Display panel and preparation method thereof

Abstract

The application provides a display panel and a preparation method thereof. The display panel comprises a substrate, an isolation structure, a light-emitting layer and a first encapsulation layer. The isolation structure is arranged on one side of the substrate and forms a plurality of isolated openings. The light-emitting layer comprises a light-emitting unit in each isolated opening. The first encapsulation layer comprises an encapsulation part on the side of each light-emitting unit away from the substrate. The encapsulation part comprises at least a first sub-part and a second sub-part. The first sub-part covers the light-emitting unit, and the second sub-part covers the first sub-part. The densities of the first sub-part and the second sub-part are different. The densities of the first sub-part of each encapsulation part are different from each other. By designing the encapsulation structure with different densities of the two layers, the reliability of the encapsulation layer is improved, the problem of pixel dark spots is solved, and the display effect of the display panel is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as low power consumption, high brightness, wide viewing angle, high contrast, and the ability to realize flexible displays.

[0003] However, current display panels are prone to pixel dark spots during use. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel and its manufacturing method to solve the problem of dark pixels that easily appear in current display panels during use.

[0005] To achieve the above objectives, the present invention provides a display panel comprising:

[0006] substrate

[0007] An isolation structure is disposed on one side of the substrate and encloses multiple isolation openings;

[0008] The light-emitting layer includes light-emitting units located at each of the said isolation openings;

[0009] The first encapsulation layer includes an encapsulation portion located on the side of each light-emitting unit facing away from the substrate. The encapsulation portion includes at least a first sub-part and a second sub-part. The first sub-part covers the light-emitting unit, and the second sub-part covers the first sub-part. The first sub-part and the second sub-part have different densities, and the densities of the first sub-parts of each encapsulation portion are at least two different from each other.

[0010] In one embodiment, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening, wherein the first isolation opening, the second isolation opening, and the third isolation opening respectively define light-emitting units with different emitted light colors, and the wavelengths of the emitted light from the light-emitting units defined by the first isolation opening, the second isolation opening, and the third isolation opening respectively increase sequentially.

[0011] Preferably, the light-emitting unit includes a first light-emitting unit located in the first isolation opening, a second light-emitting unit located in the second isolation opening, and a third light-emitting unit located in the third isolation opening;

[0012] Preferably, the packaging portion includes:

[0013] The first encapsulation portion is located on the side of the first light-emitting unit away from the substrate, and the density of the first sub-part is less than the density of the second sub-part;

[0014] The second encapsulation portion is located on the side of the second light-emitting unit away from the substrate, and the density of the first sub-part is less than the density of the second sub-part;

[0015] The third encapsulation part is located on the side of the second light-emitting unit away from the substrate, and the density of the first sub-part is greater than the density of the second sub-part.

[0016] In one embodiment, the encapsulation portion further includes a third sub-portion that covers the second sub-portion, and the third sub-portions of each encapsulation portion have the same density;

[0017] Preferably, the density of the third sub-part in the first encapsulation portion is the same as or similar to the density of the second sub-part;

[0018] The density of the third sub-part in the second encapsulation part is the same as or similar to the density of the second sub-part;

[0019] The density of the third sub-part in the third encapsulation part is the same as or similar to the density of the first sub-part.

[0020] In one embodiment, the material of the encapsulation portion includes inorganic materials;

[0021] Preferably, the inorganic material includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

[0022] In one embodiment, the display panel further includes:

[0023] The first electrode is disposed between the substrate and the light-emitting unit;

[0024] A pixel defining layer is disposed on the substrate and covers the first electrode;

[0025] A pixel opening extends through the pixel defining layer, and the light-emitting unit covers the pixel opening;

[0026] The isolation structure is disposed on the side of the pixel limiting layer opposite to the substrate, and the orthographic projection of the isolation structure on the substrate does not coincide with the orthographic projection of the pixel opening on the substrate.

[0027] In one embodiment, the isolation structure includes a first isolation portion and a second isolation portion disposed on the side of the first isolation portion away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0028] Preferably, the width of the second isolation portion is smaller than the width of the first isolation portion between two adjacent light-emitting units;

[0029] Preferably, the material of the first isolation portion includes a conductive material;

[0030] Preferably, the light-emitting unit includes a light-emitting functional layer and a second electrode disposed on the side of the light-emitting functional layer away from the substrate, the second electrode overlapping with the first isolation portion.

[0031] The present invention also provides a method for manufacturing a display panel, the method comprising:

[0032] Provide substrate

[0033] An isolation structure is prepared on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings;

[0034] A light-emitting layer is formed on one side of the substrate, comprising:

[0035] Light-emitting units are formed in each of the aforementioned isolation openings;

[0036] A first encapsulation layer is prepared on the side of each of the light-emitting units facing away from the substrate, comprising:

[0037] An encapsulation portion is formed on the side of each light-emitting unit away from the substrate. The encapsulation portion includes at least a first sub-part and a second sub-part. The first sub-part covers the light-emitting unit, and the second sub-part covers the first sub-part. The first sub-part and the second sub-part have different densities, and the densities of the first sub-parts of each encapsulation portion are at least two different from each other.

