Light-emitting panel, preparation method thereof and display device

Abstract

The embodiment of the invention provides a light-emitting panel, a preparation method thereof and a display device, relates to the technical field of display, and aims to improve the density of light-emitting devices on the light-emitting panel. The display panel comprises n substrates which are sequentially arranged in a stacked mode, n is larger than or equal to 2, and n is an integer. From the light-emitting side of the light-emitting panel to the backlight side, the n substrates are the first substrate to the nth substrate. Wherein the substrate comprises a back plate and a light-emitting device layer, and the back plate is provided with a light-transmitting area; the light-emitting device layer is arranged on the back plate, and the light-emitting device layer comprises a light-emitting device located outside the light-transmitting area; the light emitted by the light-emitting device of each substrate from the second substrate to the nth substrate can penetrate through the light-transmitting area of each substrate above the light-emitting device to be transmitted out. The present disclosure is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting panel and a preparation method thereof, and a display device. Background Art

[0002] As an important component of display devices, light-emitting devices are widely used in the display field. Among them, light-emitting devices such as sub-millimeter light-emitting diodes (Mini Light Emitting Diode, referred to as Mini LED) and micro light-emitting diodes (Micro Light Emitting Diode, referred to as Micro LED) have attracted widespread attention and applications due to their many advantages such as self-luminescence, high efficiency, high brightness, high reliability, energy saving and fast response speed. Summary of the invention

[0003] An object of the embodiments of the present disclosure is to provide a light-emitting panel and a method for manufacturing the same, and a display device, so as to increase the density of light-emitting devices on the light-emitting panel.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a light-emitting panel is provided, comprising n substrates stacked in sequence, n≥2, and n is an integer; from the light-emitting side to the backlight side of the light-emitting panel, the n substrates are the first substrate to the nth substrate. The substrate comprises a backplane and a light-emitting device layer, the backplane has a light-transmitting area; the light-emitting device layer is arranged on the backplane, and the light-emitting device layer comprises light-emitting devices located outside the light-transmitting area; the light emitted by the light-emitting device of each substrate from the second substrate to the nth substrate can pass through the light-transmitting area of ​​each substrate above it.

[0006] For the above-mentioned light-emitting panel, since the light emitted by the light-emitting device of each substrate from the second substrate to the nth substrate can pass through the light-transmitting areas of the substrates above it, for the first substrate, not only the light emitted by the light-emitting device on itself can be used as the light source of the light-emitting panel, but also the light-transmitting area on the first substrate can be used as the light source of the light-emitting panel. Moreover, since the n substrates are stacked in sequence, the area of ​​the light-emitting surface of the light-emitting panel is equal to the area of ​​the light-emitting surface of the first substrate, that is, the area of ​​the light-emitting surface of the light-emitting panel has not changed, but the light sources on the light-emitting panel (the light-emitting devices on the first substrate and the light-transmitting areas on the first substrate) have increased, so the density of the light sources on the light-emitting panel is improved, which is equivalent to increasing the density of the light-emitting devices on the light-emitting panel, thereby improving the resolution of the display device 1.

[0007] Since this method does not need to increase the density of the light-emitting devices in the single-layer substrate, the bonding yield of the light-emitting devices in the single-layer substrate can be guaranteed, and the layout requirements of the pixel driving circuit in the single-layer substrate can also be met.

[0008] That is, in the present application, the density of the light-emitting devices in the light-emitting panel is not only improved, but also the bonding difficulty of the light-emitting devices in the light-emitting panel is not increased, thus ensuring the bonding yield of the light-emitting devices.

[0009] In some embodiments, in the orthographic projection onto the plane where the nth substrate is located, the light-transmitting areas of the substrates above the i-th substrate at least partially overlap, and the light-emitting device of the i-th substrate is at least partially located in the at least partially overlapping area; n≥3, i=3~n; or, the light-emitting device of the second substrate is at least partially located in the light-transmitting area of ​​the first substrate.

[0010] In some embodiments, in the light-emitting device layer, there are multiple light-emitting devices, and the multiple light-emitting devices constitute multiple light-emitting device groups, and the light-emitting device groups include at least one red light-emitting device, at least one green light-emitting device and at least one blue light-emitting device; in the orthographic projection onto the plane where the nth substrate is located, the light-emitting devices included in the same light-emitting device group of each substrate from the second substrate to the nth substrate are located in the same light-transmitting area of ​​each of the substrates above it.

[0011] In some embodiments, in an orthographic projection onto the plane where the nth substrate is located, the light-emitting devices of each of the substrates are staggered.

[0012] In some embodiments, n=2, and in an orthographic projection onto the plane where the nth substrate is located, the light-transmitting regions of the two substrates are staggered.

[0013] In some embodiments, the substrate includes a plurality of pixels, each pixel includes a plurality of the light-emitting devices and at least one light-transmitting area, and the plurality of pixels of the n substrates are arranged in one-to-one correspondence; in the orthographic projection onto the plane where the nth substrate is located, the light-emitting devices of the correspondingly arranged n pixels are staggered.

[0014] In some embodiments, the backplane includes a driving circuit layer, the driving circuit layer includes a plurality of first signal lines, and the plurality of first signal lines are arranged to avoid the light-transmitting area.

[0015] In some embodiments, the substrate includes a first transparent filling portion disposed in the light-transmitting area; the driving circuit layer includes multiple transparent insulating layers, and portions of the multiple transparent insulating layers located in the light-transmitting area form the first transparent filling portion.

