Substrate processing apparatus and substrate processing method

Abstract

The invention discloses an apparatus for processing a substrate and a method for processing the substrate. The device comprises: a body providing a processing space; a first fluid supply line connected to the body and supplying a processing fluid to the processing space; a second fluid supply line connected to the body at a different position from the first fluid supply line, and supplying the processing fluid to the processing space; a first supply valve installed in the first fluid supply line; and an air removal line, one end of which is connected to the first fluid supply line downstream of the first supply valve, to allow air introduced into the processing space of the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies the processing fluid to the processing space.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0083383 filed in the Korean Intellectual Property Office on June 28, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0004] In order to manufacture semiconductor devices, a desired pattern is formed on a substrate such as a wafer through various processes such as photography, etching, ashing, ion implantation, and thin film deposition. Various processing solutions and processing gases are used in each process, and particles and process byproducts are generated during the process. Cleaning processes are performed before and after each process to remove these particles and process byproducts from the substrate.

[0005] In the cleaning process, the substrate is cleaned by supplying a cleaning solution to the substrate. The substrate is then dried to remove any residual cleaning solution on the substrate. An example of a drying process is a spin drying process, in which the substrate is rotated at a high speed to remove any residual cleaning solution on the substrate. However, the spin drying process of rotating the substrate to remove the cleaning solution has the risk of damaging the pattern formed on the substrate. In addition, when the aspect ratio of the pattern increases, the cleaning fluid introduced between the patterns may not be fully removed due to the rotation of the substrate.

[0006] Recently, a supercritical drying process has been utilized, in which a cleaning solution remaining on a substrate is replaced with an organic solvent having a low surface tension, such as isopropyl alcohol (IPA), and then a supercritical drying gas (e.g., carbon dioxide) is supplied to the substrate to remove the remaining organic solvent from the substrate. In the supercritical drying process, a drying gas is supplied into a sealed chamber, and the drying gas is heated and pressurized. Both the temperature and pressure of the drying gas rise to a critical point or above, and the drying gas undergoes a phase change to reach a supercritical state.

[0007] The dry gas in the supercritical state has high solubility and permeability. In other words, when the supercritical dry gas is supplied to the substrate, the dry gas easily penetrates into the pattern on the substrate, and the organic solvent remaining on the substrate is also easily dissolved in the dry gas. Therefore, the pattern formed on the substrate and the organic solvent remaining between the patterns can be easily removed.

[0008] Figure 1 FIG. 1 is a diagram showing a general substrate processing apparatus that performs a supercritical drying process.

[0009] See also Figure 1 The substrate processing apparatus for performing a conventional supercritical drying process includes a lower chamber 1, an upper chamber 2, a support member 3, a lower supply line 4, a lower valve 5, an upper supply line 6, an upper valve 7, a discharge valve 8 and a pump 9.

[0010] The lower chamber 1 and the upper chamber 2 are combined with each other to provide a processing space in which the substrate W is processed, and the support member 3 is installed in the upper chamber 2 and configured to support the bottom edge region of the substrate W. When the process starts, the lower supply line 4 supplies the dry gas G to the lower portion of the substrate W. The dry gas G increases the pressure in the processing space. The pressure in the processing space where the chambers 1 and 2 are provided is pressurized to be higher than the critical pressure, at which the dry gas G can maintain a supercritical state.

[0011] The dry gas G may not be able to maintain a supercritical state until the pressure in the process space reaches a threshold pressure. Therefore, first supplying the dry gas G from the upper supply line 6 may allow the substrate W to be supplied with the dry gas G in a gas state that is not in a supercritical state. Therefore, when the process space is pressurized, the dry gas G is first supplied from the lower supply line 4, and when the pressure of the process space is slightly increased, the dry gas G is supplied from the upper supply line 6.

[0012] In this case, the dry gas G supplied through the lower supply line 4 pushes the air in the processing space in the upward direction. The air pushed by the dry gas G is introduced into the upper supply line 6 and compressed near the closed upper valve 7. The compressed air forms an air pocket AP.

[0013] like Figure 2 As shown, when the dry gas G is supplied from the upper supply line 6 , the air pockets AP are transferred to the top surface of the substrate W. The air pockets AP transferred to the substrate W may cause defects in the substrate W. Summary of the invention

[0014] The present invention is directed to providing a substrate processing device and a substrate processing method capable of effectively processing a substrate.

[0015] The present invention is directed to providing a substrate processing device and a substrate processing method capable of increasing the drying efficiency of a substrate.

[0016] The present invention is directed to providing a substrate processing apparatus and a substrate processing method capable of minimizing the transfer of air pockets to a substrate.

[0017] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those of ordinary skill in the art.

[0018] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a body providing a processing space; a first fluid supply line connected to the body and supplying a processing fluid to the processing space; a second fluid supply line connected to the body at a position different from the first fluid supply line and supplying a processing fluid to the processing space; a first supply valve installed in the first fluid supply line; and an air removal line, one end of which is connected to the first fluid supply line at a downstream position compared to the first supply valve to allow air introduced into the processing space of the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies the processing fluid to the processing space.

[0019] According to an exemplary embodiment, the apparatus may further include an exhaust line for exhausting the atmosphere of the processing space, wherein the other end of the air removal line is connected to the exhaust line.

[0020] According to an exemplary embodiment, the apparatus may further include a discharge valve installed in the discharge line, wherein, in order to allow air introduced into the air removal line to be discharged from the processing space, the other end of the air removal line is connected to the discharge line downstream of the exhaust valve.

[0021] According to an exemplary embodiment, the apparatus may further include a discharge valve installed in the discharge line, wherein the other end of the air removal line is connected to the discharge line upstream of the exhaust valve in order to allow air introduced into the air removal line to circulate to the processing space.

[0022] According to an exemplary embodiment, the device may further include a discharge valve installed in the discharge line, wherein the air removal line includes: a main removal line connected to the first fluid supply line; a circulation line branched from the main removal line and connected to an upstream side compared to the discharge valve; and a discharge line branched from the main removal line to be connected to a downstream side compared to the exhaust valve.

[0023] According to an exemplary embodiment, the air removal line may be connected to the first fluid supply line within 200 mm from the first supply valve.

[0024] According to an exemplary embodiment, the body may be provided with a first supply port connected with the first fluid supply line and a second supply port connected with the second fluid supply line, and an outlet of the first supply port and an outlet of the second supply port are opposite to each other.

