Display panel, manufacturing method thereof and display device

Abstract

The invention is suitable for the technical field of display equipment, and provides a display panel, a manufacturing method thereof and a display device.The display panel comprises a substrate, a light-emitting layer and a packaging layer, the light-emitting layer and the packaging layer are sequentially arranged on the surface of one side of the substrate in a stacked mode, the packaging layer comprises a composite layer, the composite layer comprises a base structure and filler arranged in the base structure, and the filler is arranged in the base structure. The manufacturing material of the substrate structure is different from the manufacturing material of the filler. In the display panel, the thickness of the composite layer is lower than that of a conventional organic packaging layer, stress can be buffered, filler particles can be covered, water and oxygen can be blocked, the effect of protecting the light-emitting layer is achieved, the distance between the light-emitting layer and the black matrix layer above the packaging layer is reduced due to the small thickness of the composite layer, and the light-emitting effect is improved. The light-emitting layer has a larger light-emitting angle, so that the problem of serious brightness attenuation of the display panel under a large visual angle can be relieved.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and in particular, relates to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, OLED (Organic Light Emitting Diode) display panels have been widely used due to their advantages such as lighter weight, higher brightness, lower power consumption, faster response and higher definition.

[0003] COE technology is to coat a color filter on the traditional AMOLED package after it is completed. Each pixel has a CF corresponding to the color of the pixel, and the gaps between the CFs are separated by BM (Black Matrix). The screen using COE technology has a higher transmittance in the spectral range of the device's light emission, which can effectively improve the light output rate of RGB and significantly reduce the power consumption of the screen. However, the use of BM will bring about the problem of fast brightness decay at a wide viewing angle. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device to solve the problems of low light output efficiency at a large viewing angle and fast brightness decay at a large viewing angle in the current OLED display panel COE technology.

[0005] A first aspect of an embodiment of the present application provides a display panel, comprising: a substrate, a light-emitting layer and an encapsulation layer, the light-emitting layer and the encapsulation layer are sequentially stacked on a side surface of the substrate, the encapsulation layer comprises a composite layer, the composite layer comprises a base structure and a filler arranged in the base structure, and the base structure is made of a material different from the filler.

[0006] The above-mentioned display panel, by providing an encapsulation layer including a composite layer, different structures in the composite layer can respectively play a role in protecting the light-emitting layer. Since the filler is provided in the base structure, the overall thickness of the composite layer is relatively small, that is, the composite layer combines multiple protection functions in the same layer structure, which can buffer stress, cover filler particles and block water and oxygen, and can significantly reduce the thickness of the encapsulation layer, thereby facilitating the miniaturization of the display panel. Furthermore, due to the reduction in the thickness of the encapsulation layer, the distance between the light-emitting layer and the black matrix layer above the encapsulation layer is also reduced. In this way, under the same other conditions, the angle range in which the light emitted by the light-emitting layer is blocked by the black matrix is ​​smaller, that is, the light-emitting layer has a larger light-emitting angle, which can alleviate the problem of severe brightness attenuation of the display panel at a wide viewing angle and increase the viewing angle of the display panel.

[0007] In one embodiment, the base structure is made of organic polymer, and the filler is made of inorganic material. By using organic polymer to make the base structure, the effect of the base structure in buffering external stress can be improved, and the free volume in the organic polymer is conducive to setting the filler, while using inorganic material to make the filler can improve the effect of blocking external water and oxygen corrosion.

[0008] In one embodiment, the encapsulation layer further includes a first sub-encapsulation layer, the first sub-encapsulation layer is disposed on a surface of the light-emitting layer facing away from the substrate, and the composite layer is disposed on a surface of the first sub-encapsulation layer facing away from the light-emitting layer. By arranging the first sub-encapsulation layer in the encapsulation layer, the encapsulation reliability of the encapsulation layer can be further improved.

[0009] In one embodiment, the light-emitting layer includes a plurality of sub-pixels spaced apart from each other; the first sub-encapsulation layer covers the following surfaces: the surface of the substrate between adjacent sub-pixels; the surface of the sub-pixel away from the substrate. This design facilitates the processing and molding of the first sub-encapsulation layer and can reduce the size occupied by the first sub-encapsulation layer.

