Integrated circuit production and processing equipment

Abstract

The invention provides integrated circuit production and processing equipment, and relates to the technical field of integrated circuit processing, the integrated circuit production and processing equipment comprises a base, the base is provided with a positioning mechanism convenient for fixing an integrated circuit board, the base is provided with a gluing mechanism convenient for gluing and packaging, and the base is provided with a collecting mechanism convenient for recycling glue; the positioning mechanism comprises a vertical rod, the gluing mechanism comprises a support, a first T-shaped sliding block, a glue storage barrel and a valve plate, and the collecting mechanism comprises a constant temperature box, a collecting box, a second motor, an arc-shaped sliding rod and an arc-shaped scraping plate. According to the device, a gluing mode of erecting the integrated circuit board from top to bottom is set, glue naturally falls under the action of gravity, the glue amount can be more accurately controlled, the glue amount of each point is more uniform and consistent, and compared with a mode of plane gluing and waiting for natural leveling of the glue, the glue amount is more uniform and uniform by erecting the circuit board for gluing; the glue can quickly reach a designated position under the action of gravity and form a uniform glue layer, and extra leveling time is not needed.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit processing, and more specifically, particularly relates to an integrated circuit production and processing equipment. Background Art

[0002] Integrated circuit board packaging refers to the process of using film technology and micro-machining technology to layout, paste, fix and connect chips and other elements on a frame or substrate, lead out the wiring terminals, and inject and fix them through plastic insulating media to form an overall structure. It is the last link in the production of integrated circuits. Its main functions include protecting, supporting, connecting and improving the reliability of semiconductor device chips.

[0003] The Chinese patent publication number is: CN115295506A, a packaging device for integrated circuit production and processing, the invention reduces the thickness of the integrated circuit board packaging colloid by collecting excess overflow colloid, and cools the integrated circuit board after packaging in the packaging cavity by circulating cooling. The cooling is uniform and the cooling speed is fast, which reduces defective products and improves the efficiency of packaging integrated circuit boards.

[0004] Existing integrated circuit board packaging equipment has the following disadvantages:

[0005] 1. Existing integrated circuit boards are mostly packaged by planar glue application. In planar glue application, glue is not easy to spread on the surface of the circuit board, and there may be uneven glue distribution, resulting in excessive glue in some areas and insufficient glue in some areas. After glue application, it is usually necessary to wait for the glue to level naturally, or use additional tools to assist leveling. This process will take a certain amount of time and reduce production efficiency;

[0006] 2. The sizes of existing integrated circuit boards are different. It is difficult to accurately apply glue and control glue according to the sizes of different integrated circuit boards during actual glue application, which may result in insufficient or excessive glue, affecting the firmness after packaging or causing waste of glue.

[0007] Therefore, in view of this, research and improvement are conducted on the existing structure and defects, and an integrated circuit production and processing equipment is provided to achieve a more practical purpose. Summary of the invention

[0008] In order to solve the above technical problems, the present invention provides an integrated circuit production and processing equipment to solve the above problems.

