Color temperature detection module, image processing device and electronic device

Abstract

The application provides a color temperature detection module, an image processing device and an electronic device. The color temperature detection module comprises a diffusion element and a color temperature sensor. The diffusion element comprises a microstructure layer and a substrate layer which are stacked. The microstructure layer is used for diffusing light entering the diffusion element. The substrate layer comprises a plurality of first light transmission portions and a plurality of light shielding portions. Any two adjacent first light transmission portions are provided with the light shielding portion. The color temperature sensor is stacked on one side of the diffusion element. The color temperature sensor comprises a plurality of light sensing portions which are spaced apart. Each first light transmission portion is at least partially stacked with a light sensing portion. The plurality of light sensing portions are used for receiving light which is diffused by the microstructure layer and passes through the plurality of first light transmission portions, and obtaining the color temperature of the light. The color temperature detection module can be used for detecting the color temperature of different regions in a mixed light source environment.

Description

Technical Field

[0001] The present application relates to the field of electronics, and specifically to a color temperature detection module, an image processing device, and an electronic device. Background Art

[0002] Existing color temperature sensors can only roughly determine the color temperature of the environment they are in. In mixed light source environments, such simple color temperature sensors cannot determine the different color temperatures in different areas of the camera's field of view, resulting in the inability to accurately restore the true color of the captured object. Summary of the Invention

[0003] An embodiment of the present application provides a color temperature detection module, which can be used to detect the color temperature of different areas in a mixed light source environment.

[0004] The first embodiment of the present application provides a color temperature detection module, which includes:

[0005] a diffusion element, the diffusion element comprising a stacked microstructure layer and a base layer, the microstructure layer being configured to diffuse light entering the diffusion element, the base layer comprising a plurality of first light-transmitting portions and a plurality of light-shielding portions, the light-shielding portion being disposed between any two adjacent first light-transmitting portions; and

[0006] A color temperature sensor is stacked on one side of the diffusion element, and the color temperature sensor includes a plurality of photosensitive portions arranged at intervals, each of the first light-transmitting portions corresponds to one of the photosensitive portions and is at least partially stacked, and the plurality of photosensitive portions are used to receive the light diffused by the microstructure layer and passing through the plurality of first light-transmitting portions and obtain the color temperature of the light.

[0007] A second embodiment of the present application provides an image processing device, comprising:

[0008] The color temperature detection module described in the embodiment of the first aspect of the present application; and

[0009] A processor is electrically connected to the color temperature sensor of the color temperature detection module, and is used to perform white balance processing on an image captured at the color temperature according to the color temperature detected by the color temperature detection module.

[0010] A third embodiment of the present application provides an electronic device, comprising:

[0011] The color temperature detection module described in the embodiment of the first aspect of the present application;

[0012] A camera module, the camera module being used to capture images; and

[0013] A processor is electrically connected to the color temperature sensor of the color temperature detection module and the camera module, respectively. The processor is used to control the camera module to capture images and to perform white balance processing on the image captured at the color temperature according to the color temperature detected by the color temperature detection module.

[0014] The color temperature detection module of the embodiment of the present application includes a stacked diffusion element and a color temperature sensor, wherein the color temperature sensor includes multiple photosensitive parts, each of which can work independently and is used to detect the color temperature (or spectral information) of different areas within the shooting field of view, so that when the color temperature detection module is in a mixed light source environment, the color temperature of different areas can be more accurately determined. When the color temperature detection module is used for shooting, the color of different areas of the captured image can be restored according to the color temperature of the different areas, reducing the degree of color cast under the mixed light source, and improving the color restoration and shooting effect of the captured image. In addition, the diffusion element includes a stacked microstructure layer and a base layer, wherein the base layer includes multiple first light-transmitting parts and multiple light-shielding parts, and the light-shielding part is provided between any two adjacent first light-transmitting parts. The light-shielding part can block light, avoid or reduce light crosstalk between different first light-transmitting parts, improve the signal-to-noise ratio of the spectral information detected by each photosensitive part, thereby improving the accuracy of the color temperature of the light detected by the photosensitive part, avoiding the situation where the color temperature of each area within the shooting field of view is inaccurately determined, and thus achieving better color restoration and imaging effect of the captured image. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 Schematic diagram of the structure of a color temperature detection module according to an embodiment of the present application.

[0017] Figure 2 The color temperature detection module of an embodiment of the present application is Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0018] Figure 3 Schematic diagram of the structure of the base layer of one embodiment of the present application.

[0019] Figure 4 Schematic diagram of the planar structure of a color temperature sensor according to an embodiment of the present application.

[0020] Figure 5 This is another embodiment of the color temperature detection module of the present application. Figure 1Schematic diagram of the cross-sectional structure in the AA direction.

[0021] Figure 6 yes Figure 2 Enlarged view of the dotted box I in the middle.

[0022] Figure 7 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0023] Figure 8 It is a structural schematic diagram of the base layer of another embodiment of the present application.

[0024] Figure 9 It is a schematic structural diagram of the preparation process of the base layer of one embodiment of the present application.

[0025] Figure 10 The base layer of one embodiment of the present application is along Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0026] Figure 11 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0027] Figure 12 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0028] Figure 13 It is a structural schematic diagram of the base layer of another embodiment of the present application.

[0029] Figure 14 yes Figure 13 Enlarged view of the middle dashed box II.

[0030] Figure 15 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0031] Figure 16 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0032] Figure 17 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0033] Figure 18 This is another embodiment of the color temperature detection module of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0034] Figure 19 1 is a top view of a carrier according to an embodiment of the present application.

[0035] Figure 20 This is a top view of a carrier according to another embodiment of the present application.

[0036] Figure 21 It is a structural diagram of an image processing device according to an embodiment of the present application.

[0037] Figure 22 This is a circuit block diagram of an image processing device according to an embodiment of the present application.