[0016] On the other hand, a method for preparing a light-emitting panel is provided. The method comprises: preparing n initial substrates, where n≥2 and n is an integer; the initial substrates comprise a carrier substrate and a substrate; the substrate comprises a backplane and a light-emitting device layer, wherein a light-transmitting area is formed on the backplane; the light-emitting device layer is disposed on the backplane, wherein the light-emitting device layer comprises light-emitting devices located outside the light-transmitting area;

[0017] From the light emitting side to the backlight side of the light emitting panel, the n substrates are respectively the first substrate to the nth substrate, and the n substrates are stacked in sequence, so that the light emitted by the light emitting device of each substrate from the second substrate to the nth substrate can pass through the light-transmitting area of ​​each substrate above it; wherein, stacking the n substrates in sequence includes:

[0018] Making a supporting substrate on a surface of the substrate to be stacked away from the carrier substrate;

[0019] removing the carrier substrate of the substrate to be stacked;

[0020] Laminating the substrate to be stacked onto the already stacked substrates, wherein the already stacked substrates include at least one of the substrates;

[0021] The support substrate is removed.

[0022] The method for preparing the above-mentioned light-emitting panel has the same beneficial effects as those achieved by the light-emitting panel provided above, and will not be described in detail here.

[0023] On the other hand, a display device is provided, including a housing and a light-emitting panel, wherein the light-emitting panel is the light-emitting panel described in any one of the above embodiments, and the light-emitting panel is disposed in the housing.

[0024] The above-mentioned display device has the same structure and beneficial technical effects as the light-emitting panels provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, etc.

[0026] Figure 1 is a structural diagram of a display device according to some embodiments;

[0027] Figure 2is a structural diagram of another display device according to some embodiments;

[0028] Figure 3 is a structural diagram of a light emitting panel according to some embodiments;

[0029] Figure 4 is a structural diagram of another light emitting panel according to some embodiments;

[0030] Figure 5 is a structural diagram of another light-emitting panel according to some embodiments;

[0031] Figure 6 is a structural diagram of another light-emitting panel according to some embodiments;

[0032] Figure 7 is a structural diagram of another light-emitting panel according to some embodiments;

[0033] Figure 8 is a structural diagram of another light-emitting panel according to some embodiments;

[0034] Fig. 9 is a structural diagram of another light-emitting panel according to some embodiments;

[0035] Fig.10 is a structural diagram of another light-emitting panel according to some embodiments;

[0036] Fig.11 is a structural diagram of another light-emitting panel according to some embodiments;

[0037] Fig.12 is a structural diagram of another light-emitting panel according to some embodiments;

[0038] Fig.13 is a structural diagram of another light-emitting panel according to some embodiments;

[0039] Fig.14 is a top view of a substrate according to some embodiments;

[0040] Fig.15 is a structural diagram of another light-emitting panel according to some embodiments;

[0041] Fig.16 is a structural diagram of another light-emitting panel according to some embodiments;

[0042] Fig.17 is a flow chart of a method for preparing a light-emitting panel according to some embodiments;

[0043] Fig.18 is a structural diagram of another light-emitting panel according to some embodiments;

[0044] Fig.19 is another flow chart of a method for preparing a light-emitting panel according to some embodiments;

[0045] Figures 20A to 20F It is another structural diagram corresponding to each step in the method for preparing a light-emitting panel according to some embodiments. DETAILED DESCRIPTION

[0046] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0047] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "some embodiments", "exemplary embodiments", "examples", etc. are intended to indicate that specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0048] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0049] When describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0050] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0051] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0052] As used herein, "equal" includes the stated situation and the situation similar to the stated situation, the range of which is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two being equal is less than or equal to 5% of either one.

[0053] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0054] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0055] With the development of display technology, various display devices have appeared in life, and the display devices can provide people with various display services to meet people's needs.

[0056] Based on this, the present disclosure provides a display device, which can be any device that displays whether it is moving (e.g., video) or fixed (e.g., still image) and whether it is text or image. More specifically, it is expected that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, global positioning system (GPS) receivers / navigators, cameras, moving picture experts group 4 (MP4) video players, video cameras, game consoles, watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0057] In some embodiments, the display device may be an LCD (Liquid Crystal Display) device.

[0058] In this case, if Figure 1 As shown, the display device 1 may include a light emitting panel 11, an array substrate 12, a color filter substrate 13 and a liquid crystal layer 14. The array substrate 12 is located on the light emitting side of the light emitting panel 11. The color filter substrate 13 is located on the side of the array substrate 12 away from the light emitting panel 11. The liquid crystal layer 14 is located between the color filter substrate 13 and the array substrate 12.

[0059] It is understandable that the above-mentioned light emitting panel 11 can also be called a backlight module, which is used to provide backlight. For example, the backlight provided by the light emitting panel 11 can be white light or blue light, which is not specifically limited in the present disclosure. Among them, the light emitting side of the light emitting panel 11 refers to the side from which the light emitting panel 11 emits light.

[0060] Exemplarily, the array substrate 12 may include a plurality of transistors and a plurality of pixel electrodes, and the plurality of transistors may be arranged in an array shape. The plurality of transistors are electrically connected to the plurality of pixel electrodes in a one-to-one correspondence, and the transistors transmit pixel voltages to corresponding pixel electrodes.

[0061] Exemplarily, the color film substrate 13 may include a variety of color filters. For example, when the backlight provided by the light-emitting panel 11 is white light, the color filters may include a red filter, a green filter, a blue filter, and the like. For example, a red filter may only allow red light in the incident light to pass through, a green filter may only allow green light in the incident light to pass through, and a blue filter may only allow blue light in the incident light to pass through. For another example, when the backlight provided by the light-emitting panel 11 is blue light, the color filters may also include a red filter, a green filter, and the like.

