Optical image circuit, camera module and electronic equipment

Abstract

The invention relates to an optical image circuit, a camera module and electronic equipment, the optical image circuit comprises a plurality of processor modules, a plurality of function modules and a switch module, the processor modules are provided with interfaces, and the switch module is electrically connected with the plurality of function modules and the plurality of processor modules. And each functional module is connected with the interfaces of different processor modules through the switch module. The switch module is arranged, the function module is connected with the interfaces of the different processor modules through the switch module, and the problem that the number of the interfaces is insufficient is solved on the premise that the cost budget is prevented from being exceeded.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to an optical image circuit, a camera module and an electronic equipment. Background Art

[0002] With the continuous development of terminal technology, electronic devices such as mobile phones and tablet computers have been equipped with powerful processing capabilities, and people are increasingly using the camera function of electronic devices in their daily lives.

[0003] Optical Image Stabilization (OIS) is an increasingly popular feature of electronic devices. In order to obtain better quality photos and avoid the impact of shaking on electronic devices when shooting with the camera of an electronic device, optical image stabilization processing is required during the shooting process. During shooting, the optical image circuit can use the shaking data of the shooting device detected by the motion sensor, and the OIS controller controls the motor that drives the OIS to move the lens or image sensor according to the shaking data.

[0004] However, current optical imaging circuits have a technical problem of insufficient number of interfaces in order to avoid exceeding the cost budget. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the present disclosure provides an optical imaging circuit, a camera module and an electronic device.

[0006] According to a first aspect of an embodiment of the present disclosure, an optical image circuit is provided, comprising: a plurality of processor modules, each of which has an interface and a plurality of functional modules; and a switch module, the switch module being electrically connected to the plurality of functional modules and the plurality of processor modules, each of the functional modules being connected to an interface of a different processor module via the switch module.

[0007] In some possible implementations, the switch module is a multiplexer.

[0008] In some possible implementations, the switch module includes one, and multiple functional modules are connected to interfaces of different processor modules through the same switch module, or,

[0009] The switch modules include a plurality of switch modules, and the plurality of switch modules correspond one-to-one to the plurality of functional modules. Each functional module is connected to interfaces of different processor modules through a corresponding switch module.

[0010] In some possible implementations, the plurality of functional modules include: a first functional module and a second functional module, the first functional module and the second functional module are both electrically connected to the switch module, wherein when the first functional module is in an enabled state, the first functional module is connected to an interface of one of the plurality of processor modules through the switch module, and the second functional module is connected to an interface of another of the plurality of processor modules through the switch module;

[0011] When the first functional module is in a closed state, the first functional module is disconnected from an interface of one of the processor modules through the switch module, and the second functional module is connected to an interface of the same processor module through the switch module.

[0012] In some possible implementations, the first functional module includes a camera module.

[0013] Wherein, when the camera module is in an enabled state, the camera module is connected to an interface of one of the plurality of processor modules through the switch module, and the second function module is connected to an interface of another of the plurality of processor modules through the switch module;

[0014] When the camera module is in a closed state, the camera module is disconnected from an interface of one of the processor modules through the switch module, and the second functional module is connected to an interface of the same processor module through the switch module.

[0015] In some possible implementations, the second functional module is one or more of an antenna sensor, a magnetic sensor, a proximity sensor, and a light sensor.

[0016] In some possible implementations, the processor module includes:

[0017] A first processor module having a first interface; and

[0018] A second processor module has a second interface, and the computing power consumption of the second processor module is different from that of the first processor module.

[0019] Wherein, when the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module, and the second functional module is connected to the second interface of the second processor module through the switch module;

[0020] When the first functional module is in a closed state, the first functional module is disconnected from the first interface of the first processor module through the switch module, and the second functional module is connected to the first interface of the first processor module through the switch module.

[0021] In some possible implementations, the first processor module is a smart sensor hub.