[0025] According to an exemplary embodiment, the device may also include: an air removal valve installed in the air removal pipeline; a second supply valve installed in the second fluid supply pipeline; and a controller configured to control the operation of the first supply valve, the second supply valve and the air removal valve, wherein the controller may generate a signal for performing the following: closing the first supply valve and opening the second supply valve to allow the processing fluid to be supplied to the processing space through the second fluid supply pipeline; and opening the air removal valve to allow the air introduced into the processing space of the first fluid supply pipeline to be introduced into the air removal pipeline.

[0026] According to an exemplary embodiment, the controller may generate a control signal to perform an operation of opening the first supply valve to allow the process fluid to be supplied to the processing space through the first fluid supply line after air is introduced into the air removal line.

[0027] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method comprising: a liquid processing operation, in which a processing solution is supplied to the substrate; and a drying operation, in which the substrate supplied with the processing solution is loaded into a processing space provided with a body, and the substrate is dried by supplying a processing fluid, wherein the drying operation comprises: a pressurizing operation, in which the processing fluid is supplied to the processing space to pressurize the processing space to a set pressure; a flowing operation, in which the processing fluid in the processing space is made to flow to remove the processing solution remaining on the substrate; and a decompression operation, in which the atmosphere of the processing space is discharged to decompress the processing space, and the pressurizing operation comprises: a first supply operation, in which the processing fluid is supplied to the processing space through a second fluid supply line connected to the body; and an air removal operation, in which the air introduced into the first fluid supply line from the processing space is removed by the processing fluid supplied in the first supply operation via an air removal line connected to the first fluid supply line, the first fluid supply line being connected to the body at a position different from that of the second fluid supply line.

[0028] According to an exemplary embodiment, the pressurizing operation may further include a second supplying operation of supplying the processing fluid to the processing space through the first fluid supply line after the air removing operation.

[0029] According to an exemplary embodiment, the air removal line may be connected to an exhaust line for exhausting the atmosphere of the process space, and the air removal operation includes circulating the air introduced into the first fluid supply line to the process space through the air removal line and the exhaust line.

[0030] According to an exemplary embodiment, the air removal line may be connected to an exhaust line for exhausting the atmosphere of the process space, and the air removal operation includes exhausting air introduced from the process space to the first fluid supply line through the air removal line and the exhaust line.

[0031] According to an exemplary embodiment, the air removal line can be connected to an exhaust line for exhausting the atmosphere of the processing space, and the air removal operation includes exhausting the air introduced into the first fluid supply line to the outside through the air removal line and the exhaust line, and then circulating the processing fluid to the processing space through the air removal line and the exhaust line.

[0032] According to an exemplary embodiment, the air removal line may be connected to the first fluid supply line downstream of a first supply valve installed in the first fluid supply line to introduce air accumulated in an area adjacent to the first supply valve into the air removal line.

[0033] According to an exemplary embodiment, the air removal line may be connected to the first fluid supply line within 200 mm from the first supply valve.

[0034] According to an exemplary embodiment, the air removal line may be connected to the first fluid supply line within 200 mm from the first supply valve.

[0035] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a body providing a processing space; a fluid supply unit for supplying a processing fluid to the processing space; an exhaust unit for exhausting the atmosphere of the processing space; and an air removal line for removing air introduced into the fluid supply unit, wherein the fluid supply unit comprises: a first fluid supply line for supplying the processing fluid to a first area of ​​the processing space; a second fluid supply line for supplying the processing fluid to a second area of ​​the processing space; and a second fluid supply line for supplying the processing fluid to a second area of ​​the processing space. A fluid is supplied to a second area different from a first area of ​​a processing space; a first supply valve, which is installed in a first fluid supply pipeline; and a second supply valve, which is installed in a second fluid supply pipeline; and the discharge unit includes: a discharge pipeline, which is connected to the body; a discharge valve, which is installed on the discharge pipeline; and a discharge device, which is used to discharge the atmosphere of the processing space through the discharge pipeline, and an air removal line has one end connected to the first fluid supply pipeline at a position within 200 mm from the first supply valve, and the other end connected to the discharge pipeline.

[0036] According to an exemplary embodiment, the device may also include: an air removal valve installed in the air removal pipeline; and a controller configured to control the operation of the first supply valve, the second supply valve and the air removal valve, wherein the controller generates a signal for performing the following: closing the first supply valve and opening the second supply valve to allow the processing fluid to be supplied to the processing space through the second fluid supply pipeline; and opening the air removal valve to allow the air introduced into the processing space of the first fluid supply pipeline to be introduced into the air removal pipeline.

[0037] According to an exemplary embodiment, the controller may generate a control signal to perform an operation of opening the first supply valve to allow the process fluid to be supplied to the processing space through the first fluid supply line after air is introduced into the air removal line.

[0038] According to the exemplary embodiments of the present invention, a substrate can be efficiently processed.

[0039] Furthermore, according to the exemplary embodiment of the present invention, the drying process efficiency of the substrate may be improved.

[0040] Furthermore, according to the exemplary embodiment of the present invention, the transfer of air pockets to the substrate can be minimized.

[0041] The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand unmentioned effects from the present specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 FIG. 1 is a diagram showing a general substrate processing apparatus that performs a supercritical drying process.

[0043] Figure 2 To show that in Figure 1 Figure 2. A diagram of the gas pocket generated in the supercritical fluid supply line and transferred to the substrate.

[0044] Figure 3 FIG. 1 is a top view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0045] Figure 4 For schematic illustration Figure 3 FIG. 1 is a diagram of an exemplary embodiment of a liquid processing chamber.

[0046] Figure 5 For schematic illustration Figure 3 FIG. 1 is a diagram of an exemplary embodiment of a drying chamber.

[0047] Figure 6 FIG. 2 is a flow chart showing a substrate processing method according to an exemplary embodiment of the present invention.

[0048] Figure 7 To show the execution Figure 6 FIG. 1 is a view of a liquid handling chamber for liquid handling operations.

[0049] Figure 8 To show that when executing Figure 6 A diagram showing the pressure change in the processing space of the drying chamber during the drying operation.

[0050] Fig. 9 To show the execution Figure 6 Flow chart of the sequence of pressurization operations.

[0051] Fig.10 To show the execution Fig. 9 FIG. 1 is a view of a drying chamber of a first supply operation.

[0052] Fig.11 To show the execution Fig. 9 Figure 2. A view of a drying chamber of the air removal operation.

[0053] Fig.12 To show the execution Fig. 9 FIG. 1 is a view of a drying chamber of a second supply operation.

[0054] Fig.13 is a diagram illustrating a view of a drying chamber including an air removal unit performing an air removal operation according to another exemplary embodiment of the present invention.

[0055] Fig.14 is a diagram showing a view of a drying chamber including an air removal unit according to another exemplary embodiment of the present invention.

