A detachable optical fiber array light engine package structure

Abstract

The application relates to the technical field of light engines and discloses a light engine packaging structure of a detachable optical fiber array, which comprises a substrate, an electric chip, a silicon light chip, a fixing seat and an optical fiber array, the electric chip, the silicon light chip and the fixing seat are all mounted on one side of the substrate, and the electric chip and the silicon light chip are electrically connected with the substrate; a groove is arranged on the side surface of the fixing seat, the end part of the optical fiber array is provided with an adapter block, the adapter block can be detachably mounted in the groove along the direction perpendicular to the side surface of the substrate, the adapter block comprises a limiting section and a cantilever section which are fixedly connected, the limiting section is in convexo-concave cooperation with the groove; the cantilever section is protrudingly arranged towards the side close to the silicon light chip, the cantilever section is opposite to the silicon light chip in the up-down direction, and a lens structure is further mounted between the end surface of the cantilever section corresponding to the silicon light chip and the silicon light chip, the lens structure is in light guide connection with the optical fiber array and the silicon light chip respectively; the fixing seat is detachably assembled with a clamping piece, and the clamping piece is tightly matched with the adapter block along the direction perpendicular to the side surface of the substrate.

Description

Technical Field

[0001] This invention relates to the field of optical engine technology, and in particular to an optical engine packaging structure with a detachable fiber array. Background Technology

[0002] Currently, in optical communication systems, the optical engine is the core component for optical signal conversion, and its performance has a close impact on the transmission rate and stability of the optical communication system. To enable maintenance, upgrades, or replacement of components in the optical engine, a detachable fiber optic design is necessary.

[0003] For example, Chinese utility model patent CN209560165U, with an authorization announcement date of October 29, 2019, discloses an optoelectronic module with a silicon-based optical base. Specifically, it includes a circuit board with a rectangular mounting frame fixed to the top. Inside the mounting frame is an optical base fixed to the circuit board. One side of the mounting frame has a positioning groove on the circuit board, with one end extending to the edge of the circuit board. A mounting plate is slidably connected to the bottom inner wall of the positioning groove. A fiber optic fixing plate is slidably connected to the top of the mounting plate. Equally spaced connecting seats are installed on the left side of the fiber optic fixing plate, and equally spaced connecting lines are connected to the right side of the optical base. When maintenance or replacement is needed, the fiber optic fixing plate can be slid out along the groove, facilitating the reinstallation, rearrangement, or replacement of the optical fibers on the fixing plate.

[0004] However, the fiber optic array installation structure of existing optoelectronic modules is complex, and it is difficult to guarantee the coupling accuracy between the fiber optic array and the silicon photonic chip after disassembly and assembly. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that the fiber array installation structure of the optoelectronic module in the prior art is complicated, and it is difficult to guarantee the coupling accuracy between the fiber array and the silicon photonic chip after disassembly and assembly.

[0006] To address the aforementioned technical problems, this invention provides a technical solution for a detachable fiber optic array optical engine packaging structure:

[0007] The optical engine packaging structure of the detachable fiber array includes a substrate, an electrical chip, a silicon photonic chip, a mounting base, and a fiber array. The electrical chip, the silicon photonic chip, and the mounting base are all mounted on one side of the substrate, and the electrical chip and the silicon photonic chip are electrically connected to the substrate.

[0008] The mounting base has a groove on its side away from the substrate. An adapter block is installed at the end of the fiber array. The adapter block is detachably installed in the groove along a direction perpendicular to the side of the substrate. The adapter block includes a fixedly connected limiting section and a cantilever section. The limiting section is in concave-convex fit with the groove.

[0009] The cantilever section protrudes towards the side closest to the silicon photonic chip. The cantilever section and the silicon photonic chip are arranged vertically opposite each other. A lens structure is also installed between the end face of the cantilever section corresponding to the silicon photonic chip and the silicon photonic chip. The lens structure is optically connected to the fiber array and the silicon photonic chip respectively.

[0010] The mounting base is detachably fitted with a fastener on the side away from the substrate, and the fastener is fastened to the adapter block in a direction perpendicular to the side of the substrate.

[0011] Furthermore, the groove is an elongated groove, and the length of the groove extends toward the direction close to the silicon photonic chip. A guide portion is provided on the side wall of the groove, and a positioning portion is also provided on the outer side of the limiting segment. The positioning portion and the guide portion are guided and engaged in a direction perpendicular to the side of the substrate.