[0022] Wherein, when the first functional module is in an enabled state, the first functional module is connected to the intelligent sensor hub through the switch module, and the second functional module is connected to the second interface of the second processor module through the switch module;

[0023] When the first functional module is in a closed state, the first functional module is disconnected from the smart sensor hub through the switch module, and the second functional module is connected to the smart sensor hub through the switch module.

[0024] In some possible implementations, the second processor module is an application processor.

[0025] Wherein, when the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module, and the second functional module is connected to the application processor through the switch module.

[0026] In some possible implementations, the optical imaging circuit further includes:

[0027] A controller is electrically connected to the switch module.

[0028] In some possible implementations, the first processor module further has a third interface.

[0029] The optical imaging circuit further includes: a third functional module electrically connected to the third interface,

[0030] Wherein, when the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module, and the first processor module performs optical image stabilization on the first functional module through the third functional module.

[0031] According to a second aspect of an embodiment of the present disclosure, a camera module is provided, comprising: an optical image circuit as described in any one of the implementations of the first aspect above.

[0032] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, comprising: an optical imaging circuit as described in any implementation of the first aspect above and / or a camera module as described in the second aspect above.

[0033] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: The present disclosure provides an optical image circuit, including multiple processor modules, multiple functional modules and a switch module, wherein the processor module has an interface, the switch module is electrically connected to the multiple functional modules and the multiple processor modules, and each functional module is connected to the interface of different processor modules through the switch module. The present disclosure solves the problem of insufficient number of interfaces by setting a switch module, and the functional modules are connected to the interfaces of different processor modules through the switch module, while avoiding exceeding the cost budget.

[0034] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0036] Figure 1 is a circuit diagram of a module optical image stabilization according to an exemplary embodiment.

[0037] Figure 2 is a circuit diagram of an optical image stabilization system of an application processor according to an exemplary embodiment.

[0038] Figure 3 is a schematic structural diagram of an optical imaging circuit according to an exemplary embodiment.

[0039] Figure 4 is a schematic structural diagram of another optical imaging circuit according to an exemplary embodiment.

[0040] Figure 5 is a circuit diagram of a multiplexer according to an exemplary embodiment.

[0041] Figure 6 The diagram is a schematic structural diagram of an electronic device according to an exemplary embodiment.

[0042] Reference numerals:

[0043] 1. Motion sensor; 2. Camera module; 3. Driver chip; 4. Computing module; 5. Sensor; 6. Optical lens;

[0044] 10. Processor module; 20. Functional module; 30. Switch module; 40. Controller; 100. Electronic device. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0046] If the OIS function is to be implemented, the following modules are required inside the electronic device, such as motion sensors, XY motors built into camera modules, etc. Electronic devices generally use micro electro mechanical systems (MEMS), which include acceleration sensing units and / or angular velocity sensing units. The acceleration sensing unit may be, for example, an accelerometer (ACCELEROMETER sensor), and the angular velocity sensor may be, for example, a gyroscope (GYROSCOPE sensor). The acceleration sensing unit and the angular acceleration sensing unit may be independently arranged, or they may be integrated into one. Of course, it is understandable that in addition to the sensor types mentioned above, the sensor may also be other sensors that can detect the shake or vibration of the electronic device.

[0047] In the related art, there are two main modes of optical image stabilization (OIS) function: module optical image stabilization, namely module OIS, and application processor optical image stabilization, namely AP-OIS.

[0048] Module optical image stabilization circuit, see Figure 1 Module optical image stabilization means that the motion sensor 1 transmits data to the camera module 2. The camera module 2 has a built-in driver chip 3, such as hardware OISDriver, which directly drives the XY motor in the optical lens 6 built into the camera module 2 after calculation. The advantage of this method is that it saves platform interfaces. The low-power calculation module 4 in the central processing unit (CPU) only needs two sets of interfaces to realize the operation of the motion sensor 1 and the low-power sensor 5. The disadvantage is that the cost of the hardware OISDriver is relatively high. In addition, due to the increase in the driver chip, the volume and thickness of the camera module will also increase.