[0056] Fig.15 is a diagram showing a view of a drying chamber according to another exemplary embodiment of the present invention.

[0057] Fig.16 is a diagram showing a view of a drying chamber according to another exemplary embodiment of the present invention.

[0058] By studying the detailed description in conjunction with the accompanying drawings, various features and advantages of the non-limiting exemplary embodiments of the present specification may become apparent. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not considered to be drawn to scale. For clarity, the various dimensions in the drawings may be exaggerated. DETAILED DESCRIPTION

[0059] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the disclosure is thorough and the scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, equipment, and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, known processes, known equipment structures, and known technologies are not described in detail.

[0060] The terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" may be intended to include plural forms. The terms "comprises, comprising", "including" and "having" are inclusive and therefore specifically refer to the presence of the features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an execution order, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0061] When an element or layer is referred to as being "on another element or layer," "engaged to," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly engaged to, directly connected to, or directly coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on another element or layer," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0062] Although the terms "first", "second", "third", etc. can be used in this article to describe different elements, components, regions, layers and / or sections, unless otherwise specified, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, first component, first region, first layer or first section discussed below can be referred to as the second element, second component, second region, second layer or second section.

[0063] For ease of description, spatially relative terms such as "inside," "outside," "below," "beneath," "below," "above," and the like may be used herein to describe the relationship of one element or feature to another element or feature, as shown in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientations described in the accompanying drawings. For example, if the device in the figure is flipped, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" is able to encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0064] When the terms "same" or "identical" are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0065] When the term "approximately" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in connection with geometric shapes, it should be understood that the precision of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0066] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0067] Figure 3 FIG. 1 is a top view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0068] See also Figure 3 , the substrate processing device includes an index module 10, a processing module 20 and a controller 30. When viewed from above, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction X, and when viewed from above, a direction perpendicular to the first direction X is referred to as a second direction Y, and a direction perpendicular to both the first direction X and the second direction Y is referred to as a third direction Z.

[0069] The index module 10 transfers the substrate W from the container C containing the substrate W therein to the processing module 20, and contains the substrate W that has been processed in the processing module 20 into the container C. The longitudinal direction of the index module 10 is set in the second direction Y. The index module 10 includes a loading port 12 and an index frame 14. The loading port 12 is located at an opposite side of the processing module 20 based on the index frame 14. The container C containing the substrate W therein is placed on the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be arranged along the second direction Y.

[0070] An airtight container such as a Front Open Unified Pod (FOUP) may be used as the container C. The container C may be placed on the load port 12 by a transport device (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle, or by an operator.

[0071] The index robot 120 is provided to the index frame 14. A guide rail 124 (the longitudinal direction of which is provided in the second direction Y) is provided in the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 124. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable in the forward and backward directions, rotatable about the third direction Z, and movable along the third direction Z. A plurality of hands 122 are provided to be spaced apart from each other in the vertical direction, and the hands 122 may be moved forward and backward independently of each other.

[0072] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space where the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 temporarily stay. The liquid processing chamber 400 performs a liquid processing process of processing the substrate W with liquid by supplying liquid onto the substrate W. The drying chamber 500 performs a drying process of removing liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0073] The buffer unit 200 includes a plurality of buffer zones 220 on which the substrate W is placed. The buffer zones 220 may be disposed to be spaced apart from each other along the third direction Z. The buffer zones 220 may be substrate holders that support the bottom surface of the substrate W. The buffer zones 220 may be provided in the form of a support frame that supports the bottom surface of the substrate W.

[0074] The front and rear of the buffer unit 200 are open. The front is a face facing the index module 10, and the rear is a face facing the transfer chamber 300. The index robot 120 can approach the buffer unit 200 through the front, and the transfer robot 320 can approach the buffer unit 200 through the rear.

[0075] The longitudinal direction of the transfer chamber 300 may be disposed in the first direction X. The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 may be disposed on a side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be disposed along the second direction Y. The drying chamber 500 and the transfer chamber 300 may be disposed along the second direction Y. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0076] According to an example, the liquid processing chamber 400 is disposed on both sides of the transfer chamber 300, and the drying chamber 500 is disposed on both sides of the transfer chamber 300, and the liquid processing chamber 400 may be disposed closer to the buffer unit 200 than the drying chamber 500. At one side of the transfer chamber 300, the liquid processing chamber 400 may be disposed in an A×B (each of A and B is a natural number of 1 or greater than 1) arrangement in the first direction X and the third direction Z. In addition, at one side of the transfer chamber 300, the drying chamber 500 may be disposed in a C×D (each of C and D is a natural number of 1 or greater than 1) number in the first direction X and the third direction Z. Different from the above, only the liquid processing chamber 400 may be disposed on one side of the transfer chamber 300, and only the drying chamber 500 may be disposed on the other side of the transfer chamber 300.

[0077] The transfer chamber 300 includes a transfer robot 320. A guide rail 324 (the longitudinal direction of which is set in the first direction X) is provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 324. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 may be provided to be movable in the forward and backward directions, rotatable around the third direction Z, and movable along the third direction Z. A plurality of hands 322 may be provided to be spaced apart from each other in the vertical direction, and may be movable forward and backward independently of each other.

[0078] The controller 30 can control the substrate processing device. The controller 30 may include: a process controller, which is composed of a microprocessor (computer) that performs control of the substrate processing device; a user interface, which is composed of a keyboard, and the operator performs command input operations on the keyboard to manage the substrate processing device; a display, which is used to visualize and display the operating status of the substrate processing device; and a storage unit, which stores a control program for executing a process performed in the substrate processing device under the control of the process controller, or stores a program (i.e., a processing scheme) for executing a process in each component according to various data and processing conditions. In addition, the user interface and the storage unit can be connected to the process controller. The processing scheme can be stored in a storage medium in the storage unit, and the storage medium can be a hard disk, a portable disk (such as a CD-ROM or a DVD), or a semiconductor memory (such as a flash memory).

[0079] The controller 30 may control the configuration of the substrate processing apparatus to perform the substrate processing method described below. For example, the controller 30 may generate a control signal to control the opening or closing operation of the valves 535 , 536 , 543 , and 552 of the drying chamber 500 .

[0080] Figure 4 For schematic illustration Figure 3 FIG. 1 is a diagram of an exemplary embodiment of a liquid processing chamber.

[0081] See also Figure 4 The liquid processing chamber 400 includes a housing 410 , a processing container 420 , a supporting unit 440 , a liquid supply unit 460 , and a lifting unit 480 .

