Laser cutting device and cutting method thereof

Abstract

The present invention discloses a laser ring cutting device and a ring cutting method thereof, which belongs to the field of laser ring cutting technology, and solves the technical problems that most of the existing laser ring cutting devices have the cut piece rotating while the laser is fixed, the laser is not convenient to be replaced according to needs, the cutting accuracy and efficiency are not high, and there are potential safety hazards. The present invention includes: a cantilever structure and a sample carrying platform, the cantilever structure includes a first cantilever, the first cantilever is a light guide arm, the light guide arm includes an arm shell, a laser incident port located at the top of the arm shell, a light guide component located inside the arm shell, and a laser outlet located at the bottom of the arm shell, the light guide component includes a beam expander, a reflector and a scanning galvanometer; the sample carrying platform is rotatably arranged below the cantilever structure, and the laser outlet faces one side of the sample carrying platform. The present invention has the advantages of no need to rotate the sample to be cut, safety can be ensured, and it is convenient to switch between multiple lasers, and the cutting accuracy and efficiency are high.

Description

Technical Field

[0001] The present invention relates to the technical field of laser ring cutting, and in particular to a laser ring cutting device and a ring cutting method thereof. Background Art

[0002] Laser has many uses in object cutting due to its highly concentrated energy and high efficiency. Different object shapes have different cutting requirements.

[0003] Cylindrical or tubular parts are a common shape of workpieces. In some cases, their surfaces need to be cut without damaging the contents inside the cylinder or tubular parts. This situation places high demands on laser cutting.

[0004] At present, the commonly used laser ring cutting method for cylindrical or tubular parts is to let the cylindrical or tubular parts rotate and fix them with laser. The problems with this method are: first, some cylindrical or tubular parts are easily damaged if they rotate and shake because the objects inside are relatively sensitive; second, the laser is a fixed part, which makes it inconvenient to replace the laser according to actual needs.

[0005] Therefore, it is necessary to develop a laser cutting device with better performance for cylindrical or tubular parts. Summary of the invention

[0006] The technical problem to be solved by the present invention is that most of the existing laser ring cutting devices have the cut piece rotating while the laser is fixed, the laser is not convenient to replace according to needs, the cutting accuracy and efficiency are not high and there are safety hazards.

[0007] In view of the above problems in the prior art, the present invention provides a laser ring cutting device and a ring cutting method thereof.

[0008] The technical solution adopted by the present invention is as follows:

[0009] A laser ring cutting device, comprising: a cantilever structure and a sample carrying platform,

[0010] The cantilever structure includes a first cantilever, the first cantilever is a light guide arm, and the light guide arm includes an arm shell, a laser incident port located at the top of the arm shell, a light guide component located inside the arm shell, and a laser outlet located at the bottom of the arm shell;

[0011] The light guide arm is rotatably connected to the top of the sample carrying platform, and the laser outlet faces one side of the sample carrying platform. During circular cutting, the sample to be cut is axially mounted on the sample carrying platform, and the light guide arm rotates around the axial direction of the sample carrying platform.

[0012] The present invention provides a cantilever structure and a sample carrying platform that are rotatably connected, and the cantilever structure can rotate relative to the sample carrying platform, thereby realizing laser rotation while fixing the piece to be cut.

[0013] During laser cutting, the laser enters the arm housing from the laser incident port, and after being processed by the light guide component, is emitted from the laser outlet port and is aimed at the side of the sample to be cut under the sample mounting table. Since the light guide arm can rotate relative to the sample mounting table, the laser can rotate along the fixed sample to be cut, thereby completing the circular cutting.

[0014] The preferred laser ring cutting device of the present invention, the cantilever structure also includes a second cantilever, the upper part of the second cantilever is connected to the first cantilever, the lower part of the second cantilever is provided with a cutting depth real-time monitoring component, and the exit position of the cutting depth real-time monitoring component is located on the same horizontal plane as the laser output head of the laser emission outlet.