[0038] In one embodiment, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening, wherein the first isolation opening, the second isolation opening, and the third isolation opening respectively define light-emitting units with different emitted light colors;

[0039] The step of forming light-emitting units in each of the said isolation openings includes:

[0040] A first light-emitting unit is formed in the first isolation opening;

[0041] A second light-emitting unit is formed in the second isolation opening;

[0042] A third light-emitting unit is formed in the third isolation opening;

[0043] The step of forming an encapsulation portion on one side of the substrate of each of the light-emitting units includes:

[0044] A first encapsulation portion is formed on the side of the first light-emitting unit away from the substrate, which includes:

[0045] A first sub-part is formed on the side of the first light-emitting unit that is away from the substrate;

[0046] A second sub-part is formed on the side of the first sub-part that is away from the substrate;

[0047] The density of the first sub-part is less than the density of the second sub-part;

[0048] A second encapsulation portion is formed on the side of the second light-emitting unit away from the substrate, which includes:

[0049] A first sub-part is formed on the side of the second light-emitting unit away from the substrate;

[0050] A second sub-part is formed on the side of the first sub-part that is away from the substrate;

[0051] The density of the first sub-part is less than the density of the second sub-part;

[0052] A third encapsulation portion is formed on the side of the third light-emitting unit away from the substrate, comprising:

[0053] A first sub-part is formed on the side of the third light-emitting unit that is away from the substrate;

[0054] A second sub-part is formed on the side of the first sub-part that is away from the substrate;

[0055] The density of the first sub-part is greater than the density of the second sub-part.

[0056] In one embodiment, the step of forming a first encapsulation portion on the side of the first light-emitting unit away from the substrate further includes:

[0057] A third sub-part is formed on the side of the second sub-part that faces away from the substrate; wherein the density of the third sub-part is the same as or similar to the density of the second sub-part;

[0058] The step of forming a second encapsulation portion on the side of the second light-emitting unit away from the substrate further includes;

[0059] A third sub-part is formed on the side of the second sub-part that faces away from the substrate; wherein the density of the third sub-part is the same as or similar to the density of the second sub-part;

[0060] The step of forming a third encapsulation portion on the side of the third light-emitting unit away from the substrate further includes;

[0061] A third sub-part is formed on the side of the second sub-part away from the substrate; wherein the density of the third sub-part is the same as or similar to the density of the first sub-part.

[0062] In one embodiment, the step of providing the substrate further includes forming a first electrode on one side of the substrate;

[0063] Prior to the step of fabricating an isolation structure on one side of the substrate, the method further includes: forming a pixel defining layer on the substrate, the pixel defining layer covering the first electrode; the pixel defining layer having a plurality of pixel openings.

[0064] The advantages of this invention are: In the display panel and its manufacturing method provided in this invention, by designing a double-layer encapsulation structure with different densities, the encapsulation reliability is improved while increasing production equipment without increasing production costs. This solves the problem of pixel dark spots caused by material residue and other phenomena in related display technologies, and improves the display effect of the display panel. Attached Figure Description

[0065] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0066] Figure 1 This is a schematic diagram of the layered structure of the display panel in an embodiment of the present invention. Figure 1 ;

[0067] Figure 2 This is a schematic diagram of the layered structure of the display panel in an embodiment of the present invention. Figure 2

[0068] Figure 3 This is a schematic diagram of the layered structure of the light-emitting device in an embodiment of the present invention;

[0069] Figure 4 This is a schematic flowchart of the display panel manufacturing method in an embodiment of the present invention;

[0070] Figure 5 This is a schematic diagram of the layered structure of the display panel in step S50 of this embodiment of the invention. Figure 1 ;

[0071] Figure 6 This is a schematic diagram of the layered structure of the display panel in step S50 of this embodiment of the invention. Figure 1 ;

[0072] Figure 7 This is a schematic diagram of the layered structure of the display panel in step S60 of this embodiment of the invention. Figure 1 ;

[0073] Figure 8 This is a schematic diagram of the layered structure of the display panel in step S60 of this embodiment of the invention. Figure 2 ;

[0074] Figure 9This is a schematic diagram of the layered structure of the display panel in step S70 of this embodiment of the invention. Figure 1 ;

[0075] Figure 10 This is a schematic diagram of the layered structure of the display panel in step S70 of this embodiment of the invention. Figure 2 ;

[0076] The components in the diagram are shown below:

[0077] Display panel 1; First light-emitting unit 1B;

[0078] Second light-emitting unit 1G; Third light-emitting unit 1R;

[0079] Substrate 10; First electrode 20;

[0080] Pixel confinement layer 30; Pixel opening 31;

[0081] Isolation structure 40; First isolation section 41;

[0082] Second isolation section 42; Light-emitting functional layer 50;

[0083] Hole-functional layer 51; Emissive layer 52;

[0084] Electronic functional layer 53; Second electrode 60;

[0085] Encapsulation layer 70; First encapsulation section 70B;

[0086] Second packaging section 70G; Third packaging section 70R;

[0087] First Subsection 71; First Subsection 72

[0088] First photolithography layer 81; Second photolithography layer 82;

[0089] Third photolithography layer 83. Detailed Implementation

[0090] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0091] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0092] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0093] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0094] In related display technologies, to achieve high resolution and color in OLED (Organic Light-Emitting Diode) and to better address issues such as low resolution of the OLED cathode film and low device yield, a cathode isolation structure has been introduced. This involves fabricating an isolation structure on the driving layer before depositing the organic thin film and metal cathode, instead of using a metal mask during device fabrication. This isolation structure separates different pixels, creating a pixel array. However, the inventors discovered in actual production that some of the high-density materials used in current packaging processes tend to creep up the sidewalls of the isolation structure, easily leaving residues and resulting in dark spots on the pixels, thus affecting the display panel's performance.

[0095] Based on the technical problems discovered in the aforementioned related display technologies, this embodiment of the invention provides a display panel 1. The display panel 1 has multiple first light-emitting units 1R, multiple second light-emitting units 1G, and multiple third light-emitting units 1B distributed within it. Each light-emitting unit has a pixel circuit and a light-emitting functional layer 50 driven by the pixel circuit. The pixel circuit includes electronic devices such as pixel switches, driving transistors, and capacitors. Different light-emitting units can emit different colors of light under the drive of their corresponding pixel circuits. For example, the first light-emitting unit 1B can emit blue light, the second light-emitting unit 1G can emit green light, and the third light-emitting unit 1R can emit red light. Through the combination of the first light-emitting units 1B, the second light-emitting units 1G, and the third light-emitting units 1R, the display panel 1 can achieve color display.

[0096] like Figure 1 As shown, the display panel 1 includes a substrate 10, a first electrode layer 20, a pixel defining layer 30, an isolation structure 40, a light-emitting unit, and an encapsulation layer 70.

[0097] The substrate 10 is an array substrate, which includes multiple thin-film transistors arranged in an array. The pixel switches and driving transistors in the pixel circuit are all switching elements composed of thin-film transistors. At the same time, the substrate 10 has a variety of signal traces, such as data signal lines, scan signal lines, power signal lines, reset signal lines, etc. Different signal traces are electrically connected to the corresponding thin-film transistors. The thin-film transistors are turned on under the display signals transmitted by the corresponding signal traces, thereby conducting the corresponding pixel circuits. Under the drive of the pixel circuits, the corresponding light-emitting functional layer 50 is lit, causing the corresponding sub-pixels to emit light, thereby realizing the display of the image.

[0098] Multiple first electrodes 20 are disposed on one side of the substrate 10, and each light-emitting unit has at least one first electrode 20. Each first electrode 20 is electrically connected to at least one thin-film transistor in the substrate 10. A pixel defining layer 30 is disposed on the substrate 10 and covers the first electrodes 20. The pixel defining layer 30 has multiple pixel openings 31, and each sub-pixel has at least one pixel opening 31. The pixel openings 31 penetrate the pixel defining layer 30, causing a portion of the surface of the first electrode 20 to be exposed in the corresponding pixel opening 31. A light-emitting functional layer 50 is disposed on the side of the pixel defining layer 30 and the first electrodes 20 facing away from the substrate 10 and covers the exposed surface of the first electrode 20 in the corresponding pixel opening 31, thereby electrically connecting to the pixel circuit through the corresponding first electrode 20. An isolation structure 40 is disposed on the side of the pixel limiting layer 30 facing away from the substrate 10. The isolation structure 40 encloses and forms a plurality of isolation openings 31. The light-emitting unit is at least partially located within the isolation openings 31. The light-emitting unit includes a light-emitting functional layer 50 and a second electrode 60 stacked sequentially. The first electrode 60 is disposed on the side of the light-emitting functional layer 50 facing away from the substrate 10. Each light-emitting unit has at least one Dongling Electronic Control. Each second electrode 60 is electrically connected to the isolation structure 40. The isolation structure 40 can transmit power signals (e.g., low-level power limit signal VSS) to the second electrode 60 while isolating adjacent light-emitting functional layers 50 and second electrodes 60. An encapsulation layer 70 is disposed on the side of the light-emitting functional layer 50 and the second electrode 60 facing away from the substrate 10 and extends from the surface of the second electrode 60 to the surface of the isolation structure 40 facing away from the substrate 10. The orthographic projection of the isolation structure 40 on the substrate 10 does not coincide with the orthographic projection of the pixel opening 31 on the substrate 10, thereby preventing a short circuit between the first electrode 20 and the second electrode 60 caused by the isolation structure 40 blocking the exposed surface of the first electrode 21 in the pixel opening 31.