[0082] The housing 410 may have an inner space for processing the substrate W. The housing 410 may have a substantially hexahedral shape. For example, the housing 410 may have a cubic shape. In addition, the housing 410 may have an opening (not shown) through which the substrate W is loaded or unloaded. In addition, the housing 410 may be equipped with a door (not shown) that selectively opens and closes the opening.

[0083] The processing container 430 may have a cylindrical shape with an open top. The processing container 420 may provide a processing space in which the substrate W is processed. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies a processing solution to the substrate W supported on the support unit 440. The processing solution may be provided in a variety of types and may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the processing container 420 and the substrate W placed on the support unit 440.

[0084] In one example, the processing container 420 has a plurality of collection containers 422, 424, and 426. Each of the collection containers 422, 424, and 426 has a collection space for collecting liquid used to process the substrate. Each of the collection containers 422, 424, and 426 is provided in a shape surrounding the support unit 440. As the liquid treatment process proceeds, the treatment solution sputtered by the rotation of the substrate W enters the collection space through the inlets 422a, 424a, and 426a of the respective collection containers 422, 424, and 426. In one example, the processing container 420 has a first collection container 422, a second collection container 424, and a third collection container 426. The first collection container 422 is provided to surround the support unit 440, the second collection container 424 is provided to surround the first collection container 422, and the third collection container 426 is provided to surround the second collection container 424.

[0085] The second inlet 424a introducing liquid into the second collection container 424 may be located above the top side of the first inlet 422a introducing liquid into the first collection container 422, and the third inlet 426a introducing liquid into the third collection container 426 may be located above the top side of the second inlet 424a.

[0086] The supporting unit 440 includes a supporting plate 442 and a driving shaft 444. The upper surface of the supporting plate 442 may be provided in a substantially circular shape and may have a diameter greater than the diameter of the substrate W. An edge region of the top surface of the supporting plate 442 may be provided with supporting pins 442a that support the rear surface of the substrate W. The supporting pins 442a are provided with top ends protruding from the supporting plate 442 so that the substrate W is spaced a certain distance from the supporting plate 442.

[0087] The chuck pin 442b is provided at the edge of the top surface of the support plate 442. The chuck pin 442b may be provided at the outer side of the support pin 442a. The chuck pin 442b is provided to protrude upward from the support plate 442 and clamp the side of the substrate W so that the substrate W is not separated from the support unit 440 when the substrate W rotates. The driving shaft 444 is driven by the driver 446 and coupled to the center of the lower surface of the support plate 442 and rotates the support plate 442 about its central axis.

[0088] The liquid supply unit 460 may supply a processing solution to the substrate W. The liquid supply unit 460 may include an arm 461, a nozzle 462, and a driver 463. The nozzle 462 may be installed at one end of the rod-shaped arm 461. The driver 463 may be configured in the form of a rotation axis with a third direction Z as a rotation axis, and may be coupled to the other end of the arm 461. The driver 463 may axially rotate the arm 461 by rotating in the third direction Z as the rotation axis. Therefore, the position of the nozzle 462 installed at one end of the arm 461 may be changed.

[0089] The nozzle 462 may supply a treatment solution to the substrate W. The treatment solution may be a chemical, a rinse solution, or an organic solvent. The chemical may be a chemical having a strong acid or a strong base property. In addition, the rinse solution may be pure water. In addition, the organic solvent may be isopropyl alcohol (IPA).

[0090] Although Figure 4 4 shows only one nozzle 462, but the liquid supply unit 460 may include a plurality of nozzles 462, and each nozzle 462 may be configured to supply a different type of processing solution. For example, one of the nozzles 462 may supply a chemical, another of the nozzles 462 may supply a rinsing solution, and another of the nozzles 462 may supply an organic solvent. In addition, the controller 30 may control the liquid supply unit 460 to supply the rinsing solution from one of the nozzles 462 to the substrate W, and then supply the organic solvent from another of the nozzles 462. Therefore, the rinsing solution supplied to the substrate W can be replaced with an organic solvent having a small surface tension.

[0091] The lifting unit 480 may move the processing container 420 in an upward or downward direction. The relative height between the processing container 420 and the substrate W changes as the processing container 420 moves up and down. The lifting unit 480 may include a power generation device such as a motor, a pneumatic cylinder, or a hydraulic cylinder. The lifting unit 480 may adjust the height of the processing container 420 to distinguish the collection containers 422, 424, and 426 for collecting the processing solution according to the type of liquid supplied to the substrate W.

[0092] Alternatively, as described above, the processing container 420 may be fixedly installed, and the support plate 442 may be configured to be movable in the up-down direction.

[0093] Figure 5 For schematic illustration Figure 3 FIG. 1 is a diagram of an exemplary embodiment of a drying chamber.

[0094] See also Figure 5, a drying chamber 500 according to an exemplary embodiment of the present invention may include a body 510 , a support member 520 , a fluid supply unit 530 , a fluid discharge unit 540 , and an air removal unit 550 .

[0095] The body 510 may provide a processing space 513 in which the substrate W is processed. The body 510 may include a first body 511 and a second body 512. At least one of the first body 511 and the second body 512 may have a shape that is recessed in a direction away from the other of the first body 511 and the second body 512. The first body 511 and the second body 512 may be combined with each other to define the processing space 513. The first body 511 and the second body 512 may be formed of a material that can withstand the high pressure conditions of the processing space 513. For example, the first body 511 and the second body 512 may be formed of a material such as a metal (such as aluminum). The first body 511 may be an upper body located at the top, and the second body 512 may be a lower body located at the bottom.

[0096] The position of at least one of the first body 511 and the second body 512 may be changed by a driver (not shown). For example, the position of the first body 511 may be fixed, and the second body 512 may be configured to be movable along the third direction Z. The driver may be any one of a cylinder, a pneumatic cylinder, a motor, and a magnetic suspension actuator.

[0097] The driver can move the second body 512 between the open position and the closed position. When the second body 512 is in the open position, the processing space 513 can be opened outward. When the second body 512 is in the closed position, the first body 511 and the second body 512 can be combined with each other to provide a sealed processing space 513.

[0098] The first body 511 may be provided with a first supply port 514. The first supply port 514 may be connected to a first fluid supply line 533 to be described later to supply a processing fluid to the processing space 513. An outlet of the first supply port 514 faces an upper area of ​​the processing space 513 and may face an upper surface of the substrate W resting on the support member 520. The first supply port 514 may be formed on the first body 511 itself, or may be provided as a separate supply conduit inserted into the first body 511.

[0099] The second body 512 may be provided with a second supply port 515. The second supply port 515 may be connected to a second fluid supply line 534 described later to supply a processing fluid to the processing space 513. An outlet of the second supply port 515 may face a lower area of ​​the processing space 513. Similar to the first supply port 514, the second supply port 515 may be formed in the second body 512 itself, or may be provided as a separate supply conduit inserted into the second body 512.

