Array substrate, preparation method thereof and display device

Abstract

The invention provides an array substrate, a preparation method thereof and a display device. The array substrate comprises a substrate and a light-emitting structure layer, the light-emitting structure layer comprises at least one light-emitting unit, and the light-emitting unit is configured to emit white light in the direction away from the substrate; at least one light-emitting unit comprises a first light-emitting element, a second light-emitting element and a third light-emitting element which are sequentially stacked, and orthographic projections of the first light-emitting element, the second light-emitting element and the third light-emitting element on the array substrate are partially overlapped; the first light-emitting element is configured to emit monochromatic light of a first color, the second light-emitting element is configured to emit monochromatic light of a second color, and the third light-emitting element is configured to emit monochromatic light of a third color; wherein the first color, the second color and the third color are all one of three primary colors. According to the array substrate provided by the embodiment of the invention, the problems of low yield and relatively low pixel density of an existing product can be solved.

Description

Technical Field

[0001] The present invention relates to but is not limited to the field of display technology, and in particular to an array substrate and a preparation method thereof, and a display device. Background Art

[0002] In recent years, the research on Micro Light Emitting Diode (Micro LED) has continued to heat up. Micro LED refers to the traditional LED array, miniaturized and arranged on the circuit substrate to form ultra-small pitch LED. Specifically, it refers to further miniaturizing the length of the millimeter-level LED to the micron level to adapt to display products of various sizes. Micro LED has the advantages of long life and low power consumption.

[0003] However, existing color Micro LEDs have problems such as low yield rate and low pixel density (pixels per inch, PPI). Summary of the invention

[0004] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0005] The embodiments of the present disclosure provide an array substrate and a method for manufacturing the same, and a display device, which can solve the problems of low yield and low pixel density of existing products.

[0006] In one aspect, an embodiment of the present disclosure provides an array substrate. The array substrate includes a substrate and a light emitting structure layer located on one side of the substrate, the light emitting structure layer includes at least one light emitting unit, and the light emitting unit is configured to emit white light in a direction away from the substrate;

[0007] The at least one light-emitting unit includes a first light-emitting element, a second light-emitting element and a third light-emitting element which are stacked in sequence, and the first light-emitting element, the second light-emitting element and the third light-emitting element partially overlap in their orthographic projections on the array substrate; the first light-emitting element is configured to emit monochromatic light of a first color in a direction away from the substrate, the second light-emitting element is configured to emit monochromatic light of a second color in a direction away from the substrate, and the third light-emitting element is configured to emit monochromatic light of a third color in a direction away from the substrate; wherein the first color, the second color and the third color are all one of the three primary colors.

[0008] In an exemplary embodiment, the first light-emitting element, the second light-emitting element and the third light-emitting element are stacked in sequence in a direction away from the substrate; wherein the orthographic projection of the first light-emitting element on the array substrate includes the orthographic projection of the second light-emitting element on the array substrate, and the orthographic projection of the second light-emitting element on the array substrate includes the orthographic projection of the third light-emitting element on the array substrate.

[0009] In an exemplary embodiment, the orthographic projection of the second light-emitting element on the array substrate is located in the middle of the orthographic projection of the first light-emitting element on the array substrate, and the orthographic projection of the third light-emitting element on the array substrate is located in the middle of the orthographic projection of the second light-emitting element on the array substrate.

[0010] In an exemplary embodiment, the first light-emitting element is ring-shaped in the portion where the orthographic projection of the first light-emitting element on the array substrate does not overlap with the orthographic projection of the second light-emitting element on the array substrate, and the second light-emitting element is ring-shaped in the portion where the orthographic projection of the second light-emitting element on the array substrate does not overlap with the orthographic projection of the third light-emitting element on the array substrate.

[0011] In an exemplary embodiment, the first light-emitting element includes a first electrode, a first light-emitting composite layer, and a second electrode stacked in sequence in a direction away from the substrate, and the first light-emitting composite layer is configured to emit monochromatic light of a first color under the drive of an electric field formed by the first electrode and the second electrode;

[0012] Among them, the overlapping part of the orthographic projection of the first light-emitting composite layer and the second electrode on the array substrate partially overlaps with the orthographic projection of the first electrode on the array substrate, and the orthographic projections of the first light-emitting composite layer and the second electrode on the array substrate are both located inside the orthographic projection of the first electrode on the array substrate.

[0013] In an exemplary embodiment, the second light-emitting element includes a third electrode, a second light-emitting composite layer, and a fourth electrode stacked in sequence in a direction away from the substrate, and the second light-emitting composite layer is configured to emit monochromatic light of a second color under the drive of an electric field formed by the third electrode and the fourth electrode;

[0014] Among them, the overlapping part of the orthographic projection of the second light-emitting composite layer and the fourth electrode on the array substrate partially overlaps with the orthographic projection of the third electrode on the array substrate, and the orthographic projection of the second light-emitting composite layer and the fourth electrode on the array substrate are both located inside the orthographic projection of the third electrode on the array substrate.

[0015] In an exemplary embodiment, the third light-emitting element includes a fifth electrode, a third light-emitting composite layer, and a sixth electrode stacked in sequence in a direction away from the substrate, and the third light-emitting composite layer is configured to emit monochromatic light of a third color under the drive of an electric field formed by the fifth electrode and the sixth electrode;

[0016] Among them, the overlapping part of the orthographic projection of the third light-emitting composite layer and the sixth electrode on the array substrate partially overlaps with the orthographic projection of the fifth electrode on the array substrate, and the orthographic projections of the third light-emitting composite layer and the sixth electrode on the array substrate are both located inside the orthographic projection of the fifth electrode on the array substrate.

[0017] In an exemplary embodiment, the array substrate further includes a planar layer, and an orthographic projection of the planar layer on the array substrate includes an orthographic projection of at least one of the light emitting units on the array substrate.

[0018] In an exemplary embodiment, the array substrate further includes a conductive layer, the conductive layer is located on a side of the planar layer away from the substrate, the conductive layer includes a plurality of connecting electrodes, and the plurality of connecting electrodes are configured to be electrically connected to the light emitting units.

[0019] In an exemplary embodiment, the multiple connecting electrodes include a first connecting electrode and a second connecting electrode, the planar layer includes a first via and a second via, and the first via exposes a portion of the surface of the first electrode, the second via exposes a portion of the surface of the second electrode, the first connecting electrode is electrically connected to the first electrode via the first via, and the second connecting electrode is electrically connected to the second electrode via the second via.

[0020] In an exemplary embodiment, the plurality of connecting electrodes include a third connecting electrode and a fourth connecting electrode, the planar layer includes a third via and a fourth via, and the third via exposes a portion of the surface of the third electrode, the fourth via exposes a portion of the surface of the fourth electrode, the third connecting electrode is electrically connected to the third electrode via the third via, and the fourth connecting electrode is electrically connected to the fourth electrode via the fourth via.

[0021] In an exemplary embodiment, the plurality of connecting electrodes include a fifth connecting electrode and a sixth connecting electrode, the planar layer includes a fifth via and a sixth via, and the fifth via exposes a portion of the surface of the fifth electrode, the sixth via exposes a portion of the surface of the sixth electrode, the fifth connecting electrode is electrically connected to the fifth electrode via the fifth via, and the sixth connecting electrode is electrically connected to the sixth electrode via the sixth via.

