Display panel, method for manufacturing the display panel, and display device

Abstract

The present application discloses a display panel, a manufacturing method of the display panel, and a display device, relating to the field of display technologies. The display panel includes a substrate, a plurality of overhanging structures, a plurality of light-emitting units, and a first inorganic encapsulation layer. The plurality of overhanging structures are arranged on the substrate at intervals, and adjacent overhanging structures are arranged in a surrounding manner to form pixel apertures. The plurality of light-emitting units are respectively arranged in the pixel apertures. The first inorganic encapsulation layer is arranged on a side of the overhanging structure away from the substrate; an organic encapsulation layer is arranged on a side of the first inorganic encapsulation layer away from the overhanging structure; the overhanging structure includes a pixel definition layer, a conductive layer, and an eaves shielding layer stacked in sequence. At least one groove structure is arranged on a side of the eaves shielding layer away from the conductive layer, and a light-emitting material and a first inorganic encapsulation material are sequentially filled in the groove structure. Through the above design, the adhesion between the encapsulation film layers is improved, and the encapsulation effect is ensured.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] Organic light emitting diodes (OLEDs) have become increasingly mature in mass production technology due to advantages such as surface light sources, cold light, energy saving, fast response, flexibility, ultra-thinness, and low cost. Since OLEDs have poor stability and are extremely sensitive to water, oxygen, and heat, packaging technology is particularly crucial.

[0003] In order to achieve high resolution and colorization of passive matrix OLEDs and better solve problems such as low cathode template resolution and low device yield, a cathode isolation column structure is introduced in actual research. That is, in device manufacturing, instead of using a metal template, isolation columns are fabricated on the substrate before depositing the organic thin film and the metal cathode, and finally, different pixels of the device are separated to form a pixel array. The shape of the isolation column is crucial for the isolation effect. The base insulating buffer layer is used to solve the short-circuit problem between anodes of adjacent pixels, and an inverted trapezoidal isolation column is used to solve the short-circuit problem of the organic light-emitting layer between adjacent pixels. This inverted trapezoid is also called a hanging structure. In order to protect the organic light-emitting layer, a first inorganic encapsulation layer is deposited above the organic light-emitting layer for encapsulation, and then an organic encapsulation layer is inkjet-printed over the entire surface. However, peeling or cracking between the encapsulation layers will accelerate the aging rate of the OLED organic light-emitting layer device. Therefore, strict encapsulation must be carried out to extend the lifespan and improve stability.

[0004] However, currently, the adhesion between the first inorganic encapsulation layer and the organic encapsulation layer is relatively weak, which is prone to the risk of peeling between the film layers, and thus the risk of water and oxygen intrusion. Summary of the Invention

[0005] The objective of the present application is to provide a display panel, a method for manufacturing a display panel, and a display device that can improve the adhesion between encapsulation film layers and ensure the encapsulation effect.

[0006] The present application discloses a display panel, including a substrate, a plurality of overhanging structures, a plurality of light-emitting units, and a first inorganic encapsulation layer. The plurality of overhanging structures are arranged at intervals on the substrate, and adjacent overhanging structures are arranged in a surrounding manner to form pixel openings. The plurality of light-emitting units are correspondingly arranged in the pixel openings one by one. The first inorganic encapsulation layer is arranged on the side of the overhanging structure away from the substrate; the organic encapsulation layer is arranged on the side of the first inorganic encapsulation layer away from the overhanging structure; the overhanging structure includes a pixel definition layer, a conductive layer, and an eaves shielding layer stacked in sequence. At least one groove structure is arranged on the side of the eaves shielding layer away from the conductive layer, and a light-emitting material and a first inorganic encapsulation material are sequentially filled in the groove structure.

[0007] Optionally, along the direction in which the overhanging structures are arranged, the width of the bottom of the groove structure is greater than the width of the opening of the groove structure.

[0008] Optionally, the cross-section of the groove structure is a trapezoidal structure, and the size of the bottom angle of the trapezoidal structure is 60°-80°.

[0009] Optionally, let the depth of the groove structure be h, let the width of the opening be b, and let the thickness of the eaves shielding layer be H. Among them, H = 3μm, 1 / 3H ≤ h ≤ 1 / 2H, then 1um ≤ h ≤ 1.5um; the setting range of b: 1um ≤ b ≤ 1.5um;

[0010] Optionally, the overhanging structures are arranged in columns or rows. Along the direction of column arrangement or row arrangement, the groove structure penetrates the entire eaves shielding layer.

