mode.

[0018] Figure 5C It shows Figures 1 to 4 Top perspective view of one aspect of the movable component of the valve in the third mechanical mode.

[0019] Figure 5D It shows Figures 1 to 4 Top perspective view of one aspect of the movable component of the valve in the fourth mechanical mode.

[0020] Figure 5E It shows Figures 1 to 4 Top perspective view of one aspect of the movable component of the valve in the fifth mechanical mode.

[0021] Figure 6 It shows how to use Figures 1 to 4 A block diagram illustrating a representative process of particle removal mechanisms reducing or removing particles from valves.

[0022] Figure 7 It shows Figure 1 A cross-sectional side view of another side of the valve and particle removal mechanism of a portable electronic device and / or transducer assembly.

[0023] Figure 8 It shows Figure 1 A cross-sectional side view of another side of the valve and particle removal mechanism of a portable electronic device and / or transducer assembly.

[0024] Figure 9 It shows Figure 1 A cross-sectional side view of another side of the valve and particle removal mechanism of a portable electronic device and / or transducer assembly.

[0025] Figure 10 It shows Figure 1 A cross-sectional side view of another side of the valve and particle removal mechanism of a portable electronic device and / or transducer assembly.

[0026] Figure 11 It shows that it can be implemented including Figures 1 to 10A block diagram of one aspect of the electronic equipment for the transducer of the particle removal mechanism and valve assembly. Detailed Implementation

[0027] In this section, we will explain several preferred aspects of this disclosure with reference to the accompanying drawings. Where the shape, relative position, and other aspects of the described components are not clearly defined, the scope of this disclosure is not limited to the components shown, which are for illustrative purposes only. Furthermore, while many details are set forth, it should be understood that some aspects of this disclosure can be implemented without these details. In other instances, well-known structures and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0028] The terminology used herein is for the purpose of describing particular aspects only and is not intended to limit this disclosure. Spatially related terms, such as “below,” “under,” “down,” “above,” “above,” etc., may be used herein for the convenience of describing the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. It should be understood that spatially related terms are intended to cover different orientations of the device during use or operation other than those shown in the drawings. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features may then be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both the orientations above and below. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially related descriptors used herein are interpreted accordingly.

[0029] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context otherwise indicates. It should be further understood that the terms “comprising”, “including”, “emphasize” define the presence of the stated feature, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or collections thereof.

[0030] The terms “or” and “and / or” as used herein should be interpreted as including or referring to any one or any combination thereof. Therefore, “A, B, or C” or “A, B, and / or C” means “any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or actions is inherently mutually exclusive in some way.

[0031] Figure 1A cross-sectional side view of one aspect of a valve assembly for positioning a transducer within a portable electronic device is shown. The electronic device 100 may include a housing, enclosure, or outer housing 102 that defines or encloses a chamber therein housing the constituent electronic components of the electronic device 100. In some aspects, the device 100 may be a portable or mobile communication device, an in-ear device, a portable timing device, or any other device in which a transducer may be implemented. The housing 102 may include a housing wall 104 that separates the surrounding environment from the enclosed space or internal chamber 106 formed within the housing 102. In some cases, the housing wall 104 completely isolates or seals the entire internal chamber 106 or a portion thereof from the surrounding environment. For example, the housing wall 104 may form a waterproof and / or airtight waterproof or acoustically isolated portion of the internal chamber 106. The internal chamber 106 may have sufficient volume and / or size to accommodate the constituent components of the electronic device 100. The housing wall 104 may also include one or more acoustic ports 108. Acoustic port 108 can be, for example, a sound output port through which sound from a speaker located within the internal chamber 106 can be output. Alternatively, where a microphone is located near the housing acoustic interface 108, it can be a sound input port to allow sound input to the microphone.

[0032] Representatively, in Figure 1In one aspect, the housing acoustic port 108 is an acoustic port acoustically open to a transducer 110 positioned within the internal chamber 106. In some aspects, the transducer 110 can be any type of electroacoustic transducer capable of converting an electro-audio signal into sound or vice versa. Typically, the transducer 110 can be a loudspeaker or a miniature loudspeaker, for example, a miniaturized version of a loudspeaker that uses a moving-coil motor to drive the sound output. Therefore, in some aspects, the transducer 110 may be referred to herein as a miniature loudspeaker. In other aspects, where the transducer 110 converts sound into an electro-audio signal, it may be further referred to herein as a microphone. In some aspects, the transducer 110 may be coupled to an internal wall 124 and is considered to divide the internal chamber 106 into a front volume chamber 106A and a rear volume chamber 106B surrounding the transducer 110. When the transducer 110 is a loudspeaker, the front volume chamber 106A can be formed as a chamber having a first volume (V1) surrounding the sound output surface or surface 110A of the transducer 110. The front volume chamber 106A (and the first volume V1) can be considered acoustically coupled to or otherwise acoustically open to the acoustic port 108. In this respect, sound pressure waves output from the surface 110A of the transducer 110 can pass through the front volume chamber 106A and be transmitted to the surrounding environment 112 through the acoustic port 108. The rear volume chamber 106B can have a second volume (V2) and surround the rear side of the transducer 110 (e.g., the side of the transducer 110 opposite to the surface 110A).

[0033] It should be recognized that, for example, the size, volume, pressure, or other aspects of the front volume chamber 106A or the rear volume chamber 106B may affect the acoustic performance of the transducer 110. Therefore, modifying the size, volume, and / or pressure of the front volume chamber 106A and / or the rear volume chamber 106B can be used to tune the acoustic performance of the transducer 110. For example, in some cases, it may be desirable for the front volume chamber 106A and / or the rear volume chamber 106B to be isolated from or sealed (e.g., with high impedance) from the surrounding environment 112 to achieve desired acoustic performance. In other cases, it may be desirable for the front volume chamber 106A and / or the rear volume chamber 106B to have a very open path (e.g., with low impedance) and a certain amount of leakage to the surrounding environment 112. In yet another aspect, it may be desirable for the front volume chamber 106A to have leakage or otherwise be open to the rear volume chamber 106B.