[0062] Exemplarily, the display device 1 further includes a common electrode. The common electrode can receive a common voltage. The common electrode can be disposed in the color filter substrate 13, or in the array substrate 12, which is not specifically limited in the present disclosure.

[0063] Exemplarily, the liquid crystal layer 14 includes a plurality of liquid crystal molecules. For example, an electric field may be formed between the pixel electrode and the common electrode, and the liquid crystal molecules may be deflected under the action of the electric field.

[0064] Through the above arrangement, when the display device 1 is working, the light emitting panel 11 can emit light, and then the light will pass through the array substrate 12, the liquid crystal layer 14 and the color film substrate 13 in sequence, and finally realize the picture display.

[0065] Specifically, when light is incident on the liquid crystal layer 14, the liquid crystal molecules will be deflected under the action of the electric field formed between the pixel electrode and the common electrode, thereby changing the amount of light passing through the liquid crystal molecules, so that the light emitted through the liquid crystal molecules reaches a preset brightness. Then, when the light passes through the color filter substrate 13, it will pass through filters of different colors and emit light of different colors, such as red light, blue light, green light, etc., and the light of various colors cooperates to achieve display.

[0066] In some other embodiments, the display device 1 may also be a LED (Light Emitting Diode) display device.

[0067] In this case, if Figure 2 As shown, the display device 1 may include a housing 15 and a light emitting panel 11, and the light emitting panel 11 is disposed in the housing 15. The light emitting panel 11 itself can emit light to realize picture display.

[0068] The housing 15 should have a certain strength so as to provide support and protection for the light emitting panel 11. For example, the material of the housing 15 may include plastic.

[0069] In some embodiments, Figure 3As shown, the light emitting panel 11 comprises a substrate 111, the substrate 111 comprises a back plate 1111 and a light emitting device layer 1112, the light emitting device layer 1112 is arranged on the back plate 1111, the light emitting device layer 1112 comprises a light emitting device 11121, and the light emitting device 11121 is electrically connected to the back plate 1111. The light emitting device 11121 is controlled to emit light by the back plate 1111.

[0070] Specifically, Figure 4 As shown, the backplane 1111 includes a substrate 11111 and a driving circuit layer 11112, and the driving circuit layer 11112 is arranged on one side of the substrate 11111. The light emitting device layer 1112 is arranged on a side of the driving circuit layer 11112 away from the substrate 11111, and the light emitting device 11121 is electrically connected to the driving circuit layer 11112.

[0071] In this way, the substrate 11111 provides support for the driving circuit layer 11112 to facilitate the setting of the driving circuit layer 11112 , and the driving circuit layer 11112 controls the light-emitting device 11121 to emit light, thereby realizing the light-emitting panel 11 .

[0072] In some examples, the substrate 11111 may be a flexible substrate. The material of the substrate 11111 may include PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate Two Formic Acid Glycol Ester), or PI (Polyimide).

[0073] Alternatively, the substrate 11111 may also be a rigid substrate. For example, the material of the substrate 11111 may include glass or the like.

[0074] In some examples, such as Figure 5 As shown, the driving mode of the light emitting device 11121 is active driving. Correspondingly, the driving circuit layer 11112 is an AM (Active Matrix, active driving) circuit layer.

[0075] Specifically, when the driving circuit layer 11112 is an AM circuit layer, as shown in FIG. Figure 5As shown, the driving circuit layer 11112 includes a plurality of pixel driving circuits 111121. The structures of the pixel driving circuits 111121 include various structures, which can be selected and set according to actual needs. For example, the structure of the pixel driving circuit 111121 includes but is not limited to structures such as "3T1C", "6T1C", "7T1C", "6T2C" or "7T2C". Here, "T" represents a transistor, and the number in front of "T" represents the number of transistors, and "C" represents a storage capacitor, and the number in front of "C" represents the number of storage capacitors.

[0076] in, Figure 5 A thin film transistor (TFT) represents a pixel driving circuit 111121. The driving circuit layer 11112 further includes a plurality of common voltage lines 111122. The plurality of pixel driving circuits 111121 may be arranged into a plurality of pixel driving circuit columns, and the plurality of pixel driving circuit columns and the plurality of common voltage lines 111122 may be alternately arranged.

[0077] The thin film transistor may be a low temperature polysilicon (LTPS) thin film transistor, or may be an oxide thin film transistor.

[0078] In this case, the anode pin of the light-emitting device 11121 can be electrically connected to the pixel driving circuit 111121 and used to transmit the driving signal, and the cathode pin of the light-emitting device 11121 can be electrically connected to the common voltage line 111122 and used to transmit the common voltage signal.

[0079] For example, the electrical connection between the anode pin of the light-emitting device 11121 and the pixel driving circuit 111121 can be achieved through the pad, and the electrical connection between the cathode pin of the light-emitting device 11121 and the common voltage line 111122 can be achieved through the pad.

[0080] In some other examples, the driving mode of the light emitting device 11121 is passive driving. Accordingly, the driving circuit layer 11112 may also be a PM (Passive Matrix, passive driving) circuit layer.

[0081] Specifically, when the driving circuit layer 11112 is a PM circuit layer, as shown in FIG. Figure 6As shown, the driving circuit layer 11112 includes a conductive layer 111123, the conductive layer 111123 includes a plurality of first signal lines 1111231, and the conductive layer 111123 is disposed on one side of the substrate 11111. Of course, the driving circuit layer 11112 may also include a plurality of conductive layers 111123, and different types of first signal lines 1111231 are disposed in different conductive layers 111123, which is not limited in the embodiments of the present disclosure.