[0009] An integrated circuit production and processing equipment, including a base, the base is provided with a positioning mechanism for fixing an integrated circuit board, the base is provided with a glue coating mechanism for gluing and packaging, the base is provided with a collecting mechanism for recycling colloid, the positioning mechanism includes a vertical rod, the glue coating mechanism includes a bracket, a first T-shaped slider, a glue storage barrel and a valve plate, the collecting mechanism includes a constant temperature box, a collection box, a second motor, an arc-shaped sliding rod and an arc-shaped scraper, the bracket is fixedly installed on the two side ends of the base, the upper ends of the two brackets are fixedly installed with the same cross bar, the upper ends of the two cross bars are penetrated with a first rectangular groove, the first T-shaped slider is penetrated and slidably installed in the first rectangular groove, the glue storage barrel is fixedly installed on the first T-shaped slider The lower end of the vertical rods is two, and both side ends of the two vertical rods are fixedly installed with mounting plates, and the side ends of each mounting plate are provided with a T-shaped slide groove, and the inner side wall of each T-shaped slide groove is slidably installed with a third T-shaped slider, and the inner side wall of each T-shaped slide groove is also slidably installed with a fourth T-shaped slider. The constant temperature box is fixedly installed on the upper end of the base, and the upper end of the constant temperature box is fixedly installed with a collecting bucket, and the side end of the constant temperature box is fixedly installed with two fixed blocks, the arc sliding rod is located between the two fixed blocks, and the side end of the base is fixedly installed with an L-shaped side rod, and the side end of the L-shaped side rod is fixedly installed with a bracket, and the vertical rod located on one side of the L-shaped side rod is fixedly installed on the side end of the bracket, away from the one side of the L-shaped side rod. The vertical rod is fixedly installed on the upper end of the base, and first circular grooves are penetrated at both side ends of the first rectangular groove, and the same first reciprocating screw rod is rotatably installed on the inner side walls of the two first circular grooves, and the first motor is fixedly installed on the side end of the cross bar, and the first reciprocating screw rod is fixedly installed on the output end of the first motor, and a first threaded groove is penetrated at the side end of the first T-shaped slider, and the first reciprocating screw rod is threadedly rotatably installed on the inner side wall of the first threaded groove, and a valve is fixedly installed on the lower end of the glue storage barrel, and a bellows is fixedly installed on the lower end of the valve, and a valve plate is provided on the inner side wall of the valve, and a fixing pipe is also fixedly installed on the circumferential end of the valve, and a round shaft is fixedly installed on the side end of the valve plate, and the round shaft penetrates and is rotatably installed on the fixed The inner side wall of the tube, a first torsion spring is fixedly installed between the round shaft and the fixed tube, a movable rod is fixedly installed on the side end of the round shaft, the side ends of the two vertical rods are penetrated with a second round groove, the inner side walls of the two second round grooves are penetrated with double-headed screws rotatably installed, the upper end of each mounting plate is penetrated with a second rectangular groove, the upper end of each third T-shaped slider is fixedly installed with a second T-shaped slider, each second T-shaped slider is penetrated and slidably installed on the inner side wall of the second rectangular groove, the side end of each second T-shaped slider is penetrated with a second threaded groove, the two double-headed screws are threadedly rotatably installed on the inner side wall of each second threaded groove, and a spring is fixedly installed between each fourth T-shaped slider and each third T-shaped slider.A slide plate is fixedly installed on the side end of each fourth T-shaped slider, and a clamping plate is fixedly installed on the side end of each slide plate. The clamping plates on the two vertical rods face oppositely, and a push rod is fixedly installed on the upper end of the two slide plates on one side of the glue storage barrel. The upper ends of the two push rods are fixedly installed with the same arc-shaped telescopic rod. A side groove is penetrated through the side end of the constant temperature box, and a collection box is installed on the inner side wall of the side groove. The same second reciprocating screw rod is rotatably installed between the two fixed blocks, and a second motor is fixedly installed on the side end of the fixed block. The second reciprocating screw rod is fixedly installed on the output end of the second motor. The same limit rod is also fixedly installed between the two fixed blocks.

[0010] Preferably, a third thread groove and a third circular groove are penetrated through the side end of the arc-shaped sliding rod, the second reciprocating screw rod is threadably mounted on the inner side wall of the third thread groove, the arc-shaped sliding rod is slidably mounted on the circumferential end of the limit rod through the third circular groove, a fixed shaft is fixedly mounted on the side end of the arc-shaped sliding rod, and an arc-shaped scraper is also provided on one side of the arc-shaped sliding rod.

[0011] Preferably, both side ends of the arc scraper are provided with glue guiding grooves, and the side ends of the arc scraper are penetrated by a fourth circular groove. The arc scraper is rotatably mounted on the circumferential end of the fixed shaft through the fourth circular groove, and a second torsion spring is fixedly installed between the fixed shaft and the fourth circular groove.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] In the present invention, by setting up a method of standing the integrated circuit board upright and applying glue from top to bottom, the glue naturally falls under the action of gravity, the amount of glue can be more accurately controlled, and the excess glue will be collected by dripping due to gravity, which can effectively avoid the problem of excessive glue and make the amount of glue at each point more uniform. Compared with the method of applying glue on a flat surface and waiting for the glue to level naturally, when the circuit board is stood up for gluing, the glue can quickly reach the designated position under the action of gravity and form a uniform glue layer, without the need for additional leveling time, and the glue coating is uniform.

[0014] In the present invention, a method of vertically applying glue on the circuit board is adopted. The vertically applying glue method enables the glue to cover the parts that need to be packaged more evenly, and the thickness of the formed glue layer is more uniform and moderate, which helps to reduce the curing time and internal stress, and avoids the possibility that the glue will form a thicker glue layer on the surface of the circuit board when applying glue on a flat surface. This will not only increase the curing time of the glue, but may also generate internal stress during the curing process, resulting in cracks, bubbles and other defects in the packaging layer, thereby ensuring the uniformity of the glue layer and the quality of subsequent fixed packaging.

[0015] In the present invention, by providing an adjustable fourth T-shaped slider, the slide plate and the third T-shaped slider to cooperate, the spring has a certain deformation ability and can adapt to integrated circuit boards of different sizes. When the clamping force of the spring is not sufficient to firmly fix a larger or smaller integrated circuit board, additional support and clamping force can be provided by adjusting the two third T-shaped sliders. The third T-shaped slider can be adjusted according to the actual situation of the circuit board to ensure that the circuit board will not loosen or shift during the clamping process, thereby avoiding the situation where the clamping force is too large or too small due to relying solely on the spring.

