A stress intensity factor acquisition method, device, equipment and storage medium

Abstract

The application belongs to the field of aircraft design, and particularly relates to a stress intensity factor acquisition method, device, equipment and storage medium, which comprises the following steps: determining a crack initiation mode of a hole edge crack, calculating a stress intensity factor correction coefficient beta1 of a single hole edge crack by calling a finite element software and using a fitting function method; calculating a stress intensity factor correction coefficient beta2 of a double hole edge crack by calling the finite element software and using the fitting function method; obtaining a crack tip stress intensity factor correction coefficient beta3 under the influence of a side hole according to an analytical method; obtaining left and right crack tip stress intensity factor correction coefficients beta4 and beta5 under the influence of a side crack according to the analytical method; and calculating a stress intensity factor of the hole edge crack according to a combined multiplication formula stress intensity factor. The application is aimed at solving the stress intensity factor of a multi-hole and multi-crack structure of an aircraft, and different solving methods are respectively given for different boundary conditions.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of aircraft design, and particularly relates to a stress intensity factor acquisition method, device, equipment and storage medium. BACKGROUND

[0002] The fatigue damage of aircraft structure is a difficult problem in the current aircraft damage tolerance design and analysis. Under the action of long-time fatigue load, the multi-hole and multi-crack structure is a common damage mode in the fatigue damage of aged aircraft. However, due to the mutual interference between the cracks around the hole, the analysis and calculation of the stress intensity factor at the crack tip are complex and there is no analytical solution, which is a key problem at present.

[0003] The commonly used stress intensity factor solving methods for the multi-hole and multi-crack structure in engineering mainly include: 1) calling the finite element software for calculation, which often needs to continuously re-divide the mesh at the crack tip and perform calculation, and a large amount of time is required in the crack propagation life analysis; 2) the stress intensity factor acquisition method based on combination multiplication, which needs to fit various boundary conditions, but the fitting process is very tedious and is easily affected by the remaining boundary conditions to increase the error. SUMMARY

[0004] The purpose of the application is to provide a method for calculating the stress intensity factor of the multi-hole and multi-crack structure by combining the analytical method and the fitting function method, which can effectively improve the calculation speed and accuracy of the stress intensity factor, and can be applied in the fatigue crack propagation life prediction and damage tolerance design analysis of the aircraft multi-hole and multi-crack structure, and has strong engineering application value.

[0005] To achieve the above technical effects, the technical scheme of the application is as follows:

[0006] A stress intensity factor acquisition method for the multi-hole and multi-crack structure of an aircraft, comprising the following steps:

[0007] S1: determining the crack initiation mode of the crack around the hole, and calculating the stress intensity factor correction coefficient β1 of the single crack around the hole by calling the finite element software and using the fitting function method;

[0008] S2: determining the crack initiation mode of the crack around the hole, and calculating the stress intensity factor correction coefficient β2 of the double crack around the hole by calling the finite element software and using the fitting function method;

[0009] S3: obtaining the stress intensity factor correction coefficient β3 of the crack tip under the influence of the side hole according to the analytical method;

[0010] S4: obtaining the stress intensity factor correction coefficients β4 and β5 of the left and right crack tips under the influence of the side crack according to the analytical method;

[0011] S5: Stress intensity factor according to the combination of the formula The stress intensity factor of a hole edge crack is calculated, wherein σ is a far-field stress, and a is a crack length.

[0012] Further, the determination method of the hole edge single crack stress intensity factor correction coefficient β1 is:

[0013] The hole edge single crack stress intensity factor correction coefficient and the geometric parameters hole edge crack length a and hole radius r present a nonlinear relationship, and the function relationship between the stress intensity factor boundary correction coefficient β1 and the crack length a and the hole radius r is expressed by the Levenberg-Marquardt optimization algorithm fitting as follows:

[0014]

[0015] In the formula, x=a / r (0.2

[0016] Further, the determination method of the hole edge double crack stress intensity factor correction coefficient β2 is:

[0017] In the hole edge double crack crack initiation mode, a1 and a2 are the lengths of the single cracks in the hole edge double cracks, and r is the hole radius. When a1 / r>3 and a2 / r>3, the double edge crack and the hole can be regarded as a long crack together, and the crack length is a1+a2+2r. When a1 / r≤3 or a2 / r≤3, the function relationship between the correction coefficient β2 of the left crack and the left and right cracks is obtained by fitting all data points according to the orthogonal distance regression method as follows:

[0018]

[0019] In the formula, x=a3 / r (0.2

[0020] Further, according to the Eshelby inclusion theory, the expression of the crack tip correction coefficient β3 of the side hole is:

[0021]

[0022] In the formula, r is the hole radius; and d is the distance from the crack tip to the center of the hole.

