Micro coaxial chip interconnection structure based on copper-based additive manufacturing process and application

Abstract

The invention discloses a micro coaxial chip interconnection structure based on a copper-based additive manufacturing process and application, and belongs to the technical field of microwave radio frequency. Comprising a coaxial horizontal-to-vertical connection structure and a connector-like interconnection structure, the coaxial horizontal-to-vertical connection structure comprises a horizontal rectangular coaxial interface and a vertical circular coaxial interface which are connected through a first rectangular coaxial line, and an outer conductor is arranged on the outer side of the first rectangular coaxial line; the connector-like interconnection structure comprises a circular coaxial outer conductor, a structure in which the two ends of an inner core protrude out of the outer conductor, an inner core matching structure and a medium supporting structure, the inner core is provided with two sections, the two sections of the inner core are connected through the inner core matching structure, and the circular coaxial outer conductor is arranged on the outer side of the medium supporting structure. The end face of the inner core connected with the outside is respectively provided with a structure that the two ends of the inner core protrude out of the outer conductor, the connector can be in direct contact with a standard connector, the structure is compact, welding is not needed, the connector has the advantages of flexibility and easy assembly, and packaging and using of the micro coaxial chip are facilitated.

Description

Technical Field

[0001] The present invention belongs to the field of microwave radio frequency testing technology, and in particular relates to a micro-coaxial chip interconnection structure based on a copper-based additive manufacturing process and an application thereof. Background Art

[0002] As microwave systems become increasingly miniaturized, the interconnection structure inside RF systems plays a vital role in system integration. Traditional 3D interconnection technologies, such as those based on microstrip, stripline, and waveguide transmission lines, have been widely studied and applied. However, in recent years, micro-coaxial devices have received increasing attention for their applications in RF microsystems due to their advantages in ultra-wideband, low insertion loss, and low crosstalk. Micro-coaxial devices have demonstrated excellent performance and have achieved efficient integration and testing in certain applications.

[0003] Despite this, there is still relatively little research on micro-coaxial devices, especially their multi-layer interconnection structures, especially in high-frequency bands (such as the W band). At present, a variety of broadband, low-loss micro-coaxial transition structures have been proposed, and these solutions show good electrical performance in different frequency ranges. However, these structures can often only be applied in specific test environments or limited frequency ranges, and there are certain limitations in their application in actual multi-layer chip interconnection.

[0004] For example, a micro-coaxial-GSG transition structure proposed in a study can work at 170 GHz, but is only suitable for probe testing; another micro-coaxial-CPW transition structure has reliable mechanical properties and can be connected to other MMICs through gold wire bonding or flip chip, but its operating frequency is limited to below 40 GHz. In addition, most of the research on interconnection between micro-coaxial chips relies on solder balls or liquid metal as the interconnection medium. These methods are prone to short circuits or operational difficulties in actual operation, affecting the reliability and stability of the interconnection structure.

[0005] In order to meet these challenges, especially to achieve ultra-wideband three-dimensional interconnection of micro-coaxial devices in the W-band, it is necessary to provide a micro-coaxial chip interconnection structure based on standard connectors and connector-like connectors. Summary of the invention

[0006] In order to solve the above problems and achieve the above objectives, the present invention provides a micro-coaxial chip interconnection structure and application based on a copper-based additive manufacturing process, aiming to achieve effective and convenient chip interconnection.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a connector-like micro-coaxial chip interconnection structure, including a coaxial horizontal to vertical connection structure and a connector-like interconnection structure, the coaxial horizontal to vertical connection structure includes a rectangular coaxial interface in the horizontal direction and a circular coaxial interface in the vertical direction connected by a first rectangular coaxial line, and the outer side of the first rectangular coaxial line is an outer conductor; the connector-like interconnection structure includes a circular coaxial outer conductor, a structure in which an inner core protrudes from the outer conductor at both ends, an inner core matching structure and a dielectric support structure, the inner core is provided with two sections, the two sections of the inner core are connected by the inner core matching structure, the outer side of the dielectric support structure is a circular coaxial outer conductor, and the inner core end faces connected to the outside are respectively provided with structures in which the inner core protrudes from the outer conductor at both ends.

