Laser radar printed circuit board solder resist curing plug hole monitoring method and device, computer equipment and storage medium

Abstract

The invention provides a laser radar printed circuit board solder resist curing plug hole monitoring method and device, computer equipment and a storage medium. The method comprises the following steps: acquiring solder resist plug hole detection parameters of the laser radar printed circuit board; performing hole crack adjustment processing on the resistance welding hole plugging detection parameter and a preset hole plugging parameter to obtain a resistance welding hole crack adjustment amount; and according to the resistance welding hole crack adjustment amount, a post-baking adjusting signal is sent to a plate-making resistance welding central controller. The method comprises the following steps of: after acquiring solder mask plug hole detection parameters, determining a plug hole condition on a current solder mask layer of a laser radar printed circuit board, and then comparing the solder mask plug hole detection parameters with standard plug hole parameters; according to the method, the difference between the current hole plugging condition on the solder mask layer of the laser radar printed circuit board and the standard hole plugging condition on the solder mask layer is conveniently determined, and finally, the post-baking mode of the board-making solder mask central controller is optimized and adjusted according to the difference value, so that the probability of rechecking the hole plugging condition after solder mask is reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a method, device, computer equipment and storage medium for monitoring solder mask curing and plugging holes of a laser radar printed circuit board. Background Art

[0002] With the development of technology, LiDAR is widely used in the fields of autonomous driving, intelligent robot navigation, drones and other intelligent equipment, and is applied to scenarios such as environmental detection and space modeling. LiDAR is a radar system that emits laser beams to detect the position, speed and other characteristic quantities of target objects. Its working principle is to first emit a detection laser beam to the target object, and then compare the received reflected signal reflected from the target object with the transmitted signal, and after processing, obtain relevant information of the target object, such as target distance, direction, height, speed, attitude and shape. The transmitting system of LiDAR has multiple laser transmitters, and the receiving system of LiDAR has laser receivers corresponding to the multiple transmitters one by one. The multiple laser transmitters and the multiple laser receivers need to be installed on the circuit board body.

[0003] However, in the existing production process of the laser radar circuit board industry, the printed circuit board needs to be soldered, which includes a plugging process. When the ink is post-cured after the soldering, the ink cracks due to uneven heating, causing quality problems. Repeated manual re-inspection is required, resulting in low production efficiency. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a laser radar printed circuit board solder mask curing plugging monitoring method, device, computer equipment and storage medium that effectively improve the board manufacturing efficiency.

[0005] The purpose of this disclosure is achieved through the following technical solutions:

[0006] A laser radar printed circuit board solder resist curing plugging monitoring method, the method comprising:

[0007] Obtain solder mask plugging detection parameters of laser radar printed circuit board;

[0008] Perform hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount;

[0009] A post-baking adjustment signal is sent to the board soldering control center according to the solder resist hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board.

[0010] In one of the embodiments, the obtaining of the solder resist plugging via detection parameters of the laser radar printed circuit board includes: obtaining the number of cracked edges of the solder resist plugging vias of the laser radar printed circuit board.

[0011] In one of the embodiments, the solder resist hole plugging detection parameters and preset hole plugging parameters are processed for hole crack adjustment to obtain the solder resist hole crack adjustment amount, including: calculating the difference between the number of crack edges of the solder resist hole plugging and the preset number of crack edges to obtain the solder resist hole crack edge adjustment.

[0012] In one of the embodiments, sending a post-bake adjustment signal to the board making solder resist central controller according to the solder resist hole crack adjustment amount to adjust the post-bake time of the lidar printed circuit board, includes: detecting whether the solder resist hole crack edge adjustment is greater than or equal to the preset crack edge adjustment; when the solder resist hole crack edge adjustment is greater than or equal to the preset crack edge adjustment, sending a post-bake delay signal to the board making solder resist central controller.

[0013] In one of the embodiments, the obtaining of solder resist plugging hole detection parameters of the laser radar printed circuit board includes: obtaining the solder resist plugging hole crack length of the laser radar printed circuit board.

[0014] In one of the embodiments, the solder resist hole crack adjustment processing is performed on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount, including: calculating the difference between the solder resist hole crack length and the preset crack length to obtain the solder resist hole crack length adjustment.

