Laser cutting method and device for semiconductor ceramic-based circuit board

Abstract

The present application relates to the field of laser cutting technology, and provides a method and device for laser cutting of semiconductor ceramic-based circuit boards. The method includes constructing a first virtual model corresponding to the circuit board to be cut, and nesting a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; determining a cutting area on the first virtual model based on the second virtual model, and marking the cutting area on the circuit board to be cut; the cutting area includes multiple areas; for each cutting area, a target laser beam diameter corresponding to the cutting area is generated based on a preset laser beam diameter generation algorithm; for each cutting area, a laser cutting device is controlled to cut the cutting area on the circuit board to be cut based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area. The method can ensure the positioning accuracy of the cutting area.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and in particular to a laser cutting method and device for semiconductor ceramic-based circuit boards. Background Art

[0002] With the rapid development of electronic information technology, electronic devices are developing towards high integration, miniaturization and high performance. Semiconductor ceramic-based circuit boards are an important part of electronic devices. High-quality cutting is a key factor in ensuring the quality of electronic devices.

[0003] In recent years, laser cutting technology has been widely used in circuit board manufacturing. Laser cutting has the advantages of non-contact, high precision, and strong controllability, and can effectively avoid problems such as scratches and deformation in traditional cutting methods. However, when cutting complex circuit boards, the existing laser cutting technology is difficult to accurately locate the cutting area. Summary of the invention

[0004] The present application provides a method and device for laser cutting of a semiconductor ceramic-based circuit board to solve the problems raised by the above-mentioned background technology.

[0005] In a first aspect, the present application provides a laser cutting method for a semiconductor ceramic-based circuit board, comprising:

[0006] Determine whether there is a circuit board to be cut on the cutting platform;

[0007] If yes, obtain the identification code of the circuit board to be cut, and obtain the cutting parameter information of the circuit board to be cut in the database based on the identification code;

[0008] Constructing a first virtual model corresponding to the circuit board to be cut, and nesting a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model;

[0009] Determine a cutting area on the first virtual model based on the second virtual model, and mark the cutting area on the circuit board to be cut; the cutting area includes a plurality of areas;

[0010] For each cutting area, a target laser beam diameter corresponding to the cutting area is generated based on a preset laser beam diameter generation algorithm;

[0011] For each of the cutting areas, based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area, the laser cutting device is controlled to cut the cutting area on the circuit board to be cut.

[0012] In a possible implementation, the cutting platform is provided with a pressure sensor, and the step of determining whether there is a circuit board to be cut on the cutting platform includes:

[0013] Obtaining a pressure value through the pressure sensor, and determining whether the pressure value is 0;

[0014] If it is 0, it is determined that there is no circuit board to be cut on the cutting platform;

[0015] If it is not 0, it is determined that there is a circuit board to be cut on the cutting platform.

[0016] In a possible implementation, determining a cutting area on the first virtual model based on the second virtual model, and marking the cutting area on the circuit board to be cut, includes:

[0017] Determining, on the upper surface of the first virtual model, an area that does not overlap with the second virtual model as the cutting area;

[0018] The cutting area is marked on the upper surface of the first virtual model to obtain a cutting area layout diagram, and the cutting area layout diagram is mapped to the upper surface of the circuit board to be cut.

[0019] In a possible implementation, the generating of the target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generating algorithm includes:

[0020] Acquiring a standard incision width of the cutting area, and determining an initial laser beam diameter based on the standard incision width;

[0021] Based on the cutting parameter information and the initial laser beam diameter, the virtual laser cutting device is controlled to cut the cutting area on the first virtual model; the virtual laser cutting device is matched with the laser cutting device;

[0022] Obtaining the incision width after the cutting area is cut;

[0023] The absolute value of the incision width difference between the incision width and the standard incision width is obtained, the absolute value is compared with a preset absolute value, and the target laser beam diameter is determined based on the comparison result.

[0024] In a possible implementation manner, determining the target laser beam diameter based on the comparison result includes:

[0025] If the absolute value is less than the preset absolute value, determining the initial laser beam diameter as the target laser beam diameter;

[0026] If the absolute value is not less than the preset absolute value, Determine the target laser beam diameter; wherein, is the target laser beam diameter, is the initial laser beam diameter, is the incision width, is the standard incision width.

