Heat-assisted magnetic head, light source unit strip member, and hard disk drive

Abstract

A heat-assisted magnetic head includes a head slider having a head slider substrate and a head portion, and a light source unit having a laser diode and a sub-mount. The head portion includes a media facing surface, a light source facing surface, and a head slider leading end surface. The sub-mount includes a connection end surface and a mounting leading end surface, and the laser diode includes an electrode surface and an LD leading end surface. The light source unit includes a shift connection structure, the laser diode is joined to a shifted region of the connection end surface, and the light source unit is mounted on the head slider substrate with the electrode surface intersecting a lamination surface of the head portion. The shifted region is disposed in a shifted position such that the LD leading end surface is further from the head slider leading end surface than the mounting leading end surface.

Description

BACKGROUND 1. TECHNICAL FIELD

[0002] The present disclosure relates to a heat-assisted magnetic head, a light source unit strip member, and a hard disk drive.

[0003] 2. BACKGROUND

[0004] In recent years, with an increase in recording density of a magnetic disk drive, a thin-film magnetic head that records data on a magnetic recording medium needs to further improve its performance. In a thin-film magnetic head, a composite thin-film magnetic head has been conventionally widely used, in which a reproducing head having a magnetoresistive device (hereinafter also referred to as "MR device") for reading and a recording head having an electromagnetic coil device for writing are stacked. In a magnetic disk drive, the thin-film magnetic head is provided on a head slider that slightly floats from the magnetic recording medium.

[0005] Further, the magnetic disk drive records data by magnetizing magnetic fine particles on the magnetic recording medium using the recording head. In order to increase the recording density of the magnetic recording medium, it is effective to make the magnetic fine particles smaller.

[0006] However, when the magnetic fine particles become smaller, a problem arises in that, as the volume of the particles decreases, its magnetization becomes thermally unstable, thereby increasing the possibility of loss of data recorded on the magnetic recording medium. In order to solve this problem, it is effective to increase the magnetic energy of the magnetic fine particles to thereby enhance the stability of the magnetization. However, when the magnetic energy of the magnetic fine particles increases, another problem arises in that the coercive force (difficulty of reversing the magnetization) of the magnetic recording medium increases, resulting in a decrease in data recording performance.

[0007] In order to solve these problems, a method called heat-assisted magnetic recording has conventionally been proposed. When recording data on a magnetic recording medium having a high coercive force, a thin-film magnetic head (hereinafter referred to as "heat-assisted magnetic head") that employs the heat-assisted magnetic recording technique heats a portion of the magnetic recording medium on which data is to be recorded at the time of recording the data to thereby increase the temperature of the portion.

[0008] Since the coercive force of the magnetic fine particles decreases when the temperature increases, the instant heating makes it possible to record data on the magnetic recording medium having a high coercive force even at room temperature. After the data is recorded, the temperature of the portion of the magnetic recording medium on which the data is recorded decreases, and thus the coercive force increases. Therefore, by using the heat-assisted magnetic head, it is possible to make the magnetic fine particles finer and stably record in the magnetic disk drive.

[0009] On the other hand, in a conventional heat-assisted magnetic head, near-field light is used as a means of heating a magnetic recording medium. When light enters an opening smaller than the wavelength of the light, the light slightly leaks out of the opening and locally exists near the opening. This light that locally exists near the opening is called near-field light. Near-field light is confined to a region much smaller than a light spot obtained by using a lens, and thus, near-field light can heat only a limited, extremely small recording region of a magnetic recording medium.

[0010] Next, regarding a method of generating near-field light, in a conventional heat-assisted magnetic head, a method of using a plasmonic generator (also referred to as "PG"), which is a minute metal piece, is known. In this method, near-field light is generated by guiding laser light onto the PG through an optical waveguide.

[0011] In this case, it is preferable that a semiconductor laser such as a laser diode (also referred to as "LD") or the like be arranged as a laser light source near the PG. Then, structures disclosed in, for example, U.S. Patent Application Publication No. 2011 / 0228650 Al (also referred to as Patent Document 1), U.S. Patent Application Publication No. 2014 / 0209664 Al (also referred to as Patent Document 2), U.S. Patent Application Publication No. 2015 / 0131415 Al (also referred to as Patent Document 3), and U.S. Patent No. 8,310,903 (also referred to as Patent Document 4) are well known. In these structures, a semiconductor laser is fixed to a head slider, and laser light of the semiconductor laser is guided into an optical waveguide of the head slider. SUMMARY

[0012] In addition, as a laser light source, an LD includes a side-emission LD and a surface-emission LD. Among the side-emission LDs, there are an LD including a TE (transverse electric field) mode (TE mode LD) and an LD including a TM (transverse magnetic field) mode (TM mode LD). The TE mode is a mode that emits laser light with a polarization parallel to a semiconductor substrate, and the TM mode is a mode that emits laser light with a polarization perpendicular to the semiconductor substrate. In a heat-assisted magnetic head, a side-emission LD of the TE mode and a side-emission LD of the TM mode are used as a laser light source.

[0013] Further, in a heat-assisted magnetic head, a plurality of PGs are formed so that their conversion efficiency is maximized when the polarization direction of laser light emitted by an LD is orthogonal to the laminated surface of the heat-assisted magnetic head. Therefore, the plurality of PGs are formed in accordance with the LD used as a laser light source. That is, if the LD is a TE mode LD, the plurality of PGs are formed in a structure corresponding to laser light of the TE mode. Further, if the LD is a TM mode LD, the plurality of PGs are formed in a structure corresponding to laser light of the TM mode.

[0014] As is customary, the following structures are disclosed regarding heat-assisted magnetic heads, for example in U.S. Patent Application Publication No. 2013 / 0322221A1 (also known as Patent Document 5) and U.S. Patent No. 9,437,227 (also known as Patent Document 6). A TE-mode LD is used, in which the PG is formed as a TM-mode LD. Furthermore, the orientation of the TE-mode LD is adjusted to a 90-degree rotation such that the substrate surface of the TE-mode LD orthogonally intersects the stacked surface of the heat-assisted magnetic head, and the TE-mode LD is mounted on the head slider such that the TE-mode LD and the sub-mount are arranged in a row along the side direction of the head slider. Laser emitted from the TE-mode LD is guided to the PG having this structure.

[0015] However, the heat-assisted magnetic head with the above structure still does not solve the following problem. This will be explained below.

[0016] The heat-assisted magnetic head is mounted on the cantilever assembly. The head flap assembly (hereinafter also referred to as "HGA") is made of the cantilever assembly. In this case, holes are formed in the flexible part and load bar of the cantilever assembly, and the heat-assisted magnetic head is mounted on the cantilever assembly so that the TE mode LD passes through these holes.

[0017] Furthermore, as a TE mode LD, it is known that there are such... Figures 31 to 33 The laser diode 472 is shown. Although the laser diode 472 has six sides, the sides 472a and 472b arranged in a direction orthogonally intersecting with the head slider 361 are inclined surfaces. The sides 472a and 472b are inclined such that the farther away from the sub-mount 371, the closer they are to the outer end face 361E of the head slider 361.

[0018] When, in addition to the sub-mount 371, the laser diode 472 is also mounted on the magnetic head 361, the side 472a sometimes extends beyond the side 371a of the sub-mount 371. In this case, as... Figure 33 As shown, the dimension of the gap D472 between side 472a and wiring electrode 362 is smaller than the gap D371 between side 371a and wiring electrode 362. Therefore, the active layer 472c of laser diode 472 is arranged near wiring electrode 362. Therefore, similar to the heat-assisted magnetic head 360 using laser diode 372, the heat-assisted magnetic head 360A using laser diode 472 will also experience short circuits or malfunctions.