[0015] Furthermore, the cutting depth real-time monitoring component includes a laser three-dimensional profile measuring instrument, and the test light of the laser three-dimensional profile measuring instrument is located at the same horizontal plane as the laser output head of the laser emission outlet, so as to ensure that the monitored depth is the position of the laser cutting, thereby more accurately determining the cutting depth and the time to stop cutting, preventing inadequate cutting or excessive cutting.

[0016] In the preferred laser ring cutting device of the present invention, a contour monitoring component is further provided at the bottom of the light guide arm, and a rangefinder of the contour monitoring component is parallel and coplanar with the laser output head.

[0017] There are two ways to set up the rangefinder and laser output head of the contour monitoring component:

[0018] The first is that the rangefinder and the laser output head are installed on the same linear motion module. The spatial positions of the two are relatively fixed, and the cutting laser output direction is ensured to be consistent with the ranging direction. By controlling the up and down movement of the linear motion module, the rangefinder and the laser output head can be moved in the longitudinal direction to achieve workstation switching.

[0019] The other is that the rangefinder and the laser output head are both connected to the lower end of the second hollow arm, keeping their spatial positions relatively fixed and ensuring that the cutting laser output direction is consistent with the ranging direction. By adjusting the extension and retraction of the lower end of the second hollow arm, the rangefinder and the laser output head can be moved in the longitudinal direction to achieve workstation switching.

[0020] The preferred laser ring cutting device of the present invention comprises: the arm shell comprising a first hollow arm and a second hollow arm vertically connected to each other; the light guiding assembly comprising a beam expander, a reflector and a scanning galvanometer; the laser incident port is arranged on the top of the first hollow arm, a beam expander is arranged below the laser incident port, a reflector is arranged at the junction corner between the first hollow arm and the second hollow arm, a scanning galvanometer is arranged at the inner lower part of the second hollow arm, the laser exit port is opened on the lower side wall of the second hollow arm, and the laser emitted through the scanning galvanometer is emitted through the laser exit port.

[0021] The present invention inputs laser through the laser incident port, the laser is expanded by a beam expander and reflected to a 45° reflector, and after the angle is changed by 90°, enters a scanning galvanometer for laser scanning, and then is emitted from a laser exit port to perform laser cutting on a sample to be tested fixed under a sample mounting table.

[0022] A scanning galvanometer is used to control the laser focal spot to scan within a certain range. A larger slit entrance is obtained through scanning and splicing, thereby opening the transmission channel and ensuring that the light beam can be incident into the slit, effectively preventing the incision from being too small to block the laser entering the slit and affect subsequent cutting.

[0023] Preferably, the scanning galvanometer is a two-dimensional galvanometer or a three-dimensional galvanometer.

[0024] The preferred laser ring cutting device of the present invention has a spatial output laser or a fiber laser installed at the laser incident port. The spatial output laser is such as a solid laser, a picosecond or femtosecond laser to achieve low-heat or heatless cold processing.

[0025] The laser incident port of the present invention is a cylindrical through hole or a rectangular through hole. If it is a spatial output laser, the laser can be directly aligned and installed in the through hole. If it is a fiber laser, the optical fiber is directly plugged into the through hole, so that the laser can be easily replaced according to the different laser parameters required for cutting different samples.

[0026] In the preferred laser ring cutting device of the present invention, when the scanning galvanometer mirror adopts a three-dimensional galvanometer mirror, the three-dimensional galvanometer mirror has a self-focusing function.

[0027] After the contour monitoring component detects the morphology of the sample surface, it transmits the data to the controller and feeds it back to the laser for real-time adjustment of the focus, thereby fully ensuring the cutting efficiency.

