A vision inspection camera

Abstract

The application belongs to the field of semiconductor detection, and discloses a visual detection camera, which comprises a shell, has a containing chamber, and is provided with a light inlet; an imaging mechanism arranged in the containing chamber, the imaging mechanism comprising a lens and an imaging element, the lens being arranged in alignment with the light inlet, and the lens being used for focusing signal light generated by a photographed object to the imaging element; and a focusing mechanism mounted on the shell, the focusing mechanism comprising a connecting plate and an adjusting piece, the imaging element being arranged on the connecting plate, and the adjusting piece being rotationally matched with the shell, and the adjusting piece being used for driving the connecting plate to move close to or away from the shell to adjust the distance between the imaging element and the lens. The visual detection camera can realize flexibility and accuracy of focusing in limited space, and can provide a larger focusing range and higher focusing accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor inspection, and more specifically, to a visual inspection camera. Background Technology

[0002] In the field of semiconductor metrology and inspection, to ensure a one-to-one correspondence between the inspected wafer and its inspection result, a unique ID is typically deployed at a corresponding location on the wafer. A visual inspection camera identifies the characters of this ID and matches them with the wafer product. The wafer ID consists of a cluster of tiny, dense dots. During inspection, the visual inspection camera must possess high resolution and focusing accuracy to identify the wafer ID.

[0003] In related technical approaches, the EFEM (Equipment Front-End Module) space needs to accommodate multiple test devices, mechanical devices, and electrical and pneumatic lines connecting these devices. Therefore, the EFEM space is typically a relatively narrow area, which strictly limits the size of the cameras installed within it. Due to the space constraints, the cameras installed within the EFEM are generally small, and the positional relationship between the imaging element and the lens is fixed. When identifying small, densely packed points of wafer ID, inaccurate focusing can easily lead to blurry or distorted images, affecting image quality and making wafer ID identification difficult. Summary of the Invention

[0004] This application addresses the problems of poor focusing flexibility and inaccuracy in existing small-sized cameras by providing a visual inspection camera that can achieve focusing flexibility and accuracy within a limited space, offering a larger focusing range and higher focusing precision, thereby helping to improve the resolution of the visual inspection camera to identify wafer IDs.

[0005] The visual inspection camera provided in this application adopts the following technical solution:

[0006] A visual inspection camera, comprising:

[0007] The housing has a receiving chamber and a light inlet.

[0008] An imaging mechanism is disposed in the receiving chamber. The imaging mechanism includes a lens and an imaging element. The lens is aligned with the light inlet and is used to focus the signal light generated by the object being photographed onto the imaging element.

[0009] A focusing mechanism is installed on the housing. The focusing mechanism includes a connecting plate and an adjusting member. The imaging element is disposed on the connecting plate. The adjusting member is rotatably engaged with the housing. Rotating the adjusting member causes the connecting plate to move closer to or further away from the housing, thereby adjusting the distance between the imaging element and the lens.

[0010] Optionally, the imaging element includes an imaging sensor and a circuit board. The circuit board is supported on the surface of the connecting plate, and the imaging sensor is fixed on the circuit board or the connecting plate and electrically connected to the circuit board. When the adjusting member drives the connecting plate to move, the imaging sensor moves synchronously with the connecting plate.

[0011] Optionally, the focusing mechanism further includes a guide post and an elastic element. The guide post extends in the same direction as the adjusting element. The elastic element is sleeved on the periphery of the guide post. The elastic element is located between the connecting plate and the housing. The guide post is fixedly connected to one of the housing or the connecting plate and slidably engaged with the other.

[0012] Optionally, a heat dissipation mechanism is also included, which includes a first heat dissipation component. The first heat dissipation component is attached to the circuit board and is used to dissipate heat from the circuit board. The first heat dissipation component is carried on the connecting plate and moves synchronously with the connecting plate.

[0013] Optionally, the first heat dissipation component includes a first heat-conducting plate and a first heat dissipation fin disposed on the first heat-conducting plate. The circuit board is attached to the first heat-conducting plate by a thermally conductive pad, and the first heat dissipation fin is arranged around the circuit board.

[0014] Optionally, the imaging mechanism further includes a first light source assembly, which is disposed in the receiving cavity and communicates with the lens; the first light source assembly includes an internal light source module, which is used to generate illumination light, which illuminates the object after passing through the lens, and the object generates signal light under the illumination light.

