Matte wire and preparation method thereof

Abstract

The invention provides a matte wire and a preparation method thereof.The matte wire comprises a wire core and a matte heat dissipation layer located on the outer surface of the wire core, the matte heat dissipation layer comprises a bonding layer and a matte layer, the bonding layer is located on the outer surface of the wire core, the matte layer is located on the outer surface of the bonding layer, and the matte layer is located on the outer surface of the bonding layer. The inorganic non-metal powder is located on the matte layer, the surface emission coefficient of the inorganic non-metal powder is larger than or equal to 0.6, the matte wire has the high surface emission coefficient, and therefore the matte wire has the excellent heat dissipation performance and the long service life.

Description

Technical Field

[0001] The invention belongs to the technical field of power cables, and in particular relates to a matte conductor and a preparation method thereof. Background Art

[0002] Matt wires will generate more heat during operation, which will increase their temperature. Therefore, it is necessary to discharge the heat of the matt wires in time to avoid excessive heat affecting the performance and service life of the matt wires.

[0003] At present, the heat dissipation of matte wires is mainly improved by spraying brown corundum and other sand materials on the surface of the wire core to extend the service life of the matte wire. However, the existing wire core used to prepare matte wires is mainly made of aluminum, and the surface emissivity of aluminum is low. Spraying brown corundum and other sand materials on the surface of aluminum is difficult to meet the heat dissipation requirements of matte wires.

[0004] Therefore, how to develop a matte conductive wire with a high surface emissivity is a technical problem that needs to be solved urgently in this field. Summary of the invention

[0005] The invention provides a matte conductive wire, which has a high surface emissivity and thus has excellent heat dissipation performance and a long service life.

[0006] The present invention also provides a method for preparing the above-mentioned matte conductive wire. The matte conductive wire obtained by the preparation method has a high surface emission coefficient and is simple to operate and is suitable for large-scale production.

[0007] In a first aspect, the present invention provides a matte conductive wire, the matte conductive wire comprising a conductive wire core and a matte heat dissipation layer located on an outer surface of the conductive wire core;

[0008] The matte heat dissipation layer includes an adhesive layer and a matte layer, the adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer;

[0009] The inorganic non-metallic powder is located in the matte layer, and the surface emission coefficient of the inorganic non-metallic powder is ≥0.6.

[0010] The matte wire as described above, wherein the particle size of the inorganic non-metallic powder is 10 μm-25 μm.

[0011] The matte conductive wire as described above, wherein the thickness of the adhesive layer is 3 μm-10 μm.

[0012] The matte conductive wire as described above, wherein the thickness of the matte layer is 10 μm-30 μm.

[0013] The matte wire as described above, wherein the diameter of the wire core is 4.05mm-52.8mm.

[0014] The matte conductive wire as described above, wherein the material of the adhesive layer includes a thermosetting resin.

[0015] The matte wire as described above, wherein the inorganic non-metallic powder includes silicon powder or silicon ash.

[0016] In a second aspect, the present invention proposes a method for preparing the above-mentioned matte wire, comprising: obtaining the matte wire by forming a matte heat dissipation layer on the outer surface of the wire core.

[0017] As described above, the method for preparing the matte heat dissipation layer further includes: forming an adhesive layer on the outer surface of the conductor core, and forming a matte layer on the outer surface of the adhesive layer away from the conductor core.

[0018] In the preparation method as described above, the matte layer is obtained by spraying inorganic non-metallic powder on the outer surface of the adhesive layer.

[0019] The implementation of the present invention has at least the following beneficial effects:

[0020] 1) The matte wire of the present invention has excellent heat dissipation capability, is not prone to aging and cracking during long-term use, and has a long service life;

[0021] 2) The present invention uses inorganic non-metallic powder with a surface emissivity of ≥0.6 to form a matte heat dissipation layer to improve the heat dissipation performance of the matte wire. Compared with the prior art of using brown corundum and other abrasives for sandblasting and improving the heat dissipation performance of the matte wire, the matte wire of the present invention can also avoid the pollution of air and soil by brown corundum and other abrasives used for sandblasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of a device for preparing matte conductive wires in some embodiments of the present invention.