[0023] Further, when two unequal length cracks interact with each other, the influence coefficient β4 of the left crack A end crack tip stress intensity factor and the influence coefficient β5 of the B end crack tip stress intensity factor can be obtained according to the analytical method as follows:

[0024]

[0025] In the formula, L is the distance between the two cracks, 2a1 is the left crack length, and 2a2 is the right crack length.

[0026] Further, the correction coefficient of the stress intensity factor at the crack tip is calculated according to different influence conditions, according to the formula:

[0027]

[0028] A stress intensity factor acquisition device, comprising:

[0029] The correction coefficient β1 acquisition module determines the crack initiation mode of the hole edge crack, and calculates the stress intensity factor correction coefficient β1 of the hole edge single crack by calling the finite element software using the fitting function method.

[0030] The correction coefficient β2 acquisition module determines the crack initiation mode of the hole edge crack, and calculates the stress intensity factor correction coefficient β2 of the hole edge double crack by calling the finite element software using the fitting function method.

[0031] The correction coefficient β3 acquisition module obtains the stress intensity factor correction coefficient β3 of the crack tip under the influence of the side hole according to the analytical method.

[0032] The correction coefficient β4 and β5 acquisition module obtains the left and right crack tip stress intensity factor correction coefficients β4 and β5 under the influence of the side crack according to the analytical method.

[0033] The strength factor acquisition module calculates the stress intensity factor according to the combined multiplication formula stress intensity factor The stress intensity factor of the hole edge crack is calculated, wherein σ is the far-field stress, a is the crack length, and n is the nth hole crack.

[0034] An electronic device includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor implements the stress intensity factor acquisition method when executing the program.

[0035] A non-transitory computer readable storage medium has a computer program stored thereon, and the computer program is executed by a processor to implement the stress intensity factor acquisition method.

[0036] The beneficial effects of the present application are:

[0037] 1) The present application is aimed at solving the stress intensity factor of the multi-hole and multi-crack structure of the aircraft.

[0038] 2) The present application gives different solving methods for different boundary conditions.

[0039] 3) The present application has the advantages of small error by obtaining the influence coefficient of the crack tip stress intensity factor of the near-hole through the analytical method.

[0040] 4) The present application has the advantages of effectively improving the calculation accuracy of the stress intensity factor under complex boundary conditions by obtaining the influence coefficient of the crack tip stress intensity factor of the side crack through the analytical method.

[0041] 5) The stress intensity factor acquisition method has the advantage of fast speed compared with calling finite element software.

[0042] 6) The stress intensity factor acquisition method is suitable for stress intensity factor calculation in crack propagation analysis of multi-hole and multi-crack flat plate structure.

[0043] 7) The algorithm in the present application can be programmed to form a calculation tool, which can solve the problem of complex stress intensity factor calculation and large amount of calculation in multi-site damage (MSD) crack propagation analysis.

[0044] 8) The present application is suitable for widely distributed fatigue damage life assessment and damage tolerance design analysis, and can be widely applied to multi-site damage life prediction of three-dimensional structure after considering the geometric factor. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 The stress intensity factor acquisition method for the multi-hole and multi-crack structure of the present application is a technical roadmap.

[0046] Figure 2 The present application is a schematic diagram of the single crack initiation form structure of the hole edge.

[0047] Figure 3 The present application is a schematic diagram of the double crack initiation form structure of the hole edge.

[0048] Figure 4 The present application is a schematic diagram of the influence of the side hole on the crack tip.

[0049] Figure 5 The present application is a schematic diagram of the mutual influence of two unequal length cracks.

[0050] Figure 6 The present application is a schematic diagram of the structure parameters of the embodiment.

[0051] Figure 7 The present application is a schematic diagram of the example of the embodiment.