[0015] Optionally, the imaging mechanism further includes a second light source assembly, which is disposed on the outer wall of the housing and located around the light inlet, for supplementing light to the subject; the end face of the housing where the second light source assembly is mounted is provided with a textured layer.

[0016] Optionally, the heat dissipation mechanism further includes a second heat dissipation component, which covers the first light source component to dissipate heat from the first light source component; the second heat dissipation component includes a second heat-conducting plate and a second heat dissipation fin disposed on the second heat-conducting plate, the internal light source module is disposed on the second heat-conducting plate through a thermally conductive pad, and the second heat dissipation fin is arranged around the internal light source module.

[0017] Optionally, the second heat-conducting plate is provided with multiple winding grooves and multiple pressure plates. The winding grooves and the pressure plates are arranged in a one-to-one correspondence. The pressure plates cover the openings of the winding grooves and fix the cables to organize them when the cables pass through the winding grooves.

[0018] Optionally, the housing includes a middle shell, a front cover, and a rear cover, and the receiving chamber is enclosed by the middle shell, the front cover, and the rear cover. The receiving chamber is configured as a closed space to achieve electromagnetic shielding of the housing.

[0019] Optionally, the connecting plate is provided with multiple exposed through holes, and the imaging element is provided with multiple copper metal through holes. The connecting plate and the imaging element are connected by screws through the exposed through holes and the metal through holes and are electrically conductive to each other. The first heat-conducting plate is provided with multiple exposed interfaces. The first heat-conducting plate and the connecting plate are connected by screws through the exposed through holes and the exposed interfaces and are electrically conductive to each other, forming an electromagnetic shield around the imaging element.

[0020] Optionally, the connecting plate is also provided with a grounding hole for connecting a grounding wire to ground. The grounding hole is used to ground the imaging element through the grounding wire to form a 0V reference surface inside the imaging element to constitute local electromagnetic shielding.

[0021] Optionally, the connecting plate is provided with exposed screw holes for connecting the adjusting member, and the housing is provided with exposed bosses for connecting the guide post. The connecting plate is electrically connected to the housing through the adjusting member and the guide post to achieve secondary electromagnetic shielding of the housing.

[0022] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0023] The adjustment component is installed in the housing. The position of the connecting plate in the receiving chamber is adjusted by the adjustment component. The connecting plate drives the imaging element to move synchronously to adjust the distance between the imaging element and the lens. This enables focusing flexibility and accuracy in a limited space, providing a larger focusing range and higher focusing accuracy, thereby helping to improve the resolution of the visual inspection camera to identify wafer IDs.

[0024] Furthermore, for cameras that previously did not require focusing, simply connecting the imaging element to the housing using thermal pads was sufficient to dissipate heat from the imaging element via the housing. However, for cameras requiring focusing, conventional heat sinks are typically arranged perpendicular to the circuit board surface, encroaching on camera space and hindering miniaturization. This application's embodiment, by rationally arranging the number of circuit board layers, fully utilizes the space for adjusting the focusing structure, placing the heat sinks laterally within the gaps of the focusing structure. Simultaneously, the stacked circuit board arrangement further saves space along the camera's plane, ensuring camera miniaturization while achieving focusing functionality, which is beneficial for camera placement in confined areas. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the disassembly structure of a visual inspection camera disclosed in an embodiment of this application;

[0026] Figure 2 This is a cross-sectional view of the overall structure of a visual inspection camera disclosed in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the structure of a visual inspection camera highlighting imaging mechanism disclosed in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of a visual inspection camera highlighting an imaging element disclosed in an embodiment of this application;

[0029] Figure 5 This is an exploded view of the imaging element and the first heat dissipation structure of a visual inspection camera disclosed in an embodiment of this application;

[0030] Figure 6 This is an exploded view of the structure of a visual inspection camera that highlights the first heat dissipation structure, as disclosed in an embodiment of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Shell; 11. Middle shell; 12. Front cover; 121. Light inlet; 122. Textured layer; 13. Rear cover; 14. Receiving chamber; 15. Exposed boss;

[0033] 2. Imaging mechanism; 21. Lens; 22. Imaging element; 221. Imaging sensor; 222. Circuit board; 223. Metal through hole; 24. First light source assembly; 241. Internal light source module; 242. Mounting cover; 25. Second light source assembly;