[0034] With this in mind, valve assemblies or valves 114, 116, and / or 118 may be further provided to vent the associated chambers. Valves 114, 116, and / or 118 may open and / or close vents or openings 120 from the front volume chamber 106A and / or the rear volume chamber 106B to the surrounding environment 112, or vents or openings 120 between the front volume chamber 106A and the rear volume chamber 106B. For example, valve 114 may open and / or close the opening 120 formed through the wall 104 between the front volume chamber 106A and the surrounding environment 112. In other words, when valve 114 is open, the front volume chamber 106A may leak or vent to the surrounding environment 112, and when valve 114 is closed, leakage or venting is prevented. Leakage or venting from the front volume chamber 106A may be desirable in cases where, for example, device 100 is an in-ear headphone sealed within the user's ear but requiring a more open feel. Valve 116 can open and / or close the opening 120 through the wall 104 between the rear volume chamber 106B and the surrounding environment 112. In other words, when valve 116 is open, the rear volume chamber 106B can leak or vent to the surrounding environment 112, and when valve 116 is closed, leakage or venting is prevented. Valve 118 can open and / or close the opening 120 through the wall 124 between the front volume chamber 106A and the rear volume chamber 106B. In this respect, when valve 118 is open, the front volume chamber 106A can leak or vent to the rear volume chamber 106B, and when valve 118 is closed, leakage or venting is prevented. In another aspect, it is conceivable that one or more of valves 114, 116, 118 may be used to open and / or close an opening (e.g., opening 120) to another type of acoustic chamber, such as an opening to one or more of the previously discussed acoustic resonators or attenuators connected to the transducer.

[0035] In one aspect, one or more of valves 114, 116, and 118 can be any type of valve operable to open and / or close an opening, for example, in response to an applied voltage. In this aspect, valves 114, 116, and 118 can be dynamically actuated to control leakage. In some aspects, one or more of valves 114, 116, and 118 can be microelectromechanical systems (MEMS) actuators or valves with moving parts such as vanes that open or close an opening. For example, any one or more of valves 114, 116, and 118 can be an electrostatic MEMS valve, a piezoelectric MEMS valve, a slide valve, a gate valve, etc. Valves 114, 116, and 118 can be the same or different. In some aspects, one or more valves can provide the advantages of: bi-stability, low power consumption during switching from open / closed states, digitalization of the percentage or amount of open area for controlling exhaust, and / or silent operation.

[0036] Furthermore, as previously discussed, one or more of valves 114, 116, and 118 may be susceptible to small particle contamination that can interfere with valve performance. For example, in some cases, small particles may accumulate on the moving parts or vanes of the valve, making it difficult for the valve to transition between open and closed states, or requiring a larger direct current (DC) bias voltage than the system can provide to transition the parts or vanes between states. Therefore, valves 114, 116, and 118 may also include a particle removal system, component, or mechanism 122 for reducing or removing particles that may interfere with valve operation. Typically, particle removal mechanism 122 may include actuators, such as AC circuit components that add to the existing DC bias voltage required for the main operation of the valve. At specified intervals, AC voltage may be applied to valves 114, 116, and 118 to cause the moving parts of the valve to transition between various mechanical modes (or configurations) for removing adhered particles. For example, AC voltage may cause vibration of areas or zones on the moving parts or vanes of the valve where particles are prone to accumulate to remove adhered particles. In some respects, the particles may be solid particles adhering to valves 114, 116, 118, and these solid particles are removed by particle removal mechanism 122, as referenced. Figures 2 to 6 A more detailed description is provided. In other respects, the particles may be liquid particles aggregated on or near valves 114, 116, 118, and the particle removal mechanism 122 may be operable to displace the liquid particles away from valves 114, 116, 118, as will be described in reference to… Figures 7 to 10 To describe in more detail.

[0037] Reference Figures 2 to 10 Several representative configurations of valves 114, 116, and 118 with a particle cleaning or removal mechanism 122 are described. Typically, Figure 2 Showing from Figure 1 A cross-sectional side view of a representative valve. In this respect, Figure 2 A valve 114 is shown for opening / closing an opening 120 formed in the housing wall 104. However, it should be understood that although valve 114 is specifically discussed, one or more of valves 116 and / or 118 may be identical to valve 114, making the description provided herein also applicable. Figure 1Any other valve disclosed herein. As can be seen from this view, valve 114 may include a moving part or vane 214 configured to open / close opening 120. It should be appreciated that, although the term "vane" is used herein, vane 214 may be any structure suitable for opening and / or closing opening 120 as discussed herein. In some aspects, opening 120 may be a relatively small vent or leakage port through housing wall 104, for example, about 1 mm to about 3 mm. Opening and / or closing of vane 214 may be actuated by applying a voltage to impart variable impedance control. For example, in some aspects, applying a direct current (DC) voltage may be used to open vane 214. In other aspects, once vane 214 is open, it may be considered "latched" and may be held in the open position while reducing power to virtually zero. In this respect, valve 114 may consume a relatively low amount of power when transitioning between open / closed states or configurations.

[0038] Typically, the flap 214 may include: a first end portion 230, which is considered a free end portion that is freely movable relative to the support member 224 to open / close the opening 120; and a second end portion 232, which is connected to the support member 222 via a hinge 226. The second end portion 232 drives the free end portion or the first end portion 230 to move between an open position and a closed position. The free end portion or the first end portion 230 is considered to be in a closed position when it contacts the support member 224, in which the free end portion or the first end portion closes the opening 120. The free end portion or the first end portion 230 may be in an open position when it is not in contact with the support member 224 or when there is otherwise a gap between the end portion 230 and the support member 224, in which the free end portion or the first end portion opens the opening 120. In some aspects, hinge 226 may include a spring or biasing mechanism 236 that biases flap 214 toward a closed or horizontal position in which flap 214 covers opening 120, such as Figure 2 As shown. In this respect, in Figure 2 In the static state shown (e.g., without applied voltage), the flap 214 will remain closed or otherwise positioned such that it covers the opening 120. However, applying a sufficient voltage to the flap 214 will create an attractive force between the flap 214 and the support member 222, overcoming the biasing force of the hinge 226. This, in turn, causes the flap 214 to move or rotate (as indicated by the arrow) toward the support member 222 to an open position (or vertical position), in which the flap does not cover the opening 120 and is latched to the support member 222 due to electrostatic force, as... Figure 3 As shown. (From...) Figure 2It can be further seen that when the fin 214 is closed, the internal cavity 106 of the housing is closed or sealed off from the surrounding environment 112. On the other hand, when the fin 214 is closed as... Figure 4 When in the open position, the internal chamber 106 is either open or shares volume with the surrounding environment 112.

