GIL equipment with active temperature control

Abstract

This invention provides a GIL device with an active temperature control mechanism. The GIL device includes: a housing, grounded; a guide rod, extending in the same direction as the housing; a post insulator, sleeved on the guide rod and connected to the housing; and the active temperature control mechanism, including a cooling element, a temperature measuring element, and a control element. The cooling element is located on the upper part of the housing, the temperature measuring element is located on the housing, and the control element is signal-connected to both the cooling element and the temperature measuring element. The control element controls the operation of the cooling element based on the measurement results from the temperature measuring element. The technical solution provided in this application solves the problem of the lack of active temperature control measures for uneven temperature distribution in the space of a three-post insulator in a GIL device.

Description

Technical Field

[0001] This invention relates to the field of GIL technology, and more specifically, to a GIL device with an active temperature control device. Background Technology

[0002] GIL, an advanced power transmission device, consists of a conductor rod, a housing, and three-post insulators. The conductor rod is coaxially inserted into the housing, and the cavity between the housing and the conductor rod is filled with insulating gas such as SF6 as the insulating medium. The three-post insulators are sleeved on the conductor rod and connected to the housing to provide electrical insulation and mechanical support. Due to its large transmission capacity, low power consumption, and transmission stability unaffected by geographical environment and weather, GIL is widely used in special power transmission scenarios such as hydropower transmission and cross-mountain and river crossings. GIL is an effective alternative to overhead transmission lines and cables, and can effectively support the clean and green upgrading of the power system.

[0003] During normal operation of ultra-high voltage (330kV to 750kV) GIL transmission pipelines, the current flowing through the internal conductor rods can reach 5000A. The Joule heat generated by the current flowing through the conductor rods is transferred to the three-post insulators through heat conduction, causing the temperature of the three-post insulators to rise. This heats the conductor rods and the insulating gas near the three-post insulators. Accompanied by heat transfer through thermal radiation and thermal convection of the insulating gas, the high-temperature insulating gas flows upward along the surface of the three-post insulators. After transferring heat to the outer shell, the insulating gas cools down and sinks to the bottom of the outer shell or the bottom of the three-post insulators, thus forming thermal convection within the GIL (the flow velocity can reach up to 0.12m / s). Gas convection causes the conductor rods to dissipate heat to the area above the conductor rods, making the temperature in the area above the conductor rods inside the GIL significantly higher than the temperature in the area below the conductor rods.

[0004] Due to the aforementioned conditions, the surface temperature of the three-post insulator exhibits spatial asymmetry (the temperature of the uppermost post is higher than that of the two lower posts). Since the surface flashover voltage of the three-post insulator in an SF6 atmosphere is related to the SF6 gas density, under constant gas pressure, as temperature increases, the SF6 gas density decreases, leading to a decline in SF6 insulation strength. This makes the surface of the insulating medium of the three-post insulator more susceptible to discharge. The spatial asymmetry in the surface temperature of the three-post insulator results in spatial non-uniformity in the surrounding SF6 gas density, thus causing spatial asymmetry in the surface insulation strength of the three-post insulator. The posts above the conductor rods have higher temperatures and lower SF6 gas densities than other posts, making them more prone to surface flashover. The uneven temperature distribution inside the gas-insulated barrier (GIL) affects the insulation performance of the three-post insulator. Because the three-post insulator plays a role in electrical insulation and mechanical support within the GIL, the uneven temperature distribution inside the GIL significantly impacts its insulation performance. The three-post insulator, to a certain extent, determines the insulation performance of the GIL; therefore, the uneven temperature distribution inside the GIL, to some extent, jeopardizes its safe and stable operation.