[0100] In addition, the second body 512 may be provided with an exhaust port 516. The exhaust port 516 may be connected to an exhaust line 541 described later to exhaust the atmosphere of the processing space 513. The exhaust port 516 may exhaust a processing fluid (such as carbon dioxide) supplied to the processing space 513 to the outside of the processing space 513 to reduce the pressure in the processing space 513. The exhaust port 516 may be provided in parallel with the second supply port 515. Similar to the first supply port 514 and the second supply port 515, the exhaust port 516 may be formed in the second body 512 itself, or may be provided as a separate supply pipe inserted into the second body 512.

[0101] In the example described above, the present invention is described based on the case where the first supply port 514 is provided on the first body 511 and the second supply port 515 and the exhaust port 516 are provided on the second body 512 as an example, but the present invention is not limited thereto. For example, the first supply port 514, the second supply port 515 and the exhaust port 516 may all be provided on the first body 511, or may all be provided on the second body 512.

[0102] The body 510 may be provided with a heater 517. The heater 517 may be installed while being buried inside the first body 511 and / or the second body 512. The heater 517 may be a resistance heater. Alternatively, the heater 517 may be modified variously to any known device that generates heat. The heater 517 may increase the temperature of the processing space 513. The heater 517 may maintain the temperature of the processing space 513 at a set temperature. Herein, the set temperature may be set to a temperature higher than a critical temperature that allows the state of the processing fluid to remain supercritical.

[0103] The support member 520 may support the substrate W. The support member 520 may be configured to support the substrate W in the processing space 513 where the body 510 is disposed.

[0104] The support member 520 may be configured to support the bottom surface of the substrate W. The support member 520 may be configured to support the bottom edge region of the substrate W. The support member 520 may be fixedly mounted on the bottom side of the first body 511. The support members 520 may be provided in pairs. Each support member 520 may extend in a downward direction from the first body 511 to the second body 512, and may have a transversely curved shape at the end to support the bottom surface of the substrate W.

[0105] When the contact area between the substrate W and the support member 520 is large, the risk of damage to the bottom surface of the substrate W (such as scratches) increases; however, the support member 520 can be configured to support only the edge area of ​​the bottom surface of the substrate W, thereby minimizing the contact area with the bottom surface of the substrate W.

[0106] The fluid supply unit 530 may supply a treatment fluid to the processing space 513. The treatment fluid may be a dry gas that removes any residual treatment solution on the substrate W. For example, the treatment fluid may be a carbon dioxide gas. The treatment fluid may also be converted into a supercritical state and supplied to the processing space 513. Alternatively, the treatment fluid may be supplied to the processing space 513 in a gaseous state and phase-converted into a supercritical state in the processing space 513.

[0107] The fluid supply unit 530 may include a fluid supply source 531 , a main supply line 532 , a first fluid supply line 533 , a second fluid supply line 534 , a first supply valve 535 , and a second supply valve 536 .

[0108] The supply lines 532 , 533 , and 534 may be equipped with line heaters (not shown) to heat the process fluid flowing in the supply lines 532 , 533 , and 534 .

[0109] The fluid supply source 531 may store and supply the treatment fluid. The fluid supply source 531 may be a fluid storage tank capable of storing and supplying the treatment fluid. The fluid supply source 531 may be configured to store and supply carbon dioxide.

[0110] The fluid supply source 531 may be connected to one end of a main supply line 532. The other end of the main supply line 532 may be branched into a first fluid supply line 533 and a second fluid supply line 534. The first fluid supply line 533 may be connected to the first supply port 514 described above. The second fluid supply line 534 may be connected to the second supply port 515. The first fluid supply line 533 may be configured to supply a processing fluid to an upper area of ​​the processing space 513, and the second fluid supply line 534 may be configured to supply a processing fluid to a lower area of ​​the processing space 513.

[0111] The first supply valve 535 may be installed in the first fluid supply line 533. The first supply valve 535 may be provided as an automatic valve that receives a control signal from the controller 30 to allow or block the flow of the process fluid in the first fluid supply line 533.

[0112] Similarly, the second fluid supply line 534 may be provided with a second supply valve 536. The second supply valve 536 may be provided as an automatic valve that receives a control signal from the controller 30 to allow or prevent the flow of the process fluid in the second fluid supply line 534.

[0113] The fluid discharge unit 540 may control the atmosphere of the processing space 513. The fluid discharge unit 540 may discharge the processing fluid supplied to the processing space 513 to the outside of the drying chamber 500. The fluid discharge unit 540 may include a fluid discharge line 541, a discharge device 542, and a discharge valve 543.

[0114] The fluid discharge line 541 may be connected to the discharge port 516. A discharge valve 543 may be installed in the fluid discharge line 541, and the discharge valve 543 may be provided as an automatic valve that receives a control signal from the controller 30 to allow or prevent the flow of the process fluid in the discharge line 541.

[0115] The exhaust device 542 may be coupled to the exhaust line 541. The exhaust device 542 may be a decompression device that decompresses the processing space 513. For example, the exhaust device 542 may be a pump. However, there is no limitation, and the exhaust device 542 may be variously modified to any known device capable of providing decompression to the processing space 513 through the exhaust line 541 and the exhaust port 516.

[0116] The air removal unit 550 may be configured to remove air that may be introduced from the fluid supply unit 530 into the processing space 513 from the fluid supply unit 530. For example, the air removal line 551 may be configured to remove air that may be introduced from the processing space 513 from the first fluid supply line 533. The air removal unit 550 may include the air removal line 551 and an air removal valve 552.

[0117] One end of the air removal line 551 may be connected to the first fluid supply line 533 downstream of the first supply valve 535 installed in the first fluid supply line 533. In addition, the other end of the air removal line 551 may also be connected to the exhaust line 541 downstream of the exhaust valve 543 installed in the exhaust line 541.

[0118] The air removal line 551 may be connected to the first fluid supply line 533 at a position very close to the first supply valve 535. The air removal line 551 may be connected to the first fluid supply line 533 at a position within 200 mm of the first supply valve 535. For example, the distance "d" from the side of the first supply valve 535 to the connection point of the first fluid supply line 533 (to which the air removal line 551 is connected) may be between 0 and 200 mm, more preferably between 0 and 100 mm. This is because when "d" is greater than 200 mm, it is difficult to remove an air pocket described later from the first fluid supply line 533.