[0039] In one aspect, the wing 214 and / or support member 222 may include a material that allows the wing 214 to open and / or close relative to the opening 120 when a voltage and electrostatic force are applied. Typically, the wing 214 may include a first material layer 234A made of a metallic material and a second material layer 234B made of a structural material. In some aspects, the wing 214 may also include an optional deformable material layer 234C connected to the second material layer 234B and the first material layer 234A. When a voltage is applied, the deformable material layer 234C can deform, thereby driving the wing 214 to deform into different mechanical modes for particle removal, as previously discussed. In other aspects, the deformable material layer 234C may be omitted, and alternatively, the material of one or more of the material layers 234A, 234B may deform the wing 214 into different mechanical modes when a voltage is applied. For example, material layer 234A may be made of a metallic material or another material having an embedded material that deforms the layer into different mechanical modes when a voltage is applied. In some aspects, one or more of the materials used for layers 234A-234C may be made of any MEMS material. For example, the first material layer 234A may be made of a metallic material, including but not limited to gold, aluminum, etc. In some aspects, the first material layer 234A may be referred to herein as an electrode layer, or mentioned as including electrodes. The second material layer 234B may be made of a structural material, including but not limited to polycrystalline silicon, silicon nitride, silicon carbide, monocrystalline silicon, or polymer MEMS materials in general. The third material layer 234C may be made of a metallic material similar to the first material layer 234A. The first material layer 234A, the second material layer 234B, and the optional third material layer 234C may be fixedly attached to each other (e.g., during processing operations, using adhesives, etc.) to form a flap 214. The support member 222 may include a material that allows the flap 214 to rotate toward and latch to the support member 222 when a force is applied. Typically, the support member 222 may be a vertical extension (or wall) of a base or housing wall and includes an insulating material 228 attached to the side or surface facing the flap 214. In some aspects, the support member 222 may be made of monocrystalline silicon, quartz, or glass, and the insulating material 228 may be, for example, a layer of alumina or silicon dioxide. When a DC voltage is applied to the flap 214, the voltage will slowly begin to exert a force on the flap 214. This voltage may be continuously increased until an attractive force is generated that causes the flap 214 to move or rotate toward and latch onto the support member 222. It should also be understood that once latched, the flap 214 may remain latched while the power is reduced to almost zero due to electrostatic forces. However, once the voltage is reduced to a certain threshold, the spring / mechanical force of the hinge 226 will overcome the electrostatic force, causing the flap 214 to rotate back. Figure 2The closed position is shown. In some aspects, the device may have an application-specific integrated circuit (ASIC) 242, which may be adjacent to the wing 214 and used to apply the voltage (e.g., DC voltage) required to dynamically control the wing 214.

[0040] like Figure 2 Further, in some aspects, particles 240 may adhere to the fin 214, thereby inhibiting the operation of the fin 214. For example, particles 240 may be solid particles that enter the opening 120 from the surrounding environment 112 or may originate from within the internal chamber 106. Particles 240 may adhere (e.g., adhere to or stick) to the inner side surface of the fin 214, as shown. For example, particles 240 may adhere to the inner side surface of the material layer 234B of the fin 214. In this aspect, if the fin moves to a position where particles 240 are attached, such as... Figure 4 In the open position shown, particles 240 are trapped between the vane 214 and the support structure 222. This may in turn interfere with the vane 214 “latching” to the structure 222. To remove these particles 240, the valve 114 may also include a particle removal system, component, or mechanism 122. The particle removal system, component, or mechanism 122 may be or otherwise include an actuator operable to actuate or cause the vane 214 to deform into one or more of a variety of mechanical modes that remove or otherwise eliminate particles 240 from the vane 214. Typically, the actuator may include an alternating current (AC) circuit 244 that generates and / or applies one or more AC frequencies 244A of a plurality of AC frequencies that cause the vane 214 to deform into one or more desired mechanical modes. In some aspects, the frequencies 244A may be in the range of ultrasonic frequencies inaudible to a user. For example, the AC circuit 244 may generate or apply AC frequencies 244A in the range of 20 kHz or greater to actuate different mechanical modes. Typically, each mechanical mode can be actuated via a different frequency range. To actuate different mechanical modes, the AC circuit 244 can apply a frequency 244A within the range where the desired actuation mode is found. The AC circuit 244 can simultaneously apply multiple frequencies (or tones) to actuate multiple modes simultaneously, or sequentially apply multiple frequencies (or tones) to actuate multiple modes sequentially, as shown in the reference... Figures 5A to 5E To be discussed in more detail. When one or more frequencies (or tones) 244A are applied through AC circuit 244, the deformation and / or vibration of the vane 214 will be greater in some areas than in others, causing the particles 240 attached to the vane 214 to detach and fall off the vane 214, such as... Figure 3 As shown. With particle 240 now removed from wing 214, wing 214 can move freely to the open configuration and can be latched to support member 222 without interference from particle 240, as... Figure 4 As shown.

[0041] Reference Figures 5A to 5E Describe the representative different mechanical modes that can be achieved depending on the applied AC frequency. For example, from... Figures 5A to 5E It can be seen that winglet 214 can be based on previous references Figures 2 to 4 The discussed deformation into different shapes, configurations, or modes is caused by the frequency applied by the AC circuit actuator. Typically, depending on the applied frequency, the vane 214 may have greater acceleration or vibration in some parts than in others, causing it to deform into a variety of different configurations. This, in turn, allows the use of different mechanical modes to remove particles from different areas of the valve. For example, the AC circuit 244 can apply a frequency in a first range of about 20 kHz to about 30 kHz to actuate a first mechanical mode, apply a frequency in a second range of about 30 kHz to about 40 kHz to actuate a second mechanical mode, apply a frequency in a third range of about 40 kHz to about 100 kHz to actuate a third mechanical mode, apply a frequency in a fourth range of about 100 kHz to about 150 kHz to actuate a fourth mechanical mode, or apply a frequency in a fifth range of about 150 kHz to about 200 kHz to actuate a fifth mechanical mode. AC circuit 244 can generate or apply a frequency (or tone) in a single frequency range for actuating one of the mechanical modes, while simultaneously actuating multiple frequencies (or tones) across multiple frequency ranges for multiple mechanical modes, or sequentially actuating a sequence or scan of frequencies (or tones) across multiple frequency ranges for mechanical modes.