[0015] In one of the embodiments, a post-bake adjustment signal is sent to the board making solder resist central controller according to the solder resist hole crack adjustment amount to adjust the post-bake time of the laser radar printed circuit board, including: detecting whether the solder resist hole crack length adjustment difference is less than a preset crack length adjustment difference; when the solder resist hole crack length adjustment difference is less than the preset crack length adjustment difference, a post-bake holding signal is sent to the board making solder resist central controller.

[0016] A laser radar printed circuit board solder mask curing plugging monitoring device comprises: a plugging sampling module, a hole crack adjustment processing module and a post-bake adjustment module; the plugging sampling module is used to obtain the solder mask plugging detection parameters of the laser radar printed circuit board; the hole crack adjustment processing module is used to perform hole crack adjustment processing on the solder mask plugging detection parameters and preset plugging parameters to obtain the solder mask hole crack adjustment amount; the post-bake adjustment module is used to send a post-bake adjustment signal to the board solder mask central controller according to the solder mask hole crack adjustment amount to adjust the post-bake time of the laser radar printed circuit board.

[0017] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0018] Obtain solder mask plugging detection parameters of laser radar printed circuit board;

[0019] Perform hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount;

[0020] A post-baking adjustment signal is sent to the board soldering control center according to the solder resist hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board.

[0021] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0022] Obtain solder mask plugging detection parameters of laser radar printed circuit board;

[0023] Perform hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount;

[0024] A post-baking adjustment signal is sent to the board soldering control center according to the solder resist hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] After collecting the solder mask plugging detection parameters, the plugging situation on the current solder mask layer of the lidar printed circuit board is determined, and then the solder mask plugging detection parameters are compared with the standard plugging parameters to facilitate determining the difference between the plugging situation on the current solder mask layer of the lidar printed circuit board and the plugging situation on the standard solder mask layer. Finally, according to the above difference value, the post-bake mode of the board making solder mask central controller is optimized and adjusted to reduce the probability of re-inspection of the plugging situation after solder masking, thereby effectively improving the board making efficiency of the lidar printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a flow chart of a method for monitoring solder resist curing and plugging holes of a laser radar printed circuit board in one embodiment;

[0029] Figure 2 1 is a diagram of the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] The present disclosure relates to a laser radar printed circuit board solder resist curing plugging method. In one embodiment, the laser radar printed circuit board solder resist curing plugging method includes obtaining the laser radar printed circuit board solder resist plugging detection parameters; performing hole crack adjustment processing on the solder resist plugging detection parameters and the preset plugging parameters to obtain the solder resist hole crack adjustment amount; sending a post-baking adjustment signal to the board solder resist central controller according to the solder resist hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board. After the solder resist plugging detection parameters are collected, the plugging situation on the current solder resist layer of the laser radar printed circuit board is determined, and then the solder resist plugging detection parameters are compared with the standard plugging parameters to facilitate the determination of the difference between the plugging situation on the current solder resist layer of the laser radar printed circuit board and the plugging situation on the standard solder resist layer. Finally, according to the above difference value, the post-baking mode of the board solder resist central controller is optimized and adjusted to reduce the probability of re-inspecting the plugging situation after solder resist, and effectively improve the board making efficiency of the laser radar printed circuit board.

[0034] See also Figure 1 , which is a flow chart of a laser radar printed circuit board solder resist curing plugging method according to an embodiment of the present disclosure. The laser radar printed circuit board solder resist curing plugging method includes part or all of the following steps.

[0035] S100: Obtain solder mask plugging detection parameters of a laser radar printed circuit board.

[0036] In this embodiment, the solder resist plugging hole detection parameter is the plugging hole curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter is the plugging hole curing molding condition of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter corresponds to the curing degree of the plugging hole on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging hole detection parameters, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging hole is cured.

[0037] S200: performing hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount.

[0038] In this embodiment, the solder resist plugging hole detection parameter is the plugging hole curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter is the plugging hole curing and forming state of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter corresponds to the curing degree of the plugging hole on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging hole detection parameters, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging hole is cured. The preset plugging hole parameters are the standard state data of the plugging hole on the solder resist layer of the laser radar printed circuit board after curing. By processing the hole crack adjustment of the solder resist plugging hole detection parameters and the preset plugging hole parameters, it is convenient to determine the degree of plugging hole cracking after the solder resist layer of the laser radar printed circuit board is cured.