[0038] Figure 23 It is a structural diagram of an electronic device according to an embodiment of the present application.

[0039] Figure 24 This is a schematic diagram of a partially exploded structure of an electronic device according to an embodiment of the present application.

[0040] Figure 25 This is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0041] Description of reference numerals:

[0042] 100-color temperature detection module, 10-diffusion element, 11-microstructure layer, 13-base layer, 131-first light-transmitting part, 133-light-shielding part, 135-light-transmitting connecting part, 137-second light-transmitting part, 13a-light-transmitting substrate, 131a-groove, 30-color temperature sensor, 31-photosensitive part, 50-lens, 70-carrying part, 71-first supporting part, 711-through hole, 73-second supporting part, 200-image processing device, 210-processor, 230-memory, 300-electronic device, 310-processor, 320-camera module, 330-memory, 340-display, 350-middle frame, 360-back cover, 361-first window part, 363-second window part. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] The terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0045] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0046] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0047] With the development of technology, digital camera systems are widely used in various camera devices and portable electronic devices (such as mobile phones, smart watches, and tablets). The subject is refracted by the optical imaging system, and the image is projected onto the photosensitive element. The light signal is converted into an electrical signal, and then the electrical signal is converted into a digital signal. The chip or processor processes and filters it to obtain the image.

[0048] When users shoot scenes under mixed light sources, the camera's image signal processor (ISP) is unable to complete color adaptation under the mixture of different light sources, resulting in the inability to restore the original color of the subject or person under the mixed light source, resulting in poor imaging effects in such scenes. In order to improve the color restoration degree of camera modules (such as mobile phone camera modules) under different light sources, the camera module is equipped with a color temperature sensor. However, this simple color temperature sensor is only suitable for scenes with a single light source and a consistent overall color temperature, and can only roughly determine the color temperature of the environment. For shooting environments with mixed light sources, this simple color temperature sensor cannot determine the different color temperatures of different areas within the field of view of the camera. It may even cause deviations in the recognized color temperature due to the mixing of multiple color temperatures of the mixed light source, resulting in the inability to accurately restore the true color of the photographed object, and the color restoration of the captured image is poor.

[0049] See Figures 1 to 4The present embodiment provides a color temperature detection module 100, which includes a diffusion element 10 and a color temperature sensor 30. The diffusion element 10 includes a stacked microstructure layer 11 and a base layer 13. The microstructure layer 11 is used to diffuse light entering the diffusion element 10 to homogenize the light, so that the light incident on the microstructure layer 11 forms a uniform surface light source for emission. The base layer 13 includes a plurality of first light-transmitting portions 131 and a plurality of light-shielding portions 133. A light-shielding portion 133 is provided between any two adjacent first light-transmitting portions 131. The color temperature sensor 30 is stacked on one side of the diffusion element 10. The color temperature sensor 30 includes a plurality of spaced-apart photosensitive portions 31, each of which corresponds to at least a portion of the stacked photosensitive portions 31. The plurality of photosensitive portions 31 are used to receive the light diffused by the microstructure layer 11 and passing through the plurality of first light-transmitting portions 131 and obtain the color temperature of the light.

[0050] The term "plurality" means greater than or equal to two.

[0051] The “diffusing element 10 ” is also called a diffusion plate or a diffusion sheet, and is used to diffuse light to provide a uniform surface light source.

[0052] It is understandable that the multiple light shielding portions 133 can be arranged at intervals, or can be connected to each other as a whole, or some of the light shielding portions 133 can be connected and some of the light shielding portions 133 can be arranged at intervals. In the drawings of this application, the multiple light shielding portions 133 connected to each other as a whole are used as an example for illustration, and should not be understood as limiting the multiple light shielding portions 133 in the embodiments of this application.

[0053] In a specific embodiment, the plurality of first light-transmitting portions 131 are arranged in an array, and the plurality of light-shielding portions 133 are interconnected as a whole and are disposed around the periphery of each of the first light-transmitting portions 131 .

[0054] It should be noted that the light-shielding portion 133 is provided between any two adjacent first light-transmitting portions 131 . It can be understood that one light-shielding portion 133 or multiple light-shielding portions 133 can be provided between any two adjacent first light-transmitting portions 131 .

[0055] It should be noted that each first light-transmitting portion 131 is at least partially stacked with a corresponding light-sensing portion 31. It is understood that there is a one-to-one correspondence between the light-sensing portions 31 and the first light-transmitting portions 131, with each light-sensing portion 31 corresponding to a corresponding first light-transmitting portion 131, and different light-sensing portions 31 corresponding to different first light-transmitting portions 131. It is also understood that each light-sensing portion 31 is at least partially stacked with a first light-transmitting portion 131, and different light-sensing portions 31 are at least partially stacked with different first light-transmitting portions 131. It is also understood that the orthographic projection of each first light-transmitting portion 131 on the surface of the color temperature sensor 30 facing the diffusion element 10 at least partially stacks with a corresponding light-sensing portion 31, and the orthographic projections of different first light-transmitting portions 131 on the surface of the color temperature sensor 30 facing the diffusion element 10 at least partially stack with different light-sensing portions 31. In a specific embodiment, the orthographic projections of the plurality of first light-transmitting portions 131 on the surface of the color temperature sensor 30 facing the diffusion element 10 and the orthographic projections of the plurality of light-sensitive portions 31 on the surface of the color temperature sensor 30 facing the diffusion element 10 overlap one by one.

[0056] Optionally, the plurality of first light-transmitting portions 131 are arranged in an array, and the plurality of light-sensing portions 31 are arranged in an array.

[0057] It can be understood that the multiple photosensitive parts 31 of the color temperature sensor 30 are light receiving areas, and the areas between adjacent photosensitive parts 31 are non-light receiving areas. When the multiple photosensitive parts 31 are arranged in an array, the non-light receiving areas are in a grid shape.

