Portable heat exchange equipment

Abstract

The invention relates to the technical field of heat exchange, in particular to portable heat exchange equipment which comprises an equipment body and a heat exchange module for heat exchange through the equipment body, and the heat exchange module is used for independently conducting heat exchange on third-party equipment so as to achieve cooling or temperature control operation. According to the embodiment, the heat exchange module is independently arranged, or the heat exchange module and the refrigeration module are indirectly connected, the heat exchange module is cooled through the refrigeration module of the equipment body, and according to the design thought, a fan and other devices capable of generating noise or vibration are indirectly separated from third-party equipment for operation; the heat exchange module capable of transmitting the heat source is arranged between the refrigeration module and the third-party equipment, so that the third-party equipment cannot be influenced by noise or vibration generated by the refrigeration module in the using process.

Description

Technical Field

[0001] The invention relates to the technical field of heat exchange, and in particular to a portable heat exchange device. Background Art

[0002] During the use of electronic products, temperature control of electronic products is very important, which directly affects the normal operation of electronic components; therefore, in the fields of electronic product structure and heat dissipation, corresponding heat exchange modules are used to control the temperature of electronic products. The current cooling / heating solution is to use TEC electric heating fins and fan heat dissipation in one, such as the heat dissipation back clip described in the invention patent authorization announcement number CN112601424B, which directly acts on the heating device, that is, the object to be cooled / heated. Due to the low cooling / heating efficiency of TEC, the cooling / heating effect needs to be enhanced by a fan. The fan has strong noise, which affects the sound pickup of third-party equipment (the object to be cooled / heated); at the same time, the fan has strong vibration, which also affects the balance and video recording of third-party equipment; in this regard, it is necessary to propose an improved solution to solve the above problems. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.

[0004] A portable heat exchange device, comprising a device body and a heat exchange module for performing heat exchange through the device body, wherein the heat exchange module is used to perform heat exchange on a third-party device alone to achieve a cooling or temperature control operation; The device body includes a main body casing, at least one refrigeration module installed on the main body casing, and a power supply control module electrically connected to the refrigeration module, wherein the refrigeration module is provided with a fan electrically connected to the power supply control module, a radiator docked with the fan, and a semiconductor refrigeration sheet for heat exchange with the radiator, the heat exchange module includes a heat storage module and an interface material layer for heat exchange with the heat storage module, and heat exchange is achieved between the heat exchange module and the refrigeration module through the contact between the interface material layer and the semiconductor refrigeration sheet; The main casing is provided with at least one module placement compartment, and the main casing is provided with a vent connected to the module placement compartment, the refrigeration module and the heat exchange module are placed in the module placement compartment, the refrigeration module generates a directional fluid that circulates inside and outside the module placement compartment through the vent, and the refrigeration module and the heat exchange module cooperate in heat exchange through the restriction of the module placement compartment.

[0005] Preferably, an openable and closable sliding door is provided on the module placement compartment, and an elastic structure is provided in the module placement compartment. The refrigeration module and the heat exchange module enter the module placement compartment along the openable and closable sliding door, and a thrust toward the elastic structure is applied to the refrigeration module and the heat exchange module through the openable and closable sliding door, so that the interface material layer between the refrigeration module and the heat exchange module is in close contact with the semiconductor refrigeration sheet.

[0006] Preferably, the radiator includes a heat dissipation mainboard and heat dissipation fins formed on the heat dissipation mainboard and arranged at equal distances. A fixing hole penetrating the heat dissipation mainboard and the heat dissipation fins is opened on the radiator, and the fan is installed in the fixing hole.

[0007] Preferably, a first thermal insulation frame is arranged around the periphery of the semiconductor refrigeration sheet, and the first thermal insulation frame and the semiconductor refrigeration sheet are both attached to the heat dissipation mainboard.

[0008] Preferably, the heat storage module includes a hollow shell, a phase change material arranged in the hollow shell, and a second insulation frame surrounding the periphery of the hollow shell. A temperature display screen is also provided on the outside of the hollow shell to display its temperature value, and the interface material layer is attached to the hollow shell.

[0009] Preferably, two refrigeration modules and two heat exchange modules are provided, and the main casing is provided with two symmetrical module placement compartments, with a partition between the two module placement compartments, an elastic structure is provided on the partition, and the side of the main casing relative to the partition is provided with an openable and closable sliding door.

[0010] Preferably, a power supply module compartment is provided in the portion of the main shell corresponding to the module placement compartment, and the power supply control module is arranged in the module placement compartment.