[0008] Furthermore, the end face of the coaxial line at the rectangular coaxial interface is connected with a matching structure, and the matching structure has a rectangular cross-section.

[0009] Furthermore, a horizontal rectangular coaxial-vertical circular coaxial conversion structure is arranged at the circular coaxial interface. The horizontal rectangular coaxial-vertical circular coaxial conversion structure is columnar as a whole. A circular coaxial interface is arranged at the top of the horizontal rectangular coaxial-vertical circular coaxial conversion structure. One end of the first rectangular coaxial line is connected to the side, and the other end is a rectangular coaxial interface.

[0010] Furthermore, a cavity is provided at the rectangular coaxial interface to reduce parasitic coupling; the outer conductor is a five-layer structure, the first rectangular coaxial line is located in the middle layer, and the outer conductor is removed along the rectangular cross-section near the matching structure at the top and bottom layers of the outer conductor to form a cavity.

[0011] Furthermore, it also includes a coaxial horizontal connection structure, including an inner conductor, an outer conductor outside the inner conductor, the inner conductor is a second rectangular coaxial line, matching structures are set at both ends of the inner conductor, and a cavity is set at the outer conductor at the connection with the coaxial line.

[0012] Furthermore, an auxiliary connection structure is provided at the connection between the coaxial connector and the rectangular coaxial line. The auxiliary connection structure is composed of a circular coaxial transmission line with an inner conductor indented to a set length toward the inner side of the end face and a SU-8 photoresist support structure. The circular coaxial transmission line is connected to the matching structure 7 at the discontinuity of the inner core.

[0013] Furthermore, the structure in which the inner core protrudes from the outer conductor at both ends protrudes from the outer conductor by 20 μm.

[0014] Furthermore, a SU-8 photoresist support structure is provided at the bottom end of the circular coaxial interface, the SU-8 photoresist support structure is evenly spaced between the first rectangular coaxial line and the outer conductor, and positioning holes are provided on both sides of the middle of the coaxial horizontal to vertical connection structure.

[0015] On the other hand, the present invention also provides the application of the above-mentioned connector-based micro-coaxial chip interconnection structure, where the horizontal rectangular coaxial interface and the vertical circular coaxial interface are directly connected to the standard coaxial connector.

[0016] Furthermore, it also includes a coaxial horizontal connection structure, including an inner conductor, an outer conductor outside the inner conductor, the inner conductor is a second rectangular coaxial line, matching structures are set at both ends of the inner conductor, a cavity is set at the outer conductor at the connection with the coaxial line, and both ends of the coaxial horizontal connection structure are connected to standard coaxial connectors.

[0017] Compared with the prior art, the present invention has at least the following beneficial effects: the present invention provides two connection interfaces when the micro-coaxial chip is connected to the standard connector, including a horizontal connection interface and a vertical connection interface, which can be directly contacted with the standard connector, have a compact structure and do not require welding, have the advantages of flexibility and easy assembly, and are conducive to the packaging and use of the micro-coaxial chip. In addition, when the two interfaces are connected to the connector, the simulation results show good return loss and low insertion loss, and have good transmission performance in the DC-110GHz frequency band. In addition, the design of the vertical interconnection structure and the coordination of the micro-coaxial chip interface design realize the inter-layer interconnection of the micro-coaxial chip, which has the advantages of compact structure, easy assembly, ultra-wideband and low insertion loss, and provides help for realizing a micro-coaxial system with compact structure and low loss performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the prior art solutions, the drawings used in the embodiments or the prior art solutions are briefly introduced below. It should be noted that the drawings described below are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0019] Figure 1 An oblique axonometric diagram of a coaxial horizontal to vertical connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Figure 2 A front detail view of a coaxial horizontal-to-vertical connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Figure 3 A schematic diagram of a coaxial horizontal to vertical connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention connected to a standard coaxial connector; Figure 4 An oblique axonometric diagram of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Figure 5A connection structure detail diagram of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Figure 6 A schematic diagram of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention connected to a standard coaxial connector; Figure 7 A detailed diagram of an auxiliary connection structure of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Figure 8 A simulation result diagram of a coaxial horizontal to vertical connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Fig. 9 A simulation result diagram of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention; Fig.10 A schematic diagram of a coaxial interconnect structure provided by an embodiment of the present invention; Fig.11 A schematic isometric view of a micro-coaxial chip interconnection structure based on a connector-like structure provided in Example 1 of the present invention; Fig.12 for Fig.11 A front view schematic diagram of . DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. It should be noted that the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0021] In the description of the embodiments of the present invention, it needs to be understood that the terms "vertical", "horizontal", "vertical direction", "horizontal direction", "top", "bottom", "left side", "right side", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and cannot be regarded as indicating that the elements or devices indicated are in specific orientations.