[0049] Application processor optical image stabilization circuit, see Figure 2 The application processor optical image stabilization means that the motion sensor 1 transmits data to the low-power computing module 4 in the central processing unit. The low-power computing module 4 replaces the driving chip 3 to process the data, and then transmits the calculated data to the optical lens 6 built into the camera module 2, and drives the XY motor in the optical lens 6. Compared with the module optical image stabilization circuit, it has the advantages of low cost and compact module size, but the disadvantage is that the requirement for the number of interfaces of the low-power computing module 4 in the central processing unit increases exponentially, and four sets of interfaces are required to realize the operation of the motion sensor 1 and the low-power sensor 5.

[0050] Due to the low cost of application processor optical image stabilization circuits, they are often used as the primary solution for optical image stabilization in mid- and low-end electronic equipment projects. However, application processor optical image stabilization circuits have high requirements for the number of low-power computing module interfaces in the central processor, and low-end platforms usually have very few interfaces, so there will be a situation where the number of platform interfaces is insufficient.

[0051] In order to solve the above technical problem, according to a first aspect of the present disclosure, an optical image circuit is provided. Figure 3 is an optical image circuit diagram according to an exemplary embodiment. Figure 4 is another optical image circuit diagram according to an exemplary embodiment.

[0052] like Figure 3-4 As shown, the optical imaging circuit includes: a plurality of processor modules 10 , a plurality of functional modules 20 and a switch module 30 .

[0053] The processor module 10 has an interface, the switch module 30 is electrically connected to the multiple functional modules 20 and the multiple processor modules 10 , and each functional module 20 is connected to the interface of a different processor module 10 through the switch module 30 .

[0054] It should be noted that the processor module 10 belongs to at least part of the central processing unit (CPU), and a part of the central processing unit needs to perform high-computing operations, such as the application processor (AP). The application processor is one of the most important parts of the central processing unit. The system operation of electronic equipment and the operation of applications (APP) all rely on high-computing application processors. A part of the central processing unit needs to perform low-power operations, such as the smart sensor hub. The main function of the smart sensor hub is to connect and process data from various sensor devices.

[0055] The functional module 20 includes a camera module and a sensor module, both of which need to be electrically connected to the interface of the processor module 10 to meet the functional requirements of the electronic device. The camera module may include an optical lens, and the motion sensor may include an optical image stabilization unit and a posture detection unit. For example, an angle sensor is used to detect the rotational movement of the electronic device in the X, Y, and Z directions, which may be a gyroscope or other motion sensor. A displacement sensor is used to detect the translational jitter of the electronic device in the X, Y, and Z directions, which may be an accelerometer or other motion sensor. After receiving the compensation data from the posture detection unit, the optical image stabilization unit controls the movement of the optical lens to suppress the influence of jitter on image acquisition and enhance the user's shooting experience.

[0056] The sensor module includes at least one sensor. For example, the depth sensor is used to detect the object distance of the shooting scene, which can be a laser sensor, time of flight (TOF), structured light and other depth detection devices. The position sensor is used to detect the position of the lens or the image distance, which can be a Hall sensor, anisotropic magneto resistance sensor (anisotropic magneto resistance, AMR), giant magneto resistance sensor (giant magneto resistance, GMR), tunneling magneto resistance sensor (tunneling magneto resistance, TMR) and other devices that can detect the position of the lens. The image sensor is used to sense light and generate images, which can be a complementary metal oxide semiconductor (CMOS), charge coupled device (CCD) and other optical image sensors. Other sensors such as barometers, hygrometers, thermometers, infrared sensors, etc. can also be configured.

[0057] The switch module 30 has multiple conduction paths, which can enable the same functional module 20 to connect to interfaces of different processor modules 10, and the cost of the switch module 30 is much lower than the cost of the hardware OISDriver in the module OIS.

[0058] Among them, the number of processor modules 10 is at least two, the number of functional modules 20 is at least two, the switch module 30 is electrically connected to multiple functional modules 20 and multiple processor modules 10, and each functional module 20 is connected to the interface of different processor modules 10 through the switch module 30.