[0011] Preferably, the interface material layer has a first heat exchange material layer and a second heat exchange material layer, and the heat storage module includes a first water-cooled plate attached to the first heat exchange material layer, a second water-cooled plate attached to the second heat exchange material layer, a water-cooled pipe connected between the first water-cooled plate and the second water-cooled plate to realize water circulation, and a water pump module installed on the first water-cooled plate and providing power to the first water-cooled plate, wherein the first heat exchange material layer is attached to the semiconductor refrigeration plate, and the second heat exchange material layer cooperates with the third-party equipment for heat exchange, and the water pump module, the first water-cooled plate, the water-cooled pipe and the second water-cooled plate constitute a water circulation system that acts on the first heat exchange material layer and the second heat exchange material layer respectively.

[0012] Preferably, a magnetic attraction layer is provided on both the first heat exchange material layer and the semiconductor refrigeration sheet, and the first heat exchange material layer and the semiconductor refrigeration sheet are magnetically attached to each other through the magnetic attraction layer.

[0013] Compared with the prior art, the present invention has the following beneficial effects: In this embodiment, the heat exchange module is provided separately, or the heat exchange module is indirectly connected to the refrigeration module, and the heat exchange module is cooled by the refrigeration module of the equipment body. The design idea is to indirectly separate the operation of devices such as fans that can generate noise or vibration from third-party equipment. By providing a heat exchange module that can transmit heat source between the refrigeration module and the third-party equipment, the third-party equipment will not be affected by the noise or vibration generated by the refrigeration module during use.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 is a schematic structural diagram of Embodiment 1 of the present invention; Figure 2 It is a schematic diagram of the explosion structure of Example 1 of the present invention; Figure 3 It is a schematic diagram of the exploded structure of the refrigeration module in the present invention; Figure 4 It is a schematic diagram of the exploded structure of the heat exchange module in the present invention; Figure 5 It is a schematic diagram of the explosion structure of Example 2 of the present invention.

[0017] The reference numerals and names in the figures are as follows: Heat exchange module 10, heat storage module 11, hollow shell 111, phase change material 112, second insulation frame 113, temperature display screen 114, first water-cooled plate 115, second water-cooled plate 116, water-cooled pipe 117, water pump module 118, interface material layer 12, first heat exchange material layer 121, second heat exchange material layer 122, magnetic attraction layer 123, main casing 20, module placement compartment 21, vent 22, power supply module compartment 23, openable sliding door 24, elastic structure 25, refrigeration module 30, fan 31, radiator 32, heat dissipation mainboard 321, heat dissipation fins 322, semiconductor refrigeration sheet 33, first insulation frame 331, power supply control module 40. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] [Example 1] Please refer to Figure 1-4 A portable heat exchange device includes a device body and a heat exchange module 10 for heat exchange through the device body, wherein the heat exchange module 10 is used to perform heat exchange on a third-party device (such as a mobile phone, a camera) to achieve cooling or temperature control operation. The heat exchange module 10 can be set as a back clip or other structure to achieve close contact with the heat-generating part of the third-party device, so as to effectively transfer heat. In this embodiment, the heat exchange module 10 is set separately. When the heat exchange module 10 transfers the heat on the third-party device to a certain extent, the heat exchange module 10 is removed and installed on the device body, and the heat exchange module 10 is cooled through the device body. At the same time, other heat exchange modules 10 can be taken out and continue to be connected to the third-party device, so as to continuously cool the third-party device. The design idea is to separate the fan 31 and other devices that can generate noise or vibration from the third-party device. By setting a heat exchange module 10 that can transmit heat source through air between the refrigeration module 30 and the third-party device, the third-party device will not be affected by the noise or vibration generated by the refrigeration module 30 during use; Specifically, the device body includes a main body casing 20, at least one refrigeration module 30 installed on the main body casing 20, and a power supply control module 40 electrically connected to the refrigeration module 30. The power supply control module 40 controls the refrigeration module 30, so that the refrigeration module 30 can perform corresponding work according to user needs, so as to perform low heat exchange cooling operations on the heat exchange module 10 to different degrees or in different ways; wherein the refrigeration module 30 is provided with a fan 31 electrically connected to the power supply control module 40, a radiator 32 docked to the fan 31, and a semiconductor refrigeration sheet 33 for heat exchange with the radiator 32, the heat exchange module 10 includes a heat storage module 11 and an interface material layer 12 for heat exchange with the heat storage module 11, and heat exchange is achieved between the heat exchange module 10 and the refrigeration module 30 through the contact between the interface material layer 12 and the semiconductor refrigeration sheet 33; The main casing 20 is provided with at least one module placement compartment 21, and the main casing 20 is provided with a vent 22 connected to the module placement compartment 21. The refrigeration module 30 and the heat exchange module 10 are placed in the module placement compartment 21. The refrigeration module 30 generates a directional fluid that circulates inside and outside the module placement compartment 21 through the vent 22, and the refrigeration module 30 and the heat exchange module 10 cooperate in heat exchange through the restriction of the module placement compartment 21.