[0028] The preferred laser ring cutting device of the present invention, the first hollow arm includes a first telescopic structure, the telescopic section of the first telescopic structure is connected to the second hollow arm, the fixed section of the first telescopic structure is connected to a focusing mirror via a mounting frame, the focusing mirror is located in the emission direction of the laser outlet, the telescopic structure of the first hollow arm can realize telescopic adjustment along the radial direction of the sample, thereby adjusting the position of the focusing mirror, and realizing self-adjustment of the focus according to the morphology of the position to be cut of the sample.

[0029] Furthermore, the second hollow arm includes a second telescopic structure, which can realize telescopic adjustment along the axial direction of the sample, thereby facilitating the adjustment of the cutting position of the sample to be cut in the axial direction and the switching of the laser cutting and contour monitoring stations.

[0030] In order to allow the mounting frame to adapt to the extension and retraction of the second hollow arm, the mounting frame is connected to the telescopic section of the second telescopic structure, and the upper part and the lateral part of the mounting frame are both telescopic structures.

[0031] The preferred laser ring cutting device of the present invention, the sample carrying platform includes a sample top fixing component, the sample top fixing component is connected to the light guide arm through a rotating shaft, the sample top fixing component is rotatably connected to the rotating shaft, and the rotating shaft is fixedly connected to the bottom of the light guide arm.

[0032] Driving the rotating shaft to rotate will drive the light guide arm to rotate, while the fixed component on the top of the sample remains stationary, thereby reducing the unsafe factors caused by sample movement.

[0033] The preferred laser ring cutting device of the present invention also includes a sample bottom fixing component, which includes a stage and a fastener. The fastener includes a plurality of arc pieces distributed in an annular manner at intervals on the stage, and the arc pieces are connected to the inner wall of the stage by elastic parts.

[0034] By fixing the sample at the bottom and cooperating with the top fixing component of the upper sample, the sample can be better fixed. Secondly, when the ring cutting device is moved to the sample for fixing, the advance fixation of the bottom can prevent the sample from tipping over during the operation, and there is no need to manually stabilize the sample.

[0035] The preferred laser ring cutting device of the present invention also includes a mechanical arm, which is used to grasp, move and rotate the laser ring cutting device.

[0036] Furthermore, the robot arm includes a robot arm, and the robot arm includes a turntable, at least two clamping arms, and a clamping piece arranged at the end of the clamping arm, and the clamping piece is used to clamp the shell of the laser incident port.

[0037] A laser ring cutting method is implemented by using the above laser ring cutting device, comprising the following steps:

[0038] Step 1: Place the laser ring cutting device on top of the sample to be cut and connect the sample carrier to the sample to be cut, ensuring that the laser output is perpendicular to the axial direction of the sample to be cut;

[0039] Step 2: Using a profile monitoring component to measure the surface topography data of the to-be-cut position of the to-be-cut sample;

[0040] Step 3: Determine the working distance of the laser output head according to the surface morphology data of step 2;

[0041] Step 4: Start the laser and start the cantilever structure to rotate;

[0042] Step 5: Adjust the focus in real time according to the working distance of the laser output head determined in step 3 until the cutting is completed.

[0043] The step 2 also includes adjusting the contour monitoring component to correspond to the position to be cut.

[0044] Before starting the laser in step 4, the laser output head needs to be adjusted to correspond to the position to be cut.

[0045] In the preferred laser ring cutting method of the present invention, in step 5, the real-time focus adjustment method is achieved by extending and retracting the first hollow arm to change the distance between the focusing mirror and the scanning galvanometer mirror.

[0046] According to the preferred laser ring cutting method of the present invention, when the first hollow arm is extended or retracted, the cross bar of the mounting frame will extend or retract along with the extension or retraction of the first hollow arm, and the upper part of the mounting frame will extend or retract along with the extension or retraction of the second retractable structure, thereby ensuring that the focusing mirror is always located in front of the laser output head.