[0016] In the present invention, a movable rod, a round shaft, a first torsion spring and an adjustable arc-shaped telescopic rod are arranged to cooperate with each other. After adjustment, the length of the arc-shaped telescopic rod is the width of the integrated circuit board. Only when the movable rod moves and contacts the arc-shaped telescopic rod, the movable rod will drive the valve plate to rotate and open in the valve to realize glue discharge. After the movable rod leaves the arc-shaped telescopic rod, the first torsion spring will drive the valve plate to rotate and reset to close. Without the need for additional manual intervention, precise glue control is achieved, so that the glue application amount is adapted to different integrated circuit board widths, thereby avoiding additional waste of glue.

[0017] In the present invention, a constant temperature box, a collection box and an arc scraper are provided to cooperate with each other. The collection box can collect the excess glue dripping on the integrated circuit board and the overflowing glue scraped by the arc scraper. The constant temperature box can ensure that the glue in the collection box maintains a certain temperature to avoid condensation of the glue, thereby realizing the recycling of the glue and avoiding waste of the glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the base of the present invention;

[0019] Figure 2 It is a schematic diagram of the exploded structure of the bracket of the present invention;

[0020] Figure 3 It is a schematic diagram of the explosion structure of the glue storage barrel of the present invention;

[0021] Figure 4 It is a schematic diagram of the exploded structure of the vertical pole of the present invention;

[0022] Figure 5 It is a schematic diagram of the exploded structure of the third T-shaped slider of the present invention;

[0023] Figure 6 It is a structural schematic diagram of the thermostat of the present invention;

[0024] Figure 7 It is a schematic diagram of the exploded structure of the arc scraper of the present invention;

[0025] Figure 8 It is a schematic diagram of the explosion structure of the thermostatic box of the present invention.

[0026] In the figure, the corresponding relationship between the component names and the figure numbers is: 1, base; 11, L-shaped side rod; 2, bracket; 21, cross bar; 22, first rectangular groove; 23, first circular groove; 24, first motor; 25, first reciprocating screw rod; 3, first T-shaped slider; 31, first thread groove; 32, glue storage barrel; 33, valve; 34, bellows; 35, valve plate; 36, first torsion spring; 37, round shaft; 38, movable rod; 39, fixed tube; 4, vertical rod; 41, mounting plate; 42, T-shaped slide groove; 43, second circular groove; 45, second rectangular groove; 46, second thread slot; 47, second T-shaped slider; 48, third T-shaped slider; 49, double-headed screw; 5, fourth T-shaped slider; 51, spring; 52, slide plate; 53, clamping plate; 54, push rod; 55, arc-shaped telescopic rod; 6, constant temperature box; 61, collecting bucket; 62, side slot; 63, collecting box; 64, fixed block; 65, second reciprocating screw; 66, second motor; 67, limit rod; 7, arc-shaped slide rod; 71, third threaded groove; 72, third circular groove; 73, arc-shaped scraper; 74, fourth circular groove; 75, rubber guide groove; 76, second torsion spring; 77, fixed shaft. DETAILED DESCRIPTION