[0058] Optionally, each photosensitive portion 31 has multiple channels for receiving and detecting (or acquiring) different wavelengths. For example, each photosensitive portion 31 has 11 channels, and the 11 channels can detect spectra of different wavelengths, that is, multi-spectral detection can be realized. Therefore, multiple photosensitive portions 31 can respectively receive spectral information of multiple different regions and obtain color temperatures of multiple different regions.

[0059] It can be understood that the multiple photosensitive parts 31 are independent of each other, and each photosensitive part 31 is used to detect the color temperature of the light passing through its corresponding first light-transmitting part 131. The multiple photosensitive parts 31 can be used to detect the color temperature of different areas within the shooting field of view, thereby realizing the judgment of the color temperature of different areas in the mixed light source scene, thereby achieving better color reproduction effect and imaging effect.

[0060] It should be noted that the photosensitive surface of the color temperature sensor 30 faces the diffusion element 10 , that is, the photosensitive surface of each photosensitive portion 31 faces the diffusion element 10 .

[0061] It should be noted that when the color temperature detection module 100 is in use, light is incident from the side of the diffusion element 10 away from the color temperature sensor 30. After the light is incident on the microstructure layer 11, it is diffused by the microstructure layer 11, thereby homogenizing the light so that the light distribution at each position is uniform. Then it enters the base layer 13, and most of the light incident on the first light-transmitting part 131 passes through the first light-transmitting part 131 and finally enters the photosensitive part 31 of the color temperature sensor 30 and is received by the photosensitive part 31, so that the photosensitive part 31 detects the color temperature of the light based on the spectral information of the received light. The light that is irradiated on the light-shielding portion 133 is absorbed by the light-shielding portion 133, preventing this part of the light from being incident on other first light-transmitting portions 131, thereby causing light interference between different first light-transmitting portions 131. The light that passes through the first light-transmitting portion 131 is received by the photosensitive portion 31 that does not correspond to the first light-transmitting portion 131, thereby avoiding inaccurate color temperature judgment of multiple photosensitive portions 31 on the color temperature sensor 30, and improving the accuracy of the spectral information detected by each photosensitive portion 31 and obtaining the color temperature.

[0062] It can be understood that the plurality of first light-transmitting portions 131 and the light-shielding portions 133 are provided in the same layer, and the plurality of first light-transmitting portions 131 and the light-shielding portions 133 are located on the same side of the microstructure layer 11 .

[0063] Optionally, the number of the first light-transmitting portions 131 and the number of the light-sensitive portions 31 can be set in a one-to-one correspondence, and the size and position of the first light-transmitting portions 131 can be set according to the partitioning conditions and light modulation conditions of the light-sensitive portions 31 .

[0064] The color temperature detection module 100 of the embodiment of the present application includes a stacked diffusion element 10 and a color temperature sensor 30. The color temperature sensor 30 includes multiple photosensitive parts 31. The multiple photosensitive parts 31 can work independently and are respectively used to detect the color temperature (or spectral information) of different areas within the shooting field of view. Therefore, when the color temperature detection module 100 is in a mixed light source environment, the color temperature of different areas can be more accurately judged. Therefore, when the color temperature detection module 100 is used for shooting, the color of different areas of the captured image can be restored according to the color temperature of different areas, thereby reducing the degree of color cast under mixed light sources and improving the color restoration and shooting effect of the captured image. In addition, the diffusion element 10 includes a stacked microstructure layer 11 and a base layer 13, wherein the base layer 13 includes a plurality of first light-transmitting portions 131 and a plurality of light-shielding portions 133. The light-shielding portion 133 is provided between any two adjacent first light-transmitting portions 131. The light-shielding portion 133 can block light, thereby avoiding or reducing light interference between different first light-transmitting portions 131, improving the signal-to-noise ratio of the spectral information detected by each photosensitive portion 31, thereby improving the accuracy of the color temperature of the light detected by the photosensitive portion 31, avoiding inaccurate color temperature judgment of various areas within the shooting field of view, and thus improving the color reproduction and imaging effect of the captured image.

[0065] Optionally, the number of the microstructure layer 11 is one or two. Figure 2 As shown, when the microstructure layer 11 is a single layer, the microstructure layer 11 is disposed on the surface of the base layer 13 facing away from the color temperature sensor 30. Figure 5 As shown, when the microstructure layer 11 is two layers, the two microstructure layers 11 are respectively disposed on the surface of the base layer 13 facing the color temperature sensor 30 and the surface away from the color temperature sensor 30 .

[0066] Optionally, the microstructure layer 11 is made of resin and can be formed by nanoimprinting. When the microstructure layer 11 is a single layer, single-sided nanoimprinting is used, and when the microstructure layer 11 is a two-layer layer, double-sided nanoimprinting is used. The microstructure layer 11 includes a plurality of randomly distributed micro-nanoscale protrusions (not shown) that are used to scatter light, thereby diffusing or diverging the light. The light incident on the diffusion element 10 is mixed and evenly emitted as a uniform surface light source, thereby achieving a uniform light effect.

[0067] Optionally, the microstructure layer 11 is formed by coating a layer of adhesive on the surface of the base layer 13, and performing nano-imprinting on the adhesive layer using a textured mold to form a plurality of randomly distributed protrusions on the adhesive layer. After curing, the adhesive layer having multiple protrusions forms a microstructure layer 11 having multiple protrusions.

[0068] In this embodiment, when the microstructure layer 11 is a single layer, the base layer 13 is arranged between the microstructure layer 11 and the color temperature sensor 30. The microstructure layer 11 can diffuse the light so that the light has better uniformity, and the base layer 13 can increase the distance between the microstructure layer 11 and the color temperature sensor 30, so that the light can be fully diffused in the diffusion element 10, and the light incident on the color temperature sensor 30 has better uniformity. The shading portion 133 of the base layer can absorb light with a larger diffusion angle to prevent light from crosstalk between different first light-transmitting portions 131, thereby improving the accuracy of the spectral information detected by each photosensitive portion 31 and improving the accuracy of the color temperature of different areas in the shooting field of view detected by the photosensitive portion 31.