[0082] In this case, the anode pin of the light-emitting device 11121 may be electrically connected to one of the plurality of first signal lines 1111231 , and the cathode pin of the light-emitting device 11121 may be electrically connected to another of the plurality of first signal lines 1111231 .

[0083] For example, the electrical connection between the anode pin of the light-emitting device 11121 and the first signal line 1111231 can be achieved through a soldering pad, and the electrical connection between the cathode pin of the light-emitting device 11121 and the first signal line 1111231 can be achieved through a soldering pad.

[0084] For the convenience of subsequent description, the following description is made on the assumption that the driving circuit layer 11112 is an AM circuit layer.

[0085] In some examples, the light emitting device 11121 may be a Micro LED (Micro Light Emitting Diode) or a Mini LED (Mini Light Emitting Diode) .

[0086] Exemplarily, the structure of the light emitting device 11121 may be any one of a face-up structure, a vertical structure or a flip-down structure. For ease of description, the following description takes the structure of the light emitting device 11121 as a flip-down structure as an example.

[0087] Since the light-emitting device 11121 is generally grown on a sapphire substrate 11111, when electrically connecting the light-emitting device 11121 to the driving circuit layer 11112, it is necessary to use mass transfer technology to transfer and bond the light-emitting device 11121 on the sapphire substrate 11111 to the driving circuit layer 11112.

[0088] Due to the limitations of current mass transfer and bonding technologies, it is generally necessary to make the number of light-emitting devices 11121 bonded per unit area of ​​the driving circuit layer 11112 appropriate, so as to ensure the bonding yield of the light-emitting devices 11121. However, in this way, the increase in the density of the light-emitting devices 11121 in the light-emitting device layer 1112 will be limited, thus limiting the increase in the resolution of the display device 1.

[0089] At the same time, since the structure of the pixel driving circuit 111121 is relatively complex, a certain layout space needs to be provided for its complex structure. Since the light-emitting device 11121 needs to be electrically connected to the pixel driving circuit 111121, the increase in the density of the light-emitting devices 11121 in the light-emitting device layer 1112 will also be limited by the arrangement of the pixel driving circuit 111121.

[0090] Based on this, Figure 7 As shown, the light emitting panel 11 provided by the present disclosure includes n substrates 111 ( Figure 7 In the figure, two substrates 111 are used as an example for illustration), n≥2, and n is an integer. From the light-emitting side of the light-emitting panel 11 to the backlight side ( Figure 7 The n substrates 111 are respectively the first substrate 111 to the nth substrate 111. The substrate 111 includes a backplane 1111 and a light-emitting device layer 1112, and the backplane 1111 has a light-transmitting area 1111a. The light-emitting device layer 1112 is disposed on the backplane 1111, and the light-emitting device layer 1112 includes a light-emitting device 11121 located outside the light-transmitting area 1111a. The light emitted by the light-emitting device 11121 of each substrate 111 of the second substrate 111 to the nth substrate 111 can pass through the light-transmitting area 1111a of each substrate 111 above it.

[0091] It is understood that the light emitting side of the light emitting panel 11 refers to the side where the light emitting panel 11 emits light, while the backlight side of the light emitting panel 11 refers to the side where the light emitting panel 11 does not emit light, that is, the side opposite to the light emitting side of the light emitting panel 11.

[0092] In some examples, each back panel 1111 includes a plurality of light-transmitting areas 1111a, and each light-emitting device layer 1112 includes a plurality of light-emitting devices 11121. In this case, light emitted by the plurality of light-emitting devices 11121 in any light-emitting device layer 1112 can pass through the plurality of light-transmitting areas 1111a in each back panel 1111 above it.

[0093] For example, the multiple light-emitting devices 11121 in each light-emitting device layer 1112 correspond one-to-one to the multiple light-transmitting areas 1111a in the back plate 1111 above it, that is, the light emitted by a light-emitting device 11121 can pass through a corresponding light-transmitting area 1111a.

[0094] Alternatively, a light-transmitting area 1111a in the back plate 1111 in each substrate 111 corresponds to a plurality of light-emitting devices 11121 in the light-emitting device layer 1112 in each substrate 111, for example, two, three, four, etc. That is, the light emitted by the plurality of light-emitting devices 11121 can pass through a corresponding light-transmitting area 1111a.

[0095] In some examples, the orthographic projection of the light-transmitting area 1111 a on its corresponding back plate 1111 may be in a regular shape such as a square or a circle, or may be in an irregular shape.

[0096] In some examples, the light-transmitting area 1111 a may not be provided on the nth backplane 1111 , so that it is not necessary to layout the pixel driving circuit 111121 on the nth backplane 1111 to avoid the light-transmitting area 1111 a .

[0097] Through the above arrangement, since the light emitted by the light emitting device 11121 of each substrate 111 in the second substrate 111 to the nth substrate 111 can pass through the light-transmitting area 1111a of each substrate 111 above it, for the first substrate 111, not only the light emitted by the light emitting device 11121 on itself can be used as the light source of the light emitting panel 11, but also the light-transmitting area 1111a on the first substrate 111 can be used as the light source of the light emitting panel 11. Therefore, the area of ​​the light emitting surface of the light emitting panel 11 is equal to the area of ​​the light emitting surface of the first substrate 111, that is, the area of ​​the light emitting surface of the light emitting panel 11 has not changed, but the light sources on the light emitting panel 11 (the light emitting devices 11121 on the first substrate 111 and the light-transmitting areas 1111a on the first substrate 111) have increased, so the density of the light sources on the light emitting panel 11 is increased, which is equivalent to increasing the density of the light emitting devices 11121 on the light emitting panel 11, so that the resolution of the display device 1 can be improved.