[0011] Optionally, the overhanging structure includes a first overhanging structure and a second overhanging structure. The first overhanging structure is correspondingly arranged between adjacent light-emitting units, and the second overhanging structure is arranged on the side away from the light-emitting units. The number of groove structures on the first overhanging structure is greater than the number of groove structures on the second overhanging structure.

[0012] Optionally, the overhanging structure includes a first overhanging structure and a second overhanging structure. The display panel includes a first spacer formed between adjacent same-color light-emitting units and a second spacer formed between adjacent different-color light-emitting units. The first overhanging structure is correspondingly arranged in the first spacer, and the second overhanging structure is correspondingly arranged in the second spacer; wherein, the cross-sectional area of the groove structure on the first overhanging structure is smaller than the cross-sectional area of the groove structure on the second overhanging structure; the number of groove structures on the first overhanging structure is smaller than the number of groove structures on the second overhanging structure.

[0013] Optionally, along the direction of the scanning line, a plurality of first groove structures are provided on the eaves shielding layer of each of the overhanging structures, and along the direction of the data line, a plurality of second groove structures are provided on the eaves shielding layer of each of the overhanging structures, wherein the cross-sectional area of the first groove structure is smaller than the cross-sectional area of the second groove structure.

[0014] The present application also discloses a method for manufacturing a display panel for the display panel as described above, including the steps of:

[0015] Providing a backplane including a driving circuit, an anode layer, and a pixel definition layer;

[0016] Forming a conductive layer on the pixel definition layer of the backplane;

[0017] Forming an eaves shielding layer on the conductive layer, and stacking the pixel definition layer, the conductive layer, and the eaves shielding layer to form an overhanging structure;

[0018] Forming a groove structure on the eaves shielding layer;

[0019] Coating a photoresist material over the entire surface to form a photoresist layer;

[0020] Forming a pixel opening between adjacent overhanging structures;

[0021] Depositing a light-emitting material above the anode layer to form a light-emitting layer, and part of the light-emitting material falls into the groove structure;

[0022] Depositing a cathode material above the light-emitting layer to form a cathode layer, and the cathode layer is connected through the conductive layer, and the anode layer, the light-emitting layer, and the cathode layer are stacked to form a light-emitting unit;

[0023] Coating a first encapsulation material above the overhanging structure and above the cathode layer to form a first inorganic encapsulation layer, and part of the first encapsulation material falls into the groove structure and covers the light-emitting material;

[0024] Stripping the photoresist layer;

[0025] Repeating the steps of the light-emitting unit and the first inorganic encapsulation layer to form the encapsulation of all the light-emitting units and the first inorganic encapsulation layer;

[0026] Performing a full-surface encapsulation above the first inorganic encapsulation layer to obtain a fully encapsulated display panel.

[0027] The present application also discloses a display device including the display panel as described above.

[0028] Compared with the prior art solution where the adhesion between the first inorganic encapsulation layer and the organic encapsulation layer is relatively weak, and there is a risk of peeling between the film layers, the display panel of the present application includes a substrate, a plurality of overhanging structures, a plurality of light-emitting units, and a first inorganic encapsulation layer. The plurality of overhanging structures are arranged on the substrate at intervals, and a pixel opening is formed between two adjacent overhanging structures. The plurality of light-emitting units are respectively arranged in the pixel openings. The first inorganic encapsulation layer is arranged on the side of the overhanging structure away from the substrate; the organic encapsulation layer is arranged on the side of the first inorganic encapsulation layer away from the overhanging structure; the overhanging structure includes a pixel definition layer, a conductive layer, and an eaves shielding layer stacked in sequence. At least one groove structure is arranged on the side of the eaves shielding layer away from the conductive layer. A light-emitting material and a first inorganic encapsulation material are sequentially filled in the groove structure. The light-emitting material and the first inorganic encapsulation material are deposited during the subsequent evaporation of the light-emitting unit and the encapsulation of the first inorganic encapsulation layer, so that the first inorganic encapsulation layer forms a discontinuous encapsulation on the overhanging structure, thereby blocking the continuity of the first inorganic encapsulation layer, cutting off the water and oxygen intrusion path between adjacent pixels, and the organic encapsulation layer above the first inorganic encapsulation layer forms a strong adhesion at the groove structure. Description of the Drawings