[0119] An air removal valve 552 may be installed in the air removal line 551. The air removal valve 552 may be provided as an automatic valve that receives a control signal from the controller 30 to allow or block the flow of air or process fluid in the air removal line 551.

[0120] Figure 5 The present invention is described based on the case where the position of the air removal valve 552 is closer to the discharge valve 543 than the first supply valve 535 as an example, but the present invention is not limited thereto. For example, the air removal valve 552 may be located closer to the first supply valve 535 than the discharge valve 543. In addition, similar to the first supply valve 535, the air removal valve 552 may be installed within 200 mm of the connection point where the air removal line 551 and the first fluid supply line 533 are connected to each other.

[0121] Figure 6 FIG. 2 is a flow chart showing a substrate processing method according to an exemplary embodiment of the present invention.

[0122] See also Figure 3 and Figure 6 , the substrate processing method according to the exemplary embodiment of the present invention may include a liquid processing operation S10 and a drying operation S20. The liquid processing operation S10 and the drying operation S20 may be performed sequentially, and the liquid processing operation S10 may be performed in the above-mentioned liquid processing chamber 400, and the drying operation S20 may be performed in the above-mentioned drying chamber 500.

[0123] Figure 7 To show the execution Figure 6 FIG. 1 is a view of a liquid handling chamber for liquid handling operations.

[0124] See also Figure 4 , Figure 6 and Figure 7In the liquid treatment operation S10, the support unit 440 rotates the substrate W, and the liquid supply unit 460 supplies the treatment solution L to the rotating substrate W to perform liquid treatment on the substrate W. The treatment solution L supplied by the liquid supply unit 460 may be a cleaning solution for cleaning the substrate, for example, a rinse solution such as pure water or an organic solvent such as IPA. The liquid treatment operation S10 may include supplying a rinse solution to the substrate W to clean the substrate W, and then supplying an organic solvent to the substrate W to replace any residual rinse solution on the substrate W with the organic solvent.

[0125] The substrate W on which the liquid treatment has been performed may be unloaded from the liquid treatment chamber 400 and loaded into the drying chamber 500 by the transfer robot 320. On the substrate W loaded into the drying chamber 500, a liquid film may be formed by the treatment solution supplied from the liquid treatment chamber 400. The liquid film may be a liquid film formed of the above-mentioned organic solvent.

[0126] Figure 8 To show that when executing Figure 6 A diagram showing the pressure change in the processing space of the drying chamber during the drying operation.

[0127] See also Figure 5 , Figure 6 and Figure 8 , the drying operation S20 may include a pressurizing operation S21 , a flowing operation S22 , and a decompressing operation S23 .

[0128] The pressurizing operation S21 may be performed after loading the substrate W into the drying chamber 500. The pressurizing operation S21 may include supplying a treatment fluid to the processing space 513 to increase the pressure in the processing space 513 to a set pressure P. The set pressure P may be a pressure greater than a threshold pressure at which the processing fluid supplied to the processing space 513 remains supercritical or may be phase-changed from a gaseous state to a supercritical state. The pressurizing operation S21 may be performed by closing the exhaust valve 543, opening the first supply valve 535 and / or the second supply valve 536 to supply the processing fluid to the processing space 513.

[0129] The flowing operation S22 may include flowing the processing fluid in the processing space 513 to remove any residual processing solution on the substrate W.

[0130] In the flow operation S22 , the pressure in the processing space 513 can be kept constant at the set pressure P by making the supply flow rate per unit time of the processing fluid supplied to the processing space 513 equal to the discharge flow rate per unit time of the processing fluid discharged from the processing space 513 .

[0131] Alternatively, in the flowing operation S22, the supply of the processing fluid and the discharge of the processing fluid are alternately and repeatedly performed to flow the processing fluid by pulsating the pressure in the processing space 513 between the first pressure P1 and the second pressure P2. In this case, both the first pressure P1 and the second pressure P2 may be greater than a threshold pressure at which the processing fluid supplied to the processing space 513 remains supercritical or may be phase-changed from a gaseous state to a supercritical state.

[0132] In the flow operation S22 , pressure control within the processing space 513 may be achieved by opening or closing the first supply valve 535 , the second supply valve 536 , and the exhaust valve 543 .

[0133] The decompression operation S23 may be an operation of decompressing the processing space 513 under a high pressure state. In the decompression operation S23, the pressure of the processing space 513 may be reduced to change the pressure of the processing space 513 to be equal to or similar to the standard pressure. After the decompression operation S23 is finished, the second body 512 may be lowered, the processing space 513 may be opened, and the substrate W provided in the processing space 513 may be unloaded from the drying chamber 500.

[0134] Hereinafter, the pressurizing operation S21 according to an exemplary embodiment of the present invention will be described in more detail. The pressurizing operation S21 may include pressurizing the pressure in the processing space 513 in which the body 510 is disposed from the standard pressure to the set pressure P, and during this process, the air introduced into the first fluid supply line 533 may be removed from the first fluid supply line 533.

[0135] The pressurizing operation S21 may include a first supply operation S21A, an air removal operation S21B, and a second supply operation S21C. The first supply operation S21A and the second supply operation S21C may be performed sequentially. In addition, the first supply operation S21A may start before the air removal operation S21B, but the time of performing the first supply operation S21A and the air removal operation S21B may overlap at least partially. In addition, the second supply operation S21C may be performed after the air removal operation S21B ends.

[0136] Fig.10 To show the execution Fig. 9 FIG. 1 is a view of a drying chamber of a first supply operation.

[0137] See also Fig. 9 and Fig.10In the first supply operation S21A, the second supply valve 536 may be opened, and the first supply valve 535 and the exhaust valve 543 may be closed. In addition, the air removal valve 552 may be closed. In the first supply operation S21, the second fluid supply line 534 may supply the processing fluid G to the processing space 513 through the second supply port 515.

[0138] Since the processing fluid G supplied to the processing space 513 may not phase change to a supercritical state, or may have difficulty maintaining a supercritical state, when the processing fluid G is supplied to the substrate W through the first supply port 514 in an unpressurized state, the processing space 513 can be pressurized by first supplying the processing fluid G to the lower area of ​​the processing space 513.

[0139] The processing fluid G supplied in the first supply operation S21A may push the air present in the processing space 513 in the direction toward the first supply port 514. The air of the processing space 513 pushed toward the first supply port 514 by the processing fluid G supplied in the first supply operation S21A may be introduced into the first fluid supply line 533 to form an air pocket AP. In addition, in some cases, the air may also be directly introduced into the air removal line 551 connected to the first fluid supply line 533 without forming an air pocket AP.

[0140] Fig.11 To show the execution Fig. 9 Figure 2. A view of a drying chamber of the air removal operation.

