System chassis with divider walls having concave edges

Abstract

A system chassis can include a frame having a width, a depth, and a height, and a plurality of divider walls coupled to the frame and forming a plurality of receptacles each configured to receive an electronics tray containing electronic components. Each of the plurality of divider walls includes a sheet of metal having a front edge, a back edge, and two lateral edges attached to two lateral walls of the frame. The front edge of the sheet of metal has a concave shape such that a distance between the front edge and the back edge of the sheet of metal continuously decreases when moving laterally from one lateral edge to a center of the front edge and continuously increases when moving laterally from the center to an opposite lateral edge.

Description

Technical Field

[0001] This disclosure relates to a system chassis, a computing system having multiple electronic device trays, and a method for attaching the electronic device trays to the system chassis. Background Technology

[0002] Some electronic systems include multiple electronic devices (e.g., servers, networking devices, power supply units, etc.) housed together within a common mechanical enclosure (referred to as a system chassis). Each of these electronic devices includes an electronic component (e.g., a system board with a processor and memory) and a mechanical support structure or enclosure (which may be referred to herein as an electronic component tray) that supports and / or houses the electronic component. The electronic component tray may be received in a corresponding slot or recess within the system chassis.

[0003] One or more partition walls are often included in a system chassis. Partition walls help define slots or receptacles for receiving electronic component trays, which, when the trays are assembled into the system chassis, act as partitions between the individual electronic component trays. Partition walls help support the electronic component trays and provide signal isolation between the electronic components. Partition walls are typically attached to two opposing sides of the system chassis, and sometimes also to the rear side. However, partition walls are generally not attached to the front of the system chassis; that is, the front of the system chassis often remains relatively open to allow unobstructed tray insertion. Partition walls can be constructed from sheet metal (such as steel), and can be relatively thin to limit their weight, the amount of space they occupy, and their cost.

[0004] Some electronic systems are configured to be mounted in racks. For example, system enclosures based on standard racks typically conform to the Electronic Industries Association (EIA) standard EIA-310. EIA-310 allows for a wide variety of component configurations, including various heights and depths for electronic component trays. However, all of these configurations are fitted into system enclosures with a maximum width of 19 inches, thus limiting the width of the electronic component trays to 17.5 inches. Other system enclosures may conform to other standards and / or have other dimensions. Summary of the Invention

[0005] According to one aspect of this disclosure, a system chassis is provided, comprising: a frame having a width, a depth, and a height; and a plurality of partition walls coupled to the frame and forming a plurality of receptacles, each receptacle being configured to receive an electronic device tray containing electronic components, wherein each of the plurality of partition walls comprises a metal sheet having a front edge, a rear edge, and two lateral edges attached to two lateral walls of the frame, and wherein the front edge of the metal sheet has a concave shape such that the distance between the front edge and the rear edge of the metal sheet continuously decreases as it moves laterally from one lateral edge to the center of the front edge and continuously increases as it moves laterally from the center to the other lateral edge.

[0006] According to another aspect of this disclosure, a computing system having multiple electronic device trays is provided, comprising: a system chassis including: a frame having a width, a depth, and a height; and a plurality of partition walls coupled to the frame and forming a plurality of receptacles, each of the plurality of partition walls including a metal sheet having a front edge, a rear edge, and two lateral edges attached to two lateral walls of the frame; and a plurality of electronic device trays, each of the plurality of system trays being mounted in one of the plurality of receptacles, each electronic device tray including at least one electronic component, wherein the front edge of the metal sheet has a concave shape such that the distance between the front edge and the rear edge of the metal sheet continuously decreases as it moves laterally from one lateral edge to the center of the front edge and continuously increases as it moves laterally from the center to another lateral edge.

[0007] According to another aspect of this disclosure, a method for attaching an electronic device tray to a system chassis is provided, comprising: aligning an electronic device tray containing electronic components into an opening in a housing in the system chassis, the housing being formed by a frame in the system chassis and two partition walls attached to the frame, wherein the front edges of the two partition walls have a concave shape such that the distance between the front and rear edges of a metal sheet continuously decreases as it moves laterally from one side edge to the center of the front edge and continuously increases as it moves laterally from the center to an opposing side edge; engaging a leading edge of the electronic device tray with at least one corner of the front edge of at least one of the two partition walls forming the housing; and inserting the electronic device tray into the housing such that the leading edge of the electronic device tray contacts the front edge of the at least one partition wall in the partition walls over an increased contact area until the center of the front edge. Attached Figure Description

[0008] It can be described alone or in conjunction with the following detailed description. Figure 1 To understand this disclosure, the accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and form a part of this specification. The drawings illustrate one or more examples of the teachings and, together with the description, explain certain principles and operations. In the drawings:

[0009] Figure 1 This is a block diagram illustrating the system, including the system chassis.

[0010] Figure 2A A 3D view of the system chassis is shown.

[0011] Figure 2B It shows Figure 2A Front view of the system chassis.

[0012] Figure 3 It shows Figure 2A A top view of the partition wall of the system chassis.

[0013] Figures 4A to 4D A top view of the electronic component tray during the various stages of attachment of the electronic component tray to the system chassis is shown, as well as... Figure 2A The cross-sectional view of the system chassis taken along 4-4 ​​in Figure 2.

[0014] Figures 5A to 5D This illustrates the various stages during which the electronic component tray is attached to the system chassis. Figures 4A to 4D A 3D view of the electronic component tray and system chassis.

[0015] Figures 6A to 6DThis illustrates the various stages during which the electronic component tray is attached to the system chassis. Figures 4A to 4D Rear view of the electronic component tray and system chassis.

[0016] Figure 7 This illustrates the case where the electronic component tray is attached to the system chassis. Figures 4A to 4D A 3D view of the electronic component tray and system chassis.

[0017] Figure 8 A perspective view of another system chassis is shown.

[0018] Figure 9 It shows Figure 8 Front view of the system chassis.

[0019] Figure 10 A top view of another partition wall is shown.

[0020] Figure 11 This is a block diagram illustrating the computing system.

[0021] Figure 12 This is a flowchart illustrating an example process for attaching an electronic component tray to a system chassis. Detailed Implementation

[0022] In some system enclosures, partition walls (especially those constructed of thin metal) may experience some degree of bending. This bending often occurs most commonly along the front edges of the partition walls, which are not directly supported by the system enclosure. In some cases, this bending may be caused by gravity applied to the partition wall. In other cases, it may be caused by external objects “squeezing” the system enclosure, such as the weight of another system stacked on top of it. If the bending or flexing becomes excessive, the user may be unable to insert the electronic component tray into the system enclosure due to interference between the tray and the bent partition wall. In some cases, if an attempt is made to insert the electronic component tray into a holder with a bent partition wall, the bent partition wall may collide with and damage the physical connectors on the back of the electronic component tray used to interconnect the electronic components to other electronic components in the system enclosure.

[0023] Generally, the wider the partition wall, the greater the likelihood and severity of bending. Specifically, while bending can sometimes occur in standard rack-based system chassis (which are typically around 19 inches wide), it is often a much more serious problem in wider system chassis. For example, some newer system chassis designs can be 30.5 inches or wider. Conversely, the thinner the partition wall, the greater the likelihood and severity of bending. Some newer system chassis designs can have relatively thin partition walls to allow for positioning electronics trays closer together (thus increasing the number of such trays that can be fitted into a chassis of a given size) and to reduce weight and cost. As a result, wide and thin partition walls in these systems become even more prone to bending or flexing along their front edge (which is not attached to the system chassis). Additionally, in some contexts, adding support structures (such as ribs, folds, or other support structures) to the partition wall to prevent bending may not be feasible, because in some contexts it may be desirable to keep the wall thin and light, and such support structures may lead to an increase in thickness and / or weight.

