Temperature acquisition system, thermosensitive module, communication system, electronic chip and electronic equipment

Abstract

The invention provides a temperature acquisition system, a thermosensitive module, a communication system, an electronic chip and electronic equipment, and the temperature acquisition system can acquire a small minimum value of a temperature measurement value representing the temperature of a first thermosensitive device, i.e., the temperature acquisition resolution of the temperature acquisition system is high. And the temperature acquisition precision of the temperature acquisition system is improved. The temperature acquisition system may include a sampling circuit and a processing module. The sampling circuit may include a first sampling circuit and a second sampling circuit. The first sampling circuit can comprise a first resistor unit and a second thermosensitive device and is used for outputting a first voltage. The second sampling circuit can comprise a second resistor unit and a third thermosensitive device and is used for outputting a second voltage. The processing module may be configured to output a temperature measurement representative of a temperature of the first thermal device based on the first voltage and the second voltage.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and more specifically, to a temperature acquisition system, a thermistor module, a communication system, an electronic chip and an electronic device. Background Art

[0002] With the rapid development of thermosensitive materials such as copper oxide and iron oxide, the first thermosensitive devices such as crystal oscillators (XO) and power amplifiers (PA) using thermosensitive materials have been widely used. Since the frequency accuracy, adjustment frequency difference and other parameters of the crystal resonator XO and the quiescent current and output power of the power amplifier PA are significantly affected by temperature, it is necessary to collect the temperature measurement value representing the temperature of the first thermosensitive device, and then compensate for the parameters that change with temperature.

[0003] Related technologies often collect temperature measurement values ​​through a temperature acquisition system. The temperature acquisition system may include a fixed resistor and a second thermistor connected in series. Among them, the second thermistor may be in contact with the first thermistor, or have a certain distance from the first thermistor. The resistance of the second thermistor may change with the change of the temperature of the first thermistor, thereby obtaining a temperature measurement value. The voltage after voltage division can be output by the fixed resistor and the second thermistor. By deriving the corresponding relationship between the voltage and the temperature, the corresponding relationship between the slope of the voltage and the temperature (which may be called the voltage-temperature slope) can be obtained, and the temperature measurement value can be obtained by the voltage-temperature slope and the voltage. It can be seen that the voltage-temperature slope obtained by the related technology through the fixed resistor and the second thermistor is a negative number, and its absolute value is small, so that the minimum value of the temperature measurement value that the temperature acquisition system can collect is large, that is, the temperature acquisition resolution of the temperature acquisition system is low, which leads to low temperature acquisition accuracy of the temperature acquisition system.

[0004] Therefore, there is an urgent need for a technical solution that can improve the temperature acquisition accuracy of the temperature acquisition system. Summary of the invention

[0005] The present application provides a temperature acquisition system, a thermistor module, a communication system, an electronic chip and an electronic device. The minimum value of the temperature measurement value representing the temperature of the first thermistor device that can be acquired by the temperature acquisition system is small, that is, the temperature acquisition resolution of the temperature acquisition system is high, thereby improving the temperature acquisition accuracy of the temperature acquisition system.

[0006] The present application provides a temperature acquisition system, which may include a sampling circuit and a processing module.

[0007] The sampling circuit may include a first sampling circuit and a second sampling circuit.

[0008] The first sampling circuit may include a first resistor unit and a second thermal sensor. The first end of the first resistor unit may be used to receive a first reference voltage. The second end of the first resistor unit may be electrically connected to the first end of the second thermal sensor. The second end of the second thermal sensor may be electrically connected to a ground terminal. The second end of the first resistor unit and the first end of the second thermal sensor may serve as output ends of the first sampling circuit for outputting a first voltage.

[0009] Similarly, the second sampling circuit may include a second resistor unit and a third thermal sensor. The first end of the third thermal sensor may be used to receive the second reference voltage. The second end of the third thermal sensor may be electrically connected to the first end of the second resistor unit. The second end of the second resistor unit may be electrically connected to the ground terminal. The second end of the third thermal sensor and the first end of the second resistor unit may serve as the output end of the second sampling circuit for outputting the second voltage.

[0010] The processing module may be configured to output a temperature measurement value representing a temperature of the first thermal-sensitive device according to the first voltage and the second voltage.

[0011] The temperature acquisition system provided in the present application outputs a first voltage and a second voltage through an acquisition circuit including a second thermistor and a third thermistor, and outputs a temperature measurement value through a processing module, thereby improving the temperature acquisition resolution of the temperature acquisition system and further improving the temperature acquisition accuracy of the temperature acquisition system.

[0012] In one example, the sampling circuit can be located near the first thermistor, and the second thermistor and the third thermistor in the sampling circuit can be in contact with the first thermistor to maximize the temperature sampling accuracy of the temperature sampling system. Of course, the second thermistor and the third thermistor can also have a certain distance from the first thermistor. The distances between the second thermistor and the third thermistor and the first thermistor can be as equal as possible to ensure that as the temperature measurement value changes, the changes in the resistance values ​​of the second thermistor and the third thermistor are as equal as possible, thereby improving the temperature sampling accuracy of the temperature sampling system.

[0013] In another example, the second thermosensitive device and the third thermosensitive device may be located inside the same chip, and the first thermosensitive device and the chip including the second thermosensitive device and the third thermosensitive device may be packaged in the same packaging structure.

[0014] In a possible implementation, the first resistor unit may include one or more first fixed resistors connected in parallel. That is, the first resistor unit includes multiple first fixed resistors, and the multiple first fixed resistors may be connected in parallel. Of course, the multiple first fixed resistors may also be electrically connected in series or in a combination of series and parallel, which is not limited in this application.

[0015] Furthermore, the first resistor unit may further include a plurality of first switches. The plurality of first switches and the first fixed resistors may be connected in series one by one to form a plurality of first series branches. The plurality of first series branches may be connected in parallel.

[0016] It is conceivable that the corresponding first fixed resistor can be connected by closing the first switch, and the corresponding first fixed resistor can be disconnected by opening the first switch. In other words, the resistance value of the first resistor unit can be adjusted by switching the state of the first switch.

[0017] In another possible implementation, the second resistor unit may include one or more second fixed resistors connected in parallel. Of course, the plurality of second fixed resistors may also be electrically connected in series or in a combination of series and parallel, which is not limited in the present application.

[0018] Furthermore, the second resistor unit further includes a plurality of second switches. The plurality of second switches and the plurality of second fixed resistors can be connected in series one by one to form a plurality of second series branches. The plurality of second series branches can be connected in parallel.

[0019] It is conceivable that the corresponding second fixed resistor can be connected by closing the second switch, and the corresponding second fixed resistor can be disconnected by opening the second switch. In other words, the resistance value of the second resistor unit can be adjusted by switching the state of the second switch.

[0020] Exemplarily, the second thermosensitive device and the third thermosensitive device may both be negative temperature coefficient (NTC) thermistors (may be referred to as NTC thermistors).

[0021] Optionally, the first switch and the second switch can be controlled to achieve the equality of the resistance of the first resistor unit, the resistance of the second resistor unit, the resistance of the second thermistor and the resistance of the third thermistor, so that the minimum value of the temperature measurement value that can be collected by the temperature acquisition system can be minimized to the maximum extent, that is, the temperature acquisition resolution of the temperature acquisition system is improved, thereby greatly improving the temperature acquisition accuracy of the temperature acquisition system.

[0022] In a possible implementation, the processing module may include an analog-to-digital converter and a processor.

