Carrier tape

Abstract

A carrier tape is provided that is not prone to interlayer delamination in the partition walls between the receiving portions of the receiving components. The carrier tape (1) is formed into a strip shape from a laminated material constituting layers in the lamination direction, and has a surface (1a) and a back surface (1b) opposite each other in the height direction corresponding to the lamination direction. On the surface (1a) side, a plurality of receiving portions (10) of the receiving component (M) are arranged along the length direction with the partition walls (20) in between. In the height direction, the height position (21h) of the top (21) of the partition wall (20) is lower than the height position (1ah) of the surface (1a).

Description

Technical Field

[0001] The present invention relates to a carrier tape suitable for use in situations where a number of chip-shaped electronic components or other components are contained, transported, or stored. Background Technology

[0002] Conventionally, when transporting tiny electronic components such as semiconductor chips and capacitor chips, many electronic components are sometimes housed in a long, strip-shaped carrier tape. This carrier tape is wound onto a reel and transported along with the reel. Such carrier tapes have receiving portions arranged along their length on the surface side, including recesses for individually accommodating electronic components. A cover tape is then attached to the surface to seal the electronic components into these receiving portions. Patent Document 1 discloses a carrier tape made of paper as a substrate, with many receiving portions formed on the surface of the substrate using a molding die.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-061944 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The aforementioned receiving portions are separated by partition walls. Reducing the thickness of the partition walls that form the gaps between the receiving portions, thereby decreasing the spacing between them, is advantageous for efficiently accommodating numerous electronic components. However, if the thickness of the partition walls is made as thin as, for example, about 0.3 mm, in the case of a layered paper carrier tape, interlayer delamination can easily occur at the partition walls during stamping with a molding die. If this delamination occurs, fine dust and paper particles are generated from the delaminated portion as foreign matter, raising concerns that this foreign matter may adversely affect the electronic components.

[0008] Therefore, the object of the present invention is to provide a carrier tape that is less prone to interlayer peeling in the partition wall between the receiving portions of the receiving component.

[0009] Technical solutions for solving the problem

[0010] The carrier tape of the present invention is formed into a strip from a laminated material constituting layers in the lamination direction, having a surface and a back surface opposite each other in a height direction corresponding to the lamination direction, wherein on the surface side, a plurality of receiving portions of receiving members are arranged along the length direction with spacers between them, wherein, in the height direction, the top of the spacers is lower than the height of the surface.

[0011] Invention Effects

[0012] According to the present invention, a carrier tape is provided that is less prone to interlayer delamination in the partition walls between the receiving portions of the receiving components. Attached Figure Description

[0013] Figure 1 This is a top view showing a portion of the carrier tape involved in the embodiment.

[0014] Figure 2 yes Figure 1 Sectional view II-II.

[0015] Figure 3 yes Figure 1 Sectional view III-III.

[0016] Figure 4 yes Figure 2 Enlarged view of Part IV.

[0017] Figure 5 This is a cross-sectional view showing another embodiment of the partition wall portion and is related to... Figure 4 The corresponding diagram. Detailed Implementation

[0018] The embodiments will now be described with reference to the accompanying drawings. Figure 1 This is a top view of the carrier tape 1 according to the embodiment. Figure 2 yes Figure 1 Sectional view II-II. Figure 3 yes Figure 1 Sectional view III-III. Figure 4 yes Figure 2 Enlarged view of Part IV.

[0019] The carrier tape 1 involved in the embodiment is formed into a strip shape from paper, which is a laminated material constituting layers in the thickness direction. Regarding the paper forming the carrier tape 1, multiple sheets of paper, known as laminated paper, are stacked in the lamination direction and bonded together to form the tape. Figures 1-4 In the diagram, L represents the length direction of carrier tape 1, W represents the width direction orthogonal to the length direction L, and T represents the height direction orthogonal to both the length direction L and the width direction W. The aforementioned lamination direction corresponds to the height direction of carrier tape 1. In the following description, the length direction, width direction, and height direction refer to the directions indicated by L, W, and T, respectively. Furthermore, the height direction T is the same as the thickness direction of carrier tape 1. Hereinafter, the height direction will sometimes be referred to as the thickness direction.

[0020] The carrier tape 1 has a surface 1a and a back surface 1b that are opposite to each other in the height direction. Both surface 1a and back surface 1b are flat surfaces and are parallel to each other. The distance between surface 1a and back surface 1b is the maximum distance in the height direction of the carrier tape 1, that is, the distance between surface 1a and back surface 1b is the thickness of the carrier tape 1.