[0052] Figure 8 The stress intensity factor Comparison table of predicted value and finite element value. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0054] Therefore, the detailed description of the embodiments of the present application provided below in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts fall within the scope of protection of the present application.

[0055] It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0056] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "vertical", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0057] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrange", "mount", "connect" should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0058] Embodiment 1

[0059] A stress intensity factor acquisition method for a multi-hole multi-crack structure of an aircraft, comprising the following steps:

[0060] S1: determining the cracking mode of the hole edge crack, calculating the stress intensity factor correction coefficient β1 of the single hole edge crack by calling the finite element software using the fitting function method;

[0061] S2: determining the crack initiation mode of the hole edge crack, calculating the stress intensity factor correction coefficient β2 of the hole edge double crack by calling the finite element software using the fitting function method;

[0062] S3: obtaining the crack tip stress intensity factor correction coefficient β3 under the influence of the side hole according to the analytical method;

[0063] S4: obtaining the left and right crack tip stress intensity factor correction coefficients β4 and β5 under the influence of the side crack according to the analytical method;

[0064] S5: calculating the stress intensity factor of the hole edge crack according to the combined multiplication formula stress intensity factor K = β1 * β2 * β3 * β4 * β5 σ is the far-field stress, and a is the crack length.

[0065] The present application decomposes the complex situation of the porous structure into the combination of N simple situations according to the idea of combination multiplication, gives the accurate solution of the correction coefficient in N simple situations, omits the mutual influence of each boundary according to the local effect principle, and obtains the stress intensity factor K, which is represented as:

[0066]

[0067] According to the crack initiation mode of the crack initiation hole itself, the side hole and the adjacent crack, the reusable dimensionless stress intensity factor is obtained. Among the three types of influencing factors, the self-cracking mode correction coefficient is calculated by fitting, the side hole and the adjacent crack correction coefficient is calculated by analytical method, and the formula obtains the final stress intensity factor value. The specific calculation process of the correction coefficient is as follows:

[0068] 1) The self-cracking mode correction coefficient is determined by fitting a large amount of data due to the simple process.

[0069] Further, the determination method of the hole edge single crack stress intensity factor correction coefficient β1 is:

[0070] The hole edge single crack stress intensity factor correction coefficient and the geometric parameters hole edge crack length a and hole radius r present a nonlinear relationship, and the function relationship between the stress intensity factor boundary correction coefficient β1 and the crack length a and the hole radius r is expressed by the Levenberg-Marquardt optimization algorithm fitting as follows:

[0071]

[0072] In the formula: x=a / r (0.2<x<16).

[0073] Further, the determination method of the hole edge double crack stress intensity factor correction coefficient β2 is:

[0074] In the hole edge double crack initiation mode, a1 and a2 are the lengths of a single crack in the hole edge double crack, and the attached drawings are as follows: Figure 5 It can be seen that a1 and a2 are the lengths of the whole crack composed of the hole and the left and right cracks, A-B is the length of the left hole crack, B-C is the hole diameter, and C-D is the length of the right hole crack, a1 is half of the length of the left hole crack A-B, a2 is half of the length of the right hole crack C-D, and r is the hole radius. When a1 / r>3 and a2 / r>3, the double-side crack and the hole can be regarded as a long crack together, and the crack length is a1+a2+2r. When a1 / r≤3 or a2 / r≤3, the function relationship between the correction coefficient β2 of the left crack and the left and right cracks is expressed as:

[0075]

[0076] Wherein, x=a3 / r (0.2

[0077] Further, the side hole correction coefficient β3 can be determined according to the analytical method, which can effectively improve the calculation accuracy and difficulty.

[0078] According to the Eshelby inclusion theory, the expression of the crack tip correction coefficient β3 of the side hole is:

[0079]

[0080] In the formula, r is the hole radius; d is the distance from the crack tip to the center of the hole.

[0081] Further, the correction coefficient of the side crack influence can be determined according to the analytical method, which can effectively improve the calculation accuracy and difficulty.

[0082] When two unequal-length cracks interact with each other, the influence coefficient β4 of the left crack A end crack tip stress intensity factor and the influence coefficient β5 of the B end crack tip stress intensity factor can be obtained according to the analytical method as follows:

[0083]

[0084]

[0085] In the formula, L is the distance between the two cracks, 2a1 is the length of the left crack, and 2a2 is the length of the right crack.