[0019] Accordingly, the present disclosure aims to improve hard disk drive reliability in the case of a heat-assisted magnetic head including a lateral placement structure with respect to a TE mode LD and a sub-mount. The present disclosure is a heat-assisted magnetic head including: a head slider including a head slider substrate and a head portion formed on the head slider substrate, the head slider substrate including a light source placement surface on which a light source unit is placed, the light source unit including a laser diode and a sub-mount, the laser diode being joined to the sub-mount, the head portion including a medium opposing surface opposing a magnetic recording medium, a light source opposing surface disposed at a rear side of the medium opposing surface, a waveguide guiding laser light output from the laser diode from the light source opposing surface to the medium opposing surface, and a head slider front end surface connected to the medium opposing surface and the light source opposing surface and having a same width as the medium opposing surface and the light source opposing surface, the sub-mount including a connection end surface to which the laser diode is joined and a mounting front end surface intersecting the connection end surface and disposed in a direction of the head slider front end surface, the laser diode including an electrode surface and an LD front end surface intersecting the electrode surface and disposed in a direction of the mounting front end surface. The light source unit includes a shift connection structure in which the laser diode is joined to a shift region of the connection end surface, the light source unit being mounted on the light source placement surface such that the electrode surface of the laser diode intersects a laminated surface of the head portion, the shift region being disposed in a shifted position such that the LD front end surface is farther from the head slider front end surface than the mounting front end surface.

[0020] In the case of the above-described heat-assisted magnetic head, it is preferable to dispose part of the laser diode and the sub-mount on the head portion.

[0021] Further, in the case of the above-described heat-assisted magnetic head, the laser diode can include an electrode bottom surface, along the electrode surface, the sub-mount can include a shift recess having a size larger than the electrode bottom surface of the laser diode, the shift recess being formed in a shift region of the connection end surface, the electrode bottom surface being fitted into the shift recess, and the laser diode being joined to the sub-mount.

[0022] Furthermore, the sub-mount can include a positioning stopper formed between the shift region of the connection end surface and the mounting front end surface, the laser diode being joined to the shift region and being in contact with the positioning stopper such that the laser diode is distanced from the mounting front end surface.

[0023] Further, the heat-assisted magnetic head can further include: a solder layer formed between a bottom of the shift recess and the electrode bottom surface of the laser diode, the depth of the shift recess being larger than the thickness of the solder layer. The heat-assisted magnetic head can further include: a solder layer formed between the connection end surface and the electrode bottom surface of the laser diode, the thickness of the positioning stopper being larger than the thickness of the solder layer.

[0024] Further, the present disclosure provides a light source unit bar member including a bar member formed in a long strip form, and a plurality of laser diodes, the bar member including a mounting line structure including a long strip joint surface and a long strip front end surface intersecting the long strip joint surface, the long strip joint surface and the long strip front end surface being formed by a plurality of mounting portions arranged in the long strip form separated by a scribe line, the laser diodes each including an electrode surface and an LD front end surface, the light source unit bar member further including a line-shaped displacement joint structure in which each of the laser diodes is joined to each of the displacement regions of each of the mounting portions with the LD front end surface together with the long strip front end surface, the displacement region being disposed in a position displaced by a certain size on the long strip joint surface in a direction away from an edge line at which the long strip joint surface and the long strip front end surface intersect.

[0025] In the case of the light source unit bar member, it is preferable that the laser diodes each include an electrode bottom surface together with the electrode surface, each of the sub-mounts include displacement recesses larger in size than the electrode bottom surface of the laser diodes, the displacement recesses being formed in the displacement regions of each of the mounting portions in the connection end surface in the long strip form, the electrode bottom surface fitting into the displacement recess, and each of the laser diodes being joined to each of the mounting portions.

[0026] Further, it is preferable that each of the mounting portions further include positioning stoppers formed between the displacement regions of the long strip joint surface and the long strip front end surface, each of the laser diodes being joined to the displacement region in contact with the positioning stopper, and the laser diode being displaced away from the long strip front end surface.

[0027] Further, it is preferable that the light source unit bar member further include solder layers formed between the bottoms of the displacement recesses and the electrode bottom surfaces of the laser diodes, the depths of the displacement recesses all being greater than the thicknesses of the solder layers. Further, it is preferable that the light source unit bar member further include solder layers respectively formed between the long strip joint surface and the electrode bottom surfaces of the laser diodes, the thicknesses of the positioning stoppers all being greater than the thicknesses of the solder layers.

[0028] Further, the present disclosure provides a hard disk drive including a head tab assembly and a magnetic recording medium, the head tab assembly including a heat-assisted head and a suspension member, the heat-assisted head including a head slider and a light source unit coupled to the head slider, the head slider including a head slider substrate and a head portion formed on the head slider substrate, the head slider substrate including a light source placement surface on which the light source unit is placed; the light source unit including a laser diode and a sub-mount, the laser diode being coupled to the sub-mount, the head portion including a medium opposing surface opposing the magnetic recording medium, a light source opposing surface disposed at a rear side of the medium opposing surface, a waveguide guiding laser light output from the laser diode from the light source opposing surface to the medium opposing surface, and a head slider front end surface connected to the medium opposing surface and the light source opposing surface and having a same width as the medium opposing surface and the light source opposing surface; the sub-mount including a connection end surface to which the laser diode is coupled and a mounting front end surface intersecting the connection end surface and disposed in a direction of the head slider front end surface; the laser diode including an electrode surface and an LD front end surface intersecting the electrode surface and disposed in a direction of the mounting front end surface; the light source unit including a shift connection structure in which the laser diode is coupled to a shifted region of the connection end surface and the light source unit is mounted on the light source placement surface such that the electrode surface of the laser diode intersects a laminated surface of the head portion; the shifted region being disposed in a shifted position such that the LD front end surface is farther from the head slider front end surface than the mounting front end surface; the suspension member including a through opening portion penetrating from a head slider placement surface on which the head slider is disposed to a light source unit placement surface on which the light source unit is disposed, and a flexible member forming the head slider placement surface; the head tab assembly further including an assembly structure in which the light source unit is inserted into the through opening portion from the head slider placement surface of the suspension member, the light source unit protrudes from the light source unit placement surface, the head slider is adhered to the head slider placement surface of the suspension member, an LD solder connection is formed to connect the laser diode to the flexible member, and a mounting solder connection is formed to connect the sub-mount to the flexible member.

[0029] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, which are given only as an example and thus should not be construed as limiting the scope of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a perspective view of an entire HGA according to an embodiment of the present disclosure as viewed from the front;

[0031] Figure 2 is a perspective view of a main portion of the HGA in Figure 1 as viewed from the front;

[0032] Figure 3 is a perspective view of a main portion of the suspension member constituting the HGA in Figure 1 as viewed from the front;

[0033] Figure 4 is a perspective view of a thermal assist head that constitutes the HGA in Figure 1 ;

[0034] Figure 5 is a longitudinal sectional view of a main part of the HGA in Figure 1 ;

[0035] Figure 6 is a perspective view of a main part of the HGA in Figure 1 from the back;

[0036] Figure 7 is a plan view enlarged to show a main part in Figure 6 ;

[0037] Figure 8 is an exploded perspective view showing a light source unit mounted in the HGA in Figure 1 ;

[0038] Figure 9 is a front view showing a main part of a thermal assist head that constitutes the HGA in Figure 1 ;

[0039] Figure 10 is a perspective view showing the entirety of a silicon wafer for manufacturing strip members;

[0040] Figure 11 is an exploded perspective view showing a plurality of strip members manufactured from the silicon wafer in Figure 10 , in addition to a laser diode;

[0041] Figure 12 is a perspective view partially omitting a light source unit strip member;

[0042] Figure 13 is a plan view partially omitting the light source unit strip member and a light source unit;

[0043] Figure 14 is a perspective view showing the entirety of a wafer-shaped substrate for manufacturing a thermal assist head;

[0044] Figure 15 is an exploded perspective view showing a plurality of strip members manufactured from the wafer-shaped substrate in Figure 14 , in addition to a light source unit;

[0045] Figure 16 is a perspective view partially omitting a head strip member;

[0046] Figure 17 is an exploded perspective view of a light source unit according to the variant embodiment 1;

[0047] Figure 18perspective view of the light source unit according to variant embodiment 2; Figure 17

[0048] Figure 19 perspective view of the light source unit according to variant embodiment 2;

[0049] Figure 20 perspective view of the light source unit strip member according to variant embodiment 1;