[0021] On the surface 1a side of the carrier tape 1, a plurality of receiving portions 10 are formed. The plurality of receiving portions 10 are arranged at equal intervals along the length direction at one end biased towards the width direction of the carrier tape 1. On the opposite side of the width direction end where the plurality of receiving portions 10 are arranged, i.e., the other end side, a plurality of feed holes 30 are formed at equal intervals along the length direction. The feed holes 30 are circular through holes that extend from the surface 1a to the back surface 1b.

[0022] It accommodates one by one in multiple compartments 10. Figure 4 The component M shown is a chip-shaped electronic component with a cuboid shape, such as a semiconductor chip or a multilayer ceramic capacitor, but is not limited to this.

[0023] A partition wall 20 is formed between adjacent receiving portions 10 in the longitudinal direction to separate the receiving portions 10. The plurality of receiving portions 10 are arranged in a row along the longitudinal direction with the partition walls 20 in between.

[0024] The receiving portion 10 is a recess that opens on the surface 1a side of the carrier tape 1. The receiving portion 10 has a rectangular internal space corresponding to the received component M. For example... Figure 3 as well as Figure 4 As shown, the receiving portion 10 is formed by a bottom 11, a pair of sidewall portions 12 on both sides in the width direction, and a pair of partition wall portions 20 on both sides in the length direction. The pair of sidewall portions 12 are opposite to each other in the width direction, and the pair of partition wall portions 20 are opposite to each other in the length direction.

[0025] The pair of sidewall portions 12 forming the receiving portion 10 are flat surfaces along both the length and height directions, and are formed to rise substantially vertically from the end edges on both sides of the bottom 11 in the width direction and be directly continuous with the surface 1a. That is, as Figure 1 As shown, when viewed from above, the carrier belt 1 has surfaces 1a on both sides of the recess in the width direction, but there is no portion that separates the receiving portion 10 from the surface 1a.

[0026] like Figure 3 As shown, the partition wall portion 20 has a rectangular shape when viewed from the front in the length direction. The partition wall portion 20 has a top 21 that extends straight in the width direction. The top 21 is the end of the partition wall portion 20 on the surface 1a side. In the height direction, the height position 21h of the top 21 is lower than the height position 1ah of the surface 1a. That is, the top 21 of the partition wall portion 20 does not exist in the same plane as the surface 1a, and is recessed towards the bottom 11 side compared to the surface 1a. In addition, the so-called height position 21h of the top 21 refers to the highest position of the top 21 that is closest to the surface 1a in the height direction.

[0027] like Figure 4As shown, the amount of recess H1, that is, the distance H1 in the height direction from the top 21 to the surface 1a, is preferably 5% or more and 30% or less of the depth H2 of the receiving portion 10. The depth H2 of the receiving portion 10 is the dimension in the height direction from the bottom 11 to the surface 1a, and is the height of the side wall portion 12.

[0028] In this embodiment, the thickness G, which is a dimension along the length of the partition wall 20, is not limited, but is, for example, 0.2 mm or more and 0.45 mm or less. If the thickness G of the partition wall 20 is small enough, the spacing between the plurality of receiving portions 10 becomes smaller, thereby increasing the number of receiving portions 10 and enabling efficient accommodation of many components M, which is therefore preferred.

[0029] like Figure 4 As shown, the cross-sectional shape of the top 21 along both the length and height directions is formed in an R-shape protruding towards the surface 1a. That is, the cross-sectional shape of the upper surface 21a side of the partition wall including the top 21 is a semi-circular arc. The radius r of the R of this upper surface is, for example, 0.1 mm or more and 1.5 mm or less.

[0030] Additionally, the cross-sectional shape of the top 21 of the partition wall 20 may not be R-shaped. For example, as... Figure 5 As shown, the top 21 of the partition wall 20 may also have a rectangular cross-sectional shape along its length and height, and the upper surface 21a of the top 21 may be formed on a flat surface along its length and width.

[0031] In this embodiment, the carrier tape 1 is formed by pressing a forming mold onto the surface 1a of a raw material comprising a strip of laminated paper, thereby simultaneously forming the receiving portion 10 and the partition wall portion 20. During this stamping process, the partition wall portion 20 is formed by compressing the raw material in both the height and thickness directions. Therefore, the partition wall portion 20 has a higher degree of compression compared to other portions, and a higher density compared to other portions. Furthermore, due to its high density, the partition wall portion 20 has a higher hardness than other portions.