[0029] The accompanying drawings included are used to provide a further understanding of the embodiments of the present application, which form a part of the specification, are used to illustrate the implementation manners of the present application, and together with the text description, explain the principles of the present application. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0030] Figure 1 is a schematic structural diagram of the display device provided by the present application;

[0031] Figure 2 is a schematic cross-sectional structure diagram of the display panel provided by the present application;

[0032] Figure 3 is Figure 2 a partial enlarged structural diagram of area A in;

[0033] Figure 4 is a schematic structural diagram of the overhanging structure provided by the first embodiment of the present application;

[0034] Figure 5 is Figure 4 a partial enlarged structural diagram of area B of;

[0035] Figure 6 is a schematic top-view structural diagram of the display panel provided by the third embodiment of the present application;

[0036] Figure 7It is a schematic flow chart of the method for manufacturing a display panel provided by the present application.

[0037] Among them, 10 is a display device; 100 is a display panel; 110 is a substrate; 120 is a hanging structure; 121 is a pixel definition layer; 122 is a conductive layer; 123 is an eaves shielding layer; 124 is a first hanging structure; 125 is a second hanging structure; 126 is a first pixel definition layer; 127 is a first conductive layer; 128 is a first eaves shielding layer; 129 is a second pixel definition layer; 130 is a second conductive layer; 131 is a second eaves shielding layer; 140 is a first inorganic encapsulation layer; 150 is a groove structure; 151 is a first groove structure; 152 is a second groove structure; 160 is a light-emitting unit; 161 is a first color light-emitting unit; 162 is a second color light-emitting unit; 163 is a first spacer; 164 is a second spacer; 165 is a light-emitting layer; 166 is a light-emitting material; 167 is a first inorganic encapsulation material; 170 is an anode layer; 180 is a cathode layer; 190 is an organic encapsulation layer; 200 is a second inorganic encapsulation layer. Detailed implementation manners

[0038] It should be understood that the terms, specific structures and functional details disclosed here are only for describing specific embodiments, which are representative. However, the present application can be specifically implemented in many alternative forms and should not be construed as being limited only to the embodiments described herein.

[0039] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating relative importance or implicitly indicating the quantity of the indicated technical features. Thus, unless otherwise specified, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; the meaning of "a plurality" is two or more. In addition, the terms indicating the orientation or positional relationship, such as "upper", "lower", "left", "right", "second direction", "first direction", etc., are described based on the orientation or relative positional relationship shown in the drawings, and are only for facilitating the simplified description of the present application, rather than indicating that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0040] Figure 1 It is a schematic block diagram structure of the display device 10 provided by the present application. Figure 2 It is a schematic cross-sectional structure of the display panel 100 provided by the present application. Figure 3 is Figure 2 a partial enlarged structure schematic diagram of the A area in Figures 1-3As shown in the figure, the present application discloses a display device 10, including a display panel 100. The display panel 100 includes a substrate 110, a plurality of overhanging structures 120, a plurality of light-emitting units 160, a first inorganic encapsulation layer 140, and an organic encapsulation layer 190. The plurality of overhanging structures 120 are arranged at intervals on the substrate 110, and adjacent overhanging structures are arranged in a surrounding manner to form a pixel opening. The plurality of light-emitting units 160 are correspondingly arranged in the pixel openings one by one. The first inorganic encapsulation layer 140 is arranged on the side of the overhanging structure 120 away from the substrate 110; the organic encapsulation layer 190 is arranged on the side of the first inorganic encapsulation layer 140 away from the overhanging structure 120; the overhanging structure 120 includes a pixel definition layer 121, a conductive layer 122, and an eaves shielding layer 123 stacked in sequence. At least one groove structure 150 is arranged on the side of the eaves shielding layer 123 away from the conductive layer 122. A light-emitting material 166 and a first inorganic encapsulation material 167 are sequentially filled in the groove structure 150.