[0010] In one embodiment, the composite layer is filled between adjacent sub-pixels, and the composite layer covers the surface of the first sub-encapsulation layer on the side away from the sub-pixel. This design improves the structural integration of the composite layer, and can also completely encapsulate the gap between the sub-pixel in the light-emitting layer and the adjacent sub-pixel, thereby improving the encapsulation effect.

[0011] In one embodiment, along the direction perpendicular to the surface of the substrate, the thickness h1 of the first sub-encapsulation layer satisfies: 0.02 μm ≤ h1 ≤ 1 μm. By setting the thickness of the first sub-encapsulation layer to meet the above range, the thickness of the first sub-encapsulation layer can be reduced as much as possible while satisfying its use function, which is conducive to reducing the thickness of the entire encapsulation layer.

[0012] In one embodiment, along the direction perpendicular to the surface of the substrate, the thickness h2 of the composite layer satisfies: 1 μm ≤ h2 ≤ 10 μm. By setting the thickness of the composite layer to meet the above range, the thickness of the composite layer can be reduced as much as possible while satisfying its use function, which is conducive to reducing the thickness of the entire encapsulation layer.

[0013] The second aspect of the embodiments of the present application provides a method for manufacturing a display panel as described in the first aspect, comprising: forming a light-emitting layer on a substrate; forming an encapsulation layer on the light-emitting layer, the encapsulation layer comprising a composite layer, the composite layer comprising a base structure and a filler arranged in the base structure, and the base structure is made of a material different from the filler.

[0014] The display panel manufactured by the above manufacturing method can significantly reduce the thickness of the encapsulation layer, thereby facilitating the miniaturization of the display panel. Moreover, under the same other conditions, the angle range in which the light emitted by the light-emitting layer is blocked by the black matrix is ​​smaller, that is, the light-emitting layer has a larger light-emitting angle, which can alleviate the problem of severe brightness attenuation of the display panel at a large viewing angle and increase the viewing angle of the display panel.

[0015] In one embodiment, the encapsulation layer further includes a first sub-encapsulation layer, and the forming of the encapsulation layer on the light-emitting layer includes: forming the first sub-encapsulation layer on the light-emitting layer; forming the base structure on the first sub-encapsulation layer; and filling the base structure with the filler. Such a design can meet the structural design of each film layer, improve the production efficiency of each film layer structure, and reduce the production cost.

[0016] A third aspect of the embodiments of the present application provides a display device, comprising the display panel as described in the first aspect.

[0017] It can be understood that the beneficial effects of the third aspect can be found in the relevant descriptions of the first and second aspects, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 is a schematic diagram of the overall structure of a display panel provided by an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of the overall structure of a display panel provided by another embodiment of the present application;

[0021] Figure 3 is a schematic diagram of the light emission angle of the light emitting layer in the display panel provided in an embodiment of the present application;

[0022] Figure 4 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0023] Figure 5 It is a schematic diagram of the overall structure of the display device provided in an embodiment of the present application.

[0024] Figure Number:

[0025] 10. Display device;

[0026] 100. Display panel;

[0027] 110. Substrate;

[0028] 120, light emitting layer, 121, sub-pixel;

[0029] 130, encapsulation layer, 131, composite layer, 1311, base structure, 1312, filler, 132, first sub-encapsulation layer;

[0030] 140. pixel limiting layer;

[0031] 150, color film;

[0032] 160. Black matrix. DETAILED DESCRIPTION

[0033] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0034] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0038] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. "Multiple" means two or more.

[0039] In order to at least partially solve the problem that the OLED display panel in the related art has a large structure size and is not conducive to the miniaturization of the display panel, see Figure 1 and Figure 3 As shown, an embodiment of the present application provides a display panel 100 , which includes a substrate 110 , a light emitting layer 120 and an encapsulation layer 130 .

[0040] Specifically, the substrate 110 is used to support and carry other film layers in the display panel 100. For example, the substrate 110 can be made of materials such as glass and polyimide (PI). In some embodiments, the substrate 110 can also include an array substrate 110 (not shown in the figure). The array substrate 110 is provided with a driving circuit for driving the light-emitting layer 120 to emit light. Under the drive of the driving circuit, different sub-pixels 121 in the light-emitting layer 120 can be excited to emit light of different colors, so that the display panel 100 can achieve a colorful display effect.