[0022] In the description of the embodiments of the present invention, the structural dimensions given are preferred parameters. With reference to the embodiments of the present invention, the dimensional parameters of each component may be modified to further obtain the actual required performance.

[0023] The present invention proposes to design a corresponding horizontal or vertical micro-coaxial chip transfer structure based on a standard connector to achieve the transfer of the micro-coaxial chip with the connector structure in the horizontal and vertical directions, including the electrical and mechanical design of the inner guide shaft, the outer coaxial shaft and the supporting structure SU-8. Based on these two transfer structures, a connector-like interconnection structure is designed, including an inner conductor, an outer conductor and a dielectric bead, which ultimately achieves the vertical interconnection of two layers of micro-coaxial chips. The micro-coaxial-connector horizontal transfer structure and the micro-coaxial-connector vertical transfer structure both utilize a section of equivalent connector, i.e., a circular coaxial transmission line structure, for excitation at the interface, and utilize the inner and outer conductor design of the micro-coaxial chip to perform impedance matching at the discontinuity, thereby enabling effective transfer between the micro-coaxial line and the standard coaxial connector. In addition, a connector-like structure is used as an intermediate structure to achieve low-loss, ultra-wideband interconnection between two layers of micro-coaxial chips.

[0024] Embodiment 1. The present invention provides a connector-like micro-coaxial chip interconnection structure, including a coaxial horizontal-to-vertical connection structure and a connector-like interconnection structure. The coaxial horizontal-to-vertical connection structure includes a horizontal rectangular coaxial interface 4 and a vertical circular coaxial interface 1 connected by a first rectangular coaxial line 3, and the outer side of the first rectangular coaxial line 3 is an outer conductor; the connector-like interconnection structure includes a circular coaxial outer conductor 12, a structure 13 in which an inner core protrudes from the outer conductor at both ends, an inner core matching structure 14 and a dielectric support structure 15. The inner core is provided with two sections, and the two sections of the inner core are connected by the inner core matching structure 14. The outer side of the dielectric support structure 15 is a circular coaxial outer conductor 12, and the inner core end faces connected to the outside are respectively provided with a structure 13 in which the inner core protrudes from the outer conductor at both ends.

[0025] Embodiment 2, the present invention provides a coaxial horizontal connection structure, including an inner conductor, an outer conductor outside the inner conductor, the inner conductor is a second rectangular coaxial line 8, matching structures 7 are arranged at both ends of the inner conductor, and a cavity 10 is arranged at the outer conductor at the connection with the coaxial line; a cavity 10 for reducing parasitic coupling is provided at the connection between the second rectangular coaxial line 8 and the coaxial connector; the outer conductor is a five-layer structure, the first rectangular coaxial line 3 is located in the middle layer, and the outer conductor is removed along the rectangular cross-section at the top and bottom layers of the outer conductor near the matching structure 7 to form a cavity 10; both ends of the coaxial horizontal connection structure can be connected to the coaxial connector.