[0059] In the present disclosure, when it is detected that one of the multiple functional modules 20 is in the first state, the conduction path of the switch module 30 is controlled, the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of another processor module 10 of the multiple processor modules 10 through the switch module 30. When it is detected that one of the multiple functional modules 20 is in the second state, the conduction path of the switch module 30 is controlled, the functional module 20 is disconnected from the interface connection with one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of the functional module 20 through the switch module 30. The present disclosure solves the problem of insufficient number of interfaces without exceeding the cost budget by setting the switch module 30, and the functional module 20 is connected to the interfaces of different processor modules 10 through the switch module 30.

[0060] In some possible implementations, such as Figure 5 As shown, the switch module 30 is a multiplexer.

[0061] The multiplexer has multiple connection paths, which can connect the same functional module 20 to the interfaces of different processor modules 10, and the cost of the multiplexer is much lower than the cost of the hardware OISDriver in the module OIS.

[0062] For example, the multiplexer uses a 4-bit 2-to-1 multiplexer, such as TI SN74CBTLV3257. Figure 5 As shown in the circuit diagram of the multiplexer, the two ends of the multiplexer are four inputs, namely 1A, 2A, 3A, and 4A, and two outputs, namely B1 and B2. The output path can be switched by configuring the level of the S end. When S is the first signal, such as a high-level signal, 1A, 2A, 3A, and 4A are connected to 1B1, 2B1, 3B1, and 4B1 respectively. When S is the second signal, such as a low-level signal, 1A, 2A, 3A, and 4A are connected to 1B2, 2B2, 3B2, and 4B2 respectively.

[0063] In the embodiment of the present disclosure, when it is detected that one of the multiple functional modules 20 is in the first state, the conduction path of the multiplexer can be controlled by configuring the S-terminal level. When the S-terminal level is configured as a first signal, such as a high-level signal, the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the multiplexer, and another functional module 20 of the multiple functional modules 20 is connected to the interface of another processor module 10 of the multiple processor modules 10 through the multiplexer. When it is detected that one of the multiple functional modules 20 is in the second state, the conduction path of the multiplexer can be controlled by configuring the S-terminal level. When the S-terminal level is configured as a second signal, such as a low-level signal, the functional module 20 disconnects the interface connection with one of the multiple processor modules 10 through the multiplexer, and another functional module 20 of the multiple functional modules 20 is connected to the interface of the functional module 20 through the multiplexer. The problem of insufficient number of interfaces is solved without exceeding the cost budget. At the same time, the use of a hardware driver chip is avoided, thus saving the volume of the functional module 20 .

[0064] In some possible implementations, the switch module 30 includes one, and multiple functional modules 20 are connected to interfaces of different processor modules 10 through the same switch module 30, or,

[0065] The switch modules 30 include a plurality of switch modules 30 , and the plurality of switch modules 30 correspond one-to-one to the plurality of functional modules 20 . Each functional module 20 is connected to interfaces of different processor modules 10 through a corresponding switch module 30 .

[0066] Exemplarily, the switch module 30 includes a Figure 3 As shown, when it is detected that one of the multiple functional modules 20 is in the first state, the conduction path of the switch module 30 can be controlled by configuring the S-terminal level. When the S-terminal level is configured as a first signal, such as a high-level signal, the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of another processor module 10 of the multiple processor modules 10 through the same switch module 30. When it is detected that one of the multiple functional modules 20 is in the second state, the conduction path of the switch module 30 can be controlled by configuring the S-terminal level. When the S-terminal level is configured as a second signal, such as a low-level signal, the functional module 20 is disconnected from the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of the functional module 20 through the same switch module 30.

