Vapor chamber, cooler, heat dissipation plate structure and terminal equipment
CN119383891APending Publication Date: 2025-01-28HONOR DEVICE CO LTD
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Patent Information
- Application Number
- CN202310938556.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-27
- Publication Date
- 2025-01-28
AI Technical Summary
Technical Problem
The existing temperature uniform plates have poor heat dissipation effect under low heat source conditions, making it difficult to ensure the temperature uniformity of terminal equipment.
Method used
The architecture of a nuclear structure and hydrophilic structure is set in the evaporation area of the average temperature plate. The nuclear structure has a hydrophobic function, and the hydrophilic structure is used to promote the refrigerant.
Benefits of technology
It is achieved to promote liquid core boiling at a lower temperature, and improve the average temperature effect and heat dissipation performance of the average temperature plate.
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Smart Images
Figure CN119383891A_ABST
Abstract
The invention further provides a vapor chamber, a cooler, a heat dissipation plate structure and terminal equipment. The vapor chamber comprises a shell, a sealed space is defined by the shell, a refrigerant medium is arranged in the sealed space, the sealed space comprises an evaporation area, a plurality of nucleation structures distributed at intervals are arranged in the evaporation area, the periphery of each nucleation structure is a hydrophilic structure, and the nucleation structures are used for promoting nucleation boiling of the refrigerant medium. The liquid in the evaporation area of the vapor chamber is easier to nucleate and boil, and the vapor chamber has good heat dissipation performance.
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