[0023] Optionally, the analog-to-digital converter can be used to calculate the voltage difference between the first voltage and the second voltage to obtain a third voltage, and convert the third voltage into a fourth voltage. The third voltage can be an analog voltage, and the fourth voltage can be a digital voltage. It can be seen that the analog-to-digital converter plays a role in converting the analog voltage into a digital voltage.

[0024] The processor may be used to obtain a temperature measurement value according to the fourth voltage and the corresponding relationship between the voltage and the temperature. The corresponding relationship between the voltage and the temperature may be embodied in a form of a table or a curve, etc., which is not limited in this application.

[0025] Optionally, the first temperature-sensitive device may be a crystal oscillator (XO) or a power amplifier (PA).

[0026] In one example, the first thermosensitive device may be a crystal resonator. It can be seen that the temperature acquisition system can realize the acquisition of the temperature measurement value of the crystal resonator.

[0027] Then, the processor can also be used to: obtain the frequency deviation of the first thermosensitive device according to the temperature measurement value and the corresponding relationship between the frequency deviation and the temperature, and compensate the operating frequency of the first thermosensitive device according to the frequency deviation of the first thermosensitive device. In other words, the processor can compensate the operating frequency of the crystal resonator according to the temperature measurement value of the crystal resonator.

[0028] Exemplarily, the corresponding relationship between the frequency deviation and the temperature may be presented in the form of a table or a curve, etc., which is not limited in the present application.

[0029] In another example, the first thermosensitive device may be a power amplifier. It can be seen that the temperature acquisition system can realize the acquisition of the temperature measurement value of the power amplifier.

[0030] Then, the processor can also be used to: obtain the output power deviation of the first thermosensitive device according to the temperature measurement value and the corresponding relationship between the output power deviation and the temperature, and compensate the output power of the first thermosensitive device according to the output power deviation. In other words, the processor can compensate the output power of the power amplifier according to the temperature measurement value of the power amplifier.

[0031] Exemplarily, the corresponding relationship between the output power deviation and the temperature may also be expressed in the form of a table or a curve, etc., which is not limited in the present application.

[0032] In a second aspect, the present application provides a thermistor module, which may include a first thermistor device and a sampling circuit.

[0033] The sampling circuit may include a first sampling circuit and a second sampling circuit.

[0034] The first sampling circuit may include a first resistor unit and a second thermal sensor. The first end of the first resistor unit may be used to receive a first reference voltage. The second end of the first resistor unit may be electrically connected to the first end of the second thermal sensor. The second end of the second thermal sensor may be electrically connected to a ground terminal. The second end of the first resistor unit and the first end of the second thermal sensor may serve as output ends of the first sampling circuit for outputting a first voltage.

[0035] Similarly, the second sampling circuit may include a second resistor unit and a third thermal sensor. The first end of the third thermal sensor may be used to receive the second reference voltage. The second end of the third thermal sensor may be electrically connected to the first end of the second resistor unit. The second end of the second resistor unit may be electrically connected to the ground terminal. The second end of the third thermal sensor and the first end of the second resistor unit may serve as the output end of the second sampling circuit for outputting the second voltage.

[0036] Optionally, the first voltage and the second voltage may be used to obtain a temperature measurement representative of the temperature of the first thermally sensitive device.

[0037] The first reference voltage and the second reference voltage may be equal, that is, both may be equal to the preset reference voltage. Of course, the first reference voltage and the second reference voltage may also be unequal, which is not limited in this application.

[0038] Optionally, the second end of the second thermistor can be electrically connected to the second end of the second resistor unit to form a first port of the sampling circuit, and the first port is used to be electrically connected to the ground terminal. The output end of the first sampling circuit can be used as the second port of the sampling circuit to output the first voltage. Similarly, the output end of the second sampling circuit can be used as the third port of the sampling circuit to output the second voltage.

[0039] When the first reference voltage and the second reference voltage are equal, the first end of the first resistor unit can be electrically connected to the first end of the third thermosensitive device to form a fourth port of the sampling circuit for receiving a preset reference voltage. When the first reference voltage and the second reference voltage are not equal, the first end of the first resistor unit can be used as the fourth port of the sampling circuit for receiving the first reference voltage; the first end of the third thermosensitive device can be used as the fifth port of the sampling circuit for receiving the second reference voltage.

[0040] Optionally, the sampling circuit may be configured to output a first voltage and a second voltage according to the second thermosensitive device and the third thermosensitive device.

[0041] In one example, the sampling circuit can be located near the first thermistor, and the second thermistor and the third thermistor in the sampling circuit can be in contact with the first thermistor to maximize the temperature sampling accuracy of the temperature sampling system. Of course, the second thermistor and the third thermistor can also have a certain distance from the first thermistor. The distances between the second thermistor and the third thermistor and the first thermistor can be as equal as possible to ensure that as the temperature measurement value changes, the changes in the resistance values ​​of the second thermistor and the third thermistor are as equal as possible, thereby improving the temperature sampling accuracy of the temperature sampling system.

[0042] In another example, the second thermosensitive device and the third thermosensitive device may be located inside the same chip, and the first thermosensitive device and the chip including the second thermosensitive device and the third thermosensitive device may be packaged in the same packaging structure.

[0043] In a possible implementation, the first resistor unit may include one or more first fixed resistors connected in parallel. That is, the first resistor unit includes multiple first fixed resistors, and the multiple first fixed resistors may be connected in parallel. Of course, the multiple first fixed resistors may also be electrically connected in series or in a combination of series and parallel, which is not limited in this application.

[0044] Furthermore, the first resistor unit may further include a plurality of first switches. The plurality of first switches and the first fixed resistors may be connected in series one by one to form a plurality of first series branches. The plurality of first series branches may be connected in parallel.

[0045] It is conceivable that the corresponding first fixed resistor can be connected by closing the first switch, and the corresponding first fixed resistor can be disconnected by opening the first switch. In other words, the resistance value of the first resistor unit can be adjusted by switching the state of the first switch.

[0046] In another possible implementation, the second resistor unit may include one or more second fixed resistors connected in parallel. Of course, the plurality of second fixed resistors may also be electrically connected in series or in a combination of series and parallel, which is not limited in the present application.

[0047] Furthermore, the second resistor unit further includes a plurality of second switches. The plurality of second switches and the plurality of second fixed resistors can be connected in series one by one to form a plurality of second series branches. The plurality of second series branches can be connected in parallel.

[0048] It is conceivable that the corresponding second fixed resistor can be connected by closing the second switch, and the corresponding second fixed resistor can be disconnected by opening the second switch. In other words, the resistance value of the second resistor unit can be adjusted by switching the state of the second switch.

[0049] Exemplarily, the second thermosensitive device and the third thermosensitive device may both be negative temperature coefficient (NTC) thermistors (may be referred to as NTC thermistors).

[0050] Optionally, the first switch and the second switch can be controlled to achieve that the resistance of the first resistor unit, the resistance of the second resistor unit, the resistance of the second thermistor and the resistance of the third thermistor are equal, so that the temperature acquisition system can acquire the minimum value of the temperature measurement value as small as possible, that is, to improve the temperature acquisition resolution of the temperature acquisition system, thereby greatly improving the temperature acquisition accuracy of the temperature acquisition system.

[0051] In a third aspect, the present application further provides a communication system, which may include a first thermosensitive device and a temperature acquisition system provided by the first aspect and possible implementations thereof, wherein the temperature acquisition system may be used to acquire a temperature measurement value representing the temperature of the first thermosensitive device.

