Heat dissipation component with CPU (central processing unit) and LED (light-emitting diode) lamp beads in direct contact with liquid level and adjustable heat dissipation terminal

Abstract

The invention relates to a radiating system of a CPU (central processing unit) and an LED (light-emitting diode), in particular to a radiating part with an adjustable radiating terminal and a direct contact liquid surface of a CPU and an LED lamp bead, which adopts the scheme that a heating part is directly sealed inside a vacuum radiating cavity, and can directly contact the surface of a heat source to absorb heat from phase change liquid by bypassing the traditional heat-conducting medium such as silicone grease with a single heat conductivity coefficient, and a more direct heat dissipation effect is achieved. And by adopting the scheme that the number of the heat dissipation ends can be adjusted and the flexible hose is connected with the heat dissipation ends and the heating ends, the heat dissipation part can be modularly produced and is universal among different products.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic components, and specifically to a heat dissipation component in which a CPU and LED lamp beads directly contact a liquid surface and a heat dissipation terminal is adjustable. The heat dissipation component is compatible with existing high-end liquid metal heat-conducting media, and can also be a component that directly absorbs heat on the surface of a heat source in a phase change manner using liquids such as water and alcohol. At the same time, the heat dissipation terminal between each platform and different heating elements only needs to replace connecting hoses of different lengths. Background Art

[0002] Modern electronic devices such as CPUs and LED lamp beads are developing in the trend of miniaturization and high performance, and power consumption has also increased accordingly. The internal heat accumulation of electronic components has limited their performance.

[0003] The heat conduction of today's electronic components mainly consists of three parts: the first is the terminal heat sink, such as heat sink fins; the second is the vacuum heat pipe or VC heat sink that quickly transports the heat from the heat source to various parts of the heat dissipation components; the third is the thermal conductive medium such as thermal grease that fills the gap between the vacuum heat pipe and the heat source.

[0004] At present, the gaps between electronic components and vacuum heat pipes or heat sink fins are mainly coated with thermal conductive media made of silicon, such as silicone grease, phase change film, and thermal conductive gel. The biggest drawback of this type of product is that the thermal conductivity is not high. The thermal conductivity of ordinary silicone grease is generally 1-5W / (m·℃), and other high-end materials are generally around 6-10W / (m·℃). Although some media such as silver are added to silicone grease, the thermal conductivity is slightly improved, but there is electrical conductivity, so there is a risk of causing short circuits when used in electronic products.

[0005] In recent years, an advanced thermal conductive medium has emerged in the field of thermal conductivity - liquid metal, and data show that its thermal conductivity has reached tens of W / (m·℃). However, this thermal conductive medium not only has the risk of short circuit after leakage, but also has a high price. However, it can also greatly improve the defect of low thermal conductivity of the original thermal conductive medium. The most important problem of liquid metal thermal conductive medium is the deviation defect during use, which causes part of the heat source surface to lose the heat dissipation effect and dry burn.

[0006] The above-mentioned thermal conductive medium has no obvious effect during the use of low-power and high-power electronic components that are not fully loaded, but it has a huge impact on high-power electronic components that need to be fully loaded or overloaded. Take a common low-power notebook as an example. Assuming that the CPU has a surface area of ​​1cm², it is coated with common silicone grease with a common thermal conductivity of 2W / (m·℃). The silicone grease is pressed to a thickness of 0.2mm and works at a power consumption of 50W. When the heat energy is transferred from the CPU through the 0.2mm silicone grease to the heat dissipation component, according to Fourier's law, it can be calculated that the temperature difference between the two sides of the silicone grease can reach 50℃. The CPU power consumption of a high-power desktop computer such as the 14th generation is 253W. If it uses a phase change film with a thermal conductivity of 10W / (m·℃) and a thickness of 0.2mm, it can also be calculated that the temperature difference between the two sides of the phase change film is 50℃. Assuming that the operating environment is 40℃ in summer, the CPU temperature will reach 90℃ if it passes through only 0.2mm of heat-conducting medium. Adding the temperature difference caused by the heat dissipation components, the final temperature of the CPU will reach more than 100 degrees. Therefore, the CPU in the current electronic field cannot run at full load for a long time, and can only reduce the temperature by reducing the frequency, and the high temperature state greatly reduces the stability of the CPU. For high-power LED lamp beads, the excessive internal temperature backlog will cause their service life to drop sharply. Some data show that the life of LED lamp beads will decrease by 2% for every 1℃ increase.