[0027] In a possible implementation, the obtaining the cutting parameter information of the circuit board to be cut in the database based on the identification code includes:

[0028] generating a decryption password based on the identification code;

[0029] Decryption processing is performed on each encrypted text in the database based on the decryption password, and the successfully decrypted encrypted text is determined to be the target text; wherein the target text includes the cutting parameter information.

[0030] In a possible implementation, the identification code includes n letters and n+1 numbers, and generating a decryption password based on the identification code includes:

[0031] Extracting each letter in the identification code in sequence to obtain a letter sequence, and extracting each number in the identification code in sequence to obtain a number sequence;

[0032] Inserting each letter in the letter sequence into the number gaps of the number sequence in order to obtain a character sequence;

[0033] Obtaining a preset coding algorithm matrix; the coding algorithm matrix includes multiple rows and multiple columns, and different coding algorithms are set at various positions of the coding algorithm matrix;

[0034] For each letter in the character sequence, a matrix position corresponding to the letter is determined based on two numbers adjacent to the letter; the number corresponding to the row of the matrix position is the previous number adjacent to the letter, and the number corresponding to the column of the matrix position is the next number adjacent to the letter;

[0035] For each letter in the character sequence, determine the target encoding algorithm corresponding to the letter in the encoding algorithm matrix based on the matrix position corresponding to the letter, and encode the letter based on the target encoding algorithm to obtain the encoding sequence corresponding to the letter;

[0036] For each letter in the character sequence, multiply the numbers adjacent to the letter to obtain a target number corresponding to the letter;

[0037] For each letter in the character sequence, based on the target number corresponding to the letter, the target character is sequentially extracted from the coding sequence corresponding to the letter to obtain the target coding sequence corresponding to the letter; wherein the attribute of the number corresponding to the sequence of the target character in the coding sequence is consistent with the numerical attribute of the target number, and the numerical attribute is a prime number or a composite number;

[0038] The target coding sequences corresponding to the letters are arranged in sequence based on the sequences corresponding to the letters in the letter sequence to obtain the decryption code.

[0039] In a second aspect, the present application provides a laser cutting device for a semiconductor ceramic-based circuit board, comprising:

[0040] A judging module, used for judging whether there is a circuit board to be cut on the cutting platform;

[0041] An acquisition module, used for acquiring an identification code of the circuit board to be cut if there is a circuit board to be cut on the cutting platform, and acquiring cutting parameter information of the circuit board to be cut in a database based on the identification code;

[0042] A construction module, used to construct a first virtual model corresponding to the circuit board to be cut, and to nest a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model;

[0043] A determination module, configured to determine a cutting area on the first virtual model based on the second virtual model, and mark the cutting area on the circuit board to be cut; the cutting area includes a plurality of cutting areas;

[0044] A generating module, for generating, for each cutting area, a target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generating algorithm;

[0045] The control module is used to control the laser cutting device to cut the cutting area on the circuit board to be cut based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area for each cutting area.

[0046] The present application provides a method and device for laser cutting of semiconductor ceramic-based circuit boards, the method comprising: determining whether there is a circuit board to be cut on the cutting platform; if so, obtaining an identification code of the circuit board to be cut, and obtaining cutting parameter information of the circuit board to be cut in a database based on the identification code; constructing a first virtual model corresponding to the circuit board to be cut, and nesting a second virtual model corresponding to a standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model; determining a cutting area on the first virtual model based on the second virtual model, and marking the cutting area on the circuit board to be cut; the cutting area includes multiple areas; for each cutting area, generating a target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generation algorithm; for each cutting area, controlling a laser cutting device to cut the cutting area on the circuit board to be cut based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area. When cutting complex circuit boards, the method can ensure the positioning accuracy of the cutting area, avoid cutting errors caused by inaccurate positioning in traditional methods, help improve cutting quality and accuracy, and avoid material waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0048] Figure 1 A schematic flow chart of a laser cutting method for a semiconductor ceramic-based circuit board provided in an embodiment of the present application;

[0049] Figure 2 A schematic block diagram of the structure of a laser cutting device for a semiconductor ceramic-based circuit board provided in an embodiment of the present application;

[0050] Figure 3 A schematic block diagram of the structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0053] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0054] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0055] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0056] See also Figure 1 , Figure 1 A schematic diagram of a process flow of a laser cutting method for a semiconductor ceramic-based circuit board provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the laser cutting method for a semiconductor ceramic-based circuit board provided in an embodiment of the present application includes steps S1 to S6.

[0057] Step S1, determining whether there is a circuit board to be cut on the cutting platform.