[0052] In a possible implementation, the first temperature-sensitive device may be a crystal resonator. The communication system may further include a clock circuit.

[0053] Optionally, the clock circuit can be used to: drive a crystal resonator.

[0054] The crystal resonator can be used to: output a first clock signal to the clock circuit under the drive of the clock circuit.

[0055] The clock circuit can also be used to amplify and filter (which can be understood as shaping) the first clock signal to obtain a second clock signal and transmit it to the temperature acquisition system. It can be seen that the clock circuit can provide the second clock signal for the temperature acquisition system.

[0056] In another possible implementation, the first heat-sensitive device may be a power amplifier. The communication system may further include an antenna.

[0057] Optionally, the power amplifier may be used to amplify the power of a first radio frequency signal from the temperature acquisition system to obtain a second radio frequency signal and transmit the second radio frequency signal to the antenna.

[0058] The antenna can be used to: transmit a second radio frequency signal.

[0059] That is, the temperature acquisition system can send the first radio frequency signal to the power amplifier. The power amplifier can amplify the power of the first radio frequency signal, and the second radio frequency signal obtained by the processing can be transmitted through the antenna.

[0060] Furthermore, the communication system may further include a memory. The memory may be used to store the corresponding relationship between voltage and temperature, the corresponding relationship between frequency deviation and temperature, and the corresponding relationship between output power deviation and temperature. Of course, the memory may also be used to store the fourth voltage and the parameters of the first thermal sensitive device, etc., which is not limited in this application.

[0061] In a fourth aspect, the present application provides an electronic chip that may include the temperature acquisition system provided by the first aspect and possible implementations thereof.

[0062] Optionally, the electronic chip may further include passive components, and the passive components may be electrically connected to the temperature acquisition system.

[0063] Furthermore, the passive device may be a resistor, a capacitor, etc., which is not limited in this application.

[0064] In a fifth aspect, the present application provides an electronic device that may include the communication system provided by the third aspect and its possible implementation methods.

[0065] Optionally, the electronic device may further include a power supply system. The power supply system may be electrically connected to the communication system to supply power to the communication system.

[0066] Optionally, the electronic device may be a mobile phone, a vehicle-mounted device, a wireless terminal access device (customer premises, CPE) and a handheld wireless terminal, etc. Among them, the vehicle-mounted device may be a vehicle-mounted entertainment device and a vehicle-mounted control device, etc. This application does not limit the type of electronic device.

[0067] It should be understood that the second to fifth aspects of the present application are consistent with the technical solutions of the first aspect of the present application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation methods are similar and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0069] Figure 1 A schematic structural diagram of a temperature acquisition system 10 in an embodiment of the present application;

[0070] Figure 2 Another schematic structural diagram of the temperature acquisition system 10 in the embodiment of the present application;

[0071] Figure 3Schematic diagram of the corresponding relationship between the frequency deviation △f1 and the temperature T1 in the embodiment of the present application;

[0072] Figure 4 Schematic diagram of the corresponding relationship between the output power deviation △P and the temperature T2 in the embodiment of the present application;

[0073] Figure 5 Schematic diagram of the corresponding relationship between voltage V and temperature T in the embodiment of the present application;

[0074] Figure 6 Schematic diagram of the first slope k1 and the second slope k2 in the embodiment of the present application;

[0075] Figure 7 Schematic diagram of the corresponding relationship between voltage V and temperature T in the embodiment of the present application;

[0076] Figure 8 Schematic diagram of the first slope k1, the second slope k2 and the third slope k3 in the embodiment of the present application;

[0077] Fig. 9 is a schematic structural diagram of a thermal module 20 in an embodiment of the present application;

[0078] Fig.10 Another schematic structural diagram of the thermal module 20 in the embodiment of the present application;

[0079] Fig.11 is a schematic structural diagram of a communication system 100 in an embodiment of the present application;

[0080] Fig.12 is another schematic structural diagram of the communication system 100 in an embodiment of the present application;

[0081] Fig.13 This is another schematic structural diagram of the communication system 100 in an embodiment of the present application. DETAILED DESCRIPTION

[0082] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0083] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0084] The terms "first", "second", etc. in the specification embodiments, claims, and drawings of the present application are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, including a series of steps or units. The method, system, product, or device is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0085] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0086] With the rapid development of thermosensitive materials such as copper oxide and iron oxide, the first thermosensitive devices such as crystal oscillators (XOs) and power amplifiers (PAs) using thermosensitive materials have been widely used. Since the frequency accuracy and adjustment frequency difference of the crystal resonator and the quiescent current and output power of the power amplifier are significantly affected by temperature, it is necessary to collect the temperature measurement value representing the temperature of the first thermosensitive device, and then compensate for the parameters that change with temperature.

[0087] The related art often collects temperature measurement values ​​through a temperature acquisition system. The temperature acquisition system may include a fixed resistor and a second thermistor Rth2 connected in series. Among them, the second thermistor Rth2 may be in contact with the first thermistor, or have a certain distance from the first thermistor. The resistance of the second thermistor Rth2 may change with the change of the temperature of the first thermistor, and then the temperature measurement value is obtained through the second thermistor Rth2. The voltage after voltage division can be output through the fixed resistor and the second thermistor. By deriving the corresponding relationship between the voltage V and the temperature T (which can be called the VT corresponding relationship), the corresponding relationship between the slope of the voltage V and the temperature T (which can be called the voltage V-temperature T slope) can be obtained, and the temperature measurement value can be obtained through the voltage V-temperature T slope and the voltage after voltage division. The voltage V-temperature T slope obtained by the related art is a negative number, and its absolute value is small, so that the minimum value of the temperature measurement value that can be collected by the temperature acquisition system is large, that is, the temperature acquisition resolution of the temperature acquisition system is low, which leads to low temperature acquisition accuracy of the temperature acquisition system.

[0088] In order to overcome the above shortcomings, the present application embodiment provides a temperature acquisition system, such as Figure 1 and Figure 2 The temperature acquisition system 10 may include a sampling circuit 1 and a processing module 2 .

[0089] The sampling circuit 1 may include a first sampling circuit 11 and a second sampling circuit 12 .

[0090] The first sampling circuit 11 may include a first resistor unit 111 and a second thermal sensor Rth2. The first end of the first resistor unit 111 may be used to receive a first reference voltage (which may be V REF1 denoted by ). The second end of the first resistor unit 111 may be electrically connected to the first end of the second thermosensitive device Rth2. The second end of the second thermosensitive device Rth2 may be electrically connected to the ground terminal. The second end of the first resistor unit 111 and the first end of the second thermosensitive device Rth2 may serve as output ends of the first sampling circuit 11, and may be used to output a first voltage (which may be denoted by V1).

[0091] Similarly, the second sampling circuit 12 may include a second resistor unit 121 and a third thermal sensor Rth3. The first end of the third thermal sensor Rth3 may be used to receive a second reference voltage (which may be V REF2 In which, V REF1 With V REF2The second end of the third thermal sensor Rth3 can be electrically connected to the first end of the second resistor unit 121. The second end of the second resistor unit 121 can be electrically connected to the ground terminal. The second end of the third thermal sensor Rth3 and the first end of the second resistor unit 121 can serve as output ends of the second sampling circuit 12, and can be used to output a second voltage (which can be represented by V2).

[0092] The second thermosensitive device Rth2 and the third thermosensitive device Rth3 can be connected to the first thermosensitive device ( Figure 1 and Figure 2 The resistance values ​​of the second thermosensitive device Rth2 and the third thermosensitive device Rth3 may both change with the temperature of the first thermosensitive device.