[0022] In an exemplary embodiment, the first light-emitting element, the second light-emitting element and the third light-emitting element are stacked in sequence in a direction away from the substrate; the array substrate also includes a first bonding medium layer and a second bonding medium layer, the first bonding medium layer is located between the first light-emitting element and the second light-emitting element, and the second bonding medium layer is located between the third light-emitting element and the second light-emitting element.

[0023] On the other hand, an embodiment of the present disclosure provides a display device, which includes the array substrate described in any of the above embodiments.

[0024] On the other hand, an embodiment of the present disclosure provides a method for preparing an array substrate, which is used to prepare the array substrate described in any of the above embodiments; the preparation method comprises:

[0025] forming a first light-emitting element composite thin film, a second light-emitting element composite thin film, and a third light-emitting element composite thin film;

[0026] Bonding the first light-emitting element composite film, the second light-emitting element composite film and the third light-emitting element composite film;

[0027] The first light-emitting element composite film, the second light-emitting element composite film and the third light-emitting element composite film are patterned by using the same patterning process to form at least one of the light-emitting units.

[0028] The array substrate provided in the embodiment of the present disclosure can realize one-time movement of multiple light-emitting elements in the light-emitting unit by stacking multiple light-emitting elements in the light-emitting unit. Compared with the technical solution of moving multiple light-emitting elements in the light-emitting unit in batches, the array substrate provided in the embodiment of the present disclosure can solve the problems of low yield and low pixel density of existing products.

[0029] It is not necessary to achieve all the advantages described above at the same time for any product or method of the present invention to be implemented. Other features and advantages of the present invention will be described in the subsequent description embodiments, and partly become apparent from the description embodiments, or be understood by practicing the present invention. The purposes and other advantages of the embodiments of the present disclosure can be achieved and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention. The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the contents of the present invention.

[0031] Figure 1 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 1 ;

[0032] Figure 2 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 2 ;

[0033] Figure 3 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 3 ;

[0034] Figure 4 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 4 ;

[0035] Figure 5 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 5 ;

[0036] Figure 6 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 6 ;

[0037] Figure 7 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 7 ;

[0038] Figure 8 is a schematic diagram of a partial cross-sectional structure of an array substrate of an exemplary embodiment of the present disclosure;

[0039] 9A to 9D , FIG. 10A to FIG. 10D as well as Figures 11 to 20 FIG. 4 is a schematic diagram of a process for preparing an array substrate according to an exemplary embodiment of the present disclosure.

[0040] Description of reference numerals:

[0041] 10-first collinear line, 20-second collinear line, 30-third collinear line, 40-fourth collinear line, 301-first sub-line, 302-second sub-line, 303-third sub-line, 304-fourth sub-line, 50-fifth collinear line, 60-sixth collinear line, 70-seventh collinear line, 80-eighth collinear line, 701-first line segment, 702-second line segment, 703-third line segment, 704-fourth line segment, 90-ninth collinear line, 100-tenth collinear line;

[0042] 101 - substrate, 111 - first bonding dielectric layer, 112 - second bonding dielectric layer;

[0043] 121 - first electrode, 122 - second electrode, 123 - third electrode, 124 - fourth electrode, 125 - fifth electrode, 126 - sixth electrode;

[0044] 131 - a first semiconductor layer, 132 - a second semiconductor layer, 133 - a third semiconductor layer, 134 - a fourth semiconductor layer, 135 - a fifth semiconductor layer, 136 - a sixth semiconductor layer;

[0045] 141 - first light-emitting layer, 142 - second light-emitting layer, 143 - third light-emitting layer;

[0046] 151 - a first connecting electrode, 152 - a second connecting electrode, 153 - a third connecting electrode, 154 - a fourth connecting electrode, 155 - a fifth connecting electrode, 156 - a sixth connecting electrode;

[0047] 200 - flat layer, 11 - first substrate, 110 - first rigid substrate, 12 - second substrate, 113 - second rigid substrate, 13 - third substrate, 114 - third rigid substrate, 300 - supporting substrate. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The embodiments can be implemented in a plurality of different forms. A person of ordinary skill in the art can easily understand the fact that the method and content can be transformed into one or more forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0049] In the drawings, the size of one or more components, the thickness of a layer, or an area is sometimes exaggerated for the sake of clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to the size, and the shape and size of each component in the drawings do not reflect the true proportion. In addition, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes or values ​​shown in the drawings.

[0050] The ordinal numbers such as "first", "second", and "third" in the present disclosure are provided to avoid confusion of constituent elements, rather than to limit the quantity. The "plurality" in the present disclosure includes two and more than two.

[0051] In the present disclosure, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing the present specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which the constituent elements are described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.

[0052] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the meanings of the above terms in the present disclosure can be understood according to the circumstances.

[0053] In the present disclosure, a transistor refers to an element including at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain) and a source electrode (source electrode terminal, source region, or source), and current can flow through the drain electrode, the channel region, and the source electrode. In the present disclosure, a channel region refers to a region where current mainly flows.

[0054] In the present disclosure, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using transistors with opposite polarities or when the current direction changes during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in the present disclosure, the "source electrode" and the "drain electrode" may be interchanged.

[0055] In the present disclosure, "electrical connection" includes the situation where components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having one or more functions.

[0056] In the present disclosure, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, a state where the angle is greater than -5° and less than 5° may be included. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, a state where the angle is greater than 85° and less than 95° may be included.

[0057] In the present disclosure, "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film" in some cases. Similarly, "insulating film" may be replaced with "insulating layer" in some cases.

[0058] The term "about" in the present disclosure refers to a numerical value that is not strictly limited to allow for process and measurement errors.

[0059] The embodiment of the present disclosure provides an array substrate, wherein the array substrate comprises a substrate and a light emitting structure layer located on one side of the substrate, wherein the light emitting structure layer comprises at least one light emitting unit, and the light emitting unit is configured to emit white light in a direction away from the substrate;

[0060] The at least one light-emitting unit includes a first light-emitting element, a second light-emitting element and a third light-emitting element which are stacked in sequence, and the first light-emitting element, the second light-emitting element and the third light-emitting element partially overlap in their orthographic projections on the array substrate; the first light-emitting element is configured to emit monochromatic light of a first color in a direction away from the substrate, the second light-emitting element is configured to emit monochromatic light of a second color in a direction away from the substrate, and the third light-emitting element is configured to emit monochromatic light of a third color in a direction away from the substrate; wherein the first color, the second color and the third color are all one of the three primary colors.

[0061] The array substrate provided in the embodiment of the present disclosure can realize one-time movement of multiple light-emitting elements in the light-emitting unit by stacking multiple light-emitting elements in the light-emitting unit. Compared with the technical solution of moving multiple light-emitting elements in the light-emitting unit in batches, the array substrate provided in the embodiment of the present disclosure can solve the problems of low yield and low pixel density of existing products.

[0062] The technical solution of the embodiment of the present disclosure is described in detail below through specific examples.

[0063] Figure 1 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 1 .like Figure 1As shown, the array substrate may include a plurality of light-emitting units arranged in a matrix, and at least one of the plurality of light-emitting units includes a plurality of light-emitting elements emitting light of different colors. The light-emitting element may be a micro-light-emitting element, such as a Micro LED. By way of example, at least one of the plurality of light-emitting units may include a first light-emitting element P1 emitting a first color light, a second light-emitting element P2 emitting a second color light, and a third light-emitting element P3 emitting a third color light. By way of example, the first color may be red (R), the second color may be green (G), and the third color may be blue (B). The shape of the light-emitting unit may be a rectangle, a rhombus, a circle, a pentagon, a hexagon, etc. The shape of the light-emitting element may be a rectangle, a rhombus, a circle, a pentagon, a hexagon, etc. The shapes of the plurality of light-emitting elements in the light-emitting unit may be the same or different.