[0012] Furthermore, there are two guide parts, which are arranged opposite each other along the width direction of the groove. There are also two positioning parts, which are arranged opposite each other along the width direction of the adapter block.

[0013] Furthermore, the guide part is a V-shaped guide groove, the opening of the V-shaped guide groove is arranged facing the inside of the groove, and the positioning part is a semi-cylindrical protrusion, the height direction of the semi-cylindrical protrusion is arranged along the direction perpendicular to the side of the substrate.

[0014] Furthermore, the cantilever section is in the shape of a right trapezoid, and the side of the cantilever section near the fixing base is provided with an inclined side surface, and the inclined side surface is inclined towards the side near the fixing base in the side direction away from the base plate.

[0015] Furthermore, the lens structure has two lenses, namely a first lens and a second lens. The first lens is installed on the end face of the overhanging section corresponding to the silicon photonic chip, and the second lens is installed on the side of the silicon photonic chip away from the substrate. The first lens and the second lens are arranged vertically at intervals.

[0016] Furthermore, the fixing seat has flanges on both sides corresponding to the width direction of the groove, and the fastener is a U-shaped fastener with inward flanges on both sides. The flanges and the inward flanges are engaged in a stop-fitting manner along the side direction perpendicular to the substrate.

[0017] Furthermore, the U-shaped fastener is made by bending an elastic sheet, and the sidewalls of the U-shaped fastener are clamped to the flange along the width direction of the groove.

[0018] Furthermore, the fixing base is made of glass, and the bottom surface of the groove is provided with a frosted surface with a roughness between 0.03mm and 0.1mm. The bottom surface of the limiting section facing the groove is also provided with a smooth surface, which fits against the frosted surface.

[0019] Furthermore, the adapter block has multiple optical fiber channels inside. The optical fiber channels are smoothly arranged from the limiting section to the cantilever section corresponding to the end face of the silicon photonic chip. The limiting section also has a stepped portion on the side away from the groove. The optical fiber array is bonded and fixed on the stepped portion, and multiple fiber cores of the optical fiber array are respectively inserted into the optical fiber channels.

[0020] Compared with the prior art, the optical engine packaging structure of the detachable fiber array of the present invention has the following advantages: the optical engine packaging structure of the detachable fiber array adopts a design of substrate, electrical chip, silicon photonic chip, mounting base, fiber array and adapter block. The electrical chip, silicon photonic chip and mounting base are all mounted on one side of the substrate. The electrical chip integrates Driver and TIA functions, and the silicon photonic chip integrates modulator, multiplexer, multiplexer and grating waveguide and other structures. The electrical chip and silicon photonic chip are both mounted on the substrate by flip-chip connection, thereby realizing the electrical connection between the electrical chip, silicon photonic chip and substrate.

[0021] Furthermore, a groove is provided on the side of the mounting base away from the substrate. An adapter block is installed at the end of the fiber array. The adapter block is detachably installed in the groove along a direction perpendicular to the side of the substrate. The adapter block includes a limiting section and a cantilever section. The limiting section of the adapter block forms a concave-convex fit with the groove of the mounting base, which allows the fiber array to be accurately and detachably installed on the mounting base. The groove serves to define the position of the adapter block and the fiber array. A fastener is detachably mounted on the side of the mounting base away from the substrate, simplifying the design of the installation structure. The fastener provides a tightening effect on the adapter block in a direction perpendicular to the side of the substrate, ensuring the stability and reliability of the fiber array installation position.

[0022] In addition, the cantilever section and the silicon photonic chip are arranged vertically opposite each other. A lens structure is also installed between the end face of the cantilever section corresponding to the silicon photonic chip and the silicon photonic chip. The lens structure is optically connected to both the fiber array and the silicon photonic chip. The lens structure forms a conductive optical path between the fiber array and the silicon photonic chip, ensuring that the silicon photonic chip can accurately send optical signals to the fiber array and effectively receive optical signals transmitted from the fiber array. This achieves both flexible installation and removal of the fiber array and high coupling precision between the fiber array and the silicon photonic chip during disassembly and replacement. Attached Figure Description