[0005] In related technologies, passive heat dissipation methods are used to optimize the internal temperature distribution of the GIL. For example, the size of the outer shell is increased to optimize the internal temperature distribution of the GIL. However, this method has high expansion costs and limited optimization of the internal temperature distribution of the GIL, so it is rarely used. Alternatively, as in patent 202311027988.6, multiple sets of heat dissipation holes are opened on the guide rod to improve the internal convection effect. However, the basic mechanism is still passive heat dissipation, and the actual heat dissipation effect is questionable. Or, since the conductivity of the guide rod material significantly affects the amount of Joule heat generated by current flow, the guide rod material with higher conductivity generates less heat per unit under the same current. Therefore, a material with lower resistivity is used to reduce the heat generation of the central guide rod under the same current, thereby improving the current carrying capacity of the guide rod. However, the effect of improving the material conductivity is limited, and the economy and processability are not good.

[0006] However, the relevant technologies lack active temperature regulation measures to address the uneven temperature distribution in the space of GIL three-post insulators. Summary of the Invention

[0007] This invention provides a GIL device with an active temperature control mechanism to solve the problem in related technologies of the lack of active temperature control measures for uneven temperature distribution in the space of GIL three-post insulators.

[0008] This invention provides a GIL device with an active temperature control mechanism. The GIL device includes: a housing, grounded; a guide rod, inserted inside the housing and extending in the same direction as the housing; a post insulator, sleeved on the guide rod and connected to the housing; and an active temperature control mechanism, including a cooling element, a temperature measuring element, and a control element. The cooling element is disposed on the upper part of the housing, the temperature measuring element is disposed on the housing, and the control element is signal-connected to both the cooling element and the temperature measuring element. The control element controls the operation of the cooling element based on the measurement results of the temperature measuring element.

[0009] Furthermore, the cooling component includes: a thermoelectric cooler with a cooler placement chamber on the outer casing, the thermoelectric cooler being placed inside the cooler placement chamber; and a power supply component disposed on the outside of the outer casing and electrically connected to the thermoelectric cooler.

[0010] Furthermore, the outer casing includes an annular ground plane and a cylindrical body. The annular ground plane is disposed inside the cylindrical body and connected to the cylindrical body. The guide rod passes through the annular ground plane. The annular ground plane surrounds the outer periphery of the post insulator. The annular ground plane is grounded. A cooling groove is provided on the inner side wall of the cylindrical body. The cooling groove and the outer surface of the annular ground plane form a cooling chip placement chamber. And / or, the cooling chip placement chamber is filled with silicone grease to fix the semiconductor cooling chip.

[0011] Furthermore, the cooling element includes at least two thermoelectric coolers, which are distributed circumferentially along the housing; and / or, the cooling surfaces of the thermoelectric coolers are arranged facing the axis of the housing.

[0012] Furthermore, a temperature measuring element placement chamber is provided on the outer shell, and the temperature measuring element is placed inside the temperature measuring element placement chamber.

[0013] Furthermore, the outer shell includes an annular grounding plate and a cylindrical body. The annular grounding plate is disposed inside the cylindrical body and connected to the cylindrical body. The guide rod passes through the annular grounding plate. The annular grounding plate surrounds the outer periphery of the post insulator. The annular grounding plate is grounded. A temperature measuring groove is provided on the inner side wall of the cylindrical body. The temperature measuring groove and the outer surface of the annular grounding plate form a temperature measuring element placement chamber.

[0014] Furthermore, the post insulator includes three posts evenly arranged circumferentially along the outer shell, each post extending radially along the outer shell, with both ends of the post connected to the guide rod and the outer shell respectively, one of the three posts being located directly above the guide rod and arranged vertically, and the control element being located directly above the post located directly above the guide rod.

[0015] Furthermore, the GIL device includes two temperature measuring elements, which are symmetrically arranged on both sides of the control element in the axial direction of the housing relative to the control element; and / or, the GIL device includes two cooling elements, which are symmetrically arranged on both sides of the control element in the circumferential direction of the housing relative to the control element.

[0016] Furthermore, the control unit includes a data processing and storage unit, a data transmission unit, and a manual reset unit disposed on the data processing and storage unit. The data processing and storage unit is connected to the data transmission unit, the temperature measuring unit, and the cooling unit via signals, respectively.