[0064] like Figure 1 As shown, the orthographic projections of the plurality of light-emitting elements emitting light of different colors in the light-emitting unit on the array substrate partially overlap, so that the light-emitting unit can emit white light. For example, the orthographic projection of the second light-emitting element P2 on the array substrate is located in the middle of the orthographic projection of the first light-emitting element P1 on the array substrate, and the orthographic projection of the third light-emitting element P3 on the array substrate is located in the middle of the orthographic projection of the second light-emitting element P2 on the array substrate. The array substrate provided in the embodiment of the present disclosure can adjust the proportion of a plurality of different color lights by adjusting the relationship between the orthographic projections of the plurality of light-emitting elements in the light-emitting unit on the array substrate, thereby improving the flexibility of the array substrate adjustment and enhancing the competitiveness of the display product.

[0065] In an exemplary embodiment, if Figure 1 As shown, the non-overlapping portion of the orthographic projection of the first light emitting element P1 on the array substrate and the orthographic projection of the second light emitting element P2 on the array substrate may be in the shape of a rectangular ring. The non-overlapping portion of the orthographic projection of the second light emitting element P2 on the array substrate and the orthographic projection of the third light emitting element P3 on the array substrate may be in the shape of a rectangular ring.

[0066] Figure 2 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 2 .like Figure 2As shown, the orthographic projections of the plurality of light-emitting elements emitting light of different colors in the light-emitting unit on the array substrate partially overlap, so that the light-emitting unit can emit white light. For example, the orthographic projection of the second light-emitting element P2 on the array substrate is located within the range of the orthographic projection of the first light-emitting element P1 on the array substrate, and a portion of the outer edge of the orthographic projection of the second light-emitting element P2 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the first light-emitting element P1 on the array substrate, and are marked as a first collinearity 10, and the orthographic projection of the third light-emitting element P3 on the array substrate is located within the range of the orthographic projection of the second light-emitting element P2 on the array substrate, and a portion of the outer edge of the orthographic projection of the third light-emitting element P3 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the second light-emitting element P2 on the array substrate, and are marked as a second collinearity 20. For example, as Figure 2 As shown, the first collinear line 10 and the second collinear line 20 both extend along the second direction Y, and the first collinear line 10 and the second collinear line 20 are collinear.

[0067] In an exemplary embodiment, the length of the second collinear line 20 along the second direction Y is less than or equal to the length of the first collinear line 10 along the second direction Y.

[0068] In some possible exemplary embodiments, the first co-linear line 10 and the second co-linear line 20 both extend along the second direction Y, and there is a distance along the first direction X.

[0069] In some possible exemplary embodiments, one of the first co-linear line 10 and the second co-linear line 20 extends along the second direction Y, and the other of the first co-linear line 10 and the second co-linear line 20 extends along the first direction X.

[0070] In an exemplary embodiment, if Figure 2 As shown, the portion where the orthographic projection of the first light emitting element P1 on the array substrate does not overlap with the orthographic projection of the second light emitting element P2 on the array substrate may be U-shaped. The portion where the orthographic projection of the second light emitting element P2 on the array substrate does not overlap with the orthographic projection of the third light emitting element P3 on the array substrate may be U-shaped.

[0071] Figure 3 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 3 .like Figure 3As shown, the orthographic projections of the plurality of light-emitting elements emitting light of different colors in the light-emitting unit on the array substrate partially overlap, so that the light-emitting unit can emit white light. By way of example, the orthographic projection of the second light-emitting element P2 on the array substrate is located within the range of the orthographic projection of the first light-emitting element P1 on the array substrate, and a portion of the outer edge of the orthographic projection of the second light-emitting element P2 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the first light-emitting element P1 on the array substrate, and is marked as a third collinearity 30, and the orthographic projection of the third light-emitting element P3 on the array substrate is located within the range of the orthographic projection of the second light-emitting element P2 on the array substrate, and a portion of the outer edge of the orthographic projection of the third light-emitting element P3 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the second light-emitting element P2 on the array substrate, and is marked as a fourth collinearity 40. By way of example, Figure 3 As shown, the third collinear line 30 and the fourth collinear line 40 are both non-straight lines.

[0072] In an exemplary embodiment, if Figure 3 As shown, the third collinear line 30 may include a first subline 301 and a second subline 302. The first subline 301 extends along the first direction X and has a first end and a second end that are oppositely arranged. The second subline 302 extends along the second direction Y and has a first end and a second end that are oppositely arranged. The second subline 302 may be located on the opposite side of the first subline 301 along the second direction Y, and the first end of the first subline 301 is connected to the first end of the second subline 302. The fourth collinear line 40 may include a third subline 303 and a fourth subline 304. The third subline 303 extends along the first direction X and has a first end and a second end that are oppositely arranged. The fourth subline 304 extends along the second direction Y and has a first end and a second end that are oppositely arranged. The fourth subline 304 is located on the opposite side of the third subline 303 along the second direction Y, and the first end of the third subline 303 is connected to the first end of the fourth subline 304. For example, the first sub-line 301 and the third sub-line 303 may be collinear, and the second sub-line 302 and the fourth sub-line 304 may be collinear.

[0073] In an exemplary embodiment, if Figure 3 As shown, the non-overlapping portion of the orthographic projection of the first light emitting element P1 on the array substrate and the orthographic projection of the second light emitting element P2 on the array substrate may be L-shaped. The non-overlapping portion of the orthographic projection of the second light emitting element P2 on the array substrate and the orthographic projection of the third light emitting element P3 on the array substrate may be L-shaped.

[0074] Figure 4 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 4 .like Figure 4As shown, the orthographic projections of the plurality of light emitting elements emitting light of different colors in the light emitting unit partially overlap on the array substrate, so that the light emitting unit can emit white light. For example, the orthographic projection of the second light emitting element P2 on the array substrate is located within the range of the orthographic projection of the first light emitting element P1 on the array substrate, and a portion of the outer edge of the orthographic projection of the second light emitting element P2 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the first light emitting element P1 on the array substrate, and is marked as the fifth collinearity 50, and the orthographic projection of the third light emitting element P3 on the array substrate is located within the range of the orthographic projection of the second light emitting element P2 on the array substrate, and a portion of the outer edge of the orthographic projection of the third light emitting element P3 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the second light emitting element P2 on the array substrate, and is marked as the sixth collinearity 60. For example, Figure 4 As shown, the fifth collinear line 50 and the sixth collinear line 60 may be U-shaped, and the fifth collinear line 50 may be collinear with the sixth collinear line 60 .

[0075] In an exemplary embodiment, if Figure 4 As shown, the portion where the orthographic projection of the first light emitting element P1 on the array substrate does not overlap with the orthographic projection of the second light emitting element P2 on the array substrate can be in the shape of a long strip. The portion where the orthographic projection of the second light emitting element P2 on the array substrate does not overlap with the orthographic projection of the third light emitting element P3 on the array substrate can be in the shape of a long strip.

