A display panel and display device

Abstract

This invention discloses a display panel and a display device. The display panel includes a substrate comprising a first main surface and a second main surface disposed opposite to each other, and a side surface connecting the first and second main surfaces. A plurality of connecting portions are disposed on the first main surface. At least one connecting portion includes a first connecting portion and a second connecting portion connected together, the second connecting portion being located on the side of the first connecting portion closer to the side surface. The display panel also includes a plurality of side traces, each side trace being at least partially disposed on the side surface. The side traces overlap with the second connecting portions. Along a first direction, the maximum width of the first connecting portion is different from the maximum width of the second connecting portion. Thus, when the second connecting portion overlaps with the side traces, redundant space can be formed in the first direction, reducing the positioning accuracy requirement for alignment between the second connecting portion and the side traces, and improving the yield of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0002] Existing frameless display panels, due to their frameless design, lack the stepped structure found in traditional display panels around their perimeter. Instead, they feature side signal lead-out pads on the bottom edge for transmitting and receiving all the drive signals required for display. These side signal lead-out pads are paired with side traces, which guide the signals to the back of the display panel for bonding.

[0003] Currently, when side signal lead-out pads are overlapped with side traces, the alignment accuracy is poor, resulting in poor electrical connection stability between side traces and side signal lead-out pads. Summary of the Invention

[0004] The present invention provides a display panel display device. By setting the maximum width of the first connecting portion to be different from the maximum width of the second connecting portion along the first direction, redundant space can be formed in the first direction when the second connecting portion overlaps with the side wiring. This reduces the positioning accuracy requirement of the second connecting portion and the side wiring during alignment and improves the yield of the display panel.

[0005] In a first aspect, embodiments of the present invention provide a display panel, comprising:

[0006] The substrate includes a first main surface and a second main surface disposed opposite to each other, and a side surface connecting the first main surface and the second main surface;

[0007] Multiple connecting portions are disposed on the first main surface; at least one connecting portion includes a first connecting portion and a second connecting portion, wherein the second connecting portion is located on the side of the first connecting portion near the side surface;

[0008] Multiple side traces are at least partially disposed on the side surface; the side traces overlap with the second connecting portion; along a first direction, the maximum width of the first connecting portion is different from the maximum width of the second connecting portion, wherein the first direction intersects with the extension direction of the side traces.

[0009] Secondly, embodiments of the present invention also provide a display device, including the display panel provided in any embodiment of the first aspect of the present invention.

[0010] The display panel provided in this embodiment of the invention includes at least one connecting portion comprising a first connecting portion and a second connecting portion, wherein the second connecting portion is located on the side of the first connecting portion near the side surface, and the connecting portion overlaps with the side trace through the second connecting portion. Furthermore, by setting the maximum width of the first connecting portion to be different from the maximum width of the second connecting portion, the maximum width of the second connecting portion can be increased or decreased. Thus, when the second connecting portion overlaps with the side trace, the change in the maximum width of the second connecting portion and the side trace creates a redundant space in the first direction. When there is a positioning error between the second connecting portion and the side trace in the first direction, due to the redundant space, the width of the actual overlapping area between the second connecting portion and the side trace can still meet the connection requirements of the second connecting portion and the side trace, reducing the positioning accuracy requirements during alignment of the second connecting portion and the side trace, and improving the yield of the display panel. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0012] Figure 2 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention;

[0013] Figure 3 yes Figure 2 An enlarged schematic diagram of region A in the middle;

[0014] Figure 4 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0015] Figure 5 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0016] Figure 6 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0017] Figure 7 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0018] Figure 8 yes Figure 7 A schematic diagram of a cross-section along the B-B' direction;

[0019] Figure 9 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0020] Figure 10 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0021] Figure 11 yes Figure 10 A schematic diagram of a cross-section along line C-C';

[0022] Figure 12 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0023] Figure 13 yes Figure 12 A schematic diagram of a cross section along line D-D';

[0024] Figure 14 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0025] Figure 15 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0026] Figure 16 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0027] Figure 17 yes Figure 2 Another enlarged schematic diagram of region A in the middle;

[0028] Figure 18 This is a schematic diagram of another display panel provided in an embodiment of the present invention;

[0029] Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings in the embodiments of this invention, through specific implementation methods. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort fall within the protection scope of this invention.

[0031] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. See also: Figure 1The display panel includes a substrate 10, which includes a first main surface 110 and a second main surface 120 disposed opposite to each other, and a side surface 130 connecting the first main surface 110 and the second main surface 120. The display panel also includes a plurality of connecting portions 20 disposed on the first main surface 110. At least one connecting portion 20 includes a first connecting portion 210 and a second connecting portion 220 connected together. The second connecting portion 220 is located on the side of the first connecting portion 210 near the side surface 130. The display panel also includes a plurality of side traces 30, at least a portion of which is disposed on the side surface 130. The side traces 30 overlap with the second connecting portions 220. Along a first direction X, the maximum width of the first connecting portion 210 is different from the maximum width of the second connecting portion 220, wherein the first direction X intersects the extension direction of the side traces 30.