[0027] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0028] See also Figure 1 - Figure 8The present invention provides an integrated circuit production and processing equipment, including a base 1, a positioning mechanism for fixing an integrated circuit board is provided on the base 1, a glue coating mechanism for glue coating and packaging is provided on the base 1, and a collecting mechanism for recycling colloid is provided on the base 1. The positioning mechanism includes a vertical rod 4, the glue coating mechanism includes a bracket 2, a first T-shaped slider 3, a glue storage barrel 32 and a valve plate 35, and the collecting mechanism includes a constant temperature box 6, a collection box 63, a second motor 66, an arc-shaped sliding rod 7 and an arc-shaped scraper 73. The bracket 2 is fixedly installed on the two side ends of the base 1, and the upper ends of the two brackets 2 are fixedly installed with the same cross bar 21, and the upper ends of the two cross bars 21 are penetrated with a first rectangular groove 22, and the first T-shaped slider 3 penetrates and is slidably installed in the first rectangular groove 22. Inside, the glue storage barrel 32 is fixedly installed on the lower end of the first T-shaped slider 3, the number of vertical rods 4 is two, and the two side ends of the two vertical rods 4 are fixedly installed with mounting plates 41, and the side ends of each mounting plate 41 are provided with a T-shaped slide groove 42, and the inner side wall of each T-shaped slide groove 42 is slidably installed with a third T-shaped slider 48, and the inner side wall of each T-shaped slide groove 42 is also slidably installed with a fourth T-shaped slider 5, the thermostatic box 6 is fixedly installed on the upper end of the base 1, and the upper end of the thermostatic box 6 is fixedly installed with a collecting bucket 61, and the side end of the thermostatic box 6 is fixedly installed with two fixed blocks 64, and the arc-shaped slide bar 7 is located between the two fixed blocks 64, and the side end of the base 1 is fixedly installed with an L-shaped side rod 11, and the side end of the L-shaped side rod 11 is fixedly installed with a bracket 2, which is located in the L-shaped The vertical rod 4 on one side of the side rod 11 is fixedly installed on the side end of the bracket 2, and the vertical rod 4 on the side away from the L-shaped side rod 11 is fixedly installed on the upper end of the base 1. The two side ends of the first rectangular groove 22 are penetrated with a first circular groove 23, and the inner side walls of the two first circular grooves 23 are rotatably installed with the same first reciprocating screw rod 25. The side end of the cross bar 21 is fixedly installed with a first motor 24, and the first reciprocating screw rod 25 is fixedly installed on the output end of the first motor 24. The side end of the first T-shaped slider 3 is penetrated with a first threaded groove 31, and the first reciprocating screw rod 25 is threadedly rotatably installed on the inner side wall of the first threaded groove 31. The lower end of the glue storage barrel 32 is fixedly installed with a valve 33, and the lower end of the valve 33 is fixedly installed with a bellows 34, and the inner side wall of the valve 33 is provided with The valve plate 35 and the circumferential end of the valve 33 are also fixedly installed with a fixed tube 39, and the side end of the valve plate 35 is fixedly installed with a round shaft 37, which penetrates and is rotatably installed on the inner side wall of the fixed tube 39, and a first torsion spring 36 is fixedly installed between the round shaft 37 and the fixed tube 39, and a movable rod 38 is fixedly installed on the side end of the round shaft 37. The user can stretch the bellows 34 so that the port of the bellows 34 is close to the upper end position of the integrated circuit board. At this time, the user can start the first motor 24, and the first motor 24 starts to drive the first reciprocating screw rod 25 to rotate. The rotation of the first reciprocating screw rod 25 will drive the first T-shaped slider 3 to move through the first threaded groove 31, and the movement of the first T-shaped slider 3 will drive the glue storage barrel 32 to move, and the movement of the glue storage barrel 32 will drive the bellows 34 to move.When the valve 33 moves, the movable rod 38 at the side end of the valve 33 will also move. After the movable rod 38 moves and contacts the end of the arc-shaped telescopic rod 55, the movable rod 38 will rotate under force. The rotation of the movable rod 38 will drive the round shaft 37 to rotate. The rotation of the round shaft 37 will drive the valve plate 35 to rotate and open in the valve 33. At this time, the first torsion spring 36 is compressed. After the valve plate 35 is opened, the glue in the glue storage barrel 32 will flow to the integrated circuit board through the valve 33 and the bellows 34. When the bellows 34 moves horizontally, it will glue along the edge of the integrated circuit board.

[0029] The side ends of the two uprights 4 are penetrated with a second circular groove 43, the inner side walls of the two second circular grooves 43 are penetrated with a double-headed screw 49 for rotational installation, the upper end of each mounting plate 41 is penetrated with a second rectangular groove 45, the upper end of each third T-shaped slider 48 is fixedly installed with a second T-shaped slider 47, each second T-shaped slider 47 is penetrated and slidably installed on the inner side wall of the second rectangular groove 45, the side end of each second T-shaped slider 47 is penetrated with a second threaded groove 46, and two double-headed screws 49 are threadedly rotatably installed on the inner side wall of each second threaded groove 46, a spring 51 is fixedly installed between each fourth T-shaped slider 5 and each third T-shaped slider 48, and a slide plate 52 is fixedly installed on the side end of each fourth T-shaped slider 5 , a clamping plate 53 is fixedly installed on the side end of each slide plate 52, and the clamping plates 53 on the two uprights 4 face oppositely. The user can rotate the double-headed screw 49 in a positive or reverse direction, and the double-headed screw 49 rotates through the second thread groove 46 to drive the two second T-shaped sliders 47 to move closer to or away from each other. The movement of the second T-shaped slider 47 will drive the third T-shaped slider 48 to move, and the movement of the third T-shaped slider 48 drives the fourth T-shaped slider 5 to move through the spring 51. The movement of the fourth T-shaped slider 5 drives the clamping plate 53 to move through the slide plate 52. After moving the two third T-shaped sliders 48 to the appropriate position, the user can stop rotating the double-headed screw 49, and the user can place the integrated circuit board between the two clamping plates 53 to clamp the integrated circuit board;

[0030] The upper ends of the two slides 52 located on one side of the glue storage barrel 32 are fixedly mounted with push rods 54, and the upper ends of the two push rods 54 are fixedly mounted with the same arc-shaped telescopic rod 55. When the two slides 52 and the clamping plate 53 are adjusted, the movement of the slides 52 will also drive the two push rods 54 to move, and the movement of the two push rods 54 will drive the arc-shaped telescopic rod 55 to extend or contract. At this time, the length of the arc-shaped telescopic rod 55 is adapted to the integrated circuit board;

[0031] A side groove 62 is formed through the side end of the thermostat box 6, and a collecting box 63 is installed on the inner wall of the side groove 62. After one application of glue is completed, the excess glue on the integrated circuit board will drip into the collecting box 63 in the thermostat box 6.