[0007] The vacuum heat pipe and VC vapor chamber technology, which are already very mature in the heat dissipation field, utilizes the principle that water, alcohol, etc. can undergo phase change in a vacuum environment at room temperature. Therefore, their thermal conductivity ranges from 10,000 to 100,000 W / m℃, which is about 250 times that of copper. Currently, a large number of institutions are researching and continuing to improve the thermal conductivity of heat pipes and VC vapor chambers. However, in the heat dissipation system of electronic components, the heat source exists in point form. The huge heat energy urgently needs to quickly pass through the ultra-thin thermal grease and the small area of ​​the copper tube wall. The huge temperature difference is mainly generated between the heat source and the 0.2-0.5mm thin thermal conductive medium and the copper tube wall at the contact surface of the heat pipe. This junction has become a bottleneck in the heat dissipation system and a major defect in the application scenarios of heat pipes and VC vapor chambers.

[0008] The cooling systems of different models of current computer and notebook manufacturers are all disposable products. They are neither universal across products nor reusable. In particular, the cooling fins on notebook platforms are all customized, welded, and flattened copper vacuum heat pipe fins. When the notebook is eliminated, the copper vacuum heat pipe is difficult to reshape after being flattened and bent, so it is difficult to recycle it, resulting in the defect that the entire copper heat dissipation component can only be scrapped. Summary of the invention

[0009] Technical Problem Solved: The present invention is a heat dissipation component in which the CPU and LED lamp beads directly contact the liquid surface and the heat dissipation terminal is adjustable, the purpose is to solve the following problems of the existing technology: 1. By bypassing the traditional thermal conductivity of silicone grease with a thermal conductivity of only single digits, the solution of directly absorbing heat from the surface of the heating element is adopted by transferring heat through liquid phase change with a thermal conductivity of tens of thousands. There is no other material obstructing the heat flow process in the middle, and the heat can be directly transported from the heat source to the heat dissipation terminal at a speed close to the speed of sound. The thermal conductivity performance is more advanced than the existing technology.

[0010] 2. The basic implementation method provided by the present invention adopts a liquid injection solution in a sealed vacuum environment, which is compatible with existing liquid metal heat dissipation solutions. The purpose is to solve the problems of liquid metal leakage and offset. At the same time, it can continue to be used with existing heat pipe products to upgrade the products that have been produced.

[0011] 3. The optimized implementation scheme provided by the present invention adopts an adjustable number of heat dissipation terminals connected to the heat-generating electronic components. The modular heat dissipation terminals can be used on different platforms, solving the problem that the existing customized heat pipe products are not used on different platforms. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a cross-sectional structural diagram of a basic embodiment of the present invention. Figure 2 This is a cross-sectional structure diagram of the optimized split vacuum chamber of the present invention. In the figure: 1 heat-generating electronic components (CPU / LED), 2 heat-dissipating component base, 3 sealing cavity wall, 4 capillary structure material, 5 capillary structure elastic support column, 6 connecting channel, 7 valve, 8 connecting hose, 9 heat-dissipating cavity wall, 10 vacuum inner cavity, 11 heat-dissipating end vacuum cavity 1, 12 heat-dissipating end vacuum cavity 2. DETAILED DESCRIPTION

[0013] 1. The basic implementation method of the present invention is: 1. Sealing, completely sealing the heating element 1 and the heat dissipation component 2 through the sealing cavity wall 3; 2. Constructing a thermal circulation loop, directly filling the liquid metal or covering the capillary material 4 on the surface of the heating element 1 and extending to the inner surface of the heat dissipation component; 3. Exhausting and extracting the air in the sealed cavity 10, 11, 12; 4. Filling, injecting phase change liquid (such as water, alcohol, etc.) or liquid metal into the sealed cavity 10, 11, 12.