[0032] For example, such as Figure 1 As shown, the display panel includes a first main surface 110, a second main surface 120, and multiple side surfaces 130. The first main surface 110 and the second main surface 120 are disposed opposite to each other, and both the first main surface 110 and the second main surface 120 are adjacent to the multiple side surfaces 130. The first main surface 110 can be the light-emitting side surface of the display panel, that is, the first main surface 110 includes a display area, which includes multiple light-emitting elements 140, and the image is displayed by emitting light through the multiple light-emitting elements 140. The first main surface 110 of the display panel is also provided with multiple signal lines 150. The signal lines 150 can include at least one of scan signal lines, data signal lines, positive power signal lines, negative power signal lines, and reset signal lines. The signal lines 150 are electrically connected to the light-emitting elements 140, thereby providing various driving signals required for the light-emitting elements 140 to emit light, so as to ensure the normal operation of the light-emitting elements 140. The second main surface 120 of the display panel can be the back surface of the display panel, that is, the second main surface 120 of the display panel is the non-light-emitting side surface of the display panel. A flexible circuit board (not shown in the figure) can be disposed on the second main surface 120. The flexible circuit board can provide various driving signals for the signal line 150. Specifically, the first main surface 110 also includes multiple connecting portions 20. The connecting portions 20 can be connecting pads. The connecting portions 20 are located on the side of the light-emitting element 140 near the side surface 130, that is, the connecting portions 20 are located in the first main surface 110 near the side surface 130, thereby facilitating the electrical connection between the light-emitting element 140 in the first main surface 110 and one end of the side trace 30 through the connecting portions 20, realizing the signal transmission between the light-emitting element 140 and the side trace 30. The other end of the side trace 30 is bonded to the flexible circuit board of the second main surface 120 to realize the signal transmission between the flexible circuit board and the side trace 30.

[0033] In existing technologies, the width of the side trace is basically the same as the width of the connecting pad. When aligning and overlapping the side trace and the connecting pad, the alignment accuracy between the side trace and the connecting pad is limited, which leads to the risk of misalignment. That is, the alignment of the side trace and the connecting pad is prone to deviation, resulting in a smaller actual overlap area between the side trace and the connecting pad. This increases the contact resistance between the side trace and the connecting pad, and may even cause an open circuit between the side trace and the connecting pad, resulting in poor electrical stability of the trace.

[0034] Therefore, in this embodiment of the invention, at least one connecting portion 20 is provided, including a first connecting portion 210 and a second connecting portion 220 electrically connected. The second connecting portion 220 is located on the side of the first connecting portion 210 near the side surface 130, and the side trace 30 overlaps with the second connecting portion 220. Furthermore, along the first direction X, the maximum width of the second connecting portion 220 is set to be different from the maximum width of the first connecting portion 210, thereby increasing or decreasing the maximum width of the second connecting portion. For example, along the first direction X, the maximum width of the second connecting portion 220 can be set to be greater than the maximum width of the first connecting portion 210. This is equivalent to increasing the width of the overlap portion with the side trace 30 on the basis of the originally uniformly arranged connecting portions, so that the width of the formed second connecting portion 220 is greater than the width of the side trace 30. Alternatively, along the first direction X, the maximum width of the second connecting portion 220 can be set to be less than the maximum width of the first connecting portion 210. This is equivalent to reducing the width of the overlap portion with the side trace 30 based on the originally uniformly distributed connecting portions, so that the width of the formed second connecting portion 220 is less than the width of the side trace 30. In this way, when the second connecting portion 220 overlaps with the side trace 30, the change in the maximum width of the second connecting portion 220 (the increase or decrease in width) and the side trace 30 form redundant space in the first direction X. When there is a positioning error between the second connecting portion 220 and the side trace 30 in the first direction X, due to the existence of redundant space, the actual overlap width of the second connecting portion 220 and the side trace 30 can still meet the connection requirements of the second connecting portion 220 and the side trace 30. This allows the connection between the second connecting portion 220 and the side trace 30 to have good physical and electrical connection stability, and also increases the maximum positioning error of the second connecting portion 220 and the side trace 30 in the first direction X, reducing the positioning accuracy requirements of the manufacturing process and improving the yield of the display panel.

[0035] It should be noted that, Figure 1The example described is only exemplified by the fact that the maximum width of the second connecting portion 220 is less than the maximum width of the first connecting portion 210, but this is not a limitation. In other embodiments, the maximum width of the second connecting portion 220 may also be greater than the maximum width of the first connecting portion 210. Those skilled in the art can set it as needed.

[0036] It should also be noted that the side trace 30 overlaps with the second connection portion 220, that is, along the thickness direction of the display panel, the side trace 30 and the second connection portion 220 overlap at least partially to ensure the stability of the electrical connection between the side trace 30 and the second connection portion 220.

[0037] In summary, this embodiment of the invention increases or decreases the maximum width of the second connecting portion by setting the maximum width of the second connecting portion to be different from the maximum width of the first connecting portion along the first direction. Thus, when the second connecting portion overlaps with the side trace, the change in the maximum width of the second connecting portion and the side trace create a redundant space in the first direction. When there is a positioning error between the second connecting portion and the side trace in the first direction, due to the existence of the redundant space, the actual overlap width of the second connecting portion and the side trace can still meet the connection requirements of the second connecting portion and the side trace. This reduces the contact resistance between the second connecting portion and the side trace, increases the maximum positioning error of the second connecting portion and the side trace in the first direction, reduces the positioning accuracy requirements of the manufacturing process, and improves the yield of the display panel.

[0038] Optional, Figure 2 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention. See also... Figure 2 Along the first direction X, the maximum width of the second connecting portion 220 is greater than the maximum width of the first connecting portion 210.