[0024] To address the issues associated with bent / flexed partition walls, the examples described herein utilize a system chassis comprising one or more partition walls having a concave shape along their front edges. In other words, instead of the front edge of the partition wall extending along a straight line perpendicular to both lateral sides of the partition wall, resulting in a generally rectangular profile, in the examples disclosed herein, the front edge has a concave shape, wherein the center of the front edge is offset rearward relative to both lateral sides of the front edge. More specifically, the concave shape causes the distance between the front and rear edges of the partition wall to decrease continuously as it moves laterally from one side edge to the center of the front edge and to increase continuously as it moves laterally from the center to the opposite side edge. In some examples, the concave shape may be symmetrical about the center of the front edge. The concave shape may be, for example, a “V” shape, a curved shape (e.g., a semicircle, a semi-ellipse, a parabola, a portion of a hyperbola, etc.), or other concave shapes. In some examples, the concave shape allows the front edge to act as an inlet for engaging an electronic component tray, thus eliminating the bending of the partition wall when the electronic component tray is inserted into the system chassis between the partition walls. When the tray is inserted into the system chassis, it initially engages with the partition wall near the two lateral sides of its front edge, as these are the foremost portions of the partition wall (due to the concave shape of the front edge). The partition wall sags very little near its lateral sides (because the lateral sides are attached to the system chassis), so it does not interfere with or prevent tray insertion during initial engagement. Therefore, the lateral portions of the tray can slide under the partition wall during initial engagement. While there may be significant bending near the center of the front edge, during initial engagement, the center of the front edge is behind the tray (due to the concave shape of the front edge), so the sag in the center does not interfere with the tray at this point. Furthermore, as the tray continues to be inserted into the system chassis after initial engagement, the portion of the tray already under the partition wall will contact the partition wall and lift the portion of the partition wall that has not yet contacted the tray but is adjacent to the leading edge contact point between the tray and the partition wall. This lifting of the partition wall at the leading edge contact point avoids interference that would otherwise occur, thus allowing further tray insertion. As the tray is inserted, the leading contact point between the partition wall and the leading edge of the electronics tray advances along the leading edge from the side edge of the partition wall toward the center of the leading edge, with the tray gradually lifting the partition wall more and more along the way. This advancement of the contact point increases the contact / overlap area between the partition wall and the electronics tray, thus slowly reducing the amount of bend or kink in the partition wall. When insertion reaches the center point of the leading edge of the partition wall, the bend or kink can be largely or completely eliminated, thereby reducing or eliminating interference between the electronics tray and the partition wall.

[0025] In some examples, one or more of the partition walls may include two support structures extending along each of the two side edges of the partition wall. These two support structures can be used to attach the partition wall to the system chassis. For example, the support structures may be flanges integrally joined and perpendicular to the flat portion of the partition wall.

[0026] In some examples, the system chassis can be configured to operate as a computing system having multiple electronic component trays containing electronic components. These electronic components may include, for example, compute nodes, storage nodes, switches or other networking devices, communication interface nodes, etc.

[0027] Turning now to the accompanying drawings, various apparatuses, systems, and methods according to aspects of this disclosure will be described.

[0028] Figure 1 This is a conceptual block diagram illustrating system 10, including system chassis 100. It should be understood that... Figure 1 The illustrations are not intended to depict specific shapes, dimensions or other structural details accurately or to scale, and embodiments of system 10 and system chassis 100 may have different numbers and arrangements of the illustrated components, and may also include other parts not shown.

[0029] like Figure 1 As shown, system 10 includes a system chassis 100, and the system chassis 100 includes a frame 110 and a set of partition walls 120a-120d. The frame 110 and the set of partition walls 120 are coupled together to form a set of receptacles 121. Specifically, each pair of adjacent partition walls 120, together with a portion of the frame 110, can define and partially enclose an open volume corresponding to a receptacle 121. The receptacle 121 can be configured to receive an electronics tray 160. In some examples, system 10 includes one or more such electronics trays 160. For example, in Figure 1 In the figure, an electronic component tray 160 is shown in a reservoir 121 formed by partition walls 120a and 120b and a frame 110. As shown, there is one electronic component tray 160; however, the frame 110 is configured to accommodate any number of electronic component trays similar to the electronic component tray 160. The electronic component tray 160 further includes an electronic assembly 170, which is described below. In some examples, the system 10 includes a frame 110 in which no electronic component tray 160 is mounted.

[0030] For convenience, this article will discuss... Figure 1The orientation shown (in which the partition wall 120 is generally horizontal) is used to describe system 10, and the directional terms used herein for various components of system 10 (such as "sideways," "top," "bottom," etc.) are used with respect to the orientation shown. However, it should be understood that system 10 may have other orientations and configurations, as described in more detail below, in which case the directional terms used herein with reference to the orientation shown may differ in other orientations. For example, if chassis 100 is rotated 90 degrees, then in… Figure 1 The “top” of frame 110 in the orientation shown can become the side of frame 110.

[0031] The frame 110 may be in the general shape of a hollow cube or a hollow rectangular cuboid (with one or more sides omitted or discontinuous and / or having openings formed therein), and its height, width and depth may accommodate one or more electronic device trays 160. Figure 1 The width and height dimensions are indicated in the text, where the depth dimension is perpendicular to both the width and height dimensions (i.e., extends to...). Figure 1 (See page [page number in the original text]). Frame 110 may be formed of a suitable structural material. Suitable structural materials include, but are not limited to, metals (such as steel, copper, brass, aluminum) or other relatively rigid materials (such as plastic). In one example, frame 110 is formed of steel and has a height of 48 inches, a width of 30.5 inches, and a depth of 24 inches. In some embodiments, all or part of frame 110 may include a subframe formed of structural rails and beams that create a skeleton with desired dimensions for use with frame 110. One or more panels or other structures may be attached to the subframe to form a housing having at least a top wall 116, a bottom wall 118, and two side walls 112 and 114. These panels or walls may be formed, for example, of sheet metal. In some examples, the housing of frame 110 may also include a rear wall (not shown). In some examples, the rear wall is discontinuous (i.e., formed of multiple sections that are not necessarily directly connected together) and / or has one or more openings to allow wiring for cables or other infrastructure and / or to allow airflow. In some examples, the front side of frame 110 may lack a wall or panel to allow insertion and removal of the electronics tray 160. In other examples, frame 110 may include a front wall or panel or door (not shown) that is removable or can be opened (e.g., via hinges) to allow insertion or removal of the electronics tray 160, but in such examples, the partition wall 120 is not attached to the front wall / door.

[0032] Throughout this document, references will occasionally be made to the top, bottom, front, back, and side sides of frame 110 or system chassis 100. It should be understood that these terms generally refer to locations or areas associated with the sides or faces of frame 110. For example, references to the top, bottom, and side sides of frame 110 generally refer to areas at or around top wall 116, bottom wall 118, and side walls 112 and 114, respectively. References to the front and back of frame 110 may generally refer to two additional sides of frame 110 that are perpendicular to and tangent to top wall 116, bottom wall 118, and side walls 112 and 114. Note that the front and back sides do not necessarily have any corresponding walls located therein. As used herein, the distinction between the "front" side and the back side is that the front side is the side from which the electronics tray 160 is inserted into the system chassis 100.