[0039] S300: Sending a post-bake adjustment signal to the board solder mask central controller according to the solder mask hole crack adjustment amount to adjust the post-bake time of the laser radar printed circuit board.

[0040] In this embodiment, the solder resist hole crack adjustment amount is collected based on the solder resist plugging detection parameters and the preset plugging parameters. The solder resist plugging detection parameters are the plugging curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging detection parameters are the plugging curing and forming conditions of the laser radar printed circuit board, that is, the solder resist plugging detection parameters correspond to the curing degree of the plugging on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging detection parameters, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging is cured. The preset plugging parameters are the standard state data of the plugging on the solder resist layer of the laser radar printed circuit board after curing. By processing the hole crack adjustment of the solder resist plugging detection parameters and the preset plugging parameters, it is convenient to determine the degree of plugging cracking after the solder resist layer of the laser radar printed circuit board is cured. After obtaining the solder mask crack adjustment amount, the plugged hole crack condition on the lidar printed circuit board is determined, and a post-bake adjustment signal is sent to the board solder mask central controller to adjust the subsequent baking time of the solder mask layer on the lidar printed circuit board, thereby achieving crack repair improvement on the plugged hole and reducing the probability of crack formation after plugging the hole.

[0041] In the above embodiment, after the solder resist plugging detection parameters are collected, the plugging status of the current solder resist layer of the laser radar printed circuit board is determined, and then the solder resist plugging detection parameters are compared with the standard plugging parameters to facilitate the determination of the difference between the plugging status of the current solder resist layer of the laser radar printed circuit board and the plugging status of the standard solder resist layer. Finally, according to the above difference value, the post-baking mode of the board making solder resist central controller is optimized and adjusted to reduce the probability of re-inspection of the plugging status after solder resist, thereby effectively improving the board making efficiency of the laser radar printed circuit board.

[0042] In one of the embodiments, the obtaining of the solder resist plugging hole detection parameters of the laser radar printed circuit board includes: obtaining the number of cracked edges of the solder resist plugging hole of the laser radar printed circuit board. In this embodiment, the solder resist plugging hole detection parameter is the plugging hole curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter is the plugging hole curing and forming condition of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter corresponds to the curing degree of the plugging hole on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging hole detection parameters, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging hole is cured. The solder resist plugging hole detection parameters include the number of cracked edges of the solder resist plugging hole of the laser radar printed circuit board, and the number of cracked edges of the solder resist plugging hole is the number of fractures that appear on the edge of the plugging hole after the current solder resist layer of the laser radar printed circuit board is cured. By collecting the number of cracked edges of the solder resist plugging hole, it is convenient to determine the plugging hole cracking condition of the laser radar printed circuit board.

[0043] Further, the solder resist plugging hole detection parameter and the preset plugging hole parameter are subjected to hole crack adjustment processing to obtain the solder resist hole crack adjustment amount, including: obtaining the difference between the number of crack edges of the solder resist plugging hole and the preset number of crack edges to obtain the solder resist hole crack edge adjustment. In this embodiment, the solder resist plugging hole detection parameter is the plugging hole curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter is the plugging hole curing molding condition of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter corresponds to the curing degree of the plugging hole on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging hole detection parameter, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging hole is cured. The preset plugging hole parameter is the standard state data after the plugging hole is cured on the solder resist layer of the laser radar printed circuit board. By performing the hole crack adjustment processing on the solder resist plugging hole detection parameter and the preset plugging hole parameter, it is convenient to determine the plugging hole cracking degree after the solder resist layer of the laser radar printed circuit board is cured. The solder resist plugging hole detection parameters include the number of cracked edges of the solder resist plugging hole of the laser radar printed circuit board. The number of cracked edges of the solder resist plugging hole is the number of fractures that appear on the edge of the plugging hole after the current solder resist layer of the laser radar printed circuit board is solidified. By collecting the number of cracked edges of the solder resist plugging hole, it is convenient to determine the cracked edge of the plugging hole of the laser radar printed circuit board. By subtracting the number of cracked edges of the solder resist plugging hole from the preset number of cracked edges, it is convenient to determine the degree of plugging hole cracking after the current solder resist layer of the laser radar printed circuit board is solidified.