[0039] For example, such as Figure 2In the illustrated embodiment, the maximum width of the second connecting portion 220 is greater than the maximum width of the first connecting portion 210. This can be understood as follows: based on the existing uniformly arranged connecting portions, the maximum width of the portion overlapping with the side wiring 30 is increased to form the second connecting portion 220, and the maximum width of the portion not overlapping with the side wiring 30 is decreased to form the first connecting portion 210. This results in the connecting portion 20 forming a convex structure that is narrower at the top and wider at the bottom. Thus, by increasing the width of the overlap between the connecting portion 20 and the side wiring 30, the width of the formed second connecting portion 220 is greater than the width of the side wiring 30. When the second connecting portion 220 overlaps with the side wiring 30, the increased width of the second connecting portion 220 and the side wiring 30 create redundant space in the first direction X. When there is a positioning error between the second connecting portion 220 and the side trace 30 in the first direction X, due to the existence of redundant space, the actual overlap width of the second connecting portion 220 and the side trace 30 can still meet the connection requirements of the second connecting portion 220 and the side trace 30. This allows the connection between the second connecting portion 220 and the side trace 30 to have good physical and electrical connection stability, thereby improving the yield of the display panel.

[0040] Optional, Figure 3 yes Figure 2 An enlarged schematic diagram of region A in the middle. See also... Figure 2 and Figure 3 The display panel also includes at least one insulating layer 40 located on one side of the substrate 10. The insulating layer 40 includes a boundary 50 near the side surface 130. Along the thickness direction of the display panel, the first connecting portion 210 overlaps with at least one boundary 50.

[0041] Specifically, such as Figure 2 and Figure 3 As shown, the isolation layer 40 can be an insulating layer used to separate different metal film layers. The isolation layer 40 includes a boundary 50 near the side surface 130. It should be noted that when setting the isolation layer 40, it can extend along the second direction Y from the edge region of the display panel where the connecting portion 20 is located to the other side of the display panel, or it can extend from one side of the display panel to the edge region of the display panel where the connecting portion 20 is located. The second direction Y is the extension direction of the side trace 30. This embodiment of the invention does not limit the extension direction of the insulating layer 40; those skilled in the art can set it as needed. It is understood that regardless of which direction the isolation layer 40 extends, it includes a boundary 50 near the side surface 130. In other words, the boundary 50 is the boundary line of the isolation layer 40 near the connecting portion 20. The boundary 50 is the dividing line used to distinguish whether or not the isolation layer 40 is provided. Figure 3In the illustrated embodiment, no isolation layer 40 is provided below the boundary 50, but an isolation layer 40 is provided above the boundary 50. Consequently, the height of the area above the boundary 50 differs from the height of the area below the boundary 50, creating a step at that location. The first connecting portion 210 overlaps with at least one boundary 50, meaning a portion of the first connecting portion 210 is positioned on the step. This makes it easy for metal residue to remain at the step location during the etching process of forming the first connecting portion 210. If the width of the first connecting portion 210 at the boundary 50 is large, the spacing between adjacent first connecting portions 210 is small, making it easy for them to come into contact with the residual metal at the step location, causing a short circuit. Therefore, in this embodiment of the invention, the maximum width of the first connecting portion 210 along the first direction X is less than the maximum width of the second connecting portion 220. This is equivalent to reducing the maximum width of the portion of the connecting portion that does not overlap with the side trace 30 to form the first connecting portion 210, based on the original uniformly arranged connecting portions. In other words, the maximum width of the first connecting portion 210 is reduced, thereby increasing the spacing between two adjacent first connecting portions 210. This avoids short circuits caused by residual metal at the step position connecting two adjacent first connecting portions 210, further improving the yield of the display panel.

[0042] It should be noted that, Figure 3 The illustration only exemplifies the case where isolation layer 40 includes a single isolation layer, and is not intended to limit the scope. In other embodiments, the display panel may include multiple isolation layers. For example, based on the above embodiments, Figure 4 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also Figure 2 and Figure 4 The display panel further includes at least one isolation layer 40 located on one side of the substrate 10. The isolation layer 40 includes a first isolation layer 410 and a second isolation layer 420 stacked together, with the first isolation layer 410 located on the side of the second isolation layer 420 closest to the substrate 10. The first isolation layer 410 includes a first boundary 510 near the side surface 130, and the second isolation layer 420 includes a second boundary 520 near the side surface, with the first boundary 510 located on the side of the second boundary 520 closest to the side surface 130. The display panel also includes a step region S1, with the first boundary 510 and the second boundary 520 disposed in the step region S1, and at least a portion of the first connecting portion 210 disposed in the step region S1.

[0043] Specifically, such as Figure 4In the illustrated embodiment, at least one isolation layer 40 includes a first isolation layer 410 and a second isolation layer 420. Along the thickness direction of the display panel, the first isolation layer 410 and the second isolation layer 420 at least partially overlap, and the first isolation layer 410 is located on the side of the second isolation layer 420 closest to the substrate 10. The boundary 50 includes a first boundary 510 and a second boundary 520. Both the first boundary 510 and the second boundary 520 are formed extending from the central region of the display panel to the edge region of the display panel. Specifically, the boundary of the first isolation layer 410 closest to the side surface 130 is the first boundary 510, and the boundary of the second isolation layer 420 closest to the side surface 130 is the second boundary 520. In other words, the first boundary 510 is the boundary line of the first isolation layer 410 closest to the connecting portion 20, and the second boundary 520 is the boundary line of the second isolation layer 420 closest to the connecting portion 20. The first boundary 510 is located on the side of the second boundary 520 closest to the side surface 130, meaning that a portion of the first isolation layer 410 is exposed between the first boundary 510 and the second boundary 520. In addition, the display panel also includes a stepped area S1, with a first boundary 510 and a second boundary 520 disposed in the stepped area S1.