[0032] In this embodiment, the carrier tape 1 accommodates each component M individually in a plurality of receiving portions 10, and a cover tape (not shown) is attached to the surface 1a to seal the plurality of receiving portions 10. Thus, the component M is sealed into the receiving portion 10 without falling off. The carrier tape 1, with each component M individually accommodated in the plurality of receiving portions 10, is wound onto a reel (not shown) and transported or stored. Furthermore, at the destination of the component M, the carrier tape 1 is unwound from the reel while the cover tape is peeled off, so that the component M is picked up from the receiving portion 10 and used. When unwinding the carrier tape 1 from the reel, the teeth of a rotating conveyor sprocket sequentially engage with the feed holes 30. Thus, the carrier tape 1 is unwound from the reel, and the plurality of components M are conveyed in the unwinding direction.

[0033] The above describes the carrier tape 1 according to the embodiment. The following effects can be achieved by using the carrier tape 1.

[0034] The carrier tape 1 involved in the embodiment is formed into a tape shape from a laminated material that constitutes layers in the lamination direction, and has a surface 1a and a back surface 1b that are opposite each other in the height direction corresponding to the lamination direction. On the surface 1a side, a plurality of receiving portions 10 of the receiving member M are arranged along the length direction through the partition wall portion 20. In the height direction, the height position of the top 21 of the partition wall portion 20 is lower than the height position of the surface 1a.

[0035] Therefore, since the height of the partition wall portion 20 is smaller than the height (thickness) of the carrier tape 1, the degree of interlaminar delamination can be reduced compared to the case where the height is the same as the thickness of the carrier tape 1. That is, interlaminar delamination is less likely to occur in the partition wall portion 20.

[0036] In the carrier belt 1 of the embodiment, the distance H1 from the top 21 to the surface 1a in the height direction is preferably 5% or more and 30% or less of the depth H2 of the receiving portion 10.

[0037] Therefore, the height of the partition wall portion 20 can be ensured to be such that the component M housed in the receiving portion 10 does not exceed the partition wall portion 20 and is exposed, and the effect of suppressing interlayer peeling due to the low height can be obtained.

[0038] In the carrier tape 1 of the embodiment, the thickness of the partition wall portion 20 is preferably 0.2 mm or more and 0.45 mm or less.

[0039] As a result, the spacing between the multiple receiving parts 10 becomes smaller and the number of receiving parts 10 increases, enabling the efficient accommodation of many components M.

[0040] In the carrier belt 1 of the embodiment, the cross-sectional shape of the top 21 along the length and height directions is preferably formed as an R-shape protruding toward the surface 1a.

[0041] For example, if the cross-sectional shape of the top 21 is rectangular and has corners, the corners are prone to curling, which can easily lead to interlayer peeling and burrs. However, by forming the top 21 into an R-shape, such defects are less likely to occur. That is, by forming the top 21 into an R-shape, the generation of interlayer peeling and burrs at the top 21 can be suppressed.

[0042] In the carrier tape 1 of the embodiment, the density of the partition wall portion 20 is preferably higher than that of other portions other than the partition wall portion 20.

[0043] As a result, the layers of the partition wall 20 are densified, thus further suppressing the occurrence of interlayer delamination.

[0044] The present invention is not limited to the structure of the above embodiments, and can be applied by appropriate modifications without changing the spirit of the present invention.

[0045] Explanation of reference numerals in the attached figures

[0046] 1: Carrier tape;

[0047] 1a: The surface of the carrier tape;

[0048] 1ah: The height position of the carrier tape surface;

[0049] 1b: The back side of the carrier tape;

[0050] 10: Reception area;

[0051] 20: Partition wall section;

[0052] 21: Top;

[0053] 21h: The height position of the top of the partition wall;

[0054] G: Thickness of the partition wall;

[0055] H1: The distance from the top to the surface in the height direction;

[0056] H2: Depth of the accommodating section;

[0057] M: Component;

[0058] L: Length direction;

[0059] T: Height direction;

[0060] W: Width direction.

Claims

1. A carrier tape formed from paper, which is a laminated material constituting layers in a lamination direction, into a tape shape, having a surface and a back surface opposite each other in a height direction corresponding to the lamination direction, wherein on the surface side, a plurality of receiving portions of receiving members are arranged along the length direction with partition walls between them. in, In the height direction, the top of the partition wall is lower than the height of the surface. The distance from the top to the surface in the height direction is more than 5% and less than 30% of the depth of the receiving portion. The thickness of the partition wall in the longitudinal direction is 0.2 mm or more and 0.45 mm or less.

2. The carrier tape according to claim 1, wherein, The cross-sectional shape of the top along the length and height directions is formed as an R-shape protruding towards the surface.

3. The carrier tape according to claim 1 or 2, wherein, The density of the partition wall is higher than that of other parts outside the partition wall.

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