[0069] In this embodiment, when the microstructure layer 11 is two layers, the surface of the base layer 13 facing the color temperature sensor 30 and the surface of the base layer facing away from the color temperature sensor 30 are both provided with a microstructure layer 11. In this way, through the uniform light effect of the two layers of microstructure layers 11, the light incident on the photosensitive part 31 of the color temperature sensor 30 can have better uniformity, thereby improving the accuracy of color temperature detection of the photosensitive part 31.

[0070] Optionally, the first light-transmitting portion 131 may be made of, but is not limited to, glass or resin.

[0071] Optionally, the light shielding portion 133 may be made of, but not limited to, glass or resin. Optionally, the light shielding portion 133 may be made of, but not limited to, a light absorbing portion, such as a black light absorbing material (e.g., a black ink layer or black glass). The light absorbing portion can absorb light incident on the light shielding portion 133 at excessively large angles, preventing light from crossing between the different first light-transmitting portions 131.

[0072] It can be understood that the first light-transmitting portion 131 and the light-shielding portion 133 can both be made of glass, for example, the first light-transmitting portion 131 is transparent glass and the light-shielding portion 133 is black glass; or, the first light-transmitting portion 131 and the light-shielding portion 133 are both made of resin, for example, the first light-transmitting portion 131 is transparent resin and the light-shielding portion 133 is black resin; or, the first light-transmitting portion 131 is transparent glass and the light-shielding portion 133 is both black resin.

[0073] When the first light-transmitting portions 131 and the light-shielding portions 133 are both made of glass or resin, the plurality of first light-transmitting portions 131 and the light-shielding portions 133 may be an integrated structure, and the base layer 13 may be prepared by processes such as hot-melt drawing.

[0074] See Figure 6 Optionally, the ratio of the width w1 of the first light-transmitting portion 131 to the line width w2 of the light-shielding portion 133 is in the range of 2≤w1 / w2≤100. Further, the ratio of the width w1 of the first light-transmitting portion 131 to the line width w2 of the light-shielding portion 133 is in the range of 30≤w1 / w2≤80. Still further, the ratio of the width w1 of the first light-transmitting portion 131 to the line width w2 of the light-shielding portion 133 is in the range of 40≤w1 / w2≤70. Specifically, the ratio of the width w1 of the first light-transmitting portion 131 to the line width w2 of the light-shielding portion 133 may be, but is not limited to, 2, 5, 10, 15, 20, 30, 40, 50, 60, 70, 80, 90, 100, etc. If the ratio of the width w1 of the first light-transmitting portion 131 to the line width w2 of the light-shielding portion 133 is too small, it means that the first light-transmitting portion 131 is relatively small and the light-shielding portion 133 is relatively large, which makes the area of ​​the light-sensitive portion 31 of the color temperature sensor 30 too small and the area of ​​the non-light-sensitive area too large, thereby reducing the utilization rate of the area of ​​the color temperature sensor 30; if the ratio of the width w1 of the first light-transmitting portion 131 to the line width w2 of the light-shielding portion 133 is too large, it means that the first light-transmitting portion 131 is relatively large and the light-shielding portion 133 is relatively small, thereby reducing the anti-light-channeling effect of the light-shielding portion 133 and increasing the difficulty of preparing the light-shielding portion 133, or even making it impossible to achieve in terms of process.

[0075] Optionally, the line width w2 of the light shielding portion 133 is in the range of 4 μm ≤ w2 ≤ 500 μm. Specifically, the line width w2 of the light shielding portion 133 may be, but is not limited to, 4 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc. If the line width w2 of the light-shielding portion 133 is too small, the anti-light-channeling effect of the light-shielding portion 133 is reduced, and the difficulty of preparing the light-shielding portion 133 is increased, and it may even be impossible to achieve in terms of process; if the line width w2 of the light-shielding portion 133 is too large, the proportion of the first light-transmitting portion 131 is reduced, so that the proportion of the area of ​​the photosensitive portion 31 on the color temperature sensor 30 is too small, and the proportion of the non-photosensitive area is too large, thereby reducing the utilization rate of the area of ​​the color temperature sensor 30.

[0076] In some embodiments, the line width w2 of the light shielding portion 133 is in the range of 4 μm ≤ w2 ≤ 250 μm. In other embodiments, the line width w2 of the light shielding portion 133 is in the range of 20 μm ≤ w2 ≤ 500 μm.

[0077] When the first light-transmitting portion 131 and the light-shielding portion 133 are both made of glass, the base layer 13 can be prepared by hot-melt drawing or other processes and the plurality of first light-transmitting portions 131 and the light-shielding portion 133 are an integrated structure, the line width w2 of the light-shielding portion 133 is in the range of: 4μm≤w2≤250μm.

[0078] Optionally, along the stacking direction of the diffusion element 10 and the color temperature sensor 30, the thickness H1 of the base layer 13 ranges from 0.15 mm to H1 and from 2 mm to 3 mm. Specifically, the thickness H1 of the base layer 13 may be, but is not limited to, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, or 2 mm. If the thickness H1 of the base layer 13 is too thin, the uniformity of the diffusion element 10 is reduced. Poor uniformity of the diffusion element 10 reduces the accuracy of the spectral information detected by the photosensitive portion 31, thereby reducing the accuracy of the color temperature determination. If the thickness H1 of the base layer 13 is too thick, the optical path of the light is too long, and excessive light is absorbed by the diffusion element 10, reducing the efficiency of the color temperature detection module 100.