[0050] Figure 21 perspective view of the light source unit strip member according to variant embodiment 2; Figure 20

[0051] Figure 22 perspective view of the light source unit strip member according to variant embodiment 2;

[0052] Figure 23 perspective view of the light source unit strip member according to variant embodiment 2; Figure 22

[0053] Figure 24 perspective view of the light source unit strip member according to variant embodiment 2; Figure 23

[0054] Figure 25 perspective view of the light source unit strip member according to variant embodiment 2;

[0055] Figure 26 perspective view of the light source unit strip member according to variant embodiment 2; Figure 25

[0056] Figure 27 perspective view of the hard disk drive including the HGA according to variant embodiment 1; Figure 1

[0057] Figure 28 perspective view of the hard disk drive including the HGA according to variant embodiment 1;

[0058] Figure 29 plan view of the hard disk drive including the HGA according to variant embodiment 1; Figure 28

[0059] Figure 30 perspective view of the hard disk drive including the HGA according to variant embodiment 1;

[0060] Figure 31 perspective view of the hard disk drive including the HGA according to variant embodiment 1; Figure 28

[0061] plan view of the hard disk drive including the HGA according to variant embodiment 1; Figure 32 Figure 31 ​​​​​​​​​

[0062] Figure 33 The enlarged plan view shows Figure 32 The main part. Detailed Implementation

[0063] Embodiments of this disclosure will now be described in conjunction with the accompanying drawings. It should be noted that the same components are referenced by the same numbers or letters, and repeated descriptions are omitted.

[0064] (Structure of the magnetic head flap assembly)

[0065] First, combine Figures 1 to 9 The structure of HGA101 according to embodiments of the present disclosure will be described. Wherein, Figures 1 to 8 This is a view showing an HGA 101 and a heat-assisted magnetic head 60 according to an embodiment of the present disclosure. Figure 1 This is a 3D view of the entire HGA101 from the front. Figure 2 A 3D view of the main parts of the HGA101 as seen from the front; Figure 3 This is a perspective view of the main components of the cantilever member 50 that constitutes the HGA101, as seen from the front. Furthermore, Figure 4 A three-dimensional view of the heat-assisted magnetic head 60 that constitutes the HGA101. Figure 5 This is a cross-sectional view along the length of the main part of HGA101. Figure 6 A 3D view of the main parts of HGA101. Figure 7 To show in magnified form Figure 6 A floor plan of the main parts of the building. Figure 8 An exploded perspective view of the light source unit 160 installed in the HGA101. Figure 9 This is a front view of the heat-assisted magnetic head 60.

[0066] like Figure 1 As shown, the HGA101 has a cantilever 50 and a heat-assisted magnetic head 60. The cantilever 50 has a base plate 102, a load bar 103, a flexible member 106, and a damper (not shown), in which these components are joined together by welding or other means.

[0067] The substrate 102 is the part used to fix the cantilever 50 to the drive arm 209 of the hard disk drive 201, which will be described later, and it is made of a metal such as stainless steel.

[0068] The load bar 103 is fixed to the substrate 102. The shape of the load bar 103 is such that its width gradually decreases with increasing distance from the substrate 102. The load bar 103 has a load bending portion that generates energy to press the heat-assisted magnetic head 60 onto the hard disk 202 of the hard disk drive 201.

[0069] In addition, such as Figure 2As shown, the flexure 106 has a flexure substrate 104, a wiring member 75, a connection wiring 111, and thin film piezoelectric material elements 112a, 112b. In the structure of the flexure 106, the wiring member 75 is formed on the flexure substrate 104, and the connection wiring 111 and the thin film piezoelectric material elements 112a, 112b are adhered to the wiring member 75. Also, a protective insulating layer, not shown, is formed to cover the connection wiring 111 and the thin film piezoelectric material elements 112a, 112b.

[0070] The flexure 106 has a piezoelectric element attachment structure in which, in addition to the connection wiring 111, the thin film piezoelectric material elements 112a, 112b are also fixed to the surface of the wiring member 75 to become a structure having piezoelectric elements.

[0071] In addition, the flexure 106 has a flap portion 110 on the tip side (load beam 103 side). A tongue portion 119 in which the heat-assisted magnetic head 60 is mounted is fastened to the flap portion 110 (see Figure 3 ), and a plurality of connection contacts 120 are formed closer to the edge side than the tongue portion 119. The connection contacts 120 are electrically connected to electrode pads, not shown, on the heat-assisted magnetic head 60, and the connection contacts 120 are formed by solder.

[0072] This flexure 106 stretches or contracts the thin film piezoelectric material elements 112a, 112b, and stretches or contracts a stainless steel portion (called a trigger portion) that protrudes outside the tongue portion 119. This causes the position of the heat-assisted magnetic head 60 to move slightly around a dimple, not shown, thereby precisely controlling the position of the heat-assisted magnetic head 60.

[0073] The flexure substrate 104 is a substrate for supporting the entire flexure 106, and is made of stainless steel. The rear side of the flexure substrate 104 is fixed to the substrate 102 and the load beam 103 (see Figure 5 , regarding the load beam 103) by welding. As Figure 1 shown, the flexure substrate 104 has a central portion 104a that is fixed to the surface of the load beam 103 and the substrate 102, and a wiring portion 104b that extends outward from the substrate 102.

[0074] As Figure 5 shown, the wiring member 75 covers the surface of the flexure substrate 104. The wiring member 75 forms a head slider arrangement surface 50a of the HGA 101 according to the present disclosure, which will be described later. The wiring member 75 is made of, for example, polyimide, and has a thickness of about 5 μm to 10 μm. In addition, as Figure 3As shown in detail, a part of the wiring member 75 located on the load beam 103 is divided into two parts. One of the parts is the first wiring portion 105a, and the other part is the second wiring portion 105b. The thin film piezoelectric material element 112a and the thin film piezoelectric material element 112b are adhered to the surfaces of each of the wiring portions, respectively. The thin film piezoelectric material elements 112a, 112b are connected to the electrode pads 118a, 118b. The electrode pads 118a, 118b are connected to the connection wiring 111.

[0075] In addition, as shown in Figure 5 , Figure 6 , the wiring member 75 has an exposed wiring portion 75a exposed to the inside of the penetration opening portion 109 described later. The connection contacts 76e, 77e belonging to the electrode wiring 76, 77 of the connection wiring 111 are provided on the exposed wiring portion 75a. The LD solder connection 99a, the mounting solder connection 99b described later are connected to each of the connection contacts 76e, 77e. Furthermore, a plurality of connection contacts 120 are formed on the head slider arrangement surface 50a of the wiring member 75. The connection contacts 120 are connected to the connection wiring 111.

[0076] As shown in Figure 3 , a plurality of connection wirings 111 are formed on the surfaces of each of the first wiring portion 105a and the second wiring portion 105b. Each of the connection wirings 111 is formed of a conductor such as copper. One end portion of each of the connection wirings 111 is connected to the electrode pads 118a, 118b or each of the connection contacts 20. The electrode wiring 76, 77 of the connection wiring 111 is connected to the LD solder connection 99a, the mounting solder connection 99b, respectively.

[0077] Then, as shown in Figure 5 , the cantilever member 50 includes the head slider arrangement surface 50a and the light source unit arrangement surface 50b. The head slider arrangement surface 50a is a surface of a side on which the head slider 70 described later of the heat-assisted magnetic head 60 is disposed. The head slider arrangement surface 50a is formed of the outer surface of the wiring member 75 described above. The head slider 70 is attached to the head slider arrangement surface 50a.

[0078] Furthermore, the cantilever member 50 includes the penetration opening portion 109. The penetration opening portion 109 is a hole portion penetrating from the head slider arrangement surface 50a to the light source unit arrangement surface 50b, which is formed by overlapping the opening portion 75d, the opening portion 116, the opening portion 50d. The opening portion 75d, the opening portion 116, the opening portion 50d are the opening portion of the wiring member 75, the opening portion of the flexible member substrate 104, the opening portion of the load beam 103, respectively (note that the load beam 103 is omitted in the middle for convenience of explanation, Figure 6 .