[0044] Furthermore, the post-baking adjustment signal is sent to the board soldering control center according to the solder resist crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board, including: detecting whether the solder resist crack edge adjustment is greater than or equal to the preset crack edge adjustment; when the solder resist crack edge adjustment is greater than or equal to the preset crack edge adjustment, a post-baking delay signal is sent to the board soldering control center. In this embodiment, the solder resist crack adjustment amount is collected based on the solder resist plugging detection parameter and the preset plugging parameter, and the solder resist plugging detection parameter is the plugging curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging detection parameter is the plugging curing molding condition of the laser radar printed circuit board, that is, the solder resist plugging detection parameter corresponds to the plugging curing degree on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging detection parameter, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging is cured. The preset plugging hole parameters are the standard state data of the plugging holes on the solder mask layer of the laser radar printed circuit board after curing. By processing the hole crack adjustment of the solder mask plugging hole detection parameters and the preset plugging hole parameters, it is convenient to determine the degree of plugging hole cracking after the solder mask layer of the laser radar printed circuit board is cured. After obtaining the solder mask hole crack adjustment amount, the plugging hole crack situation on the laser radar printed circuit board is determined. By sending a post-baking adjustment signal to the board solder mask central controller to adjust the subsequent baking time of the solder mask layer on the laser radar printed circuit board, the crack repair of the plugging hole is improved to reduce the probability of crack formation after plugging. The solder mask plugging hole detection parameters include the number of solder mask plugging hole crack edges of the laser radar printed circuit board. The solder mask plugging hole crack edge number is the number of fractures that appear on the plugging hole edge after the current solder mask layer of the laser radar printed circuit board is cured. By collecting the number of solder mask plugging hole crack edges, it is convenient to determine the plugging hole crack edge situation of the laser radar printed circuit board. By calculating the difference between the number of crack edges of the solder resist plug hole and the preset number of crack edges, it is convenient to determine the degree of plug hole cracking after the current solder resist layer of the laser radar printed circuit board is cured. The solder resist hole crack edge adjustment is greater than or equal to the preset crack edge adjustment, indicating that cracks appear at the edge of the plug hole after the current solder resist layer of the laser radar printed circuit board is cured. At this time, a post-bake delay signal is sent to the board solder resist central controller to extend the post-bake time of the laser radar printed circuit board, so that the plug hole cracks of the laser radar printed circuit board are reduced, that is, the solder resist layer of the laser radar printed circuit board near the plug hole is further cured to reduce cracking.

[0045] In another embodiment, when the crack edge adjustment of the solder mask hole is less than the preset crack edge adjustment, a post-bake holding signal is sent to the board making solder mask central controller. At this time, no cracks appear on the edge of the plugged hole after the current solder mask layer of the lidar printed circuit board is cured, so as to maintain the current post-bake time and provide a reference benchmark for the subsequent post-bake time of the lidar printed circuit board.

[0046] In one of the embodiments, the obtaining of the solder resist plugging hole detection parameters of the laser radar printed circuit board includes: obtaining the solder resist plugging hole crack length of the laser radar printed circuit board. In this embodiment, the solder resist plugging hole detection parameter is the plugging hole curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter is the plugging hole curing molding condition of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter corresponds to the plugging hole curing degree on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging hole detection parameters, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging hole is cured. The solder resist plugging hole detection parameters include the solder resist plugging hole crack length of the laser radar printed circuit board, and the solder resist plugging hole crack length is the crack distance that appears on the plugging hole edge after the current solder resist layer of the laser radar printed circuit board is cured. By collecting the solder resist plugging hole crack length, it is convenient to determine the plugging hole crack edge condition of the laser radar printed circuit board.