[0041] Compared with the prior art in which the encapsulation adhesion between the first inorganic encapsulation layer 140 and the organic encapsulation layer 190 is relatively weak and there is a risk of peeling between the film layers, the display panel 100 of the present application includes a substrate 110, a plurality of overhanging structures 120, a plurality of light-emitting units 160, and a first inorganic encapsulation layer 140. The plurality of overhanging structures 120 are arranged at intervals on the substrate 110, adjacent overhanging structures 120 are arranged in a surrounding manner to form a pixel opening, the plurality of light-emitting units 160 are correspondingly arranged in the pixel openings one by one, the first inorganic encapsulation layer 140 is arranged on the side of the overhanging structure 120 away from the substrate 110, and the organic encapsulation layer 190 is arranged on the side of the first inorganic encapsulation layer 140 away from the overhanging structure 120; the overhanging structure 120 includes a pixel definition layer 121, a conductive layer 122, and an eaves shielding layer 123 stacked in sequence. At least one groove structure 150 is arranged on the side of the eaves shielding layer 123 away from the conductive layer 122. A light-emitting material 166 and a first inorganic encapsulation material 167 are sequentially filled in the groove structure 150. The light-emitting material 166 and the first inorganic encapsulation material 167 are deposited during the subsequent evaporation of the light-emitting unit 160 and the encapsulation of the first inorganic encapsulation layer 140, so that the first inorganic encapsulation layer 140 forms a discontinuous encapsulation on the overhanging structure 120, thereby blocking the continuity of the first inorganic encapsulation layer 140 and cutting off the water and oxygen intrusion path between adjacent pixels, and the organic encapsulation layer 190 above the first inorganic encapsulation layer 140 forms a strong adhesion at the groove structure 150.

[0042] The following will describe the present application in detail with reference to the accompanying drawings and optional embodiments.

[0043] First Embodiment:

[0044] Combined with Figure 2It can be seen that the light-emitting unit is a sandwich structure formed by sequentially stacking an anode layer 170, a light-emitting layer 165, and a cathode layer 180. Figure 4 It is a schematic structural diagram of the overhanging structure 120 provided in the first embodiment of the present application. Figure 5 It is Figure 4 A partial enlarged structural diagram of region B of Figures 4-5 As shown, along the arrangement direction of the overhanging structure 120, the width of the bottom of the groove structure 150 is greater than the width of the opening of the groove structure 150, that is, the groove structure 150 can be a trapezoidal structure. The groove structure 150 adopts an undercut pattern design. In this way, when the organic light-emitting material 166 is evaporated later, the residue of the evaporated organic material on the side wall of the groove structure 150 can be effectively reduced, and the organic light-emitting material 166 and the first inorganic encapsulation material 167 are deposited into the groove structure 150, avoiding the accumulation of the light-emitting material 166 and the first inorganic encapsulation material 167 above the eaves shielding layer 123, reducing the phenomenon of climbing here during the subsequent encapsulation of the organic encapsulation layer 190. On the side of the organic encapsulation layer 190 away from the first inorganic encapsulation layer 140, the second inorganic encapsulation layer 200 can also be encapsulated. In order to further improve the encapsulation tightness.

[0045] The light-emitting units 160 of the display panel 100 generally include three colors: red light-emitting units, green light-emitting units, and blue light-emitting units. Therefore, when the light-emitting layer 165 is evaporated, the light-emitting layer 165 of each color needs to be evaporated over the entire surface separately, and then the first inorganic encapsulation layer 140 is deposited, and then patterning is performed to form the light-emitting layer 165 within the corresponding pixel opening. Therefore, it is necessary to perform three different-color light-emitting layer 165 evaporations and the encapsulation of the first inorganic encapsulation layer in sequence to complete the preparation of the three-color organic light-emitting units 160.

[0046] In this way, when preparing the three-color light-emitting units 160, the first-color light-emitting material, the first layer of the first inorganic encapsulation material, the second-color light-emitting material, the second layer of the first inorganic encapsulation material, the third-color light-emitting material, and the third layer of the first inorganic encapsulation material can be sequentially formed within the groove structure 150. The multi-layer light-emitting materials 166 and the multi-layer first inorganic encapsulation materials 167 are stacked in a sandwich structure to form an encapsulation barrier structure. If water vapor invades from the outside through the organic encapsulation layer, since the light-emitting material 166 of the encapsulation barrier structure is an organic material, it can also absorb water vapor, and the inorganic encapsulation material plays a role in blocking water vapor. The sandwich cooperation further improves the effect of blocking water vapor.