[0093] Therefore, the sampling circuit 1 can be used to output the first voltage V1 and the second voltage V2 according to the second thermosensitive device Rth2 and the third thermosensitive device Rth3 .

[0094] The processing module 2 may be configured to output a temperature measurement value representing the temperature of the first thermosensitive device according to the first voltage V1 and the second voltage V2.

[0095] The temperature acquisition system 10 provided in the embodiment of the present application outputs a first voltage V1 and a second voltage V2 through an acquisition circuit 1 including a second thermistor Rth2 and a third thermistor Rth3, and outputs a temperature measurement value through a processing module 2, thereby improving the temperature acquisition resolution of the temperature acquisition system 10 and thereby improving the temperature acquisition accuracy of the temperature acquisition system 10.

[0096] In one example, the sampling circuit 1 may be located near the first thermosensitive device, and the second thermosensitive device Rth2 and the third thermosensitive device Rth3 in the sampling circuit 1 may be in contact with the first thermosensitive device, and both may have a certain distance from the first thermosensitive device. The distances between the second thermosensitive device Rth2 and the third thermosensitive device Rth3 and the first thermosensitive device may be as equal as possible to ensure that as the temperature measurement value changes, the changes in the resistance values ​​of the second thermosensitive device Rth2 and the third thermosensitive device Rth3 are as equal as possible, thereby improving the temperature sampling accuracy of the temperature sampling system 10.

[0097] In another example, the second thermosensitive device Rth2 and the third thermosensitive device Rth3 may be located inside the same chip, and the first thermosensitive device and the chip or device including the second thermosensitive device Rth2 and the third thermosensitive device Rth3 may be packaged in the same packaging structure. Optionally, the first thermosensitive device may be integrated with the second thermosensitive device Rth2 and the third thermosensitive device Rth3 in the same chip.

[0098] In a possible implementation, the first resistor unit 111 may include a first fixed resistor R1. Figure 1 The first end of the first fixed resistor R1 can be used to receive the first reference voltage V REF1 , the second end of the first fixed resistor R1 can be electrically connected to the first end of the second thermal sensor Rth2. The second end of the second thermal sensor Rth2 can be electrically connected to the ground terminal. The second end of the first fixed resistor R1 and the first end of the second thermal sensor Rth2 can serve as output ends of the first sampling circuit 11, and can be used to output the first voltage V1.

[0099] In another possible implementation, the first resistor unit 111 may also include a first fixed resistor R11, a first fixed resistor R12, and a first fixed resistor R13, a total of a plurality of first fixed resistors. Figure 2 As shown. The first fixed resistor R11, the first fixed resistor R12 and the first fixed resistor R13 can be connected in parallel to form multiple first parallel branches, and multiple first parallel branches can be connected in parallel. Of course, the first fixed resistor R11, the first fixed resistor R12 and the first fixed resistor R13 can also be electrically connected in series or in a combination of series and parallel, which is not limited in the embodiment of the present application.

[0100] Further, refer to Figure 2 The first resistor unit 111 may further include a first switch S11, a first switch S12, and a first switch S13, a total of a plurality of first switches. The first switch S11, the first switch S12, and the first switch S13 may be connected in series with the first fixed resistor R11, the first fixed resistor R12, and the first fixed resistor R13 in a one-to-one correspondence to form a plurality of first series branches, and the plurality of first series branches may be connected in parallel.

[0101] It is conceivable that the corresponding first fixed resistors R11, R12 and R13 are connected by closing the first switch S11, S12 and S13, and the corresponding first fixed resistors R11, R12 and R13 are cut out by opening the first switch S11, S12 and S13. In other words, the resistance value of the first resistor unit 111 can be adjusted by switching the states of the first switch S11, S12 and S13.

[0102] In another possible implementation, the second resistor unit 121 may include a second fixed resistor R2. Figure 1 The first end of the second fixed resistor R2 can be electrically connected to the second end of the third thermal sensor Rth3, and can be used as the output end of the second sampling circuit 12 to output the second voltage V2. The second end of the second fixed resistor R2 can be electrically connected to the ground end.

[0103] In another possible implementation, the second resistor unit 121 may also include a second fixed resistor R21, a second fixed resistor R22, and a second fixed resistor R23, a total of a plurality of second fixed resistors. Figure 2 As shown. The second fixed resistor R21, the second fixed resistor R22, and the second fixed resistor R23 can be connected in parallel to form a plurality of second parallel branches, and the plurality of second parallel branches can be connected in parallel. Of course, the second fixed resistor R21, the second fixed resistor R22, and the second fixed resistor R23 can also be electrically connected in series or in a combination of series and parallel, which is not limited in the embodiment of the present application.

[0104] Further, refer to Figure 2 The second resistor unit 121 may further include a second switch S21, a second switch S22, and a second switch S23. The second switches S21, the second switches S22, and the second switches S23 may be connected in series with the second fixed resistors R21, the second fixed resistors R22, and the second fixed resistors R23 in a one-to-one correspondence to form a plurality of second series branches, and the plurality of second series branches may be connected in parallel.

[0105] It is conceivable that the corresponding second fixed resistors R21, R22 and R23 are connected by closing the second switch S21, S22 and S23, and the corresponding second fixed resistors R21, R22 and R23 are cut out by opening the second switch S21, S22 and S23. In other words, the resistance value of the second resistor unit 121 can be adjusted by switching the states of the second switch S21, S22 and S23.

[0106] It should be noted that the first resistor unit 111 may include a first fixed resistor and the second resistor unit 121 may include multiple second fixed resistors, or the first resistor unit 111 may include multiple first fixed resistors and the second resistor unit 121 may include a second fixed resistor, which will not be described in detail in the embodiments of the present application.

[0107] Exemplarily, the second thermistor Rth2 and the third thermistor Rth3 may both be negative temperature coefficient (NTC) thermistors (which may be referred to as NTC thermistors), and the resistance of the NTC thermistor decreases as the temperature increases, thereby realizing the collection of temperature measurement values.

[0108] Optionally, the resistance value of the first resistor unit 111 (which can be expressed as R 111 can be Figure 1The resistance value of the first fixed resistor R1 (which can be represented by R1) or Figure 2 Similarly, the resistance of the second resistor unit 121 (which can be expressed by R 121 can be Figure 1 The resistance value of the second fixed resistor R2 (which can be represented by R2) or Figure 2 The equivalent resistance value of the enabled parallel resistors in the plurality of second fixed resistors.

[0109] Furthermore, the resistance value R of the first resistor unit 111 can be realized by the first switch and the second switch. 111 , the resistance value R of the second resistance unit 121 121 , the resistance value of the second thermal sensor Rth2 is R th2 and the resistance value R of the third thermal sensor Rth3 th3 Equal, that is, R 111 =R 121 =R th2 =R th3 , the minimum value of the temperature measurement value that can be collected by the temperature collection system 10 is reduced to the maximum extent, that is, the temperature collection resolution of the temperature collection system 10 is improved, thereby greatly improving the temperature collection accuracy of the temperature collection system 10.

[0110] In one possible implementation, Figure 1 and Figure 2 As shown, the processing module 2 may include an analog-to-digital converter 21 and a processor 22 .

[0111] The input end of the analog-to-digital converter 21 may be electrically connected to the output end of the first acquisition circuit 11 and the output end of the second acquisition circuit 12 , so as to receive the first voltage V1 and the second voltage V2 .