[0033] In some examples, frame 110 may also include additional structures (not shown), such as intermediate vertical or horizontal walls that connect to other parts of the frame (such as any one of walls 112, 114, 116, and 118). These intermediate vertical or horizontal walls may, for example, define additional compartments or berths for accommodating other components of system 10.

[0034] Each partition wall 120 comprises a metal sheet with a width similar to that of the frame 110. The metal sheet may be generally flat. In some examples, the metal sheet may include features such as ribs or stops in its surface. The depth of the partition wall 120 may vary, but is generally similar to the depth of the frame 110. The metal used to form the partition wall 120 may include, but is not limited to, steel, copper, brass, and aluminum. In one example, the partition wall 120 is made of steel sheet metal. In some examples, the thickness of the partition wall is 0.71 mm (0.028 inches). In some examples, the thickness of the partition wall is 1.01 mm (0.040 inches). In some examples, the thickness of the partition wall is between 0.71 mm (0.028 inches) and 1.01 mm (0.040 inches). In some examples, the thickness of the partition wall is less than 0.71 mm (0.028 inches). In some examples, the thickness of the partition wall is greater than 1.01 mm (0.040 inches). In some examples, the partition walls are generally flat and without additional features in order to minimize weight and reduce the amount of space occupied by the partition walls 120 within the frame 110.

[0035] Each partition wall can be attached to the frame 110 using a suitable attachment mechanism. In some examples, the attachment mechanism may include attaching each partition wall 120 to a portion of the lateral side of the frame 110 using mechanical fasteners (such as rivets, bolts, or other fasteners). In other examples, each partition wall 120 may be attached to a portion of the lateral side of the frame 110 by brazing, soldering, welding, adhesive, interlocking joints, or any other attachment mechanism. More specifically, in some examples, one lateral edge 122 of the partition wall 120 is attached to the lateral wall 112, and the opposing lateral edge 124 of the partition wall 120 is attached to the lateral wall 114. In other examples, one or both lateral edges 122 or 124 of the partition wall 120 are attached to an intermediate structure (not shown), such as an intermediate vertical wall (not shown) extending vertically between the top and bottom sides of the frame 110. Although the partition wall 120 is in Figure 1 The partition wall 120 is shown extending horizontally and connecting to side walls 112 or 114, but this is only one possible configuration, and the partition wall 120 can be configured in other ways. For example, the partition wall 120 can extend vertically and connect to the top wall 116 and the bottom wall 118. Figure 1 The horizontally extending partition wall 120 shown in the figure can be referred to as a horizontal configuration of the system chassis 100, while the vertically extending partition wall 120 can be referred to as a vertical configuration. The principles of this disclosure apply equally regardless of the orientation of the system chassis 100. In embodiments where the system chassis 100 has an orientation different from that shown in the figure, it should be understood that the directional terms used herein will be changed accordingly, for example, regarding... Figure 1 The horizontal configuration shown is described as being located on the "side" of the chassis 100, while in the vertical configuration it can be located on the "top" or "bottom" side of the chassis 100.

[0036] The electronic component tray 160 is shaped to fit within a reservoir formed by the partition walls 120 and the frame 110. In some examples, the electronic component tray 160 is generally shaped as a cube or rectangular cuboid with height, width, and depth. The electronic component tray 160 can be formed using a structural material similar to that used for the frame 110. In one example, the electronic component tray is formed of steel and has a height of 1.75 inches, a width of 30.5 inches, and a depth of 24 inches. In some embodiments, all or part of the electronic component tray 160 may include a subframe structure similar to the subframe structure described above for the frame 110.

[0037] Electronic component tray 160 includes electronic assembly 170. Electronic assembly 170 includes a plurality of electronic components electrically interconnected, forming all or part of an electronic device capable of performing a function or operation. Examples of electronic devices include, but are not limited to, computing nodes, storage nodes, switches or other networking devices, power supply units, and communication interface nodes. In some embodiments, the electronic component tray may include one or more electrical connectors providing an interface between electronic assembly 170 and other electronic components (such as other electronic components 170 within the electronic component tray 160 as part of system chassis 100 or external to system chassis 100). In some examples, power and / or communication connectors (not shown) may be located within system chassis 100 at a position corresponding to receptacle 121 to connect via blind mating to complementary connectors located on or behind the electronic component tray when the electronic component tray 160 is inserted into the corresponding receptacle 121. These connectors can be mounted on a middle or back panel PCB (not shown) that extends perpendicularly to the partition wall 120 and the lateral walls 112 and 114, allowing interconnection of various electronic components 170 mounted in system 10. In some examples, in addition to or instead of the middle or back panel PCB, power and / or communication cables can be used to interconnect the various electronic components 170 with each other and / or with other devices.

[0038] exist Figure 1 In the figure, partition walls 120b-120d are shown bent or sagged downwards (the bending is exaggerated in the figure for visualization purposes, but the figure is not intended to depict actual dimensions or the actual degree of bending). The downward bending or sag (also referred to as sagging) may be due to gravity on, for example, the horizontally oriented partition walls 120b-120d (in a horizontal configuration of the system chassis 100). Alternatively, the bending may also be due to a compressive force applied to the frame 110. Therefore, although the bending... Figure 1 While shown downwards, in some cases, one or more of the horizontally oriented partition walls 120 may bend or bend upwards due to forces applied, for example, to the sides of the frame 110. In other embodiments using a vertical configuration of the system chassis 100, the vertically oriented partition walls 120 may bend laterally due to forces applied, for example, to the top and / or bottom of the frame 110 (e.g., due to another object stacked on the frame 110).

[0039] exist Figure 1In the diagram, partition wall 120a is shown as flat and straight, while the other partition walls 120b-120d are shown as curved. As a result of the insertion of the electronics tray 160 into the receiver formed by partition walls 120a and 120b and frame 110, partition wall 120a is flat. In other words, before the electronics tray 160 is inserted, partition wall 120a initially includes a sag similar to that of partition walls 120b-120d. Each of partition walls 120a-120 includes a front edge 126 (…). Figure 1 Only one front edge 126 is marked in the middle, when viewed from above or below the partition wall 120 at an angle (with) Figure 3 and Figure 10 When viewed from a similar angle (as shown), the front edge has a concave shape. This concave shape causes the distance between the front edge and the rear edge (not shown) of the partition wall 120 to decrease continuously as it moves laterally from either side of the front edge 126 to the center portion of the front edge 126 (the side of the front edge 126 adjacent to the lateral edges 122 and 124 of the partition wall 120). In other words, as it moves laterally along the front edge 126 from the lateral edge 122 to the lateral edge 124, the front-to-back distance decreases continuously from the lateral edge 122 until it reaches an inflection point at the center portion, and after the inflection point, the front-to-back distance now increases continuously as it moves from the center portion to the lateral edge 124. Therefore, the lateral sides of the front edge 126 (adjacent to the lateral edges 122 and 124) are positioned further forward than any other portion of the front edge 126, and the front edge 126 may have an inflection point or a minimum value at the center portion of the front edge 126, where the inflection point is the rearmost portion of the front edge 126. The concave shape of the leading edge 126 may include, for example, a concave shape formed by two or more line segments joined together, such as a V-shape. For example, Figure 3 The illustration shows an example configuration of a partition wall 120 (in the form of partition wall 220) with a V-shaped front edge. As another example, the concave shape of the front edge 126 may include a curved or arched shape, such as a semicircle, semi-ellipse, parabola, hyperbola (or a portion thereof), pointed arch, or other curve. For example, Figure 10 An example configuration of a partition wall 120 (in the form of partition wall 1020) with a curved leading edge is illustrated. As another example, the concave shape may include a combination of curved and straight segments. The concave shape, including the leading edge 126, prevents interference between the partition wall 120a, which initially has a drooping shape, and the electronics tray 160 during the initial insertion moment. As the insertion process continues, the drooping in the partition wall 120a is gradually removed, resulting in the partition wall 120a becoming relatively flat.