[0047] In summary, compared with the prior art, the present invention has the following advantages and beneficial effects:

[0048] 1. The present invention realizes that the cutting object does not need to be moved during the cutting process by rotating the cantilever structure, thereby ensuring the safety and stability of the sample to be cut;

[0049] 2. The laser inlet of the present invention can be adapted to install a variety of laser types and output types, including fiber lasers, such as high-power continuous lasers or pulsed lasers, and spatial output lasers, such as solid-state lasers or picosecond femtosecond lasers to achieve low-heat or heatless cold processing, meeting the needs of different lasers;

[0050] 3. The present invention has the function of automatically adapting to the surface morphology of the cutting object, and can also realize laser focus following and precise cutting in the ring cutting process for tubular or cylindrical objects with certain deformation;

[0051] 4. The present invention uses a scanning galvanometer to control the laser focal spot to scan within a certain range, and obtains a larger slit entrance through scanning and splicing, thereby opening the transmission channel and ensuring that the light beam can be incident into the slit;

[0052] 5. The present invention adopts the telescopic design of the cantilever, and the focus is adjusted by the lateral telescopic design of the first cantilever, and the cutting height position is adjusted by the longitudinal telescopic design of the first cantilever, and the switching between the two positions of laser cutting and contour monitoring is realized; the cutting depth real-time monitoring component is adjusted in the lateral and axial directions by the telescopic design of the second cantilever to adapt to samples to be cut of different sizes;

[0053] 6. The present invention can monitor the cutting depth in real time, effectively preventing safety hazards caused by excessive cutting or inadequate cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention.

[0055] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention without a mechanical focusing structure.

[0056] Figure 2 It is a front view schematic diagram of the structure without mechanical focusing structure of the present invention.

[0057] Figure 3 It is a front view structural schematic diagram of the present invention having a mechanical focusing structure and a mechanical arm.

[0058] Figure 4 It is a schematic diagram of the structure of the robot of the present invention.

[0059] Figure 5 It is a schematic diagram of the structure of the bottom fixing assembly of the sample of the present invention.

[0060] Parts names in the attached figure:

[0061] 1-laser incident port, 10-inner concave portion, 2-light guide arm, 20-first hollow arm, 200-first telescopic structure, 2000-cylinder, 2001-telescopic rod, 21-second hollow arm, 210-second telescopic structure, 22-laser exit port, 3-second cantilever, 30-third hollow arm, 300-third telescopic structure, 31-fourth hollow arm, 310-fourth telescopic structure, 40-beam expander, 41- Reflector, 42-scanning galvanometer, 5-rotating axis, 6-sample carrying platform, 60-sample top fixing component, 61-sample bottom fixing component, 610-stage, 611-arc sheet, 612-elastic part, 7-laser three-dimensional profile measuring instrument, 8-sample to be cut, 9-rangefinder, 11-mechanical arm, 110-turntable, 111-clamping arm, 112-clamping part, 12-focusing mirror, 13-mounting frame.

[0062] In the figure, “→” indicates the incident direction of the laser. DETAILED DESCRIPTION

[0063] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0064] Example 1

[0065] like Figure 1 , 2As shown in 5, a laser ring cutting device includes: a cantilever structure and a sample carrying platform 6, the cantilever structure includes a first cantilever and a second cantilever 3, the first cantilever and the second cantilever 3 form an inverted U-shaped structure, the first cantilever is a light guide arm 2, the light guide arm 2 includes an arm shell, a laser incident port 1 located at the top of the arm shell, a light guide component located inside the arm shell, and a laser outlet 22 located at the bottom of the arm shell, the top of the sample carrying platform 6 is rotatably connected to the cantilever structure, and the laser outlet 22 faces one side of the sample carrying platform 6, the sample carrying platform 6 includes a sample top fixing component 60, the sample top fixing component 60 is rotatably connected to the light guide arm 2 through a rotating shaft 5, specifically connected through a bearing, and the rotating shaft 5 is fixedly connected to the bottom of the light guide arm 2.