[0042] For reference Figure 5A , Figure 5AA wing 214 deformed into a first mechanical mode 214-1 is shown. The deformation of the wing 214 into the first mechanical mode 214-1 can be caused by applying an AC voltage or current at a first frequency and / or at one or more frequencies within a first frequency range by the particle removal mechanism 122. The first frequency or first frequency range may, for example, be in the range of about 20 kHz to about 30 kHz. For example, in a stationary or unactuated state, the wing 214 may be a flat or planar structure having sides 214A, 214B, 214C, 214D in the XY plane represented by profile 516. The application of an AC voltage at or within the first frequency range actuates the wing 214, thereby causing side 214A to vibrate out of plane and / or deform into the first mechanical mode 214-1. Typically, side 214A may vibrate and / or deform out of plane in the direction indicated by the arrow. The opposing sides 214C of the vane 214 may be unacted or minimally actuated at this frequency, such that they remain undeformed or otherwise substantially contained within the plane 516. In this respect, the actuation or deformation of the vane 214 at certain sides, regions, or areas may be greater than at other sides, regions, or areas to remove particles accumulated at those sides, regions, or areas. For example, the vane 214 may be considered to have different surface regions or areas 514A, 514B, 514C, and 514D, defined by the intersection of an axis 502 (e.g., the Y-axis) along the centerline and an axis 504 (e.g., the X-axis) intersecting the axis 502, such as... Figure 5A As shown. The application of an AC voltage within a first frequency range can cause one or more of these surface regions or regions 514A-514D to vibrate, thereby deforming them out of plane to remove particles adhering to these regions or regions. For example, in Figure 5A In the first mechanical mode 214-1 shown, regions 514A and 514B between side 214A and axis 504 vibrate and deform, while regions 514C and 514D are not actuated and remain in a substantially static configuration. Therefore, the first mechanical mode 214-1 may be optimal for removing particle accumulation in regions 514A-514B of the blade 214.

[0043] Figure 5BA wing 214 in a second mechanical mode 214-2 is shown. Deformation of the wing 214 into the second mechanical mode 214-2 can be caused by the application of an AC voltage or current at a second frequency and / or at one or more frequencies within a second frequency range by the particle removal mechanism 122. The second frequency or second frequency range may, for example, be in the range of about 30 kHz to about 40 kHz. For example, in a stationary or unactuated state, the wing 214 may be a flat or planar structure having sides 214A, 214B, 214C, 214D in the XY plane represented by profile 516, as previously discussed. The application of an AC voltage at or within the second frequency range actuates the wing 214, causing sides 214B and 214D to vibrate out of plane and deform into the second mechanical mode 214-2. Typically, sides 214B and 214D may vibrate or deform out of plane in opposite directions as indicated by the arrows. The center or middle portion of the wing 214 may be unacted or minimally actuated at this frequency, so that it remains undeformed or otherwise substantially contained within the plane 516. For example, in Figure 5B In the second mechanical mode 214-2 shown, the portions of regions 514B and 514C closest to side 214B and the portions of regions 514A and 514D closest to side 214D vibrate and deform, while the portions of regions 514A-514D closest to the center or centerline of the blade 214 are not actuated and remain in a substantially static configuration. Therefore, the second mechanical mode 214-2 may be optimal for removing particle buildup on the portions of regions 514A-514D near sides 214B and 214D.

[0044] Figure 5CA wing 214 in a third mechanical mode 214-3 is shown. Deformation of the wing 214 into the third mechanical mode 214-3 can be caused by applying an AC voltage or current at a third frequency and / or at one or more frequencies within a third frequency range by the particle removal mechanism 122. The third frequency or third frequency range may, for example, be in the range of about 40 kHz to about 100 kHz. For example, in a stationary or unactuated state, the wing 214 may be a flat or planar structure having sides 214A, 214B, 214C, 214D in the XY plane represented by profile 516, as previously discussed. The application of an AC voltage at or within the third frequency range actuates the wing 214, causing the entire side 214C and portions of sides 214A, 214B, and 214D to vibrate out of plane and deform into the third mechanical mode 214-3. Representatively, portions of side 214C and sides 214A, 214B, and 214D may vibrate or deform out of plane in the direction indicated by the arrow. The arcuate region along the center or middle of the blade 214 may be unacted or minimally actuated at this frequency, so that it remains undeformed or otherwise substantially within plane 516. For example, in Figure 5C In the third mechanical mode 214-3 shown, most of the portions of regions 514C and 514D closest to side 214C, and the central or midline portions of regions 514A and 514B closest to side 214A, vibrate and deform, while the remaining portions of regions 514A-514D remain unacted and in a substantially static configuration. Therefore, the third mechanical mode 214-3 may be optimal for removing particle buildup on the portions of regions 514A-514D near sides 214A and / or 214C.

[0045] Figure 5DA wing 214 in a fourth mechanical mode 214-4 is shown. Deformation of the wing 214 into the fourth mechanical mode 214-4 can be caused by the application of an AC voltage or current at a fourth frequency and / or at one or more frequencies within a fourth frequency range by the particle removal mechanism 122. The fourth frequency or fourth frequency range may, for example, be in the range of about 100 kHz to about 150 kHz. For example, in a stationary or unactuated state, the wing 214 may be a flat or planar structure having sides 214A, 214B, 214C, 214D in the XY plane represented by profile 516, as previously discussed. The application of an AC voltage or current at or within the fourth frequency range actuates the wing 214, causing the entire sides 214B, 214D and portions of sides 214A, 214C to vibrate out of plane and deform into the fourth mechanical mode 214-4. Representatively, portions of sides 214B, 214D and sides 214A, 214C can vibrate or deform out of plane in the opposite directions as indicated by the arrows. The region between the centerline 502 of the blade 214 and sides 214B, 214D may be unacted or minimally actuated at this frequency, such that they remain undeformed or otherwise substantially within plane 516. For example, in Figure 5D In the fourth mechanical mode 214-4 shown, the portions of regions 514A-514D closest to the centerline 502 and the sides 214B and 214D vibrate and deform, while the remaining portions of regions 514A-D remain unacted and in a substantially static configuration. Therefore, the fourth mechanical mode 214-4 can be optimal for removing particle buildup in regions 514A-514D near the sides 214B and 214D or near the centerline or axis 502 of the winglet 214, as shown.