[0034] 3. Focusing mechanism; 31. Connecting plate; 311. Exposed through hole; 312. Grounding hole; 313. Exposed screw hole; 32. Adjusting component; 33. Guide column; 34. Elastic component;

[0035] 4. Heat dissipation mechanism; 41. First heat dissipation component; 411. First heat conduction plate; 412. First heat dissipation fin; 413. Exposed interface; 42. Second heat dissipation component; 421. Second heat conduction plate; 422. Second heat dissipation fin; 43. Winding groove; 44. Pressure plate. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0037] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0038] For ease of understanding, the visual inspection camera in the embodiments of this application is described below. Please refer to [link / reference]. Figure 1 and Figure 2 An embodiment of a visual inspection camera in this application includes: a housing 1, an imaging mechanism 2, a focusing mechanism 3, and a heat dissipation mechanism 4. The imaging mechanism 2, the focusing mechanism 3, and the heat dissipation mechanism 4 are all disposed inside the housing 1. The heat dissipation mechanism 4 is used to dissipate heat from the internal structure of the imaging mechanism 2, and the focusing mechanism 3 is used to adjust the imaging mechanism 2 to improve image quality.

[0039] Please see Figure 1The housing 1 includes a middle shell 11, a front cover 12, and a rear cover 13. The front cover 12 is located on the side of the camera closer to the subject, and the rear cover 13 is located on the side of the camera farther from the subject. Its main function is to serve as the base plate for the focusing mechanism 3. The rear cover 13 is positioned opposite to the front cover 12. The middle shell 11 is located in the middle of the camera and has a U-shaped cross-section structure. Its main function is to fix and connect the front cover 12 and the rear cover 13 to form the camera housing 1. The housing 1 has a receiving chamber 14, which is enclosed by the middle shell 11, the front cover 12, and the rear cover 13. The receiving chamber 14 is configured as a closed space to achieve electromagnetic shielding of the housing 1. The integrated U-shaped cross-section structure of the housing 1 helps to ensure the rigidity of the housing 1 and prevents the focusing mechanism 3 from failing due to accidental pressure. At the same time, the integrated U-shaped cross-section structure facilitates better electromagnetic shielding and also contributes to the aesthetics of the camera's appearance.

[0040] Please see Figure 2 and Figure 3 The imaging mechanism 2 is disposed in the receiving chamber 14, and includes a lens 21 and an imaging element 22. The lens 21 is located near the front cover 12. To enhance the installation stability of the lens 21, a vertical flange for fixing the lens 21 is provided on the side of the front cover 12 near the lens 21. The lens 21 is fixedly installed on the front cover 12 through the vertical flange. The housing 1 is provided with a light inlet 121 for light transmission. In this embodiment, the light inlet 121 is located in the middle of the front cover 12, and the lens 21 is aligned with the light inlet 121. The imaging element 22 is located at the end of the lens 21 away from the light inlet 121 and near the rear cover 13. When light passes through the subject and enters the lens 21 through the light inlet 121, the lens 21 focuses the signal light generated by the subject onto the imaging element 22, forming an image through the imaging element 22.

[0041] Please see Figure 3 and Figure 5 The imaging element 22 includes an imaging sensor 221 and a circuit board 222. The circuit board 222 is supported on the surface of the connecting plate 31. The imaging sensor 221 is fixed on the circuit board 222 or the connecting plate 31. The imaging sensor 221 is electrically connected to the circuit board 222. The imaging sensor 221 and the circuit board 222 are stacked to reduce their size on the board surface. In this embodiment, the imaging sensor 221 is located on the side of the circuit board 222 closer to the lens 21. The imaging sensor 221 is a CMOS focal plane, and an image acquisition sensor is disposed on the CMOS focal plane. When light enters the lens 21, an image is formed on the CMOS focal plane. The image on the focal plane is received by the image acquisition sensor, which converts the received light signal into a digital signal to represent the brightness and color information of the image.