[0067] Exemplarily, the switch module 30 includes two, namely, a first switch module and a second switch module. Figure 4 As shown, when it is detected that one of the multiple functional modules 20 is in the first state, the conduction path of the first switch module and the second switch module can be controlled by configuring the S-terminal level. When the S-terminal level is configured as a first signal, such as a high-level signal, the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the first switch module, and another functional module 20 in the multiple functional modules 20 is connected to the interface of another processor module 10 in the multiple processor modules 10 through the second switch module. When it is detected that one of the multiple functional modules 20 is in the second state, the conduction path of the first switch module and the second switch module can be controlled by configuring the S-terminal level. When the S-terminal level is configured as a second signal, such as a low-level signal, the functional module 20 disconnects the interface connection with one of the multiple processor modules 10 through the first switch module, and another functional module 20 in the multiple functional modules 20 is connected to the interface of the functional module 20 through the second switch module.

[0068] In some possible implementations, such as Figure 3-4 As shown, the plurality of functional modules 20 include: a first functional module and a second functional module, and the first functional module and the second functional module are both electrically connected to the switch module 30.

[0069] When the first functional module is in the enabled state, the first functional module is connected to an interface of one of the multiple processor modules 10 through the switch module 30, and the second functional module is connected to an interface of another processor module 10 through the switch module 30;

[0070] When the first functional module is in the off state, the first functional module is disconnected from the interface of one of the processor modules 10 through the switch module 30 , and the second functional module is connected to the interface of the same processor module 10 through the switch module 30 .

[0071] Among them, the first functional module may be a camera module, the camera module may include an optical lens, and the motion sensor may include an optical image stabilization unit and a posture detection unit, for example, an angle sensor, which is used to detect the rotational motion of the electronic device in the X, Y, and Z directions, and may be a gyroscope or other motion sensor. The displacement sensor, which is used to detect the translational jitter of the electronic device in the X, Y, and Z directions, may be an accelerometer or other motion sensor. After receiving the compensation data from the posture detection unit, the optical image stabilization unit controls the movement of the optical lens to suppress the influence of jitter on image acquisition and improve the user's shooting experience.

[0072] The second functional module may be a sensor module, and the sensor module includes at least one sensor. For example, a depth sensor is used to detect the object distance of the shooting scene, and may be a laser sensor, time of flight (TOF), structured light and other depth detection devices. A position sensor is used to detect the position of the lens or the image distance, and may be a Hall sensor, anisotropic magneto resistance sensor (AMR), giant magneto resistance sensor (GMR), tunneling magneto resistance sensor (TMR) and other devices that can detect the position of the lens. An image sensor is used to sense light and generate images, and may be a complementary metal oxide semiconductor (CMOS), a charge coupled device (CCD) and other optical image sensors. Other sensors such as a barometer, a hygrometer, a thermometer, and an infrared sensor may also be configured.

[0073] In the embodiment of the present disclosure, by setting a switch module 30, the first functional module is electrically connected to the switch module 30, the second functional module is electrically connected to the switch module 30, and the second functional module is connected to the interfaces of different processor modules 10 through the switch module 30, thereby solving the problem of insufficient number of interfaces on medium and low platforms without exceeding the cost budget.

[0074] In some possible implementations, the first functional module includes a camera module.

[0075] When the camera module is in an enabled state, the camera module is connected to an interface of one of the multiple processor modules 10 through the switch module 30, and the second function module is connected to an interface of another processor module 10 through the switch module 30;

[0076] When the camera module is in the off state, the camera module is disconnected from the interface of one of the processor modules 10 through the switch module 30 , and the second functional module is connected to the interface of the same processor module 10 through the switch module 30 .

[0077] In the embodiment of the present disclosure, when the camera module is in the enabled state, the low-power second functional module uses the interface of the high-computing power processor module 10, and the low-power second functional module reuses the interface of the high-computing power processor module 10 through the switch module 30, and is temporarily used as the interface of the low-power processor module 10. When the camera module is in the disabled state, the camera module disconnects the interface connection with the low-power processor module 10 through the switch module 30, and the low-power second functional module is connected to the interface of the low-power processor module 10 through the switch module 30. Because the high-computing power processor module 10 consumes the computing power resources of the central processing unit, the power consumption is very high when used for a long time around the clock, but it is only effective when the camera module is in the enabled state, so it has little effect on the power consumption of the central processing unit, solves the problem of insufficient number of interfaces on the mid- and low-end platforms, and realizes the OIS function.