[0020] In the above technical solution, the main housing 20 is a protective and compartmentalized, fixed structure for the entire device. The overall material of the main housing 20 can be made of poor conductor materials, such as plastic, bakelite, etc., or metals, such as stainless steel, aluminum, titanium, etc., but it is necessary to add thermal insulation materials, such as aerogel, thermal insulation foam, bubble glue, etc.; the main housing 20 of this embodiment can also be provided with a power supply module compartment 23 on the basis of having at least one module placement compartment 21, such as Figure 1 As shown, there are two module placement compartments 21 and a power supply module compartment 23 arranged on the two module placement compartments 21, and the power supply control module 40 is arranged in the module placement compartment 21, so that the whole is easy to carry and can transfer heat to the two heat exchange modules 10 at the same time; The refrigeration module 30 performs heat exchange cooling on the heat exchange module 10. The fan 31 can select a speed control strategy according to demand, and this purpose can be achieved through a conventional power supply control module 40 on the market. The performance of the radiator 32 is related to the size, manufacturing process, and material type. An appropriate radiator 32 can be selected according to the heat generation of the semiconductor refrigeration plate 33. In this embodiment, the radiator 32 includes a heat dissipation main board 321 and heat dissipation fins 322 formed on the heat dissipation main board 321 and arranged at equal distances. The fan 31 is installed in the fixing hole that runs through the heat dissipation main board 321 and the heat dissipation fins 322, and its structural design is compact and ingenious; in addition, a first heat insulation frame 331 is arranged around the periphery of the semiconductor cooling sheet 33, and the first heat insulation frame 331 and the semiconductor cooling sheet 33 are both attached to the heat dissipation main board 321. The first heat insulation frame 331 is used to place the semiconductor cooling sheet 33 in contact with the main housing 20 to prevent heat or cold leakage. The material of the first heat insulation frame 331 can be selected from various heat insulation materials such as silicone, rubber, aerogel, foam, etc.; The heat exchange module 10 provides cooling or temperature control operations for third-party equipment. When used alone, the interface material layer 12 prevents the third-party equipment from being scratched or otherwise damaged. The material selection may be silicone, plastic, rubber, or other materials with certain toughness and thermal conductivity. The heat storage module 11 stores the cold source provided by the refrigeration module 30 or the heat source of a third-party device. Under special circumstances, the heat storage module 11 may also be used to store the cold source of a third-party device or the heat source provided by the refrigeration module 30. The heat storage module 11 includes a hollow shell 111, a phase change material 112 disposed in the hollow shell 111, and a second heat insulation frame 113 surrounding the outer periphery of the hollow shell 111. The hollow shell 111 may be made of stainless steel, aluminum, titanium alloy, or other materials that are not prone to rust. The phase change material 112 can be pure water, ethylene glycol, refrigerant, oil, paraffin and other liquids or their mixtures, which can store heat. The second insulation frame 113 can prevent the leakage of cold and heat when the heat exchange module 10 is in use, which may shorten the working time of the heat exchange module 10. The optional materials include aerogel, insulation foam, silicone, rubber, etc. In addition, a temperature display screen 114 is provided on the outside of the hollow shell 111 to display its temperature value, and the interface material layer 12 is attached to the hollow shell 111. The temperature display screen 114 can display the current temperature of the heat exchange module 10, the ambient temperature of the third-party equipment, the working time information of the heat exchange module 10, etc. A solar display screen or a separately powered temperature display screen 114 can be used.