[0079] As shown in Figure 7As shown in detail, the penetration opening portion 109 has a three-width structure. The three-width structure means that the structure includes three portions (the first opening portion 109a, the second opening portion 109b, and the third opening portion 109c, which are described later) having different widths in a direction along the head slider front end face 85 of the later-described head slider 70. In the penetration opening portion 109, the first opening portion 109a, the second opening portion 109b, and the third opening portion 109c are arranged in order along the direction away from the head slider front end face 85.

[0080] The first opening portion 109a, the second opening portion 109b, and the third opening portion 109c have different widths in the direction along the head slider front end face 85, respectively. The first opening portion 109a is a portion in which a portion of the later-described head portion 59 of the head slider 70 is arranged, and has a first width W1. The second opening portion 109b is a portion in which the sub-mount 150 and the laser diode 130 of the later-described light source unit 160 are arranged. The second opening portion 109b is arranged at a position farther from the head slider front end face 85 than the first opening portion 109a, and has a second width W2 that is smaller than the first width W1. The third opening portion 109c is a portion in which the sub-mount 150 of the light source unit 160 is arranged. The third opening portion 109c is arranged at a position farther from the head slider front end face 85 than the second opening portion 109b, and has a third width W3 that is smaller than the second width W2 (W1 > W2 > W3).

[0081] Then, the HGA 101 includes an assembly structure. As shown in Figure 5 , Figure 6 , this assembly structure is constituted by the suspension 50 and the heat-assisted magnetic head 60.

[0082] As will be described in detail later, the heat-assisted magnetic head 60 includes the head slider 70 and the light source unit 160. In the HGA 101, with respect to the suspension 50 and the heat-assisted magnetic head 60, the light source unit 160 is inserted into the penetration opening portion 109 from the head slider arrangement face 50a, and the light source unit 160 is protruded from the light source unit arrangement face 50b. Also, the head slider 70 is adhered to the head slider arrangement face 50a of the suspension 50. This structure constituted by the suspension 50 and the heat-assisted magnetic head 60 is the assembly structure.

[0083] Further, the HGA 101 includes an LD solder connection 99a and a mounting solder connection 99b. The LD solder connection 99a and the mounting solder connection 99b will be explained in detail below.

[0084] (LD solder connection, mounting solder connection 99b)

[0085] As shown in Figures 5 to 7As shown, the LD solder connecting piece 99a is connected to the n-type electrode 141 of the laser diode 130 described later and the connecting contact 76e of the electrode wiring 76 described later. The connecting contact 76e is provided on the LD extension 75aa of the exposed wiring portion 75a described later, and the n-type electrode 141 is arranged to face the connecting contact 76e. The n-type electrode 141 is connected to the connecting contact 76e through the LD solder connecting piece 99a.

[0086] Further, the mounting solder connecting piece 99b is connected to the electrode pad 50e of the sub-mount 150 described later and the connecting contact 77e of the electrode wiring 77 described later. The connecting contact 77e is provided on the mounting extension 75ab of the exposed wiring portion 75a described later, and the electrode pad 50e is arranged to face the connecting contact 77e. The electrode pad 50e is connected to the connecting contact 77e through the mounting solder connecting piece 99b.

[0087] The LD extension 75aa is a portion of the exposed wiring portion 75a that extends inside the second opening portion 109b. A portion of the exposed wiring portion 75a extends toward the laser diode 130, thereby shortening the distance between the exposed wiring portion 75a and the laser diode 130. This extension is the LD extension 75aa. The mounting extension 75ab is a portion of the exposed wiring portion 75a that is arranged inside the third opening portion 109c and extends toward the sub-mount 150 with respect to the LD extension 75aa. A portion of the exposed wiring portion 75a extends toward the sub-mount 150, thereby shortening the distance between the exposed wiring portion 75a and the sub-mount 150. This extension is the mounting extension 75ab.

[0088] The LD solder connecting piece 99a and the mounting solder connecting piece 99b are formed of, for example, solder balls in a molten particle state. In this case, a solder ball is ejected from an ejection device (not shown) to connect the laser diode 130 and the flexure 106, and the solder ball is placed between the n-type electrode 141 and the LD extension 75aa. The solder ball comes into contact with the n-type electrode 141 and the LD extension 75aa, and then the solder ball hardens, thereby forming the LD solder connecting piece 99a.

[0089] Another solder ball is ejected from the ejection device (not shown) and placed between the electrode pad 50e and the mounting extension 75ab. The solder ball comes into contact with the electrode pad 50e and the mounting extension 75ab, and then the solder ball hardens, thereby forming the mounting solder connecting piece 99b. Note in the present disclosure that the molten particle state refers to a state in which molten solder becomes a particle shape due to surface tension. The solder ball is a minute particle-shaped member made of solder, in a spherical form (not shown).

[0090] (Structure of a heat-assisted magnetic head)

[0091] As shown in FIG. 1, the heat-assisted magnetic head 100 includes a substrate 101, a laser diode 130, a flexure 106, a sub-mount 150, and a magnetic head element 110. Figure 4As shown, the heat-assisted magnetic head 60 has a head slider 70 and a light source unit 160. In the structure of the heat-assisted magnetic head 60, the light source unit 160 is joined to the head slider 70.

[0092] The head slider 70 has a head slider-substrate 58 and a head portion 59 formed on the head slider-substrate 58.

[0093] The head slider-substrate 58 is made of a ceramic material such as alumina-titanium carbide (Al203-TiC) and is formed in a cuboid shape. The head slider-substrate 58 has a medium-opposing surface (air bearing surface, hereinafter also referred to as ABS) 81 that opposes the magnetic recording medium, and a light source placement surface 82 that is located opposite the ABS 81. A part of the light source placement surface 82 formed in the head portion 59 is defined as a light source-opposing surface 83. The light source-opposing surface 83 opposes a later-described laser diode 130 of the light source unit 160.

[0094] The head portion 59 includes a head slider front end surface 85. The head portion 59 includes an electromagnetic coil element 12 that is a recording head for recording magnetic data, and an MR device 13 that is a reproducing head for detecting a magnetic signal. The head slider front end surface 85 is continuous with the ABS 81 and the light source-opposing surface 83, and has the same width as the ABS 81 and the light source-opposing surface 83. Further, a plurality of connection electrodes 86 are formed on the head slider front end surface 85. In the structure of the head portion 59, the reproducing head and the recording head are stacked. Further, the head portion 59 has a core layer 17 and a near-field light generating layer 28.

[0095] The MR device 13 is composed of a magnetic sensitive film that exhibits a magnetoresistance effect, such as an AMR (anisotropic magnetoresistance), a GMR (giant magnetoresistance), and a TMR (tunneling magnetoresistance) device.

[0096] The electromagnetic coil element 12 has a plurality of layers that are stacked on a thin film layer-stacking surface 111a of the head slider-substrate 58, including a recording magnetic layer 12a and a thin film coil 12b. The thin film coil 12b surrounds the recording magnetic layer 12a like a flat spiral.

[0097] Next, in the electromagnetic coil element 12, when a current modulated in accordance with magnetic data to be recorded on the magnetic recording medium flows through the thin film coil 12b, the current causes the thin film coil 12b to generate a recording magnetic field. Further, in correspondence with the recording magnetic field, magnetic flux is emitted from the recording magnetic layer 12a toward the magnetic recording medium, and the magnetic flux flows back to a not-shown return pole layer through the magnetic recording medium (specifically, a not-shown soft magnetic layer).

[0098] The core layer 17 is a waveguide that guides laser light generated by a later-described laser diode 130 of the light source unit 160 from the light source-opposing surface 83 to the ABS 81.

[0099] Core layer 17 is made of materials such as tantalum oxide (TaO) x It can be made of dielectric materials such as Ta2O5 (e.g., with a refractive index of about 2.16). For example, the core layer 17 can be made of Ta2O5.

[0100] The near-field light generating layer 28 generates near-field light for heating the magnetic recording medium. The near-field light generating layer 28 is made of metal, and is formed of, for example, one of Au, Ag, Al, Cu, Pd, Pt, Rh, Ir or an alloy of these elements.