[0078] In some possible implementations, the second functional module is one or more of an antenna sensor, a magnetic sensor, a proximity sensor, and a light sensor.

[0079] Among them, the second functional module is a low-power module. The antenna sensor, namely the SAR Sensor, is a sensor itself used as a wireless transmitter, integrating signal acquisition and transmission functions, combining signal "sensing" and "transmission", thereby eliminating the external wire interface and enhancing the reliability of the sensor. The magnetic sensor, namely the MAG Sensor, is a device that converts the change of magnetic properties of sensitive elements caused by external factors such as magnetic field, current, stress strain, temperature, light, etc. into electrical signals, and detects the corresponding physical quantities in this way. The proximity sensor and the light sensor, namely the PL Sensor, detect objects by measuring the electromagnetic field or other physical quantities between the object and the sensor. When the probe is very close to the detected object, the proximity sensor will process the signal it senses and generate a control signal of approaching or moving away. The light sensor mainly uses the properties of light emission and reception to detect the existence of an object. When the detected object passes through the light sensor, it reflects or blocks the light, and the received signal will change, thereby judging whether the object exists or not.

[0080] The OIS function is realized by the processor module 10 with low power consumption. When the camera module is used, the usage scenarios of other sensors are relatively low, so the power consumption will be greatly reduced. The interface of the high-computing processor module 10 can be reused and temporarily used as the interface of the processor module 10 with low power consumption.

[0081] In some possible implementations, such as Figure 3-4 As shown, the processor module 10 includes: a first processor module and a second processor module.

[0082] The first processor module has a first interface; the second processor module has a second interface, and the computing power consumption of the second processor module is different from that of the first processor module.

[0083] Wherein, when the first functional module is in the enabled state, the first functional module is connected to the first interface of the first processor module through the switch module 30, and the second functional module is connected to the second interface of the second processor module through the switch module 30;

[0084] When the first functional module is in the off state, the first functional module is disconnected from the first interface of the first processor module through the switch module 30 , and the second functional module is connected to the first interface of the first processor module through the switch module 30 .

[0085] In the embodiment of the present disclosure, the first processor module belongs to the part of the central processing unit that needs to perform low-power computing, and the second processor module belongs to the part of the central processing unit that needs to perform high-computing power computing; when the first functional module is in an enabled state, the second functional module reuses the second interface of the second processor module through the switch module 30 for temporary use, and when the first functional module is in a disabled state, the second functional module is connected to the first interface of the first processor module through the switch module 30, thereby solving the problem of insufficient number of interfaces on mid- and low-end platforms.

[0086] In some possible implementations, the first processor module is a smart sensor hub.

[0087] When the first functional module is in the enabled state, the first functional module is connected to the intelligent sensor hub through the switch module 30, and the second functional module is connected to the second interface of the second processor module through the switch module 30;

[0088] When the first functional module is in the off state, the first functional module is disconnected from the smart sensor hub through the switch module 30 , and the second functional module is connected to the smart sensor hub through the switch module 30 .

[0089] In the embodiments of the present disclosure, the smart sensor hub is also referred to as a sensor control center, Sensor hub. When the central processing unit is in sleep mode, it can realize real-time control of sensors, thereby reducing power consumption. It can also fuse data from different types of sensors to realize functions that can only be achieved by combining data from multiple sensors.

[0090] In some possible implementations, the second processor module is an application processor. When the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module 30, and the second functional module is connected to the application processor through the switch module 30.

[0091] In the embodiment of the present disclosure, the interface of the application processor can be reused and temporarily used as the first interface of the first processor module. The application processor usually cannot directly drive the second functional module because the application processor consumes the computing power resources of the central processing unit and consumes a lot of power for long-term use around the clock. However, it only takes effect when the first functional module is enabled, which has little effect on power consumption. Therefore, when the first functional module is enabled, the second functional module can be driven by the application processor through the switch module 30, and when the first functional module is turned off, the second functional module can be driven by the first processor module through the switch module 30, which can solve the problem of insufficient number of interfaces on mid- and low-end platforms.