[0046] Figure 5EA wing 214 in a fifth mechanical mode 214-5 is shown. Deformation of the wing 214 into the fifth mechanical mode 214-5 can be caused by applying an AC voltage or current at a fifth frequency and / or at one or more frequencies within a fifth frequency range by the particle removal mechanism 122. The fifth frequency or fifth frequency range may, for example, be in the range of about 150 kHz to about 200 kHz. For example, in a stationary or unactuated state, the wing 214 may be a flat or planar structure having sides 214A, 214B, 214C, 214D in the XY plane represented by profile 516, as previously discussed. The application of an AC voltage or current at or within the fifth frequency range actuates the wing 214, causing the corners defined by sides 214A-214D to vibrate out of plane and deform into the fifth mechanical mode 214-5. Typically, each corner formed by adjacent sides 214A-214D may vibrate or deform out of plane in different directions as indicated by the arrows. The center of the wing 214 may be unacted or minimally actuated at this frequency, so that it remains undeformed or otherwise substantially contained within the plane 516. For example, in Figure 5E In the fifth mechanical mode 214-5 shown, the portions of regions 514A-514D closest to the corners defined by sides 214A-214D vibrate and deform, while the remaining portions of regions 514A-514D remain unacted and in a substantially static configuration. Therefore, the fifth mechanical mode 214-5 can be optimal for removing particle buildup on the portions of regions 514A-514D near the corners of fin 214, as shown.

[0047] As previously discussed, the particle removal mechanism 122 may have an AC circuit 244, which can simultaneously apply multiple frequencies (or tones) to simultaneously actuate multiple mechanical modes 214-1 to 214-5, as previously discussed, or sequentially apply multiple frequencies (or tones) as needed to sequentially actuate mechanical modes 214-1 to 214-5. For example, as referenced Figure 6 In one aspect, the representative particle removal process 600 may include providing a particle removal mechanism coupled to a valve at operation 602. The particle removal mechanism may be as previously referenced. Figures 1 to 5E The particle removal mechanism 122 is discussed, and the valve may be the valve 114 previously discussed with reference to these figures. At operation 604, the actuable particle removal mechanism applies a first frequency to the valve. The particle removal mechanism may be actuated by AC circuit 244 and applies the first frequency within the ultrasonic frequency range, as previously discussed. For example, the first frequency may be in the range of 20 kHz or greater, or, for example, a frequency in the range of 20 kHz to 30 kHz. At operation 606, the first frequency is applied, thereby deforming the valve to a first mechanical mode for particle removal. Typically, the first mechanical mode may be a reference... Figures 5A to 5BAny one of the mechanical modes 214-1 to 214-5 discussed. For example, in the case where the first frequency applied at operation 604 is in the range of 20kHz to 30kHz, the valve can be deformed to a reference frequency. Figure 5A The first mechanical mode 214-1 is described above. In other aspects, when the first frequency is in the range of 30 kHz or greater, the valve can be deformed to a reference... Figures 5B to 5E One of the mechanical modes 214-2 to 214-5. In some aspects, process 600 then continues to operation 608, in which the particle removal mechanism applies any one of a second frequency, a third frequency, a fourth frequency, or a fifth frequency to the valve. The second, third, fourth, and / or fifth frequencies may be in a range different from the first frequency already applied. For example, if the first frequency is in the range of 20 kHz to 30 kHz, the applied second to fifth frequencies may be in the range of 30 kHz or greater, or about 30 kHz to about 200 kHz. At operation 610, when the second to fifth frequencies are applied, the valve may be adapted to the second, third, fourth, or fifth mechanical mode for particle removal. For example, the valve may be adapted to the previously referenced... Figures 5A to 5E Any one of the mechanical modes 214-1 to 214-5 discussed. It should also be understood that in operations 604-610, different frequencies are applied sequentially (e.g., successively), and therefore the transitions between mechanical modes 214-1 to 214-5 can also be sequential. In other words, the valve is caused to deform once to one of the mechanical modes 214-1 to 214-5. For example, in operations 604-610, the particle removal mechanism can be understood as performing a sequential ultrasonic cleaning process in which the particle removal mechanism undergoes a scan of an ultrasonic frequency range (e.g., 20 kHz to 200 kHz), which are generated to remove any particles via multiple mechanical modes (e.g., modes 214-1 to 214-5) that sequentially actuate the valve.

[0048] However, process 600 may also include an alternative processing sequence of operations 612-614, in which multiple frequencies and multiple mechanical modes can be simultaneously actuated. Typically, while performing operation 604, operation 612 may be performed to actuate the particle removal mechanism to simultaneously apply any or more of a second, third, fourth, and / or fifth frequency to the valve. This then deforms the valve to a first, second, third, fourth, and / or fifth mechanical mode, such that in operation 614 the valve simultaneously or synchronously deforms to multiple mechanical modes. This sequence of operations 604, 612, 614 can be considered a multi-mode cleaning process in which the valve simultaneously deforms to multiple mechanical modes (e.g., modes 214-1 to 214-5) to remove particles from various surfaces of the valve. Furthermore, it should be understood that although a first frequency and / or mechanical mode, a second frequency and / or mechanical mode, a third frequency and / or mechanical mode, a fourth frequency and / or mechanical mode, and a fifth frequency and / or mechanical mode are described in process 600, any number of frequencies, frequency ranges, and / or mechanical modes may be applied and / or implemented in process 600. In other words, although the first to fifth frequencies and / or mechanical modes are described, “n” frequencies and / or mechanical modes may be applied and / or implemented sequentially or simultaneously depending on the operation of process 600.

[0049] For reference Figures 7 to 10 , Figures 7 to 10 Another particulate removal mechanism is mentioned, which can be implemented alone or in combination with any or more of the valves and particulate removal configurations previously discussed. Typically, it is similar to the previously discussed... Figures 1 to 6 The discussed device configuration, device 700, may include a housing wall 104 separating an internal volume or chamber 106 from the surrounding environment 112. A valve 114 may be coupled to a vent or leak port 720 for venting the internal volume or chamber 106 to the surrounding environment 112. An application-specific integrated circuit (ASIC) 242 may be further coupled to the valve 114 to apply a voltage (e.g., DC voltage) required for dynamically controlling the valve 114. Additionally, a particle removal mechanism 122 may be coupled to the valve 114 for removing particles from the valve 114, as previously referenced. Figures 1 to 6 As discussed previously, the particle removal mechanism 122 can be used to remove solid particles from the valve vanes.