[0017] Furthermore, the GIL device also includes a low-voltage insert. The post insulator has at least two posts, one end of which is connected to a guide rod. The low-voltage insert is disposed at the other end of the post and is connected to the inner wall of the housing. The GIL device also includes an equalizing cover, which includes a first cover and a second cover. Both the first cover and the second cover are fitted onto the guide rod and are symmetrically disposed on both sides of the post insulator relative to the post insulator. The guide rod is a hollow cylinder.

[0018] According to the technical solution of this invention, the GIL device includes a shell, a guide rod, a post insulator, a cooling component, a temperature measuring component, and a control component. The guide rod carries AC or DC current, and the post insulator provides support and electrical insulation. The temperature measuring component detects the temperature distribution inside the shell, and the control component controls the cooling component to cool the shell based on the detection results. Since the cooling component is located in the upper part of the shell (the part of the shell above its axis), it can target the upper space of the shell with higher temperature according to the temperature distribution inside the shell. This allows the GIL device provided in this embodiment to actively cool the shell using the cooling component based on the temperature distribution inside the shell, reducing the Joule heat generated by the current flowing through the guide rod and the uneven temperature distribution of the post insulator caused by the flow of insulating gas. This improves the spatial uniformity of the insulation performance of the post insulator and reduces the impact on the safe and stable operation of the GIL. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0020] Figure 1 A cross-sectional view of a GIL device provided according to an embodiment of the present invention is shown;

[0021] Figure 2 A side view of a GIL device provided according to an embodiment of the present invention is shown.

[0022] The above figures include the following reference numerals:

[0023] 10. Outer shell; 11. Cooling chip placement compartment; 12. Annular grounding plate; 13. Cylinder body; 14. Temperature measuring element placement compartment;

[0024] 20. Guide rod;

[0025] 30. Post insulator; 31. Post;

[0026] 40. Cooling components; 41. Semiconductor refrigeration chips; 42. Power supply components;

[0027] 50. Temperature measuring element;

[0028] 60. Control components; 61. Data processing and storage components; 62. Data transmission components; 63. Manual reset components;

[0029] 70. Low-pressure insert; 80. Equalizing cover; 81. First cover; 82. Second cover. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] like Figure 1 As shown, this embodiment of the invention provides a GIL device, which includes a housing 10, a guide rod 20, a post insulator 30, and an active temperature control device. The housing 10 is grounded, the guide rod 20 is inserted inside the housing 10 and extends in the same direction as the housing 10, the post insulator 30 is sleeved on the guide rod 20 and connected to the housing 10, and the active temperature control device includes a cooling element 40, a temperature measuring element 50, and a control element 60. The cooling element 40 is disposed on the upper part of the housing 10, the temperature measuring element 50 is disposed on the housing 10, and the control element 60 is signal-connected to the cooling element 40 and the temperature measuring element 50 respectively. The control element 60 controls the cooling element 40 to work according to the measurement result of the temperature measuring element 50.

[0032] The GIL device provided in this embodiment includes a housing 10, a guide rod 20, a post insulator 30, a cooling component 40, a temperature measuring component 50, and a control component 60. The guide rod 20 carries AC or DC current, and the post insulator provides support and electrical insulation. The temperature measuring component 50 detects the temperature inside the housing 10. The control component 60 controls the cooling component 40 to cool the housing 10 based on the detection results of the temperature measuring component 50. Since the cooling component 40 is located in the upper part of the housing 10 (the part of the housing 10 above its axis), the cooling component 40 can target the upper space of the housing 10 with a higher temperature according to the temperature distribution inside the housing 10. This allows the GIL device provided in this embodiment to actively cool the housing based on the temperature distribution inside the housing 10, reducing the Joule heat generated by the current flowing through the guide rod 20 and the uneven temperature distribution of the post insulator 30 caused by the flow of insulating gas. This improves the spatial uniformity of the insulation performance of the post insulator 30 and reduces the impact on the safe and stable operation of the GIL.