[0101] (Light source unit)

[0102] like Figures 4 to 6 As shown, the light source unit 160 includes a laser diode 130 and a sub-mount 150. The laser diode 130 is coupled to the sub-mount 150 to form the light source unit 160.

[0103] The laser diode 130 has a cuboid shape. The laser diode 130 is a TE-mode LD, which emits laser light in TE mode. The laser diode 130 includes an electrode surface (n-type electrode 141) and an LD front end surface 149. The LD front end surface 149 intersects orthogonally with the electrode surface (n-type electrode 141, described later) and is arranged along the direction of the mounting front end surface 139, which will be described later. Both the LD front end surface 149 and the electrode surface (n-type electrode 141) are formed in a rectangular shape.

[0104] like Figure 9 As shown, the laser diode 130 includes an n-type substrate 140, an n-type electrode 141, a light-emitting layer 145, and a p-type electrode 142. The n-type electrode 141 is bonded to the outer surface of the n-type substrate 140. Furthermore, the light-emitting layer 145 is formed on the side of the n-type substrate 140 opposite to the n-type electrode 141, and the p-type electrode 142 is bonded to the light-emitting layer 145 through a ground layer 143.

[0105] The light emitting layer 145 has an active layer, an n-type coating layer and a p-type coating layer, and the active layer is sandwiched between the n-type coating layer and the p-type coating layer in its structure.

[0106] Then, the laser diode 130 is bonded to the sub-mount 150 such that the active layer is opposite the core layer 17, and the emitting portion (not shown) is located in the portion of the light emitting layer 145 opposite to the core layer 17, thereby forming the light source unit 160. The light source unit 160 is mounted on the light source placement surface 82. The emitting portion is the part of the laser diode 130 that emits laser light.

[0107] The sub-mount 150 is made of a ceramic material such as alumina-titanium carbide (Al2O3·TiC) and is formed in a cuboid shape. The size of the sub-mount 150 is larger than that of the laser diode 130. In addition, the sub-mount 150 can be made of semiconductor materials such as Si, GaAs, and SiC.

[0108] like Figure 4 , Figure 6 and Figure 7 As shown, the sub-mount 150 includes a mating end face 151 to which the laser diode 130 is mated, and a mounting front end face 139. An electrode pad 50e is formed on the mating end face 151. The electrode pad 50e is connected to a mounting wiring 50f. The mounting wiring 50f is connected to the p-type electrode 142 of the laser diode 130. The mounting front end face 139 intersects the mating end face 151 orthogonally. In the light source unit 160, the mounting front end face 139 is arranged along the direction of the front end face 85 of the magnetic head slider. Both the mounting front end face 139 and the mating end face 151 are rectangular in shape.

[0109] Next, the light source unit 160 includes a shift bonding structure. The shift bonding structure means that the laser diode 130 in the structure is bonded to a shift region 152 of the bonding end face 151. For example... Figures 6 to 8 As shown, the shifting region 152 is located in a direction away from the front end face 85 of the magnetic head slider (direction f, such as...). Figure 8 The position of the displacement region 152 relative to the mounting front face 139 is shifted by a certain displacement dimension dx. The displacement dimension dx can be set to, for example, 10 μm to 20 μm. The size of the displacement region 152 corresponds to the p-type electrode 142 (electrode bottom surface). Figure 7 As shown, since the light source unit 160 includes a shifted bonding structure, the laser diode 130 is shifted by a shift dimension dx relative to the sub-mount 150.

[0110] like Figure 4 As shown, the sub-mount 150 of the light source unit 160 with the above structure is coupled to the magnetic head slider 70 to form a heat-assisted magnetic head 60.

[0111] In addition, such as Figure 4 As shown, in the heat-assisted magnetic head 60, the light source unit 160 is mounted on the light source placement surface 82, such that the electrode surface (n-type electrode 141) of the laser diode 130 intersects orthogonally with the stacked surfaces 59a and 59b (e.g., thin film stacked surface 111a, core layer 17, etc.) of the magnetic head 59. Furthermore, as... Figure 7As shown, a unit gap ux is ensured between the mounting front end face 139 and the head slider front end face 85. The laser diode 130 (of the TE mode LD) and the sub-mount 150 are placed on the head slider 70 so as to be arranged side by side with the side face (the head slider front end face 85) of the head slider 70. Thus, the heat-assisted magnetic head 60 includes a lateral placement structure with respect to the laser diode 130 and the sub-mount 150. Note that, in the structure in which the light source unit 160 is placed on the light source placement face 82, the portion of the laser diode 130 and the sub-mount 150 are placed on the head portion 59.

[0112] (light source unit strip member and method for manufacturing the light source unit strip member)

[0113] Next, the light source unit strip member (hereinafter also referred to as "LSU strip member") 169 and the manufacturing method of the LSU strip member 169 will be explained.

[0114] The LSU strip member 169 is a member for manufacturing the above-described light source unit 160, which includes a plurality of light source units 160. As Figures 11 to 13 As shown, the LSU strip member 169 includes the strip member 168 and a plurality of laser diodes 130.

[0115] The length L171 of the strip member 168 is much larger than the width W171, and the strip member 168 is a long strip member as a whole having a linear form. The strip member 168 includes a plurality of mounting portions 171 (171a, 171b, 171c, 171d,...). Each of the mounting portions 171 is separated by a scribe line 172 (172a, 172b, 172c, 172d,...). Further, the strip member 168 has a long strip surface formed by the joint surface of the plurality of mounting portions 171 (171a, 171b, 171c, 171d,...) and the scribe lines 172 (172a, 172b, 172c, 172d,...). The strip member 168 includes four long strip surfaces, one of which is a long strip joint face 170 and the other of which is a long strip front end face 173. According to the present disclosure, in the strip member 168, the plurality of mounting portions 171 and the scribe lines 172 form a structure indicating the long strip joint face 170 and the long strip front end face 173, which is a mounting line structure.

[0116] The long strip joint face 170 is a plane in which the plurality of laser diodes 130 are arranged. The long strip front end face 173 is also a plane, which orthogonally intersects the long strip joint face 170. In the long strip joint face 170, the laser diodes 130 are arranged one by one on each of the mounting portions 171 (171a, 171b, 171c, 171d,...).

[0117] Then, the LSU strip member 169 includes a linear displacement joint structure. As Figure 11As shown, when each laser diode 130 is bonded to each mounting portion 171 (171a, 171b, 171c, 171d,...), each laser diode 130 is bonded to each displacement region 152 (152a, 152b, 152c, 152d,...) so that the LD front end face 149 of each laser diode 130 is arranged along each scribe line 172 (172a, 172b, 172c, 172d,...). As shown, Figure 13 As shown, the displacement region 152 (152a, 152b, 152c, 152d,...) is displaced from each scribe line 172 (172a, 172b, 172c, 172d,...) by a displacement dimension dx, similarly to the light source unit 160. As shown, Figure 12 and Figure 13 As shown, the plurality of laser diodes 130 are bonded one by one to the displacement regions 152 (152a, 152b, 152c, 152d,...) so that the laser diodes 130 are arranged in a linear form, and this structure is a linear displacement bonding structure.

[0118] In the LSU strip member 169, for all of the mounting portions 171 (171a, 171b, 171c, 171d,...) included in the strip member 168, the displacement regions 152 (152a, 152b, 152c, 152d,...) are provided in the displacement positions along the direction of each scribe line 172 (172a, 172b, 172c, 172d,...) away from the long strip bonding face 170 by a displacement dimension dx. These displacement regions 152 (152a, 152b, 152c, 152d,...) are also provided in the displacement positions displaced from the edge line 174 by an LD gap dy. The edge line 174 is a linear corner portion at which the long strip bonding face 170 and the long strip front end face 173 intersect each other.

[0119] Then, as shown, Figure 13 when the cutting step is performed on the LSU strip member 169, the light source unit 160 is manufactured from each mounting portion 171. In the cutting step, the LSU strip member 169 is cut along each scribe line 172 (172a, 172b, 172c, 172d,...) using a blade not shown.

[0120] Next, the method of manufacturing the LSU strip member 169 will be explained as follows.