[0041] The light-emitting layer 120 and the encapsulation layer 130 are sequentially stacked on one side surface of the substrate 110, that is, the light-emitting layer 120 is arranged on one side surface of the substrate 110, and the encapsulation layer 130 is arranged on the side surface of the light-emitting layer 120 away from the substrate 110. The light-emitting layer 120 may include a plurality of different sub-pixels 121, and the sub-pixel 121 may be a red light sub-pixel 121, a green light sub-pixel 121, a blue light sub-pixel 121 or a white light sub-pixel 121, etc., which are not limited here. Specifically, the sub-pixel 121 may include a multi-layer structure. For example, the sub-pixel 121 includes a stacked hole injection part, a hole transport part, a light-emitting part, an electron transport part, an electron injection part (all not shown in the figure), etc., which realize light emission under the action of the electric field of the electrode. The light-emitting layer 120 has a light-emitting side, and the light emitted by each sub-pixel 121 can be observed by facing its light-emitting side.

[0042] The encapsulation layer 130 can isolate external impurities, water vapor, oxygen, etc., prevent them from entering the display panel 100 and corroding its internal structure, and play a protective role for other structures in the display panel 100. Specifically, the encapsulation layer 130 includes a composite layer 131, and the composite layer 131 includes a base structure 1311 and a filler 1312 disposed in the base structure 1311. The base structure 1311 is made of a different material from the filler 1312. The base structure 1311 may have a plurality of gaps so that the filler 1312 can be disposed in the gaps. The base structure 1311 can buffer external stress, and the filler 1312 can block external water and oxygen erosion, so that the composite layer 131 can well protect the light-emitting layer 120.

[0043] The display panel 100 of the embodiment of the present application is provided with an encapsulation layer 130 including a composite layer 131. Different structures in the composite layer 131 can respectively play a role in protecting the light-emitting layer 120. Since the filler 1312 is arranged in the base structure 1311, the overall thickness of the composite layer 131 is relatively small. In other words, the composite layer 131 integrates multiple protection functions in the same layer structure, which can significantly reduce the thickness of the encapsulation layer 130, thereby facilitating the miniaturization of the display panel 100.

[0044] In order to avoid signal crosstalk between two adjacent sub-pixels 121, in some embodiments, the display panel 100 further includes a pixel defining layer 140 disposed on the substrate 110, the pixel defining layer 140 defines a plurality of pixel openings, and the sub-pixels 121 are at least partially located in the pixel openings. In this case, the encapsulation layer 130 is disposed on a surface of the pixel defining layer 140 that is away from the substrate 110.

[0045] like Figure 2 and Figure 3As shown, in order to allow each sub-pixel 121 to emit light of different colors, in some embodiments, the display panel 100 further includes a color filter 150 (CF) and a black matrix 160 (BM) disposed on the encapsulation layer 130. The color filter 150 is disposed in one-to-one correspondence with each sub-pixel 121. The color filters 150 disposed corresponding to different sub-pixels 121 have different colors. The color filter 150 of each color only allows light of the same color as itself to pass through. In this way, when the light emitted by the sub-pixel 121 is irradiated to the red color filter 150, the light of other colors is filtered, and only the red light can pass through. When the light emitted by the sub-pixel 121 is irradiated to the green color filter 150, the light of other colors is filtered, and only the green light can pass through. When the light emitted by the sub-pixel 121 is irradiated to the blue color filter 150, the light of other colors is filtered, and only the blue light can pass through. Two adjacent color filters 150 are separated by a black matrix 160. The black matrix 160 is opaque, and the light emitted by the sub-pixel 121 is completely absorbed when it hits the black matrix 160. Therefore, the light emission angle of each sub-pixel 121 is as follows: Figure 2 and Figure 3 As shown, it is determined by the relative position between the sub-pixel 121 and the black matrix 160 .

[0046] exist Figure 3 In the figure, the solid line frame shows the position of the black matrix 160 in the embodiment of the present application, θ1 is the light emitting angle of the sub-pixel 121 in the embodiment of the present application, and the dotted line frame shows the position where the black matrix 160' should be located in the related art, θ2 is the light emitting angle of the sub-pixel 121 in the related art, Figure 3 It can be seen that, obviously, θ1>θ2.