[0098] Since this method does not need to increase the density of the light-emitting devices 11121 in the single-layer substrate 111, the bonding yield of the light-emitting devices 11121 in the single-layer substrate 111 can be guaranteed, and the layout requirements of the pixel driving circuit 111121 in the single-layer substrate 111 can also be met.

[0099] That is, in the present application, the density of the light-emitting devices 11121 in the light-emitting panel 11 is not only improved, but also the bonding difficulty of the light-emitting devices 11121 in the light-emitting panel 11 is not increased, thus ensuring the bonding yield of the light-emitting devices 11121.

[0100] In some examples, such as Figure 8 As shown, the driving circuit layer 11112 includes a plurality of first signal lines 111121, and the plurality of first signal lines 111121 are arranged to avoid the light-transmitting area 1111a, that is, there is no first signal line 111121 in the light-transmitting area 1111a.

[0101] For example, when the light emitting device 11121 is AM driven, the first signal line 111121 includes a common voltage line 111122 .

[0102] In this case, if Figure 8 As shown, the light-transmitting area 1111 a avoids the pixel driving circuit 111121 at the same time, so that the pixel driving circuit 111121 can be prevented from affecting the propagation of light in the light-transmitting area 1111 a, so as to better ensure the light-emitting effect of the light-emitting panel 11.

[0103] For another example, when the light emitting device 11121 is PM driven, the first signal line 111121 includes a second signal line 1111231 .

[0104] Through the above arrangement, since the first signal line 111121 avoids the light-transmitting area 1111a, there is no first signal line 111121 in the light-transmitting area 1111a, so when light propagates in the light-transmitting area 1111a, it will not be blocked by the first signal line 111121, thereby achieving better propagation of light, so as to better ensure the light-emitting effect of the light-emitting panel 11, and further ensure the display effect of the display device 1.

[0105] On this basis, if Fig. 9 As shown, the substrate 111 includes a first transparent filling portion 1113 disposed in the light-transmitting area 1111a. The driving circuit layer 11112 includes a plurality of transparent insulating layers 111124, and the portion of the plurality of transparent insulating layers 111124 located in the light-transmitting area 1111a forms the first transparent filling portion 1113.

[0106] Since the driving circuit layer 11112 itself includes multiple layers of transparent insulating layers 111124, the first transparent filling portion 1113 is formed directly by utilizing the portion of the transparent insulating layer 111124 located in the light-transmitting area 1111a. There is no need to change the structure of the driving circuit layer 11112, thereby not increasing the difficulty of manufacturing the driving circuit layer 11112 due to the increase in the light-transmitting area 1111a.

[0107] In some other examples, a first filling hole may be opened on the driving circuit layer 11112 at the position of the light-transmitting area 1111a, and then a first transparent medium is filled in the first filling hole to form a first transparent filling portion 1113 using the first transparent medium.

[0108] By way of example, the material of the first transparent medium may include polycarbonate (PC), polyethylene glycol terephthalate (PET), polypropylene (PP), and the like.

[0109] In some examples, such as Fig. 9As shown, the substrate 11111 includes a second transparent filling portion 1111b disposed in the light-transmitting area 1111a. The substrate 11111 is made of a transparent material, and the portion of the substrate 11111 located in the light-transmitting area 1111a forms the second transparent filling portion 1111b.

[0110] In this way, there is no need to modify the substrate 11111 due to the provision of the light-transmitting area 1111a. As long as the substrate 11111 is made of transparent material according to conventional operations, the light-transmitting area 1111a on the substrate 11111 can transmit light. In this way, the process difficulty of processing the substrate 11111 is not increased.

[0111] For example, the material of the substrate 11111 may include glass, CPI (Colorless Polyimide, transparent polyimide), etc.

[0112] Alternatively, a second filling hole may be opened at a position corresponding to the light-transmitting area 1111a on the substrate 11111, and then a second transparent medium may be filled in the second filling hole to form a second transparent filling portion 1111b using the second transparent medium.

[0113] By way of example, the material of the second transparent medium may include polycarbonate (PC), polyethylene glycol terephthalate (PET), polypropylene (PP), and the like.

[0114] It is understandable that a buffer layer is generally provided between the substrate 11111 and the driving circuit layer 11112, and the light-transmitting region 1111a in the buffer layer should also be provided in the same manner as the light-transmitting region 1111a in the substrate 11111 and the driving circuit layer 11112. No further description will be given here.

[0115] In some embodiments, Fig.10 As shown, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-transmitting areas 1111a of each substrate 111 above the i-th substrate 111 at least partially overlap, and the light-emitting device 11121 of the i-th substrate 111 is at least partially located in the at least partially overlapping area, n≥3, i=3~n.

[0116] Exemplarily, when n=3, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-transmitting area 1111a on the first substrate 111 above the third substrate 111 and the light-transmitting area 1111a on the second substrate 111 at least partially overlap, and the light-emitting device 11121 of the third substrate 111 is located in the at least partially overlapping area.

[0117] Exemplarily, when n=4, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-transmitting area 1111a of the first substrate 111 above the fourth substrate 111 and the light-transmitting area 1111a on the second substrate 111 and the light-transmitting area 1111a on the third substrate 111 at least partially overlap, and the light-emitting device 11121 of the fourth substrate 111 is located in at least a partially overlapping area.