[0026] See also Figure 1 , an oblique axonometric view of a coaxial horizontal to vertical connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention, Figure 2A front detail view of a coaxial horizontal to vertical connection structure based on a copper-based additive manufacturing process provided in an embodiment of the present invention, comprising a circular coaxial interface 1, a horizontal rectangular coaxial-vertical circular coaxial conversion structure 2, a first rectangular coaxial line 3, a rectangular coaxial interface 4, and a positioning hole 5 for positioning the chip and the fixture, wherein the inner conductor in the first rectangular coaxial line 3 is supported by a first SU-8 photoresist support structure 6. The impedance of the circular coaxial interface 1 and the rectangular coaxial interface 4 is 50 ohms, and is used to connect a standard coaxial connector; the coaxial horizontal to vertical connection structure is semicircular at one end and rectangular at the other end, a horizontal rectangular coaxial-vertical circular coaxial conversion structure 2 is provided at one end of the semicircle, a rectangular coaxial interface 4 is provided at one end of the rectangle, one end of the first rectangular coaxial line 3 is connected to the horizontal rectangular coaxial-vertical circular coaxial conversion structure 2, and the other end extends to the rectangular coaxial interface 4, and the positioning holes 5 are provided on both sides of the middle of the coaxial horizontal to vertical connection structure.

[0027] See also Figure 3 , a schematic diagram of a coaxial horizontal to vertical connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention is connected to a standard coaxial connector, wherein a circular coaxial line 11 is used as a simplified standard coaxial connector, which is connected to a circular coaxial interface 1 and a rectangular coaxial interface 4 respectively, and the circular coaxial line 11 connects a horizontal rectangular coaxial-vertical circular coaxial conversion structure 2 and a rectangular coaxial interface 4; See also Figure 4 An oblique axonometric diagram of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention, Figure 5 A detailed diagram of the connection structure of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided in an embodiment of the present invention includes a matching structure 7 at a discontinuity of the inner core, a second rectangular coaxial line 8, a second SU-8 photoresist support structure 9, and a cavity 10. The two ends of the second rectangular coaxial line 8 are respectively connected to the matching structure 7 at the discontinuity of the inner core, the outer side of the second rectangular coaxial line 8 is an outer conductor, and cavities 10 are provided at both ends of the outer conductor. The matching structure 7 at the discontinuity of the inner core is used to connect a standard coaxial connector, and the size of the matching structure 7 of the coaxial horizontal connection structure used for the DC-220GHz frequency band is 0.05mm-0.2mm. The cavity 10 is a rectangular cavity hollowed out at the top and bottom layers of the outer conductor near the matching structure 7, which is used to reduce the parasitic coupling between the horizontal connection structure B and the standard coaxial connector, and the size of the cavity 10 of the coaxial horizontal connection structure used for the DC-220GHz frequency band is 0.05mm-0.5mm.

[0028] Figure 6 A schematic diagram of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided by an embodiment of the present invention connected to a standard coaxial connector, Figure 7A detailed diagram of the auxiliary connection structure of a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided in an embodiment of the present invention, wherein a circular coaxial line 11 is used as a simplified standard coaxial connector, and the auxiliary connection structure 16 is composed of a circular coaxial transmission line 17 in which the inner conductor is indented 0.1 mm inwardly of the end face and a SU-8 photoresist support structure 9, which is connected to the matching structure 7 at the discontinuity of the inner core, thereby protecting the matching structure 7 from being damaged by the standard coaxial connector.

[0029] See also Figure 8 and Fig. 9 The simulation result diagrams of a coaxial horizontal to vertical connection structure and a coaxial horizontal connection structure based on a copper-based additive manufacturing process provided in an embodiment of the present invention respectively show that the echo in the DC-110GHz frequency band is less than -20dB, which can realize the function of interconnecting chips and has little impact on test accuracy.

[0030] See also Fig.10 A schematic diagram of a coaxial interconnection structure provided for an embodiment of the present invention includes a circular coaxial outer conductor 12, a structure 13 where the inner core protrudes from the outer conductor at both ends, an inner core matching structure 14 at the discontinuity of the inner core, and a dielectric support structure 15 for fixing the position of the inner core. The inner core is provided with two sections, and the inner cores are connected by the inner core matching structure 14. The dielectric support structure 15 is coaxially provided outside the inner core matching structure 14. The outer side of the dielectric support structure 15 is a circular coaxial outer conductor 12, and the inner core end faces connected to the outside are respectively provided with structures 13 where the inner core protrudes from the outer conductor at both ends. The inner core matching structure 14 is used to reduce the reflection caused by the dielectric support structure 15. The inner conductor protruding structure 13 is to enable the inner core of A to produce a certain elastic deformation when the coaxial interconnection structure is interconnected with the vertical interface of the horizontal-to-vertical connection coaxial horizontal-to-vertical connection structure, so that there is sufficient contact force when the two are in contact, ensuring the close contact between the two, so that the signal can be effectively transmitted. Since the presence of the dielectric support structure 15 will deteriorate the echo and insertion loss of the coaxial interconnect structure, in order to achieve impedance matching of the structure, a coplanar compensation design is made for the inner core where the dielectric exists, so that the radius of the inner core is discontinuous.