[0086] Furthermore, the correction factor for the stress intensity factor at the crack tip is calculated based on different influencing conditions, according to the formula:

[0087]

[0088] Appendix Figure 1 It can be seen that there are only 5 types of hole cracks in this model. Based on the condition of the hole and the crack structure, we can determine which of the 5 types it belongs to. After selecting the type, we can substitute it into the formula and multiply it. That is, βn is the crack initiation form of the nth hole.

[0089] Example 2

[0090] The following is for reference. Figures 1-6 This invention describes a method for obtaining the stress intensity factor according to an embodiment of the invention.

[0091] like Figure 1 As shown in the flowchart of the stress intensity factor acquisition method according to the present invention, the stress intensity factor acquisition method may include the following steps:

[0092] S1: Determine the number of holes and the crack initiation mode. Different crack initiation modes are determined by judging the crack lengths on the left and right sides of the holes.

[0093] S2: When it is determined to be a single crack at the edge of the hole, calculate the value of β1, where β1 is the stress intensity factor correction coefficient for a single crack at the edge of the hole.

[0094] S3: When it is determined to be a double crack at the edge of the hole, it is then determined whether the ratio of the crack length on both sides to the hole radius is greater than 3. If it is greater than 3, it can be regarded as a long crack and no correction factor is calculated.

[0095] S4: When it is determined that one of the ratios of the two cracks to the hole radius is not greater than 3, calculate the value of β2, where β2 is the stress intensity factor correction coefficient for the double crack at the hole edge.

[0096] S5: Sequentially determine whether there is a crack in the i-th hole. If there is no crack at the edge of the hole, calculate the value of β3. β3 is the correction coefficient of the stress intensity factor at the crack tip under the influence of the side hole.

[0097] S6: When there is a crack at the edge of the hole, the stress intensity factor correction coefficient near the crack tip is calculated using β4, where β4 is the stress intensity factor correction coefficient at the left crack tip under the influence of the side crack.

[0098] S7: When there is a crack at the edge of the hole, the stress intensity factor correction coefficient away from the crack tip is calculated using β5, where β5 is the stress intensity factor correction coefficient of the right crack tip under the influence of the side crack.

[0099] S8: According to the formula Calculate the stress intensity factor, where σ is the far field stress, a is the crack length.

[0100] The application will be further described in detail below with reference to a specific example. Figure 6

[0101] The method for obtaining the stress intensity factor of the hole edge of a 5-hole two-dimensional infinite plate in a uniaxial tension state comprises the following steps:

[0102] It is known that the hole radius is r, the distance between the holes is w, the stress is 100 MPa, the crack form and the crack length are given, and the material parameters in the example do not have any effect on the boundary conditions and the stress intensity factor.

[0103] The stress intensity factor of point A in the current state is calculated.

[0104] Step one, the crack initiation mode of hole No. 1 is a single crack, according to the formula:

[0105]

[0106] The stress intensity factor of point A at this time is

[0107] In the formula, x=a / r, a is the crack length at the hole edge, r is the hole radius, and σ is the far field stress.

[0108] Step two, the influence of hole No. 2 on hole No. 1 can be regarded as the influence between cracks, where a1=(2r+a) / 2, a2=(2r+b) / 2, L=w-a-b-2r, according to the formula:

[0109]

[0110] The correction coefficient β at this time can be obtained 5,2 (β i,j , where i is the correction method, and j is the influence of the jth hole);

[0111] In the formula, L is the distance between the two cracks, r is the hole radius, 2a1 is the length of the left crack, and 2a2 is the length of the right crack.

[0112] Step three, the influence of hole No. 3 on hole No. 1 can be regarded as the influence between cracks, where a1=(2r+a) / 2, a2=(2r+c) / 2, L=2w-a-2r, according to the formula:

[0113]

[0114] The correction coefficient β at this time can be obtained 5,3 ;

[0115] ​Step four, the influence of hole No. 4 on hole No. 1 can be regarded as the influence between cracks, where a1=(2r+a) / 2, a2=(2r+d+e) / 2, L=3w-a-d-2r, according to the formula:

[0116]

[0117] The correction coefficient β at this time can be obtained 5,4 ;

[0118] Step five, the influence of hole No. 5 on hole No. 1 can be regarded as the influence of a side hole on a crack, where d=4w-r-a, according to the formula:

[0119]

[0120] The correction coefficient β3 at this time can be obtained

[0121] In the formula, r is the radius of the circular hole, and d is the distance from the crack tip to the center of the hole.