[0121] First, a preparation step is performed. As shown, Figure 10 In the preparation step, a silicon wafer 178 and a plurality of laser diodes 130 (the laser diodes are not shown in the drawing) are prepared. Figure 10

[0122] ​The silicon wafer 178 is a substrate (sub-mount substrate) used to manufacture the sub-mount 150. A plurality of mounting portions 171, including mounting portions 171a, 171b, 171c, 171d, are arranged in a grid-like form intervening between scribe lines 172 (172a, 172b, 172c, 172d...) and scribe lines 176 (176a, 176b, 176c, 176d...).

[0123] It should be noted that Figure 10 In the diagram, lines 172 (172a, 172b, 172c, 172d...) are vertical lines, and lines 176 (176a, 176b, 176c, 176d...) are horizontal lines. Lines 172 (172a, 172b, 172c, 172d...) and 176 (176a, 176b, 176c, 176d...) intersect orthogonally.

[0124] Next, a strip-shaped component forming step is performed. In this step, a blade (not shown) is used to cut the silicon wafer 178 along one of the scribing lines 172 or 176 in a fixed direction (longitudinal or transverse). Here, considering the... Figure 11 The relationship is as follows: silicon wafer 178 along the scribing line 176 (176a, 176b, 176c, 176d...) Figure 10 The cutting is performed using the middle arrow (rf). Subsequently, multiple strip-shaped members 168 are formed. Multiple mounting portions 171 (171a, 171b, 171c, 171d…) are arranged along the scribing lines 176 (176a, 176b, 176c, 176d…) in each of the formed strip-shaped members 168. Furthermore, each strip-shaped member 168 has four elongated surfaces. One of these elongated surfaces is the aforementioned elongated mating surface 170, and another is the elongated front end surface 173.

[0125] Next, proceed with the step of setting the shift region. For example... Figure 11 As shown, in the step of setting up the displacement area, displacement areas 152 (152a, 152b, 152c, 152d...) are set for the mounting portions 171 (171a, 171b, 171c, 171d...) of each strip member 168. Figure 13 As shown, the shifted regions 152 (152a, 152b, 152c, 152d...) are positioned at locations shifted by a certain shift size dx along a direction away from each of the scribed lines 172 (172a, 172b, 172c, 172d...).

[0126] Next, a laser diode bonding step is performed. In this step, the laser diode 130 is bonded to each mounting portion 171 (171a, 171b, 171c, 171d...) of each strip member 168. At this time, the laser diode 130 is also bonded to the shifting regions 152 (152a, 152b, 152c, 152d...) of each mounting portion 171 (171a, 171b, 171c, 171d...). After performing the laser diode bonding step, the aforementioned LSU strip member 169 is manufactured.

[0127] Next, the manufacturing method of the heat-assisted magnetic head 60 with the above structure will be explained as follows.

[0128] First, such as Figure 14 As shown, a wafer-shaped substrate 229 is fabricated. The wafer-shaped substrate 229 is made of a ceramic material, such as alumina-titanium carbide (Al2O3·TiC). Scribes 220 and 221 are formed on the first surface 229a of the wafer-shaped substrate 229. Multiple scribes 220 and 221 are formed on the first surface 229a and are aligned along a straight line at predetermined intervals in a fixed direction. Scribes 220 and 221 are orthogonal. Multiple regions enclosed by the scribes 220 and 221 constitute head slider regions 210. The head slider 70 is formed from each head slider region 210.

[0129] Next, a thin film forming process is performed on the first surface 229a to form a thin film magnetic head 59 in each magnetic head slider region 210.

[0130] Next, a strip-shaped component formation step is performed. In this step, the wafer-shaped substrate 229 is cut along the scribing line 221. Thus, as... Figure 15 As shown, multiple strip-shaped members 230 are formed. Each strip-shaped member 230 contains multiple head slider regions 210. Each head slider region 210 is separated by a scribing line 220. Furthermore, the strip-shaped member forming step is also used to form a head slider front end face 85 in each head slider region 210.

[0131] Next, the light source unit installation step is performed. In this step, multiple light source units 160 are used. Since the multiple light source units 160 are manufactured from the aforementioned LSU strip member 169, each light source unit 160 includes the aforementioned shifting connection structure.

[0132] Next, as Figure 15As shown, in the light source unit mounting step, the light source units 160 are respectively mounted on the head slider regions 210. In this case, the light source units 160 are respectively placed on the light source placement surface 82 so that the electrode surface (n-type electrode 141) of the laser diode 130 orthogonally intersects the lamination surface of the head portion 59 (the head portion 59, the light source placement surface 82 are not shown in Figure 15 ). Further, at this time, the light source units 160 are respectively positioned and mounted on the head slider regions 210 so that the active layer of the laser diode 130 opposes the core layer 17, and the emission portion, not shown, is disposed in the portion of the light emission layer 145 that opposes the core layer 17. At this time, the portion of the laser diode 130 and the sub-mount 150 are disposed on the head portion 59. Further, for each light source unit 160, the unit gap ux (the unit gap is not shown in Figure 16 ) is ensured. As Figure 16 shown, after the light source unit mounting step is completed, the head strip member (also referred to as "MH strip member") 231 is manufactured. Thereafter, the connection contact 120 is formed. Still later, when the cutting step is performed along the scribe line 220, the heat-assisted magnetic head 60 is manufactured from each head slider region 210 with respect to the MH strip member 231.

[0133] (Modification Example 1)

[0134] Next, the light source unit 165 according to Modification Example 1 is explained. Figure 17 is an exploded perspective view showing the light source unit 165, Figure 18 is a perspective view showing the sub-mount 155. The light source unit 165 differs from the light source unit 160 in that it uses the sub-mount 155 instead of the sub-mount 150. The sub-mount 155 differs from the sub-mount 150 in that it includes the displacement cavity 153. The displacement cavity 153 corresponds to the displacement recess according to the present disclosure. The displacement cavity 153 is formed in a displacement region 152 on the connection end surface 151 of the sub-mount 155. The displacement cavity 153 is a concave cavity having a bottom 153a that is deeper than the size of the p-type electrode 142 (electrode bottom surface) of the laser diode 130.

[0135] In the light source unit 165, the p-type electrode 142 (electrode bottom surface) is fitted into the displacement cavity 153, and the laser diode 130 is joined to the sub-mount 155 using the solder layer 199.

[0136] Next, the light source unit 165 is manufactured with the LSU strip member 169A. As Figure 20 , 21As shown, the LSU bar member 169A differs in that it has a displacement cavity 153 in each mounting portion 171 (171a, 171b, 171c, 171d,...). In addition, the manufacturing steps for manufacturing the LSU bar member 169A differ from the manufacturing steps for the LSU bar member 169 in that a displacement cavity forming step is performed. In the displacement cavity forming step, the displacement cavity 153 is formed in each mounting portion 171 (171a, 171b, 171c, 171d,...) by, for example, etching. At this time, as shown in FIG. 17B, the displacement cavity 153 is formed so as to have a depth greater than the thickness of the solder layer 199. Figure 21 As shown, the displacement cavity 153 has a depth greater than the thickness of the solder layer 199.

[0137] (Modification Example 2)

[0138] The light source unit 166 according to Modification Example 2 is explained next. Figure 19 is an exploded perspective view showing the light source unit 166 according to Modification Example 2. The light source unit 166 differs from the light source unit 160 in that it has the sub-mount 156 instead of the sub-mount 150. The sub-mount 156 differs from the sub-mount 150 in that it includes the positioning stopper 154.

[0139] The positioning stopper 154 is made of AI2O3, SiO2, TiO2, Zr2O3, or a metal material such as Au, Ti, Si, Ni, NiFe, or the like. The positioning stopper 154 is in a band form in a plan view, and is formed between the displacement region 152 of the connection end face 151 and the mounting front end face 139. In addition, the positioning stopper 154 protrudes a little from the connection end face 151, and is formed so as to have a thickness.