[0118] Through the above-mentioned arrangement, along the direction perpendicular to the plane where the nth substrate 111 is located, the light emitted by the light-emitting device 11121 on the i-th substrate 111 can directly enter the area at least partially overlapping with the light-transmitting area 1111a, and then pass through the light-transmitting area 1111a. In this way, the light loss of the light emitted by the light-emitting device 11121 can be reduced, thereby ensuring the light-emitting effect of the light-emitting panel 11, and further ensuring the display effect of the display device 1.

[0119] Or, if Fig.11 As shown, when n=2, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-emitting device 11121 of the second substrate 111 is at least partially located in the light-transmitting area 1111 a of the first substrate 111 .

[0120] In this way, along the direction perpendicular to the plane where the nth substrate 111 is located, the light emitted by the light-emitting device 11121 of the second substrate 111 can directly enter the light-transmitting area 1111a on the first substrate 111, and then pass through the light-transmitting area 1111a. This can reduce the light loss of the light emitted by the light-emitting device 11121, thereby ensuring the light-emitting effect of the light-emitting panel 11, and then ensuring the display effect of the display device 1.

[0121] In other embodiments, Fig.12 As shown, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-transmitting areas 1111a of the substrates 111 above the i-th substrate 111 may not overlap; n≥3, i=3-n. As long as the light emitted by the light-emitting device 11121 can pass through the light-transmitting areas 1111a on the substrates 111 above it.

[0122] In some embodiments, Fig.12 As shown, when the light emitting panel 11 includes only two substrates 111 , that is, n=2, in the orthographic projection onto the plane where the n-th substrate 111 is located, the light-transmitting areas of the two substrates 111 are staggered.

[0123] Since the light-emitting device 11121 is located outside the light-transmitting area 1111a, when the light-transmitting areas 1111a on the two substrates 111 are staggered, by reasonably setting the position of the light-emitting device 11121 on the second substrate 111, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-emitting device 11121 on the second substrate 111 can be at least partially located in the light-transmitting area 1111a on the first back panel 1111, so that the light emitted by the light-emitting device 11121 on the second substrate 111 can directly enter the light-transmitting area 1111a on the first substrate 111 and then be emitted, so that the light loss of the light emitted by the light-emitting device 11121 can be reduced, thereby ensuring a better light-emitting effect of the light-emitting panel 11, and then ensuring the display effect of the display device 1.

[0124] In some embodiments, Fig.13 As shown, in the orthographic projection onto the plane where the nth substrate 111 is located, the light emitting devices 11121 of each substrate 111 are staggered.

[0125] In this way, when all areas on the substrate 111 except the area where the light-emitting device 11121 is located are the light-transmitting areas 1111a, along the direction perpendicular to the plane where the nth substrate 111 is located, as long as the light-emitting devices 11121 in each light-emitting device layer 1112 are staggered, then the light-emitting devices 11121 in each substrate 111 located below the first substrate 111 will definitely be located in the light-transmitting area 1111a, so that the light emitted by the light-emitting device 11121 can be emitted into the light-transmitting area 1111a along the direction perpendicular to the plane where the nth substrate 111 is located, and continue to be emitted through the light-transmitting area 1111a, so that the light loss of the light emitted by the light-emitting device 11121 can be reduced, thereby ensuring a better light-emitting effect of the light-emitting panel 11, and further ensuring the display effect of the display device 1.

[0126] In some embodiments, in the light emitting device layer 1112, the number of light emitting devices 11121 is multiple, such as Fig.14 As shown, a plurality of light emitting devices 11121 constitute a plurality of light emitting device groups 11122 , and the light emitting device groups 11122 include at least one red light emitting device R, at least one green light emitting device G, and at least one blue light emitting device B.

[0127] The red light emitting device R, the green light emitting device G and the blue light emitting device B are used to emit red, green and blue lights respectively, and then the three colors of light are mixed in a certain proportion to form white light, which is then emitted to realize luminescence.

[0128] Exemplarily, a red light emitting device R, a green light emitting device G, and a blue light emitting device B may be arranged together, and then packaged together using packaging technology to perform light mixing.

[0129] On this basis, if Fig.15 As shown, in the orthographic projection onto the plane where the nth substrate 111 is located, the light-emitting devices 11121 included in the same light-emitting device group 11122 of each substrate 111 from the second substrate 111 to the nth substrate 111 are located in the same light-transmitting area 1111a of the substrates 111 thereover.

[0130] Through the above arrangement, the red light emitting device R, the green light emitting device G and the blue light emitting device B can be conveniently arranged together, thereby facilitating the layout and packaging of the three, and further facilitating the mixing of light of the red light emitting device R, the green light emitting device G and the blue light emitting device B.

[0131] In some embodiments, Fig.16 As shown, the substrate 111 includes a plurality of pixels 1114, each pixel 1114 includes a plurality of light-emitting devices 11121 and at least one light-transmitting area 1111a, and the plurality of pixels 1114 of the n substrates 111 are arranged in a one-to-one correspondence. In the orthographic projection onto the plane where the n-th substrate 111 is located, the light-emitting devices 11121 of the corresponding n pixels 1114 are arranged staggered.