[0122] Step six, the stress intensity factor of the A end is obtained, that is:

[0123]

[0124] Example 3

[0125] The following refers to Figure 7 , and the present application is further compared and illustrated with a specific example.

[0126] Method for obtaining stress intensity factor of each crack at hole edge of two 5-hole plates and one 7-hole plate in uniaxial tension state.

[0127] Given the crack size, hole spacing and hole radius as shown in Figure 7 , the calculation method is carried out according to Example 1, and the stress intensity factor solved by calling the finite element method is as shown in Figure 8 .

[0128] It can be seen that the method for obtaining the stress intensity factor of multiple cracks proposed in the present application has an error of 2% compared with the finite element method, and can save more than 90% of the time cost.

[0129] The application provides a stress intensity factor acquisition method for multiple crack propagation, and solves the problems of large amount of calculation, long time consumption, complicated calculation process and no analytical solution in the calculation process of the stress intensity factor of a complex boundary condition of a multiple-hole multiple-crack structure of an airplane.

[0130] Figure 1 Wherein, β1 is a stress intensity factor correction coefficient of a single crack at a hole edge, β2 is a stress intensity factor correction coefficient of double cracks at a hole edge, β3 is a stress intensity factor correction coefficient of a crack tip under the influence of a side hole, and β4 and β5 are stress intensity factor correction coefficients of left and right crack tips under the influence of a side crack, respectively.

[0131] Figure 2 In the formula, an infinite plate is subjected to a far-field stress σ, a circular hole with a radius of r is arranged at the center of the plate, and a crack with a length of a is arranged at a position with a distance of d from the hole center.

[0132] Figure 3 In the formula, an infinite plate is subjected to a far-field stress σ, a circular hole with a radius of r is arranged at the center of the plate, and left and right cracks with lengths of a3 and a4 are arranged at the hole edge.

[0133] Figure 4 In the formula, an infinite plate is subjected to a far-field stress σ, a circular hole with a radius of r is arranged at the center of the plate, and a crack with a length of a is arranged at a position with a distance of d from the hole center.

[0134] Figure 5 In the formula, an infinite plate is subjected to a far-field stress σ, two cracks with different lengths, crack AB and crack CD, are arranged at the center of the plate, the distance between the two cracks is L, the length of crack AB is 2a1, and the length of crack CD is 2a2.

[0135] Figure 6 In the formula, an infinite plate is subjected to a far-field stress σ, five circular holes with a radius of r are uniformly distributed in the plate, the distance between the circular holes is w, the length of a right crack at the hole edge of hole 1 is a, the length of a left crack at the hole edge of hole 2 is b, the length of a right crack at the hole edge of hole 3 is c, the length of a left crack at the hole edge of hole 4 is d, the length of a right crack is e, and there is no crack at the hole edge of hole 5.

[0136] Figure 7 In the formula, the hole radius is 4 mm, the hole spacing is 20 mm, and the crack length is marked at the hole edge.

[0137] Embodiment 4

[0138] On the basis of Embodiments 1-3, a stress intensity factor acquisition device comprises:

[0139] A correction coefficient β1 acquisition module: determine the crack initiation mode of the hole edge crack, and calculate the stress intensity factor correction coefficient β1 of the single hole edge crack by calling the finite element software using the fitting function method;

[0140] A correction coefficient β2 acquisition module: determine the crack initiation mode of the hole edge crack, and calculate the stress intensity factor correction coefficient β2 of the double hole edge crack by calling the finite element software using the fitting function method;

[0141] A correction coefficient β3 acquisition module: obtain the crack tip stress intensity factor correction coefficient β3 under the influence of the side hole according to the analytical method;

[0142] A correction coefficient β4 and β5 acquisition module: obtain the left and right crack tip stress intensity factor correction coefficients β4 and β5 under the influence of the side crack according to the analytical method;

[0143] A strength factor acquisition module: according to the combination multiplication formula stress intensity factor Calculate the stress intensity factor of the hole edge crack, wherein σ is the far-field stress, a is the crack length, and n is the nth hole crack.