[0076] Figure 5 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 5 .like Figure 5 As shown, the orthographic projections of the plurality of light emitting elements emitting light of different colors in the light emitting unit on the array substrate partially overlap, so that the light emitting unit can emit white light. For example, the orthographic projection of the second light emitting element P2 on the array substrate is located within the range of the orthographic projection of the first light emitting element P1 on the array substrate, and a portion of the outer edge of the orthographic projection of the second light emitting element P2 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the first light emitting element P1 on the array substrate, and is marked as the seventh collinearity 70, and the orthographic projection of the third light emitting element P3 on the array substrate is located within the range of the orthographic projection of the second light emitting element P2 on the array substrate, and a portion of the outer edge of the orthographic projection of the third light emitting element P3 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the second light emitting element P2 on the array substrate, and is marked as the eighth collinearity 80.

[0077] like Figure 5As shown, the seventh collinear line 70 may include a first line segment 701 and a second line segment 702. The first line segment 701 and the second line segment 702 may both extend along the first direction X, and there is a distance between the two along the second direction Y. The eighth collinear line 80 may include a third line segment 703 and a fourth line segment 704. The third line segment 703 and the fourth line segment 704 may both extend along the first direction X, and there is a distance between the two along the second direction Y. The third line segment 703 may be collinear with the first line segment 701, and the fourth line segment 704 may be collinear with the second line segment 702. For example, the third line segment 703 may be located in the middle of the first line segment 701, and the fourth line segment 704 may be located in the middle of the second line segment 702.

[0078] In an exemplary embodiment, if Figure 5 As shown, the portion where the orthographic projection of the first light emitting element P1 on the array substrate does not overlap with the orthographic projection of the second light emitting element P2 on the array substrate may be in the shape of a long strip, and the two long strips are respectively located on both sides of the second light emitting element P2 along the first direction X. The portion where the orthographic projection of the second light emitting element P2 on the array substrate does not overlap with the orthographic projection of the third light emitting element P3 on the array substrate may be in the shape of a long strip, and the two long strips are respectively located on both sides of the third light emitting element P3 along the first direction X.

[0079] Figure 6 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 6 .like Figure 6 As shown, the orthographic projections of the plurality of light emitting elements emitting light of different colors in the light emitting unit on the array substrate partially overlap, so that the light emitting unit can emit white light. For example, the orthographic projection of the second light emitting element P2 on the array substrate is located within the range of the orthographic projection of the first light emitting element P1 on the array substrate, and a portion of the outer edge of the orthographic projection of the second light emitting element P2 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the first light emitting element P1 on the array substrate, and the orthographic projection of the third light emitting element P3 on the array substrate is located within the range of the orthographic projection of the second light emitting element P2 on the array substrate, and the outer edge of the orthographic projection of the third light emitting element P3 on the array substrate is not collinear with the outer edge of the orthographic projection of the second light emitting element P2 on the array substrate.

[0080] In an exemplary embodiment, if Figure 6 As shown, the portion where the orthographic projection of the first light emitting element P1 on the array substrate does not overlap with the orthographic projection of the second light emitting element P2 on the array substrate may be in the shape of a long strip, and the two long strips are respectively located on both sides of the second light emitting element P2 along the first direction X. The portion where the orthographic projection of the second light emitting element P2 on the array substrate does not overlap with the orthographic projection of the third light emitting element P3 on the array substrate may be in the shape of a rectangular ring.

[0081] In an exemplary embodiment, if Figure 6As shown, the orthographic projection of the second light emitting element P2 on the array substrate is located in the middle of the orthographic projection of the first light emitting element P1 on the array substrate along the first direction X, and the orthographic projection of the third light emitting element P3 on the array substrate is located in the middle of the orthographic projection of the second light emitting element P2 on the array substrate.

[0082] In an exemplary embodiment, the orthographic projection of the third light emitting element P3 on the array substrate may be a circle, a rhombus, a pentagon, a hexagon, or the like.

[0083] Figure 7 The planar structure of the array substrate of the exemplary embodiment of the present disclosure is shown in FIG. Figure 7 .like Figure 7 As shown, the orthographic projections of the plurality of light-emitting elements emitting light of different colors in the light-emitting unit on the array substrate partially overlap, so that the light-emitting unit can emit white light. For example, the orthographic projection of the second light-emitting element P2 on the array substrate is located within the range of the orthographic projection of the first light-emitting element P1 on the array substrate, and a portion of the outer edge of the orthographic projection of the second light-emitting element P2 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the first light-emitting element P1 on the array substrate, and is marked as the ninth collinear line 90, and the orthographic projection of the third light-emitting element P3 on the array substrate is located within the range of the orthographic projection of the second light-emitting element P2 on the array substrate, and a portion of the outer edge of the orthographic projection of the third light-emitting element P3 on the array substrate is collinear with a portion of the outer edge of the orthographic projection of the second light-emitting element P2 on the array substrate, and is marked as the tenth collinear line 100. As shown Figure 7 As shown, the ninth collinear line 90 extends along the first direction X, and the tenth collinear line 100 extends along the second direction Y.

[0084] In an exemplary embodiment, if Figure 7 As shown, the portion where the orthographic projection of the first light emitting element P1 on the array substrate does not overlap with the orthographic projection of the second light emitting element P2 on the array substrate may be in the shape of a long strip, and the two long strips are respectively located on both sides of the second light emitting element P2 along the first direction X. The portion where the orthographic projection of the second light emitting element P2 on the array substrate does not overlap with the orthographic projection of the third light emitting element P3 on the array substrate may be in the shape of a long strip, and the two long strips are respectively located on both sides of the third light emitting element P3 along the second direction Y.

[0085] As mentioned above, Figures 1 to 7It only illustrates seven kinds of orthographic projection relationships of the first light-emitting element P1, the second light-emitting element P2 and the third light-emitting element P3 on the array substrate. The embodiments of the present disclosure do not limit the orthographic projection relationship of the three. Those skilled in the art can select and set them according to actual needs, and the relative position relationship of the first light-emitting element P1, the second light-emitting element P2 and the third light-emitting element P3 along the direction perpendicular to the array substrate can also be selected and set according to actual needs. For example, the positions of the first light-emitting element P1 and the second light-emitting element P2 can be interchanged, etc.

[0086] Figure 8 FIG. 1 is a schematic diagram of a partial cross-sectional structure of an array substrate according to an exemplary embodiment of the present disclosure. Figure 8 As shown, only one light-emitting unit is illustrated as an example. In a plane perpendicular to the array substrate, the array substrate may include a substrate 101, a light-emitting structure layer and a conductive layer, wherein the light-emitting structure layer is located between the substrate 101 and the conductive layer. The light-emitting structure layer may include at least one light-emitting unit, and the conductive layer may include a plurality of connecting electrodes, wherein the connecting electrodes are configured to provide a driving voltage to the light-emitting element electrically connected thereto so that the light-emitting element emits light of a specified color.

[0087] like Figure 8 As shown, the light-emitting unit may include a first light-emitting element P1, a second light-emitting element P2, and a third light-emitting element P3 which are sequentially stacked in a direction away from the substrate 101. The first light-emitting element P1 is connected to the second light-emitting element P2 via a first bonding medium layer 111, and the second light-emitting element P2 is connected to the third light-emitting element P3 via a second bonding medium layer 112. Figure 8 As shown, the orthographic projection of the second light emitting element P2 on the array substrate is within the range of the orthographic projection of the first light emitting element P1 on the array substrate, and the orthographic projection of the third light emitting element P3 on the array substrate is within the range of the orthographic projection of the second light emitting element P2 on the array substrate. The orthographic projection of the first bonding medium layer 111 on the array substrate can overlap with the orthographic projection of the second light emitting element P2 on the array substrate. The orthographic projection of the second bonding medium layer 112 on the array substrate can overlap with the orthographic projection of the third light emitting element P3 on the array substrate.