[0058] Specifically, the cutting platform is provided with a pressure sensor, and the method of judging whether there is a circuit board to be cut on the cutting platform comprises the following steps:

[0059] Obtaining a pressure value through the pressure sensor, and determining whether the pressure value is 0;

[0060] If it is 0, it is determined that there is no circuit board to be cut on the cutting platform;

[0061] If it is not 0, it is determined that there is a circuit board to be cut on the cutting platform.

[0062] Step S2: If yes, obtain the identification code of the circuit board to be cut, and obtain the cutting parameter information of the circuit board to be cut in the database based on the identification code.

[0063] Specifically, a QR code is provided on the circuit board to be cut, and the circuit board to be cut is scanned by a preset code scanning device to obtain the identification code. The database is provided with a matching relationship between multiple identification codes and their corresponding cutting parameter information. Based on the identification code, a search is performed in the database to obtain the cutting parameter information of the circuit board to be cut. The cutting parameter information is obtained through experiments. When the circuit board to be cut is cut using the cutting parameter information, cracks or burrs can be prevented from being generated on the cutting edge. The cutting parameter information includes but is not limited to cutting power, cutting speed, and the height of the cutting head from the cutting surface.

[0064] Step S3, constructing a first virtual model corresponding to the circuit board to be cut, and nesting a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model.

[0065] Specifically, the geometric parameter information and material information of the circuit board to be cut are obtained in the database through the identification code, and the first virtual model is constructed based on the geometric parameter information and the material information, the number of the standard circuit board input by the user is obtained, and the second virtual model is obtained in the database based on the number, and the second virtual model is embedded in the first virtual model, and the edge of the first virtual model coincides with the edge of the second virtual model.

[0066] Step S4: determining a cutting area on the first virtual model based on the second virtual model, and marking the cutting area on the circuit board to be cut; the cutting area may include a plurality of cutting areas.

[0067] Specifically, step S4 includes the following steps:

[0068] Determine, on the upper surface of the first virtual model, an area that does not overlap with the second virtual model as the cutting area; specifically, determine, on the upper surface of the first virtual model, an area that does not overlap with the second virtual model as the cutting area based on the color of the first virtual model and the color of the second virtual model;

[0069] The cutting area is marked on the upper surface of the first virtual model to obtain a cutting area layout diagram, and the cutting area layout diagram is mapped to the upper surface of the circuit board to be cut.

[0070] It can be understood that the method provided in step S4, on the one hand, effectively avoids errors caused by manual marking or traditional graphic recognition technology through a color recognition-based method, ensures accurate positioning of the cutting area, and thus improves the overall accuracy of the cutting process; on the other hand, by mapping the cutting area layout diagram to the circuit board to be cut, the cutting equipment can perform efficient cutting according to a predetermined path, reduce unnecessary movement and repeated cutting, improve cutting efficiency, and shorten the production cycle.

[0071] Step S5: for each cutting area, generating a target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generation algorithm.

[0072] Specifically, step S5 includes the following steps:

[0073] Obtaining a standard incision width of the cutting area, and determining an initial laser beam diameter based on the standard incision width; specifically, determining the standard incision width as the initial laser beam diameter;

[0074] Based on the cutting parameter information and the initial laser beam diameter, the virtual laser cutting device is controlled to cut the cutting area on the first virtual model; the virtual laser cutting device is matched with the laser cutting device; specifically, the virtual cutting head of the virtual laser cutting device is placed directly above the cutting area, the height of the virtual cutting head from the cutting area is obtained from the cutting parameter information, and the virtual cutting head is controlled to cut the cutting area on the first virtual model at the cutting power and the cutting speed;

[0075] Obtaining the incision width after the cutting area is cut;

[0076] The absolute value of the incision width difference between the incision width and the standard incision width is obtained, the absolute value is compared with a preset absolute value, and the target laser beam diameter is determined based on the comparison result.

[0077] Wherein, determining the target laser beam diameter based on the comparison result comprises the following steps:

[0078] If the absolute value is less than the preset absolute value, determining the initial laser beam diameter as the target laser beam diameter;

[0079] If the absolute value is not less than the preset absolute value, Determine the target laser beam diameter; wherein, is the target laser beam diameter, is the initial laser beam diameter, is the incision width, is the standard incision width.

[0080] It can be understood that the target laser beam diameter obtained in step S5 is helpful to improve cutting accuracy.

[0081] Step S6: for each cutting area, based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area, control the laser cutting device to cut the cutting area on the circuit board to be cut.