[0047] Further, the hole crack adjustment processing of the solder resist plugging hole detection parameter and the preset plugging hole parameter to obtain the solder resist hole crack adjustment amount includes: obtaining the difference between the solder resist plugging hole crack length and the preset crack length to obtain the solder resist hole crack length adjustment. In this embodiment, the solder resist plugging hole detection parameter is the plugging hole curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter is the plugging hole curing molding condition of the laser radar printed circuit board, that is, the solder resist plugging hole detection parameter corresponds to the curing degree of the plugging hole on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging hole detection parameter, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging hole is cured. The preset plugging hole parameter is the standard state data after the plugging hole is cured on the solder resist layer of the laser radar printed circuit board. By performing the hole crack adjustment processing of the solder resist plugging hole detection parameter and the preset plugging hole parameter, it is convenient to determine the plugging hole cracking degree after the solder resist layer of the laser radar printed circuit board is cured. The solder resist plugging hole detection parameters include the solder resist plugging hole crack length of the laser radar printed circuit board. The solder resist plugging hole crack length is the crack distance that appears at the plugging hole edge after the current solder resist layer of the laser radar printed circuit board is solidified. By collecting the solder resist plugging hole crack length, it is convenient to determine the plugging hole crack edge situation of the laser radar printed circuit board. By calculating the difference between the solder resist plugging hole crack length and the preset crack length, it is convenient to determine the plugging hole cracking degree after the current solder resist layer of the laser radar printed circuit board is solidified.

[0048] Furthermore, the post-baking adjustment signal is sent to the board soldering control center according to the solder resist crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board, including: detecting whether the solder resist crack length adjustment is less than the preset crack length adjustment; when the solder resist crack length adjustment is less than the preset crack length adjustment, a post-baking holding signal is sent to the board soldering control center. In this embodiment, the solder resist crack adjustment amount is collected based on the solder resist plugging detection parameter and the preset plugging parameter, and the solder resist plugging detection parameter is the plugging curing state data on the current solder resist layer of the laser radar printed circuit board, that is, the solder resist plugging detection parameter is the plugging curing molding condition of the laser radar printed circuit board, that is, the solder resist plugging detection parameter corresponds to the plugging curing degree on the current solder resist layer of the laser radar printed circuit board. By collecting the solder resist plugging detection parameter, it is convenient to determine the crack quality of the laser radar printed circuit board after the solder resist plugging is cured. The preset plugging hole parameters are the standard state data of the plugging holes on the solder mask layer of the laser radar printed circuit board after curing. By processing the hole crack adjustment of the solder mask plugging hole detection parameters and the preset plugging hole parameters, it is convenient to determine the degree of plugging hole cracking after the solder mask layer of the laser radar printed circuit board is cured. After obtaining the solder mask hole crack adjustment amount, the plugging hole crack situation on the laser radar printed circuit board is determined. By sending a post-baking adjustment signal to the board solder mask central controller to adjust the subsequent baking time of the solder mask layer on the laser radar printed circuit board, the crack repair of the plugging hole is improved to reduce the probability of crack formation after plugging. The solder mask plugging hole detection parameters include the solder mask plugging hole crack length of the laser radar printed circuit board. The solder mask plugging hole crack length is the crack distance that appears at the plugging hole edge after the current solder mask layer of the laser radar printed circuit board is cured. By collecting the solder mask plugging hole crack length, it is convenient to determine the plugging hole crack edge situation of the laser radar printed circuit board. By calculating the difference between the solder mask plug hole crack length and the preset crack length, it is convenient to determine the degree of plug hole cracking after the current solder mask layer of the laser radar printed circuit board is cured. The solder mask hole crack edge adjustment is less than the preset crack edge adjustment. At this time, no cracks appear on the edge of the plug hole after the current solder mask layer of the laser radar printed circuit board is cured, so as to maintain the current post-baking time and provide a reference benchmark for the subsequent post-baking time of the laser radar printed circuit board.

[0049] In another embodiment, when the crack edge adjustment of the solder mask hole is less than the preset crack edge adjustment, a post-bake delay signal is sent to the board making solder mask central controller, indicating that cracks appear at the edge of the plug hole after the current solder mask layer of the lidar printed circuit board is cured. At this time, a post-bake delay signal is sent to the board making solder mask central controller to extend the post-bake time of the lidar printed circuit board, so that the plug hole cracks of the lidar printed circuit board are reduced, that is, the solder mask layer of the lidar printed circuit board near the plug hole is further cured to reduce cracking.