[0023] Figure 1This is a schematic diagram of the optical engine packaging structure of the detachable fiber array in the embodiment of the present invention applied to the optical module;

[0024] Figure 2 This is a three-dimensional schematic diagram of the optical engine packaging structure of the detachable fiber array in an embodiment of the present invention;

[0025] Figure 3 This is a disassembly diagram of the optical engine packaging structure of the detachable fiber array in an embodiment of the present invention;

[0026] Figure 4 This is an assembly diagram of the optical engine packaging structure of the detachable fiber array in an embodiment of the present invention;

[0027] In the figure: 1-substrate, 2-electrical chip, 3-silicon photonic chip, 30-lens structure, 31-first lens, 32-second lens, 4-fixed base, 40-groove, 41-guide part, 42-flange, 5-fiber array, 50-adapter block, 51-limiting section, 52-cantilever section, 53-positioning part, 54-step part, 6-fastener, 60-inner flange. Detailed Implementation

[0028] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0029] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0032] like Figures 1 to 4 As shown, an embodiment of the present invention provides a detachable fiber optic array optical engine packaging structure, including a substrate 1, an electrical chip 2, a silicon photonic chip 3, a mounting base 4, and a fiber optic array 5. The electrical chip 2, the silicon photonic chip 3, and the mounting base 4 are all mounted on one side of the substrate 1, and the electrical chip 2 and the silicon photonic chip 3 are electrically connected to the substrate 1 respectively. A groove 40 is provided on the side of the mounting base 4 away from the substrate 1, and an adapter block 50 is installed at the end of the fiber optic array 5. The adapter block 50 is detachably mounted in the groove 40 along a direction perpendicular to the side of the substrate 1.

[0033] The adapter block 50 includes a fixedly connected limiting section 51 and a cantilever section 52. The limiting section 51 is in concave-convex fit with the groove 40. The cantilever section 52 protrudes towards the side close to the silicon photonic chip 3. The cantilever section 52 and the silicon photonic chip 3 are arranged vertically opposite each other. A lens structure 30 is also installed between the end face of the cantilever section 52 and the silicon photonic chip 3. The lens structure 30 is optically connected to the fiber array 5 and the silicon photonic chip 3 respectively. A fastener 6 is detachably assembled on the side of the fixing base 4 away from the substrate 1. The fastener 6 is fastened to the adapter block 50 in a direction perpendicular to the side of the substrate 1.

[0034] The optical engine packaging structure of the detachable fiber array adopts a design of substrate 1, electrical chip 2, silicon photonic chip 3, mounting base 4, fiber array 5, and adapter block 50. Electrical chip 2, silicon photonic chip 3, and mounting base 4 are all mounted on one side of substrate 1. Electrical chip 2 integrates driver and TIA functions, while silicon photonic chip 3 integrates modulator, multiplexer, multiplexer, and grating waveguide structures. Electrical chip 2 and silicon photonic chip 3 are both mounted on substrate 1 via flip-chip connection, thereby realizing the electrical connection between electrical chip 2, silicon photonic chip 3 and substrate 1.

[0035] Furthermore, a groove 40 is provided on the side of the mounting base 4 away from the substrate 1. An adapter block 50 is installed at the end of the fiber array 5. The adapter block 50 is detachably installed in the groove 40 along a direction perpendicular to the side of the substrate 1. The adapter block 50 includes a limiting section 51 and a cantilever section 52. The limiting section 51 of the adapter block 50 forms a concave-convex fit with the groove 40 of the mounting base 4, which allows the fiber array 5 to be accurately and detachably installed on the mounting base 4. The groove 40 serves to limit the position of the adapter block 50 and the fiber array 5. A fastener 6 is detachably mounted on the side of the mounting base 4 away from the substrate 1, which simplifies the design of the installation structure. The fastener 6 can provide a fastening effect on the adapter block 50 in a direction perpendicular to the side of the substrate 1, ensuring the stability and reliability of the installation position of the fiber array 5.

[0036] In addition, the cantilever section 52 and the silicon photonic chip 3 are arranged vertically opposite each other. A lens structure 30 is also installed between the end face of the cantilever section 52 and the silicon photonic chip 3. The lens structure 30 is optically connected to the fiber array 5 and the silicon photonic chip 3. The lens structure 30 forms a conductive optical path between the fiber array 5 and the silicon photonic chip 3, ensuring that the silicon photonic chip 3 can accurately send optical signals to the fiber array 5 and effectively receive optical signals transmitted from the fiber array 5. This achieves the goal of high coupling accuracy between the fiber array 5 and the silicon photonic chip 3 while allowing for flexible disassembly and installation of the fiber array 5.