[0047] It is also possible that the groove structure 150 is filled with two-color light-emitting materials and two layers of first inorganic encapsulation materials, or that the groove structure 150 is only filled with one layer of light-emitting material 166 and one layer of first inorganic encapsulation material 167, which will not be limited here.

[0048] Among them, combined with Figure 5 it can be known that if the base angle of the trapezoidal structure is set as a, and the size of a is 60° - 80°, the feasibility of the etching process can be ensured to be higher. If the depth of the groove structure 150 is set as h, the width of the groove opening is set as b, and the thickness of the eaves shielding layer 123 is set as H, where H = 3μm, 1 / 3H ≤ h ≤ 1 / 2H, then 1um ≤ h ≤ 1.5um; the setting range of b is: 1um ≤ b ≤ 1.5um;. Since the thickness of the first inorganic encapsulation layer 140 is generally less than the thickness of the eaves shielding layer 123, in order to cut off the continuity of the encapsulation of the first inorganic encapsulation layer 140, the depth of the groove structure 150 needs to be greater than the thickness of the first inorganic encapsulation layer 140, so as to ensure that when the first inorganic encapsulation layer 140 is encapsulated, the first inorganic encapsulation material 167 corresponding to the groove structure 150 can completely fall into the groove structure 150. And in order to ensure the strength of the eaves shielding layer 123, the maximum depth of the groove structure 150 is up to 1 / 2 of the thickness of the eaves shielding layer 123. Of course, the groove structure 150 can also adopt a rectangular or other-shaped design, as long as it can ensure the disconnection of the encapsulation continuity of the first inorganic encapsulation layer 140, which will not be limited here.

[0049] The number of groove structures 150 on each overhang structure 120 can be set to be the same. Combined with Figure 4 when the number of groove structures 150 on the eaves shielding layer 123 is two groups, that is, four groove structures 150 are made, and the width of the groove opening of the groove structure 150 is 1.5um. In each group of groove structures 150, the distance between adjacent groove structures 150 needs to be slightly greater than the width of the groove opening. Because of the undercut design of the trapezoidal structure, the lower part is slightly wider, and a margin needs to be reserved to ensure that the two groove structures 150 are not etched and conducted. Therefore, the distance between the first groove structure 151 and the second groove structure 152 is greater than 1.5um. When the groove structure 150 is three groups, since the width of the eaves shielding layer 123 is certain, the width of the groove opening of each groove structure 150 and the distance between two groups of groove structures 150 can be appropriately reduced. Moreover, the number of groove structures 150 can be designed and adjusted according to the size of the actual display panel 100.

[0050] The hanging structure 120 is arranged in columns or rows. In the direction of column arrangement or row arrangement, the groove structure 150 penetrates the entire eaves shielding layer 123, that is, the groove structure 150 forms an upward opening on the eaves shielding layer 123, and penetrates both ends of the eaves shielding layer 123. A single etching process can complete it, and the process is simple. Of course, it is also possible that the groove structure 150 does not penetrate the eaves shielding layer 123, which is specifically set according to the actual situation and will not be limited here.

[0051] Second Embodiment:

[0052] Combined with Figure 2 , as the second embodiment of the present application, the difference between this embodiment and the first embodiment is that the hanging structure 120 includes a first hanging structure 124 and a second hanging structure 125. The first hanging structure 124 is correspondingly arranged between adjacent light-emitting units 160, and the second hanging structure 125 is arranged on the side away from the light-emitting unit 160. The first hanging structure 124 and the second hanging structure 125 have the same size. The first hanging structure 124 includes a first pixel definition layer 126, a first conductive layer 127, and a first eaves shielding layer 128 stacked in sequence; the second hanging structure 125 includes a second pixel definition layer 129, a second conductive layer 130, and a second eaves shielding layer 131 stacked in sequence. A plurality of groove structures 150 are provided on both the first eaves shielding layer 128 and the second eaves shielding layer 131, and the number of groove structures 150 on the first eaves shielding layer 128 is less than the number of groove structures 150 on the second eaves shielding layer 131.