[0141] See also Fig. 9 and Fig.11 , the air removal operation S21B may include removing air introduced from the processing space 513 to the first fluid supply line 533 by the treatment fluid G supplied from the first fluid supply line 533 in the first supply operation S21A. In the air removal operation S21B, the first supply valve 535 and the exhaust valve 543 may be closed, and the second supply valve 536 and the air removal valve 552 may be opened. With the second supply valve 536 opened, the treatment fluid G may continue to be supplied from the second supply port 515, and the air introduced into the first fluid supply line 533 may flow toward the exhaust line 541 through the air removal line 551. Upon reaching the exhaust line 541, the air may be discharged to the outside of the drying chamber 500 through the exhaust line 541.

[0142] Fig.12 To show the execution Fig. 9 FIG. 1 is a view of a drying chamber of a second supply operation.

[0143] See also Fig. 9 and Fig.12Once the air removal operation S21B is performed to remove the air introduced into the first fluid supply line 533 , the second supply operation S21C may be performed.

[0144] Before performing the second supply operation S21C, air introduced into the first fluid supply line 533 is removed, thereby minimizing air delivered to the substrate W through the first fluid supply line 533 in the second supply operation S21C and minimizing defects caused in the substrate W.

[0145] The pressure in the processing space 513 may be raised from the standard pressure to the set pressure P by sequentially undergoing the first supply operation S21A, the air removal operation S21B, and the second supply operation S21C.

[0146] When the processing space 513 is pressurized, when any one of the plurality of fluid supply lines 533 and 534 supplies the processing fluid G, air may be introduced into another of the plurality of fluid supply lines 533 and 534. The introduced air may be compressed to form an air pocket AP, which may be delivered to the substrate W when the other of the plurality of fluid supply lines 533 and 534 supplies the processing fluid G.

[0147] According to an exemplary embodiment of the present invention, the air removal line 551 is connected to a position adjacent to the supply valve 535 installed in another of the plurality of fluid supply lines 533 and 534, and air is removed through the air removal line 551, thereby minimizing the risk of defects on the substrate W.

[0148] Fig.13 is a diagram illustrating a view of a drying chamber including an air removal unit performing an air removal operation according to another exemplary embodiment of the present invention.

[0149] The air removal line 551 is connected to the exhaust line 541 at a downstream position compared to the exhaust valve 543, and is used as an exhaust line to exhaust air to the outside of the drying chamber 500. The air removal unit 560 according to another exemplary embodiment may include an air removal line 561 and an air removal valve 552. The air removal line 561 may be connected to the exhaust line 541 at an upstream position compared to the exhaust valve 543, and is used as a circulation line. The air removal line 561 may remove air from the first fluid supply line 533 and recirculate the air to the processing space 513 through the exhaust line 541.

[0150] In this way, even when air is not exhausted from the drying chamber 500 and recycled into the processing space 513, defects on the substrate W can be minimized. First, even when air is introduced into the first fluid supply line 533, the air may circulate through the air removal line 561, so that there is a high possibility that air pockets AP are not formed. Even if air pockets AP are formed, when air circulates through the air removal line 561 and is introduced into the processing space 513, which is very large relative to the volume of the line, the air may be diluted by a large amount of the processing fluid G supplied to the processing space 513, and has very little effect on the substrate W.

[0151] Fig.14 is a diagram showing a view of a drying chamber including an air removal unit according to another exemplary embodiment of the present invention.

[0152] See also Fig.14 , an air removal unit 570 according to another exemplary embodiment of the present invention may include a main air removal line 571 , a circulation line 572 , a discharge line 573 , a circulation valve 574 , and a discharge valve 575 .

[0153] One end of the main air removal line 571 may be connected to the first fluid supply line 533, and the other end may be branched into a circulation line 572 and an exhaust line 573. In other words, the air removal unit 570 may exhaust the air introduced into the first fluid supply line 533 to the outside of the drying chamber 500, or alternatively circulate the air to the processing space 513.

[0154] In addition, in order to allow the user to more reliably remove air introduced into the first fluid supply line 533, the processing fluid G supplied by the second supply port 515 can be circulated through the circulation line 572 after the air has been pre-exhausted through the exhaust line 573 to minimize the risk of air-induced defects on the substrate W.

[0155] The above example shows, but is not limited to, the body 510 including the first body 511 as the upper body and the second body 512 as the lower body.

[0156] Fig.15 6. A drying chamber 600 according to another exemplary embodiment may include a body 610, a support member 620, a fluid supply unit 630, a fluid discharge unit 640, and an air removal unit 650.

[0157] The body 610 may include a first body 611 and a second body 612, the first body 611 may be a door configured to be laterally movable, and the second body 612 may have a barrel shape with an open side. A support member 620 may be installed on the first body 611 to support the bottom surface of the substrate W. The first body 611 may be laterally movable to be combined with the second body 612. The first body 611 and the second body 612 may be combined with each other to provide a processing space 613.

[0158] The fluid supply unit 630 may include a main supply line 632, a first fluid supply line 633, a second fluid supply line 634, a first supply valve 635, and a second supply valve 636. The first fluid supply line 633 may be connected to a first supply port 614 provided on the second body 612, and the second fluid supply line 634 may be connected to a second supply port 615 provided on the second body 612. The configuration of the fluid supply unit 630 performs the same or similar functions as the above-described fluid supply unit 530, and thus description thereof will not be repeated.

[0159] The fluid discharge unit 640 may include a discharge line 641, a discharge device 642, and a discharge valve 643, and the discharge line 641 may be connected to a discharge port 616 disposed in the second body 612. The configuration of the fluid discharge unit 640 performs the same or similar functions as the above-mentioned fluid discharge unit 540, and will not be described again.

[0160] The air removal unit 650 may include an air removal line 651 and an air removal valve 652, and one end of the air removal line 651 may be connected to the first fluid supply line 633 at a position very close to the first supply valve 635 (e.g., a position within 200 mm from the first supply valve 635). In addition, the other end of the air removal line 651 may be connected to the exhaust line 641 at a downstream position compared to the exhaust valve 643. In this case, the air removal line 651 may be used as an exhaust line.

[0161] However, there is no limitation, and the other end of the air removal line 651 may be connected to the discharge line 641 at an upstream position compared to the discharge valve 643. In this case, the air removal line 651 may be used as a circulation line.