[0088] In an exemplary embodiment, the first light emitting element P1 may include a first electrode 121, a first semiconductor layer 131, a first light emitting layer 141, a second semiconductor layer 132, and a second electrode 122, which are stacked in sequence. In the exemplary embodiment of the present disclosure, the first semiconductor layer 131, the first light emitting layer 141, and the second semiconductor layer 132 are combined to form a first light emitting composite layer. The first electrode 121, the first semiconductor layer 131, the first light emitting layer 141, the second semiconductor layer 132, and the second electrode 122 have at least partial overlap in the orthographic projection of the array substrate. For example, the orthographic projection of the first semiconductor layer 131, the first light emitting layer 141, the second semiconductor layer 132, and the second electrode 122 overlap in the orthographic projection of the array substrate, and are located within the range of the orthographic projection of the first electrode 121 in the array substrate. For example, the first electrode 121 may be an anode, and the second electrode 122 may be a cathode. The first semiconductor layer 131 may be one of a P-type semiconductor layer and an N-type semiconductor layer, and the second semiconductor layer 132 may be the other of a P-type semiconductor layer and an N-type semiconductor layer. The first light emitting layer 141 may include multiple quantum wells. The first light emitting composite layer is configured to emit red light under the driving of the electric field formed by the first electrode 121 and the second electrode 122 .

[0089] In an exemplary embodiment, the materials of the first electrode and the second electrode may be metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), gold (Au), platinum (Pt), chromium (Cr), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and may be a single-layer structure or a multi-layer composite structure, such as Mo / Cu / Mo, or Cr / Pt / Au, or Cr / Al / Ti / Pt / Ti / Pt / Au, etc.

[0090] In an exemplary embodiment, the material of the first bonding dielectric layer 111 may include one or more of silicon dioxide, aluminum nitride, and gallium nitride. The first bonding dielectric layer may be a single layer or a composite structure layer.

[0091] In an exemplary embodiment, the thickness of the first bonding dielectric layer 111 may be in a range of 3.0 micrometers to 5.0 micrometers.

[0092] In an exemplary embodiment, if Figure 8As shown, the second light emitting element P2 may include a third electrode 123, a third semiconductor layer 133, a second light emitting layer 142, a fourth semiconductor layer 134 and a fourth electrode 124 which are stacked in sequence. In the exemplary embodiment of the present disclosure, the third semiconductor layer 133, the second light emitting layer 142 and the fourth semiconductor layer 134 together form a second light emitting composite layer. The third electrode 123, the third semiconductor layer 133, the second light emitting layer 142, the fourth semiconductor layer 134 and the fourth electrode 124 overlap at least partially in the orthographic projection of the array substrate. For example, the orthographic projections of the third semiconductor layer 133, the second light emitting layer 142, the fourth semiconductor layer 134 and the fourth electrode 124 overlap in the orthographic projection of the array substrate and are located within the range of the orthographic projection of the third electrode 123 in the array substrate. For example, the third electrode 123 may be an anode and the fourth electrode 124 may be a cathode. The third semiconductor layer 133 may be one of a P-type semiconductor layer and an N-type semiconductor layer, and the fourth semiconductor layer 134 may be the other of a P-type semiconductor layer and an N-type semiconductor layer. The second light emitting layer 142 may include a multiple quantum well. The second light emitting composite layer is configured to emit green light under the driving of the electric field formed by the third electrode 123 and the fourth electrode 124 .

[0093] In an exemplary embodiment, if Figure 8 As shown, the third light emitting element P3 may include a fifth electrode 125, a fifth semiconductor layer 135, a third light emitting layer 143, a sixth semiconductor layer 136 and a sixth electrode 126 which are stacked in sequence. In the exemplary embodiment of the present disclosure, the fifth semiconductor layer 135, the third light emitting layer 143 and the sixth semiconductor layer 136 together form a third light emitting composite layer. The fifth electrode 125, the fifth semiconductor layer 135, the third light emitting layer 143, the sixth semiconductor layer 136 and the sixth electrode 126 overlap at least partially in the orthographic projection of the array substrate. For example, the orthographic projection of the fifth semiconductor layer 135, the third light emitting layer 143, the sixth semiconductor layer 136 and the sixth electrode 126 overlap in the orthographic projection of the array substrate and are located within the range of the orthographic projection of the fifth electrode 125 in the array substrate. For example, the fifth electrode 125 may be an anode and the sixth electrode 126 may be a cathode. The fifth semiconductor layer 135 may be one of a P-type semiconductor layer and an N-type semiconductor layer, and the sixth semiconductor layer 136 may be the other of a P-type semiconductor layer and an N-type semiconductor layer. The third light emitting layer 143 may include a multiple quantum well. The third light emitting composite layer is configured to emit blue light under the driving of the electric field formed by the fifth electrode 125 and the sixth electrode 126 .

[0094] In an exemplary embodiment, if Figure 8As shown, in a plane perpendicular to the array substrate, the array substrate may further include a flat layer 200. The flat layer 200 is located between the light emitting structure layer and the conductive layer. The flat layer 200 may flatten the film height difference between the plurality of light emitting elements, which is beneficial to ensure the consistency of the film thickness of the conductive layer and improve the yield rate of the array substrate. The orthographic projection of the flat layer 200 on the array substrate includes at least the orthographic projection of one light emitting unit on the array substrate.

[0095] In an exemplary embodiment, if Figure 8 As shown, the flat layer 200 may be provided with a plurality of vias, and the connecting electrode is electrically connected to the electrode of the light-emitting element via the vias. The plurality of vias may include at least a first via K1, a second via K2, a third via K3, a fourth via K4, a fifth via K5, and a sixth via K6. The conductive layer may include at least a first connecting electrode 151, a second connecting electrode 152, a third connecting electrode 153, a fourth connecting electrode 154, a fifth connecting electrode 155, and a sixth connecting electrode 156.

[0096] like Figure 8 As shown, the first via hole K1 exposes a portion of the surface of the first electrode 121, and the first connection electrode 151 is connected to the first electrode 121 via the first via hole K1. The second via hole K2 exposes a portion of the surface of the second electrode 122, and the second connection electrode 152 is connected to the second electrode 122 via the second via hole K2. The third via hole K3 exposes a portion of the surface of the third electrode 123, and the third connection electrode 153 is connected to the third electrode 123 via the third via hole K3. The fourth via hole K4 exposes a portion of the surface of the fourth electrode 124, and the fourth connection electrode 154 is connected to the fourth electrode 124 via the fourth via hole K4. The fifth via hole K5 exposes a portion of the surface of the fifth electrode 125, and the fifth connection electrode 155 is connected to the fifth electrode 125 via the fifth via hole K5. The sixth via hole K6 exposes a portion of the surface of the sixth electrode 126, and the sixth connection electrode 156 is connected to the sixth electrode 126 via the sixth via hole K6.

[0097] In an exemplary embodiment, the shape of the orthographic projection of the via hole on the array substrate may be a circle, a rectangle, a pentagon, or the like.