[0050] In the actual solder resist curing and plugging process of the laser radar printed circuit board, the solder resist ink needs to be exposed and developed before post-baking, and the solder resist ink forms a patterned solder resist layer after exposure and development, so as to form a solder resist layer with a specified pattern. However, before exposure and development, the solder resist ink needs to be coated through a screen. The choice of the screen directly determines the amount of solder resist ink used, which is likely to affect the subsequent residue after the solder resist ink is developed, thereby affecting the molding color of the solder resist ink.

[0051] In order to solve the above problem, the post-baking adjustment signal is sent to the board soldering central controller according to the soldering hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board, which also includes:

[0052] Obtaining the number of solder mask exposure grids of the laser radar printed circuit board;

[0053] Detecting whether the number of solder mask exposure grids is less than or equal to a preset number of grids;

[0054] When the number of solder mask exposure grids is less than or equal to the preset number of grids, a film reduction and increase signal is sent to the board solder mask central controller.

[0055] In this embodiment, the solder resist exposure grid number is the solder resist ink exposure grid number of the laser radar printed circuit board in the process of making the solder resist layer, that is, the solder resist exposure grid number is the exposure amount of the solder resist ink of the laser radar printed circuit board in the process of making the solder resist layer, and the preset grid number is the solder resist ink exposure grid number of the solder resist ink of the specified color in the laser radar printed circuit board in the process of making the solder resist layer. The solder resist exposure grid number is less than or equal to the preset grid number, indicating that the solder resist ink exposure grid number of the laser radar printed circuit board in the process of making the solder resist layer is too low, that is, the solder resist exposure amount of the laser radar printed circuit board is too little. At this time, by sending a film reduction and increase signal to the board solder resist central controller, the number of screens before exposure is increased, and the thickness of the wet film is reduced, so that the amount of solder resist ink used is increased, and the thickness of the protective wet film thereon is reduced. At low exposure, the amount of solder resist ink on the laser radar printed circuit board is avoided from being too much, thereby ensuring the stable curing of the plug hole on the solder resist layer to reduce the probability of cracks after post-baking.

[0056] Further, the detecting whether the number of solder mask exposure grids is less than or equal to a preset number of grids further includes:

[0057] When the solder resist exposure grid number is greater than the preset grid number, obtaining the solder resist development time of the laser radar printed circuit board;

[0058] Detecting whether the solder resist developing time is greater than or equal to a preset developing time;

[0059] When the solder resist developing time is greater than or equal to the preset developing time, a film increasing and reducing signal is sent to the board solder resist central controller.

[0060] In this embodiment, the number of solder mask exposure grids is greater than the preset number of grids, indicating that the exposure amount of the solder mask ink is sufficient. At this time, the solder mask development time of the laser radar printed circuit board is collected to determine the development time of the solder mask ink on the laser radar printed circuit board after exposure. The preset development time is the specified time that the solder mask ink on the laser radar printed circuit board is immersed in the developer, and the preset development time corresponds to the specified ink color. The solder mask development time is greater than or equal to the preset development time, indicating that the development time of the solder mask ink on the laser radar printed circuit board after exposure is too long. In order to avoid excessive development of the solder mask ink, the number of screens before exposure is reduced by sending a film increase and mesh reduction signal to the board solder mask central controller to reduce the amount of solder mask ink used, and the wet film thickness is also thickened to separate the solder mask ink from the developer in the solder mask pattern area, reduce the contact with the solder mask ink, and further reduce the probability of cracks in the plug hole.

[0061] In another embodiment, when the solder resist developing time is less than the preset developing time, step S300 is performed.

[0062] The above-mentioned various preset variables are all set in the database for timely retrieval, and different preset variables are placed in different storage units, that is, in different storage stacks. Moreover, the number of solder mask exposure grids and the solder mask development time can be collected through corresponding detectors, for example, through the light measuring instrument and development timer in the hole crack adjustment processing module.

[0063] In one of the embodiments, the present disclosure also relates to a laser radar printed circuit board solder mask curing plugging hole monitoring device, including: a plugging hole sampling module, a hole crack adjustment processing module and a post-bake adjustment module; the plugging hole sampling module is used to obtain the solder mask plugging hole detection parameters of the laser radar printed circuit board; the hole crack adjustment processing module is used to perform hole crack adjustment processing on the solder mask plugging hole detection parameters and preset plugging hole parameters to obtain the solder mask hole crack adjustment amount; the post-bake adjustment module is used to send a post-bake adjustment signal to the board solder mask central controller according to the solder mask hole crack adjustment amount to adjust the post-bake time of the laser radar printed circuit board.