[0031] The invention discloses a transfer structure between a micro-coaxial chip and a chip and between a chip and a standard connector, belonging to the field of microwave radio frequency technology, and includes a micro-coaxial horizontal-connector transfer structure, a micro-coaxial vertical-connector transfer structure, and an interconnection structure between micro-coaxial chips and chips. A rectangular micro-coaxial line includes an outer conductor, an inner conductor and a support structure. The interconnection structure includes an outer conductor, an inner conductor and a dielectric bead. The coaxial structure part where the connector contacts the chip includes an inner conductor and an outer conductor, wherein the inner conductor and the outer conductor protrude by 20 μm, the purpose of which is to ensure that when interconnected with the micro-coaxial chip, the reliability of the contact between the inner conductors of the two is increased. The structural part where the micro-coaxial chip contacts the connector in the horizontal direction includes an inner conductor, an outer conductor and an SU-8 support structure, wherein the matching structure of the inner conductor at the discontinuity includes a change in the width of the inner conductor and a protruding structure, which can improve the interconnection effect and reduce reflection. The structural part where the micro-coaxial chip contacts the connector in the vertical direction includes an inner conductor, an outer conductor and an SU-8 support structure, wherein increasing the thickness of the SU-8 support structure can improve the mechanical strength of the micro-coaxial chip when interconnected. The micro-coaxial interconnection structure provided by the present invention is applicable to working frequency bands covering DC-67 GHz, DC-110 GHz, DC-145 GHz, and DC-220 GHz.

[0032] Based on the above records, including the micro-coaxial horizontal-connector transition structure, the micro-coaxial vertical-connector transition structure, and the interconnection structure between micro-coaxial chips, the rectangular micro-coaxial line includes an outer conductor, an inner conductor and a supporting structure, and the interconnection structure includes an outer conductor, an inner conductor and a medium; the coaxial structure part where the connector contacts the chip includes an inner conductor and an outer conductor, wherein the inner conductor and the outer conductor protrude by 20μm, the purpose of which is to ensure that when interconnected with the micro-coaxial chip, the reliability of the contact between the inner conductors of the two is increased; the structural part when the micro-coaxial chip contacts the connector in the horizontal direction includes the inner conductor, the outer conductor and the SU-8 supporting structure, wherein the matching structure of the inner conductor at the discontinuity, including the change of the width of the inner conductor and the protruding structure, can improve the interconnection effect and reduce reflection; the structural part when the micro-coaxial chip contacts the connector in the vertical direction includes the inner conductor, the outer conductor and the SU-8 supporting structure, wherein increasing the thickness of the SU-8 supporting structure can improve the mechanical strength of the micro-coaxial chip when interconnected. The micro-coaxial interconnection structure provided by the present invention is applicable to working frequency bands covering DC-67 GHz, DC-110 GHz, DC-145 GHz, and DC-220 GHz.

[0033] The connector-like micro-coaxial chip interconnection structure described in the present application can be used to realize ultra-wideband three-dimensional interconnection of micro-coaxial devices in the DC-67GHz, DC-110GHz, DC-145GHz, and DC-220GHz bands, overcoming the problem that the existing structure can only be applied to specific test environments or within a limited frequency range and has limitations in its application in actual multi-layer chip interconnection, and can be used for the connection of interfaces in various orientations.