[0082] The method provided in this embodiment can ensure the positioning accuracy of the cutting area when cutting complex circuit boards, avoid cutting errors caused by inaccurate positioning in traditional methods, help improve cutting quality and accuracy, and avoid material waste.

[0083] In some embodiments, obtaining the cutting parameter information of the circuit board to be cut in the database based on the identification code includes the following steps:

[0084] generating a decryption password based on the identification code;

[0085] Decryption processing is performed on each encrypted text in the database based on the decryption password, and the successfully decrypted encrypted text is determined to be the target text; wherein the target text includes the cutting parameter information.

[0086] The identification code includes n letters and n+1 numbers, and the step of generating a decryption password based on the identification code includes the following steps:

[0087] Extracting each letter in the identification code in sequence to obtain a letter sequence, and extracting each number in the identification code in sequence to obtain a number sequence;

[0088] Inserting each letter in the letter sequence into the number gaps of the number sequence in order to obtain a character sequence;

[0089] Obtaining a preset coding algorithm matrix; the coding algorithm matrix includes multiple rows and multiple columns, and different coding algorithms are set at various positions of the coding algorithm matrix;

[0090] For each letter in the character sequence, a matrix position corresponding to the letter is determined based on two numbers adjacent to the letter; the number corresponding to the row of the matrix position is the previous number adjacent to the letter, and the number corresponding to the column of the matrix position is the next number adjacent to the letter;

[0091] For each letter in the character sequence, determine the target encoding algorithm corresponding to the letter in the encoding algorithm matrix based on the matrix position corresponding to the letter, and encode the letter based on the target encoding algorithm to obtain the encoding sequence corresponding to the letter;

[0092] For each letter in the character sequence, multiply the numbers adjacent to the letter to obtain a target number corresponding to the letter;

[0093] For each letter in the character sequence, based on the target number corresponding to the letter, the target character is sequentially extracted from the coding sequence corresponding to the letter to obtain the target coding sequence corresponding to the letter; wherein the attribute of the number corresponding to the sequence of the target character in the coding sequence is consistent with the numerical attribute of the target number, and the numerical attribute is a prime number or a composite number;

[0094] The target coding sequences corresponding to the letters are arranged in sequence based on the sequences corresponding to the letters in the letter sequence to obtain the decryption code.

[0095] The method provided in this embodiment, on the one hand, stores the cutting parameter information in an encrypted text, which can prevent the cutting parameter information from being tampered with by unauthorized personnel, improve the security of the cutting parameter information, and ensure the cutting quality. On the other hand, the method provided in this embodiment for generating a decryption password based on the identification code can increase the difficulty of cracking the decryption password, and further improve the security of the cutting parameter information.

[0096] See also Figure 2 , Figure 2 The structure schematic block diagram of the laser cutting device 100 for semiconductor ceramic-based circuit boards provided in the embodiment of the present application is as follows: Figure 2 As shown, the laser cutting device 100 for semiconductor ceramic-based circuit boards provided in the embodiment of the present application includes:

[0097] The judging module 110 is used to judge whether there is a circuit board to be cut on the cutting platform.

[0098] The acquisition module 120 is used to acquire the identification code of the circuit board to be cut if there is a circuit board to be cut on the cutting platform, and acquire the cutting parameter information of the circuit board to be cut from the database based on the identification code.

[0099] The construction module 130 is used to construct a first virtual model corresponding to the circuit board to be cut, and to nest a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model.

[0100] The determination module 140 is used to determine a cutting area on the first virtual model based on the second virtual model, and mark the cutting area on the circuit board to be cut; the cutting area includes multiple cutting areas.

[0101] The generating module 150 is used to generate, for each cutting area, a target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generating algorithm.

[0102] The control module 160 is used to control the laser cutting device to cut the cutting area on the circuit board to be cut based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area for each cutting area.

[0103] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described device and each module can refer to the process in the aforementioned semiconductor ceramic-based circuit board laser cutting method embodiment, and will not be repeated here.

[0104] The semiconductor ceramic substrate laser cutting device 100 provided in the above embodiment can be implemented in the form of a computer program. The computer program can be used in Figure 3 The system is run on the terminal device 200 shown.

[0105] See also Figure 3 , Figure 3 The present invention provides a schematic block diagram of the structure of a terminal device 200 according to an embodiment of the present application. The terminal device 200 includes a processor 201 and a memory 202. The processor 201 and the memory 202 are connected via a device bus 203, wherein the memory 202 may include a non-volatile storage medium and an internal memory.