[0023] Description of reference numerals:

[0024] 1: Online resin coating device;

[0025] 2: Sand blasting device;

[0026] 3: Online medium frequency induction heating device;

[0027] 4: Wire taking-up device and reel. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in combination with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The present invention provides a matte wire, which includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core, the matte heat dissipation layer includes an adhesive layer and a matte layer, the adhesive layer is located on the outer surface of the wire core, the matte layer is located on the outer surface of the adhesive layer, the inorganic non-metallic powder is located on the matte layer, and the surface emissivity coefficient of the inorganic non-metallic powder is ≥0.6.

[0030] The present invention forms a matte heat dissipation layer including inorganic non-metallic powder with a surface emissivity of ≥0.6 on the outer surface of the conductor core, thereby improving the surface emissivity of the matte conductor, thereby improving the heat dissipation capacity of the matte conductor, thereby reducing the risk of aging and cracking of the matte conductor, and extending the service life of the matte conductor. Furthermore, the matte layer and the conductor core are bonded using an adhesive layer, so that the matte layer can be more firmly adsorbed on the surface of the conductor core, which helps to further improve the surface emissivity of the matte conductor and extend the service life of the matte conductor.

[0031] In the present invention, the outer surface of the conductor core refers to the outer surface of the conductor core extending in the radial direction. The outer surface of the adhesive layer refers to the outer surface of the adhesive layer extending in the radial direction. The matte conductor of the present invention may include a matte layer, an adhesive layer and a conductor core from the outside to the inside. Among them, the adhesive layer is used to bond the matte layer and the conductor core, and the inorganic non-metallic powder is located in the matte layer to improve the heat dissipation of the matte conductor. The conductor core may be formed by twisting a plurality of single conductors, and the material of the single conductor includes copper, aluminum or aluminum alloy; the twisting form of the single conductor may be concentric layer twisting; the cross-section of the conductor core may be circular, fan-shaped or tile-shaped. The matte layer includes an inorganic non-metallic powder with a surface emissivity ≥ 0.6. For example, the surface emissivity of the inorganic non-metallic powder may be any one of 0.6, 0.7, 0.8, 0.9 and a range consisting of any two of them.

[0032] The surface emissivity refers to the thermal radiation ability emitted by an object at a certain temperature. The larger the surface emissivity of the matte wire, the faster the matte wire can release heat energy, the shorter the time it takes to reach a thermal equilibrium state, and the better the heat dissipation.

[0033] In some embodiments of the present invention, in order to further increase the surface emissivity of the matte conductor and improve the heat dissipation of the matte conductor, inorganic non-metallic powder with a particle size of 10 μm-25 μm can be selected.

[0034] In the present invention, when the thickness of the adhesive layer is set to 3 μm-10 μm, the matte layer can be firmly bonded to the surface of the conductor core without affecting the heat dissipation of the matte conductor, thereby extending the service life of the matte conductor.

[0035] In some embodiments, when the thickness of the matte layer is set to 10 μm-30 μm, the matte wire can be endowed with excellent heat dissipation properties without affecting the conductivity of the matte wire.

[0036] In some embodiments, the diameter of the wire core is 4.05 mm-52.8 mm. Selecting a wire core within this diameter range can give the matte wire excellent conductive properties.

[0037] In the present invention, the material of the adhesive layer includes a thermosetting resin, which has good heat resistance, aging resistance and mechanical properties, and effectively improves the weather resistance and mechanical properties of the matte wire.

[0038] In some embodiments, the thermosetting resin includes a phenolic resin and / or a urea-formaldehyde resin, that is, the thermosetting resin may include a phenolic resin, may include a urea-formaldehyde resin, or may include a phenolic resin and a urea-formaldehyde resin.

[0039] In some embodiments, the inorganic non-metallic powder includes silicon powder or silicon ash. By using the inorganic non-metallic powder, the surface emissivity of the matte wire can be improved while maintaining the excellent electrical conductivity and mechanical properties of the matte wire.