[0042] Due to installation errors or the camera's requirements for different working distances, the optimal focal plane position may change, meaning the optimal position of the imaging sensor 221 will vary. To achieve higher focusing accuracy in the visual inspection camera and produce a clear image, the imaging element 22 needs to be adjustable along the optical axis; therefore, the visual inspection camera must have a focusing function. Please refer to [link to relevant documentation]. Figure 4 The focusing mechanism 3 is located near the rear cover 13 and between the rear cover 13 and the lens 21. The focusing mechanism 3 includes a connecting plate 31 and an adjusting member 32. The imaging element 22 is mounted on the connecting plate 31. The adjusting member 32 is rotatably engaged with the housing 1. When the adjusting member 32 rotates, causing the connecting plate 31 to move closer to or further away from the housing 1, the imaging sensor 221 moves synchronously with the connecting plate 31 to adjust the distance between the imaging element 22 and the lens 21. Specifically, the connecting plate 31 is parallel to the rear cover 13. The imaging element 22 is fixedly mounted on the side of the connecting plate 31 away from the lens 21. The side of the connecting plate 31 away from the rear cover 13 is connected to the lens 21. The connecting plate 31 has a lens guide structure. The lens 21 is precisely positioned through the lens guide structure's hole-axis engagement, serving as the main guide for the focusing process. Simultaneously, the enclosed space prevents stray light from entering the optical system. The imaging sensor 221 is positioned opposite the lens guide structure. Light passes through the lens guide structure and forms an image on the imaging sensor 221. In this embodiment, one end of the adjusting member 32 is rotatably engaged with the rear end cover 13, and the other end is threadedly connected to the connecting plate 31. In some other embodiments, one end of the adjusting member 32 is fixedly connected to the connecting plate 31, and the other end extends to the rear end cover 13 and rotatably engages with the rear end cover 13. The adjusting member 32 is an adjusting screw. By rotating the adjusting member 32 clockwise or counterclockwise, a stepless focusing function is formed. Depending on the usage environment, adjusting the adjusting member 32 moves the connecting plate 31 closer to or further away from the lens guide structure, thereby adjusting the distance between the lens 21 and the imaging element 22, so as to achieve focusing flexibility and accuracy in a limited space, providing a larger focusing range and higher focusing accuracy.

[0043] Furthermore, the focusing mechanism 3 is also provided with a guide post 33 and an elastic element 34. The guide post 33 extends in the same direction as the adjusting member 32. The elastic element 34 is sleeved on the periphery of the guide post 33. The elastic element 34 is located between the connecting plate 31 and the housing 1. The guide post 33 is fixedly connected to either the housing 1 or the connecting plate 31, and slidably engaged with the other. In this embodiment, the rear end cover 13 is provided with a guide positioning hole. One end of the guide post 33 passes through the guide positioning hole and slidably engages with the rear end cover 13. The other end of the guide post 33 is fixedly connected to the connecting plate 31. When the adjusting member 32 is rotated, the connecting plate 31 moves. The connecting plate 31 is guided in the direction of movement by the guide post 33 engaging with the guide positioning hole, which enhances the movement stability of the connecting plate 31 and reduces the misalignment of the imaging sensor 221 and the lens guiding structure caused by the offset of the connecting plate 31. The elastic element 34 is preferably a compression spring. The elastic element 34 is provided outside the guide post 33. After the focusing is completed, the focusing mechanism 3 is self-locked, and the stickiness of the focusing process is ensured.

[0044] Please refer to Figure 2 and Figure 6 In order to achieve better imaging results for the visual inspection camera, the imaging mechanism 2 is provided with a first light source assembly 24 and a second light source assembly 25. The first light source assembly 24 is located in the receiving chamber 14 and is connected to the lens; the second light source assembly 25 is located on the outer wall of the housing 1 and is located around the light inlet 121. The second light source assembly 25 is used to provide supplementary lighting for the object being photographed.

[0045] The first light source assembly 24 includes an internal light source module 241 electrically connected to the circuit board 222 and a mounting cover 242 for mounting the internal light source module 241. The mounting cover 242 is fixedly connected to the lens 21. The internal light source module 241 is fixedly mounted on the mounting cover 242 and located between the mounting cover 242 and the connecting plate 31. The internal light source module 241 generates illumination light. After passing through the lens 21, the illumination light illuminates the object being photographed. Under the illumination light, the object generates signal light, which is focused onto the imaging element 22. In this embodiment, the illumination light generated by the internal light source module 241 shares a light path with the light during imaging to compact the central space. The spatial size of the lens 21, considering the design standards of the imaging element 22 and the field of view of the lens 21, utilizes the central space as much as possible to achieve miniaturization of the visual inspection camera.