[0079] See Figure 7 and Figure 8In some embodiments, the base layer 13 has a groove 131a, and the light shielding portion 133 is disposed in the groove 131a. By providing the groove 131a in the base layer 13 and filling the groove 131a with light shielding ink or the like to form the light shielding portion 133, the preparation process of the base layer 13 can be simplified, thereby reducing the preparation cost of the base layer 13.

[0080] Optionally, the number of the grooves 131 a may be one or more, the number of the grooves 131 a corresponds to the number of the light shielding portions 133 , and the shape of the grooves 131 a matches the shape of the light shielding portions 133 .

[0081] In some embodiments, the base layer 13 also includes a light-transmitting connecting portion 135, which is located on the side of the multiple first light-transmitting portions 131 facing the microstructure layer 11, and the light-transmitting connecting portion 135 is connected to the multiple first light-transmitting portions 131, and the light-transmitting connecting portion 135 and the multiple first light-transmitting portions 131 define the groove 131a.

[0082] It can be understood that the base layer 13 of this embodiment includes multiple first light-transmitting parts 131, light-shielding parts 133 and light-transmitting connecting parts 135. The multiple first light-transmitting parts 131 and the light-shielding parts 133 are arranged in the same layer, and the light-transmitting connecting parts 135 are located between the multiple first light-transmitting parts 131 and the microstructure layer 11.

[0083] Optionally, the plurality of first light-transmitting portions 131 and the light-transmitting connecting portion 135 are made of the same material, and the plurality of first light-transmitting portions 131 and the light-transmitting connecting portion 135 are an integrated structure.

[0084] Optionally, the first light-transmitting portion 131 may be made of transparent resin or transparent glass, and the light-transmitting connecting portion 135 may be made of transparent resin or transparent glass. The light-shielding portion 133 may be made of light-absorbing ink, such as black ink.

[0085] See Figure 9 Alternatively, the base layer 13 of this embodiment can be prepared by the following steps:

[0086] 1) Providing a light-transmitting substrate 13a;

[0087] Optionally, the light-transmitting substrate 13a may be a light-transmitting glass substrate or a light-transmitting resin substrate.

[0088] 2) forming a groove 131a on the surface of the light-transmitting substrate 13a; and

[0089] Optionally, a thinner cutter is used to cut from one side of the light-transmitting substrate 13a to form the grooves 131a. Optionally, the grooves 131a are grid-like grooves 131a, which divide the light-transmitting substrate 13a into a plurality of first light-transmitting portions 131 spaced apart from each other. The uncut portions of the light-transmitting substrate 13a form the light-transmitting connecting portions 135, thereby connecting the plurality of first light-transmitting portions 131 and the light-transmitting connecting portions 135 to form an integrated structure.

[0090] 3) Light-absorbing ink is placed in the groove 131 a and cured to form the light-shielding portion 133 .

[0091] Optionally, a light-absorbing ink is applied to the surface of the light-transmitting substrate 13a having the groove 131a, allowing the ink to penetrate the groove 131a and cure to form the light-shielding portion 133. Optionally, the ink on the surface of the light-transmitting substrate 13a is cleaned to prevent the ink from blocking the first light-transmitting portion 131 and thus blocking effective light, thereby affecting the accuracy of the color temperature detection module 100.

[0092] In this embodiment, by providing a light-transmitting connecting portion 135, the plurality of first light-transmitting portions 131 are connected together. This allows the base layer 13 to be formed by cutting grooves in a light-transmitting substrate and filling it with light-absorbing ink. This significantly reduces the cost of preparing the base layer 13 compared to base layers 13 prepared using a hot-melt drawing process. Furthermore, the light-transmitting connecting portion 135 is located on the side of the plurality of first light-transmitting portions 131 and light-shielding portions 133 facing the microstructure layer 11. This provides better support for the microstructure layer 11, making the microstructure layer 11 smoother during nanoimprinting.

[0093] Optionally, when the base layer 13 includes a plurality of first light-transmitting portions 131 , light-shielding portions 133 and light-transmitting connecting portions 135 , the line width w2 of the light-shielding portions 133 is in the range of 20 μm≤w2≤500 μm.

[0094] See Figure 10 In some embodiments, the base layer 13 includes a plurality of first light-transmitting portions 131, light-shielding portions 133, and light-transmitting connecting portions 135. Along the stacking direction of the diffusion element 10 and the color temperature sensor 30, the base layer 13 has a thickness H1, and the light-transmitting connecting portions 135 have a thickness H2, where 1 / 20 ≤ H2 / H1 ≤ 1 / 3. In other words, 3 ≤ H1 / H2 ≤ 20.

[0095] Specifically, along the stacking direction of the diffusion element 10 and the color temperature sensor 30, the ratio of the thickness H2 of the light-transmitting connecting portion 135 to the thickness H1 of the base layer 13 can be, but is not limited to, 1 / 20, 1 / 19, 1 / 18, 1 / 17, 1 / 16, 1 / 15, 1 / 14, 1 / 13, 1 / 12, 1 / 11, 1 / 10, 1 / 9, 1 / 8, 1 / 7, 1 / 6, 1 / 5, 1 / 4, 1 / 3, etc. If the ratio of the thickness H2 of the light-transmitting connecting portion 135 to the thickness H1 of the base layer 13 is too small, the thickness of the light-transmitting connecting portion 135 is too small, thereby reducing the mechanical strength of the base layer 13 and making the base layer 13 easily break; if the ratio of the thickness H2 of the light-transmitting connecting portion 135 to the thickness H1 of the base layer 13 is too large, then the thickness of the light-transmitting connecting portion 135 is too large, and the light incident on different positions of the first light-transmitting portion 131 can easily pass through the light-transmitting connecting portion 135, thereby causing crosstalk, reducing the accuracy of the spectral information detected by different photosensitive portions 31, thereby reducing the accuracy of color temperature detection.