[0033] In addressing the heat dissipation problem related to the temperature rise during GIL operation, the inventors proposed a solution that differs from the passive heat dissipation of the post insulators caused by the guide rods in existing technologies. This solution addresses the spatial differences in insulation performance caused by uneven temperature rise in and around the post insulators. It effectively solves the problem of uneven temperature distribution of the post insulators caused by the Joule heat generated by the current flowing through the GIL guide rods combined with the flow of insulating gas, thereby achieving active adjustment of the temperature distribution around the post insulators of the GIL.

[0034] Specifically, in this embodiment, the guide rod 20 is coaxially arranged with the outer shell 10, and the space between the inner wall of the outer shell 10 and the outer wall of the guide rod 20 is filled with insulating gas.

[0035] It should be noted that the temperature sensor 50 detects the temperature inside the outer casing 10, and the control unit 60 controls the cooling unit 40 to perform a cooling operation on the outer casing 10 based on the detection result of the temperature sensor 50, including the following two embodiments:

[0036] (1) The temperature measuring element 50 measures the temperature of several points inside the outer shell 10. The above points are preferably close to the post insulator 30 and located in the space above the middle of the post insulator 30. The control element 60 monitors the temperature of the above points according to the detection results of the temperature measuring element 50. When the proportion of the above points whose temperature exceeds the temperature threshold reaches the set proportion threshold, the control element 60 controls the cooling element 40 to perform a cooling operation on the outer shell 10.

[0037] (2) The temperature measuring element 50 detects the temperature distribution inside the outer shell 10. The control element 60 monitors the highest temperature inside the outer shell 10 based on the detection result of the temperature measuring element 50. When the highest temperature inside the outer shell 10 reaches the set temperature threshold, the control element 60 controls the cooling element 40 to perform a cooling operation on the outer shell 10.

[0038] like Figure 1 and Figure 2 As shown, the cooling component 40 includes a thermoelectric cooler 41 and a power supply component 42. A cooler placement chamber 11 is provided on the outer casing 10, and the thermoelectric cooler 41 is disposed within the cooler placement chamber 11. The power supply component 42 is disposed on the outside of the outer casing 10 and is electrically connected to the thermoelectric cooler 41. The control component 60 is signal-connected to the power supply component 42, and the control component 60 controls the power supply component 42 to cool the thermoelectric cooler 41 based on the detection result of the temperature measuring component 50.

[0039] In this embodiment, the power supply component 42 outputs a stable voltage of 8V to 12V to the semiconductor cooling chip 41. The power supply component 42 is connected to an external 220V mains power or 380V industrial power.

[0040] like Figure 1 and Figure 2 As shown, the outer casing 10 includes an annular ground plane 12 and a cylindrical body 13. The annular ground plane 12 is disposed inside and connected to the cylindrical body 13. The guide rod 20 passes through the annular ground plane 12. The annular ground plane 12 surrounds the outer periphery of the post insulator 30 and is grounded. A cooling trough is provided on the inner side wall of the cylindrical body 13. The cooling trough and the outer surface of the annular ground plane 12 form a cooling chip placement chamber 11. The grounding of the annular ground plane 12 makes its potential 0. During operation, although a high-frequency voltage is applied to the guide rod 20, the cooling component 40 in the cooling chip placement chamber 11 is shielded by the annular ground plane 12. The electric field strength in the temperature measuring component placement chamber 14 is extremely low. Thus, the annular ground plane 12 provides electromagnetic shielding for the cooling component 40 in the cooling trough, electromagnetically isolating the internal space of the annular ground plane 12 from the internal space of the cooling trough, and preventing the cooling component 40 from being affected by signal interference and high voltage.

[0041] In this embodiment, the annular ground plane 12 is coaxially arranged with the cylinder 13, and the semiconductor cooling chip 41 is preferably a TEC-12715 type semiconductor cooling chip.

[0042] In this embodiment, the cooling chip placement chamber 11 is filled with silicone grease to fix the semiconductor cooling chip 41.

[0043] like Figure 1As shown, the cooling element 40 includes at least two semiconductor cooling chips 41, which are distributed along the circumference of the housing 10, thereby increasing the cooling range of the cooling element 40 on the interior of the housing 10 in the circumference direction.

[0044] In this embodiment, the cooling element 40 includes five semiconductor cooling chips 41.