[0040] As described above, the receptacle 121 is typically defined (i.e., demarcated) by a pair of adjacent partition walls 120 together with portions of the frame 110. However, in some examples, one or more of the receptacles 121 may be defined by a single partition wall of the partition walls 120 together with other portions of the frame 110. For example, in some examples, the uppermost receptacle 121 is defined by the uppermost partition wall of the partition walls 120 and the top wall 116. As another example, in some cases, the lowermost receptacle 121 is defined by the lowermost partition wall of the partition walls 120 and the bottom wall 118 of the frame 110.

[0041] Now turn to Figure 2 Figure 7 The system chassis 200 according to various aspects of this disclosure will be described. System chassis 200 may be a configuration of system chassis 100 described above. Therefore, various components of system chassis 200 may be similar to those of system chassis 100 described above. The above description of the components of system chassis 100 applies to similar components of system chassis 200, and therefore, repeated descriptions are omitted below for clarity. Similar components of system chassis 100 and 200 are given reference numerals having the same last two digits (e.g., 110 and 210). Although system chassis 200 may be a configuration of system chassis 100, system chassis 100 is not limited to the configuration of system chassis 200.

[0042] Various components of the system chassis 200 or its parts are illustrated in several figures. When describing the components below, it will be noted that one or more figures are considered particularly relevant to the component being described; therefore, the following description will not necessarily follow a strict order separate from Figures 2 to 200. Figure 7 Instead, the figures will be moved back and forth between them. Furthermore, it should be understood that when referring to certain figures related to a particular element, other figures besides the identified figure may also depict the same part from other angles.

[0043] Figure 2A and Figure 2B Perspective and front views of the system chassis 200 are shown respectively. The system chassis 200 includes a frame 210. The frame 210 has a top wall 216, side walls 212 and 214, and a bottom wall 218. The top wall 210, side walls 212 and 214, and bottom wall 216 are formed of one or more steel sheets. The frame 210 has rectangular openings at the front and back of the frame 210. The frame includes a plurality of partition walls 220 ( Figure 2A and Figure 2B Only one partition wall 220 is marked in the image. The plurality of partition walls 220 have a front edge 226 and lateral edges 222 and 224. The partition wall 220 also has a rear edge 228, which... Figure 2A and Figure 2BInvisible in the middle, but in Figure 3 (As shown in other figures). Figure 2A The front edge 226 shown has a concave shape that gradually tapers inward from the lateral edges 222 and 224 toward the center of the front edge 226. The lateral edges 222 and 224 are attached to the inner surfaces of the lateral walls 212 and 214 of the frame 210, respectively.

[0044] Each partition wall 220 in Figure 2B The middle is shown as having a bend or curve that spans the front edge 226. For example... Figure 2B As shown, the bend or curve is clearly identified relative to the dashed line 271, which is horizontal (shown from the side) across the width of the frame 210 from one corner edge 222 to another corner edge 224. The dashed line 271 indicates the nominal location of the partition wall 220 in the absence of a bend. Note that... Figure 2B The depiction of the curve is exaggerated to make it more visually apparent, and the actual dimensions are not shown.

[0045] Figure 3 This is a top view of a partition wall 220; the rest of the system 200 is omitted. The concave shape of the front edge 226 has a V-shape towards the rear edge 228. The distance from the front edge 226 to the rear edge 228 (along a line parallel to the lateral edges 212 and 214) reaches its maximum value at the lateral sides 227a and 227b of the front edge 226 (at the junction of the front edge 226 and the lateral edges 212 and 224). This maximum value of the front-rear distance is... Figure 3 The distance is shown as 274. The distance between the front edge 226 and the rear edge 228 decreases continuously as the distance moves along the front edge 226 from side to side 227a to the center point 229. At the center point 229, the front-rear distance reaches its minimum (shown as distance 273). Specifically, the front-rear distance decreases linearly as the distance moves from side to side 227a to the center point 229. Similarly, when moving along the front edge 226 from side to side 227b to the center point 229, the distance from the front edge 226 to the rear edge 28 decreases continuously from its maximum value at side to side 227b to its minimum value at the center point 229. Therefore, the front edge 226 is symmetrical about the center point 229.

[0046] The difference between distances 274 and 273 (which may be referred to as the depth of the concave shape) can depend on several factors, such as the width and material or thickness of the partition wall 220, and the orientation of the system chassis 220. Each of these factors affects the amount of bend or sag (e.g., sagging) present in the partition wall. A larger amount of bend or sag may require increasing the depth of the concave shape to prevent over-engagement during contact between the electronics tray and the partition wall. In some examples, the depth of the concave shape is three inches. In other examples, the depth may have different values, including values ​​greater than or less than three inches.

[0047] Figures 4A to 4D , Figures 5A to 5D ,as well as Figures 6A to 6D Four different states during the installation of the electronics tray 260 into the system chassis are shown from three different perspectives. Specifically, Figure 4A , Figure 5A and Figure 6A The first state is shown. Figure 4B , Figure 5B and Figure 6B The second state is shown. Figure 4C , Figure 5C and Figure 6C The third state is shown, and Figure 4D , Figure 5D and Figure 6D The fourth state is shown. The electronic component tray 260 is mounted in the frame 210 by inserting the electronic component tray 260 into the receiver 221. The receiver 221 is defined by a partition wall 220, two side walls 212 and 214, and another partition wall or another part of the frame (such as a top wall 216 or a bottom wall 218) adjacent to the partition wall 220. Figures 4A to 6D In the middle, the tray 260 is inserted into the lowest container 221, which is defined between a partition wall 220 and the bottom wall 218 of the frame 210. Figures 4A to 4D Including along Figure 2B The section 4-4 shown in the image illustrates the top of the partition wall 220 in the frame 210 and the electronic device tray 260. Figures 5A to 5D A perspective view of the electronic device tray 260 and the container 221 in the frame 210 is shown. Figures 6A to 6D A rear view of the electronic device tray 260 and the container 221 in the frame 210 is shown.

[0048] Figure 4A , Figure 5A and Figure 6AAn electronics tray 260 is shown at the moment of alignment with the receiver 221 in frame 210. In some embodiments, guide structures (not shown), such as tracks or grooves, may be included between the partition walls 220 on one or both side walls 212 and 214 of frame 210. Additionally, complementary guide structures may be added to the electronics tray 260 to engage with the guide structures of frame 210. The electronics tray 260 includes frame 261, and in some examples, complementary guide structures may be disposed on or within sides 262 and 264 of frame 261. Figure 4A and Figure 5A As shown, frame 261 may include guide tabs 263 and 265, which are positioned adjacent to or formed as part of sides 262 and 264. Guide tabs 263 and 264 project rearward beyond the leading edge 266 of frame 261, are positioned along the back of electronics tray 260, and are aligned with the bottom surface of partition wall 220 along each side edge 222 and 224.