[0106] The non-volatile storage medium can store a computer program. The computer program includes program instructions, and when the program instructions are executed by the processor 201, the processor 201 can execute any of the above-mentioned laser cutting methods for semiconductor ceramic-based circuit boards.

[0107] The processor 201 is used to provide computing and control capabilities to support the operation of the entire terminal device 200.

[0108] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor 201, the processor 201 can execute any of the above-mentioned laser cutting methods for semiconductor ceramic-based circuit boards.

[0109] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal device 200 involved in the scheme of the present application. The specific terminal device 200 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0110] It should be understood that the processor 201 may be a central processing unit (CPU), and the processor 201 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0111] In some embodiments, the processor 201 is used to run a computer program stored in the memory to implement the following steps:

[0112] Determine whether there is a circuit board to be cut on the cutting platform;

[0113] If yes, obtain the identification code of the circuit board to be cut, and obtain the cutting parameter information of the circuit board to be cut in the database based on the identification code;

[0114] Constructing a first virtual model corresponding to the circuit board to be cut, and nesting a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model;

[0115] Determine a cutting area on the first virtual model based on the second virtual model, and mark the cutting area on the circuit board to be cut; the cutting area includes a plurality of areas;

[0116] For each cutting area, a target laser beam diameter corresponding to the cutting area is generated based on a preset laser beam diameter generation algorithm;

[0117] For each of the cutting areas, based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area, the laser cutting device is controlled to cut the cutting area on the circuit board to be cut.

[0118] It should be noted that technicians in the relevant field can clearly understand that for the convenience and simplicity of description, the specific working process of the terminal device 200 described above can refer to the process of the laser cutting method of the aforementioned semiconductor ceramic-based circuit board, and will not be repeated here.

[0119] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by one or more processors, the one or more processors implement the laser cutting method of the semiconductor ceramic-based circuit board provided in the embodiment of the present application.

[0120] The computer-readable storage medium may be an internal storage unit of the terminal device 200 in the aforementioned embodiment, such as a hard disk or memory of the terminal device 200. The computer-readable storage medium may also be an external storage device of the terminal device 200, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped with the terminal device 200.

[0121] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A laser cutting method for a semiconductor ceramic-based circuit board, characterized in that: include: Determine whether there is a circuit board to be cut on the cutting platform; If yes, obtain the identification code of the circuit board to be cut, and obtain the cutting parameter information of the circuit board to be cut in the database based on the identification code; Constructing a first virtual model corresponding to the circuit board to be cut, and nesting a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model; Determining a cutting area on the first virtual model based on the second virtual model, and marking the cutting area on the circuit board to be cut; The cutting area includes a plurality of; For each cutting area, a target laser beam diameter corresponding to the cutting area is generated based on a preset laser beam diameter generation algorithm; For each of the cutting areas, based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area, a laser cutting device is controlled to cut the cutting area on the circuit board to be cut; Wherein, the generating of the target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generating algorithm includes: Acquiring a standard incision width of the cutting area, and determining an initial laser beam diameter based on the standard incision width; Based on the cutting parameter information and the initial laser beam diameter, the virtual laser cutting device is controlled to cut the cutting area on the first virtual model; the virtual laser cutting device is matched with the laser cutting device; Obtaining the incision width after the cutting area is cut; Obtaining an absolute value of a difference between the incision width and the standard incision width, comparing the absolute value with a preset absolute value, and determining the target laser beam diameter based on the comparison result; The step of determining the target laser beam diameter based on the comparison result comprises: If the absolute value is less than the preset absolute value, determining the initial laser beam diameter as the target laser beam diameter; If the absolute value is not less than the preset absolute value, Determine the target laser beam diameter; wherein, is the target laser beam diameter, is the initial laser beam diameter, is the incision width, is the standard incision width.

2. The laser cutting method of semiconductor ceramic-based circuit board according to claim 1, characterized in that: The cutting platform is provided with a pressure sensor, and the method of judging whether there is a circuit board to be cut on the cutting platform includes: Obtaining a pressure value through the pressure sensor, and determining whether the pressure value is 0; If it is 0, it is determined that there is no circuit board to be cut on the cutting platform; If it is not 0, it is determined that there is a circuit board to be cut on the cutting platform.