[0032] A second reciprocating screw rod 65 is rotatably installed between the two fixed blocks 64, a second motor 66 is fixedly installed on the side end of the fixed block 64, and the second reciprocating screw rod 65 is fixedly installed on the output end of the second motor 66. A limit rod 67 is also fixedly installed between the two fixed blocks 64. A third thread groove 71 and a third circular groove 72 are penetrated through the side end of the arc-shaped slide bar 7. The second reciprocating screw rod 65 is threadedly rotatably installed on the inner side wall of the third thread groove 71. The arc-shaped slide bar 7 is slidably installed on the circumferential end of the limit rod 67 through the third circular groove 72. A fixed shaft 77 is fixedly installed on the side end of the arc-shaped slide bar 7. A curved scraper 73 is also provided on one side of the curved slide bar 7. Both side ends of the curved scraper 73 are provided with glue guide grooves 75. A fourth circular groove 74 is penetrated through the side end of the arc-shaped scraper 73. The arc-shaped scraper 73 passes through the fourth circular groove 74. The fourth circular groove 74 is rotatably mounted on the circumferential end of the fixed shaft 77, and a second torsion spring 76 is fixedly mounted between the fixed shaft 77 and the fourth circular groove 74. The user can also drive the second motor 66. The second motor 66 starts to drive the second reciprocating screw 65 to rotate. The second reciprocating screw 65 rotates through the third threaded groove 71 to drive the arc slide bar 7 to move. The movement of the arc slide bar 7 will drive the arc scraper 73 on the fixed shaft 77 to move. The movement of the arc scraper 73 will scrape off the excess glue overflowing from the bottom of the integrated circuit board, and the glue can be collected through the glue guide grooves 75 on both sides, so that the excess glue drips into the collection box 63. A second torsion spring 76 is set between the fourth circular groove 74 and the fixed shaft 77, so that the arc scraper 73 can undergo a certain deformation when scraping to avoid excessive friction and damage to the edge of the integrated circuit board.

[0033] Working principle:

[0034] The first step is to package the integrated circuit board and the base when processing the integrated circuit. The user can fix the integrated circuit board on the vertical pole 4 away from the side of the bracket 2, and place the integrated circuit board between the two clamping plates 53. The thrust of the springs 51 on both sides drives the fourth T-shaped sliders 5 on both sides to approach each other, and the two clamping plates 53 are driven by the slide plate 52 to clamp the integrated circuit board. The user can use the same method to fix the packaging base between the two clamping plates 53 on one side of the bracket 2. At this time, the user can start the first motor 24 to drive the first reciprocating screw rod 25 to rotate, and the first T-shaped slider 3 slides in the first rectangular groove 22 to drive the glue storage barrel 32 to move, and the movement of the glue storage barrel 32 drives the glue storage barrel When the movable rod 38 on 32 contacts the arc-shaped telescopic rod 55, the movable rod 38 will rotate to drive the valve plate 35 to rotate and open in the valve 33. At this time, the glue will flow out from the port of the bellows 34 and be coated on the integrated circuit board. The glue is covered on the integrated circuit board from top to bottom by gravity, and the excess glue will fall into the constant temperature box 6 by gravity. After the coating is completed, the bracket 2 can be started to drive the vertical rod 4 close to the vertical rod 4 on the other side, so that the integrated circuit board and the packaging base are attached together, and the second motor 66 is started to drive the second reciprocating screw 65 to rotate, drive the arc-shaped slide rod 7 to move, and the movement of the arc-shaped slide rod 7 will drive the arc-shaped scraper 73 to move to scrape the glue at the bottom of the integrated circuit board, and collect it in the constant temperature box 6 through the glue guide groove 75;