[0099] Specifically, the isolation structure 40 includes a first isolation portion 41 and a second isolation portion 42. The first isolation portion 41 is disposed on the surface of the pixel defining layer 30 facing away from the substrate 10, and the second isolation portion 42 is disposed on the surface of the first isolation portion 41 facing away from the substrate 10. The material used to fabricate the first isolation portion 41 includes conductive materials, such as highly conductive metals like copper, aluminum, and silver. The material used to fabricate the second isolation portion 42 includes insulating materials or metallic materials, such as silicon oxide, oxynitride, or titanium. In the second electrode layer 60, the second electrode 61 covers the corresponding light-emitting functional layer 50 and extends from the surface of the light-emitting functional layer 50 facing away from the substrate 10 to the sidewall of the first isolation portion 41, thereby achieving electrical connection between the isolation structure 40 and the second electrode 60 through overlap with the first isolation portion 41. Between two adjacent light-emitting functional layers 50, the width of the first isolation portion 41 is smaller than the width of the second isolation portion 42, and the orthographic projection of the second isolation portion 42 on the substrate 10 can completely cover the orthographic projection of the first isolation portion 41 on the substrate 10. This ensures that the second isolation portion 42 not only blocks the first isolation portion 41 and prevents the connection between the two adjacent light-emitting functional layers 50, but also prevents the light-emitting functional layer 50 from contacting the first isolation portion 41, thus ensuring that the orthographic projection of the first isolation portion 41 on the substrate 10 does not coincide with the orthographic projection of the light-emitting functional layer 50 on the substrate 10. When fabricating the light-emitting functional layer 50 and the second electrode 60, the evaporation angle of the evaporation head can be adjusted to make the evaporation area of ​​the second electrode 60 larger than the evaporation area of ​​the light-emitting functional layer 50, thereby ensuring that the second electrode 60 can overlap with the first isolation portion 41 while covering the light-emitting functional layer 50. In addition, the cross-sectional profile of the first isolation portion 41 located between two adjacent light-emitting functional layers 50 in the display surface stacking direction is trapezoidal, and the width of the first isolation portion 41 near the second isolation portion 42 is smaller than the width of the first isolation portion 41 near the substrate 10, thereby facilitating the climbing of the second electrode 60 and reducing the difficulty of overlapping between the second electrode 60 and the first isolation portion 41.

[0100] like Figure 3 As shown, the light-emitting functional layer 50 includes a hole functional layer 51, an electron functional layer 53, and a light-emitting layer 52. The hole functional layer 51 and the electron functional layer 53 may contain multiple functional layers such as a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer. After the first electrode 21 and the second electrode 60 are turned on, electrons and holes are respectively transported into the light-emitting functional layer 50. After passing through the electron functional layer 53 and the hole functional layer 51, the electrons and holes combine in the light-emitting layer 52 to form excitons, thereby converting electrical energy into light energy, causing the light-emitting functional layer 50 to emit light, thus achieving a light-emitting display.

[0101] Specifically, the isolation opening 31 includes a first isolation opening 31, a second isolation opening 31, and a third isolation opening 31. The first isolation opening 31, the second isolation opening 31, and the third isolation opening 31 respectively define light-emitting units with different emitted light colors. The wavelengths of the emitted light from the light-emitting units defined by the second isolation opening 31 and the third isolation opening 31 increase sequentially. A first light-emitting unit 1B is disposed in the first isolation opening 31, a second light-emitting unit 1G is disposed in the second isolation opening 31, and a third light-emitting unit 1R is disposed in the third isolation opening 31. The wavelengths of the emitted light from the first light-emitting unit 1B, the second light-emitting unit 1G, and the third light-emitting unit 1R increase sequentially. In order to enable different light-emitting units to emit different colors of light, the light-emitting layer 52 of different sub-light-emitting units 50 is made of different materials. For example, the light-emitting layer 52 in the first light-emitting unit 1B contains a fluorescent material that can emit blue light, the light-emitting layer 52 in the second light-emitting unit 1G contains a fluorescent material that can emit green light, and the light-emitting layer 52 in the third light-emitting unit 1R contains a fluorescent material that can emit red light.