[0132] In this way, a single pixel 1114 on the first substrate 111 includes not only the multiple light-emitting devices 11121 in the pixel 1114 on the first substrate 111, but also includes the projection of the multiple light-emitting devices 11121 in the corresponding pixels 1114 on the second substrate 111 to the nth substrate 111. Since the multiple light-emitting devices 11121 in the corresponding pixels 1114 on the second substrate 111 to the nth substrate 111 can pass through the light-transmitting areas 1111a on the substrates 111 above them, the single pixel 1114 on the first substrate 111 is improved for the first substrate 111. The density of the light sources within (the light-emitting device 11121 and the light-transmitting area 1111a within the pixel 1114) is equivalent to increasing the density of the light-emitting devices 11121 within a single pixel 1114 on the first substrate 111, thereby increasing the density of the light-emitting devices 11121 on the first substrate 111. Since the multiple substrates 111 are stacked in sequence, the area of ​​the light-emitting surface of the first substrate 111 is consistent with the area of ​​the light-emitting surface of the light-emitting panel 11. Therefore, the density of the light-emitting devices 11121 within a single pixel 1114 on the light-emitting panel 11 is increased, thereby improving the light-emitting effect of the light-emitting panel 11.

[0133] In addition, since the number of actual light-emitting devices 11121 in a single pixel 1114 on the single-layer substrate 111 does not change, it does not increase the difficulty of bonding the light-emitting devices 11121 to the driving circuit layer 11112. That is, while the density of the light-emitting devices 11121 on the light-emitting panel 11 is increased, the bonding difficulty of the light-emitting devices 11121 is not increased.

[0134] The present disclosure also provides a method for preparing the light emitting panel 11, such as Fig.17 As shown, the preparation method includes: S100~S200.

[0135] S100: Fig.18 As shown, n initial substrates 16 are manufactured, where n≥2 and n is an integer; the initial substrate 16 includes a carrier substrate 161 and a substrate 111; the substrate 111 includes a backplane 1111 and a light-emitting device layer 1112, and a light-transmitting area 1111a is formed on the backplane 1111. The light-emitting device layer 1112 is disposed on the backplane 1111, and the light-emitting device layer 1112 includes a light-emitting device 11121 located outside the light-transmitting area 1111a.

[0136] It can be understood that the carrier substrate 161 can provide support for the manufacture of the base plate 111 .

[0137] Exemplarily, the carrier substrate 161 is a rigid substrate, for example, the material of the carrier substrate 161 may include glass. The thickness of the carrier substrate 161 may be set according to actual needs.

[0138] Exemplarily, the backplane 1111 includes a substrate 11111 and a driving circuit layer 11112 , and the driving circuit layer 11112 is manufactured on the substrate 11111 .

[0139] Specifically, when manufacturing the initial substrate 16 , it is necessary to sequentially manufacture the substrate 11111 , the driving circuit layer 11112 and the light emitting device layer 1112 on the carrier substrate 161 , so as to process the initial substrate 16 .

[0140] S200: From the light emitting side to the backlight side of the light emitting panel 11, the n substrates 111 are respectively the first substrate 111 to the nth substrate 111, and the n substrates 111 are stacked in sequence, so that the light emitted by the light emitting device 11121 of each substrate 111 from the second substrate 111 to the nth substrate 111 can pass through the light-transmitting area 1111a of each substrate 111 above it.

[0141] For example, Fig.19 As shown, stacking n substrates 111 in sequence includes: S210 to S240.

[0142] S210: Fig. 20A As shown, on the substrate 111 to be stacked (located Fig. 20A A support substrate 162 is fabricated on a surface of the upper middle substrate 111 away from the carrier substrate 161 .

[0143] It can be understood that the support substrate 162 can provide support for the initial substrate 16 .

[0144] By way of example, the support substrate 162 is a rigid substrate, and the material of the support substrate 162 may include glass or the like.

[0145] In some examples, such as Fig. 20B As shown, manufacturing the supporting substrate 162 on a surface of the to-be-stacked substrate 111 away from the carrier substrate 161 includes: S211 - S212 .

[0146] S211 : manufacturing a sacrificial film layer 163 on a surface of the substrate 111 to be stacked, which is away from the carrier substrate 161 .

[0147] S212 : manufacturing a supporting substrate 162 on a surface of the sacrificial film layer 163 which is away from the substrate 111 to be stacked.

[0148] By forming a sacrificial film layer 163 between the supporting substrate 162 and the light-emitting device layer 1112 , the light-emitting device layer 1112 can be protected, thereby preventing the supporting substrate 162 from causing damage to the light-emitting device layer 1112 .

[0149] S220: Fig. 20C As shown, the carrier substrate 161 of the substrate 111 to be stacked is removed.

[0150] Exemplarily, the carrier substrate 161 may be peeled off from the to-be-stacked substrate 111 by a peeling technique, for example, the peeling technique may be a laser peeling technique.

[0151] S230: Fig.20D As shown, the substrate 111 to be stacked is attached to the already stacked substrate 111 , and the already stacked substrate 111 includes at least one substrate 111 .

[0152] The substrate 111 to be stacked can be pasted on the already stacked substrate 111 by gluing. During the stacking process, alignment marks can be set on the substrate 111 to be stacked and the already stacked substrate 111, respectively, and then the substrate 111 to be stacked can be accurately pasted on the already stacked substrate 111 according to the alignment of the alignment marks.

[0153] S240: Fig.20E As shown, the support substrate 162 is removed.

[0154] For example, the support substrate 162 may be peeled off from the base plate 111 by a peeling technique, for example, the peeling technique may be a laser peeling technique.

[0155] In some embodiments, Fig.20F As shown, after n substrates 111 are stacked in sequence by S210 to S240, the method for preparing the light emitting panel 11 of the present disclosure further includes: removing the carrier substrate 161 on the nth substrate 111. This can make the thickness of the light emitting panel 11 thinner, thereby making the display device 1 lighter and thinner as a whole.