[0044] For example, such as Figure 4 In the illustrated embodiment, the area where the first boundary 510 extends downward by a predetermined distance and the area where the second boundary 520 extends upward by a predetermined distance is designated as the step area S1. Furthermore, along the thickness direction of the display panel, both the first boundary 510 and the second boundary 520 at least partially overlap with the first connecting portion 210, and neither the first boundary 510 nor the second boundary 520 overlaps with the second connecting portion 220, thus placing at least a portion of the first connecting portion 210 within the step area S1. In this way, by setting the maximum width of the first connecting portion 210 to be less than the maximum width of the second connecting portion 220, the maximum width of the first connecting portion 210 is reduced, thereby increasing the spacing between adjacent first connecting portions 210. This prevents short circuits caused by residual metal conduction between adjacent first connecting portions 210 and the step area S1, further improving the yield of the display panel.

[0045] It should be noted that one side of the substrate 10 may include a first metal layer, a first interlayer insulating layer, a second metal layer, a second interlayer insulating layer, a third metal layer, a third interlayer insulating layer, and a fourth metal layer stacked together. Specifically, the first insulating layer 410 can be the second interlayer insulating layer, and the second insulating layer 420 can be the third interlayer insulating layer. Specifically, the second interlayer insulating layer can be a first planarization layer, and the third interlayer insulating layer can be the second planarization layer. It is understood that since both the first and second planarization layers contain organic materials, to prevent the organic materials from flowing to the edge area of ​​the display panel and causing it to be uncut, the first and second planarization layers are prematurely terminated at the edge of the display panel, thus forming the first boundary 510 and the second boundary 520.

[0046] Optionally, based on the above embodiments, see also... Figure 4 The maximum spacing between two adjacent second connecting portions 220 is L1, where L1 < 10 μm. The minimum spacing between two adjacent first connecting portions 210 is L2, where L2 > 40 μm.

[0047] Specifically, such as Figure 4 As shown, by increasing the maximum width of the second connecting portion 220 in the first direction X, redundant space is formed between the second connecting portion 220 and the side trace 30 in the first direction X, thereby reducing the contact resistance between the second connecting portion 220 and the side trace 30. Furthermore, this embodiment of the invention sets the maximum spacing L1 between two adjacent second connecting portions 220 to be less than 10 μm, thus increasing the width of the second connecting portion 220 sufficiently to further reduce the contact resistance between the second connecting portion 220 and the side trace 30. In addition, Figure 4 In the illustrated embodiment, the maximum width of the first connecting portion 210 in the first direction X is reduced to increase the spacing between two adjacent first connecting portions 210, thereby preventing short circuits caused by residual metal in the step region S1. Based on this, the inventors discovered that by setting the minimum spacing L2 between two adjacent first connecting portions 210 to be greater than 40 μm, the spacing between two adjacent first connecting portions 210 can be increased sufficiently. In other words, the maximum width of the first connecting portion 210 is reduced sufficiently to further prevent short circuits caused by residual metal in the step region S1.

[0048] Optionally, in the above embodiments, the connecting portion 20 is described as a "convex" structure, but the embodiments of the present invention are not limited to this. In other embodiments, Figure 5 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also... Figure 5 Along the direction from the first connecting portion 210 to the second connecting portion 220, the width of the connecting portion 20 gradually changes in the first direction X. That is, the first connecting portion 210 and the second connecting portion 220 form a "quasi-trapezoidal" structure. Figure 5The example described uses a "quasi-trapezoidal" structure, where the maximum width of the second connecting portion 220 is greater than the maximum width of the first connecting portion 210, i.e., narrower at the top and wider at the bottom. However, this is not a limitation. In other embodiments, the maximum width of the second connecting portion 220 can be set to be less than the maximum width of the first connecting portion 210, i.e., forming a "quasi-trapezoidal" structure that is wider at the top and narrower at the bottom. In this way, by setting the width of the first connecting portion 210 and the second connecting portion 220 to gradually change at the junction, the large width difference between the first connecting portion 210 and the second connecting portion 220 at the junction can be avoided, which could easily lead to breakage.

[0049] Optional, Figure 6 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also... Figure 6 The connection portion 20 includes a connection pad 200, which includes an i-th layer pad Xi and a j-th layer pad Xj stacked and electrically connected. The j-th layer pad Xj is located on the side of the i-th layer pad Xi away from the substrate. i and j are both positive integers. Along the thickness direction of the display panel, the j-th layer pad Xj covers the i-th layer pad Xi.

[0050] For example, such as Figure 6 In the illustrated embodiment, the connection pad 200 includes three pad layers as an example. Specifically, the connection pad 200 includes a first pad layer X1, a second pad layer X2, and a third pad layer X3. The first pad layer X1 is located on the side of the second pad layer X2 closest to the substrate, and the first pad layer X1 is electrically connected to the second pad layer X2. Furthermore, along the thickness direction of the display panel, the second pad layer X2 covers the first pad layer X1, meaning the area of ​​the second pad layer X2 is larger than the area of ​​the first pad layer X1. This prevents the upper pad layer from being etched onto the lower pad layer during the etching process, thus avoiding over-etching. The second pad layer X2 is located on the side of the third pad layer X3 closest to the substrate, and the second pad layer X2 is electrically connected to the third pad layer X3. Similarly, along the thickness direction of the display panel, the third solder pad layer X3 covers the second solder pad layer X2, that is, the area of ​​the third solder pad layer X3 is larger than the area of ​​the second solder pad layer X2, thereby preventing over-etching and damage to the lower solder pad layer.