[0112] Optionally, the analog-to-digital converter 21 can be used to calculate the voltage difference between the first voltage V1 and the second voltage V2 to obtain a third voltage (which can be represented by V3), and convert the third voltage V3 into a fourth voltage (which can be represented by V4). The third voltage V3 can be an analog voltage, and the fourth voltage V4 can be a digital voltage. It can be seen that the analog-to-digital converter 21 plays a role in converting an analog voltage into a digital voltage.

[0113] The processor 22 may be used to obtain a temperature measurement value according to the fourth voltage V4 and the corresponding relationship between the voltage V and the temperature T (which may be referred to as the VT corresponding relationship). The corresponding relationship between the voltage V and the temperature T may be embodied in the form of a table or a curve, etc., which is not limited in the embodiment of the present application.

[0114] In some embodiments, the first temperature sensitive device may be a crystal resonator.

[0115] Then, the processor 22 can also be used to: according to the temperature measurement value of the crystal resonator and the corresponding relationship between the frequency deviation of the crystal resonator (which can be represented by Δf1) and the temperature T1 of the crystal resonator (such as Figure 3 As shown in FIG. 1 , the frequency deviation Δf of the crystal resonator is obtained, and the operating frequency of the crystal resonator (which can be represented by f1) is compensated according to the frequency deviation Δf1 of the crystal resonator. In other words, the processor 22 can compensate the operating frequency f1 of the crystal resonator according to the temperature measurement value of the crystal resonator.

[0116] Exemplarily, the corresponding relationship between the frequency deviation Δf1 of the crystal resonator and the temperature T1 of the crystal resonator may be expressed in the form of a table or a curve, etc., which is not limited in the embodiments of the present application.

[0117] In other embodiments, the first thermally sensitive device may be a power amplifier.

[0118] Then, the processor 22 can also be used to: according to the temperature measurement value of the power amplifier and the corresponding relationship between the output power deviation of the power amplifier (which can be represented by ΔP) and the temperature T2 of the power amplifier (such as Figure 4 As shown in FIG. 1 ), the output power deviation ΔP of the power amplifier is obtained, and the output power (which can be represented by P) of the power amplifier is compensated according to the output power deviation ΔP of the power amplifier. That is, the processor 22 can compensate the output power P of the power amplifier according to the temperature measurement value of the power amplifier.

[0119] Exemplarily, the corresponding relationship between the output power deviation ΔP of the power amplifier and the temperature T2 of the power amplifier may also be expressed in the form of a table or a curve, etc., which is not limited in the embodiments of the present application.

[0120] Below Figure 1 Taking the structure of the temperature acquisition system 10 shown as an example, the temperature acquisition system 10 provided in the embodiment of the present application is introduced in detail in combination with the drawings and tables.

[0121] In some possible implementations, the resistance R1 of the first fixed resistor R1 may be equal to the resistance R2 of the second fixed resistor R2, and both are equal to the preset fixed resistor resistance R (which may be 75 kΩ), that is, R1=R2=R=75 kΩ. The second thermistor Rth2 and the third thermistor Rth3 may both be NTC thermistors. The resistance R2 of the second thermistor Rth2 and R th2 Equal to the resistance value R of the third thermal sensor Rth3 th3 , and both are equal to the preset thermistor resistance R th , that is, R th2 =R th3 =R th .satisfy Wherein, T0 may represent a reference temperature, which may be 25°C. T represents a temperature measurement value representing the temperature of the first thermosensitive device. R0 may represent the resistance of the second thermosensitive device Rth2 and the third thermosensitive device Rth3 at the reference temperature T0, which may be 100 kΩ. B represents the material coefficient of the second thermosensitive device Rth2 and the third thermosensitive device Rth3 (which may be 3000).

[0122] Optionally, the first voltage V1 can be obtained by dividing the first fixed resistor R1 and the second thermal sensor Rth2 in series. Similarly, the second voltage V2 can be obtained by dividing the second fixed resistor R2 and the third thermal sensor Rth3 in series. Thus, the first voltage V1 and the second voltage V2 can satisfy Since R1=R2=R, R th2 =R th3 =R th , with the first reference voltage V REF1 Equal to the second reference voltage V REF2 And both are equal to the preset reference voltage V REF (which can be 2V) as an example, then the third voltage V3 can be expressed as:

[0123]

[0124] Further, the analog-to-digital converter 21 can convert the third voltage V3 into a fourth voltage V4. In the embodiment of the present application, the corresponding relationship between the voltage V and the temperature T can be represented in the form of a curve, such as Figure 5 shown. Figure 5 In the figure, the horizontal axis may represent the temperature T in units of °C. The vertical axis may represent the voltage in units of mV. Curve F1 may represent the corresponding relationship between the voltage V and the temperature T in the embodiment of the present application (which may be referred to as the VT corresponding relationship), and curve F2 may represent the corresponding relationship between the voltage V and the temperature T in the temperature acquisition system provided by the related art (which may be referred to as the VT corresponding relationship).

[0125] Furthermore, the VT correspondence relationship can be derived to obtain the slope correspondence relationship between the voltage V and the temperature T (which can be called the first slope, represented by k1, and the unit can be mV / °C), as shown in the following formula:

[0126]

[0127] The first slope k1 can also be expressed in the form of a curve, such as Figure 6 shown. Figure 6In the figure, the horizontal axis can represent the temperature T in units of °C. The vertical axis can represent the slope in units of mV / °C. Curve F3 can represent the first slope k1 in the embodiment of the present application. Curve F4 can represent the slope of the voltage V and the temperature T in the temperature acquisition system provided by the related art (which can be called the second slope, represented by k2).

[0128] Of course, the first slope k1 and the second slope k2 can also be expressed by Table 1:

[0129] Table 1

[0130] Temperature T(℃) -40 -30 -10 0 35 65 85 105 120 The second slope k2 4.7 6.6 11.75 14.15 15.85 10 7.5 5 3.7 The first slope k1 9.4 13.2 23.5 28.3 31.7 20 15 10 7.4 k1 / k2 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0

[0131] Taking the minimum sampling accuracy A of the processing module as 1 mV as an example, the temperature sampling resolution of the embodiment of the present application (which can be expressed by A / |k1|, and the unit can be ° C) and the temperature sampling resolution of the related art (which can be expressed by A / |k2|, and the unit can be ° C) are shown in Table 2:

[0132] Table 2

[0133] Temperature T(℃) -40 -30 -10 0 35 65 85 105 120 A / |k2|(℃) 0.21 0.15 0.09 0.07 0.06 0.10 0.13 0.20 0.27 A / |k1|(℃) 0.11 0.08 0.04 0.04 0.03 0.05 0.07 0.10 0.14

[0134] pass Figure 6 It can be seen from Table 1 that the absolute value of the first slope k1 obtained in the embodiment of the present application can reach twice the absolute value of the second slope k2 in the related art. It can be seen from Table 2 that, compared with the related art, the temperature sampling resolution of the temperature acquisition system 10 provided in the embodiment of the present application is relatively small, that is, the temperature acquisition accuracy of the temperature acquisition system 10 provided in the embodiment of the present application is relatively high.

[0135] In another possible implementation, the resistance R1 of the first fixed resistor R1 may not be equal to the resistance R2 of the second fixed resistor R2. Assume that, within the temperature range [T1, T2], the temperature sampling resolution of the temperature acquisition system 10 at temperature T1 is XmV / °C, and the temperature sampling resolution of the temperature acquisition system 10 at temperature T2 is YmV / °C.