[0040] In a second aspect, the present invention proposes a method for preparing the above-mentioned matte wire, comprising: obtaining the matte wire by forming a matte heat dissipation layer on the outer surface of the wire core.

[0041] Specifically, the matte conductor of the present invention is obtained by forming a matte heat dissipation layer on the outer surface of the conductor core. The present invention does not limit the formation method of the matte heat dissipation layer on the outer surface of the conductor core, as long as the matte heat dissipation layer can be located on the outer surface of the conductor core.

[0042] The preparation method of the present invention can prepare the matte wire of the first aspect, and the preparation method is simple to operate. No sand material such as brown corundum is used in the preparation process, which can reduce pollution to the air and soil and has excellent environmental protection.

[0043] In the present invention, the method for preparing the matte wire further comprises: forming an adhesive layer on the outer surface of the wire core, and forming a matte layer on the outer surface of the adhesive layer.

[0044] Specifically, an adhesive layer is formed on the outer surface of the wire core, and then a matte layer is formed on the outer surface of the adhesive layer, so as to obtain a matte wire including the wire core, the adhesive layer and the matte layer from the inside to the outside.

[0045] The present invention does not limit the specific formation method of the adhesive layer and the matte layer, as long as the adhesive layer and the matte layer can be formed.

[0046] The present invention forms an adhesive layer and a matte layer on the outer surface of the conductor core in sequence, and uses the adhesive layer to bond the matte layer to the outer surface of the conductor core, so as to avoid separation of the matte layer from the conductor core during long-term use, thereby further extending the service life of the matte conductor.

[0047] Furthermore, the bonding layer is coated on the outer surface of the conductor core by an online resin coating device, and the matte layer is obtained by spraying inorganic non-metallic powder on the outer surface of the bonding layer by a sandblasting device. The preparation method is simple to operate and is suitable for large-scale production.

[0048] Figure 1 Schematic diagram of the preparation device of the sub-light wire in the present invention, Figure 1 As shown, the device for preparing the matte conductor includes an online resin coating device 1, a sandblasting device 2, an online medium frequency induction heating device 3, a wire taking-up device and a reel 4.

[0049] In some embodiments, the method for preparing the matte conductive wire comprises the following steps:

[0050] (1) passing the conductor core through the online resin coating device 1 at a uniform speed, so that the thermosetting resin is evenly coated on the outer surface of the conductor core, and a bonding layer with a thickness of 3-10 μm is formed on the outer surface of the conductor core;

[0051] (2) using a sandblasting device 2 to uniformly spray inorganic non-metallic powder onto the outer surface of the bonding layer to form an intermediate conductor including a matte layer with a thickness of 10-30 μm;

[0052] (3) Using an online medium frequency induction heating device 3, the surface temperature of the intermediate conductor is set at 200-230°C and maintained for 8-12 minutes to completely cure the adhesive layer, thereby using the adhesive layer to bond the matte layer to the outer surface of the conductor core. After natural cooling, the conductor enters the wire take-up device and is taken up on the reel 4 to obtain the matte conductor.

[0053] The matte wire obtained by the preparation method has excellent heat dissipation performance and is simple to operate, and is suitable for large-scale production.

[0054] The present invention is described in detail below by specific embodiments:

[0055] Example 1

[0056] The matte conductive wire of this embodiment is prepared by a method comprising the following steps:

[0057] (1) The conductor core is passed through an online coating device at a uniform speed under the action of a traction device, so that the L872 phenolic resin is evenly coated on the outer surface of the conductor core, and a bonding layer with a thickness of 5 μm is formed on the outer surface of the conductor core;

[0058] (2) using a sandblasting device to evenly spray silicon powder on the outer surface of the bonding layer to form an intermediate conductor including a matte layer with a thickness of 30 μm;

[0059] (3) Use an online medium-frequency induction heating device to make the surface temperature of the middle conductor 210°C and maintain it for 10 minutes. After natural cooling, it enters the wire-taking device and is taken up on the reel to obtain a matte wire.