[0051] Optionally, based on the above embodiments, see also... Figure 6 The connection pad 200 includes a multilayer of pads X that are stacked and electrically connected. The area of ​​the multilayer pads X gradually increases along the direction from the substrate towards the connection pad 200. For example, as... Figure 6In the illustrated embodiment, the multi-layer solder pad layer X includes a first solder pad layer X1, a second solder pad layer X2, and a third solder pad layer X3. Along the direction from the first solder pad layer X1 to the third solder pad layer X3, the area of ​​the multi-layer solder pad layer X gradually increases. On the one hand, by setting the area of ​​the upper solder pad layer X to be larger than that of the lower solder pad layer, over-etching is prevented, avoiding damage to the lower solder pad layer. On the other hand, the gradual change in the area of ​​the solder pad layer X allows for a smaller area difference between adjacent solder pad layers X, thereby reducing the production cost of the connection portion 20.

[0052] Optional, Figure 7 yes Figure 2 Another enlarged schematic diagram of region A in the middle. Figure 8 yes Figure 7 A schematic diagram of a cross-section along the B-B' direction. See also... Figure 7 and Figure 8 The connection portion 20 includes connection pads 200, which include multiple layers X of pads stacked together. Adjacent pad layers X are electrically connected through connection vias 60. Along the thickness direction of the display panel, the connection vias 60 do not overlap with the first connection portion 210.

[0053] Specifically, such as Figure 8 In the illustrated embodiment, the bonding pad 200 includes a first bonding pad layer X1 and a second bonding pad layer X2 stacked together. The first bonding pad layer X1 is located on the side of the second bonding pad layer X2 closest to the substrate 10, and the first bonding pad layer X1 is electrically connected to the second bonding pad layer X2 through a bonding via 60. (Continue to see...) Figure 7 The connecting portion 20 also includes a first connecting portion 210 and a second connecting portion 220 for electrical connection. Along the thickness direction of the display panel, the second connecting portion 220 overlaps with the connecting via 60, while the first connecting portion 210 does not overlap with the connecting via 60. In other words, in the second connecting portion 220, the first pad layer X1 is electrically connected to the second pad layer X2 through the connecting via 60, while in the first connecting portion 210, no connecting via 60 is provided between the first pad layer X1 and the second pad layer X2. This simplifies the arrangement of the connecting via 60 while ensuring electrical connection of multiple pad layers X.

[0054] Optionally, based on the above implementation, see [link to relevant documentation]. Figure 2 and Figure 7The connection portion 20 includes connection pads 200, which include multiple pad layers X stacked together. Adjacent pad layers X are electrically connected through connection vias 60. The display panel also includes at least one isolation layer 40 located on one side of the substrate 10, the isolation layer 40 including a boundary 50 near the side surface 130. The display panel also includes a step region S1, at least one boundary 50 located in the step region S1. At least a portion of the first connection portion 210 is disposed in the step region S1, and the connection vias 60 do not overlap with the step region S1 along the thickness direction of the display panel.

[0055] For example, such as Figure 7 In the illustrated embodiment, the boundary of the first isolation layer 410 near the side surface 130 is designated as the first boundary 510, and the boundary of the second isolation layer 420 near the side surface 130 is designated as the second boundary 520. The area extending downwards from the first boundary 510 by a predetermined distance and the area extending upwards from the second boundary 520 by a predetermined distance are defined as the step region S1. Since at least a portion of the first connecting portion 210 is located in the step region S1, and the step region S1 contains film layers of varying heights, the fabrication of the connecting via 60 presents a significant challenge when it is placed on the first connecting portion 210 of the step region S1. Therefore, this embodiment of the invention simplifies the fabrication of the connecting via 60 by setting it so that it does not overlap with the step region S1; that is, the connecting via 60 is placed on the second connecting portion 220 that does not overlap with the step region S1.

[0056] Optional, Figure 9 yes Figure 2 Another enlarged schematic diagram of region A in the middle, see [link to diagram]. Figure 9 The connection portion 20 includes connection pads 200, which include multiple layers X of pads stacked together. Adjacent pad layers X are electrically connected through connection vias 60. Along the thickness direction of the display panel, the connection vias 60 at least partially overlap with the first connection portion 210. For example, Figure 9 In the illustrated embodiment, the connection pad 200 includes a first pad layer X1 and a second pad layer X2 stacked together. The first pad layer X1 is located on the side of the second pad layer X2 closest to the substrate 10, and the first pad layer X1 is electrically connected to the second pad layer X2 through a connection via 60. The connection portion 20 also includes a first connection portion 210 and a second connection portion 220 electrically connected. Along the thickness direction of the display panel, the second connection portion 220 overlaps with the connection via 60, and the first connection portion 210 overlaps with the connection via 60, thereby ensuring that in both the second connection portion 220 and the first connection portion 210, there are connection vias 60 to achieve electrical connection between the first pad layer X1 and the second pad layer X2, reducing the contact resistance between the first pad layer X1 and the second pad layer X2, and ensuring that the connection portion 20 has good performance.

[0057] Optional, Figure 10 yes Figure 2 Another enlarged schematic diagram of region A in the middle. Figure 11 yes Figure 10 A schematic diagram of a cross-section along line C-C'. See also... Figure 10 and Figure 11 The connecting pads 200 include a stacked pad layer Xm (m+1), a pad layer X(m+1), and a pad layer X(m+2), where m is a positive integer. The pad layer Xm is electrically connected to the pad layer X(m+1) via a first connecting via 610, and the pad layer X(m+1) is electrically connected to the pad layer X(m+2) via a second connecting via 620. The first connecting via 610 and the second connecting via 620 are staggered along the thickness direction of the display panel.