[0066] The light guide assembly includes a beam expander 40, a reflector 41 and a scanning galvanometer 42. The arm shell includes a first hollow arm 20 and a second hollow arm 21 which are vertically connected to each other. The laser incident port 1 is arranged at the top of the first hollow arm 20, and a beam expander 40 is arranged below the laser incident port 1. A 45° reflector 41 is arranged at the intersection corner of the first hollow arm 20 and the second hollow arm 21, and a scanning galvanometer 42 is arranged at the lower part of the second hollow arm 21. The laser emitted by the scanning galvanometer 42 is emitted through the laser emission port 22 and corresponds to the sample 8 to be cut.

[0067] The present invention provides a cantilever structure and a sample carrying platform 6 that are rotatably connected, and the cantilever structure can rotate relative to the sample carrying platform 6, thereby realizing laser rotation without the need for the workpiece to be cut to rotate.

[0068] The present invention inputs laser light through the laser incident port 1, the laser light is expanded by the beam expander 40 and reflected to the reflector 41, and after the angle is changed by 90°, it enters the scanning galvanometer 42 for laser scanning, and then is emitted from the laser emission port 22 to cut the sample to be tested fixed under the sample mounting platform 6. Since the light guide arm 2 can rotate relative to the sample mounting platform 6 under the action of the rotating shaft 5, the laser light can rotate along the fixed sample to be cut 8, thereby completing the circular cutting.

[0069] Example 2

[0070] The difference between this embodiment and embodiment 1 is that the second cantilever 3 is symmetrically arranged with the first cantilever, and the laser entrance port 1 is located in the middle of the top of the first cantilever and the second cantilever 3. A cutting depth real-time monitoring component is arranged at the lower part of the second cantilever 3, and the exit position of the cutting depth real-time monitoring component is located at the same horizontal plane as the laser emitted from the laser exit port 22. The cutting depth real-time monitoring component adopts a laser three-dimensional profile measuring instrument 7 to measure the cutting depth and ensure accurate control of the cutting depth. The exit light of the laser three-dimensional profile measuring instrument 7 is located at the same horizontal plane as the laser output head to ensure that the test depth is the position after cutting.

[0071] The present invention uses a scanning galvanometer 42 to control the laser focal spot to scan within a certain range, and obtains a larger slit entrance through scanning and splicing, thereby opening the transmission channel and ensuring that the laser beam can be incident on the inside of the slit, effectively preventing the incision from being too small to block the laser entering the slit and affect subsequent cutting.

[0072] In this embodiment, the scanning galvanometer 42 is a two-dimensional scanning galvanometer.

[0073] In this embodiment, a spatial output laser, specifically a femtosecond laser, is installed in the laser incident port 1 , and the installation method is: the femtosecond laser is directly installed in the laser incident port 1 .

[0074] In this embodiment, the sample top fixing assembly 60 includes a plurality of grooves arranged at the bottom and the middle support frame. When fixed, the top of the cylindrical or tubular workpiece abuts against the groove. Since the support frame is inclined inward from the bottom to the top, the diameter of the annular track formed by the groove gradually decreases, which can adapt to workpieces of different directions. The groove design is conducive to more stable abutment.

[0075] Example 3

[0076] like Figure 1 and Figure 2 As shown, the difference between this embodiment and embodiment 1-2 is that the first hollow arm 20 includes a first telescopic structure 200, and the second hollow arm 21 is provided with a focusing mirror 12 at the position of the laser emission outlet 22, and the first telescopic structure 200 of the first hollow arm 20 can realize telescopic adjustment along the radial direction of the sample, so as to adjust the position of the focusing mirror 12 and realize self-adjustment of the focus according to the morphology of the position to be cut of the sample.

[0077] Example 4

[0078] like Figure 1 and Figure 2As shown, the difference between this embodiment and embodiments 1-3 is that the second hollow arm 21 includes a second telescopic structure 210, which can realize telescopic adjustment along the axial direction of the sample, so as to facilitate the adjustment of the cutting position of the sample 8 to be cut in the axial direction.