[0047] Compared with the related art, since the thickness of the encapsulation layer 130 in the embodiment of the present application is reduced, the distance between the light-emitting layer 120 and the black matrix 160 layer above the encapsulation layer 130 is also reduced. In this way, under the same other conditions, the angle range in which the light emitted by the light-emitting layer 120 is blocked by the black matrix 160 is smaller, that is, the light-emitting layer 120 has a larger light output angle, which can alleviate the problem of severe brightness attenuation of the display panel 100 at a wide viewing angle, thereby increasing the viewing angle of the display panel 100.

[0048] In the present application, the specific manufacturing materials of the base structure 1311 and the filler 1312 are not limited. In one embodiment, for example, the base structure 1311 is made of an organic polymer, such as polyimide (PI), and the filler 1312 is made of an inorganic substance. The filler 1312 can be a metallic inorganic substance, such as a metal, an alloy or a metal oxide, such as Al2O3, or a non-metallic inorganic substance.

[0049] By using organic polymers to make the base structure 1311, the effect of the base structure 1311 in buffering external stress can be improved, and the gaps in the organic polymer are conducive to setting the filler 1312. Using inorganic materials to make the filler 1312 can improve the effect of blocking external water and oxygen corrosion, so that the composite layer can well protect the light-emitting layer 120.

[0050] In the present application, the encapsulation layer 130 may be a single film layer structure or may include multiple film layers. Figure 1 and Figure 2 As shown, in some embodiments, optionally, in addition to the composite layer 131, the encapsulation layer 130 further includes a first sub-encapsulation layer 132, the first sub-encapsulation layer 132 is disposed on a surface of the light-emitting layer 120 facing away from the substrate 110, and the composite layer 131 is disposed on a surface of the first sub-encapsulation layer 132 facing away from the light-emitting layer 120. By disposing the first sub-encapsulation layer 132 in the encapsulation layer 130, the encapsulation reliability of the encapsulation layer 130 can be further improved.

[0051] The first sub-encapsulation layer 132 may be an inorganic encapsulation layer 130 . For example, the first sub-encapsulation layer 132 may be made of at least one of SiN, SiNO, SiO or Al 2 O 3 .

[0052] Please continue reading Figure 1 and Figure 2 In some embodiments, the light emitting layer 120 may include a plurality of sub-pixels 121 spaced apart from each other, with a gap between two adjacent sub-pixels 121; the first sub-encapsulation layer 132 covers the following surfaces: the surface of the substrate 110 between adjacent sub-pixels 121; and the surface of the sub-pixel 121 facing away from the substrate 110. This design facilitates the processing and molding of the first sub-encapsulation layer 132 and can reduce the size occupied by the first sub-encapsulation layer 132.

[0053] The first sub-encapsulation layer 132 covers the surface between adjacent sub-pixels 121, but the first sub-encapsulation layer 132 may not be able to completely fill the gap between adjacent sub-pixels 121, that is, along the direction perpendicular to the surface of the substrate 110, the thickness of the first sub-encapsulation layer 132 is less than the depth of the gap between adjacent sub-pixels 121. Therefore, in some embodiments, optionally, the composite layer 131 is filled between adjacent sub-pixels 121, and the composite layer 131 covers the surface of the first sub-encapsulation layer 132 on the side facing away from the ion pixel 121. Such a design improves the structural integration of the composite layer 131, and can also completely encapsulate the gap between the sub-pixel 121 in the light-emitting layer 120 and the adjacent sub-pixel 121, thereby improving the encapsulation effect.

[0054] In some embodiments, optionally, along the direction perpendicular to the surface of the substrate 110, the thickness h1 of the first sub-encapsulation layer 132 satisfies: 0.02 μm ≤ h1 ≤ 1 μm. In some specific embodiments, the thickness h1 of the first sub-encapsulation layer 132 may be 0.02 μm, 0.05 μm, 0.1 μm, 0.2 μm, 0.5 μm, 0.7 μm, etc. The above are only examples of the thickness h1 of the first sub-encapsulation layer 132. In actual embodiments, the thickness h1 of the first sub-encapsulation layer 132 may also be other thickness values ​​that satisfy the above range. By setting the thickness of the first sub-encapsulation layer 132 to satisfy the above range, the thickness of the first sub-encapsulation layer 132 can be reduced as much as possible while satisfying its use function, which is conducive to reducing the overall thickness of the encapsulation layer 130.