[0058] For example, such as Figure 10 and Figure 11 In the illustrated embodiment, the connection pad 200 includes three pad layers as an example. Specifically, the connection pad 200 includes a first pad layer X1, a second pad layer X2, and a third pad layer X3. The first pad layer X1 is located on the side of the second pad layer X2 closest to the substrate, and the second pad layer X2 is located on the side of the third pad layer X3 closest to the substrate. That is, the first pad layer X1 is the lowest layer in the multi-layer pad structure, and the third pad layer X3 is the highest layer. The first pad layer X1 is electrically connected to the second pad layer X2 through a first connection via 610. In other words, along the thickness direction of the display panel, the first pad layer X1 covers multiple first connection vias 610. The second solder pad layer X2 is electrically connected to the third solder pad layer X3 through the second connection via 620. In other words, along the thickness direction of the display panel, the second solder pad layer X2 covers multiple second connection vias 620. Furthermore, since the first connection via 610 and the second connection via 620 are used to achieve electrical connections between different film layers, the first connection via 610 and the second connection via 620 are staggered along the thickness direction of the display panel. This avoids the problem of poor film layer flatness and electrical connection stability caused by the first connection via 610 and the second connection via 620 being located at the same position on different film layers.

[0059] It should be noted that, in one embodiment, Figure 12 yes Figure 2 Another enlarged schematic diagram of region A in the middle. Figure 13 yes Figure 12 A schematic diagram of a cross-section along line D-D'. For example... Figure 12 and Figure 13 In the illustrated embodiment, the connection pad 200 includes four pad layers as an example. Specifically, the connection pad 200 includes a first pad layer X1, a second pad layer X2, a third pad layer X3, and a fourth pad layer X4. The first pad layer X1 is located on the side of the second pad layer X2 closest to the substrate 10, the second pad layer X2 is located on the side of the third pad layer X3 closest to the substrate 10, and the third pad layer X3 is located on the side of the fourth pad layer X4 closest to the substrate 10. That is, the first pad layer X1 is the lowest layer in the multi-layer pad structure, and the fourth pad layer X4 is the highest layer. It should be noted that an insulating layer is provided between adjacent pad layers. In this embodiment, electrical connection between adjacent pad layers is achieved by providing connection vias. For example, the first pad layer X1 is electrically connected to the second pad layer X2 through a first connection via 610. The second solder pad layer X2 is electrically connected to the third solder pad layer X3 through the second connecting via 620, and the third solder pad layer X3 is electrically connected to the fourth solder pad layer X4 through the third connecting via 630. Furthermore, since the first connecting via 610, the second connecting via 620, and the third connecting via 630 are used to achieve electrical connections between different film layers, for example, along the thickness direction of the display panel, the first connecting via 610 and the second connecting via 620 can be staggered, and the second connecting via 620 and the third connecting via 630 can be staggered. Alternatively, along the thickness direction of the display panel, any two of the first connecting via 610, the second connecting via 620, and the third connecting via 630 can be staggered, thereby avoiding the problem of poor film layer flatness and electrical connection stability when the first connecting via 610, the second connecting via 620, and the third connecting via 630 are all located at the same position on different film layers.

[0060] Optionally, based on the above embodiments, Figure 14 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also... Figure 14 The display panel also includes a third isolation layer 430 located on the side of the connection pad 200 away from the substrate 10. The third isolation layer 430 contacts and covers at least a portion of the edge region of the first connection portion 210.

[0061] For example, such as Figure 14In the illustrated embodiment, the display panel includes a first isolation layer 410, a second isolation layer 420, and a third isolation layer 430 located on one side of the substrate 10. The bonding pad 200 includes a pad layer X. The first isolation layer 410 is located on the side of the second isolation layer 420 closest to the substrate 10. The pad layer X is disposed on the side of the second isolation layer 420 furthest from the first isolation layer 410. The third isolation layer 430 is disposed on the pad layer X. When at least a portion of the first connection portion 210 is located in the step region S1, since the boundary lines of the first connection portion 210, the first isolation layer 410, and the second isolation layer 420 overlap, the third isolation layer 430 can be configured to contact and cover at least a portion of the edge region of the first connection portion 210, thereby providing a protective edge for at least a portion of the first connection portion 210. For example, the first isolation layer 410, the second isolation layer 420, and the third isolation layer 430 can be respectively a first planarization layer, a second planarization layer, and a protective layer. In this way, the first isolation layer 410 and the second isolation layer 420 can be covered by the third isolation layer 430 and the first connecting portion 210, avoiding the leakage of the first isolation layer 410 and the second isolation layer 420, and improving the reliability of the display panel.

[0062] It should be noted that one side of the substrate 10 may include a first metal layer, a first interlayer insulating layer, a second metal layer, a second interlayer insulating layer, a third metal layer, a third interlayer insulating layer, a fourth metal layer, and a fourth interlayer insulating layer stacked together. Specifically, the third isolation layer 430 can be the fourth interlayer insulating layer, and more specifically, the fourth interlayer insulating layer can be a passivation layer.

[0063] Optional, Figure 15 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also... Figure 15 The connection portion 20 includes a first metal layer 201 and a second metal layer 202 stacked together. The first metal layer 201 is located on the side of the second metal layer 202 closer to the substrate, and the first metal layer 201 and the second metal layer 202 are electrically connected in contact. Along the first direction X, the width of the first metal layer 201 is smaller than the width of the second metal layer 202. At least a portion of the first metal layer 201 forms a first connection portion 210, and at least a portion of the second metal layer 202 forms a second connection portion 220.