[0136] V REF1 =V REF2 =V REF =2V, B=3000, T0=25°C, R0=100kΩ as an example, in the temperature range [65°C, 120°C], when T1 is 65°C, the temperature sampling resolution of the temperature acquisition system 10 is 24mV / °C, and when the temperature is T2, the temperature sampling resolution of the temperature acquisition system 10 is 13mV / °C. Therefore, it can be obtained according to the following formula that the resistance value R1 of the first fixed resistor R1 may not be equal to the resistance value R2 of the second fixed resistor R2:

[0137]

[0138]

[0139] It can be obtained that R1≈20kΩ, R2≈51kΩ. It can be seen that the embodiment of the present application provides a method for selecting the resistance value R1 of the first fixed resistor R1 and the resistance value R2 of the second fixed resistor R2. Of course, the resistance value R1 of the first fixed resistor R1 and the resistance value R2 of the second fixed resistor R2 can also be determined by other methods, which are not limited in the embodiment of the present application.

[0140] and Figure 5 Similarly, when R1≈20kΩ and R2≈51kΩ, we can get Figure 7 The corresponding relationship between voltage V and temperature T is shown. Figure 7 In FIG. 5 , the horizontal axis may represent the temperature T, and the unit may be ° C. The vertical axis may represent the voltage V, and the unit may be mV. Curve F5 may represent the VT corresponding relationship in the embodiment of the present application.

[0141] Furthermore, the VT correspondence relationship can be derived to obtain the third slope (which can be represented by k3), such as Figure 8 As shown in the middle curve F6. Figure 8 In the figure, the horizontal axis can represent the temperature T, and the unit can be ° C. The vertical axis can represent the slope, and the unit can be mV / ° C.

[0142] Of course, the third slope k1 and the second slope k2 can also be expressed by Table 3:

[0143] Table 3

[0144] Temperature T(℃) -40 -30 -10 0 35 65 85 105 120 The second slope k2 4.7 6.6 11.75 14.15 15.85 10 7.5 5 3.7 The first slope k1 9.4 13.2 23.5 28.3 31.7 20 15 10 7.4 The third slope k3 4.6 6.7 12.9 16.6 26 24 20.9 16.4 13.2 k3 / k2 1.0 1.0 1.1 1.2 1.6 2.4 2.8 3.3 3.6 k3 / k1 0.5 0.5 0.5 0.6 0.8 1.2 1.4 1.6 1.8

[0145] Taking the minimum sampling accuracy A of the processing module as 1 mV as an example, the temperature sampling resolution of the embodiment of the present application (which can be represented by A / |k3| and A / |k1|, and the unit can be ° C) and the temperature sampling resolution of the related art (which can be represented by A / |k2|, and the unit can be ° C) are shown in Table 4:

[0146] Table 4

[0147] Temperature T(℃) -40 -30 -10 0 35 65 85 105 120 A / |k2| 0.21 0.15 0.09 0.07 0.06 0.10 0.13 0.20 0.27 A / |k1| 0.11 0.08 0.04 0.04 0.03 0.05 0.07 0.10 0.14 A / |k3| 0.22 0.15 0.08 0.06 0.04 0.04 0.05 0.06 0.08

[0148] pass Figure 8 It can be seen from Table 3 that in the temperature range of 65°C and above, the absolute value of the third slope k3 obtained in the embodiment of the present application can reach 2.4 to 3.6 times the absolute value of the second slope k2 in the related art. It can be seen from Table 4 that, compared with the related art, the temperature sampling resolution of the temperature acquisition system 10 provided in the embodiment of the present application is relatively small, that is, the temperature acquisition accuracy of the temperature acquisition system 10 provided in the embodiment of the present application is relatively high.

[0149] The present application also provides a thermal module. Fig. 9 and Fig.10 The thermosensitive module 20 may include a first thermosensitive device 2 and a sampling circuit 1 .

[0150] The sampling circuit 1 may include a first sampling circuit 11 and a second sampling circuit 12 .

[0151] like Fig. 9 and Fig.10 As shown, the first sampling circuit 11 may include a first resistor unit 111 and a second thermal sensor Rth2. The first end of the first resistor unit 111 may be used to receive a first reference voltage V REF1 The second end of the first resistor unit 111 can be electrically connected to the first end of the second thermosensitive device Rth2. The second end of the second thermosensitive device Rth2 can be electrically connected to the ground terminal. The second end of the first resistor unit 111 and the first end of the second thermosensitive device Rth2 can serve as output ends of the first sampling circuit 11 and can be used to output the first voltage V1.

[0152] Similarly, the second sampling circuit 12 may include a second resistor unit 121 and a third thermal sensor Rth3. The first terminal of the third thermal sensor Rth3 may be used to receive a second reference voltage V REF2 The second end of the third thermistor Rth3 may be electrically connected to the first end of the second resistor unit 121. The second end of the second resistor unit 121 may be electrically connected to the ground. The second end of the third thermistor Rth3 and the first end of the second resistor unit 121 may serve as output ends of the second sampling circuit 12 and may be used to output the second voltage V2.

[0153] The first voltage V1 and the second voltage V2 may be used to obtain a temperature measurement value representing the temperature of the first thermosensitive device 2 .

[0154] The first reference voltage V REF1 and the second reference voltage V REF2 can be equal, that is, both can be equal to the preset reference voltage V REF Of course, the first reference voltage V REF1 and the second reference voltage V REF2 They may also be unequal, and this is not limited in the embodiments of the present application.

[0155] Optionally, the second end of the second thermistor Rth2 can be electrically connected to the second end of the second resistor unit 121 to form a first port of the sampling circuit 1, and the first port is used to be electrically connected to the ground terminal. The output end of the first sampling circuit 11 can be used as the second port of the sampling circuit 1 to output the first voltage V1. Similarly, the output end of the second sampling circuit 12 can be used as the third port of the sampling circuit 1 to output the second voltage V2.

[0156] At the first reference voltage V REF1 and the second reference voltage V REF2 When the first end of the first resistor unit 111 is equal, the first end of the first resistor unit 111 can be electrically connected to the first end of the third thermal sensor Rth3 to form a fourth port of the sampling circuit 1 for receiving the preset reference voltage V REF At the first reference voltage V REF1 and the second reference voltage V REF2 When the voltages V and V are not equal, the first end of the first resistor unit 111 can be used as the fourth port of the sampling circuit 1 to receive the first reference voltage V REF1 The first end of the third thermal sensor Rth3 can be used as the fifth port of the sampling circuit 1 for receiving the second reference voltage V REF2 .

[0157] Optionally, the sampling circuit 1 may be configured to output a first voltage V1 and a second voltage V2 according to the second thermosensitive device Rth2 and the third thermosensitive device Rth3 .

[0158] In one example, the sampling circuit 1 may be located near the first thermosensitive device 2, and the second thermosensitive device Rth2 and the third thermosensitive device Rth3 in the sampling circuit 1 may be in contact with the first thermosensitive device 2. Of course, the second thermosensitive device Rth2 and the third thermosensitive device Rth3 may also have a certain distance from the first thermosensitive device 2, such as Fig. 9 and Fig.10 The distances between the second thermosensitive device Rth2 and the third thermosensitive device Rth3 and the first thermosensitive device 2 can be as equal as possible to ensure that the changes in the resistance values ​​of the second thermosensitive device Rth2 and the third thermosensitive device Rth3 are as equal as possible as the temperature measurement value changes, thereby improving the temperature sampling accuracy.