[0102] Furthermore, such as Figure 1 As shown, the first encapsulation layer 70 includes an encapsulation portion located on the side of each first electrode away from the substrate. The encapsulation portion includes an inorganic material, which includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide. The encapsulation portion includes at least a first sub-part 71 and a second sub-part 72. The first sub-part 71 covers the light-emitting unit, and the second sub-part 72 covers the first sub-part 71. The first sub-part 71 and the second sub-part 72 have different densities, and the densities of the first sub-parts 71 of each encapsulation portion are at least two different from each other. Specifically, the encapsulation portion includes a first encapsulation portion 70B, a second encapsulation portion 70G, and a third encapsulation portion 70R. The first encapsulation portion 70B is located on the side of the first light-emitting unit 1B away from the substrate 10, and the density of the first sub-part 71B is less than the density of the second sub-part 72B. The second encapsulation portion 70G is located on the side of the second light-emitting unit 1G away from the substrate 10, and the density of the first sub-part 71G is less than the density of the second sub-part 72G. The third encapsulation portion 70R is located on the side of the third light-emitting unit 1R away from the substrate 10, and the density of the first sub-part 71R is greater than the density of the second sub-part 72R.

[0103] Since the materials of the light-emitting functional layer 50 in different light-emitting units are different, the light-emitting functional layer 50, the second electrode 60 and the encapsulation layer 70 in different light-emitting units are prepared in batches. In the embodiment of the present invention, the light-emitting functional layer 50, the second electrode 60 and the encapsulation layer 70 in the first light-emitting unit 1B can be prepared first, then the light-emitting functional layer 50, the second electrode 60 and the encapsulation layer 70 in the second light-emitting unit 1G can be prepared, and finally the light-emitting functional layer 50, the second electrode 60 and the encapsulation layer 70 in the third light-emitting unit 1R can be prepared.

[0104] The first encapsulation portion 70B and the second encapsulation portion 70G have the same structure. In both cases, the second sub-part 72 has a higher density than the first sub-part 71. Therefore, the etching rate of the second sub-part 72 is lower than that of the first sub-part 71. This can protect the encapsulation layer in the first light-emitting unit 1B and the second light-emitting unit 1G from being over-etched by the etching process used in subsequent processes. At the same time, it can also prevent the high-density encapsulation material from leaving residues on the sidewall of the isolation structure 40, thereby solving the problem of pixel dark spots and improving the display effect of the display panel 1. In the third encapsulation portion 70R, the first sub-part 71 has a higher density than the second sub-part 72, which can improve the encapsulation reliability of the encapsulation layer.

[0105] Preferably, such as Figure 2 As shown, in order to further improve the packaging reliability of the first encapsulation layer 70, the first encapsulation layer 70 can be configured as a three-layer structure, that is, the first encapsulation layer 70 includes a first sub-part 71, a second sub-part 72 and a third sub-part 73, wherein the first sub-part 71 covers the light-emitting unit, the second sub-part 72 covers the first sub-part 71 and the third sub-part 73 covers the second sub-part 72. Specifically, in the first isolation opening 31 and the second isolation opening 31, the density of the third sub-part 73 is the same as or similar to the density of the second sub-part, that is, the third sub-part 73 and the second sub-part 72 are both high-density layers. In the third isolation opening 31, the density of the third sub-part 73 is the same as or similar to the density of the first sub-part, and the third sub-part 73 and the first sub-part 71 are both high-density layers.

[0106] This invention also provides a method for manufacturing a display panel 1, used to manufacture the display panel 1 as described above. The process of this method for manufacturing the display panel 1 is as follows: Figure 4 As shown, it includes steps S10-S60.

[0107] Step S10) Fabrication of substrate 10: A substrate 10 containing multiple thin-film transistors and signal traces is formed by an array process.

[0108] Step S20) A plurality of first electrodes are prepared on one side of the substrate 10: at least one layer of conductive material is deposited on the surface of the substrate 10 and the first conductive material is patterned to form a plurality of first electrodes 20.

[0109] Step S30) A pixel defining layer 30 is prepared on one side of the substrate 10: an organic material covering the first electrode layer 20 is deposited on a layer of the substrate 10 to form a pixel defining layer 30; the pixel defining layer 30 is patterned to form a pixel opening 31 in the pixel defining layer 30.

[0110] Step S40) An isolation structure 40 is prepared on one side of the pixel defining layer 30: a conductive material is deposited on the surface of the pixel defining layer 30 away from the substrate 10 to form a support layer; an insulating material or a low conductivity metal is deposited on the surface of the support layer away from the substrate 10 to form a barrier layer; the second isolation portion 42 and the support layer are patterned in sequence to form the first isolation portion 41 and the second isolation portion 42.