[0055] In some embodiments, optionally, along the direction perpendicular to the surface of the substrate 110, the thickness h2 of the composite layer 131 satisfies: 1μm≤h2≤10μm. In some specific embodiments, the thickness h2 of the composite layer 131 may be 0.02μm, 0.05μm, 0.1μm, 0.5μm, 1μm, 3μm, 5μm, etc. The above are only examples of the thickness h2 of the composite layer 131. In actual embodiments, the thickness h2 of the composite layer 131 may also be other thickness values ​​that satisfy the above range. By setting the thickness of the composite layer 131 to satisfy the above range, the thickness of the composite can be reduced as much as possible while satisfying its functional requirements, which is beneficial to reducing the overall thickness of the encapsulation layer 130. It should be noted that the thickness dimensions of the composite layer 131 at different positions are not necessarily equal. Figure 1 and Figure 2 As shown, the thickness of the composite layer 131 between adjacent sub-pixels 121 is large, while the thickness of the composite layer 131 covering the surface of the sub-pixel 121 facing away from the substrate 110 is small. The thickness h2 of the composite layer 131 mentioned above satisfies: 0.02μm≤h2≤5μm, which means that the minimum thickness and maximum thickness of the composite layer 131 are both within this range.

[0056] Please combine Figures 1 to 3 Also see Figure 4 The present application also provides a method for manufacturing the display panel 100 as in any one of the above embodiments, the manufacturing method comprising the following steps:

[0057] S102 , forming a light emitting layer 120 on the substrate 110 .

[0058] S104 , forming an encapsulation layer 130 on the light-emitting layer 120 , wherein the encapsulation layer 130 includes a composite layer 131 , and the composite layer 131 includes a base structure 1311 and a filler 1312 disposed in the base structure 1311 , and the base structure 1311 is made of a material different from that of the filler 1312 .

[0059] The display panel 100 manufactured by the above manufacturing method can significantly reduce the thickness of the encapsulation layer 130, thereby facilitating the miniaturization of the display panel 100. Moreover, under the same other conditions, the angle range in which the light emitted by the light-emitting layer 120 is blocked by the black matrix 160 is smaller, that is, the light-emitting layer 120 has a larger light output angle, which can alleviate the problem of severe brightness attenuation of the display panel 100 at a large viewing angle and increase the viewing angle of the display panel 100.

[0060] In some embodiments, optionally, the encapsulation layer 130 further includes a first sub-encapsulation layer 132. In this case, step S104 specifically includes:

[0061] S1042 , forming a first sub-encapsulation layer 132 on the light-emitting layer 120 .

[0062] During the formation of the first sub-encapsulation layer 132 , atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD) or other deposition methods may be used for preparation.

[0063] Atomic layer deposition is a method that can deposit materials layer by layer on the surface of a substrate in the form of a single atomic film. The film layer produced by atomic layer deposition has uniform thickness and excellent consistency. Plasma enhanced chemical vapor deposition is a preparation method that uses glow discharge in a deposition chamber to ionize it and then chemically reacts and deposits it on the substrate. Its main advantages are low deposition temperature, little effect on the structure and physical properties of the substrate, fast deposition rate, good uniformity of film thickness and composition, dense film structure, few pinholes, and strong adhesion of the film layer.

[0064] S1044 , forming a base structure 1311 on the first sub-encapsulation layer 132 .

[0065] The base structure 1311 can be made by inkjet printing, screen printing or slit coating. Inkjet printing is a non-contact, non-pressure, non-printing plate printing, which is not limited by materials and has the advantages of simple machine operation and stable performance. Screen printing refers to a method of making a screen printing plate with images and texts using a screen as a base and a photosensitive platemaking method. It has the advantages of not being limited by the size and shape of the substrate, having a soft plate surface, small printing pressure, and strong ink layer coverage.