[0079] Example 5

[0080] like Figure 1 , 2 As shown in Figure 3, the difference between this embodiment and embodiment 4 is that a rangefinder 9 is also provided at the outer bottom of the second hollow arm 21. The ranging light of the rangefinder 9 is arranged in the same plane as the processing laser and is parallel light. The two are distributed in the upper and lower positions in the axial direction. Through adjustment, the rotating shaft 5 is determined to be coplanar with the output direction of the cutting laser and the rangefinder laser. Under this setting, when setting the tool, the up and down movement is switched to the ranging station, and the deformation of the cutting object at different angles is measured and recorded by rotating the rotating shaft 5. When cutting, based on the measurement data, the rotating shaft 5 is linked with the telescopic structure to form a cutting trajectory in which the cutting laser working distance and cutting height are always kept constant.

[0081] During the cutting process, a rangefinder, i.e., a laser displacement sensor, is first used to test the sample 8 to be cut for one circle, and the deformation at the cutting position is obtained through the test data. Then, the deformation data is used to control the X-axis to perform corresponding working distance compensation during the rotation of the rotating shaft 5.

[0082] Example 6

[0083] like Figure 3 As shown, in the present embodiment, the first telescopic structure 200 of the first hollow arm 20 includes a first fixed section and a first telescopic section, the first fixed section is provided with a cylinder 2000, the free end of the telescopic rod 2001 of the cylinder 2000 is detachably connected to the first telescopic section, when the cylinder 2000 controls the telescopic rod 2001 to extend or retract, it will drive the first telescopic section to extend or retract, a mounting frame 13 is provided on the first fixed section, a focusing mirror 12 is provided at the lower end of the mounting frame 13, according to the monitored surface morphology data of the sample 8 to be cut, the distance between the scanning galvanometer 42 and the focusing mirror 12 can be adjusted by controlling the extension or retraction of the first telescopic section, thereby realizing real-time adjustment of the laser focus.

[0084] The second telescopic structure 210 is the same as the first telescopic structure 200 .

[0085] In order to allow the mounting frame 13 to adapt to the extension and retraction of the second hollow arm 21 , the mounting frame 13 is connected to the telescopic section of the second telescopic structure 210 , and the upper portion of the mounting frame 13 is a telescopic structure, and the cross bar of the mounting frame 13 is also a telescopic rod 2001 .

[0086] In this embodiment, the fixed sections and telescopic sections of the first telescopic structure 200 , the second telescopic structure 210 , the third telescopic structure 300 and the fourth telescopic structure 310 are all detachable, so as to facilitate installation or adjustment of the structure inside the cantilever structure.

[0087] Example 7

[0088] The difference between this embodiment and embodiment 6 is that the second cantilever 3 includes a third hollow arm 30 and a fourth hollow arm 31, the third hollow arm 30 is provided with a third telescopic structure 300, and the fourth hollow arm 31 is provided with a fourth telescopic structure 310, and the structures of the third telescopic structure 300 and the fourth telescopic structure 310 are the same as the first telescopic structure 200.

[0089] By extending and retracting the second cantilever 3 in the lateral and axial directions, it is convenient to adjust the cutting depth real-time monitoring component in the lateral and axial directions to adapt to samples 8 to be cut of different sizes.

[0090] Example 8

[0091] This embodiment is different from the above-mentioned embodiment in that the scanning galvanometer 42 adopts a three-dimensional galvanometer, that is, the three-dimensional galvanometer has its own focusing function. After the contour monitoring component detects the actual shape of the sample surface, the data is transmitted to the controller and fed back to the three-dimensional galvanometer for real-time adjustment of the focus, thereby fully ensuring the cutting efficiency.