[0096] Optionally, along the stacking direction of the diffusion element 10 and the color temperature sensor 30, the thickness H2 of the light-transmitting connecting portion 135 ranges from 0.05 mm ≤ H2 ≤ 0.1 mm. Specifically, the thickness H2 of the light-transmitting connecting portion 135 may be, but is not limited to, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, etc. If the thickness H2 of the light-transmitting connecting portion 135 is too small, the mechanical strength of the base layer 13 is reduced, making the base layer 13 susceptible to breakage. If the thickness H2 of the light-transmitting connecting portion 135 is too large, light incident on different positions of the first light-transmitting portion 131 can easily pass through the light-transmitting connecting portion 135, causing crosstalk, reducing the accuracy of the spectral information detected by the different photosensitive portions 31, and thus reducing the accuracy of color temperature detection.

[0097] See Figures 11 to 13 In some embodiments, the base layer 13 further includes a plurality of second light-transmitting portions 137 , wherein the second light-transmitting portions 137 are arranged between the first light-transmitting portions 131 and the light-shielding portions 133 , and the refractive index of the first light-transmitting portions 131 is greater than the refractive index of the second light-transmitting portions 137 .

[0098] It can be understood that in this embodiment, the base layer 13 includes a plurality of first light-transmitting portions 131, a plurality of second light-transmitting portions 137, and a light-shielding portion 133. The plurality of first light-transmitting portions 131, the plurality of second light-transmitting portions 137, and the light-shielding portion 133 are all provided in the same layer.

[0099] Optionally, the second light-transmitting portion 137 is disposed around the periphery of the first light-transmitting portion 131, and the light-shielding portion 133 is disposed around the periphery of the second light-transmitting portion 137. Each second light-transmitting portion 137 is disposed around the periphery of one first light-transmitting portion 131, and different second light-transmitting portions 137 are disposed around the peripheries of different first light-transmitting portions 131.

[0100] Optionally, the first light-transmitting portion 131, the second light-transmitting portion 137 and the light-shielding portion 133 are connected in sequence. Optionally, the plurality of first light-transmitting portions 131, the plurality of second light-transmitting portions 137 and the light-shielding portion 133 are an integrated structure.

[0101] Optionally, the first light-transmitting portion 131 may be made of, but not limited to, glass or resin. The second light-transmitting portion 137 may be made of, but not limited to, glass or resin. Optionally, the light-shielding portion 133 may be made of, but not limited to, glass or resin.

[0102] In a specific embodiment, the first light-transmitting portion 131 is a light-transmitting glass with a higher refractive index, the second light-transmitting portion 137 is a light-transmitting glass with a lower refractive index, and the light-shielding portion 133 is black glass. The base layer 13 can be prepared by a process such as hot-melt drawing.

[0103] In this embodiment, the second light-transmitting portion 137 is provided on the periphery of the first light-transmitting portion 131, and the refractive index of the first light-transmitting portion 131 is made greater than the refractive index of the second light-transmitting portion 137. This allows the light to be evenly diffused by the microstructure layer 11. When the light with an excessively large diffusion angle enters the second light-transmitting portion 137 through the first light-transmitting portion 131, the light whose incident angle at the interface between the first light-transmitting portion 131 and the second light-transmitting portion 137 reaches the total reflection angle will be reflected back to the area of ​​the first light-transmitting portion 131 (i.e., the effective area), thereby maximizing the utilization of light and allowing more light to be received by the color temperature sensor 30, thereby improving the light utilization rate, thereby improving the optical efficiency of the color temperature detection module 100, and further improving the color temperature detection module 100. 0 overall light input, so that the color temperature detection module 100 can be used in darker environments and can still accurately detect color temperature in dark environments; in addition, the light that does not undergo total reflection and passes through the second light-transmitting portion 137 is absorbed by the light-shielding portion 133, which can prevent the light from interfering between different first light-transmitting portions 131 and being received by the photosensitive portions 31 in non-corresponding areas, thereby improving the signal-to-noise ratio of the spectral information received by the photosensitive portion 31, and can improve the accuracy of the photosensitive portion 31 in detecting the spectral information, thereby improving the accuracy of the color temperature judgment.

[0104] Optionally, the refractive index of the first light-transmitting portion 131 is n1, and the refractive index of the second light-transmitting portion 137 is n2, wherein 0.7≤n2 / n1≤0.875. Specifically, the ratio of the refractive index n2 of the second light-transmitting portion 137 to the refractive index n1 of the first light-transmitting portion 131 is 0.7, 0.725, 0.75, 0.775, 0.8, 0.825, 0.85, 0.875, etc. If the ratio of the refractive index n2 of the second light-transmitting portion 137 to the refractive index n1 of the first light-transmitting portion 131 is too small, the material requirements for the first light-transmitting portion 131 and the second light-transmitting portion 137 are too high, which increases the cost of the base layer 13; if the ratio of the refractive index n2 of the second light-transmitting portion 137 to the refractive index n1 of the first light-transmitting portion 131 is too large, the requirement for total reflection at the interface between the first light-transmitting portion 131 and the second light-transmitting portion 137 is too high, and a small portion of the light incident on the second light-transmitting portion 137 is totally reflected back to the first light-transmitting portion 131, and the improvement in the light efficiency of the color temperature detection module 100 is not obvious.

[0105] Optionally, the refractive index of the first light-transmitting portion 131 is n1, and the refractive index of the second light-transmitting portion 137 is n2, where 0.2≤n1-n2≤0.6. The difference between the refractive index n1 of the first light-transmitting portion 131 and the refractive index n2 of the second light-transmitting portion 137 can be, but is not limited to, 0.2, 0.3, 0.4, 0.5, 0.6, etc. If the difference between the refractive index n1 of the first light-transmitting portion 131 and the refractive index n2 of the second light-transmitting portion 137 is too small, the requirement for total reflection at the interface between the first light-transmitting portion 131 and the second light-transmitting portion 137 is too high, and a small portion of the light incident on the second light-transmitting portion 137 is totally reflected back to the first light-transmitting portion 131, and the improvement in the light efficiency of the color temperature detection module 100 is not obvious; if the difference between the refractive index n1 of the first light-transmitting portion 131 and the refractive index n2 of the second light-transmitting portion 137 is too large, the material requirements for the first light-transmitting portion 131 and the second light-transmitting portion 137 are too high, thereby increasing the cost of the base layer 13.