[0144] Embodiment 5

[0145] An electronic device comprises a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor implements the stress intensity factor acquisition method as described in Embodiments 1-3 when executing the program.

[0146] Embodiment 6

[0147] A non-transitory computer readable storage medium having a computer program stored thereon, the computer program being executable by a processor to implement the stress intensity factor acquisition method as described in Embodiments 1-3.

Claims

1. A stress intensity factor acquisition method characterized by comprising: The method comprises the following steps: S1: determine the crack initiation mode of the hole edge crack, calculate the stress intensity factor correction coefficient of the hole edge single crack by calling the finite element software using the fitting function method ; S2: Determine the crack initiation mode of the hole edge crack, calculate the stress intensity factor correction coefficient of the hole edge double crack by calling the finite element software using the fitting function method ; S3: Obtain the crack tip stress intensity factor correction coefficient under the influence of side hole according to the analytical method ; S4: Obtain the left and right crack tip stress intensity factor correction coefficients under the influence of the side crack according to the analytical method and ; S5: Stress intensity factor according to the combined multiplication formula The stress intensity factor of a hole edge crack is calculated, wherein , is a far field stress, is a crack length, n is the nth hole crack; Correction coefficient of stress intensity factor for double edge cracks The determination method is as follows: Under the double-edge crack initiation mode of the hole, respectively, r is the hole radius, when and , the double-edge crack and the hole are regarded as a long crack together, and the crack length is ; when or , the modified coefficient of the left crack is obtained by fitting all data points according to the orthogonal distance regression method , and the functional relationship between the left and right cracks is represented as: wherein, , wherein is the correction factor for the left side crack of the hole, and the correction factor for the right side crack is only to make and , and respectively represent the crack length of the left and right side of the hole.

2. The stress intensity factor acquisition method of claim 1, wherein: Correction coefficient of stress intensity factor for single edge cracked hole The determination method is that: The correction coefficient of the stress intensity factor of a single crack at the edge of a hole and the geometric parameters of the hole length of the crack at the edge of the hole , the hole radius r presents a nonlinear relationship, and the boundary correction coefficient of the stress intensity factor is fitted by the Levenberg-Marquardt optimization algorithm and the crack length , the function relationship formula of the hole radius r is represented as: wherein: 0.2 < x < 16.

3. The method of claim 1, wherein: According to the Eshelby inclusion theory, the expression of the side hole correction coefficient of the crack tip is as follows: ​ In the formula, r is the hole radius; d is the distance from the crack tip to the hole center.

4. The method of claim 1, wherein: When two unequal length cracks interact with each other, the correction coefficient of the stress intensity factor at the crack tip of the left crack A end and the correction coefficient of the stress intensity factor at the crack tip of the right crack B end can be obtained according to the analytical method as follows: and respectively. where L is the distance between the two cracks, Ll is the left crack length, Lr is the right crack length.

5. The method of claim 1, wherein: According to different influence conditions, the correction coefficient of the stress intensity factor at the crack tip is calculated according to the formula: 。 6. An apparatus for implementing the stress intensity factor acquisition method according to any one of claims 1 to 5, characterized in that, The method comprises the following steps: Correction coefficient The acquisition module determines the crack initiation mode of the hole edge crack, and calculates the stress intensity factor correction coefficient of the hole edge single crack by calling the finite element software using the fitting function method ; Correction coefficient Acquisition module: determine the crack initiation mode of the hole edge crack, and calculate the stress intensity factor correction coefficient of the hole edge double crack by calling the finite element software using the fitting function method ; Correction factor Obtaining module: obtaining the correction factor of the crack tip stress intensity factor under the side hole influence according to the analytical method ; Correction factor And Obtaining module: obtaining the correction factor of the left and right crack tip stress intensity factor under the influence of the side crack according to the analytical method And ; Intensity factor acquisition module: stress intensity factor according to the combined multiplication formula The stress intensity factor of a hole edge crack is calculated, wherein , is the far-field stress, is the crack length, and n is the nth hole crack.

7. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor implements the stress intensity factor acquisition method according to any one of claims 1 to 6 when the processor executes the program.

8. A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program implements the stress intensity factor acquisition method according to any one of claims 1 to 6 when the computer program is executed by the processor.

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