[0111] Step S50) A first light-emitting unit 1B is prepared in the first isolation opening 31, and a first encapsulation portion 70B is prepared on one side of the first light-emitting unit 1B:

[0112] Organic light-emitting material is deposited in all the isolation openings 31 to form a light-emitting functional layer 50; a conductive material is deposited on the side of the light-emitting functional layer 50 facing away from the substrate 10 to form a second electrode 60; an inorganic material is deposited on the side of the second electrode 60 facing away from the substrate 10 to form a first sub-part 71B; an inorganic material with a higher density than the first sub-part is deposited on the side of the first sub-part facing away from the substrate 10 to form a second sub-part 72B; a photoresist layer is coated on the surface of the second sub-part facing away from the substrate 10; the photoresist outside the first isolation openings 31 is removed by an etching process, leaving the photoresist in the first isolation openings 31 to form a first photolithography layer 81 protecting the first light-emitting unit 1B; according to the pattern of the first photolithography layer, the second sub-part 72, the first sub-part 71, the second electrode 60, and the light-emitting functional layer 50 not protected by the first photolithography layer are sequentially removed by an etching process to form a first photolithography layer 81 protecting the first light-emitting unit 1B. Figure 5 The panel structure shown; remove the first photolithography layer 81.

[0113] Furthermore, when the packaging section has a three-layer structure, an inorganic material with the same or similar density as the second sub-section 72B needs to be deposited on the side of the second sub-section 72B facing away from the substrate 10 to form the third sub-section 73B. A layer of photoresist is coated on the surface of the third sub-section facing away from the substrate 10. The photoresist outside the first isolation opening 31 is removed by an etching process, while the photoresist in the first isolation opening 31 is retained to form a first photolithography layer protecting the first light-emitting unit 1B. According to the pattern of the first photolithography layer 81, the third sub-section 73, the second sub-section 72B, the first sub-section 71, the second electrode 60, and the light-emitting functional layer 50 that are not protected by the first photolithography layer are removed sequentially by an etching process to form a structure as shown in the figure. Figure 6 The panel structure shown; remove the first photolithography layer 81.

[0114] (Step S60) A second light-emitting unit 1G is prepared in the second isolation opening 31, and a second encapsulation portion 70G is prepared on one side of the second light-emitting unit 1G:

[0115] Organic light-emitting material is deposited in all the isolation openings 31 to form a light-emitting functional layer 50; a conductive material is deposited on the side of the light-emitting functional layer 50 facing away from the substrate 10 to form a second electrode 60; an inorganic material is deposited on the side of the second electrode 60 facing away from the substrate 10 to form a first sub-part 71G; an inorganic material with a higher density than the first sub-part is deposited on the side of the first sub-part facing away from the substrate 10 to form a second sub-part 72G; a photoresist layer is coated on the surface of the second sub-part facing away from the substrate 10; the photoresist outside the second isolation openings 31 is removed by an etching process, leaving the photoresist in the second isolation openings 31 to form a second photolithography layer 82 protecting the second light-emitting unit 1G; according to the pattern of the second photolithography layer 82, the second sub-part 72, the first sub-part 71, the second electrode 60, and the light-emitting functional layer 50 not protected by the second photolithography layer are sequentially removed by an etching process to form a second photolithography layer 82 protecting the second light-emitting unit 1G; according to the pattern of the second photolithography layer 82, the second sub-part 72, the first sub-part 71, the second electrode 60, and the light-emitting functional layer 50 are sequentially removed by an etching process to form a second sub-part 72, the first sub-part 71, the second electrode 60, and the light-emitting functional layer 50 protected by the second photolithography layer 82. Figure 7 The panel structure shown; remove the second photolithography layer 82.

[0116] Furthermore, when the packaging section has a three-layer structure, an inorganic material with the same or similar density as the second sub-section 72B needs to be deposited on the side of the second sub-section facing away from the substrate 10 to form the third sub-section 73B. A layer of photoresist is coated on the surface of the third sub-section facing away from the substrate 10. The photoresist outside the first isolation opening 31 is removed by an etching process, while the photoresist in the first isolation opening 31 is retained to form a second photolithography layer protecting the second light-emitting unit 1B. According to the pattern of the second photolithography layer, the third sub-section 73, the second sub-section 72, the first sub-section 71, the second electrode 60, and the light-emitting functional layer 50 that are not protected by the second photolithography layer are removed sequentially by an etching process to form a structure as shown in the figure. Figure 8 The panel structure shown; remove the second photolithography layer 82.

[0117] When removing the second sub-part 71, the first sub-part 72, the third sub-part 73, the second electrode layer 60, and the light-emitting functional layer 50 other than the second light-emitting unit 1G, the etching process used to prepare the second light-emitting unit 1G in step S60 can be controlled to prevent the etching process in step S50 from affecting the film layer already prepared in the first light-emitting unit 1B.