[0064] Specifically, such as Figure 15 As shown, the connection portion 20 includes a connection pad 200. The connection pad 200 includes a multi-layered pad layer X. One pad layer X includes a first metal layer 201 and a second metal layer 202 stacked together, with the first metal layer 201 located on the side of the second metal layer 202 closer to the substrate, and the first metal layer 201 and the second metal layer 202 in direct contact and electrical connection. Figure 13In the illustrated embodiment, along the thickness direction of the display panel, the first metal layer 201 and the second metal layer 202 overlap, and the first metal layer 201 and the second metal layer 202 are electrically connected through the overlapping portion. Specifically, along the first direction X, the width of the first metal layer 201 is smaller than the width of the second metal layer 202. Therefore, the portion of the first metal layer 201 that is offset from the second metal layer 202 can be designated as the first connection portion 210, while the second metal layer 202 can be designated as the second connection portion 220. This ensures that the width of the second connection portion 220 is greater than the width of the first connection portion 210, guaranteeing good physical and electrical connection stability at the connection point between the second connection portion 220 and the side trace 30.

[0065] Optionally, based on the above embodiments, Figure 16 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also... Figure 16 The connection portion 20 includes a first connection pad 20A and a second connection pad 20B. Along the first direction X, the maximum width of the second connection portion 220 in the first connection pad 20A is greater than the maximum width of the first connection portion 210, and the maximum width of the second connection portion 220 in the second connection pad 20B is less than the maximum width of the first connection portion 210. Along the first direction X, the first connection pad 20A and the second connection pad 20B are spaced apart.

[0066] Specifically, such as Figure 2 and Figure 16 As shown, in the first connection pad 20A, the maximum width of the second connection portion 220 in the first direction X is greater than the maximum width of the first connection portion 210 in the first direction X. Therefore, by increasing the width of the second connection portion 220, the first connection pad 20A creates redundant space in the first direction X when the second connection portion 220 overlaps with the side trace 30. In the second connection pad 20B, the maximum width of the second connection portion 220 in the first direction X is less than the maximum width of the first connection portion 210 in the first direction X. Therefore, by decreasing the width of the second connection portion 220, the first connection pad 20A creates redundant space in the first direction X when the second connection portion 220 overlaps with the side trace 30. Along the first direction X, the first connecting pad 20A and the second connecting pad 20B are arranged alternately. That is, along the first direction X, the width of the second connecting portion 220 among the multiple connecting pads 200 is alternately increased and decreased. In this way, the space utilization rate when setting the connecting pads 200 can be increased, and the setting density of the connecting portion 20 is guaranteed.

[0067] Optional, Figure 17 yes Figure 2 Another enlarged schematic diagram of region A in the middle. See also... Figure 17 The connecting portion 20 also includes a third connecting portion 230 located on the side of the second connecting portion 220 opposite to the first connecting portion 210. Along the first direction X, the width of the second connecting portion 220 is between the width of the first connecting portion 210 and the width of the third connecting portion 230. For example, as... Figure 17 In the embodiment shown, the connecting portion 20 further includes a third connecting portion 230. Along the direction from the first connecting portion 210 to the third connecting portion 230, the widths of the multiple connecting portions gradually change. That is, the width of the second connecting portion 220 is the transition width from the width of the first connecting portion 210 to the width of the third connecting portion 230, so as to avoid a large width difference between the first connecting portion 210 and the second connecting portion 220 when the width changes, which would easily lead to breakage.

[0068] Optionally, based on the above embodiments, Figure 18 This is a schematic diagram of another display panel provided in an embodiment of the present invention. See also... Figure 18 The side trace 30 includes a first side trace portion 310 disposed on the first main surface 110 and a second side trace portion 320 disposed on the side surface 130. The first side trace portion 310 and the second side trace portion 320 are electrically connected. The first side trace portion 310 overlaps with the second connecting portion 220, and the line width of the first side trace portion 310 is smaller than the line width of the second side trace portion 320.

[0069] Specifically, such as Figure 18 As shown, the side trace 30 overlaps with the second connecting portion 220 via the first side trace portion 310 located on the first main surface 110. Furthermore, by setting the line width of the first side trace portion 310 to be smaller than the line width of the second side trace portion 320, the line width of the first side trace portion 310 is reduced. Thus, when the second connecting portion 220 overlaps with the first side trace portion 310, the reduced width of the first side trace portion 310 and the second connecting portion 220 form redundant space in the first direction X, further increasing the maximum positioning error between the second connecting portion 220 and the first side trace portion 310 in the first direction X. This reduces the positioning accuracy requirements of the manufacturing process and improves the yield of the display panel.

[0070] It should be noted that, Figure 18The example given is that the line width of the first side routing portion 310 is smaller than the line width of the second side routing portion 320. However, the present invention is not limited to this. In other embodiments, the line width of the first side routing portion 310 can be set to be greater than the line width of the second side routing portion 320 to increase the line width of the first side routing portion 310. In this way, the increased width of the first side routing portion 310 and the second connecting portion 220 form redundant space in the first direction X, which further increases the maximum positioning error between the second connecting portion 220 and the first side routing portion 310 in the first direction X, reduces the positioning accuracy requirements of the manufacturing process, and improves the yield of the display panel.