[0049] Figures 4A to 4D Regions 275 and 276 are illustrated, where region 275 corresponds to the area where there is no contact or overlap between the partition wall 220 and the frame 261, and region 276 corresponds to the area where there is contact or overlap between the partition wall 220 and the frame 216. Figure 4A , Figure 5A and Figure 6A In the state shown, the tray 260 has not yet been inserted into the container 221, therefore there is no contact / overlap between the partition wall 220 and the frame 261, as indicated by the non-contact area 275 spanning the width of the partition wall 220. Figure 6A As shown, in this state, there is a large amount of curvature in the partition wall 220, which droops below the top surface of the tray 260. Therefore, if the partition wall 220 were in a conventional configuration without a concave front edge, it would interfere with the tray 260 and prevent its insertion. However, as will be described below, because the partition wall 220 has a concave front edge 226, this curvature will not prevent the insertion of the tray 260.

[0050] exist Figure 4A , Figure 5A and Figure 6AAfter the first state illustrated, tray 260 can be initially inserted into receiver 221. In an example where the electronics tray 260 includes tabs 263 and 265, tabs 263 and 265 may be the first portion of tray 260 entering receiver 221. The partition wall 220 has almost no sag near its lateral side (because the partition wall 220 is attached to frame 220 near its lateral side), so tabs 263 and 265 can be fitted under partition wall 220 without interference. In some examples, tabs 263 and 265 may include angled or rounded introduction features on their top sides to ensure that tabs 263 and 265 slide under partition wall 220 without interference. As tabs 263 and 265 slide under partition wall 220, tabs 263 and 265 may contact the bottom side of partition wall 220, and this can be used to slightly lift the portion of partition wall 220 immediately adjacent to tabs 263 and 265. This ensures that when the leading edge 266 of the tray 260 finally reaches the leading edge 263, the leading edge 266 can pass under the leading edge 263 (at least in the area immediately adjacent to the tabs 263 and 265).

[0051] In other examples, tabs 263 and 265 are omitted, in which case the lateral side of the leading edge 266 may be the first portion of the leading edge 266 to engage the leading edge 263. In such cases, the lateral side of the leading edge 266 may be able to slide below the partition wall 220, again because tabs 263 and 265 are also able to slide below the partition wall 220 (i.e., they are located near lateral edges where there is almost no sagging).

[0052] Figure 4B , Figure 5B and Figure 6B The electronic device tray 260 is shown slightly after the moment it was initially inserted into the reservoir in the frame 210. Figure 4B , Figure 5B and Figure 6B The state illustrated represents the moment of first or initial contact between the leading edge 266 of the electronic component tray 260 and the leading edge 226 of the partition wall 220. The contact point between the leading edge 266 of the tray 260 and the leading edge 226 of the partition wall 220 is determined by... Figure 4B , Figure 5B and Figure 6BContact areas 290 and 291 are indicated in the diagram. Those portions of the leading edge 266 closer to the center point 229 than contact areas 290 and 291 have not yet contacted the leading edge 226, while those portions of the leading edge 266 farther from the center 229 than contact areas 290 and 291 have already passed beneath the leading edge 226. In this state, some portions of the frame 261 have already passed beneath the partition wall 220, as indicated by contact or overlap areas 276. These contact / overlap areas 276 correspond to the areas located between the lateral edges 222 and 224 of the partition wall 220 and contact areas 290 and 291. At this initial insertion moment, contact areas 290 and 291 are significantly very close to the lateral edges 222 and 224, therefore the contact or overlap areas 276 are small. The remaining portions of the leading edge 266 not in contact areas 276 remain in non-contact or non-overlap areas 275. In some embodiments, the guiding structures described above (such as guide tabs 263 and 264) can help the electronics tray engage with the frame 210. Figure 6B As shown, there is still a certain amount of sagging in the partition wall 220, but it is less than Figure 6A The amount of sagging present in the middle. The contact between the tray 260 and the partition wall 220 at the contact areas 290 and 291 reduces the amount of sagging because the tray 260 now supports a portion of the front edge 226 of the partition wall 220, so the unsupported portion of the front edge 226 is shorter than before.

[0053] As the tray 260 is inserted further into the container 221, the leading edge 266 slides against the front edge 226, and the contact point between the leading edge 266 and the front edge 226 gradually moves inward toward the center point 229, as can be seen by comparison. Figure 4A , Figure 4C and Figure 4D As can be seen, with the insertion of the tray 260, the contact point moves inward toward the center point 229 due to the concave shape of the leading edge 226. Because the leading edge 266 contacts the bottom of the partition wall 220 at the contact point, the tray 260 gradually lifts the partition wall 220 more and more as the contact point moves further inward, until sagging is effectively eliminated. At various moments during this insertion process, the portion of the partition wall 220 near the center point 229 may experience some bending / sagging, such as... Figure 6B and Figure 6C As shown, however, this curvature at center point 229 does not prevent further insertion because, due to the concave shape of the front edge 226, the curved portion near center 229 lies behind tray 260, as... Figure 4B , Figure 4C , Figure 5B and Figure 5CAs shown, these curved portions will not interfere with the tray 260. When the leading edge 266 finally reaches the center 229 of the front edge 226, the partition wall 220 will have been sufficiently lifted due to the gradual contact between the leading edge 266 and the front edge 226.

[0054] For example, Figure 4C , Figure 5C and Figure 6C The electronic device tray 260 is shown at the moment of further insertion into the receiver within frame 210. At this insertion moment, the contact point between the leading edge 266 and the leading edge 226 has moved inward even further, as indicated by contact areas 292 and 293. Therefore, the contact or overlapping area 276 extends further from each side 222 and 224 along the leading edge 226 to contact areas 292 and 293. The remainder of the leading edge 266 remains in the non-contact area 275. Figure 6B As shown, with Figure 6A Compared to the sag shown, the sag in the partition wall 220 is very small. Specifically, from... Figure 6B The state shown progresses to Figure 6C In the state shown, the contact point moves further inward, thus reducing the length of the unsupported portion of the front edge 226, which has the effect of reducing sagging.

[0055] Figure 4D , Figure 5D and Figure 6D The electronic device tray 260 is shown at the moment of further insertion into the receiver within frame 210. At this insertion moment, the contact point between the leading edge 266 and the leading edge 226 has moved inward even further, as indicated by contact areas 294 and 295. Therefore, the contact or overlap area 276 extends even closer to the center 229 of the leading edge 226, from sides 222 and 224 to contact areas 294 and 295. A small portion of the leading edge 266 around the center 229 remains in area 275 where it does not contact the leading edge 266. Figure 6B As shown, sagging in the partition wall 220 is almost completely eliminated. In particular, because the contact points are now quite close together, only a short section of the front edge 226 remains unsupported, and therefore there is almost no sagging.

[0056] exist Figure 4D , Figure 5D and Figure 6DAfter reaching the state illustrated, tray 260 can be inserted further into reservoir 221 until the final contact point between leading edge 266 and front edge 226 merges at center 229 (not shown). At this point, sagging in partition wall 220 is effectively eliminated (or at least reduced to the point where it no longer causes interference). After this, tray 260 is continued to be inserted so that leading edge 266 passes under front edge 226 and moves backward until reaching... Figure 7 The diagram shows the fully installed state.

[0057] In some embodiments, tray 260 may include structural features that ensure that as the electronics tray engages and is inserted into the receiver up to center point 229 in frame 210, only the leading edge 266 and tabs 263 and 265 (if present) contact the leading edge 226 of partition wall 220. For example, the height of the leading edge 266 may be equal to or slightly greater than the height of the rest of the electronics tray 260. Further, the height of the leading edge 266 may be greater than the height of any external structures (such as electronic connectors) located in front of the leading edge 266 at the back of the electronics tray 260.