[0014] 2. Further optimize the implementation method of the split vacuum cavity: further optimize the above scheme, design the vacuum heat dissipation system into split parts, the split parts are composed of a heating cavity 10 covering the heating element and heat dissipation cavities 11 and 12 for terminal heat dissipation, the exhaust and filling steps can be completed in the heat dissipation cavities 11 and 12, the inner walls of the heat dissipation cavities 11 and 12 are distributed with materials with capillary effect according to needs, the heat dissipation cavities 11 and 12 can be evacuated in advance and filled with enough liquid to make all the materials 4 with capillary effect reach liquid saturation, finally, the heat dissipation cavities 11 and 12 are connected to the heating cavity 10 through the connecting hose 8, and a valve 7 is designed at the connection between the hose 8 and the heating cavity 10. After connecting the cavities, the valve 7 is opened, and the connecting hose 8 should have two sets of channels, one channel is used for gas to pass through, and the other channel is filled with materials with capillary effect, which is used to connect the capillary material 4 covering the surface of the heating element and the inner surface of the heat dissipation cavity. After the heat dissipation chambers 11 and 12 are connected to the heating chamber 10, if the internal space of the heat dissipation chamber 10 is extremely small, it is only necessary to evacuate the heat dissipation chamber in advance. When the two are connected, the trace air inside the heating chamber 10 will be diluted by the heat dissipation chambers 11 and 12.

[0015] 3. When the split vacuum chamber is used in the heat dissipation scenario of the mobile phone processor, the existing VC heat spreader can be used as the heat dissipation chamber 11. A square opening slightly larger than the CPU processor is opened at the junction of the VC heat spreader and the CPU. A circle of sealing gaskets is arranged around the small opening as a sealed chamber wall 3. Capillary materials such as copper mesh are arranged on the contact surface with the CPU in the square small opening. Springs or shrapnel made of capillary materials are arranged under the copper mesh and other capillary materials. The VC heat spreader has exhaust and liquid injection ports reserved elsewhere. When the CPU is installed, the exhaust and liquid injection ports are used to exhaust and fill the air and then seal.

[0016] 4. The split vacuum chamber is designed for ultra-high power heating elements. If the liquid absorption speed of the capillary structure material cannot keep up with the evaporation speed of the heating element 1, a spray nozzle component can be added to the heating chamber 10. The spray nozzle component is connected to the liquid surface in the split vacuum heat dissipation component, and the liquid in the liquid surface is extracted by the existing technology to spray the heating element 1.

[0017] 5. The split vacuum chamber described above can be further optimized into a method similar to the air conditioning compression principle for application scenarios that require temperature control to below the ambient temperature. In this case, the heat dissipation chambers 11 and 12 can be made into flexible double chambers, in which the heat dissipation chamber 12 is designed as a large chamber and the heat dissipation chamber 11 is a small chamber. There is a controllable valve between the two chambers, and there should also be a controllable valve between the two chambers and the heating chamber 10. The design of the heating chamber should be increased accordingly, and the sealing wall should have a heat preservation effect. By closing valve 7, the internal space of the heat dissipation chamber 11 is reduced using external parts until the steam inside the chamber condenses and releases heat energy. After the small chamber collects enough liquid, the connecting valves of the two chambers are closed, and the connecting valve 7 is opened to transport the condensate to the heating chamber 10. After the condensate is consumed, all valves are opened, and the cycle is repeated.