[0106] Optionally, the range of the refractive index n1 of the first light-transmitting portion 131 is: 1.6≤n1≤2.0. Specifically, the refractive index n1 of the first light-transmitting portion 131 can be, but is not limited to, 1.6, 1.65, 1.7, 1.75, 1.8, 1.85, 1.9, 1.95, 2.0, etc. If the refractive index n1 of the first light-transmitting portion 131 is too low, the refractive index difference between the first light-transmitting portion 131 and the second light-transmitting portion 137 is too small, and the requirement for total reflection at the interface between the first light-transmitting portion 131 and the second light-transmitting portion 137 is too high. A small portion of the light incident on the second light-transmitting portion 137 is totally reflected back to the first light-transmitting portion 131, and the improvement in the light efficiency of the color temperature detection module 100 is not obvious; if the refractive index n1 of the first light-transmitting portion 131 is too high, the material requirements are too high, which increases the cost of the base layer 13.

[0107] Optionally, the range of the refractive index n2 of the second light-transmitting portion 137 is: 1.3≤n2≤1.6. Specifically, the refractive index n2 of the second light-transmitting portion 137 can be, but is not limited to, 1.3, 1.35, 1.4, 1.45, 1.5, 1.55, 1.6, etc. If the refractive index n2 of the second light-transmitting portion 137 is too high, the refractive index difference between the first light-transmitting portion 131 and the second light-transmitting portion 137 is too small, the requirement for total reflection at the interface between the first light-transmitting portion 131 and the second light-transmitting portion 137 is too high, and the portion of the light incident on the second light-transmitting portion 137 that is totally reflected back to the first light-transmitting portion 131 is small, and the improvement in the light efficiency of the color temperature detection module 100 is not obvious; if the refractive index n2 of the second light-transmitting portion 137 is too low, the material requirements are too high, which increases the cost of the base layer 13.

[0108] See Figure 14 Optionally, the line width w3 of the second light-transmitting portion 137 is in the range of 4μm≤w3≤250μm. Specifically, the line width w3 of the second light-transmitting portion 137 may be, but is not limited to, 4μm, 10μm, 15μm, 20μm, 30μm, 40μm, 50μm, 60μm, 80μm, 100μm, 150μm, 200μm, 250μm, etc. If the line width w3 of the second light-transmitting portion 137 is too small, the manufacturing difficulty of the second light-transmitting portion 137 may be increased, or even impossible in terms of manufacturing process. If the line width w3 of the second light-transmitting portion 137 is too large, the proportion of the first light-transmitting portion 131 is reduced, resulting in the area of ​​the light-sensitive portion 31 on the color temperature sensor 30 being too small and the non-light-sensitive area being too large, thereby reducing the area utilization of the color temperature sensor 30.

[0109] For a detailed description of the line width of the light shielding portion 133, see Figure 5 and Figure 6 The description of the corresponding parts of the embodiment will not be repeated here.

[0110] It should be noted that in the various embodiments of the present application, parameter information such as the thickness of the base layer 13, the ratio of the width of the first light-transmitting portion 131 to the line width of the light-shielding portion 133, etc., can be arbitrarily combined and applicable to any embodiment of the present application unless there is any contradiction and no clear description is given.

[0111] See Figures 15 to 17 In some embodiments, the color temperature detection module 100 further includes a lens 50 , which is disposed on a side of the diffusion element 10 away from the color temperature sensor 30 , and is used to increase the field of view of the color temperature detection module 100 .

[0112] It should be noted that the light in the environment is incident from the side of the lens 50 away from the diffusion element 10, is evenly distributed by the diffusion element 10, and then is incident on the color temperature sensor 30, where it is received and the spectral information of the light is detected, thereby realizing color temperature detection.

[0113] In this embodiment, the field of view of the light received by the diffusion element 10 is limited and generally cannot reach the field of view of the camera module. By disposing a lens 50 on the side of the diffusion element 10 facing away from the color temperature sensor 30, the field of view of the color temperature detection module 100 can be increased. When the color temperature detection module 100 is applied to a device with a camera module, the field of view of the color temperature detection module 100 can be made equivalent to or greater than the field of view of the device's camera module. This allows the field of view detected by the color temperature detection module 100 to correspond to the field of view captured by the camera module, resulting in better color reproduction and better shooting effects for images captured by the camera module.

[0114] See Figure 18 In some embodiments, the color temperature detection module 100 further includes a carrier 70, which is used to support the diffusion element 10 and the color temperature sensor 30. The carrier 70 includes a first support portion 71 and a second support portion 73 connected to each other. The first support portion 71 has a through hole 711, and the second support portion 73 is located in the through hole 711 and protrudes from the inner wall of the first support portion 71. The diffusion element 10 and the color temperature sensor 30 are spaced apart in the through hole 711. The diffusion element 10 is arranged on one side of the second support portion 73 and supported by the second support portion 73. The color temperature sensor 30 is arranged on the side of the second support portion 73 away from the diffusion element 10 and supported by the first support portion 71.

[0115] It can be understood that the second supporting portion 73 is disposed between the diffusion element 10 and the color temperature sensor 30 to support the diffusion element 10 .

[0116] Optionally, the first support portion 71 and the second support portion 73 are integrally formed. The first support portion 71 and the second support portion 73 may be two different parts of the same component. The first support portion 71 and the second support portion 73 are made of the same material and may be integrally formed by injection molding.