[0037] In this embodiment, the groove 40 is an elongated groove, extending along its length towards the silicon photonic chip 3. A guide portion 41 is provided on the sidewall of the groove 40, and a positioning portion 53 is provided on the outer side of the limiting section 51. The positioning portion 53 and the guide portion 41 are guided and engaged in a direction perpendicular to the side surface of the substrate 1. Specifically, two guide portions 41 are provided, arranged opposite each other along the width direction of the groove 40. Two positioning portions 53 are also provided, arranged opposite each other along the width direction of the adapter block 50. By utilizing the guiding portion 41 of the groove 40 and the positioning portion 53 of the limiting section 51 for guided engagement, the accuracy of the disassembly and installation positions of the adapter block 50 and the fiber array 5 is ensured.

[0038] As a further preferred embodiment, the guide part 41 is a V-shaped guide groove, with the opening of the V-shaped guide groove facing the inside of the groove 40, and the positioning part 53 is a semi-cylindrical protrusion, with the height direction of the semi-cylindrical protrusion extending along a direction perpendicular to the side of the substrate 1. The V-shaped guide groove and the semi-cylindrical protrusion not only provide a good guiding fit, but the V-shaped guide groove can also effectively accommodate deviations in shape.

[0039] The cantilever section 52 is a right-angled trapezoid with a sloping side near the mounting base 4. This sloping side is inclined towards the mounting base 4 from the side away from the substrate 1. The right-angled trapezoidal design of the cantilever section 52 shortens the vertical distance between the end face of the silicon photonic chip 2 and the silicon photonic chip 3, improving the transmission efficiency and accuracy of the optical signal. Furthermore, the sloping side of the cantilever section 52 avoids interference with the mounting base 5.

[0040] In this embodiment, the lens structure 30 has two lenses: a first lens 31 and a second lens 32. The first lens 31 is mounted on the end face of the cantilever section 52 corresponding to the silicon photonic chip 3, and the second lens 32 is mounted on the side of the silicon photonic chip 3 away from the substrate 1. The first lens 31 and the second lens 32 are arranged vertically at intervals. The first lens 31 and the second lens 32 are arranged between the fiber array 5 and the silicon photonic chip 3, which collimates and focuses the optical signal, ensuring that the new fiber array 5 can form an accurate optical signal conduction and transmission relationship with the silicon photonic chip 3 after disassembly and replacement.

[0041] In this embodiment, the mounting base 4 has flanges 42 on both sides of the groove 40 in the width direction. The fastener 6 is a U-shaped fastener 6, with inward flanges 60 on both sides. The flanges 42 and the inward flanges 60 are engaged in a stop-fitting manner along the side direction perpendicular to the substrate 1. It should be noted that the U-shaped fastener 6 is made by bending an elastic sheet, and the sidewalls of the U-shaped fastener 6 are clamped to the flanges 42 along the width direction of the groove 40. During disassembly, the U-shaped fastener 6 can be pried open to disengage the inward flanges 60 from the flanges 42 of the mounting base 4, allowing the U-shaped fastener 6 and the fiber array 5 to be easily removed. After replacing and installing the new fiber array 5, the U-shaped fastener 6 is then fastened onto the flanges 42 of the mounting base 4, thereby reliably defining the installation position of the fiber array 5.

[0042] In this embodiment, the fixing base 4 is made of glass. The bottom surface of the groove 40 is provided with a frosted surface, the roughness of which is between 0.03mm and 0.1mm. The bottom surface of the limiting section 51 facing the groove 40 is also provided with a smooth surface, which fits into the frosted surface. The roughness of the frosted surface of the groove 40 is 0.03mm to 0.1mm, which can accommodate small particle impurities and avoid misfitting due to impurities. Furthermore, the fit between the frosted surface and the smooth surface of the limiting section 51 is higher, improving the installation accuracy of the fiber optic array 5.