[0050] In some aspects, the system or device may also or alternatively include a particle removal system, component, or mechanism 702 operable to remove liquid particles in the vicinity of valve 114 and / or within device 100. Typically, the particle removal mechanism 702 may be used to remove liquid particles 713 that may accumulate in, near, or within the passage between valve 114 and the surrounding environment 112, or on another volume or chamber. In some aspects, the passage between valve 114 and the surrounding environment 112 may be an ultrasonic nozzle 704 including an actuator 706 operable to expel liquid particles 713 from the passage. Typically, the nozzle 704 may be formed by one or more Fourier horns that generate standing waves within the passage between valve 114 and the surrounding environment 112. In some aspects, the diameter of the nozzle 704 may be tuned to maintain a desired acoustic impedance. For example, the diameter of the nozzle 704 may be optimized or tuned to not eliminate the acoustic impedance specification selected for the system. Actuator 706 can generate or apply ultrasonic or high-frequency waves, which can then propel liquid particles 713 from the passage into the surrounding environment 112. Typically, actuator 706 can be coupled to AC circuit 708, which can be used to drive actuator 706 to apply a high-frequency voltage. For example, actuator 706 can be coupled to nozzle 704 and can cause the wall of nozzle 704 to vibrate at a very high frequency, which causes the liquid particles to be propelled into the environment 112.

[0051] For more details, please refer to [link / reference]. Figure 7 The nozzle 704 and particle removal mechanism 702 shown illustrate that, in this configuration, the nozzle 704 includes a closed base end 710, an open end 712 opening to the surrounding environment 112 (or another system volume), and sidewalls 714, 716 defining a passage between the ends 710 and 712. In some aspects, the ends 710 and the sidewalls 714, 716 may define a multi-Fourier horn nozzle or structure that, as previously discussed, defines a passage to the surrounding environment 112. In some aspects, a valve 114 may be coupled to the sidewall 714. The valve 114 can be used to control the opening / closing of a vent or leak port 720 in the sidewall 714. When the valve 114 is in the open position or the port 720 is otherwise considered open, the port 720 can connect the internal volume or chamber 106 to the surrounding environment 112. The valve 114 may be positioned near the closed end 710 as shown. Actuator 706 can be connected to side wall 716 opposite valve 114.

[0052] Actuator 706 may also be positioned near the closed end 710. In some aspects, actuator 706 may be a piezoelectric (PZT) film, layer, or other structure that is applied to or otherwise attached to the sidewall 716 and actuated upon application of a voltage. During operation of the particle removal mechanism 702, AC circuit 708 drives actuator 706 to apply a high-frequency voltage, as previously discussed. This high-frequency voltage causes the sidewall 716 to vibrate and generates high-frequency waves within nozzle 704. These high-frequency waves then expel liquid particles 713 from the open end 712 into the surrounding environment 112, such as... Figure 8 As shown. Typically, in some aspects, actuator 706 can increase the pressure within the passage formed by nozzle 704, which in turn causes displacement of sidewall 716 or otherwise causes vibration of the sidewall. As previously discussed, valve 114 is closed during operation of actuator 706, so the only direction in which liquid particles 713 can be driven is from the open end 712 to the surrounding environment 112. In this respect, it is desirable for valve 114 to be in a closed configuration (e.g., port 720 closed) during operation of particle removal mechanism 702. When particle removal mechanism 702 is not in use, valve 114 can be in an open configuration (e.g., port 720 open), such that the internal volume or chamber 106 is open to the surrounding environment 112.

[0053] For reference Figure 9 , Figure 9 Another representative nozzle and particle removal mechanism is shown. Typically, Figure 9 The nozzle 704 and particle removal mechanism 702 shown can be compared with the reference. Figures 7 to 8 The same applies. However, in this configuration, valve 114 is used to open / close port 720 in the closed base end 710 of nozzle 704. Actuator 706 of particle removal mechanism 702 remains coupled to sidewall 716 of nozzle 704. In this respect, valve 114 and actuator 706 are located on adjacent ends and / or walls 710, 716 of nozzle 704. Similar to the previously discussed configuration, during operation of particle removal mechanism 702, AC circuit 708 drives actuator 706 to apply a high-frequency voltage, as previously discussed. This high-frequency voltage causes the closed base end 710 to vibrate and generates high-frequency waves within nozzle 704. These high-frequency waves can then push liquid particles 713 from open end 712 into the surrounding environment 112, such as... Figure 9As shown. As previously discussed, valve 114 is closed during operation of actuator 706, so the only direction in which liquid particles 713 can be driven is from the open end 712 out to the surrounding environment 112. In this respect, it is desirable for valve 114 to be in a closed configuration (e.g., port 720 closed) during operation of particle removal mechanism 702. When particle removal mechanism 702 is not in use, valve 114 can be in an open configuration (e.g., port 720 open), such that the internal volume or chamber 106 is open to the surrounding environment 112.

[0054] For reference Figure 10 , Figure 10 Another configuration of a representative nozzle and particle removal mechanism is shown. Typically, Figure 10 The nozzle 704 and particle removal mechanism 702 shown can be compared with the reference. Figures 7 to 9 The same applies. However, in this configuration, the actuator 706 of the particle removal mechanism 702 is coupled to a valve 114 for opening / closing the port 720 in the closed base end 710 of the nozzle 704. In this respect, the valve 114 and the actuator 706 combine to form a dual-function structure or mechanism coupled to the base end 710 of the nozzle 704. Typically, the actuator 706 may be a PZT film or layer applied to the vanes of the valve 114. For example, refer to... Figure 2 The optional layer 234C described as located on the vane 214 of valve 114 can be a PZT film or layer forming the actuator 706 of particle removal mechanism 702. Similar to the previously discussed configuration, during operation of particle removal mechanism 702, AC circuit 708 drives actuator 706 to apply a high-frequency voltage, as previously discussed. This high-frequency voltage causes the bottom side 710 to vibrate and generates a high-frequency wave within nozzle 704. This high-frequency wave then pushes liquid particles 713 from open end 712 into the surrounding environment 112, such as... Figure 10 As shown. As previously discussed, valve 114 is closed during operation of actuator 706, so the only direction in which liquid particles 713 can be driven is from the open end 712 out to the surrounding environment 112. In this respect, it is desirable for valve 114 to be in a closed configuration (e.g., port 720 closed) during operation of particle removal mechanism 702. When particle removal mechanism 702 is not in use, valve 114 can be in an open configuration (e.g., port 720 open), such that the internal volume or chamber 106 is open to the surrounding environment 112.