[0060] The matte wire of this embodiment includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core, the matte heat dissipation layer includes an adhesive layer and a matte layer; the adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer; the inorganic non-metallic powder is located in the matte layer, the inorganic non-metallic powder is silicon powder, and the surface emissivity of the inorganic non-metallic powder is 0.61;

[0061] The diameter of the conductor core is 4.05 mm, and the material of the conductor core is aluminum; the bonding layer includes L872 phenolic resin, the thickness of the bonding layer is 5 μm, the thickness of the matte layer is 30 μm, and the particle size of the inorganic non-metallic powder is 10 μm.

[0062] Example 2

[0063] The matte conductive wire of this embodiment is prepared by a method comprising the following steps:

[0064] (1) The conductor core is passed through an online coating device at a uniform speed under the action of a traction device, so that urea-formaldehyde resin (Mitsui Chemicals) is evenly coated on the outer surface of the conductor core, forming an adhesive layer with a thickness of 10 μm on the outer surface of the conductor core;

[0065] (2) using a sandblasting device to evenly spray silicon powder on the outer surface of the bonding layer to form an intermediate conductor including a matte layer with a thickness of 15 μm;

[0066] (3) Use an online medium-frequency induction heating device to make the surface temperature of the middle conductor 220°C and maintain it for 12 minutes. After natural cooling, it enters the wire-taking device and is taken up on the reel to obtain a matte wire.

[0067] The matte wire of this embodiment includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core, the matte heat dissipation layer includes an adhesive layer and a matte layer; the adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer; the inorganic non-metallic powder is located in the matte layer, the inorganic non-metallic powder is silica fume, and the surface emissivity of the inorganic non-metallic powder is 0.62;

[0068] The diameter of the conductor core is 16.4 mm, and the material of the conductor core is copper; the bonding layer includes urea-formaldehyde resin, the thickness of the bonding layer is 10 μm, the thickness of the matte layer is 15 μm, and the particle size of the inorganic non-metallic powder is 13 μm.

[0069] Example 3

[0070] The matte conductive wire of this embodiment is prepared by a method comprising the following steps:

[0071] (1) The conductor core is passed through an online coating device at a uniform speed under the action of a traction device, so that the L872 phenolic resin is evenly coated on the outer surface of the conductor core, forming an adhesive layer with a thickness of 7 μm on the outer surface of the conductor core;

[0072] (2) using a sandblasting device to evenly spray silicon powder on the outer surface of the bonding layer to form an intermediate conductor including a matte layer with a thickness of 20 μm;

[0073] (3) Use an online medium-frequency induction heating device to make the surface temperature of the middle conductor 230°C and maintain it for 10 minutes. After natural cooling, it enters the wire-taking device and is taken up on the reel to obtain a matte wire.

[0074] The matte wire of this embodiment includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core, the matte heat dissipation layer includes an adhesive layer and a matte layer; the adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer; the inorganic non-metallic powder is located in the matte layer, the inorganic non-metallic powder is silicon powder, and the surface emissivity of the inorganic non-metallic powder is 0.65;

[0075] Among them, the diameter of the conductor core is 27.6mm, and the material of the conductor core is aluminum; the bonding layer includes L872 phenolic resin, the thickness of the bonding layer is 7μm, the thickness of the matte layer is 20μm, and the particle size of the inorganic non-metallic powder is 15μm.

[0076] Example 4

[0077] The preparation method of the matte wire in this embodiment is basically the same as that in Embodiment 1, except that an equal amount of phenolic resin is replaced by thermoplastic resin polypropylene (model K1020).

[0078] Example 5

[0079] The method for preparing the matte conductive line in this embodiment is substantially the same as that in Embodiment 1, except that the thickness of the adhesive layer is changed from 5 μm to 20 μm.

[0080] Example 6

[0081] The method for preparing the matte conductive line in this embodiment is substantially the same as that in Embodiment 1, except that the thickness of the matte layer is changed from 5 μm to 60 μm.

[0082] Example 7

[0083] The preparation method of the matte wire in this embodiment is basically the same as that in Embodiment 1, except that an equal amount of silicon powder with a particle size of 10 μm is replaced by silicon powder with a particle size of 50 μm.