[0035] In the second step, when the user packages the integrated circuit board, the user can first fix the integrated circuit board. The user can adjust the positions of the two third T-shaped sliders 48 according to the width of the integrated circuit board to compensate for the problem that the elastic force of the spring 51 is limited to a certain extent, so as to avoid the integrated circuit board being too wide, the resistance of the spring 51 being too large, and the clamping force being too large, which may cause damage to the integrated circuit board, or the integrated circuit board being too narrow, and the clamping force of the spring 51 being insufficient, resulting in loose clamping. The user can rotate the double-headed screw 49 forward or reversely, and the double-headed screw 49 rotates through the second thread groove 46 to drive the two second T-shaped sliders 47 to move closer to or away from each other, and the second T-shaped sliders 47 move The third T-shaped slider 48 will be driven to move, and the third T-shaped slider 48 will drive the fourth T-shaped slider 5 to move through the spring 51, and the fourth T-shaped slider 5 will drive the clamping plate 53 to move through the slide plate 52. After moving the two third T-shaped sliders 48 to the appropriate positions, the user can stop rotating the double-headed screw 49, and the user can place the integrated circuit board between the two clamping plates 53 to clamp the integrated circuit board. The user can place the bottom end of the integrated circuit board at a position attached to the upper end of the arc scraper 73 to complete the fixing of the integrated circuit board. The user can fix the package base between the two clamping plates 53 on one side of the bracket 2 in the same way.

[0036] The device is provided with an adjustable fourth T-shaped slider 5, a slide plate 52 and a third T-shaped slider 48, and the spring 51 has a certain deformation ability, which can adapt to integrated circuit boards of different sizes. When the clamping force of the spring 51 is not enough to firmly fix the integrated circuit board of larger or smaller size, the two third T-shaped sliders 48 can be adjusted to provide additional support and clamping force. The third T-shaped slider 48 can be adjusted according to the actual situation of the circuit board to ensure that the circuit board will not loosen or shift during the clamping process, and avoid the situation where the clamping force is too large or too low by relying solely on the spring 51;

[0037] In the third step, when the two slide plates 52 and the clamping plate 53 are adjusted, the movement of the slide plate 52 will also drive the two push rods 54 to move, and the movement of the two push rods 54 will drive the arc-shaped telescopic rod 55 to extend and contract. At this time, the length of the arc-shaped telescopic rod 55 is adapted to the integrated circuit board. After the integrated circuit board is fixed, the integrated circuit board can be glued. The user can stretch the bellows 34 so that the port of the bellows 34 is close to the upper end position of the integrated circuit board. At this time, the user can start the first motor 24, and the first motor 24 starts to drive the first reciprocating screw rod 25 to rotate. The rotation of the first reciprocating screw rod 25 will drive the first T-shaped slider 3 to move through the first threaded groove 31. The movement of the first T-shaped slider 3 will drive the glue storage barrel 32 to move. The movement of the glue storage barrel 32 will drive the bellows 34 to move. When the valve 33 moves, it will also drive the movable rod 38 at the side end of the valve 33 to move. After the movable rod 38 moves and contacts the end of the arc-shaped telescopic rod 55, the movable rod 38 is forced to rotate, and the rotation of the movable rod 38 drives the round shaft 37 to rotate, and the rotation of the round shaft 37 drives the valve plate 35 to rotate and open in the valve 33. At this time, the first torsion spring 36 is compressed. After the valve plate 35 is opened, the glue in the glue storage barrel 32 will flow to the integrated circuit board through the valve 33 and the bellows 34. When the bellows 34 moves horizontally, it will glue along the edge of the integrated circuit board. The glue will slide down on the integrated circuit board under the force of gravity so that the side of the integrated circuit board is evenly coated with glue. When the movable rod 38 moves away from the end of the arc-shaped telescopic rod 55, the bellows 34 also leaves the edge of the integrated circuit board. The first torsion spring 36 will rotate and drive the valve plate 35 on the round shaft 37 to rotate and reset, so that the valve 33 is closed, and one glue application is completed. The user can choose whether to glue twice according to the glue coating condition on the integrated circuit board.

[0038] The device sets up a method of standing up the integrated circuit board and applying glue from top to bottom. The glue falls naturally under the action of gravity, which can more accurately control the amount of glue. The excess glue will drip and collect due to gravity, which can effectively avoid the problem of excessive glue and make the glue amount at each point more uniform. Compared with the method of applying glue on a flat surface and waiting for the glue to level naturally, the glue can be applied by standing up the circuit board. Under the action of gravity, the glue can quickly reach the designated position and form a uniform glue layer, without the need for additional leveling time, and the glue coating is uniform.