[0118] Step S70) A third light-emitting unit 1R is fabricated in the third isolation opening 31, and a third encapsulation portion 70R is fabricated on one side of the third light-emitting unit 1R:

[0119] Organic light-emitting material is deposited in all the isolation openings 31 to form a light-emitting functional layer 50; a conductive material is deposited on the side of the light-emitting functional layer 50 facing away from the substrate 10 to form a second electrode 60; an inorganic material is deposited on the side of the second electrode 60 facing away from the substrate 10 to form a first sub-part 71R; an inorganic material with a lower density than the first sub-part is deposited on the side of the first sub-part 71R facing away from the substrate 10 to form a second sub-part 72R; a photoresist layer is coated on the surface of the second sub-part 72R facing away from the substrate 10; the photoresist outside the second isolation openings 31 is removed by an etching process, leaving the photoresist in the third isolation openings 31 to form a third photolithography layer 83 protecting the third light-emitting unit 1R; according to the pattern of the third photolithography layer 83, the second sub-part 72, the first sub-part 71, the second electrode 60, and the light-emitting functional layer 50 not protected by the third photolithography layer 73 are sequentially removed by an etching process to form a structure as shown in the image. Figure 9 The panel structure shown; remove the third photolithography layer 83.

[0120] Furthermore, when the packaging section has a three-layer structure, an inorganic material with a higher density than the second sub-section needs to be deposited on the side of the second sub-section facing away from the substrate 10 to form a third sub-section 73R. The density of the third sub-section R is the same as or similar to that of the first sub-section. A layer of photoresist is coated on the surface of the third sub-section R facing away from the substrate 10. The photoresist outside the third isolation opening 31 is removed by an etching process, while the photoresist in the third isolation opening 31 is retained to form a third photolithography layer protecting the third light-emitting unit 1R. According to the pattern of the third photolithography layer 83, the third sub-section 73R, the second sub-section 72, the first sub-section 71, the second electrode 60, and the light-emitting functional layer 50 that are not protected by the third photolithography layer 83 are removed sequentially by an etching process to form a structure as shown in the figure. Figure 10 The panel structure shown; remove the third photolithography layer 83.

[0121] Furthermore, the first package portion 70B and the second package portion 70G can be formed in the same production chamber using the same process, such as CVD (Chemical Vapor Deposition) or ALD (Atomic Layer Deposition). Taking the preparation of the first package portion 70B and the second package portion 70G containing silicon nitride by CVD as an example, a mixed gas such as silicon hydride, ammonia, nitrogen, and hydrogen is introduced into the chamber through a gas inlet, and high-frequency electricity is applied to the gas inlet. This allows silicon nitride to be deposited on the panel surface. By adjusting various parameters such as the flow rate of the mixed gas introduced into the production chamber, the ratio of the mixed gas, and the magnitude of the applied high-frequency electricity, the conditions in the chamber during the formation of the first package portion 70B and the second package portion 70G can be made different. For example, the proportion of hydrogen in the chamber during the formation of the first package portion 70B can be higher than that during the formation of the second package portion 70G. Thus, the first package portion 70B and the second package portion 70G with different densities can be prepared in the same production chamber using the same process.

[0122] The isolation structure 40 is further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202310909421.5 for reference.

[0123] In the display panel and its manufacturing method provided by the present invention, by designing a double-layer encapsulation structure with different densities, the reliability of the encapsulation layer is improved while increasing production equipment without increasing production costs. This solves the problem of pixel dark spots caused by material residue and other phenomena in related display technologies, and improves the display effect of the display panel.

[0124] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A display panel, characterized in that, substrate An isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings; the isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening, the first isolation opening, the second isolation opening, and the third isolation opening respectively define light-emitting units with different emitted light colors, and the wavelengths of the emitted light from the light-emitting units defined by the first isolation opening, the second isolation opening, and the third isolation opening respectively increase sequentially; The light-emitting layer includes light-emitting units located in each of the isolation openings, wherein the light-emitting units include a first light-emitting unit located in the first isolation opening, a second light-emitting unit located in the second isolation opening, and a third light-emitting unit located in the third isolation opening; A first encapsulation layer includes an encapsulation portion located on the side of each light-emitting unit facing away from the substrate. The encapsulation portion includes at least a first sub-part and a second sub-part. The first sub-part covers the light-emitting unit, and the second sub-part covers the first sub-part. The first sub-part and the second sub-part have different densities, and the densities of the first sub-parts of each encapsulation portion are at least two different from each other. The first encapsulation portion is located on the side of the first light-emitting unit facing away from the substrate, and the density of the first sub-part is less than the density of the second sub-part. The second encapsulation portion is located on the side of the second light-emitting unit away from the substrate, and the density of the first sub-part is less than the density of the second sub-part; The third encapsulation part is located on the side of the second light-emitting unit away from the substrate, and the density of the first sub-part is greater than the density of the second sub-part.