[0021] The power supply control module 40 provides power supply for the refrigeration module 30 to make the refrigeration module 30 work and operate. A power bank, various battery blocks, disposable batteries, and batteries that can be charged and discharged multiple times can be selected; In order to make the refrigeration module 30 and the heat exchange module 10 fit more closely and achieve efficient heat exchange operation, an openable sliding door 24 is provided on the module placement compartment 21, and an elastic structure 25 is provided in the module placement compartment 21. The refrigeration module 30 and the heat exchange module 10 enter the module placement compartment 21 along the openable sliding door 24, and a thrust is applied to the refrigeration module 30 and the heat exchange module 10 toward the elastic structure 25 through the openable sliding door 24, so that the interface material layer 12 and the semiconductor refrigeration sheet 33 between the refrigeration module 30 and the heat exchange module 10 are in close contact; when both the refrigeration module 30 and the heat exchange module 10 are provided with two, and the main housing 20 is provided with two module placement compartments 21 symmetrical to each other, There is a partition between the two module placement compartments 21, and the elastic structure 25 is arranged on the partition. The side of the main shell relative to the partition is arranged to be an openable sliding door 24; the function of the openable sliding door 24 is to open and close the main shell 20 when placing the refrigeration module 30 and the heat exchange module 10, and is also used to fix the refrigeration module 30 and the heat exchange module 10, and provide air inlet and outlet channels for the two refrigeration modules 30, that is, the vent 22 is arranged on the openable sliding door 24, and a protective structure is required when necessary to protect personnel operation. When the openable sliding door 24 is closed, a thrust can be formed on the heat exchange module 10; the material of the elastic structure 25 can be made of stainless steel springs, high-elastic foam, springs and other materials with compressible rebound properties.

[0022] [Example 2] Please refer to Figure 3-5 A portable heat exchange device includes a device body and a heat exchange module 10 for performing heat exchange through the device body, wherein the heat exchange module 10 is used to perform heat exchange on a third-party device (such as a mobile phone, a camera) to achieve cooling or temperature control operation. The heat exchange module 10 can be set as a back clip or other structure to achieve close fit with the heat-generating part of the third-party device, so as to effectively transfer heat. In this embodiment, the heat exchange module 10 is indirectly connected to the refrigeration module 30, and the heat exchange module 10 is cooled by the refrigeration module 30 of the device body. The design idea is to indirectly separate the fan 31 and other devices that can generate noise or vibration from the third-party device. By setting a heat exchange module 10 that can transmit heat source between the refrigeration module 30 and the third-party device, the third-party device will not be affected by the noise or vibration generated by the refrigeration module 30 during use. Specifically, the device body includes a main body casing 20, at least one refrigeration module 30 installed on the main body casing 20, and a power supply control module 40 electrically connected to the refrigeration module 30. The power supply control module 40 controls the refrigeration module 30, so that the refrigeration module 30 can perform corresponding work according to user needs, so as to perform low heat exchange cooling operations on the heat exchange module 10 to different degrees or in different ways; wherein the refrigeration module 30 is provided with a fan 31 electrically connected to the power supply control module 40, a radiator 32 docked to the fan 31, and a semiconductor refrigeration sheet 33 for heat exchange with the radiator 32, the heat exchange module 10 includes a heat storage module 11 and an interface material layer 12 for heat exchange with the heat storage module 11, and heat exchange is achieved between the heat exchange module 10 and the refrigeration module 30 through the contact between the interface material layer 12 and the semiconductor refrigeration sheet 33; The main casing 20 is provided with at least one module placement compartment 21, and the main casing 20 is provided with a vent 22 connected to the module placement compartment 21. The refrigeration module 30 and the heat exchange module 10 are placed in the module placement compartment 21. The refrigeration module 30 generates a directional fluid that circulates inside and outside the module placement compartment 21 through the vent 22, and the refrigeration module 30 and the heat exchange module 10 cooperate in heat exchange through the restriction of the module placement compartment 21.

[0023] Based on Example 1, the interface material layer 12 is provided with a first heat exchange material layer 121 and a second heat exchange material layer 122, and the heat storage module 11 includes a first water-cooled plate 115 attached to the first heat exchange material layer 121, a second water-cooled plate 116 attached to the second heat exchange material layer 122, a water-cooled pipe 117 connected between the first water-cooled plate 115 and the second water-cooled plate 116 to realize water circulation, and a water pump module 118 installed on the first water-cooled plate 115 and providing power to the first water-cooled plate 115, wherein the first heat exchange material layer 121 is attached to the semiconductor refrigeration sheet 33, the second heat exchange material layer 122 is heat exchanged with a third-party device, and the water pump module 118 is The first water-cooling plate 115, the water-cooling tube 117 and the second water-cooling plate 116 constitute a water circulation system that acts on the first heat exchange material layer 121 and the second heat exchange material layer 122 respectively; that is, through a structure similar to the water cooling system of the existing computer host on the market, the heat generated by the third-party equipment is transferred to the refrigeration module 30 by water cooling. Its structural design is ingenious and easy to carry. In order to make it more convenient to carry, the first heat exchange material layer 121 and the semiconductor refrigeration sheet 33 are both provided with a magnetic attraction layer 123 in this embodiment. The first heat exchange material layer 121 and the semiconductor refrigeration sheet 33 are magnetically attached through the magnetic attraction layer 123, so that it is easy to carry and quick to assemble.