[0084] Comparative Example 1

[0085] The preparation method of the matte conductive wire in this comparative example is basically the same as that in Example 1, except that the silicon powder with a surface emissivity of 0.61 is replaced by quartz powder with a surface emissivity of 0.3 in equal amounts.

[0086] Comparative Example 2

[0087] The matte conductive wire of this comparative example is prepared by a method comprising the following steps:

[0088] (1) The conductor core is passed through a sandblasting device at a uniform speed under the action of a traction device, and silicon powder is evenly sprayed on the outer surface of the conductor core by the sandblasting device to form an intermediate conductor including a matte heat dissipation layer with a thickness of 30 μm;

[0089] (2) Use an online medium-frequency induction heating device to make the surface temperature of the middle conductor 210°C and maintain it for 10 minutes. After natural cooling, it enters the wire-taking device and is taken up on the reel to obtain a matte wire.

[0090] The matte wire of this comparative example includes a wire core and a matte heat dissipation layer located on the outer surface of the wire core, the matte heat dissipation layer includes a matte layer; the matte layer is located on the outer surface of the wire core, the inorganic non-metallic powder is located on the matte layer, the inorganic non-metallic powder is silicon powder, and the surface emissivity of the inorganic non-metallic powder is 0.61;

[0091] Among them, the diameter of the conductor core is 41.1 mm, and the material of the conductor core is aluminum; the thickness of the matte layer is 30 μm, and the particle size of the inorganic non-metallic powder is 18 μm.

[0092] Performance Testing

[0093] (1) Surface emissivity: tested according to GJB5023.2-2003 test standard.

[0094] The surface emissivity of the matte conductive wires prepared in the embodiments of the present invention and the comparative examples was tested, and the results are shown in Table 1.

[0095] Table 1

[0096]

[0097] It can be seen from Table 1 that the matte wire in the embodiment of the present invention has a more excellent surface emissivity, and thus has a more excellent heat dissipation performance and a longer service life;

[0098] In particular, it can be seen from Example 1 and Comparative Example 1 that only by using inorganic non-metallic powders with a surface emission coefficient greater than or equal to 0.6 can a matte conductor with an excellent surface emission coefficient be obtained; it can be seen from Example 1 and Comparative Example 2 that the matte conductor must not only include inorganic non-metallic powders with a surface emission coefficient greater than or equal to 0.6, but also include an adhesive layer in order to have an excellent surface emission coefficient.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A matte wire, characterized in that: The matte wire comprises a wire core and a matte heat dissipation layer located on the outer surface of the wire core; The matte heat dissipation layer includes an adhesive layer and a matte layer, the adhesive layer is located on the outer surface of the wire core, and the matte layer is located on the outer surface of the adhesive layer; The inorganic non-metallic powder is located in the matte layer, and the surface emission coefficient of the inorganic non-metallic powder is ≥0.

6.

2. The matte wire according to claim 1, characterized in that: The particle size of the inorganic non-metallic powder is 10 μm-25 μm.

3. The matte wire according to claim 1, characterized in that: The thickness of the adhesive layer is 3 μm-10 μm.

4. The matte wire according to claim 1, characterized in that: The thickness of the matte layer is 10 μm-30 μm.

5. The matte wire according to claim 1, characterized in that: The diameter of the conductor core is 4.05 mm-52.8 mm.

6. The matte wire according to claim 1, characterized in that: The material of the adhesive layer includes thermosetting resin.

7. The matte wire according to claim 1, characterized in that: The inorganic non-metallic powder includes silicon powder or silicon ash.

8. A method for preparing the matte conductive wire according to any one of claims 1 to 7, characterized in that: The matte conductive wire is obtained by forming a matte heat dissipation layer on the outer surface of the conductive wire core.

9. The preparation method according to claim 8, characterized in that: Also includes: An adhesive layer is formed on the outer surface of the conductor core, and a matte layer is formed on the outer surface of the adhesive layer.

10. The preparation method according to claim 9, characterized in that: The matte layer is obtained by spraying inorganic non-metallic powder on the outer surface of the bonding layer.

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