[0045] In this embodiment, the cooling surface of the thermoelectric cooler 41 is arranged inward toward the axis of the outer casing 10, thereby improving the cooling effect of the thermoelectric cooler 41 on the interior of the outer casing 10.

[0046] like Figure 2 As shown, a temperature measuring element placement chamber 14 is provided on the outer casing 10, and the temperature measuring element 50 is placed in the temperature measuring element placement chamber 14. The temperature measuring element 50 is preferably an RFID flat-panel wireless passive detector, and the temperature sensing range of the temperature measuring element 50 is between 20°C and 85°C.

[0047] like Figure 1 and Figure 2 As shown, the outer casing 10 includes an annular ground plane 12 and a cylindrical body 13. The annular ground plane 12 is disposed inside and connected to the cylindrical body 13. The guide rod 20 passes through the annular ground plane 12. The annular ground plane 12 surrounds the outer periphery of the post insulator 30 and is grounded. A temperature measuring groove is provided on the inner wall of the cylindrical body 13. The temperature measuring groove and the outer surface of the annular ground plane 12 form a temperature measuring element placement chamber 14. The grounding of the annular ground plane 12 makes its potential 0. During operation, although a high-frequency voltage is applied to the guide rod 20, the temperature measuring element 50 in the temperature measuring element placement chamber 14 is shielded by the annular ground plane 12. The electric field strength in the temperature measuring element placement chamber 14 is extremely low. Thus, the annular ground plane 12 provides electromagnetic shielding for the temperature measuring element 50 in the temperature measuring groove, electromagnetically isolating the internal space of the annular ground plane 12 from the internal space of the temperature measuring groove, and preventing the temperature measuring element 50 from being affected by signal interference and high voltage.

[0048] like Figure 1 As shown, the post insulator 30 includes three posts 31 evenly arranged circumferentially along the outer shell 10. Each post 31 extends radially along the outer shell 10. Both ends of the post 31 are connected to the guide rod 20 and the outer shell 10, respectively. One of the three posts 31 is located directly above the guide rod 20 and is vertically arranged. The control element 60 is located directly above the post 31 located directly above the guide rod 20. With this structure, the area near the post insulator 30 where the temperature rises most severely due to operation is near the post 31 located directly above the guide rod 20.

[0049] like Figure 1 and Figure 2As shown, the GIL device includes two temperature sensors 50, which are symmetrically arranged on both sides of the control unit 60 in the axial direction of the housing 10 relative to the control unit 60. The temperature sensors 50 are capable of real-time temperature detection of the parts near the post insulator 30 where the temperature rises most severely due to operation.

[0050] like Figure 1 and Figure 2 As shown, the GIL device includes two cooling elements 40, which are symmetrically arranged on both sides of the control element 60 in the circumferential direction of the housing 10. The cooling elements 40 can effectively cool the parts near the post insulator 30 where the temperature rises most severely due to operation.

[0051] Specifically, the central angle between the two cooling elements 40 and the axis of the outer casing is between 10° and 52°.

[0052] like Figure 1 As shown, the control unit 60 includes a data processing and storage unit 61, a data transmission unit 62, and a manual reset unit 63 mounted on the data processing and storage unit 61. The data processing and storage unit 61 is connected to the data transmission unit 62, the temperature measuring element 50, and the cooling element 40 via signals. The data processing and storage unit 61 processes the detection results from the temperature measuring element 50 (comparing the detection results with historical temperature data and incorporating the current carrying capacity of the guide rod 20 during the same period in history to provide a temperature warning), then adjusts the output voltage of the power supply unit 42 to change the cooling effect of the semiconductor cooling chip 41, achieving negative feedback closed-loop regulation of the temperature near the post insulator. The data processing results of the temperature measuring element 50 by the data processing and storage unit 61 can be wirelessly transmitted to maintenance personnel via the data transmission unit 62 using the WiFi 6 protocol. The manual reset unit 63 allows for manual adjustment of the internal temperature of the GIL and also resets the data processing and storage unit 61.