[0024] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A portable heat exchange device, characterized in that: It includes a device body and a heat exchange module that performs heat exchange through the device body, and the heat exchange module is used to perform heat exchange on a third-party device separately to achieve temperature reduction or temperature control operation; The device body includes a main body casing, at least one refrigeration module installed on the main body casing, and a power supply control module electrically connected to the refrigeration module, wherein the refrigeration module is provided with a fan electrically connected to the power supply control module, a radiator docked to the fan, and a semiconductor refrigeration sheet for heat exchange with the radiator, the heat exchange module includes a heat storage module and an interface material layer for heat exchange with the heat storage module, and heat exchange is achieved between the heat exchange module and the refrigeration module through the contact between the interface material layer and the semiconductor refrigeration sheet; The main casing is provided with at least one module placement compartment, and the main casing is provided with a vent connected to the module placement compartment, the refrigeration module and the heat exchange module are placed in the module placement compartment, the refrigeration module generates a directional fluid that circulates inside and outside the module placement compartment through the vent, and the refrigeration module and the heat exchange module cooperate in heat exchange through the restriction of the module placement compartment.

2. A portable heat exchange device according to claim 1, characterized in that: An openable and closable sliding door is provided on the module placement compartment, and an elastic structure is provided in the module placement compartment. The refrigeration module and the heat exchange module enter the module placement compartment along the openable and closable sliding door, and a thrust toward the elastic structure is applied to the refrigeration module and the heat exchange module through the openable and closable sliding door, so that the interface material layer between the refrigeration module and the heat exchange module is in close contact with the semiconductor refrigeration sheet.

3. A portable heat exchange device according to claim 2, characterized in that: The radiator includes a heat dissipation mainboard and heat dissipation fins formed on the heat dissipation mainboard and arranged at equal distances. A fixing hole penetrating the heat dissipation mainboard and the heat dissipation fins is opened on the radiator, and the fan is installed in the fixing hole.

4. A portable heat exchange device according to claim 3, characterized in that: A first heat-insulating frame is arranged around the periphery of the semiconductor refrigeration sheet, and the first heat-insulating frame and the semiconductor refrigeration sheet are both attached to the heat dissipation mainboard.

5. A portable heat exchange device according to claim 2, characterized in that: The heat storage module includes a hollow shell, a phase change material arranged in the hollow shell, and a second insulation frame surrounding the outer periphery of the hollow shell. A temperature display screen is also arranged on the outside of the hollow shell to display its temperature value, and an interface material layer is attached to the hollow shell.

6. A portable heat exchange device according to claim 2, characterized in that: There are two refrigeration modules and two heat exchange modules, and the main casing is provided with two symmetrical module placement compartments, with a partition between the two module placement compartments, an elastic structure is arranged on the partition, and the side of the main casing relative to the partition is arranged as an openable and closable sliding door.

7. A portable heat exchange device according to claim 6, characterized in that: A power supply module compartment is arranged on the portion of the main shell corresponding to the module placement compartment, and the power supply control module is arranged in the module placement compartment.

8. The portable heat exchange device according to claim 1, characterized in that: The interface material layer has a first heat exchange material layer and a second heat exchange material layer. The heat storage module includes a first water-cooled plate attached to the first heat exchange material layer, a second water-cooled plate attached to the second heat exchange material layer, a water-cooled pipe connected between the first water-cooled plate and the second water-cooled plate to realize water circulation, and a water pump module installed on the first water-cooled plate and providing power to the first water-cooled plate, wherein the first heat exchange material layer is attached to the semiconductor refrigeration plate, and the second heat exchange material layer cooperates with the third-party equipment for heat exchange. The water pump module, the first water-cooled plate, the water-cooled pipe and the second water-cooled plate constitute a water circulation system that acts on the first heat exchange material layer and the second heat exchange material layer respectively.

9. A portable heat exchange device according to claim 8, characterized in that: A magnetic attraction layer is provided on both the first heat exchange material layer and the semiconductor refrigeration sheet, and the first heat exchange material layer and the semiconductor refrigeration sheet are magnetically attached to each other through the magnetic attraction layer.

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