[0055] It should also be understood that, although the particle removal mechanism 702 is in Figures 7 to 10 The text is shown as a reference. Figures 2 to 6 The particle removal mechanism 122 is described in combination, but the particle removal mechanism 122 can be optional and can be selected from... Figures 7 to 10The omission of this feature makes particle removal mechanism 702 the only particle removal mechanism used in combination with valve 114 in this configuration. In other words, it should be understood that particle removal mechanisms 122 and / or 702 can be used alone or in combination as needed. In this respect, Figures 1 to 10 The various components, aspects and / or mechanisms described should be understood as illustrative, and any one or more of the aspects and / or mechanisms shown may be optional, omitted and / or combined with aspects that may be shown or may not be shown from other figures.

[0056] Figure 11 A block diagram of one aspect of the electronic equipment in which the transducer and / or valve assemblies previously discussed can be implemented is shown. Figure 11 As shown, device 1100 can be any type of portable device in which the transducer and / or valve assembly disclosed herein is expected, such as a handset (e.g., an in-ear handset, hearing aid, etc.), a mobile phone, a personal digital assistant, a portable timing device, or other portable device. Device 1100 may include storage device 1102. Storage device 1102 may include one or more different types of storage devices, such as hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory), volatile memory (e.g., battery-based static or dynamic random access memory), etc.

[0057] Processing circuitry 1104 can be used to control the operation of device 1100. Processing circuitry 1104 may be based on a processor, such as a microprocessor and other suitable integrated circuits. In a suitable arrangement, processing circuitry 1104 and storage device 1102 can be used to run software on device 1100, such as internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. Processing circuitry 1104 and storage device 1102 can be used to implement suitable communication protocols. Communication protocols that can be implemented using processing circuitry 1104 and storage device 1102 include Internet Protocol, wireless LAN protocols (e.g., IEEE 802.11 protocol, sometimes referred to as...). Protocols for other short-range wireless communication links, such as Protocols, protocols used to process 3G or 4G communication services (e.g., using wideband code division multiple access technology), 2G cellular telephone communication protocols, etc.

[0058] To minimize power consumption, processing circuitry 1104 may include power management circuitry for implementing power management functions. For example, processing circuitry 1104 may be used to adjust the gain settings of amplifiers (e.g., RF power amplifier circuitry) on device 1100. Processing circuitry 1104 may also be used to adjust the power supply voltage supplied to portions of the circuitry on device 1100. For example, a higher DC power supply voltage may be supplied to active circuitry, and a lower DC power supply voltage may be supplied to less active or inactive circuitry. If desired, processing circuitry 1104 may be used to implement control schemes in which the power amplifier circuitry is adjusted to accommodate transmission power level requests received from the wireless network.

[0059] Input-output device 1106 can be used to allow data to be supplied to device 1100 and to be supplied from device 1100 to external devices. Display screens, microphone acoustic ports, speaker acoustic ports, and docking ports are examples of input-output device 1106. For example, input-output device 1106 may include user input-output device 1108, such as buttons, touchscreens, joysticks, click wheels, scroll wheels, touchpads, keypads, keyboards, microphones, cameras, etc. Users can control the operation of device 1100 by supplying commands via user input device 1108. Display and audio device 1110 may include a liquid crystal display (LCD) screen or other screen, light-emitting diodes (LEDs), and other components that display visual information and status data. Display and audio device 1110 may also include audio equipment, such as speakers, and other devices for generating sound. Display and audio device 1110 may include audio-visual interface equipment, such as jacks and other connectors for external headphones and monitors.

[0060] Wireless communication device 1112 may include communication circuitry, such as radio frequency (RF) transceiver circuitry formed by one or more integrated circuits, power amplifier circuitry, passive RF components, an antenna, and other circuitry for handling RF wireless signals. Light (e.g., infrared communication) may also be used to transmit wireless signals. Typically, in the case of a speaker acoustic port, the speaker may be associated with the port and communicate with an RF antenna for transmitting signals from a remote user to the speaker.

[0061] Return to Figure 11Device 1100 can communicate with external devices such as accessory 1114, computing equipment 1116, and wireless network 1118, as shown in paths 1120 and 1122. Path 1120 can include wired and wireless paths. Path 1122 can be a wireless path. Accessory 1114 can include headphones (e.g., wireless cellular headphones or audio headsets) and audio-visual equipment (e.g., wireless speakers, game controllers, or other equipment that receives and plays audio and video content), peripheral devices such as wireless printers or cameras, etc.

[0062] Computing device 1116 can be any suitable computer. In a suitable arrangement, computing device 1116 is a computer with an associated wireless access point (router) or internal or external wireless network card that establishes a wireless connection with device 1100. The computer can be a server (e.g., an internet server), a local area network computer with or without internet access, a user's own personal computer, a peer-to-peer device (e.g., another portable electronic device), or any other suitable computing device.

[0063] Wireless network 1118 may include any suitable network equipment, such as cellular phone base stations, cellular towers, wireless data networks, computers associated with the wireless network, etc. For example, wireless network 1118 may include network management equipment that monitors the wireless signal strength of wireless mobile phones (cellular phones, handheld computing devices, etc.) communicating with network 1118.