[0092] Example 9

[0093] like Figure 2 and Figure 3 As shown, in this embodiment, it also includes a sample bottom fixing component 61, and the sample bottom fixing component 61 includes a stage 610 and a fastener, and the fastener includes a plurality of arc pieces 611 distributed in an annular manner at intervals on the stage 610, and the arc pieces 611 are connected to the inner wall of the stage 610 by an elastic member 612.

[0094] Fixing the sample at the bottom, in cooperation with the upper sample top fixing assembly 60, can better fix the sample. Secondly, when the circular cutting device is moved to the sample for fixation, the advance fixation of the bottom can prevent the sample from tipping over during the operation, and there is no need to manually stabilize the sample.

[0095] Example 10

[0096] like Figure 3 and Figure 4 As shown, in this embodiment, a robot arm 11 is also included, and the robot arm 11 is used to grab, move and rotate the laser ring cutting device, so that the laser ring cutting device can be stably installed on the sample 8 to be cut, and can drive the cantilever to rotate at a uniform speed when the cantilever needs to be rotated.

[0097] In this embodiment, the laser incident port 1 is provided with an inner recess 10, which facilitates the mechanical clamp of the robot arm 11 to stably clamp. The robot includes a turntable 110, two clamping arms 111 and a semicircular clamping member 112 arranged at the end of the clamping arm 111. The clamping member 112 is surrounded by a circle, which can better cooperate with the inner recess 10 for stable clamping, and the turntable 110 can be driven to rotate, thereby driving the cantilever structure to rotate along the rotating axis 5.

[0098] Embodiment 11

[0099] In this embodiment, the laser is a fiber laser. During installation, a laser output head with an optical fiber is plugged into the laser incident port 1 .

[0100] Example 12

[0101] This embodiment discloses a laser ring cutting method, which is implemented by using the laser ring cutting device in the above embodiment, and includes the following steps:

[0102] Step 1: Place the laser ring cutting device on top of the sample 8 to be cut and connect the sample carrying platform 6 to the sample 8 to be cut, ensuring that the laser output is perpendicular to the sample 8 to be cut;

[0103] Step 2: Using a profile monitoring component to measure the surface topography data of the to-be-cut position of the to-be-cut sample 8;

[0104] Step 3: Determine the working distance of the laser head according to the surface topography data of step 2;

[0105] Step 4: Start the laser and start the cantilever structure to rotate;

[0106] Step 5: Adjust the focus in real time according to the working distance of the laser output head determined in step 3 until the cutting is completed.

[0107] In step 2, before measuring the data, the lengths of the second hollow arm 21 and the fourth hollow arm 31 are adjusted up and down according to the cutting position of the sample 8 to be cut, so that the laser three-dimensional profile measuring instrument 7 and the laser output head are on the same plane and are both located at the height to be cut.

[0108] In the step 5, the real-time focus adjustment method is achieved by extending and retracting the first hollow arm 20 to change the distance between the focusing mirror 12 and the scanning galvanometer 42 .