[0046] The second light source assembly 25 is fixedly installed on the front cover 12. The housing 1 is provided with a textured layer 122. The textured layer 122 is located on the end face of the front cover 12 facing the object being photographed. The textured layer 122 is configured to prevent light reflected by the object from re-entering the light inlet 121 and reduce the generation of stray light.

[0047] Please refer to Figure 5 and Figure 6When the visual inspection camera is running, both the circuit board 222 and the internal light source module 241 will generate heat. It is necessary to reduce the local temperature of the circuit board 222 and the internal light source module 241 during operation to prevent them from having a reduced lifespan or failing to work due to excessive temperature. Therefore, the heat dissipation mechanism 4 is provided with a first heat dissipation component 41 for dissipating heat from the circuit board 222 and a second heat dissipation component 42 for dissipating heat from the internal light source module 241.

[0048] The first heat dissipation component 41 is attached to the circuit board 222 and is supported on the connecting plate 31, moving synchronously with the connecting plate 31. The first heat dissipation component 41 includes a first heat-conducting plate 411 and first heat dissipation fins 412 disposed on the first heat-conducting plate 411. The circuit board 222 is attached to the first heat-conducting plate 411 via a thermally conductive pad, and the first heat dissipation fins 412 are arranged around the circuit board 222. During use, the thermally conductive pad can completely expel the air between the circuit board 222 and the first heat-conducting plate 411 to achieve sufficient contact and conduct the heat generated by the circuit board 222 to the first heat-conducting plate 411 for heat dissipation. In this embodiment, the first heat dissipation fins 412 are disposed on the side of the first heat-conducting plate 411 parallel to the guide post 33 and the adjusting member 32, and above the first heat-conducting plate 411, to increase the heat dissipation area. The first heat dissipation fin 412 can increase the heat dissipation area of ​​the first heat conduction plate 411 by about 25 times, accelerate heat exchange, and thus reduce the local temperature of the circuit board 222 during operation.

[0049] The second heat dissipation component 42 is mounted on the first light source component 24 to dissipate heat from the first light source component 24. The second heat dissipation component 42 is fixedly installed on the mounting cover 242. The second heat dissipation component 42 includes a second heat-conducting plate 421 and second heat dissipation fins 422 disposed on the second heat-conducting plate 421. The internal light source module 241 is disposed on the second heat-conducting plate 421 through a thermally conductive pad, and the second heat dissipation fins 422 are arranged around the internal light source module 241. The internal light source module 241 and the second heat-conducting plate 421 are in contact with each other through the thermally conductive pad, ensuring that all heat from the back of the internal light source module 241 can still be conducted to the second heat-conducting plate 421 even when there are solder joints and resistance. In this embodiment, the second heat-conducting plate 421 is provided with second heat dissipation fins 422 on the side and top to increase the heat dissipation area. Although the internal light source module 241 is far from the housing 1 and cannot dissipate heat by sticking to the housing 1, the second heat dissipation component 42 ensures that the light source LEDs work normally and are not burned out.

[0050] Furthermore, the rear cover 13 is provided with a heat dissipation hole group, which facilitates the upward discharge of hot airflow from the first heat dissipation component 41 and the second heat dissipation component 42 within the chamber 14, and the downward entry of cold airflow from outside the housing 1, thus achieving good natural convection. In addition, the heat dissipation hole group is composed of an array of small round holes, and the structure of the heat dissipation hole group can largely ensure the electromagnetic shielding effect of the housing 1.

[0051] It should be noted that for cameras that do not require focusing in the past, simply connecting the imaging element to the housing using a thermal pad is sufficient to dissipate heat from the imaging element using the housing. However, for cameras that require focusing, conventional heat sinks are usually arranged perpendicular to the circuit board surface, encroaching on camera space and hindering camera miniaturization. This application's embodiment, by rationally arranging the number of circuit board layers, fully utilizes the space for adjusting the focusing structure, placing the heat sinks laterally, i.e., in the gaps between the focusing structure. Simultaneously, the stacked circuit board arrangement further saves space along the camera's plane, ensuring camera miniaturization while achieving focusing functionality, which is beneficial for camera placement in confined areas.