[0058] Figure 7 A perspective view is shown of an electronics tray 260 fully inserted into and attached to frame 210. Divider wall 220 rests on all or part of the top surface of the electronics tray 260, and sagging is eliminated, similar to the case shown with respect to divider wall 120a described above. Figure 7 As shown, the front 268 of the electronic device tray 260 is shown flush with the front of the frame 210. In other embodiments, the front may be recessed or protruding. Further, some embodiments may include an attachment mechanism for attaching the electronic device tray 260 to the frame 210 to hold the electronic device tray 260 in a fixed position. The attachment mechanism may be permanent, semi-permanent, or removable. The attachment mechanism may be present at the front, back, and / or sides of the electronic device tray 260. The attachment mechanism may include a latch or some form of fastening using fasteners (such as screws), or may include some form of clamping that applies force to the electronic device tray or frame 210.

[0059] Turn now Figures 8 to 9The system chassis 800 according to various aspects of this disclosure will be described. The system chassis 800 may be a configuration of the system chassis 100 or 200 described above. Therefore, various components of the system chassis 800 may be similar to those of the system chassis 100 and 200 described above. The above description of the components of system chassis 100 and 200 applies to similar components of system chassis 800, and therefore, repeated descriptions are omitted below for clarity. Similar components of system chassis 100, 200, and 800 are given reference numerals having the same last two digits (such as 110, 210, and 810). Although the system chassis 800 may be a configuration of system chassis 100 or 200, system chassis 100 or 200 is not limited to the configuration of system chassis 800.

[0060] Figure 8 and Figure 9 Perspective and front views of the system chassis 800 are shown respectively. In this example, the partition walls 820 each include support structures 882 and 884 located on their opposite lateral sides. Figure 8 and Figure 9 As shown, these support structures 882 and 884 extend along and are connected to the side walls 812 and 814 of the frame in the system chassis 880, respectively. In some examples, support structures 882 and 884 extend from the front to the rear of the frame. Each of the support structures 882 and 884 may extend along all or part of the side walls 812 and 814, respectively. Each of the support structures 882 and 884 is attached to the side walls 812 and 814 using mechanical fasteners. As shown, support structure 882 is attached to side wall 812 using rivet 885. Support structure 884 is attached to side wall 814 using rivet 886 (in... Figure 9 (As shown in the figure). In other embodiments, different mechanical fasteners, such as screws, nuts, and bolts, may be used. Although one mechanical (e.g., rivet) fastener is shown, more than one mechanical fastener may be used, which span the length of support structures 882 and 884. Additionally, in some embodiments, support structures 882 and 884 may be attached by other attachment mechanisms, such as welding, adhesives, engagement with flanges or other joining structures attached to side walls 812 and 814, or any other attachment mechanism.

[0061] As shown, each of the support structures 882 and 884 is formed as part of the partition wall 820. Support structures 882 and 884 are formed as flanges orthogonal to and located below (or above, in other examples above) the horizontal portion of the partition wall 820. For example, the partition wall 820 may be formed of a sheet of metal bent along two parallel lines near its opposite sides to form the support structures 882 and 884. In this way, the support structures 882 and 884 are integrally connected to the partition wall 820. In other embodiments, the support structures 882 and 884 may be located above the partition wall 820. In some embodiments, the support structures 882 and 884 may be separate from the partition wall 820. In these embodiments, the support structures 882 and 884 can be attached to the partition wall 820 by fasteners, welding, adhesives, etc., or the partition wall 820 can be placed on the support structures 882 and 884 without necessarily being attached to the support structures 882 and 884.

[0062] Figure 10 This is a top view of another example of partition wall 1020. Partition wall 1020 is an example configuration of partition wall 120 of system chassis 100. Furthermore, in some examples, partition wall 1020 can be used in system chassis 200 or 800 instead of its partition walls 220 or 820. In this example, the concave shape of the front edge 1026 has a curved shape towards the rear edge 1028. This is consistent with... Figure 3 The more angled concave shape formed by straight segments in the partition wall 220 contrasts with this. The distance along the side edge 1024 from the front edge 1026 to the rear edge 1028 is shown as distance 1074. The distance between the front edge 1026 and the rear edge 1028 decreases continuously as one moves along the front edge 1026 to the center point 1029 (shown as distance 1073). Similarly, the distance along the side edge 1022 from the front edge 1026 to the rear edge 1028 decreases continuously as one moves along the front edge 1026 to the center point 1029, thus having distances of 1074 and 1073 respectively. As described above, the depth of the concave shape can depend on several factors that affect the amount of bending or curvature present in the partition wall 1020. In some examples, the depth is similar to that of the partition wall 220 described above, which is three inches. In other examples, the depth can have different values, including values ​​greater than or less than three inches.

[0063] like Figure 10As shown, the curve shape of the front edge 1026 is semi-circular. Other curve shapes may also be used, including but not limited to parabolas, semi-ellipses, and hyperbolas. More complex concave shapes may also be used, such as horns or pointed arches similar to combinations of V-shapes and curve shapes, or curves obtained by mirroring one or more curve segments relative to the center 1029 (e.g., mirroring exponential or logarithmic curves relative to the center 1029).

[0064] In the examples discussed above, the concave shape of the front edge is typically symmetrical with respect to its center. However, in other examples, the concave shape does not necessarily have to be symmetrical. For example, referring to the partition wall 1020, the front edge 1026 may include a different curve segment between the side edge 1022 and the center point 1029 than the curve segment used between the side edge 1024 and the center point 1029, as long as both curve segments decrease continuously as they move inward from the side edge 1022 or 1024 toward the center point 1029.

[0065] Figure 11 This is a conceptual block diagram illustrating the computing system 1000. It should be understood that... Figure 11 The illustrated components are not intended to be accurately or to scale, and embodiments of the computing system 1000 may have different numbers and arrangements of the illustrated components, and may also include other parts not shown. The computing system 1000 may be used as part of a multi-node parallel processing computer system.

[0066] The computing system 1000 includes a system chassis 1100. The system chassis 1100 can be any of the system chassis 100, 200, or 800 described above. The system chassis 1100 includes a frame 1110. The frame 1110 includes a set of partition walls 1120. The frame 1110 and the set of partition walls 1120 are connected together in a manner similar to that described above to form a set of receptacles. A set of electronic device trays 1160 are shown attached to or mounted in the receptacles of the frame 1110. As shown, three electronic device trays 1160 are shown attached to and mounted in three receptacles. In other embodiments, the computing system 1100 may be configured to accommodate more or fewer electronic device trays similar to the electronic device trays 1160.

[0067] The frame 1110 and the partition wall 1120 can be formed of a suitable structural material and configured in a manner similar to that described above. Specifically, each partition wall 1120 includes a front edge (not shown) with a concave shape. The concave shape of the front edge can be... Figure 3 The V-shape described in Figure 10The curve shape described herein is similar, or other concave shapes may be used, as long as the distance between the front and rear edges of the partition wall 1120 continuously decreases as it moves laterally from one side edge to the center of the front edge and continuously increases as it moves laterally from the center to the opposite side edge of the partition wall.

[0068] Each electronics tray 1160 includes one or more electronic components 1170. Electronic components 1170 can be mounted to the electronics tray using any well-known fastening mechanism. Each electronic component 1170 can be configured to perform the same operation and / or function, or can be configured to perform different operations and / or functions as part of the operation of the computing system 1100. Examples of different types of electronic components include, but are not limited to, compute nodes, storage nodes, switches, and communication interface nodes.