[0109] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser ring cutting device, characterized in that: include: Cantilever structure and sample mounting platform (6), The cantilever structure comprises a first cantilever, the first cantilever being a light guide arm (2), the light guide arm (2) comprising an arm housing, a laser incident port (1) located at the top of the arm housing, a light guide component located inside the arm housing, and a laser emission port (22) located at the bottom of the arm housing; The top of the sample carrier (6) is rotatably connected to the light guide arm (2), and the laser emission port (22) faces one side of the sample carrier (6). During circular cutting, the sample (8) to be cut is axially mounted on the sample carrier (6), and the light guide arm (2) rotates with the axial direction of the sample carrier (6) as the axis. The cantilever structure further comprises a second cantilever (3), the upper portion of the second cantilever (3) being connected to the first cantilever, the second cantilever (3) being symmetrically arranged with the first cantilever, the laser incident port 1 being located in the middle of the tops of the first cantilever and the second cantilever (3), the lower portion of the second cantilever (3) being provided with a cutting depth real-time monitoring component, the exit position of the cutting depth real-time monitoring component being located on the same horizontal plane as the laser output head of the laser exit port (22), A contour monitoring component is also provided at the bottom of the light guide arm (2); a distance meter (9) of the contour monitoring component is parallel and coplanar with the laser output head; the distance meter (9) is used to obtain the deformation amount at the cutting position and control the X-axis to compensate for the corresponding working distance during the working process; The arm housing comprises a first hollow arm (20) and a second hollow arm (21) which are vertically connected to each other; the first hollow arm (20) comprises a first telescopic structure (200); the telescopic section of the first telescopic structure (200) is connected to the second hollow arm (21); the fixed section of the first telescopic structure (200) is connected to a focusing mirror (12); the focusing mirror (12) is located in the emission direction of the laser emission port (22); The second hollow arm (21) comprises a second telescopic structure (210) which can realize telescopic adjustment along the axial direction of the sample, thereby facilitating the adjustment of the cutting position of the sample (8) to be cut in the axial direction, and the switching between the laser cutting and contour monitoring stations. The second cantilever (3) comprises a third hollow arm (30) and a fourth hollow arm (31); the third hollow arm (30) is provided with a third telescopic structure (300), and the fourth hollow arm (31) is provided with a fourth telescopic structure (310).

2. The laser ring cutting device according to claim 1, characterized in that: The light guide assembly comprises a beam expander (40), a reflector (41) and a scanning galvanometer (42); the laser incident port (1) is arranged at the top of the first hollow arm (20); the beam expander (40) is arranged below the laser incident port (1); a reflector (41) is arranged at the intersection corner between the first hollow arm (20) and the second hollow arm (21); a scanning galvanometer (42) is arranged at the inner lower part of the second hollow arm (21); the laser emission port (22) is opened on the lower side wall of the second hollow arm (21); laser light emitted through the scanning galvanometer (42) is emitted through the laser emission port (22).

3. The laser ring cutting device according to claim 1, characterized in that: The sample carrying platform (6) comprises a sample top fixing component (60), the sample top fixing component (60) being rotationally connected to the light guide arm (2) via a rotating shaft (5), the sample top fixing component (60) being rotationally connected to the rotating shaft (5), and the rotating shaft (5) being fixedly connected to the bottom of the light guide arm (2).

4. The laser ring cutting device according to any one of claims 1 to 3, characterized in that: It also comprises a mechanical arm (11), the mechanical arm (11) being used to grasp the laser circumcision device, the mechanical arm (11) comprising a mechanical hand, the mechanical hand comprising a rotating disk (110), at least two clamping arms (111) and a clamping member (112) arranged at the end of the clamping arm (111), the clamping member (112) being used to clamp the shell of the laser incident port (1).

5. A laser ring cutting method, characterized in that: The method is implemented by using the laser ring cutting device according to any one of claims 1 to 4, comprising the following steps: Step 1: placing the laser ring cutting device on top of the sample to be cut (8) and connecting the sample carrier (6) to the sample to be cut (8), ensuring that the laser output is perpendicular to the sample to be cut (8); Step 2: Using a profile monitoring component to measure surface topography data of a to-be-cut position of the to-be-cut sample (8); Step 3: Switch the contour monitoring station to the laser cutting station, determine the working distance of the laser output head according to the surface morphology data of step 2, and adjust the output position of the cutting depth real-time monitoring component to be on the same horizontal plane as the laser output head of the laser outlet (22); Step 4: Start the laser and start the cantilever structure to rotate; Step 5: Adjust the focus in real time according to the working distance of the laser output head determined in step 3 until the cutting is completed.

6. The laser ring cutting method according to claim 5, characterized in that: In step 5, the real-time focus adjustment method is achieved by extending and retracting the first hollow arm (20) to change the distance between the focusing mirror (12) and the scanning galvanometer (42).

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