[0140] In the light source unit 166, as shown in Figure 19 when the laser diode 130 is bonded to the sub-mount 156, the solder layer 199 is used. Next, the bottom surface (p-type electrode 142) of the laser diode 130 is distanced from the connection end face 151. Therefore, as shown in Figure 23 , 24 The positioning stopper 154 can be formed so as to have a thickness greater than the thickness of the solder layer 199. That is, the thickness t154 of the positioning stopper 154 can be greater than the thickness t199 of the solder layer 199 (t154 > t199). For example, when t199 is 1-1.5 μm, t154 can be 2-2.5 μm.

[0141] Since the light source unit 166 includes the positioning stopper 154, the position at which the laser diode 130 is bonded to the displacement region 152 is adjusted by the positioning stopper 154, so as to be distanced from the mounting front end face 139 by the displacement dimension dx.

[0142] Next, the light source unit 166 is manufactured using the LSU strip member 169B. As shown in Figure 22 , 23 , the LSU strip member 169B differs from the LSU strip member 169 in that it has the positioning stopper 154 in each mounting portion 171 (171a, 171b, 171c, 171d,...). Further, the manufacturing steps for manufacturing the LSU strip member 169B differ from the manufacturing steps of the LSU strip member 169 in that the positioning stopper forming step is performed. In the positioning stopper forming step, the positioning stopper 154 is formed on the silicon wafer 178 at a position between each displacement region 152 (152a, 152b, 152c, 152d,...) and each scribe line 172 (172a, 172b, 172c, 172d,...) in each mounting portion 171 (171a, 171b, 171c, 171d,...).

[0143] In addition, when the positioning stopper 154 is formed, as shown in Figure 25 , in the positioning stopper forming step, the positioning stopper 154 is formed on the silicon wafer 178. In Figure 25 , the positioning stopper 154 is formed together with the scribe line 176 (176a, 176b, 176c, 176d,...). At this time, as shown in Figure 26 , when the silicon wafer 178 is cut, the line-shaped portion corresponding to the blade B is removed along the scribe line 176 (176a, 176b, 176c, 176d,...) as a trace. Therefore, as shown in Figure 26 , when the positioning stopper 154 is formed, a part of the positioning stopper 154 can be formed on the scribe line 176 (176a, 176b, 176c, 176d,...).

[0144] (Embodiment of Hard Disk Drive)

[0145] Next, an embodiment of a hard disk drive will be explained with reference to Figure 27 .

[0146] Figure 27 is a perspective view of a hard disk drive 201 equipped with an HGA 101 having the above-described heat-assisted magnetic head 60. The hard disk drive 201 includes a hard disk (magnetic recording medium) 202 that rotates at high speed and the above-described head flexure assembly (HGA) 101. The hard disk drive 201 is a device that drives the HGA 101 so as to record / reproduce data on a recording surface of the hard disk 202. The hard disk 202 has a plurality of (four in the figure) disks. Each disk has a recording surface that opposes the corresponding heat-assisted magnetic head 60.

[0147] The hard disk drive 201 positions the head slider 70 on a track by a head carrier device 203. Further, the hard disk drive 201 has a plurality of drive arms 209. The drive arms 209 are pivoted by voice coil motors (VCMs) 205 about pivot bearing shafts 206, and are stacked in the direction of the pivot bearing shafts 206. Further, the HGAs 101 are attached to the tips of each of the drive arms 209.

[0148] Further, the hard disk drive 201 has a control circuit 204 for controlling recording and reproduction and generation of light by the laser diode 130.

[0149] In the hard disk drive 201, the heat-assisted head 60 moves in the radial direction of the hard disk 202, i.e., the direction across the track lines, when the HGA 101 rotates.

[0150] Although the above-described embodiment explains a type in which the thin film coil is wound in a planar spiral around the recording magnetic layer by way of example, the present disclosure is also applicable to a type in which the thin film coil is wound in a spiral around the recording magnetic layer.

[0151] The head flap assembly can include a heat-assisted head, and a suspension member. The heat-assisted head can include a head slider and a light source unit engaged with the head slider. The head slider can include a head slider substrate and a head portion formed on the head slider substrate. The head slider substrate can include a light source placement surface on which the light source unit is placed. The light source unit can include a laser diode and a sub-mount to which the laser diode is engaged. The head portion can include a medium opposing surface opposing the magnetic recording medium, a light source opposing surface located at a rear side of the medium opposing surface, a waveguide guiding laser light emitted from the laser diode from the light source opposing surface to the medium opposing surface, and a head slider front end surface connected to the medium opposing surface and the light source opposing surface and having the same width as the medium opposing surface and the light source opposing surface. The sub-mount can include a connection end surface to which the laser diode is engaged, and a mounting front end surface intersecting the connection end surface and disposed in the direction of the head slider front end surface. The laser diode can include an electrode surface and an LD front end surface intersecting the electrode surface and disposed in the direction of the mounting front end surface.

[0152] The light source unit can include a shift connection structure in which the laser diode is engaged to a shifted area of the connection end surface, and the light source unit is mounted on the light source placement surface such that the electrode surface of the laser diode intersects the laminated surface of the head portion. The shifted area is provided in a shifted position such that the LD front end surface is farther from the head slider front end surface than the mounting front end surface.

[0153] The cantilever member can include a penetration opening portion penetrating from a head slider arrangement surface where the head slider is arranged to a light source unit arrangement surface where the light source unit protrudes, and a flexible member forming the head slider arrangement surface. The head slider assembly can further include an assembly structure in which the light source unit is inserted into the penetration opening portion from the head slider arrangement surface of the cantilever member, and the light source unit protrudes from the light source unit arrangement surface, the head slider is adhered to the head slider arrangement surface of the cantilever member, an LD solder connection is further formed to connect the laser diode to the flexible member, and a mounting solder connection is further formed to connect the sub-mount to the flexible member.

[0154] According to the head slider assembly disclosed above, the penetration opening portion can include a three-width structure including a first opening portion, a second opening portion, and a third opening portion having different widths in the head slider front end surface direction, respectively. The first opening portion can be a portion where the head slider is arranged, and have a first width. The second opening portion can be a portion where the sub-mount and the laser diode of the light source unit are arranged, and have a second width smaller than the first width, at a position further away from the head slider front end surface than the first opening portion. The third opening portion is a portion where the sub-mount of the light source unit is arranged, and have a third width smaller than the second width, at a position further away from the head slider front end surface than the second opening portion.

[0155] According to the head slider assembly disclosed above, the cantilever member can include a load bar forming the light source unit arrangement surface. The flexible member can include a wiring member formed on the head slider arrangement surface. The wiring member can include an exposed wiring portion exposed to the penetration opening portion. The LD solder connection and the mounting solder connection can be connected to the exposed wiring portion of the wiring member, respectively.

[0156] According to the head slider assembly disclosed above, the cantilever member can include a load bar forming the light source unit arrangement surface. The flexible member can include a wiring member formed on the head slider arrangement surface. The wiring member can include an exposed wiring portion exposed to the penetration opening portion. The exposed wiring portion can include an LD extension portion extending inside the second opening portion, and a mounting extension portion arranged in the third opening portion, the mounting extension portion extending from the LD extension portion toward the sub-mount. The LD solder connection can be connected to the LD extension portion of the wiring member, and the mounting solder connection is connected to the mounting extension portion of the wiring member.

[0157] A manufacturing method of a light source unit strip member can include the following steps. A preparation step for preparing a sub-mount substrate in which a plurality of mounting portions are arranged in a grid form along a scribe line on the sub-mount substrate, and a plurality of laser diodes. A strip member forming step for forming a plurality of strip members in which the plurality of mounting portions are arranged in a linear form by cutting the sub-mount substrate along the scribe line. A shift region setting step for setting a shift region of a fixed size in a direction away from an edge line of a long strip-shaped front end surface intersecting a long strip-shaped joint surface with respect to all of the mounting portions of the plurality of laser diodes bonded in the long strip-shaped joint surface in each of the strip members.

[0158] The manufacturing method of a light source unit strip member according to the above disclosure can further include a shift recess forming step for forming a shift recess of a size larger than an electrode bottom surface of the laser diode with respect to all of the mounting portions on the long strip-shaped joint surface of the strip member.