[0098] In an exemplary embodiment, the material of the planar layer may be an organic insulating material or an inorganic insulating material. For example, the organic insulating material may be any one or more of epoxy resin, phenolic resin, urea-formaldehyde resin, melamine-formaldehyde resin, furan resin, silicone resin, polyester resin, polyamide resin, acrylic resin, polyurethane, vinyl resin, hydrocarbon resin, polyether resin, etc.

[0099] In an exemplary embodiment, the conductive layer may be made of a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The connecting electrode may be a single-layer structure or a multi-layer composite structure, such as ITO / IZO.

[0100] The following is an exemplary description of the preparation process of the array substrate. The "patterning process" mentioned in the present disclosure includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist for metal materials, inorganic materials, or transparent conductive materials, and includes processes such as coating organic materials, mask exposure, and development for organic materials. Deposition can be carried out by any one or more of sol-gel deposition, sputtering, evaporation, and chemical vapor deposition, coating can be carried out by any one or more of spraying, spin coating, and inkjet printing, and etching can be carried out by any one or more of dry etching and wet etching, which are not limited in the present disclosure. "Thin film" refers to a layer of thin film made by deposition, coating, or other processes on a substrate of a certain material. If the "thin film" does not require a patterning process during the entire production process, the "thin film" can also be called a "layer". If the "thin film" requires a patterning process during the entire production process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". The "A and B are arranged in the same layer" mentioned in the present disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer is the size of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of the present disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0101] The preparation process of the array substrate may include the following operation steps (101) to (118). The figure only shows one light-emitting unit as an example. The preparation process of the array substrate may include:

[0102] (101) forming a first light-emitting element composite thin film. The forming of the first light-emitting element composite thin film may include at least:

[0103] A first conductive film 11-1, a first semiconductor film 11-2, a first light-emitting film 11-3, a second semiconductor film 11-4, a second conductive film 11-5 and a first sub-bonding film 11-6 are sequentially deposited on the first substrate 11 to form a first light-emitting element composite film. Fig.9AAs shown. The first semiconductor film may be one of an n-GaN (gallium nitride) film and a p-GaN (gallium nitride) film. The second semiconductor film may be the other of an n-GaN (gallium nitride) film and a p-GaN (gallium nitride) film. For example, the first substrate may be a sapphire substrate. For example, the first sub-bonding film may be a silicon dioxide film.

[0104] (102) bonding the first light-emitting element composite film to the first rigid substrate, comprising:

[0105] A first sacrificial layer 110 - 1 and a second sub-bonding film 110 - 2 are sequentially deposited on the first rigid substrate 110 . For example, the first rigid substrate may be a glass substrate.

[0106] The first light emitting element composite film is bonded to the first rigid substrate by a bonding process, such as Fig. 9B The second sub-bonding film can be a silicon dioxide film.

[0107] In an exemplary embodiment, the material of the first sacrificial layer can be a photosensitive organic material, such as a photosensitive resin material. Alternatively, the material of the first sacrificial layer can be a photosensitive photoresist material. Alternatively, the material of the first sacrificial layer can include one of a polymer such as polyimide (PI), polyacrylate, polyphenylene sulfide, polyarylate, cellulose acetate propionate, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethersulfone resin (PES), polycarbonate (PC), polyetherimide (PEI), cycloolefin polymer (COP), silicone resin, polyarylate (PAR) or glass fiber reinforced plastic (FRP), or a mixture of multiple polymers. For example, taking the material of the first sacrificial layer as polyimide as an example, when the laser irradiates a polymer such as polyimide, the polyimide will be carbonized and decomposed due to the absorption of light, so that the first substrate can be peeled off.

[0108] (103) peeling off the first substrate, comprising:

[0109] The first substrate on the first rigid substrate 110 is peeled off by a laser lift off (LLO) process. Fig. 9C shown.

[0110] In actual production, different lasers can be selected to obtain the required laser wavelength. The laser wavelength is generally selected to be less than 365 nanometers, for example, 308 nanometers.

[0111] (104) forming a third sub-bonding film, including depositing a third sub-bonding film 110-3 on the first rigid substrate 110 obtained by the above operation, such as Fig.9D shown.

[0112] (105) forming a second light-emitting element composite thin film, wherein the forming of the second light-emitting element composite thin film may include at least:

[0113] A third conductive film 12-1, a third semiconductor film 12-2, a second light-emitting film 12-3, a fourth semiconductor film 12-4, a fourth conductive film 12-5 and a fourth sub-bonding film 12-6 are sequentially deposited on the second substrate 12 to form a second light-emitting element composite film. Fig. 10A As shown. The third semiconductor film may be one of an n-GaN (gallium nitride) film and a p-GaN (gallium nitride) film. The fourth semiconductor film may be the other of an n-GaN (gallium nitride) film and a p-GaN (gallium nitride) film. For example, the second substrate may be a sapphire substrate. For example, the fourth sub-bonding film may be a silicon dioxide film.

[0114] (106) bonding the second light-emitting element composite film to the second rigid substrate, comprising:

[0115] A second sacrificial layer 113 - 1 and a fifth sub-bonding film 113 - 2 are sequentially deposited on the second rigid substrate 113. For example, the second rigid substrate may be a glass substrate.

[0116] The second light emitting element composite film is bonded to the second rigid substrate 113 by a bonding process, such as Fig. 10B The fifth sub-bonding film may be a silicon dioxide film.

[0117] In an exemplary embodiment, the material of the second sacrificial layer can be a photosensitive organic material, such as a photosensitive resin material. Alternatively, the material of the second sacrificial layer can be a photosensitive photoresist material. Alternatively, the material of the second sacrificial layer can include one of a polymer such as polyimide (PI), polyacrylate, polyphenylene sulfide, polyarylate, cellulose acetate propionate, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethersulfone resin (PES), polycarbonate (PC), polyetherimide (PEI), cycloolefin polymer (COP), silicone resin, polyarylate (PAR) or glass fiber reinforced plastic (FRP), or a mixture of multiple polymers. For example, taking the material of the second sacrificial layer as polyimide as an example, when the laser irradiates a polymer such as polyimide, the polyimide will be carbonized and decomposed due to the absorption of light, so that the second substrate can be peeled off.

[0118] (107) peeling off the second substrate, comprising:

[0119] The second substrate on the second rigid substrate 113 is peeled off by a laser lift off (LLO) process. Fig. 10C shown.

[0120] (108) forming a sixth sub-bonding film, including depositing a sixth sub-bonding film 113-3 on the second rigid substrate 113 obtained by the above operation, such as Fig. 10D shown.

[0121] (109) forming a third light-emitting element composite thin film. The forming of the third light-emitting element composite thin film may include at least:

[0122] A fifth conductive film 13-1, a fifth semiconductor film 13-2, a third light-emitting film 13-3, a sixth semiconductor film 13-4, a sixth conductive film 13-5 and a seventh sub-bonding film 13-6 are sequentially deposited on the third substrate 13 to form a third light-emitting element composite film. Fig.11 As shown. The fifth semiconductor film may be one of an n-GaN (gallium nitride) film and a p-GaN (gallium nitride) film. The sixth semiconductor film may be the other of an n-GaN (gallium nitride) film and a p-GaN (gallium nitride) film. For example, the third substrate may be a sapphire substrate. For example, the seventh sub-bonding film may be a silicon dioxide film.

[0123] (110) bonding the second light-emitting element composite film to the third light-emitting element composite film, such as Fig.12 shown.

[0124] (111) The second rigid substrate is peeled off by using a laser lift off (LLO) process to peel off the second rigid substrate on the third substrate 13. Fig.13 shown.