[0043] In addition, the adapter block 50 has multiple fiber optic channels inside. The fiber optic channels are smoothly arranged from the limiting section 51 to the cantilever section 52 corresponding to the end face of the silicon photonic chip 3. The side of the limiting section 51 away from the groove 40 also has a stepped portion 54. The fiber optic array 5 is bonded and fixed to the stepped portion 54, and the multiple fiber cores of the fiber optic array 5 are respectively inserted into the fiber optic channels. Because the adapter block 50 has fiber optic channels inside, it ensures that the fiber optic array 5 forms a smooth transition from the stepped portion 54 of the adapter block 50 to the first lens 31 on the end face, improving the transmission stability of the optical signal.

[0044] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A detachable fiber optic array optical engine packaging structure, characterized in that, The device includes a substrate, an electrical chip, a silicon photonic chip, a mounting base, and an optical fiber array. The electrical chip, the silicon photonic chip, and the mounting base are all mounted on one side of the substrate, and the electrical chip and the silicon photonic chip are electrically connected to the substrate. The mounting base has a groove on its side away from the substrate. An adapter block is installed at the end of the fiber array. The adapter block is detachably installed in the groove along a direction perpendicular to the side of the substrate. The adapter block includes a fixedly connected limiting section and a cantilever section. The limiting section is in concave-convex fit with the groove. The cantilever section protrudes towards the side closest to the silicon photonic chip. The cantilever section and the silicon photonic chip are arranged vertically opposite each other. A lens structure is also installed between the end face of the cantilever section corresponding to the silicon photonic chip and the silicon photonic chip. The lens structure is optically connected to the fiber array and the silicon photonic chip respectively. The fixing base is detachably fitted with a fastener on the side away from the substrate, and the fastener is fastened to the adapter block in a direction perpendicular to the side of the substrate. The groove is a long through groove, and the length of the groove extends toward the direction close to the silicon photonic chip. A guide part is provided on the side wall of the groove, and a positioning part is also provided on the outer side of the limiting section. The positioning part and the guide part are guided and cooperated in a direction perpendicular to the side of the substrate. The guide part is provided in two places, and the two guide parts are arranged opposite each other along the width direction of the groove. The positioning part is also provided in two places, and the two positioning parts are arranged opposite each other along the width direction of the adapter block. The guide part is a V-shaped guide groove, the opening of the V-shaped guide groove is arranged facing the inside of the groove, and the positioning part is a semi-cylindrical protrusion, the height direction of the semi-cylindrical protrusion is arranged along the direction perpendicular to the side of the substrate. The fixing base is made of glass. The bottom surface of the groove is provided with a frosted surface with a roughness between 0.03mm and 0.1mm. The bottom surface of the limiting section facing the groove is also provided with a smooth surface, which fits against the frosted surface.

2. The optical engine packaging structure for the detachable fiber optic array according to claim 1, characterized in that, The cantilever section is in the shape of a right trapezoid, and the side of the cantilever section near the fixing base is provided with an inclined side, and the inclined side is inclined towards the side near the fixing base in the side direction away from the base plate.

3. The optical engine packaging structure for the detachable fiber optic array according to claim 1, characterized in that, The lens structure has two lenses, namely a first lens and a second lens. The first lens is installed on the end face of the overhanging section corresponding to the silicon photonic chip, and the second lens is installed on the side of the silicon photonic chip away from the substrate. The first lens and the second lens are arranged vertically at intervals.

4. The optical engine packaging structure for the detachable fiber optic array according to claim 1, characterized in that, The fixing seat has flanges on both sides corresponding to the width direction of the groove. The fastener is a U-shaped fastener with inward flanges on both sides. The flanges and the inward flanges are engaged in a stop-fitting manner along the side direction perpendicular to the substrate.

5. The optical engine packaging structure for the detachable fiber optic array according to claim 4, characterized in that, The U-shaped fastener is made by bending an elastic sheet, and the sidewalls of the U-shaped fastener are clamped to the flange along the width direction of the groove.

6. The optical engine packaging structure for the detachable fiber optic array according to claim 1, characterized in that, The adapter block has multiple optical fiber channels inside. The optical fiber channels are smoothly arranged from the limiting section to the cantilever section corresponding to the end face of the silicon photonic chip. The limiting section also has a stepped portion on the side away from the groove. The optical fiber array is bonded and fixed on the stepped portion, and multiple fiber cores of the optical fiber array are respectively inserted into the optical fiber channels.

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