[0159] In another example, the second thermosensitive device Rth2 and the third thermosensitive device Rth3 may be located inside the same chip, and the first thermosensitive device 2 and the chip including the second thermosensitive device Rth2 and the third thermosensitive device Rth3 may be packaged in the same packaging structure.

[0160] In a possible implementation, the first resistor unit 111 may include a first fixed resistor R1. Fig. 9The first end of the first fixed resistor R1 can be used to receive the first reference voltage V REF1 , the second end of the first fixed resistor R1 can be electrically connected to the first end of the second thermal sensor Rth2. The second end of the second thermal sensor Rth2 can be electrically connected to the ground terminal. The second end of the first fixed resistor R1 and the first end of the second thermal sensor Rth2 can serve as output ends of the first sampling circuit 11, and can be used to output the first voltage V1.

[0161] In another possible implementation, the first resistor unit 111 may also include a first fixed resistor R11, a first fixed resistor R12, and a first fixed resistor R13, a total of a plurality of first fixed resistors. Fig.10 As shown. The first fixed resistor R11, the first fixed resistor R12 and the first fixed resistor R13 can be connected in parallel to form multiple first parallel branches, and multiple first parallel branches can be connected in parallel. Of course, the first fixed resistor R11, the first fixed resistor R12 and the first fixed resistor R13 can also be electrically connected in series or in a combination of series and parallel, which is not limited in the embodiment of the present application.

[0162] Further, refer to Fig.10 The first resistor unit 111 may further include a first switch S11, a first switch S12, and a first switch S13, a total of a plurality of first switches. The first switch S11, the first switch S12, and the first switch S13 may be connected in series with the first fixed resistor R11, the first fixed resistor R12, and the first fixed resistor R13 in a one-to-one correspondence to form a plurality of first series branches, and the plurality of first series branches may be connected in parallel.

[0163] It is conceivable that the corresponding first fixed resistors R11, R12 and R13 are connected by closing the first switch S11, S12 and S13, and the corresponding first fixed resistors R11, R12 and R13 are cut out by opening the first switch S11, S12 and S13. In other words, the resistance value of the first resistor unit 111 can be adjusted by switching the states of the first switch S11, S12 and S13.

[0164] In another possible implementation, the second resistor unit 121 may include a second fixed resistor R2. Fig. 9 The first end of the second fixed resistor R2 can be electrically connected to the second end of the third thermal sensor Rth3, and can be used as the output end of the second sampling circuit 12 to output the second voltage V2. The second end of the second fixed resistor R2 can be electrically connected to the ground end.

[0165] In another possible implementation, the second resistor unit 121 may also include a second fixed resistor R21, a second fixed resistor R22, and a second fixed resistor R23, a total of a plurality of second fixed resistors. Fig.10 As shown. The second fixed resistor R21, the second fixed resistor R22, and the second fixed resistor R23 can be connected in parallel to form a plurality of second parallel branches, and the plurality of second parallel branches can be connected in parallel. Of course, the second fixed resistor R21, the second fixed resistor R22, and the second fixed resistor R23 can also be electrically connected in series or in a combination of series and parallel, which is not limited in the embodiment of the present application.

[0166] Further, refer to Fig.10 The second resistor unit 121 may further include a second switch S21, a second switch S22, and a second switch S23. The second switches S21, the second switches S22, and the second switches S23 may be connected in series with the second fixed resistors R21, the second fixed resistors R22, and the second fixed resistors R23 in a one-to-one correspondence to form a plurality of second series branches, and the plurality of second series branches may be connected in parallel.

[0167] It is conceivable that the corresponding second fixed resistors R21, R22 and R23 are connected by closing the second switch S21, S22 and S23, and the corresponding second fixed resistors R21, R22 and R23 are cut out by opening the second switch S21, S22 and S23. In other words, the resistance value of the second resistor unit 121 can be adjusted by switching the states of the second switch S21, S22 and S23.

[0168] It should be noted that the first resistor unit 111 may include a first fixed resistor and the second resistor unit 121 may include multiple second fixed resistors, or the first resistor unit 111 may include multiple first fixed resistors and the second resistor unit 121 may include a second fixed resistor, which will not be described in detail in the embodiments of the present application.

[0169] Exemplarily, the second thermistor Rth2 and the third thermistor Rth3 may both be NTC thermistors, and the resistance of the NTC thermistor decreases as the temperature increases, thereby realizing the collection of temperature measurement values.

[0170] Optionally, the resistance value R of the first resistance unit 111 is 111 Can be Fig. 9 The resistance value of the first fixed resistor R1 or Fig.10 Similarly, the resistance value R of the second resistor unit 121 is 121 Can be Fig. 9The resistance value of the second fixed resistor R2 is R2 or Fig.10 The equivalent resistance of multiple second fixed resistors connected in parallel.

[0171] Furthermore, the resistance value R of the first resistor unit 111 can be realized by controlling the first switch and the second switch. 111 , the resistance value R of the second resistance unit 121 121 , the resistance value of the second thermal sensor Rth2 is R th2 and the resistance value R of the third thermal sensor Rth3 th3 Equal, that is, R 111 =R 121 =R th2 =R th3 .

[0172] The present application also provides a communication system. Fig.11 The communication system 100 may include a first thermosensitive device 2 and a temperature acquisition system 10. The temperature acquisition system 10 may be used to acquire a temperature measurement value representing the temperature of the first thermosensitive device 2.

[0173] In a possible implementation, the first thermosensitive device 2 may be a crystal resonator. Fig.12 As shown, the communication system 100 may further include a clock circuit 40 .

[0174] Optionally, the clock circuit 40 may be used to drive a crystal resonator (ie, drive the first thermosensitive device 2). For example, the clock circuit 40 may send a driving signal (DS) to the crystal oscillator to drive the crystal oscillator.

[0175] The crystal resonator can be used to output a first clock signal CLK1 to the clock circuit 40 under the drive of the clock circuit 40 .

[0176] The clock circuit 40 can also be used to amplify and filter (which can be understood as shaping) the first clock signal CLK1 to obtain the second clock signal CLK2 and transmit it to the temperature acquisition system 10. It can be seen that the clock circuit 40 can provide the second clock signal CLK2 for the temperature acquisition system 10. It can be imagined that the temperature acquisition system 10 can realize the calibration of the reference frequency, the compensation of the operating frequency (i.e., frequency conversion), etc. according to the second clock signal CLK2.

[0177] In another possible implementation, the first thermal sensor 2 may be a power amplifier. Fig.13 As shown, the communication system 100 may further include an antenna 50 .

[0178] Optionally, the power amplifier may be used to amplify the power of the first radio frequency signal RF1 from the temperature acquisition system 10 to obtain the second radio frequency signal RF2 and transmit it to the antenna 50 .

[0179] The antenna 50 may be used to transmit a second radio frequency signal RF2.

[0180] That is, the temperature acquisition system 10 can send the first radio frequency signal RF1 to the power amplifier. The power amplifier can amplify the power of the first radio frequency signal RF1, and the processed second radio frequency signal RF2 can be transmitted through the antenna 50.

[0181] Furthermore, if Fig.12 and Fig.13 As shown, the communication system 10 may further include a memory 30. The memory 30 may be used to store the corresponding relationship between the voltage V and the temperature T, the corresponding relationship between the frequency deviation Δf of the first thermistor 2 and the temperature T, and the corresponding relationship between the output power deviation ΔP of the first thermistor 2 and the temperature T. Of course, the memory 30 may also be used to store the fourth voltage V4 and the parameters of the first thermistor 2, etc., which is not limited in the embodiment of the present application.