[0039] The device adopts a method of vertically applying glue on the circuit board. The vertically applying glue method enables the glue to be more evenly covered on the parts that need to be packaged, and the thickness of the formed glue layer is more uniform and moderate, which helps to reduce the curing time and internal stress. It avoids the possibility that the glue will form a thicker glue layer on the surface of the circuit board when applying glue on a flat surface, which will not only increase the curing time of the glue, but also may generate internal stress during the curing process, resulting in cracks, bubbles and other defects in the packaging layer, ensuring the uniformity of the glue layer and the quality of subsequent fixed packaging;

[0040] The device is provided with a movable rod 38, a round shaft 37, a first torsion spring 36 and an adjustable arc-shaped telescopic rod 55. After adjustment, the length of the arc-shaped telescopic rod 55 is the width of the integrated circuit board. Only when the movable rod 38 moves and contacts the arc-shaped telescopic rod 55, the movable rod 38 will drive the valve plate 35 to rotate and open in the valve 33 to achieve glue discharge. After the movable rod 38 leaves the arc-shaped telescopic rod 55, the first torsion spring 36 will drive the valve plate 35 to rotate and reset to close. Without additional manual intervention, precise glue control is achieved, so that the glue amount is adapted to different widths of integrated circuit boards, avoiding additional waste of glue.

[0041] In the fourth step, after the glue is applied once, the excess glue on the integrated circuit board will drip into the collection box 63 in the constant temperature box 6. The user can drive the bracket 2 to drive the packaging base on the vertical rod 4 on one side of the bracket 2 to fit the integrated circuit board. The two sets of clamping plates 53 on the two vertical rods 4 are oriented in different directions. The clamping plates 53 on the vertical rod 4 on one side of the bracket 2 face upward, and the clamping plates 53 on the vertical rod 4 on the other side face downward, so that the two sets of clamping plates 53 can be staggered when they are close, so that the integrated circuit board and the packaging base can fit and package. After fitting, the user can also drive the second motor 66. The second motor 66 starts to drive the second reciprocating screw rod 65 to rotate. The rotation of the second reciprocating screw rod 65 can drive the arc slide rod 7 to move through the third thread groove 71. The movement of the arc slide rod 7 will drive the fixed The arc scraper 73 on the fixed shaft 77 moves, and the arc scraper 73 moves to scrape off the excess glue overflowing from the bottom of the integrated circuit board, and the glue can be collected through the glue guide grooves 75 on both sides, so that the excess glue drips into the collection box 63. A second torsion spring 76 is arranged between the fourth circular groove 74 and the fixed shaft 77, so that the arc scraper 73 can be deformed to a certain extent during scraping to avoid excessive friction and damage to the edge of the integrated circuit board. The constant temperature box 6 can keep the glue in the collection box 63 at a certain temperature to avoid glue condensation. After the collection box 63 collects a certain amount of glue, the collection box 63 can be drawn out of the constant temperature box 6, and the glue can be added to the glue storage barrel 32 through the feeding port on the glue storage barrel 32, so as to realize the recycling of glue;

[0042] The device is provided with a thermostatic box 6, a collection box 63 and an arc scraper 73. The collection box 63 can collect the excess glue dripping on the integrated circuit board and the overflowing glue scraped by the arc scraper 73. The thermostatic box 6 can ensure that the glue in the collection box 63 maintains a certain temperature to avoid the condensation of the glue, thereby realizing the recycling of the glue and avoiding the waste of the glue.

[0043] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An integrated circuit production and processing device, comprising a base (1), characterized in that: The base (1) is provided with a positioning mechanism for fixing the integrated circuit board, the base (1) is provided with a glue coating mechanism for gluing and packaging, and the base (1) is provided with a collection mechanism for recycling the colloid; The positioning mechanism comprises a vertical rod (4), the glue coating mechanism comprises a bracket (2), a first T-shaped slider (3), a glue storage barrel (32) and a valve plate (35), the collecting mechanism comprises a constant temperature box (6), a collecting box (63), a second motor (66), an arc-shaped sliding rod (7) and an arc-shaped scraper (73), the bracket (2) is fixedly mounted on both side ends of the base (1), the upper ends of the two brackets (2) are fixedly mounted with a same cross bar (21), the upper ends of the two cross bars (21) are penetrated with a first rectangular groove (22), the first T-shaped slider (3) is penetrated and slidably mounted in the first rectangular groove (22), and the glue storage barrel (32) is fixedly mounted on the first T-shaped slider (3). The lower end of the base (1), the number of the vertical poles (4) is two, the two side ends of the two vertical poles (4) are fixedly installed with mounting plates (41), the side ends of each mounting plate (41) are provided with a T-shaped slide groove (42), the inner side wall of each T-shaped slide groove (42) is slidably installed with a third T-shaped slider (48), and the inner side wall of each T-shaped slide groove (42) is also slidably installed with a fourth T-shaped slider (5), the thermostatic box (6) is fixedly installed on the upper end of the base (1), the upper end of the thermostatic box (6) is fixedly installed with a collecting bucket (61), the side ends of the thermostatic box (6) are fixedly installed with two fixed blocks (64), and the arc-shaped slide rod (7) is located between the two fixed blocks (64).