[0156] Through the above steps, n substrates are stacked and arranged. Since the light emitted by the light emitting device 11121 of each substrate 111 from the second substrate 111 to the nth substrate 111 can pass through the light-transmitting area 1111a of each substrate 111 above it, for the first substrate 111, not only the light emitted by the light emitting device 11121 on itself can be used as the light source of the light emitting panel 11, but also the light-transmitting area 1111a on the first substrate 111 can be used as the light source of the light emitting panel 11. The second stacking arrangement is adopted, so the area of ​​the light emitting surface of the light emitting panel 11 is equal to the area of ​​the light emitting surface of the first substrate 111, that is, the area of ​​the light emitting surface of the light emitting panel 11 has not changed, but the light sources on the light emitting panel 11 (the light emitting devices 11121 on the first substrate 111 and the light-transmitting areas 1111a on the first substrate 111) have increased, so the density of the light sources on the light emitting panel 11 is improved, which is equivalent to increasing the density of the light emitting devices 11121 on the light emitting panel 11, thereby improving the resolution of the display device 1.

[0157] During the manufacturing process, the substrate 111 is manufactured on the carrier substrate 161 so as to use the carrier substrate 161 to provide support for the substrate 111. When performing the stacking arrangement, the support substrate 162 is first manufactured on the surface of the side of the substrate 111 to be stacked away from the carrier substrate 161, so that when the substrate 111 to be stacked is pasted to the stacked substrate 111, the support substrate 162 can provide support for the substrate 111 to be stacked, thereby facilitating the lamination. After the lamination is completed, the carrier substrate 161 on the substrate 111 to be stacked is removed, thereby reducing the overall thickness of the light-emitting panel 11, making the display device 1 lighter and thinner as a whole.

[0158] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A light-emitting panel, characterized in that: The invention comprises n substrates stacked in sequence, where n≥2 and n is an integer; from the light-emitting side to the backlight side of the light-emitting panel, the n substrates are respectively the first substrate to the nth substrate; wherein the substrate comprises: a back panel having a light-transmitting area; A light emitting device layer, disposed on the back plate, the light emitting device layer comprising light emitting devices located outside the light transmission area; The light emitted by the light emitting device of each substrate among the second substrate to the nth substrate can pass through the light-transmitting areas of the substrates above it.

2. The light emitting panel according to claim 1, characterized in that: In the orthographic projection onto the plane where the nth substrate is located, The light-transmitting regions of the substrates above the i-th substrate at least partially overlap, and the light-emitting device of the i-th substrate is at least partially located in the at least partially overlapping region; n≥3, i=3~n; or, The light emitting device of the second substrate is at least partially located in the light-transmitting area of ​​the first substrate.

3. The light emitting panel according to claim 1, characterized in that: In the light-emitting device layer, the number of the light-emitting devices is multiple, and the multiple light-emitting devices constitute multiple light-emitting device groups, and the light-emitting device groups include at least one red light-emitting device, at least one green light-emitting device, and at least one blue light-emitting device; In the orthographic projection onto the plane where the nth substrate is located, the light-emitting devices included in the same light-emitting device group of each substrate from the second substrate to the nth substrate are located in the same light-transmitting area of ​​each substrate above it.

4. The light emitting panel according to claim 1, characterized in that: In the orthographic projection onto the plane where the n-th substrate is located, the light-emitting devices of the substrates are staggered.

5. The light emitting panel according to claim 1, characterized in that: n=2, in the orthographic projection onto the plane where the n-th substrate is located, the light-transmitting areas of the two substrates are staggered.

6. The light emitting panel according to any one of claims 1 to 5, characterized in that: The substrate comprises a plurality of pixels, each pixel comprises a plurality of the light-emitting devices and at least one light-transmitting area, and the plurality of pixels of the n substrates are arranged in a one-to-one correspondence; In the orthographic projection onto the plane where the n-th substrate is located, the light-emitting devices of the corresponding n pixels are staggered.

7. The light emitting panel according to any one of claims 1 to 5, characterized in that: The backplane includes a driving circuit layer, the driving circuit layer includes a plurality of first signal lines, and the plurality of first signal lines are arranged to avoid the light-transmitting area.

8. The light emitting panel according to claim 7, characterized in that: The substrate comprises a first transparent filling portion disposed in the light-transmitting area; The driving circuit layer includes multiple transparent insulating layers, and portions of the multiple transparent insulating layers located in the light-transmitting area form the first transparent filling portion.

9. A method for preparing a light-emitting panel, characterized in that: The preparation method comprises: Prepare n initial substrates, n≥2, and n is an integer; the initial substrates include a carrier substrate and a substrate; the substrate includes a backplane and a light-emitting device layer, and a light-transmitting area is formed on the backplane; the light-emitting device layer is arranged on the backplane, and the light-emitting device layer includes light-emitting devices located outside the light-transmitting area; From the light-emitting side to the backlight side of the light-emitting panel, the n substrates are respectively the first substrate to the nth substrate, and the n substrates are stacked in sequence, so that the light emitted by the light-emitting device of each substrate from the second substrate to the nth substrate can pass through the light-transmitting area of ​​each substrate above it; Wherein, stacking the n substrates in sequence comprises: Making a supporting substrate on a surface of the substrate to be stacked away from the carrier substrate; removing the carrier substrate of the substrate to be stacked; Laminating the substrate to be stacked onto the already stacked substrates, wherein the already stacked substrates include at least one of the substrates; The support substrate is removed.

10. A display device, characterized in that: include: case; The light emitting panel according to any one of claims 1 to 8, wherein the light emitting panel is disposed in the housing.

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