[0069] In some embodiments, each electronics tray 1160 may also include structural features (such as a frame) and separate top, bottom, and / or side panels as described above. In some embodiments, each electronics tray 1160 may further include structural features associated with the leading edge of the electronics tray and guide structures (such as side tabs) to facilitate the alignment, engagement, and insertion of the electronics tray as part of mounting or attaching the electronics tray 1160 to the frame 1110.

[0070] System chassis 1100 further includes a power supply 1130 and a data bus 1140. Additionally, each electronics tray 1160 also includes a power interface 1176 and a data interface 1177. The power supply 1130 is connected to and supplies power to the power interface 1176 on each electronics tray 1160 for operation of the electronic components 1170. The data bus 1140 provides data and signal communication interconnection between the electronic components 1170 in each electronics tray 1160 via the data interface 1177. In some embodiments, one or both of the power interface 1176 and the data interface 1177 are located on the back of the system tray. In some embodiments, one or both connections between the power interface 1176 and the power supply 1130, and between the data interface 1177 and the data bus 1140, can be made using a backplane connection interface or a midplane connection interface on the system chassis 1100.

[0071] In some examples, computing system 1100 includes HPC systems, such as HPE Cray EX systems, HPE Apollo systems, or other HPC systems. In some examples, computing system 1100 includes converged or hyperconverged computing systems, such as HPE converged systems, HPE SimpliVity systems, or other converged / hyperconverged systems. In some examples, computing system 1100 includes a collection of individual servers, such as HPE ProLiant servers or other servers.

[0072] Figure 12 An example process 1200 for attaching an electronic component tray (such as electronic component tray 260) to a system chassis (such as system chassis 200) is described. In block 1210, the electronic component tray 260, containing electronic components 270, is aligned with an opening in a receiver formed by two partition walls 220 and the side of a frame 210 in the system chassis 200. One or more of the partition walls 220 have a front edge 226 having a concave shape as described above. Figure 4A , Figure 5A and Figure 6A Alignment is implemented in a manner similar to that described in [the text]. Specifically, as [the text continues with details about alignment]. Figure 4A and Figure 5A As shown, one or both of the side tabs 263 and 265 are aligned with the sidewalls 222 and 224 of the frame 210.

[0073] In frame 1220, the leading edge 266 of the electronic component tray 260 is engaged with the receiver in frame 210. This is in accordance with the above description. Figure 4B , Figure 5B and Figure 6B The engagement of the electronic device tray 260 is implemented in a manner similar to that described herein. In particular, one or both corners of the leading edge 266, at or near one or both corners of the leading edge 226 near the side edges 222 and 224, contact the leading edge 226 of the upper partition wall 220 for forming the receptacle.

[0074] In frame 1230, the electronic component tray 260 is inserted into the receiver in frame 210. This is in accordance with the above description. Figure 4C , Figure 5C and Figure 6C as well as Figure 4D , Figure 5D and Figure 6DInsertion is performed in a manner similar to that described herein. Specifically, in frame 1220, the contact area advances progressively along the concave front edge 226 from the initial engagement point until the leading edge 266 of the electronics tray 260 reaches the center point 229 on the front edge 220. As the contact area progresses to the center point 229, any bends or curvatures initially present in the partition wall 220 are removed. The electronics tray 260 can then be further inserted into the receiver without interference between the partition wall 220 and the electronics tray 260.

[0075] In some embodiments, the electronics tray 260 may include more than one electronic component 270. Additionally, in some embodiments, the electronics tray 260 may include one or more of a power interface connector (e.g., power interface 1176) and a data interface connector (e.g., data interface 1177). Further, these power interface connectors and data interface connectors may be connected to other electronics trays 260 attached to the system chassis 200 via backplane or midplane connection interfaces on the system chassis 200. In this way, the system chassis 200 may be configured as a computing system, such as computing system 1100.

[0076] In the above description, various types of electronic circuit systems are described. As used herein, “electronic” is intended to be broadly understood to include all types of circuit systems that utilize electricity, including digital and analog circuit systems, direct current (DC) and alternating current (AC) circuit systems, as well as circuit systems for converting electricity into another form of energy and for using electricity to perform other functions. In other words, as used herein, there is no distinction between “electronic” circuit systems and “electrical” circuit systems. In some cases, an electronic circuit system may include a processing circuit system. A processor or processing circuit system includes a circuit system configured with logic for performing various operations. The logic of a processing circuit system may include dedicated hardware for performing various operations, software (machine-readable and / or processor-executable instructions) for performing various operations, or any combination thereof. In examples where the logic includes software, the processing circuit system may include a processor for executing software instructions and a memory device for storing the software. A processor may include one or more processing devices capable of executing machine-readable instructions, such as, for example, a processor, processor core, central processing unit (CPU), controller, microcontroller, system-on-a-chip (SoC), digital signal processor (DSP), graphics processing unit (GPU), etc. In cases where the processing circuitry system includes dedicated hardware, in addition to or in place of a processor, the dedicated hardware may include any electronic device configured to perform specific operations, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), discrete logic circuits, hardware accelerators, hardware encoders, etc. The processing circuitry system may also include any combination of dedicated hardware and a processor plus software.

[0077] It will be understood that both the general description and the detailed description provide examples that are illustrative in nature and intended to provide an understanding of the disclosure, without limiting its scope. Various mechanical, compositional, structural, electronic, and operational changes may be made without departing from the scope of the description and claims. In some cases, well-known circuits, structures, and techniques have not been shown or described in detail to avoid obscuring the examples. Similar numbers in two or more figures represent the same or similar elements.

[0078] Furthermore, examples of spatial, positional, and relational terms used herein are selected to aid the reader's understanding of the embodiments, but these terms are not intended to limit the embodiments to a particular frame of reference, orientation, or positional relationship. For example, spatial, positional, and relational terms such as "up," "down," "side," "below," "under," "lower," "above," "upper," "near," and "far" may be used herein to describe a direction or to describe the spatial relationship between one element or feature and another element or feature illustrated in the figures. These spatial terms are used relative to the frame of reference in the figures and are not limited to a specific frame of reference in the real world. Thus, for example, the direction "up" in the figures does not necessarily correspond to "up" in a world frame of reference (e.g., away from the Earth's surface). Moreover, if a different frame of reference is considered than that illustrated in the figures, the spatial terms used herein may require different interpretations in that different frame of reference. For example, a direction referred to as "up" in one of the figures may correspond to a direction referred to as "down" in a different frame of reference rotated 180 degrees from the frame of reference in that figure. As another example, if the device is rotated 180 degrees in the world reference frame (compared to the case illustrated in the figure), then an item described herein as "above" or "on top" the second item will be "below" or "under" the second item in the world reference frame. Furthermore, the pose of the items illustrated in the figure is chosen for ease of illustration and description, but in practice, these items may be in different poses in the implementation.

[0079] Additionally, unless the context otherwise indicates, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. Furthermore, the terms “comprises,” “comprising,” “includes,” etc., specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Unless explicitly noted otherwise, components described as being connected may be directly connected electronically or mechanically, or they may be indirectly connected via one or more intermediate components. Unless the context otherwise indicates, mathematical and geometric terms are not necessarily required to be used according to their strict definitions, as those skilled in the art will understand that, for example, substantially similar elements acting in substantially similar ways may readily fall within the scope of descriptive terms, even if those terms also have strict definitions.

[0080] "Provide": As used herein, "provide" an item means to possess and / or control the item. This may include, for example, forming (or assembling) a part or all of the item from its constituent materials, and / or acquiring possession and / or control over the item that has already been formed.