[0034] The above is a description of a micro-coaxial chip interconnection structure based on a connector and a connector-like structure provided by the present invention. For those skilled in the art, according to the idea of ​​the embodiment of the present invention, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A micro-coaxial chip interconnection structure based on a connector-like structure, characterized in that: The invention comprises a coaxial horizontal to vertical connection structure and a connector-like interconnection structure. The coaxial horizontal to vertical connection structure comprises a rectangular coaxial interface (4) in the horizontal direction and a circular coaxial interface (1) in the vertical direction connected by a first rectangular coaxial line (3). The outer side of the first rectangular coaxial line (3) is an outer conductor. The connector-like interconnection structure comprises a circular coaxial outer conductor (12), a structure (13) in which an inner core protrudes from the outer conductor at both ends, an inner core matching structure (14), and a dielectric support structure (15). The inner core is provided with two sections, and the two sections of the inner core are connected via the inner core matching structure (14). The outer side of the dielectric support structure (15) is a circular coaxial outer conductor (12). The inner core end faces connected to the outside are respectively provided with structures (13) in which the inner core protrudes from the outer conductor at both ends.

2. The micro-coaxial chip interconnection structure based on a similar connector according to claim 1 is characterized in that: The coaxial line end face at the rectangular coaxial interface (4) is connected to a matching structure (7), and the matching structure (7) has a rectangular cross section.

3. The micro-coaxial chip interconnection structure based on a similar connector according to claim 1 is characterized in that: A horizontal rectangular coaxial-vertical circular coaxial conversion structure (2) is arranged at the circular coaxial interface (1); the horizontal rectangular coaxial-vertical circular coaxial conversion structure (2) is columnar in shape as a whole; the circular coaxial interface (1) is arranged at the top of the horizontal rectangular coaxial-vertical circular coaxial conversion structure (2); one end of the first rectangular coaxial line (3) is connected to the side surface; and the other end is a rectangular coaxial interface (4).

4. The micro-coaxial chip interconnection structure based on a similar connector according to claim 1, characterized in that: A cavity (10) for reducing parasitic coupling is provided at the rectangular coaxial interface (4); the outer conductor is a five-layer structure, the first rectangular coaxial line (3) is located in the middle layer, and the outer conductor is removed along a rectangular cross section near the matching structure (7) at the top and bottom layers of the outer conductor to form a cavity (10).

5. The micro-coaxial chip interconnection structure based on a similar connector according to claim 4 is characterized in that: It also includes a coaxial horizontal connection structure, including an inner conductor, an outer conductor outside the inner conductor, the inner conductor is a second rectangular coaxial line (8), matching structures (7) are arranged at both ends of the inner conductor, and a cavity (10) is arranged at the outer conductor at the connection with the coaxial line.

6. The micro-coaxial chip interconnection structure based on a similar connector according to claim 1, characterized in that: An auxiliary connection structure (16) is provided at the connection between the coaxial connector (11) and the rectangular coaxial line. The auxiliary connection structure (16) is composed of a circular coaxial transmission line (17) whose inner conductor is indented toward the inner side of the end face by a set length and a SU-8 photoresist support structure. The circular coaxial transmission line (17) is connected to the matching structure 7 at the discontinuity of the inner core.

7. The micro-coaxial chip interconnection structure based on a similar connector according to claim 1, characterized in that: The structure (13) of the inner core protruding from the outer conductor at both ends protrudes from the outer conductor by 20 μm.

8. The micro-coaxial chip interconnection structure based on a similar connector according to claim 1, characterized in that: The bottom end of the circular coaxial interface (1) has a SU-8 photoresist support structure, a first SU-8 photoresist support structure (6) is evenly spaced between the first rectangular coaxial line (3) and the outer conductor, and positioning holes (5) are provided on both sides of the middle of the coaxial horizontal to vertical connection structure.

9. The application of the connector-like micro-coaxial chip interconnection structure according to any one of claims 1 to 8, characterized in that: The rectangular coaxial interface (4) in the horizontal direction and the circular coaxial interface (1) in the vertical direction are both directly connected to a standard coaxial connector.

10. The use according to claim 9, characterized in that: It also includes a coaxial horizontal connection structure, including an inner conductor, an outer conductor outside the inner conductor, the inner conductor is a second rectangular coaxial line (8), matching structures (7) are arranged at both ends of the inner conductor, a cavity (10) is arranged at the outer conductor at the connection with the coaxial line, and both ends of the coaxial horizontal connection structure are connected to standard coaxial connectors.

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