[0182] The embodiment of the present application also provides an electronic chip, which may include a temperature acquisition system 10 .

[0183] Optionally, the electronic chip may further include passive components, and the passive components may be electrically connected to the temperature acquisition system 10 .

[0184] Furthermore, the passive device may be a resistor, a capacitor, etc., which is not limited in the embodiments of the present application.

[0185] An embodiment of the present application provides an electronic device, which may include a communication system 100.

[0186] Optionally, the electronic device may further include a power supply system, which may be electrically connected to the communication system 100 to supply power to the communication system 100 .

[0187] Optionally, the electronic device may be a mobile phone, a vehicle-mounted device, a wireless terminal access device (customer premises, CPE) and a handheld wireless terminal, etc. Among them, the vehicle-mounted device may be a vehicle-mounted entertainment device and a vehicle-mounted control device, etc. The embodiment of the present application does not limit the type of electronic device.

[0188] In the several embodiments provided in the present application, it should be understood that the disclosed systems and modules, etc., can be implemented in other ways. For example, the system embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0189] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0190] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0191] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0192] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A temperature acquisition system, characterized in that: Including sampling circuit and processing module: Wherein, the sampling circuit includes a first sampling circuit and a second sampling circuit; The first sampling circuit includes a first resistance unit and a second thermal sensor; the first end of the first resistance unit is used to receive a first reference voltage, the second end of the first resistance unit is electrically connected to the first end of the second thermal sensor, the second end of the second thermal sensor is electrically connected to the ground end, and the second end of the first resistance unit and the first end of the second thermal sensor serve as output ends of the first sampling circuit for outputting a first voltage; The second sampling circuit includes a second resistance unit and a third thermal sensor; the first end of the third thermal sensor is used to receive a second reference voltage, the second end of the third thermal sensor is electrically connected to the first end of the second resistance unit, the second end of the second resistance unit is electrically connected to the ground end, and the second end of the third thermal sensor and the first end of the second resistance unit serve as output ends of the second sampling circuit for outputting a second voltage; The processing module is used for outputting a temperature measurement value representing the temperature of the first thermal sensitive device according to the first voltage and the second voltage.

2. The temperature acquisition system according to claim 1, characterized in that: The first resistor unit includes one or more first fixed resistors connected in parallel.

3. The temperature acquisition system according to claim 2, characterized in that: The first resistance unit further includes a plurality of first switches; The plurality of first switches are connected in series with the plurality of first fixed resistors in a one-to-one correspondence to form a plurality of first series branches, and the plurality of first series branches are connected in parallel.

4. The temperature acquisition system according to any one of claims 1 to 3, characterized in that: The second resistance unit includes one or more second fixed resistors connected in parallel.

5. The temperature acquisition system according to claim 4, characterized in that: The second resistance unit further includes a plurality of second switches; The plurality of second switches are connected in series with the plurality of second fixed resistors in a one-to-one correspondence to form a plurality of second series branches, and the plurality of second series branches are connected in parallel.

6. The temperature acquisition system according to any one of claims 1 to 5, characterized in that: The second thermal-sensitive device and the third thermal-sensitive device are both negative temperature coefficient thermistors.

7. The temperature acquisition system according to any one of claims 1 to 6, characterized in that: The processing module comprises: an analog-to-digital converter, configured to calculate a voltage difference between the first voltage and the second voltage to obtain a third voltage, and convert the third voltage into a fourth voltage; wherein the third voltage is an analog voltage and the fourth voltage is a digital voltage; The processor is used to obtain the temperature measurement value according to the fourth voltage and the corresponding relationship between the voltage and the temperature.

8. The temperature acquisition system according to any one of claims 1 to 7, characterized in that: The first temperature-sensitive device is a crystal resonator or a power amplifier.

9. The temperature acquisition system according to claim 8, characterized in that: The first thermally sensitive device is the crystal resonator; The processor is further configured to obtain a frequency deviation of the first thermosensitive device according to the temperature measurement value and a corresponding relationship between the frequency deviation and the temperature, and compensate for an operating frequency of the first thermosensitive device according to the frequency deviation.

10. The temperature acquisition system according to claim 8, characterized in that: The first thermally sensitive device is the power amplifier; The processor is further configured to obtain an output power deviation of the first thermosensitive device according to the temperature measurement value and a corresponding relationship between the output power deviation and the temperature, and compensate the output power of the first thermosensitive device according to the output power deviation.

11. A thermal module, characterized in that: including a first thermal sensor and a sampling circuit; Wherein, the sampling circuit includes a first sampling circuit and a second sampling circuit; The first sampling circuit includes a first resistance unit and a second thermal sensor; the first end of the first resistance unit is used to receive a first reference voltage, the second end of the first resistance unit is electrically connected to the first end of the second thermal sensor, and the second end of the second thermal sensor is electrically connected to the ground end; the second end of the first resistance unit and the first end of the second thermal sensor serve as output ends of the first sampling circuit, and are used to output a first voltage; The second sampling circuit includes a second resistance unit and a third thermal sensor; the first end of the third thermal sensor is used to receive a second reference voltage, the second end of the third thermal sensor is electrically connected to the first end of the second resistance unit, and the second end of the second resistance unit is electrically connected to the ground end; the second end of the third thermal sensor and the first end of the second resistance unit serve as output ends of the second sampling circuit, and are used to output a second voltage; The first voltage and the second voltage are used to obtain a temperature measurement value representing the temperature of the first thermal sensitive device.

12. The thermal module according to claim 11, characterized in that: The first resistor unit includes one or more first fixed resistors connected in parallel.

13. The thermal module according to claim 12, characterized in that: The first resistance unit further includes a plurality of first switches; The plurality of first switches are connected in series with the plurality of first fixed resistors in a one-to-one correspondence to form a plurality of first series branches, and the plurality of first series branches are connected in parallel.

14. The thermal module according to any one of claims 11 to 13, characterized in that: The second resistance unit includes one or more second fixed resistors connected in parallel.

15. The thermal module according to claim 14, characterized in that: The second resistance unit further includes a plurality of second switches; The plurality of second switches are connected in series with the plurality of second fixed resistors in a one-to-one correspondence to form a plurality of second series branches, and the plurality of second series branches are connected in parallel.

16. The thermal module according to any one of claims 11 to 15, characterized in that: The second thermal-sensitive device and the third thermal-sensitive device are both negative temperature coefficient thermistors.

17. A communication system, characterized in that: A temperature acquisition system comprising a first thermosensitive device and any one of claims 1 to 10; The temperature acquisition system is used to acquire a temperature measurement value representing the temperature of the first thermosensitive device.

18. The communication system according to claim 17, characterized in that: The first thermally sensitive device is a crystal resonator; the communication system further comprises a clock circuit; The clock circuit is used to: drive the crystal resonator; The crystal resonator is used to: output a first clock signal to the clock circuit under the drive of the clock circuit; The clock circuit is also used to: amplify and filter the first clock signal to obtain a second clock signal and transmit it to the temperature acquisition system.

19. The communication system according to claim 18, characterized in that: The first thermally sensitive device is a power amplifier; the communication system further comprises an antenna; The power amplifier is used to: amplify the power of the first radio frequency signal from the temperature acquisition system to obtain a second radio frequency signal and transmit it to the antenna; The antenna is used to transmit the second radio frequency signal.

20. An electronic chip, characterized in that: The invention comprises a temperature acquisition system as claimed in any one of claims 1 to 10.

21. An electronic device, characterized in that: Comprising a communication system as claimed in any one of claims 17 to 19.

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