[0081] "And / or": The phrase "and / or" is used occasionally in conjunction with a list of items in this article. This phrase means that any combination of items in the list can be included, from a single item to all items and any permutation in between. Therefore, for example, "A, B and / or C" means "one of {A}, {B}, {C}, {A, B}, {A, C}, {C, B}, and {A, C, B}".

[0082] Where practicable, an element and its associated aspects described in detail with reference to an example may be included in other examples where they are not specifically shown or described. For example, if an element is described in detail with reference to an example but not with reference to a second example, that element may still be claimed as being included in the second example.

[0083] Unless otherwise noted herein or implied by the context, the use of approximate terms such as “approximately,” “about,” “around,” “roughly,” etc., should be understood as indicating that mathematical precision is not required, but rather refers to a range of variation including, but not strictly limited to, the stated values, properties, or relationships. In particular, in addition to any ranges explicitly stated herein (if any), the range of variation implied by the use of such approximate terms also includes at least any insignificant variations, and those typical of the type of article under discussion due to manufacturing or other tolerances in the relevant art. In any case, unless otherwise indicated, the range of variation may include values ​​within at least ±1% of the stated values, properties, or relationships.

[0084] In light of the disclosure herein, further modifications and alternative examples will be apparent to those skilled in the art. For example, apparatus and methods may include additional components or steps that are omitted from the figures and description for clarity of operation. Therefore, this description is to be construed as illustrative only, and its purpose is to teach those skilled in the art the general manner of implementing this teaching. It will be understood that the various examples shown and described herein will be considered exemplary. Elements and materials, and arrangements of those elements and materials, may replace the elements and materials illustrated and described herein, parts and processes may be reversed, and certain features of this teaching may be utilized independently, all of which will be apparent to those skilled in the art upon benefiting from the description herein. Changes may be made to the elements described herein without departing from the scope of this teaching and the appended claims.

[0085] It will be understood that the specific examples illustrated herein are non-limiting, and modifications may be made to the structure, dimensions, materials, and methods without departing from the scope of this teaching.

[0086] Other examples according to this disclosure will become apparent to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. The specification and examples are intended to be regarded as exemplary only, and the appended claims are entitled to the fullest extent of their applicability under applicable law, including their equivalents.

Claims

1. A system chassis comprising: a frame having a width, a depth, and a height; and a plurality of divider walls coupled to the frame and forming a plurality of receptacles, each receptacle configured to receive an electronics tray containing electronic components, wherein each divider wall of the plurality of divider walls comprises a sheet of metal having a front edge, a back edge, and two lateral edges attached to two lateral walls of the frame, and wherein the front edge of the sheet of metal has a concave shape such that a distance between the front edge and the back edge of the sheet of metal continuously decreases when moving laterally from one lateral edge to a center of the front edge and continuously increases when moving laterally from the center to the other lateral edge. the concave shape is symmetric about the center of the front edge.

2. The system chassis of claim 1, wherein, the concave shape is one of a V-shape and a curvilinear shape.

3. The system chassis of claim 1, wherein, when the receptacle receives the electronics tray, a portion of a leading edge of the electronics tray contacts a portion of the front edge of the sheet of metal of at least one of the divider walls forming one of the plurality of receptacles.

4. The system chassis of claim 1, wherein, when the receptacle receives the electronics tray, the concave shape prevents interference between the electronics tray and at least one of the divider walls forming one of the plurality of receptacles.

5. The system chassis of claim 1, wherein, the system chassis has a width of at least 30 inches.

6. The system chassis of claim 1, wherein, each divider wall of the plurality of divider walls further comprises two support structures extending along each of the two lateral edges of the sheet of metal of the each divider wall, the two support structures attaching the plurality of divider walls to the frame.

7. The system chassis of claim 1, wherein, the two support structures are integrally connected to and orthogonal to the sheet of metal.

8. The system chassis of claim 7, wherein, the support structures are attached to the frame of the system chassis using mechanical fasteners.

9. The system chassis of claim 7, wherein, 10. A computing system having a plurality of electronics trays comprising: a system chassis comprising: a frame having a width, a depth, and a height; and a plurality of divider walls coupled to the frame and forming a plurality of receptacles, each receptacle configured to receive an electronics tray containing electronic components, wherein each divider wall of the plurality of divider walls comprises a sheet of metal having a front edge, a back edge, and two lateral edges attached to two lateral walls of the frame; and the plurality of electronics trays, each system tray of the plurality of system trays mounted into one of the plurality of receptacles, each electronics tray comprising at least one electronic component, each electronics tray of the plurality of electronics trays mounted in one of the plurality of receptacles, wherein the front edge of the sheet of metal has a concave shape such that a distance between the front edge and the back edge of the sheet of metal continuously decreases when moving laterally from one lateral edge to a center of the front edge and continuously increases when moving laterally from the center to the other lateral edge.

11. The computing system of claim 10, wherein, The concave shape is symmetric about the center of the front edge.

12. The computing system of claim 10, wherein, The concave shape is one of a V-shape and a curved shape.

13. The computing system of claim 10, wherein, Each of the electronic device trays includes a frame such that when the electronic device tray is inserted into the receptacle, a portion of a leading edge of the frame contacts a portion of the front edge of the sheet metal of at least one of the divider walls forming one of the plurality of receptacles.

14. The computing system of claim 13, wherein, Each of the plurality of electronic device trays includes at least one of: a leading edge of each of the plurality of electronic device trays includes a leading edge; and a structure feature on a leading edge of each of the plurality of electronic device trays to ensure a first contact between a portion of the leading edge and a portion of the front edge of the sheet metal of the plurality of divider walls during insertion of the plurality of electronic device trays.

15. The computing system of claim 10, wherein, The concave shape prevents interference between the electronic device tray and the divider walls forming the receptacle when the electronic device tray is installed in the receptacle.

16. The computing system of claim 10, wherein, The system chassis has a width of at least 30 inches.

17. The computing system of claim 10, wherein, The electronic components include at least one of: a compute node, a storage node, a switch, and a communication interface node.

18. The computing system of claim 10, wherein, The system chassis further includes a power supply and a data bus, and wherein each of the plurality of electronic device trays further includes a power interface connector and a data interface connector, the power interface connector and the data interface connector connected to the power supply and the data bus included in the system chassis.

19. The computing system of claim 18, wherein, At least one of the connection between the power interface connector of each of the plurality of electronic device trays to the power supply and the connection between the data interface connector of each of the plurality of electronic device trays to the data bus is made using a backplane connection interface on the system chassis.

20. A method for attaching an electronic device tray to a system chassis, comprising: aligning the electronic device tray containing electronic components to an opening in a receptacle in a system chassis, the receptacle formed by a frame in the system chassis and two divider walls attached to the frame, wherein a front edge of at least one of the two divider walls has a concave shape such that a distance between the front edge and a back edge of the at least one divider wall continuously decreases when moving laterally from one lateral edge of the at least one divider wall to a center of the front edge and continuously increases when moving laterally from the center to an opposite lateral edge of the at least one divider wall; engaging a leading edge of the electronic device tray with at least one corner of the front edge of the at least one of the two divider walls forming the receptacle; and inserting the electronic device tray into the receptacle such that the leading edge of the electronic device tray contacts the front edge of the at least one of the two divider walls over an increasing contact area until the center of the front edge.

21. The method of claim 20, wherein, the front edge of the at least one of the two divider walls prevents interference between the electronic device tray and the at least one of the two divider walls during insertion of the electronic device tray into the receptacle.

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