[0125] (112) bonding the first light-emitting element composite film to the third light-emitting element composite film, comprising:

[0126] The first light-emitting element composite film obtained by the above operation and the third light-emitting element composite film are bonded by a bonding process, such as Fig.14 shown.

[0127] (113) Peel off the third substrate, such as Fig.15 shown.

[0128] (114) forming a light-emitting unit, wherein the forming of the light-emitting unit may at least include: patterning the first rigid substrate 110 obtained by the above operation using the same patterning process to form at least one light-emitting unit, such as Fig.16 shown.

[0129] like Fig.16 As shown, the second conductive film is patterned using the same patterning process, and the obtained second conductive layer pattern may include at least one first electrode 121. Fig.16 As shown, the second semiconductor film is patterned using the same patterning process, and the obtained second semiconductor layer pattern may include at least one first semiconductor layer 131. Fig.16 As shown, the first light-emitting film is patterned using the same patterning process, and the obtained first light-emitting layer pattern may include at least one first light-emitting layer 141. Fig.16 As shown, the first semiconductor film is patterned using the same patterning process, and the obtained first semiconductor layer pattern may include at least one second semiconductor layer 132. Fig.16 As shown, the first conductive film is patterned by the same patterning process, and the obtained first conductive layer pattern may include at least one second electrode 122. The first electrode 121, the first semiconductor layer 131, the first light-emitting layer 141, the second semiconductor layer 132 and the second electrode 122 stacked in sequence may form a first light-emitting element. Fig.16 As shown, the fourth sub-bonding film, the fifth sub-bonding film and the third sub-bonding film together form the first bonding medium layer 111 .

[0130] like Fig.16 As shown, the fourth conductive film is patterned using the same patterning process, and the obtained fourth conductive layer pattern may include at least one third electrode 123. Fig.16 As shown, the fourth semiconductor film is patterned using the same patterning process, and the obtained fourth semiconductor layer pattern may include at least one third semiconductor layer 133. Fig.16 As shown, the second light-emitting film is patterned using the same patterning process, and the obtained second light-emitting layer pattern may include at least one second light-emitting layer 142. Fig.16 As shown, the third semiconductor film is patterned using the same patterning process, and the obtained third semiconductor layer pattern may include at least one fourth semiconductor layer 134. Fig.16 As shown, the third conductive film is patterned by the same patterning process, and the obtained third conductive layer pattern may include at least one fourth electrode 124. The third electrode 123, the third semiconductor layer 133, the second light-emitting layer 142, the fourth semiconductor layer 134 and the fourth electrode 124 stacked in sequence may form a second light-emitting element. Fig.16 As shown, the seventh sub-bonding film and the sixth sub-bonding film together form the second bonding medium layer 112 .

[0131] like Fig.16As shown, the sixth conductive film is patterned using the same patterning process, and the obtained sixth conductive layer pattern may include at least one fifth electrode 125. Fig.16 As shown, the sixth semiconductor film is patterned using the same patterning process, and the obtained sixth semiconductor layer pattern may include at least one fifth semiconductor layer 135. Fig.16 As shown, the third light-emitting film is patterned using the same patterning process, and the obtained third light-emitting layer pattern may include at least one third light-emitting layer 143. Fig.16 As shown, the fifth semiconductor film is patterned using the same patterning process, and the obtained fifth semiconductor layer pattern may include at least one sixth semiconductor layer 136. Fig.16 As shown, the fifth conductive film is patterned by the same patterning process, and the obtained fifth conductive layer pattern may include at least one sixth electrode 126. The fifth electrode 125, the fifth semiconductor layer 135, the third light-emitting layer 143, the sixth semiconductor layer 136 and the sixth electrode 126 stacked in sequence may form a third light-emitting element together.

[0132] (115) forming a flat layer pattern, wherein the forming of the flat layer pattern may at least include: depositing an insulating film on the first rigid substrate 110 having the aforementioned pattern, and patterning the insulating film to obtain the flat layer pattern. Fig.17 As shown, the planar layer 200 may be provided with at least a plurality of via holes, and the subsequently formed connecting electrodes are electrically connected to the electrodes of the light emitting element via the via holes. The plurality of via holes may include at least a first via hole K1, a second via hole K2, a third via hole K3, a fourth via hole K4, a fifth via hole K5, and a sixth via hole K6.

[0133] like Fig.17As shown, the first via hole K1 exposes a portion of the surface of the first electrode 121, and the first via hole K1 is configured to connect the first connection electrode formed subsequently to the first electrode 121 via the first via hole K1. The second via hole K2 exposes a portion of the surface of the second electrode 122, and the second via hole K2 is configured to connect the second connection electrode formed subsequently to the second electrode 122 via the second via hole K2. The third via hole K3 exposes a portion of the surface of the third electrode 123, and the third via hole K3 is configured to connect the third connection electrode formed subsequently to the third electrode 123 via the third via hole K3. The fourth via hole K4 exposes a portion of the surface of the fourth electrode 124, and the fourth via hole K4 is configured to connect the fourth connection electrode formed subsequently to the fourth electrode 124 via the fourth via hole K4. The fifth via hole K5 exposes a portion of the surface of the fifth electrode 125, and the fifth via hole K5 is configured to connect the fifth connection electrode formed subsequently to the fifth electrode 125 via the fifth via hole K5. The sixth via hole K6 exposes a portion of the surface of the sixth electrode 126 , and the sixth via hole K6 is configured such that a sixth connecting electrode formed subsequently is connected to the sixth electrode 126 via the sixth via hole K6 .

[0134] (116) forming a conductive layer pattern, wherein the forming of the conductive layer pattern may at least include: depositing a conductive film on the first rigid substrate 110 having the aforementioned pattern, and patterning the conductive film to obtain the conductive layer pattern. Fig.18 As shown, the conductive layer pattern may include at least a first connection electrode 151, a second connection electrode 152, a third connection electrode 153, a fourth connection electrode 154, a fifth connection electrode 155, and a sixth connection electrode 156. The first connection electrode 151 is configured to be connected to the first electrode 121 via a first via hole K1. The second connection electrode 152 is configured to be connected to the second electrode 122 via a second via hole K2. The third connection electrode 153 is configured to be connected to the third electrode 123 via a third via hole K3. The fourth connection electrode 154 is configured to be connected to the fourth electrode 124 via a fourth via hole K4. The fifth connection electrode 155 is configured to be connected to the fifth electrode 125 via a fifth via hole K5. The sixth connection electrode 156 is configured to be connected to the sixth electrode 126 via a sixth via hole K6.

[0135] (117) The first rigid substrate 110 obtained by the above operation is fixed to the carrier substrate 300, as shown in FIG. Fig.19 shown.

[0136] (118) peeling off the first rigid substrate to form an array substrate, such as Fig. 20 As shown, the first sub-bonding film and the second sub-bonding film together form the substrate 101. For example, the first rigid substrate can be peeled off by laser peeling or the like to form the array substrate.

[0137] In some possible exemplary embodiments, operation steps (101) to (104), (105) to (108) and operation step (109) may be performed simultaneously.

[0138] The present disclosure provides a method for preparing an array substrate, which is used to prepare the array substrate described in any of the above embodiments; the preparation method comprises:

[0139] forming a first light-emitting element composite thin film, a second light-emitting element composite thin film, and a third light-emitting element composite thin film;

[0140] Bonding the first light-emitting element composite film, the second light-emitting element composite film and the third light-emitting element composite film;

[0141] The first light-emitting element composite film, the second light-emitting element composite film and the third light-emitting element composite film are patterned by using the same patterning process to form at least one of the light-emitting units.