[0053] In this embodiment, considering that the internal temperature rise of the GIL also has a periodicity due to the periodic variation of the GIL load during existing operation, the temperature distribution near the GIL is actively adjusted based on the historical periodic load of the guide rod.

[0054] The data processing and storage unit 61 incorporates the historical load data of the GIL's operational lines and pre-classifies it by day, month, and quarter, performing feature learning on the loads during the classification period. Subsequently, it completes the calibration of the enclosed GIL's active temperature control system and sets the temperature control strategy: the GIL is placed in a stable, open indoor environment without direct sunlight (eliminating the influence of external heat sources on the GIL's internal temperature rise) to ensure good convection heat dissipation from the GIL's casing. Five current levels (1000-5000A) are passed through the GIL, with each current level flowing for 12 hours. After the temperature stabilizes for 2 hours, measurements are taken under conditions without temperature control. Temperature stability values ​​were measured at different current levels for 2 hours, with measurement intervals of 0.5 hours. The average of four measurements was taken as the typical temperature value near the three-post insulator inside the GIL at that current level. Then, the active cooling module and active temperature feedback adjustment module for the three-post insulator were activated to actively and collaboratively control the internal temperature of the GIL, maintaining a stable temperature for 4 hours. The stable temperature value at that current level with temperature regulation was measured again for 2 hours, with measurement intervals of 0.5 hours. The average of four measurements was taken as the typical temperature regulation value near the three-post insulator inside the GIL at that current level. This operation was repeated at different current levels, with the goal of ensuring that, at current levels of 1000A-5000A, the temperature near the three-post insulator inside the GIL, after regulation, decreased by at least 10% compared to the temperature before regulation.

[0055] The data processing and storage unit 61 includes a PID negative feedback voltage control module. The input value of the PID negative feedback voltage control module is the difference between the voltage value converted from the temperature measurement result of the temperature measuring element 50 and the input voltage value of the power supply element 42. The output value of the PID negative feedback voltage control module is the adjustment voltage value of the power supply element 42. Through the PID negative feedback voltage control module, real-time feedback regulation of the internal temperature of the GIL can be achieved, and non-discriminatory regulation of loads of various current levels (1000-5000A) can be realized.

[0056] like Figure 1 and Figure 2 As shown, the GIL device also includes a low-voltage insert 70. The post insulator 30 has at least two posts 31, one end of which is connected to the guide rod 20. The low-voltage insert 70 is disposed at the other end of the post 31 and is connected to the inner wall of the housing 10. The post insulator 30 is electrically connected to the housing 10 through the low-voltage insert 70.

[0057] Specifically, the low-pressure insert 70 is connected to the inner wall of the annular ground plane 12.

[0058] like Figure 2As shown, the GIL device also includes an equalizing cover 80, which includes a first cover 81 and a second cover 82. The first cover 81 and the second cover 82 are both sleeved on the guide rod 20. The first cover 81 and the second cover 82 are symmetrically arranged on both sides of the post insulator 30 relative to the post insulator 30, so as to avoid the problem of excessive local electric field strength at the junction of the epoxy material used in the post insulator 30 and the guide rod 20, and avoid material aging and partial discharge.

[0059] like Figure 1 As shown, the guide rod 20 is a hollow cylinder. Burrs on the surface and joints of metal conductors can cause partial discharge and damage insulation performance. Therefore, it is necessary to effectively remove burrs to prevent unexpected and sudden fault discharges.

[0060] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0061] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0062] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0063] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0064] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0065] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A GIL device with an active temperature control mechanism, characterized in that, The GIL device includes: The outer casing (10) is grounded. The guide rod (20) is inserted into the housing (10) and extends in the same direction as the housing (10); The post insulator (30) is sleeved on the guide rod (20) and connected to the outer shell (10); An active temperature control device includes a cooling element (40), a temperature measuring element (50), and a control element (60). The cooling element (40) is disposed on the upper part of the outer shell (10), and the temperature measuring element (50) is disposed on the outer shell (10). The control element (60) is connected to the cooling element (40) and the temperature measuring element (50) respectively. The control element (60) controls the cooling element (40) to work according to the measurement result of the temperature measuring element (50).