[0018] 6. The split vacuum chamber can be combined with existing products such as heat pipes or VC soaking plates. It is necessary to open holes in the heat pipes and VC soaking plates, and then connect the heating chamber 10 through a hose. It can also be made of other materials according to the actual use environment and heat dissipation requirements. If the volume of the heat dissipation system is not considered, the terminal heat dissipation can be made of cheap materials such as high-hardness plastics with a larger area. If the heat dissipation requirements are not high and there are aesthetic or atmosphere requirements, it can be made of glass, and a micro wind-driven power generation or thermal power generation device can be installed inside to power the built-in atmosphere lamp.

[0019] 7. A cross-shaped semi-flexible skeleton or a spring skeleton can be added to the interior of the connecting hose 8 according to needs to increase the hose's ability to resist the extrusion of atmospheric pressure. One set of hoses is only used for air to pass through, and the other set of hoses is only used to place materials with capillary effects such as cotton strips.

[0020] 8. The capillary structure material 4 should take into account the actual use requirements. If the use environment is a scene where the direction needs to be changed frequently, all the inner walls of the cavity should be covered with materials with capillary effect. If the use environment is a relatively stable environment without upside-down, such as LED projectors, car LED lights, server hosts, etc., the heat dissipation cavity 11 can only place materials with capillary effect at its bottom, and the upper part does not need to be covered with capillary materials. The liquid filled in the heat dissipation cavity 11 can be increased. After the steam condenses at the upper part of the heat dissipation cavity 11, it naturally slides to the capillary material 4 at the bottom and is transported to the surface of the heating element 1 through capillary action. The heat dissipation cavity 11 should be placed so that the internal liquid level is slightly lower than the position of the heating element 1.

[0021] 9. Super absorbent resin material can be applied to the sealing interfaces of each component as needed to absorb the leaked liquid in case of seal failure.

Claims

1. A heat dissipation component in which the CPU and LED lamp beads directly contact the liquid surface and the heat dissipation terminal is adjustable, the component comprising: A sealed cavity wall 3 is used to construct a sealed cavity 10 for a heating element and a heat dissipation terminal; The heat circulation loop constructed by the capillary materials 4 and 8 is used to absorb the condensed liquid and transport it to the surface of the heating element again; In a negative pressure environment, the air in the sealed chambers 10, 11, and 12 should be extracted; Liquid heat-conducting medium: the sealed cavity 10 should be filled with liquid.

2. A heat dissipation component according to claim 1, wherein the CPU and LED lamp beads directly contact the liquid surface and the heat dissipation terminal is adjustable, characterized in that: The liquid is in direct contact with the heating element 1 under negative pressure or vacuum environment; the cavity between the heat dissipation terminal and the heating end can be made into heat dissipation cavities 11, 12 and a heating cavity 10, but the two cavities should be connected; the heat dissipation cavity 11 can be modularized and the number can be adjusted.

3. A heat dissipation component according to claim 1, wherein the CPU and LED lamp beads directly contact the liquid surface and the heat dissipation terminal is adjustable, characterized in that: When the injected liquid is liquid metal, the heat circulation loop is liquid metal that evenly penetrates into the gap between the heat source and the radiator base in an environment without air obstruction, Figure 1-10; when the injected liquid is a liquid that can undergo a phase change effect in a normal temperature vacuum environment, the heat circulation loop is a capillary material 4 that covers the surface of the heating element and extends to the heat dissipation component.

4. A heat dissipation component with CPU and LED lamp beads directly contacting the liquid surface and with adjustable heat dissipation terminal according to claim 1, characterized in that: The sealed cavity 10 can be designed as a separate component, the heat-generating electronic component 1 is wrapped by the sealed cavity wall 3 , and the vacuum cavities 11 , 12 at the heat dissipation end are connected to the sealed cavity 10 through the pipeline 8 .

5. A heat dissipation component with CPU and LED lamp beads directly contacting the liquid surface and with adjustable heat dissipation terminal according to claim 4, characterized in that: The pipe 8 may be a flexible pipe, and the branches of the flexible pipe may be increased or decreased according to demand, so as to further adjust the number of heat dissipation chambers 11 and 12 connected to the heat-generating electronic components.

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