[0142] An embodiment of the present disclosure further provides a display device, comprising the array substrate described in any of the above embodiments. The display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame or a navigator.

[0143] Although the embodiments disclosed in the present invention are as above, the contents described are only embodiments adopted for facilitating understanding of the present invention and are not intended to limit the present invention. It should be noted that the above embodiments or embodiments are merely exemplary and not restrictive. Therefore, the present disclosure is not limited to the contents specifically shown and described herein. Various modifications, substitutions or omissions may be made to the forms and details of implementation without departing from the scope of the present disclosure.

Claims

1. An array substrate, characterized in that: A light emitting structure layer comprising a substrate and a light emitting structure layer located on one side of the substrate, wherein the light emitting structure layer comprises at least one light emitting unit, and the light emitting unit is configured to emit white light in a direction away from the substrate; The at least one light-emitting unit includes a first light-emitting element, a second light-emitting element and a third light-emitting element which are stacked in sequence, and the first light-emitting element, the second light-emitting element and the third light-emitting element partially overlap in their orthographic projections on the array substrate; the first light-emitting element is configured to emit monochromatic light of a first color in a direction away from the substrate, the second light-emitting element is configured to emit monochromatic light of a second color in a direction away from the substrate, and the third light-emitting element is configured to emit monochromatic light of a third color in a direction away from the substrate; wherein the first color, the second color and the third color are all one of the three primary colors.

2. The array substrate according to claim 1, characterized in that: The first light-emitting element, the second light-emitting element and the third light-emitting element are stacked in sequence in a direction away from the substrate; wherein the orthographic projection of the first light-emitting element on the array substrate includes the orthographic projection of the second light-emitting element on the array substrate, and the orthographic projection of the second light-emitting element on the array substrate includes the orthographic projection of the third light-emitting element on the array substrate.

3. The array substrate according to claim 2, characterized in that: The orthographic projection of the second light emitting element on the array substrate is located in the middle of the orthographic projection of the first light emitting element on the array substrate, and the orthographic projection of the third light emitting element on the array substrate is located in the middle of the orthographic projection of the second light emitting element on the array substrate.

4. The array substrate according to claim 3, characterized in that: The first light-emitting element is ring-shaped in the portion where the orthographic projection of the first light-emitting element on the array substrate does not overlap with the orthographic projection of the second light-emitting element on the array substrate, and the second light-emitting element is ring-shaped in the portion where the orthographic projection of the second light-emitting element on the array substrate does not overlap with the orthographic projection of the third light-emitting element on the array substrate.

5. The array substrate according to claim 2, characterized in that: The first light-emitting element includes a first electrode, a first light-emitting composite layer, and a second electrode which are sequentially stacked in a direction away from the substrate, and the first light-emitting composite layer is configured to emit monochromatic light of a first color under the drive of an electric field formed by the first electrode and the second electrode; Among them, the overlapping part of the orthographic projection of the first light-emitting composite layer and the second electrode on the array substrate partially overlaps with the orthographic projection of the first electrode on the array substrate, and the orthographic projections of the first light-emitting composite layer and the second electrode on the array substrate are both located inside the orthographic projection of the first electrode on the array substrate.

6. The array substrate according to claim 5, characterized in that: The second light-emitting element comprises a third electrode, a second light-emitting composite layer and a fourth electrode which are sequentially stacked in a direction away from the substrate, and the second light-emitting composite layer is configured to emit monochromatic light of a second color under the drive of an electric field formed by the third electrode and the fourth electrode; Among them, the overlapping part of the orthographic projection of the second light-emitting composite layer and the fourth electrode on the array substrate partially overlaps with the orthographic projection of the third electrode on the array substrate, and the orthographic projection of the second light-emitting composite layer and the fourth electrode on the array substrate are both located inside the orthographic projection of the third electrode on the array substrate.

7. The array substrate according to claim 6, characterized in that: The third light-emitting element comprises a fifth electrode, a third light-emitting composite layer and a sixth electrode which are sequentially stacked in a direction away from the substrate, and the third light-emitting composite layer is configured to emit monochromatic light of a third color under the drive of an electric field formed by the fifth electrode and the sixth electrode; Among them, the overlapping part of the orthographic projection of the third light-emitting composite layer and the sixth electrode on the array substrate partially overlaps with the orthographic projection of the fifth electrode on the array substrate, and the orthographic projections of the third light-emitting composite layer and the sixth electrode on the array substrate are both located inside the orthographic projection of the fifth electrode on the array substrate.

8. The array substrate according to claim 7, characterized in that: The array substrate further includes a planar layer, and an orthographic projection of the planar layer on the array substrate includes an orthographic projection of at least one of the light emitting units on the array substrate.

9. The array substrate according to claim 8, characterized in that: The array substrate further includes a conductive layer, which is located on a side of the planar layer away from the substrate. The conductive layer includes a plurality of connecting electrodes, which are configured to be electrically connected to the light-emitting units.

10. The array substrate according to claim 9, characterized in that: The multiple connecting electrodes include a first connecting electrode and a second connecting electrode, the planar layer includes a first via hole and a second via hole, the first via hole exposes a portion of the surface of the first electrode, the second via hole exposes a portion of the surface of the second electrode, the first connecting electrode is electrically connected to the first electrode via the first via hole, and the second connecting electrode is electrically connected to the second electrode via the second via hole.

11. The array substrate according to claim 9, characterized in that: The multiple connecting electrodes include a third connecting electrode and a fourth connecting electrode, the planar layer includes a third via hole and a fourth via hole, the third via hole exposes a portion of the surface of the third electrode, the fourth via hole exposes a portion of the surface of the fourth electrode, the third connecting electrode is electrically connected to the third electrode via the third via hole, and the fourth connecting electrode is electrically connected to the fourth electrode via the fourth via hole.

12. The array substrate according to claim 9, wherein: The multiple connecting electrodes include a fifth connecting electrode and a sixth connecting electrode, the planar layer includes a fifth via and a sixth via, the fifth via exposes a portion of the surface of the fifth electrode, the sixth via exposes a portion of the surface of the sixth electrode, the fifth connecting electrode is electrically connected to the fifth electrode via the fifth via, and the sixth connecting electrode is electrically connected to the sixth electrode via the sixth via.

13. The array substrate according to any one of claims 1 to 12, characterized in that: The first light-emitting element, the second light-emitting element and the third light-emitting element are stacked in sequence in a direction away from the substrate; the array substrate also includes a first bonding medium layer and a second bonding medium layer, the first bonding medium layer is located between the first light-emitting element and the second light-emitting element, and the second bonding medium layer is located between the third light-emitting element and the second light-emitting element.

14. A display device, characterized in that: It comprises the array substrate as claimed in any one of claims 1 to 13.

15. A method for preparing an array substrate, characterized in that: Used for preparing the array substrate as claimed in any one of claims 1 to 13; The preparation method comprises: forming a first light-emitting element composite thin film, a second light-emitting element composite thin film, and a third light-emitting element composite thin film; Bonding the first light-emitting element composite film, the second light-emitting element composite film and the third light-emitting element composite film; The first light-emitting element composite film, the second light-emitting element composite film and the third light-emitting element composite film are patterned by using the same patterning process to form at least one of the light-emitting units.

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