2. The display panel as described in claim 1, characterized in that, The encapsulation portion further includes a third sub-portion, which covers the second sub-portion, and the third sub-portions of each encapsulation portion have the same density.

3. The display panel as described in claim 1, characterized in that, The density of the third sub-part in the first encapsulation part is the same as or similar to the density of the second sub-part; The density of the third sub-part in the second encapsulation part is the same as or similar to the density of the second sub-part; The density of the third sub-part in the third encapsulation part is the same as or similar to the density of the first sub-part.

4. The display panel as described in claim 1, characterized in that, The material of the encapsulation part includes inorganic materials; The inorganic material includes at least one of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

5. The display panel as described in claim 4, characterized in that, Also includes: The first electrode is disposed between the substrate and the light-emitting unit; A pixel defining layer is disposed on the substrate and covers the first electrode; A pixel opening extends through the pixel defining layer, and the light-emitting unit covers the pixel opening; The isolation structure is disposed on the side of the pixel limiting layer opposite to the substrate, and the orthographic projection of the isolation structure on the substrate does not coincide with the orthographic projection of the pixel opening on the substrate.

6. The display panel as described in claim 1, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion disposed on the side of the first isolation portion away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

7. The display panel as described in claim 6, characterized in that, Between two adjacent light-emitting units, the width of the second isolation portion is smaller than the width of the first isolation portion.

8. The display panel as described in claim 6, characterized in that, The material of the first isolation portion includes a conductive material.

9. The display panel as described in claim 6, characterized in that, The light-emitting unit includes a light-emitting functional layer and a second electrode disposed on the side of the light-emitting functional layer away from the substrate, the second electrode being connected to the first isolation portion.

10. A method for manufacturing a display panel, characterized in that, include: Provide substrate An isolation structure is formed on one side of the substrate, and the isolation structure encloses a plurality of isolation openings. The isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening. The first isolation opening, the second isolation opening, and the third isolation opening respectively define light-emitting units with different emitted light colors. A light-emitting layer is formed on one side of the substrate, comprising: A light-emitting unit is formed in each of the isolation openings; a first light-emitting unit is formed in the first isolation opening; a second light-emitting unit is formed in the second isolation opening; and a third light-emitting unit is formed in the third isolation opening. A first encapsulation layer is prepared on the side of each of the light-emitting units facing away from the substrate, comprising: An encapsulation portion is formed on the side of each of the light-emitting units facing away from the substrate. The encapsulation portion includes at least a first sub-part and a second sub-part. The first sub-part covers the light-emitting unit, and the second sub-part covers the first sub-part. The first sub-part and the second sub-part have different densities, and the densities of the first sub-parts of each of the encapsulation portions are at least two different from each other. A first encapsulation portion is formed on the side of the first light-emitting unit facing away from the substrate, which includes: A first sub-part is formed on the side of the first light-emitting unit that is away from the substrate; A second sub-part is formed on the side of the first sub-part that is away from the substrate; The density of the first sub-part is less than the density of the second sub-part; A second encapsulation portion is formed on the side of the second light-emitting unit away from the substrate, which includes: A first sub-part is formed on the side of the second light-emitting unit away from the substrate; A second sub-part is formed on the side of the first sub-part that is away from the substrate; The density of the first sub-part is less than the density of the second sub-part; A third encapsulation portion is formed on the side of the third light-emitting unit away from the substrate, comprising: A first sub-part is formed on the side of the third light-emitting unit that is away from the substrate; A second sub-part is formed on the side of the first sub-part that is away from the substrate; The density of the first sub-part is greater than the density of the second sub-part.

11. The method for manufacturing a display panel as described in claim 10, characterized in that, The step of forming the first encapsulation portion on the side of the first light-emitting unit away from the substrate further includes: A third sub-part is formed on the side of the second sub-part that faces away from the substrate; wherein the density of the third sub-part is the same as or similar to the density of the second sub-part; The step of forming a second encapsulation portion on the side of the second light-emitting unit away from the substrate further includes; A third sub-part is formed on the side of the second sub-part that faces away from the substrate; wherein the density of the third sub-part is the same as or similar to the density of the second sub-part; The step of forming a third encapsulation portion on the side of the third light-emitting unit away from the substrate further includes; A third sub-part is formed on the side of the second sub-part away from the substrate; wherein the density of the third sub-part is the same as or similar to the density of the first sub-part.

12. The method for manufacturing a display panel as described in claim 10, characterized in that, The step of providing the substrate further includes forming a first electrode on one side of the substrate; Prior to the step of fabricating an isolation structure on one side of the substrate, the method further includes: forming a pixel defining layer on the substrate, the pixel defining layer covering the first electrode; The pixel-defined layer has multiple pixel openings.

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