[0053] That is, the groove structures 150 at the edge of the pixel region are made relatively dense, while the groove structures 150 in the pixel region are made relatively sparse. Since there are gaps formed by the stacking of various film layers near the edge of the display panel 100, the possibility of water vapor intrusion is greater, while the possibility of water vapor intrusion in the pixel region in the middle of the display panel 100 is smaller. Therefore, after such a design, the manufacturing process of the corresponding pixel region in the middle can be relatively simplified, avoiding damage to other film layers in the pixel region and increasing the possibility of water vapor intrusion.

[0054] Third Embodiment:

[0055] Figure 6 It is a schematic top-view structure diagram of the display panel 100 provided by the third embodiment of the present application. As shown in Figure 6As shown, as the second embodiment of the present application, what is different from the first and second embodiments is that the overhang structure 120 includes a first overhang structure 124 and a second overhang structure 125, and the light-emitting unit 160 at least includes a plurality of first-color light-emitting units 161 and a plurality of second-color light-emitting units 162. A first spacer 163 is formed between two adjacent first-color light-emitting units 161, and a second spacer 164 is formed between the adjacent first-color light-emitting unit 161 and the second-color light-emitting unit 162. The first overhang structure 124 is correspondingly disposed in the first spacer 163, and the second overhang structure 125 is correspondingly disposed in the second spacer 164;

[0056] The size of the first overhang structure 124 is smaller than the size of the second overhang structure 125, and the number of the groove structures 150 on the first eaves shielding layer 128 is less than the number of the groove structures 150 on the second eaves shielding layer 131.

[0057] That is, the light-emitting units 160 of the same color can adopt light-emitting layers of the same material, while the light-emitting units 160 of different colors need to adopt light-emitting layers of different materials. Therefore, the size of the overhang structure 120 between the light-emitting units 160 of the same color can be made narrower, and the overhang structure 120 between the light-emitting units 160 of different colors can be made wider to improve the isolation effect. In addition, the overhang structure 120 between the light-emitting units 160 of different colors not only needs to separate adjacent pixels, but also needs to electrically connect the cathodes of adjacent light-emitting units 160. Therefore, the size of the overhang structure 120 between the light-emitting units 160 of different colors can be made relatively wider. Therefore, several groove structures 150 can be made on the wider overhang structure 120, and fewer groove structures 150 can be made on the narrower overhang structure 120, so as to make the overall process easier to implement while ensuring the encapsulation connectivity of the first inorganic encapsulation layer 140 and reducing the complexity of the process operation. Moreover, it can better ensure the encapsulation adhesion between the first inorganic encapsulation layer 140 and the organic encapsulation layer 190. The overhang structure 120 between the light-emitting units 160 of the same color may not play the role of electrically connecting the cathodes. That is, generally, the cathodes on the peripheral sides of the light-emitting unit 160 can overlap with the overhang structure 120. After differentiating the width of the overhang structure 120, the cathodes on a part of the peripheral sides of the light-emitting unit 160 may not overlap with the overhang structure 120, but the cathodes on the other part of the peripheral sides still overlap with the overhang structure 120, so that a cathode conductive network can still be formed to electrically connect all the cathodes together.

[0058] Fourth Embodiment:

[0059] As the fourth embodiment of the present application, different from the first, second, and third embodiments, along the direction of the scanning line, a plurality of first groove structures 151 are provided on the eaves shielding layer 123 of each of the overhanging structures 120, and along the direction of the data line, a plurality of second groove structures 152 are provided on the eaves shielding layer 123 of each of the overhanging structures 120, wherein the cross-sectional area of the first groove structure 151 is smaller than the cross-sectional area of the second groove structure 152.

[0060] That is, in the intersecting direction, a plurality of groove structures 150 with different sizes are formed, and the first inorganic encapsulation layer 140 forms discontinuous surfaces with different sizes at the groove structures 150. When the organic encapsulation layer 190 is encapsulated, different-sized encapsulation contact surfaces are formed between the two encapsulation layers, which not only improves the encapsulation adhesion but also makes the entire encapsulation structure more uniform. Of course, it is also possible to make the cross-sectional area of the groove structure 150 in the scanning line direction larger than the cross-sectional area of the groove structure 150 in the data line direction, or to form a plurality of groove structures 150 with different sizes in the scanning line direction and also form a plurality of groove structures 150 with different sizes in the data line direction. It is specifically designed according to the actual situation and will not be limited here.