[0092] In some possible implementations, such as Figure 3-4 As shown, the optical imaging circuit further includes: a controller 40 .

[0093] The controller 40 is electrically connected to the switch module 30 .

[0094] The controller 40 may be a GPIO (General-purpose input / output) of the high-computing-power computing part of the central processing unit, and the GPIO serves as a peripheral interface of the processor module 10 .

[0095] In the embodiment of the present disclosure, the conduction path of the switch module 30 is controlled by the controller 40, specifically, the conduction path of the switch module 30 is controlled by the level signal output by the controller 40. When it is detected that one of the multiple functional modules 20 is in the first state, the level signal output by the controller 40 is the first signal, and the conduction path of the switch module 30 can be controlled, and the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of another processor module 10 of the multiple processor modules 10 through the switch module 30. When it is detected that one of the multiple functional modules 20 is in the second state, the level signal output by the controller 40 is the second signal, and the conduction path of the switch module 30 can be controlled, and the functional module 20 is disconnected from the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of the functional module 20 through the switch module 30. The problem of insufficient number of interfaces was solved without exceeding the cost budget.

[0096] In some possible implementations, such as Figure 3-4 As shown, the first processor module also has a third interface,

[0097] The optical imaging circuit further includes: a third functional module electrically connected to the third interface,

[0098] When the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module 30, and the first processor module performs optical image stabilization on the first functional module through the third functional module.

[0099] In the disclosed embodiment, the third functional module may be a motion sensor, which may include an optical image stabilization unit and a posture detection unit, for example, an angle sensor for detecting the rotational motion of the electronic device in the X, Y, and Z directions, which may be a gyroscope or other motion sensor. A displacement sensor for detecting the translational jitter of the electronic device in the X, Y, and Z directions may be an accelerometer or other motion sensor. After receiving the compensation data from the posture detection unit, the optical image stabilization unit controls the movement of the optical lens to suppress the influence of jitter on image acquisition and improve the user's shooting experience.

[0100] Based on the same inventive concept, according to a second aspect of the present disclosure, a camera module is provided, comprising: an optical image circuit as in any one of the embodiments of the first aspect.

[0101] In the present disclosure, when it is detected that one of the multiple functional modules 20 is in the first state, the conduction path of the switch module 30 is controlled, the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of another processor module 10 of the multiple processor modules 10 through the switch module 30. When it is detected that one of the multiple functional modules 20 is in the second state, the conduction path of the switch module 30 is controlled, the functional module 20 is disconnected from the interface connection with one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of the functional module 20 through the switch module 30. The present disclosure solves the problem of insufficient number of interfaces without exceeding the cost budget by setting the switch module 30, and the functional module 20 is connected to the interfaces of different processor modules 10 through the switch module 30.

[0102] Based on the same inventive concept, according to a third aspect of the present disclosure, an electronic device is provided. Figure 6 As shown, the electronic device 100 includes: an optical imaging circuit as in any implementation of the first aspect and / or a camera module as described in the second aspect.

[0103] It can be understood that the electronic device can be various electronic devices with a camera function, for example, it can be a wearable electronic device (such as a smart watch, etc.), a tablet computer, a desktop computer, a virtual reality device, an augmented reality device, a camera, a camcorder, or a mobile phone. The embodiments of the present disclosure do not limit the specific form of the electronic device.

[0104] In the present disclosure, when it is detected that one of the multiple functional modules 20 is in the first state, the conduction path of the switch module 30 is controlled, the functional module 20 is connected to the interface of one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of another processor module 10 of the multiple processor modules 10 through the switch module 30. When it is detected that one of the multiple functional modules 20 is in the second state, the conduction path of the switch module 30 is controlled, the functional module 20 is disconnected from the interface connection with one of the multiple processor modules 10 through the switch module 30, and another functional module 20 of the multiple functional modules 20 is connected to the interface of the functional module 20 through the switch module 30. The present disclosure solves the problem of insufficient number of interfaces without exceeding the cost budget by setting the switch module 30, and the functional module 20 is connected to the interfaces of different processor modules 10 through the switch module 30.