[0066] S1046 , filling the base structure 1311 with filler 1312 .

[0067] The filler 1312 may be formed in the base structure 1311 by chemical vapor deposition or atomic penetration.

[0068] Such a design can meet the structural design of each film layer, improve the production efficiency of each film layer structure, and reduce the production cost.

[0069] See also Figure 5 The embodiment of the present application further provides a display device 10, which includes a display panel 100 as in any one of the above embodiments.

[0070] The display panel 100 disclosed in the embodiment of the present application is applied to the display device 10 to provide the function of displaying a picture. The display device 10 can be any product or component with a display function, including but not limited to a mobile phone, a tablet computer, a laptop computer, an e-reader, a wearable device, a remote control, a television, a desktop computer, a vehicle-mounted device, etc. Since the display panel 100 in any of the above embodiments is adopted, the thickness of the encapsulation layer 130 in the display panel 100 can be significantly reduced, which is conducive to the miniaturization of the display panel 100. Furthermore, under the same other conditions, the angle range in which the light emitted by the light-emitting layer 120 in the display panel 100 is blocked by the black matrix 160 is smaller, that is, the light-emitting layer 120 has a larger light-emitting angle, which can alleviate the problem of severe brightness attenuation of the display panel 100 at a large viewing angle and increase the viewing angle of the display panel 100.

[0071] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0072] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A substrate (110), a light-emitting layer (120) and an encapsulation layer (130), wherein the light-emitting layer (120) and the encapsulation layer (130) are sequentially stacked on a surface of one side of the substrate (110), the encapsulation layer (130) comprises a composite layer (131), the composite layer (131) comprises a base structure (1311) and a filler (1312) arranged in the base structure (1311), and the base structure (1311) is made of a material different from the material of the filler (1312).

2. The display panel according to claim 1, wherein: The base structure (1311) is made of organic polymer, and the filler (1312) is made of inorganic material.

3. The display panel according to claim 1, wherein: The encapsulation layer (130) further comprises a first sub-encapsulation layer (132), wherein the first sub-encapsulation layer (132) is disposed on a surface of a side of the light-emitting layer (120) facing away from the substrate (110), and the composite layer (131) is disposed on a surface of a side of the first sub-encapsulation layer (132) facing away from the light-emitting layer (120).

4. The display panel according to claim 3, wherein: The light-emitting layer (120) comprises a plurality of sub-pixels (121) spaced apart from each other; The first sub-encapsulation layer (132) covers the following surfaces: The substrate (110) is located on a surface between adjacent sub-pixels (121); The sub-pixel (121) is located on a surface facing away from the substrate (110).

5. The display panel according to claim 4, wherein: The composite layer (131) is filled between adjacent sub-pixels (121), and the composite layer (131) covers the surface of the first sub-encapsulation layer (132) on a side away from the sub-pixels (121).

6. The display panel according to claim 3, wherein: Along a direction perpendicular to the surface of the substrate (110), the thickness h1 of the first sub-encapsulation layer (132) satisfies: 0.02 μm≤h1≤1 μm.

7. The display panel according to any one of claims 1 to 6, characterized in that: Along a direction perpendicular to the surface of the substrate (110), the thickness h2 of the composite layer (131) may satisfy: 1 ​​μm≤h2≤10 μm.

8. A method for manufacturing a display panel, characterized in that: include: forming a light-emitting layer (120) on a substrate (110); An encapsulation layer (130) is formed on the light-emitting layer (120), wherein the encapsulation layer (130) comprises a composite layer (131), wherein the composite layer (131) comprises a base structure (1311) and a filler (1312) disposed within the base structure (1311), and wherein the base structure (1311) is made of a material different from that of the filler (1312).

9. The method for manufacturing a display panel according to claim 8, wherein: The encapsulation layer (130) further includes a first sub-encapsulation layer (132), and the step of forming the encapsulation layer (130) on the light-emitting layer (120) includes: forming the first sub-encapsulation layer (132) on the light-emitting layer (120); forming the base structure (1311) on the first sub-packaging layer (132); The filler (1312) is filled in the base structure (1311).

10. A display device, characterized in that: include: The display panel (100) according to any one of claims 1 to 7.

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