[0071] Based on the same inventive concept, embodiments of the present invention also provide a display device. Figure 19 This is a schematic diagram of a display device provided in an embodiment of the present invention. Figure 19 As shown, the display device includes the display panel 01 in the above embodiments. This display device includes the display panel 01 of any embodiment of the present invention; therefore, the display device provided by the embodiments of the present invention possesses the corresponding beneficial effects of the display panel 01 provided by the embodiments of the present invention, which will not be elaborated further here. For example, the display device can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device; the embodiments of the present invention do not limit this.

[0072] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: The substrate includes a first main surface and a second main surface disposed opposite to each other, and a side surface connecting the first main surface and the second main surface; Multiple connecting portions are disposed on the first main surface; at least one connecting portion includes a first connecting portion and a second connecting portion, wherein the second connecting portion is located on the side of the first connecting portion near the side surface; Multiple side traces are at least partially disposed on the side surface; The side wiring overlaps with the second connecting section; Along a first direction, the maximum width of the first connecting portion is different from the maximum width of the second connecting portion, wherein the first direction intersects with the extension direction of the side trace; Along the first direction, the maximum width of the second connecting portion is greater than the maximum width of the first connecting portion; The display panel further includes at least one insulating layer located on one side of the substrate; The isolation layer includes a first isolation layer and a second isolation layer stacked together, wherein the first isolation layer is located on the side of the second isolation layer closer to the substrate; The first isolation layer includes a first boundary near the side surface, and the second isolation layer includes a second boundary near the side surface, wherein the first boundary is located on the side of the second boundary near the side surface; The display panel further includes a stepped area, wherein the first boundary and the second boundary are disposed in the stepped area; and at least a portion of the first connecting portion is disposed in the stepped area.

2. The display panel according to claim 1, characterized in that, The connection portion includes a connection pad, which includes an i-th layer and a j-th layer of pads stacked and electrically connected. The j-th layer of pads is located on the side of the i-th layer of pads away from the substrate. i and j are both positive integers. Along the thickness direction of the display panel, the j-th layer of pads covers the i-th layer of pads.

3. The display panel according to claim 2, characterized in that, The connecting pads include multiple layers of pads that are stacked and electrically connected; Along the direction from the substrate to the bonding pads, the area of ​​the multiple bonding pad layers gradually increases.

4. The display panel according to claim 1, characterized in that, The connection portion includes a connection pad, which includes multiple layers of pads stacked together, and adjacent pads are electrically connected through a connection via. Along the thickness direction of the display panel, the connecting via does not overlap with the first connecting portion.

5. The display panel according to claim 1, characterized in that, The connection portion includes a connection pad, which includes multiple layers of pads stacked together, and adjacent pads are electrically connected through a connection via. Along the thickness direction of the display panel, the connecting via does not overlap with the stepped area.

6. The display panel according to claim 1, characterized in that, The connection portion includes a connection pad, which includes multiple layers of pads stacked together, with adjacent pads electrically connected via a connection via. Along the thickness direction of the display panel, the connection via at least partially overlaps with the first connection portion.

7. The display panel according to claim 4 or 5, characterized in that, The connection pads include a stacked pad layer of the mth layer, the (m+1)th layer, and the (m+2)th layer, where m is a positive integer; The m-th solder pad layer and the (m+1)-th solder pad layer are electrically connected through a first connection via, and the (m+1)-th solder pad layer and the (m+2)-th solder pad layer are electrically connected through a second connection via; Along the thickness direction of the display panel, the first connection via and the second connection via are staggered.

8. The display panel according to claim 1, characterized in that, The connection portion includes a connection pad, and the display panel further includes a third isolation layer located on the side of the connection pad away from the substrate; The third isolation layer contacts and covers at least a portion of the edge region of the first connection segment.

9. The display panel according to claim 1, characterized in that, The side trace includes a first side trace portion disposed on the first main surface and a second side trace portion disposed on the side surface, wherein the first side trace portion and the second side trace portion are electrically connected. The first side routing section overlaps with the second connecting section, and the line width of the first side routing section is smaller than the line width of the second side routing section.

10. The display panel according to claim 1, characterized in that, The maximum spacing between two adjacent second connecting segments is less than 10 μm.

11. The display panel according to claim 1, characterized in that, The minimum spacing between two adjacent first connecting segments is greater than 40 μm.

12. The display panel according to claim 1, characterized in that, The connecting portion includes a first metal layer and a second metal layer stacked together. The first metal layer is located on the side of the second metal layer closer to the substrate, and the first metal layer and the second metal layer are electrically connected in contact. Along the first direction, the width of the first metal layer is smaller than the width of the second metal layer; At least a portion of the first metal layer forms the first connection portion, and at least a portion of the second metal layer forms the second connection portion.

13. The display panel according to claim 1, characterized in that, Along the direction from the first connecting portion to the second connecting portion, the width of the connecting portion gradually changes in the first direction.

14. The display panel according to claim 1, characterized in that, The connection portion includes a first connection pad and a second connection pad; along the first direction, the maximum width of the second connection portion in the first connection pad is greater than the maximum width of the first connection portion, and the maximum width of the second connection portion in the second connection pad is less than the maximum width of the first connection portion; Along the first direction, the first connection pad and the second connection pad are spaced apart.

15. The display panel according to claim 1, characterized in that, The connecting portion further includes a third connecting portion located on the side of the second connecting portion opposite to the first connecting portion; Along the first direction, the width of the second connecting portion is between the width of the first connecting portion and the width of the third connecting portion.

16. A display device, characterized in that, Includes the display panel as described in any one of claims 1-15.

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