3. The laser cutting method of semiconductor ceramic-based circuit board according to claim 1, characterized in that: The step of determining a cutting area on the first virtual model based on the second virtual model, and marking the cutting area on the circuit board to be cut, includes: Determining, on the upper surface of the first virtual model, an area that does not overlap with the second virtual model as the cutting area; The cutting area is marked on the upper surface of the first virtual model to obtain a cutting area layout diagram, and the cutting area layout diagram is mapped to the upper surface of the circuit board to be cut.

4. The laser cutting method of semiconductor ceramic-based circuit board according to claim 1, characterized in that: The obtaining the cutting parameter information of the circuit board to be cut in the database based on the identification code includes: generating a decryption password based on the identification code; Decryption processing is performed on each encrypted text in the database based on the decryption password, and the successfully decrypted encrypted text is determined to be the target text; wherein the target text includes the cutting parameter information.

5. The laser cutting method of semiconductor ceramic-based circuit board according to claim 4, characterized in that: The identification code includes n letters and n+1 numbers, and the generating of the decryption password based on the identification code includes: Extracting each letter in the identification code in sequence to obtain a letter sequence, and extracting each number in the identification code in sequence to obtain a number sequence; Inserting each letter in the letter sequence into the number gaps of the number sequence in order to obtain a character sequence; Obtaining a preset coding algorithm matrix; the coding algorithm matrix includes multiple rows and multiple columns, and different coding algorithms are set at various positions of the coding algorithm matrix; For each letter in the character sequence, a matrix position corresponding to the letter is determined based on two numbers adjacent to the letter; the number corresponding to the row of the matrix position is the previous number adjacent to the letter, and the number corresponding to the column of the matrix position is the next number adjacent to the letter; For each letter in the character sequence, determine the target encoding algorithm corresponding to the letter in the encoding algorithm matrix based on the matrix position corresponding to the letter, and encode the letter based on the target encoding algorithm to obtain the encoding sequence corresponding to the letter; For each letter in the character sequence, multiply the numbers adjacent to the letter to obtain a target number corresponding to the letter; For each letter in the character sequence, based on the target number corresponding to the letter, the target character is sequentially extracted from the coding sequence corresponding to the letter to obtain the target coding sequence corresponding to the letter; wherein the attribute of the number corresponding to the sequence of the target character in the coding sequence is consistent with the numerical attribute of the target number, and the numerical attribute is a prime number or a composite number; The target coding sequences corresponding to the letters are arranged in sequence based on the sequences corresponding to the letters in the letter sequence to obtain the decryption code.

6. A laser cutting device for semiconductor ceramic-based circuit boards, characterized in that: include: A judging module, used for judging whether there is a circuit board to be cut on the cutting platform; An acquisition module, used for acquiring an identification code of the circuit board to be cut if there is a circuit board to be cut on the cutting platform, and acquiring cutting parameter information of the circuit board to be cut in a database based on the identification code; A construction module, used to construct a first virtual model corresponding to the circuit board to be cut, and to nest a second virtual model corresponding to the standard circuit board in the first virtual model based on a preset nesting method; the color of the first virtual model is different from the color of the second virtual model; A determination module, configured to determine a cutting area on the first virtual model based on the second virtual model, and mark the cutting area on the circuit board to be cut; The cutting area includes a plurality of; A generating module, for generating, for each cutting area, a target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generating algorithm; A control module, for controlling the laser cutting device to cut the cutting area on the circuit board to be cut based on the cutting parameter information and the target laser beam diameter corresponding to the cutting area for each cutting area; Wherein, the generating of the target laser beam diameter corresponding to the cutting area based on a preset laser beam diameter generating algorithm includes: Acquiring a standard incision width of the cutting area, and determining an initial laser beam diameter based on the standard incision width; Based on the cutting parameter information and the initial laser beam diameter, the virtual laser cutting device is controlled to cut the cutting area on the first virtual model; the virtual laser cutting device is matched with the laser cutting device; Obtaining the incision width after the cutting area is cut; Obtaining an absolute value of a difference between the incision width and the standard incision width, comparing the absolute value with a preset absolute value, and determining the target laser beam diameter based on the comparison result; The step of determining the target laser beam diameter based on the comparison result comprises: If the absolute value is less than the preset absolute value, determining the initial laser beam diameter as the target laser beam diameter; If the absolute value is not less than the preset absolute value, Determine the target laser beam diameter; wherein, is the target laser beam diameter, is the initial laser beam diameter, is the incision width, is the standard incision width.

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