2. The GIL device according to claim 1, characterized in that, The cooling component (40) includes: A semiconductor cooling chip (41) is provided on the outer shell (10) with a cooling chip placement chamber (11) and the semiconductor cooling chip (41) is disposed in the cooling chip placement chamber (11); The power supply component (42) is disposed on the outside of the housing (10) and electrically connected to the semiconductor cooling chip (41).

3. The GIL device according to claim 2, characterized in that, The outer casing (10) includes an annular grounding plate (12) and a cylindrical body (13). The annular grounding plate (12) is disposed inside the cylindrical body (13) and connected to the cylindrical body (13). The guide rod (20) passes through the annular grounding plate (12). The annular grounding plate (12) surrounds the outer periphery of the post insulator (30). The annular grounding plate (12) is grounded. A cooling groove is provided on the inner side wall of the cylindrical body (13). The cooling groove and the outer surface of the annular grounding plate (12) form the cooling chip placement chamber (11); and / or, The cooling chip placement chamber (11) is filled with silicone grease to fix the semiconductor cooling chip (41).

4. The GIL device according to claim 2, characterized in that, The cooling element (40) includes at least two of the semiconductor cooling chips (41), which are distributed circumferentially along the housing (10); and / or, The cooling surface of the semiconductor refrigeration chip is positioned facing the axis of the outer casing (10).

5. The GIL device according to claim 1, characterized in that, The outer shell (10) is provided with a temperature measuring element placement chamber (14), and the temperature measuring element (50) is placed in the temperature measuring element placement chamber (14).

6. The GIL device according to claim 5, characterized in that, The outer casing (10) includes an annular grounding plate (12) and a cylindrical body (13). The annular grounding plate (12) is disposed inside the cylindrical body (13) and connected to the cylindrical body (13). The guide rod (20) passes through the annular grounding plate (12). The annular grounding plate (12) surrounds the outer periphery of the post insulator (30). The annular grounding plate (12) is grounded. A temperature measuring groove is provided on the inner side wall of the cylindrical body (13). The temperature measuring groove and the outer surface of the annular grounding plate (12) surround the temperature measuring element placement chamber (14).

7. The GIL device according to claim 1, characterized in that, The post insulator (30) includes three posts (31) evenly arranged circumferentially along the outer shell (10). Each post (31) extends radially along the outer shell (10). The two ends of the post (31) are connected to the guide rod (20) and the outer shell (10) respectively. One of the three posts (31) is located directly above the guide rod (20) and is arranged vertically. The control element (60) is located directly above the post (31) located directly above the guide rod (20).

8. The GIL device according to claim 7, characterized in that, The GIL device includes two temperature measuring elements (50), which are symmetrically arranged on both sides of the control element (60) in the axial direction of the housing (10) relative to the control element (60); and / or, The GIL device includes two cooling components (40), which are symmetrically arranged on both sides of the control component (60) in the circumferential direction of the housing (10).

9. The GIL device according to claim 1, characterized in that, The control unit (60) includes a data processing and storage unit (61), a data transmission unit (62), and a manual reset unit (63) disposed on the data processing and storage unit (61). The data processing and storage unit (61) is connected to the data transmission unit (62), the temperature measuring unit (50), and the cooling unit (40) respectively.

10. The GIL device according to claim 1, characterized in that, The GIL device also includes a low-voltage insert (70), the post insulator (30) has at least two posts (31), one end of the post (31) is connected to the guide rod (20), the low-voltage insert (70) is disposed at the other end of the post (31), and the low-voltage insert (70) is connected to the inner wall of the housing (10); The GIL device also includes a pressure equalization cover (80), which includes a first cover (81) and a second cover (82). The first cover (81) and the second cover (82) are both sleeved on the guide rod (20). The first cover (81) and the second cover (82) are symmetrically arranged on both sides of the post insulator (30) relative to the post insulator (30). The guide rod (20) is a hollow cylinder.

Images