[0064] While certain aspects have been described and illustrated in the accompanying drawings, it should be understood that such aspects are merely illustrative of a broad disclosure and not limiting, and that this disclosure is not limited to the specific structures and arrangements shown and described, as various other modifications will be apparent to those skilled in the art. For example, any one or more aspects described and illustrated in the drawings may be optional, omitted, and / or combined with aspects shown in other drawings. Therefore, the description is to be regarded as exemplary and not restrictive. For example, although particle removal mechanism 122 is described as being for removing solid particles and particle removal mechanism 702 is described as being for removing liquid particles, mechanisms 122 and 702 can be used to remove any type of particles. Furthermore, although particle removal mechanisms 122 and 702 are described as being combined with valve 114, these particle removal mechanisms can be used to remove… Figure 1Particles near any of the other valves 116, 118, or structures other than valves. Additionally, although a loudspeaker is specifically disclosed herein, the valves disclosed herein can be used with other types of transducers, such as microphones. Furthermore, in some aspects, the valves can be used to open / close openings to acoustic resonators or attenuators coupled to the transducer. Furthermore, although portable electronic devices such as mobile communication devices are described herein, any of the valve and transducer configurations previously described can be implemented in tablet computers, personal computers, laptop computers, notebook computers, headphones, etc. Moreover, to assist the Patent Office and any reader of any patent granted under this application in interpreting the appended claims, the applicant wishes to indicate that they do not intend any appended claims or claim elements to reference 35U.SC112(f) unless “means for…” or “steps for…” is expressly used in a particular claim.

Claims

1. A portable electronic device, comprising: The housing has a housing wall forming an internal chamber for accommodating a transducer and a valve operable to open or close a vent leading to the internal chamber; as well as A particle removal mechanism coupled to the valve, operable to displace particles from the valve upon application of an electric current, wherein the particle removal mechanism includes an AC circuit operable to apply an electric current that deforms a moving part of the valve into at least one of several mechanical modes capable of removing solid particles from the valve. In the various mechanical modes, the AC circuit can be operated to apply different frequencies to generate greater acceleration or vibration in one part of the moving component than in another, thereby removing solid particles from different areas of the valve.

2. The portable electronic device according to claim 1, wherein the current is within the ultrasonic frequency range.

3. The portable electronic device of claim 1, wherein the current comprises a plurality of frequencies in the ultrasonic frequency range applied in sequence to deform the moving part.

4. The portable electronic device of claim 1, wherein the current comprises multiple frequencies in the ultrasonic frequency range applied simultaneously to deform the moving part.

5. The portable electronic device of claim 1, wherein the valve comprises an electrostatic valve having a flap that deforms when the current is applied.

6. The portable electronic device of claim 1, wherein the particle removal mechanism comprises a Fourier horn connecting the vent to the surrounding environment and a piezoelectric actuator for displacing liquid particles within the Fourier horn into the surrounding environment.

7. The portable electronic device of claim 6, wherein the actuator is attached to the sidewall of the Fourier horn or the moving part of the valve.

8. A portable electronic device, comprising: A housing having housing walls forming an internal chamber and ports opening to the surrounding environment; A transducer, the transducer being positioned within the internal cavity, and the internal cavity being divided into a front volume chamber connecting a first side of the transducer to the port and a rear volume chamber connecting a second side of the transducer; A valve, the valve including a movable part operable to open and close a vent to the internal chamber, the front volume chamber or the rear volume chamber; as well as An actuator, coupled to the valve, operable to actuate the moving part to deform into at least one of a plurality of mechanical modes capable of removing particles from the valve. In the various mechanical modes, the actuator can be operated to apply different frequencies to generate greater acceleration or vibration in one part of the moving component than in another, thereby removing particles from different areas of the valve.

9. The portable electronic device of claim 8, wherein the actuator includes an AC circuit capable of operating to generate an AC frequency in the ultrasonic frequency range that deforms the moving part.

10. The portable electronic device of claim 9, wherein the AC circuit sequentially applies a plurality of frequencies within the ultrasonic frequency range that deform the movable component.

11. The portable electronic device of claim 9, wherein the AC circuit simultaneously applies multiple frequencies within the ultrasonic frequency range that deform the moving part.

12. The portable electronic device of claim 8, wherein the plurality of mechanical modes includes a first mechanical mode actuated by applying alternating current in the frequency range of 20 kHz to 30 kHz.

13. The portable electronic device of claim 8, wherein the plurality of mechanical modes includes a second mechanical mode actuated by applying alternating current in the frequency range of 30 kHz to 40 kHz.

14. The portable electronic device of claim 8, wherein the plurality of mechanical modes includes a third mechanical mode actuated by applying alternating current in the frequency range of 40 kHz to 100 kHz.

15. The portable electronic device of claim 8, wherein the plurality of mechanical modes includes a fourth mechanical mode actuated by applying alternating current in the frequency range of 100 kHz to 150 kHz.

16. The portable electronic device of claim 8, wherein the plurality of mechanical modes includes a fifth mechanical mode actuated by applying alternating current in the frequency range of 150 kHz to 200 kHz.

17. The portable electronic device of claim 8, wherein the valve comprises an electrostatic valve.

18. The portable electronic device according to claim 8, further comprising: A Fourier horn that connects the vent to the surrounding environment; and a piezoelectric actuator operable to expel liquid from the Fourier horn into the surrounding environment.

19. The portable electronic device of claim 18, wherein the piezoelectric actuator is attached to the sidewall of the Fourier horn and causes displacement of the sidewall, the displacement displacing the liquid into the surrounding environment.

20. A microelectromechanical device, comprising: A valve, operable to open or close a vent to a housing chamber connected to the transducer; as well as A particle removal mechanism coupled to the valve, operable to displace particles from the valve upon application of an electric current, wherein the particle removal mechanism includes an AC circuit operable to apply an electric current that deforms a moving part of the valve into at least one of several mechanical modes capable of removing solid particles from the valve. In the various mechanical modes, the AC circuit can be operated to apply different frequencies to generate greater acceleration or vibration in one part of the moving component than in another, thereby removing solid particles from different areas of the valve.

21. The microelectromechanical device according to claim 20, wherein the current is within the ultrasonic frequency range.

22. The microelectromechanical device of claim 20, wherein the current comprises a plurality of frequencies in the ultrasonic frequency range applied sequentially to deform the moving part.

23. The microelectromechanical device of claim 20, wherein the current comprises multiple frequencies in the ultrasonic frequency range applied simultaneously to deform the moving part.

24. The microelectromechanical device of claim 20, wherein the valve comprises an electrostatic valve having a flap that deforms when the current is applied.

25. The microelectromechanical device of claim 20, wherein the particle removal mechanism comprises a Fourier horn connecting the vent to the surrounding environment and a piezoelectric actuator for displacing liquid particles within the Fourier horn into the surrounding environment.

26. The microelectromechanical device of claim 25, wherein the piezoelectric actuator is attached to the sidewall of the Fourier horn or the moving part of the valve.

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