[0061] Figure 7 It is a schematic flow chart of the steps for the manufacturing method of the display panel provided by the present application. As Figure 7 shown, the present application also discloses a manufacturing method of a display panel for the display panel as described above, including the steps:

[0062] S1: Provide a backplane, including a driving circuit, an anode layer, and a pixel definition layer;

[0063] S2: Form a conductive layer on the pixel definition layer;

[0064] S3: Form an eaves shielding layer on the conductive layer, and the pixel definition layer, the conductive layer, and the eaves shielding layer are stacked to form an overhanging structure;

[0065] S4: Form a groove structure on the eaves shielding layer;

[0066] S5: Coat a photoresist material over the entire surface to form a photoresist layer;

[0067] S6: Form a pixel opening between adjacent overhanging structures;

[0068] S7: Deposit a light-emitting material above the anode layer to form a light-emitting layer, and part of the light-emitting material falls into the groove structure;

[0069] S8: Deposit a cathode material above the light-emitting layer to form a cathode layer. The cathode layer is connected through a conductive layer. The anode layer, the light-emitting layer, and the cathode layer are stacked to form a light-emitting unit;

[0070] S9: Coat a first encapsulation material above the overhanging structure and above the cathode layer to form a first inorganic encapsulation layer. Part of the first encapsulation material falls into the groove structure and covers the light-emitting material;

[0071] S10: Strip the photoresist layer;

[0072] S11: Repeat the above steps for the light-emitting unit and the first inorganic encapsulation layer to form all the light-emitting units and the encapsulation of the first inorganic encapsulation layer;

[0073] S12: Perform a full-surface encapsulation above the first inorganic encapsulation layer to obtain a completed encapsulated display panel.

[0074] Among them, performing a full-surface encapsulation above the first inorganic encapsulation layer includes the encapsulation of an organic encapsulation layer and the encapsulation of a second inorganic encapsulation layer. When forming the groove structure, an etching process can be used to control different etching speeds to form corresponding groove patterns. When forming the pixel opening, first coat a photoresist material, and then perform exposure and development to expose the pixel opening. Additionally, a patterning process is performed at the position corresponding to the pixel opening to complete the production of each pixel, which will not be elaborated here.

[0075] It should be noted that the limitations of the steps involved in this solution are not considered to limit the sequence of the steps without affecting the implementation of the specific solution. The steps written in the front can be executed first, or can be executed later, or even can be executed simultaneously. As long as the solution can be implemented, it should be regarded as falling within the protection scope of this application.

[0076] It should be noted that the inventive concept of this application can form a very large number of embodiments, but the space of the application documents is limited and cannot list them all. Therefore, on the premise of no conflict, the above-described embodiments or technical features can be combined arbitrarily to form new embodiments. After the combination of each embodiment or technical feature, the original technical effect will be enhanced.

[0077] The above content is a further detailed description of this application in combination with specific optional implementation manners. It cannot be determined that the specific implementation of this application is only limited to these descriptions. For those of ordinary skill in the technical field to which this application belongs, without departing from the concept of this application, several simple deductions or substitutions can still be made, which should all be regarded as falling within the protection scope of this application.

Claims

1. A display panel, comprising a substrate, a plurality of overhanging structures, a plurality of light-emitting units, a first inorganic encapsulation layer, and an organic encapsulation layer. The plurality of overhanging structures are disposed on the substrate at intervals, and adjacent overhanging structures are arranged in a surrounding manner to form pixel apertures. The plurality of light-emitting units are respectively disposed in the pixel apertures. The first inorganic encapsulation layer is disposed on a side of the overhanging structure away from the substrate, and the organic encapsulation layer is disposed on a side of the first inorganic encapsulation layer away from the overhanging structure; characterized in that, the overhanging structure includes a pixel definition layer, a conductive layer, and an eave shielding layer stacked in sequence. At least one groove structure is disposed on a side of the eave shielding layer away from the conductive layer, and a light-emitting material and a first inorganic encapsulation material are sequentially filled in the groove structure; along the direction in which the overhanging structures are arranged, the width of the bottom of the groove structure is greater than the width of the opening of the groove structure; let the depth of the groove structure be h, let the width of the opening be b, and let the thickness of the eave shielding layer be H, where H = 3μm, 1 / 3H ≤ h ≤ 1 / 2H, then 1μm ≤ h ≤ 1.5μm; the setting range of b: 1μm ≤ b ≤ 1.5μm.