[0064] In this embodiment, after the plugging sampling module collects the solder mask plugging detection parameters, the plugging situation on the current solder mask layer of the lidar printed circuit board is determined, and then the hole crack adjustment processing module compares the solder mask plugging detection parameters with the standard plugging parameters to facilitate determining the difference between the plugging situation on the current solder mask layer of the lidar printed circuit board and the plugging situation on the standard solder mask layer. Finally, the post-bake adjustment module optimizes and adjusts the post-bake mode of the board making solder mask central controller according to the above difference value, reduces the probability of re-inspection of the plugging situation after solder mask, and effectively improves the board making efficiency of the lidar printed circuit board.

[0065] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 2 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as solder mask plug detection parameters, solder mask crack adjustment amount and post-bake adjustment signal. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a laser radar printed circuit board solder mask curing plug monitoring method is implemented.

[0066] Those skilled in the art will understand that Figure 2 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0067] In one of the embodiments, the present application further provides a computer device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0068] In one of the embodiments, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0069] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0070] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. A laser radar printed circuit board solder mask curing plugging monitoring method, characterized in that: include: Obtain solder mask plugging detection parameters of laser radar printed circuit board; Perform hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount; A post-baking adjustment signal is sent to the board soldering control center according to the solder resist hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board.

2. The laser radar printed circuit board solder resist curing plugging monitoring method according to claim 1 is characterized in that: The step of obtaining solder mask plugging detection parameters of a laser radar printed circuit board includes: Obtain the number of cracked edges of the solder resist plug holes of the laser radar printed circuit board.

3. The laser radar printed circuit board solder resist curing plugging monitoring method according to claim 2 is characterized in that: The step of performing hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount includes: The difference between the number of crack edges of the solder resist plug hole and the preset number of crack edges is calculated to obtain the crack edge adjustment of the solder resist hole.

4. The laser radar printed circuit board solder resist curing plugging monitoring method according to claim 3 is characterized in that: The method of sending a post-baking adjustment signal to a board solder mask central controller according to the solder mask hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board includes: Detecting whether the crack edge adjustment of the solder resist hole is greater than or equal to a preset crack edge adjustment; When the crack edge adjustment error of the solder resist hole is greater than or equal to the preset crack edge adjustment error, a post-bake delay signal is sent to the board solder resist central controller.

5. The laser radar printed circuit board solder resist curing plugging monitoring method according to claim 1 is characterized in that: The step of obtaining solder mask plugging detection parameters of a laser radar printed circuit board includes: Obtain the solder resist plug hole crack length of the laser radar printed circuit board.

6. The laser radar printed circuit board solder resist curing plugging monitoring method according to claim 5 is characterized in that: The step of performing hole crack adjustment processing on the solder resist hole plugging detection parameters and the preset hole plugging parameters to obtain the solder resist hole crack adjustment amount includes: The difference between the crack length of the solder resist plug hole and the preset crack length is calculated to obtain the solder resist hole crack length difference.

7. The laser radar printed circuit board solder resist curing plugging monitoring method according to claim 6 is characterized in that: The method of sending a post-baking adjustment signal to a board solder mask central controller according to the solder mask hole crack adjustment amount to adjust the post-baking time of the laser radar printed circuit board includes: Detecting whether the crack length difference of the solder resist hole is less than a preset crack length difference; When the crack length difference of the solder resist hole is less than the preset crack length difference, a post-baking holding signal is sent to the board solder resist central controller.

8. A laser radar printed circuit board solder mask curing plugging monitoring device, characterized in that: include: A plug hole sampling module, which is used to obtain solder mask plug hole detection parameters of a laser radar printed circuit board; A hole crack adjustment processing module, the hole crack adjustment processing module is used to perform hole crack adjustment processing on the solder resist hole plugging detection parameters and preset hole plugging parameters to obtain a solder resist hole crack adjustment amount; A post-bake adjustment module is used to send a post-bake adjustment signal to the board solder mask central controller according to the solder mask hole crack adjustment amount to adjust the post-bake time of the laser radar printed circuit board.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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