[0052] Since the first light source assembly 24 is close to the focusing mechanism 3, if the cable at its output end is not controlled, the accumulated cable can easily encroach on the focusing space, thus affecting the focusing process. In order to organize the cable at the output end of the first light source assembly 24, the second heat-conducting plate 421 is provided with multiple winding grooves 43 and multiple pressure plates 44. The pressure plates 44 are fixedly set on the second heat-conducting plate 421. The winding grooves 43 and the pressure plates 44 are arranged one-to-one, and the pressure plates 44 cover the opening of the winding grooves 43. When the cable passes through the winding grooves 43, the pressure plates 44 fix the cable to organize the cable and ensure that the internal cable does not affect the focusing function in the narrow space.

[0053] Please refer to Figure 4 and Figure 5In order to prevent electromagnetic interference from affecting the normal operation of the visual inspection camera, the connecting plate 31 and the first heat-conducting plate 411 are electrically connected to form an electromagnetic shield around the imaging element 22 while achieving the functions of focusing and heat dissipation. Specifically, the sensing element is not oxidized. The connecting plate 31 has multiple exposed through holes 311, and the imaging element 22 has multiple metal through holes 223. The connecting plate 31 and the imaging element 22 are connected by screws through the exposed through holes 311 and the metal through holes 223 and are electrically conductive to each other. The first heat-conducting plate 411 has multiple exposed interfaces 413. The first heat-conducting plate 411 and the connecting plate 31 are connected by screws through the exposed through holes 311 and the exposed interfaces 413 and are electrically conductive to each other. The imaging element 22 is located between the connecting plate 31 and the first heat-conducting plate 411 and is electrically connected to each other. The imaging element 22 is very sensitive to electromagnetic interference. Through the connecting plate 31 and the first heat-conducting plate 411, the imaging element 22 can be isolated from external electromagnetic interference, forming an electromagnetic shield around the imaging element 22 to prevent external electromagnetic interference from having a negative impact on the imaging element 22 and to ensure its normal operation.

[0054] Please refer to Figure 4 Furthermore, the connecting plate 31 is also provided with a grounding hole 312 for connecting a grounding wire to ground. The grounding hole 312 is used to ground the imaging element 22 through the grounding wire to form a 0V reference surface inside, thereby constituting local electromagnetic shielding. When electromagnetic waves encounter the imaging element 22 forming the 0V reference surface, the imaging element 22 forming the 0V reference surface can provide a low-impedance loop, allowing the energy of the electromagnetic waves to flow back to the ground or other places more easily through the grounding wire, thereby reducing the propagation of electromagnetic waves in the circuit and reducing the interference of electromagnetic waves to the surrounding environment or other electronic equipment, achieving a local electromagnetic shielding effect even in more severe environments.

[0055] The focusing mechanism 3 is electrically connected to the housing 1, and the housing 1 provides secondary electromagnetic shielding. Specifically, the connecting plate 31 is provided with exposed screw holes 313 for connecting the adjusting component 32, and the housing 11 is provided with exposed bosses 15 for connecting the guide post 33. The connecting plate 31 is electrically connected to the housing 1 through the adjusting component 32 and the guide post 33, thereby achieving the secondary electromagnetic shielding effect of the housing 1 and further ensuring the normal operation of the visual inspection camera.

[0056] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A visual inspection camera, characterized in that, include: The housing (1) has a receiving chamber (14) and the housing (1) is provided with a light inlet (121); An imaging mechanism (2) is disposed in the receiving chamber (14). The imaging mechanism (2) includes a lens (21) and an imaging element (22). The lens (21) is aligned with the light inlet (121). The lens (21) is used to focus the signal light generated by the photographed object onto the imaging element (22). A focusing mechanism (3) is installed on the housing (1). The focusing mechanism (3) includes a connecting plate (31) and an adjusting member (32). The imaging element (22) is disposed on the connecting plate (31). The adjusting member (32) is rotatably engaged with the housing (1). Rotating the adjusting member (32) causes the connecting plate (31) to move closer to or further away from the housing (1) to adjust the distance between the imaging element (22) and the lens (21). The imaging element (22) includes an imaging sensor (221) and a circuit board (222). The circuit board (222) is supported on the surface of the connecting plate (31). The imaging sensor (221) is fixed on the circuit board (222) or the connecting plate (31) and is electrically connected to the circuit board (222). When the adjusting member (32) moves the connecting plate (31), the imaging sensor (221) moves synchronously with the connecting plate (31).