[0159] The manufacturing method of a light source unit strip member according to the above disclosure can further include a positioning stopper forming step for forming a positioning stopper between the shift region of the long strip-shaped joint surface and the scribe line with respect to all of the mounting portions on the long strip-shaped joint surface of the strip member.

[0160] The present disclosure is not limited to the above-described embodiments, but various changes and modifications can be made to the components thereof without departing from the scope of the present invention. Furthermore, it is obvious that various embodiments and modified examples of the present disclosure can be implemented according to the above-described explanations. Therefore, the present disclosure can be implemented in other modes equivalent to the scope of the following claims, and not only the above-described best mode.

Claims

1. A heat-assisted magnetic head, comprising: a head slider; and a light source unit joined to the head slider, wherein the head slider includes a head slider substrate and a head portion formed on the head slider substrate, wherein the head slider substrate includes a light source placement surface on which the light source unit is placed, wherein the light source unit includes a laser diode and a sub-mount, the laser diode being joined to the sub-mount, wherein the head portion includes a medium-opposing surface opposing a magnetic recording medium, a light source-opposing surface disposed at a rear side of the medium-opposing surface, a waveguide that guides laser light emitted from the laser diode from the light source-opposing surface to the medium-opposing surface, and a head slider front end surface connecting the medium-opposing surface and the light source-opposing surface, wherein the sub-mount includes a connection end surface to which the laser diode is joined and a mounting front end surface intersecting the connection end surface and disposed in a direction of the head slider front end surface, wherein the laser diode includes an electrode surface and an LD front end surface intersecting the electrode surface and disposed in a direction of the mounting front end surface of the sub-mount, wherein the light source unit includes a shifted connection structure in which the laser diode is joined to a shifted region of the connection end surface of the sub-mount, so that the light source unit is mounted on the light source placement surface with the electrode surface of the laser diode intersecting a laminated surface of the head portion, wherein the shifted region is provided in a position shifted by a size from the mounting front end surface so that the LD front end surface is farther from the head slider front end surface than the mounting front end surface.

2. The heat-assisted magnetic head according to claim 1, wherein a portion of the light source unit is disposed on the head portion.

3. The heat-assisted magnetic head according to claim 1, wherein the laser diode includes an electrode bottom surface opposing the electrode surface, wherein the sub-mount includes a shifted recess having a size larger than the electrode bottom surface of the laser diode, wherein the shifted recess is formed in the shifted region of the connection end surface, wherein the electrode bottom surface is fitted into the shifted recess, and whereby the laser diode is joined to the sub-mount.

4. The heat-assisted magnetic head according to claim 1, wherein the sub-mount includes a positioning stopper formed between the shifted region of the connection end surface and the mounting front end surface, wherein the laser diode is joined to the shifted region in contact with the positioning stopper so that the laser diode is distanced from the mounting front end surface.

5. The heat-assisted magnetic head according to claim 3, further comprising: a solder layer formed between a bottom of the shifted recess and the electrode bottom surface of the laser diode, wherein a depth of the shifted recess is larger than a thickness of the solder layer.

6. The heat-assisted magnetic head according to claim 4, further comprising: a solder layer formed between the connection end surface and the electrode bottom surface of the laser diode, wherein a thickness of the positioning stopper is larger than a thickness of the solder layer.

7. A light source unit strip member for manufacturing a plurality of light source units, comprising: ​ a strip-shaped member including a plurality of mounting portions formed in a long strip shape and separated by a scribe line; and a plurality of laser diodes, wherein each of the laser diodes is bonded to one of the mounting portions to constitute one of the light source units, wherein the strip-shaped member includes a mounting line structure having a long strip-shaped bonding surface and a long strip-shaped front end surface intersecting the long strip-shaped bonding surface, the plurality of laser diodes being bonded to the long strip-shaped bonding surface of the strip-shaped member, the long strip-shaped front end surface and the long strip-shaped bonding surface orthogonally intersecting, wherein the long strip-shaped bonding surface and the long strip-shaped front end surface are formed by the plurality of mounting portions, wherein the laser diodes each include an electrode surface and an LD front end surface, the LD front end surface intersecting the electrode surface and being arranged in a direction of the long strip-shaped front end surface of the mounting portion, wherein the light source unit strip-shaped member further includes a line-shaped displacement connection structure, wherein each laser diode of the light source unit is bonded to each displacement region of the long strip-shaped bonding surface of each mounting portion, the LD front end surface being arranged along the scribe line, wherein each displacement region of each mounting portion is provided in the long strip-shaped bonding surface in a position displaced by a size from the scribe line.

8. The light source unit strip-shaped member according to claim 7, wherein the laser diodes each include an electrode bottom surface opposite to the electrode surface, wherein each sub-mount includes a displacement recess having a size larger than the electrode bottom surface of the laser diode, wherein the displacement recess is formed in a displacement region of each mounting portion in a connection end surface of the strip shape, wherein the electrode bottom surface is fitted in the displacement recess, and each laser diode is thereby bonded to each mounting portion.

9. The light source unit strip-shaped member according to claim 7, wherein each mounting portion further includes a positioning stopper formed between the displacement region of the long strip-shaped bonding surface and the scribe line, wherein each laser diode is bonded to the displacement region in contact with the positioning stopper, the laser diode being displaced away from the scribe line.

10. The light source unit strip-shaped member according to claim 8, further comprising: a solder layer formed between the bottom of the displacement recess and the electrode bottom surface of the laser diode, wherein the depth of the displacement recess is larger than the thickness of the solder layer.

11. The light source unit strip-shaped member according to claim 9, further comprising: a solder layer formed between the long strip-shaped bonding surface and the electrode bottom surface of the laser diode, respectively, wherein the thickness of the positioning stopper is larger than the thickness of the solder layer.

12. A hard disk drive including a head flexure assembly and a magnetic recording medium, wherein the head flexure assembly includes a heat-assisted head and a suspension member, wherein the heat-assisted head includes a head slider and a light source unit bonded to the head slider, wherein the head slider includes a head slider substrate and a head portion formed on the head slider substrate, wherein the head slider substrate includes a light source placement surface on which the light source unit is placed, wherein the light source unit includes a laser diode and a sub-mount, the laser diode being bonded to the sub-mount, wherein the sub-mount includes a displacement recess having a size larger than the electrode bottom surface of the laser diode, wherein the displacement recess is formed in a displacement region of each mounting portion in a connection end surface of the strip shape, wherein the electrode bottom surface is fitted in the displacement recess, and each laser diode is thereby bonded to each mounting portion. wherein the head portion includes a medium opposing surface opposing the magnetic recording medium, a light source opposing surface disposed at a rear side of the medium opposing surface, a waveguide guiding laser light emitted from the laser diode from the light source opposing surface to the medium opposing surface, and a head slider front end surface connected to the medium opposing surface and the light source opposing surface and having a same width as the medium opposing surface and the light source opposing surface, wherein the sub-mount includes a connecting end surface to which the laser diode is joined and a mounting front end surface intersecting the connecting end surface and disposed in a direction of the head slider front end surface, wherein the laser diode includes an electrode surface and an LD front end surface intersecting the electrode surface and disposed in a direction of the mounting front end surface, wherein the light source unit includes a displacement connecting structure, wherein the laser diode is joined to a displacement region of the connecting end surface, and the light source unit is mounted on a light source placement surface such that the electrode surface of the laser diode intersects a lamination surface of the head portion, wherein the displacement region is disposed in a position displaced by a size from the mounting front end surface such that the LD front end surface is farther from the head slider front end surface than the mounting front end surface, wherein the cantilever member includes a penetration opening portion penetrating from a head slider arrangement surface on which the head slider is arranged to a light source unit arrangement surface on which the light source unit is arranged, and a flexible member forming the head slider arrangement surface, wherein the head flap assembly further includes an assembly structure, wherein the light source unit is inserted into the penetration opening portion from the head slider arrangement surface of the cantilever member, the light source unit protrudes from the light source unit arrangement surface, the head slider is adhered to the head slider arrangement surface of the cantilever member, an LD solder connecting member is formed to connect the laser diode to the flexible member, and a mounting solder connecting member is formed to connect the sub-mount to the flexible member.

Images