[0105] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0106] It is further understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or degree of importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0107] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0108] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.

[0109] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0110] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following scope of rights.

[0111] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. An optical imaging circuit, characterized in that: include: a plurality of processor modules, the processor modules having interfaces, Multiple functional modules; as well as A switch module is electrically connected to the plurality of functional modules and the plurality of processor modules, and each of the functional modules is connected to interfaces of different processor modules through the switch module.

2. The optical image circuit according to claim 1, characterized in that: The switch module is a multiplexer.

3. The optical image circuit according to claim 1, characterized in that: The switch module includes one, and the plurality of functional modules are connected to interfaces of different processor modules through the same switch module, or, The switch modules include a plurality of switch modules, and the plurality of switch modules correspond one-to-one to the plurality of functional modules. Each functional module is connected to interfaces of different processor modules through a corresponding switch module.

4. The optical imaging circuit according to claim 1, characterized in that: The plurality of functional modules include: a first functional module and a second functional module, wherein the first functional module and the second functional module are both electrically connected to the switch module. Wherein, when the first functional module is in an enabled state, the first functional module is connected to an interface of one of the plurality of processor modules through the switch module, and the second functional module is connected to an interface of another of the plurality of processor modules through the switch module; When the first functional module is in a closed state, the first functional module is disconnected from an interface of one of the processor modules through the switch module, and the second functional module is connected to an interface of the same processor module through the switch module.

5. The optical image circuit according to claim 4, characterized in that: The first functional module includes a camera module, Wherein, when the camera module is in an enabled state, the camera module is connected to an interface of one of the plurality of processor modules through the switch module, and the second function module is connected to an interface of another of the plurality of processor modules through the switch module; When the camera module is in a closed state, the camera module is disconnected from an interface of one of the processor modules through the switch module, and the second functional module is connected to an interface of the same processor module through the switch module.

6. The optical image circuit according to claim 4, characterized in that: The second functional module is one or more of an antenna sensor, a magnetic sensor, a proximity sensor, and a light sensor.

7. The optical image circuit according to claim 4, characterized in that: The processor module comprises: A first processor module having a first interface; and A second processor module has a second interface, and the computing power consumption of the second processor module is different from that of the first processor module. Wherein, when the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module, and the second functional module is connected to the second interface of the second processor module through the switch module; When the first functional module is in a closed state, the first functional module is disconnected from the first interface of the first processor module through the switch module, and the second functional module is connected to the first interface of the first processor module through the switch module.

8. The optical image circuit according to claim 7, characterized in that: The first processor module is an intelligent sensor hub, Wherein, when the first functional module is in an enabled state, the first functional module is connected to the intelligent sensor hub through the switch module, and the second functional module is connected to the second interface of the second processor module through the switch module; When the first functional module is in a closed state, the first functional module is disconnected from the smart sensor hub through the switch module, and the second functional module is connected to the smart sensor hub through the switch module.

9. The optical image circuit according to claim 7, characterized in that: The second processor module is an application processor, Wherein, when the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module, and the second functional module is connected to the application processor through the switch module.

10. The optical image circuit according to claim 1, characterized in that: Also includes: A controller is electrically connected to the switch module.

11. The optical imaging circuit according to claim 7, characterized in that: The first processor module also has a third interface, The optical imaging circuit further includes: a third functional module electrically connected to the third interface, Wherein, when the first functional module is in an enabled state, the first functional module is connected to the first interface of the first processor module through the switch module, and the first processor module performs optical image stabilization on the first functional module through the third functional module.

12. A camera module, characterized in that: include: An optical imaging circuit as claimed in any one of claims 1 to 11.

13. An electronic device, characterized in that: include: The optical imaging circuit as described in any one of claims 1 to 11 and / or the camera module as described in claim 12.

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