[0162] It should be understood that exemplary embodiments are disclosed herein, and other variations are possible. The individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable, and, where applicable, may also be used for the selected exemplary embodiment even if not specifically shown or described. These modifications should not be considered as departing from the spirit and scope of the present disclosure, and all such modifications apparent to a person of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A device for processing a substrate, the device comprising: A body, wherein the body provides a processing space; a first fluid supply line connected to the body and supplying a treatment fluid to the processing space; a second fluid supply line connected to the body at a position different from that of the first fluid supply line and supplying a processing fluid to the processing space; a first supply valve installed in the first fluid supply line; as well as An air removal line, one end of which is connected to the first fluid supply line downstream of the first supply valve to allow air introduced into the processing space of the first fluid supply line to be removed from the first fluid supply line when the second fluid supply line supplies processing fluid to the processing space.

2. The device according to claim 1, wherein: The device also includes: an exhaust pipeline for exhausting the atmosphere of the processing space, Wherein, the other end of the air removal line is connected to the exhaust line.

3. The device according to claim 2, wherein: The device also includes: a discharge valve installed in the discharge line, Wherein, in order to allow the air introduced into the air removal line to be exhausted from the processing space, the other end of the air removal line is connected to the exhaust line at a downstream position compared to the exhaust valve.

4. The device according to claim 2, wherein: The device also includes: a discharge valve installed in the discharge line, Wherein, in order to allow the air introduced into the air removal line to circulate to the processing space, the other end of the air removal line is connected to the exhaust line at an upstream position compared to the exhaust valve.

5. The device according to claim 2, wherein: The device also includes: a discharge valve installed in the discharge line, Wherein, the air removal pipeline comprises: a main removal line connected to the first fluid supply line; a circulation line branched from the main removal line and connected upstream of the discharge valve; and A discharge line is branched from the main removal line to be connected to a downstream side than the discharge valve.

6. The device according to claim 1, wherein: The air removal line is connected to the first fluid supply line within 200 mm from the first supply valve.

7. The device according to claim 1, wherein: The body is provided with a first supply port connected to the first fluid supply line and a second supply port connected to the second fluid supply line, and An outlet of the first supply port and an outlet of the second supply port are opposite to each other.

8. The device according to claim 1, wherein: The device also includes: an air removal valve installed in the air removal line; a second supply valve installed in the second fluid supply line; and a controller configured to control operation of the first supply valve, the second supply valve, and the air removal valve, Wherein, the controller is configured to generate a signal for performing the following: An operation of closing the first supply valve and opening the second supply valve to allow the processing fluid to be supplied to the processing space through the second fluid supply line; and The air removal valve is opened to allow the air in the processing space introduced into the first fluid supply line to be introduced into the air removal line.

9. The device according to claim 8, wherein: The controller is configured to generate a control signal to perform an operation of opening the first supply valve to allow the process fluid to be supplied to the processing space through the first fluid supply line after air is introduced into the air removal line.

10. A method for processing a substrate, the method comprising: a liquid processing operation in which a processing solution is supplied to the substrate; as well as a drying operation in which the substrate supplied with the processing solution is loaded into a processing space provided with a body, and the substrate is dried by supplying a processing fluid, Wherein, the drying operation comprises: a pressurizing operation in which the processing fluid is supplied to the processing space to pressurize the processing space to a set pressure; a flow operation in which the processing fluid in the processing space is caused to flow to remove a processing solution remaining on the substrate; and a decompression operation in which the atmosphere of the processing space is exhausted to decompress the processing space, and The pressurization operation includes: a first supply operation in which the processing fluid is supplied to the processing space through a second fluid supply line connected to the body; and An air removal operation, in which air is removed from the processing space into a first fluid supply line via an air removal line connected to the first fluid supply line, by the processing fluid supplied in the first supply operation, the first fluid supply line being connected to the body at a position different from that of the second fluid supply line.

11. The method according to claim 10, wherein: The pressurizing operation further includes a second supplying operation of supplying the processing fluid to the processing space through the first fluid supply line after the air removing operation.

12. The method according to claim 10, wherein: The air removal line is connected to an exhaust line for exhausting the atmosphere of the processing space, and The air removal operation includes circulating the air introduced into the first fluid supply line to the processing space through the air removal line and the exhaust line.

13. The method according to claim 10, wherein: The air removal line is connected to an exhaust line for exhausting the atmosphere of the processing space, and The air removal operation includes exhausting the air introduced from the processing space to the first fluid supply line through the air removal line and the exhaust line.

14. The method according to claim 10, wherein: The air removal line is connected to an exhaust line for exhausting the atmosphere of the processing space, and The air removal operation includes exhausting the air introduced into the first fluid supply line to the outside through the air removal line and the exhaust line, and The process fluid is then circulated to the processing space through the air removal line and the exhaust line.

15. The method according to claim 10, wherein: The air removal line is connected to the first fluid supply line at a downstream of a first supply valve installed in the first fluid supply line to introduce air accumulated in an area adjacent to the first supply valve into the air removal line.

16. The method according to claim 15, wherein: The air removal line is connected to the first fluid supply line within 200 mm from the first supply valve.

17. The method according to claim 10, wherein: The processing fluid is a supercritical fluid, and the processing fluid is supplied in a supercritical state or converted into a supercritical state in the processing space to remove the processing solution from the substrate.

18. An apparatus for processing a substrate, the apparatus comprising: A body, wherein the body provides a processing space; a fluid supply unit, the fluid supply unit being used to supply a processing fluid to the processing space; an exhaust unit, the exhaust unit being used to exhaust the atmosphere of the processing space; as well as an air removal line for removing air introduced into the fluid supply unit, Wherein, the fluid supply unit comprises: a first fluid supply line for supplying a treatment fluid to a first region of the processing space; a second fluid supply line for supplying a processing fluid to a second area different from the first area of ​​the processing space; a first supply valve installed in the first fluid supply line; and a second supply valve installed in the second fluid supply line; and The discharge unit comprises: a discharge line connected to the body; a discharge valve installed on the discharge line; and an exhaust device for exhausting the atmosphere of the processing space through the exhaust line, and The air removal line has one end connected to the first fluid supply line at a position within 200 mm from the first supply valve, and the other end connected to the exhaust line.

19. The device according to claim 18, wherein: The device also includes: an air removal valve installed in the air removal line; and a controller configured to control operation of the first supply valve, the second supply valve, and the air removal valve, Wherein, the controller is configured to generate a signal for performing the following: An operation of closing the first supply valve and opening the second supply valve to allow the processing fluid to be supplied to the processing space through the second fluid supply line; and The air removal valve is opened to allow the air in the processing space introduced into the first fluid supply line to be introduced into the air removal line.

20. The device according to claim 19, wherein The controller is configured to control generation of a control signal to perform an operation of opening the first supply valve to allow the processing fluid to be supplied to the processing space through the first fluid supply line after air is introduced into the air removal line.

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