2. A visual inspection camera according to claim 1, characterized in that, The focusing mechanism (3) further includes a guide post (33) and an elastic element (34). The guide post (33) extends in the same direction as the adjusting element (32). The elastic element (34) is sleeved on the periphery of the guide post (33). The elastic element (34) is located between the connecting plate (31) and the housing (1). The guide post (33) is fixedly connected to either the housing (1) or the connecting plate (31) and slidably engaged with the other.

3. A visual inspection camera according to claim 1, characterized in that, It also includes a heat dissipation mechanism (4), which includes a first heat dissipation component (41). The first heat dissipation component (41) is attached to the circuit board (222) for dissipating heat from the circuit board (222). The first heat dissipation component (41) is carried on the connecting plate (31) and moves synchronously with the connecting plate (31).

4. A visual inspection camera according to claim 3, characterized in that, The first heat dissipation component (41) includes a first heat-conducting plate (411) and a first heat dissipation fin (412) disposed on the first heat-conducting plate (411). The circuit board (222) is attached to the first heat-conducting plate (411) by a thermally conductive pad, and the first heat dissipation fin (412) is arranged around the circuit board (222).

5. A visual inspection camera according to claim 4, characterized in that, The imaging mechanism (2) further includes a first light source assembly (24), which is disposed in the receiving chamber (14) and communicates with the lens (21); the first light source assembly (24) includes an internal light source module (241), which is used to generate illumination light. The illumination light passes through the lens (21) and illuminates the object being photographed. The object being photographed generates signal light under the illumination light.

6. A visual inspection camera according to claim 5, characterized in that, The imaging mechanism (2) further includes a second light source assembly (25), which is disposed on the outer wall of the housing (1) and located around the light inlet (121) for supplementing light to the object being photographed; the end face of the housing (1) on which the second light source assembly (25) is mounted is provided with a textured layer (122).

7. A visual inspection camera according to claim 5, characterized in that, The heat dissipation mechanism (4) further includes a second heat dissipation component (42), which covers the first light source component (24) to dissipate heat from the first light source component (24). The second heat dissipation component (42) includes a second heat-conducting plate (421) and a second heat dissipation fin (422) disposed on the second heat-conducting plate (421). The internal light source module (241) is disposed on the second heat-conducting plate (421) through a thermally conductive pad, and the second heat dissipation fin (422) is arranged around the internal light source module (241).

8. A visual inspection camera according to claim 7, characterized in that, The second heat-conducting plate (421) is provided with a plurality of winding grooves (43) and a plurality of pressure plates (44). The winding grooves (43) and the pressure plates (44) are arranged in a one-to-one correspondence. The pressure plates (44) cover the opening of the winding grooves (43) and are fixed by the pressure plates (44) to organize the cables when they pass through the winding grooves (43).

9. A visual inspection camera according to claim 1, characterized in that, The housing (1) includes a middle shell (11), a front cover (12) and a rear cover (13). The receiving chamber (14) is formed by the middle shell (11), the front cover (12) and the rear cover (13). The receiving chamber (14) is configured as a closed space to achieve electromagnetic shielding of the housing (1).

10. A visual inspection camera according to claim 4, characterized in that, The connecting plate (31) is provided with a plurality of exposed through holes (311), and the imaging element (22) is provided with a plurality of metal through holes (223). The connecting plate (31) and the imaging element (22) are connected by screws through the exposed through holes (311) and the metal through holes (223) and are electrically conductive to each other. The first heat-conducting plate (411) is provided with a plurality of exposed interfaces (413). The first heat-conducting plate (411) and the connecting plate (31) are connected by screws through the exposed through holes (311) and the exposed interfaces (413) and are electrically conductive to each other, forming an electromagnetic shield around the imaging element (22).

11. A visual inspection camera according to claim 10, characterized in that, The connecting plate (31) is also provided with a grounding hole (312) for connecting a grounding wire to ground. The grounding hole (312) is used to ground the imaging element (22) through the grounding wire to form a 0V reference surface inside the imaging element (22) to form local electromagnetic shielding.

12. A visual inspection camera according to claim 2, characterized in that, The connecting plate (31) is provided with exposed screw holes (313) for connecting the adjusting member (32), and the housing (1) is provided with exposed bosses (15) for connecting the guide post (33). The connecting plate (31) is electrically connected to the housing (1) through the adjusting member (32) and the guide post (33) to achieve secondary electromagnetic shielding of the housing (1).

Images