2. An integrated circuit production and processing equipment as claimed in claim 1, characterized in that: An L-shaped side rod (11) is fixedly mounted on the side end of the base (1), a bracket (2) is fixedly mounted on the side end of the L-shaped side rod (11), the vertical rod (4) located on one side of the L-shaped side rod (11) is fixedly mounted on the side end of the bracket (2), and the vertical rod (4) on the side away from the L-shaped side rod (11) is fixedly mounted on the upper end of the base (1).

3. An integrated circuit production and processing equipment as claimed in claim 2, characterized in that: The first rectangular groove (22) is penetrated by first circular grooves (23) at both side ends, the inner side walls of the two first circular grooves (23) are rotatably mounted with a first reciprocating screw rod (25), and the side end of the cross bar (21) is fixedly mounted with a first motor (24); Wherein, the first reciprocating screw rod (25) is fixedly mounted on the output end of the first motor (24).

4. An integrated circuit production and processing equipment as claimed in claim 3, characterized in that: A first thread groove (31) is formed through the side end of the first T-shaped slider (3), the first reciprocating screw rod (25) is threadably mounted on the inner side wall of the first thread groove (31), a valve (33) is fixedly mounted on the lower end of the glue storage barrel (32), a bellows (34) is fixedly mounted on the lower end of the valve (33), and a valve plate (35) is provided on the inner side wall of the valve (33).

5. An integrated circuit production and processing equipment as claimed in claim 4, characterized in that: A fixed tube (39) is fixedly mounted on the circumferential end of the valve (33), a round shaft (37) is fixedly mounted on the side end of the valve plate (35), the round shaft (37) penetrates and is rotatably mounted on the inner side wall of the fixed tube (39), and a first torsion spring (36) is fixedly mounted between the round shaft (37) and the fixed tube (39); Wherein, a movable rod (38) is fixedly mounted on the side end of the circular shaft (37).

6. An integrated circuit production and processing equipment as claimed in claim 5, characterized in that: The side ends of the two upright poles (4) are penetrated with a second circular groove (43), the inner side walls of the two second circular grooves (43) are penetrated with a double-headed screw (49) rotatably installed, and the upper end of each mounting plate (41) is penetrated with a second rectangular groove (45); Wherein, the upper end of each of the third T-shaped sliders (48) is fixedly mounted with a second T-shaped slider (47), each of the second T-shaped sliders (47) is slidably mounted on the inner side wall of the second rectangular groove (45), the side end of each of the second T-shaped sliders (47) is penetrated by a second threaded groove (46), and the two double-headed screws (49) are threadedly mounted on the inner side wall of each second threaded groove (46).

7. An integrated circuit production and processing equipment as claimed in claim 6, characterized in that: A spring (51) is fixedly installed between each of the fourth T-shaped sliders (5) and each of the third T-shaped sliders (48); a slide plate (52) is fixedly installed on the side end of each of the fourth T-shaped sliders (5); a clamping plate (53) is fixedly installed on the side end of each of the slide plates (52); and the clamping plates (53) on the two vertical rods (4) face opposite directions; Wherein, the upper ends of the two slide plates (52) located on one side of the glue storage barrel (32) are fixedly mounted with push rods (54), and the upper ends of the two push rods (54) are fixedly mounted with the same arc-shaped telescopic rod (55).

8. An integrated circuit production and processing equipment as claimed in claim 7, characterized in that: A side groove (62) is formed through the side end of the thermostatic box (6), a collecting box (63) is installed on the inner wall of the side groove (62), a second reciprocating screw rod (65) is rotatably installed through the two fixed blocks (64), and a second motor (66) is fixedly installed on the side end of the fixed block (64); The second reciprocating screw rod (65) is fixedly mounted on the output end of the second motor (66), and a same limiting rod (67) is also fixedly mounted between the two fixed blocks (64).

9. An integrated circuit production and processing equipment as claimed in claim 8, characterized in that: The side end of the arc-shaped slide rod (7) is penetrated by a third thread groove (71) and a third circular groove (72); the second reciprocating screw rod (65) is threadedly mounted on the inner side wall of the third thread groove (71); the arc-shaped slide rod (7) is slidably mounted on the circumferential end of the limit rod (67) through the third circular groove (72); and a fixed shaft (77) is fixedly mounted on the side end of the arc-shaped slide rod (7); Wherein, a curved scraper (73) is also provided on one side of the curved sliding rod (7).

10. An integrated circuit production and processing equipment as claimed in claim 9, characterized in that: The two side ends of the arc scraper (73) are provided with a rubber guide groove (75), and the side ends of the arc scraper (73) are penetrated by a fourth circular groove (74). The arc scraper (73) is rotatably mounted on the circumferential end of the fixed shaft (77) through the fourth circular groove (74), and a second torsion spring (76) is fixedly mounted between the fixed shaft (77) and the fourth circular groove (74).

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