2. The display panel according to claim 1, wherein the cross-section of the groove structure is a trapezoidal structure, and the size of the bottom angle of the trapezoidal structure is 60° - 80°; 3. The display panel according to claim 1, characterized in that, both the light-emitting material and the first inorganic encapsulation material include multiple layers and are stacked in sequence; 4. The display panel according to claim 1, wherein the overhanging structure includes a first overhanging structure and a second overhanging structure. The first overhanging structure is correspondingly disposed between adjacent light-emitting units, and the second overhanging structure is disposed on a side away from the light-emitting units. The size of the first overhanging structure is the same as that of the second overhanging structure. The first overhanging structure includes a first pixel definition layer, a first conductive layer, and a first eave shielding layer stacked in sequence; the second overhanging structure includes a second pixel definition layer, a second conductive layer, and a second eave shielding layer stacked in sequence. A plurality of groove structures are disposed on both the first eave shielding layer and the second eave shielding layer, and the number of groove structures on the first eave shielding layer is less than the number of groove structures on the second eave shielding layer; 5. The display panel according to claim 1, characterized in that, the overhanging structure includes a first overhanging structure and a second overhanging structure. The light-emitting unit at least includes a plurality of first-color light-emitting units and a plurality of second-color light-emitting units. A first interval region is formed between adjacent two first-color light-emitting units, and a second interval region is formed between an adjacent first-color light-emitting unit and a second-color light-emitting unit. The first overhanging structure is correspondingly disposed in the first interval region, and the second overhanging structure is correspondingly disposed in the second interval region; Among them, the size of the first overhang structure is smaller than that of the second overhang structure. The first overhang structure includes a first pixel definition layer, a first conductive layer, and a first eaves shielding layer stacked in sequence; the second overhang structure includes a second pixel definition layer, a second conductive layer, and a second eaves shielding layer stacked in sequence. A plurality of groove structures are provided on both the first eaves shielding layer and the second eaves shielding layer, and the number of the groove structures on the first eaves shielding layer is less than the number of the groove structures on the second eaves shielding layer.

6. The display panel according to claim 1, characterized in that Along the direction of the scanning line, a plurality of first groove structures are provided on the eaves shielding layer of each overhang structure. Along the direction of the data line, a plurality of second groove structures are provided on the eaves shielding layer of each overhang structure. Among them, the cross-sectional area of the first groove structure is smaller than the cross-sectional area of the second groove structure.

7. A method for manufacturing a display panel, for the display panel according to any one of claims 1-6, characterized in that, Including the steps of: Providing a backplane, including a driving circuit, an anode layer, and a pixel definition layer; Forming a conductive layer on the pixel definition layer of the backplane; Forming an eaves shielding layer on the conductive layer, and the pixel definition layer, the conductive layer, and the eaves shielding layer are stacked To form an overhang structure; Forming a groove structure on the eaves shielding layer; Coating a photoresist material over the entire surface to form a photoresist layer; Forming a pixel opening between adjacent overhang structures; Depositing a light-emitting material above the anode layer to form a light-emitting layer, and part of the light-emitting material falls into the groove structure; Depositing a cathode material above the light-emitting layer to form a cathode layer. The cathode layer is connected through the conductive layer, and the anode layer, the light-emitting layer, and the cathode layer are stacked to form a light-emitting unit; Coating a first encapsulation material above the overhang structure and above the cathode layer to form a first inorganic encapsulation layer. Part of the first encapsulation material falls into the groove structure and covers the light-emitting material; Stripping the photoresist layer; Repeating the steps of the above light-emitting unit and the first inorganic encapsulation layer to form the encapsulation of all light-emitting units and the first inorganic encapsulation layer; Performing a full-surface encapsulation above the first inorganic encapsulation layer to obtain a packaged display panel; Among them, along the arrangement direction of the overhang structures, the width of the bottom of the groove structure is greater than the width of the opening of the groove structure; Let the depth of the groove structure be h, let the width of the opening be b, and let the thickness of the eaves shielding layer be H. Among them, H = 3μm, 1 / 3H ≤ h ≤ 1 / 2H, then 1μm ≤ h ≤ 1.5μm; the setting range of b: 1μm ≤ b ≤ 1.5μm.

8. A display device, characterized in that, Including the display panel according to any one of claims 1-6.

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