[0117] In this embodiment, by providing a carrier 70, the diffusion element 10 and the color temperature sensor 30 can be better assembled together. In addition, by providing a second support portion 73 in the through hole 711 of the first support portion 71, the diffusion element 10 and the color temperature sensor 30 can be kept at a certain distance, so that the light can be more fully diffused after passing through the diffusion element 10, thereby having a better uniform light effect.

[0118] See Figure 19 In some embodiments, the second support portion 73 may be an annular structure. Figure 20 In some other embodiments, the second supporting portion 73 is a convex column, and there are multiple convex columns, which are spaced apart and arranged on the inner wall of the first supporting portion 71.

[0119] Please see again Figure 18 Optionally, the distance d between the diffusion element 10 and the color temperature sensor 30 is in the range of 0.15 mm ≤ d ≤ 1 mm. Specifically, the distance d between the diffusion element 10 and the color temperature sensor 30 may be, but is not limited to, 0.15 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm. The larger the distance d between the diffusion element 10 and the color temperature sensor 30, the better the effect of the diffusion element 10. However, it will increase the interference of light from different first light-transmitting parts 131 or photosensitive parts 31, affecting the accuracy of the spectral information detected by the photosensitive part 31, thereby reducing the accuracy of color temperature detection by the photosensitive part 31; when the distance d between the diffusion element 10 and the color temperature sensor 30 is too large, the accuracy of the color temperature detection module 100 in detecting the color temperature of different areas is reduced; when the distance d between the diffusion element 10 and the color temperature sensor 30 is too small, the uniform light effect of the diffusion element 10 is poor, which will also reduce the accuracy of detection by the color temperature sensor 30.

[0120] See Figure 21 and Figure 22The embodiment of the present application also provides an image processing device 200, which includes the color temperature detection module 100 and the processor 210 described in the embodiment of the present application, the color temperature detection module 100 is used to detect the color temperature of the environment, the processor 210 is electrically connected to the color temperature sensor 30 of the color temperature detection module 100, and the processor 210 is used to perform white balance processing on the image captured under the color temperature according to the color temperature detected by the color temperature detection module 100.

[0121] For a detailed description of the color temperature detection module 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0122] Optionally, the processor 210 includes one or more general-purpose processors, where a general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC. The processor 210 is used to execute various types of digitally stored instructions, such as software or firmware programs stored in memory, which enables the computing device to provide a wide variety of services.

[0123] Optionally, the image processing device 200 of the present application further includes a memory 230. The memory 230 is electrically connected to the processor 210 and is used to store program codes required for the processor 210 to run.

[0124] Optionally, the memory 230 may include volatile memory, such as random access memory (RAM); the memory 230 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). The memory 230 may also include a combination of the above types of memory.

[0125] It can be understood that the image processing device 200 described in this embodiment is merely one form of the image processing device 200 used by the color temperature detection module 100, and should not be understood as a limitation on the image processing device 200 provided in this application, nor should it be understood as a limitation on the color temperature detection module 100 provided in each embodiment of this application.

[0126] See Figures 23 to 25 The embodiment of the present application also provides an electronic device 300, which includes the color temperature detection module 100, the camera module 320 and the processor 310 described in the embodiment of the present application, the color temperature detection module 100 is used to detect the color temperature of the environment, the camera module 320 is used to capture images, and the processor 310 is electrically connected to the color temperature sensor 30 and the camera module 320 of the color temperature detection module 100 respectively. The processor 310 is used to control the camera module 320 to capture images, and is used to perform white balance processing on the image captured at the color temperature according to the color temperature detected by the color temperature detection module 100.

[0127] It is understandable that the color temperature detection module 100 is spaced apart from the camera module 320, and the color temperature detection module 100 and the camera detection module are facing the same scene. It should be noted that when the camera module 320 captures an image, the color temperature detection module 100 simultaneously performs color temperature detection to obtain the color temperature of the environment at the time of the scene captured by the camera module 320. The processor 310 is used to perform white balance processing on the image captured by the camera module 320 at the color temperature according to the color temperature, so that the image captured by the camera module 320 can better restore the color at the time, thereby having a better shooting effect.

[0128] The electronic device 300 of the embodiment of the present application includes but is not limited to vehicle-mounted cameras, computers, laptops, tablet computers, mobile phones, cameras, smart bracelets, smart watches, smart glasses, e-book readers, portable multimedia players, mobile medical devices, game consoles and other electronic devices 300 with shooting functions.

[0129] For a detailed description of the color temperature detection module 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0130] Optionally, the field of view angle of the color temperature detection module 100 is greater than or equal to the field of view angle of the camera module 320, so that the field of view range detected by the color temperature detection module 100 can correspond to the field of view range shot by the camera module 320, and different areas of the image shot by the camera module 320 can be better white balanced according to the color temperature of different areas within the field of view detected by the color temperature detection module 100, thereby improving the color reproduction of the image shot by the electronic device 300 and achieving better shooting effect.

[0131] Optionally, the camera module 320 may be a front camera module 320 or a rear camera module 320, which is not specifically limited in this application.

[0132] Optionally, processor 310 includes one or more general-purpose processors, where a general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC. Processor 310 is used to execute various types of digitally stored instructions, such as software or firmware programs stored in memory, which enables the computing device to provide a wide variety of services.

[0133] Optionally, the electronic device 300 of the present application further includes a memory 330. The memory 330 is electrically connected to the processor 310 and is used to store program codes required for the processor 310 to run, pictures and images taken by the camera module 320, and the like.

[0134] Optionally, the memory 330 may include volatile memory, such as random access memory (RAM); the memory 330 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). The memory 330 may also include a combination of the above types of memory.

[0135] Optionally, the electronic device 300 of the present application also includes a display screen 340, a middle frame 350 and a back cover 360. The display screen 340 is electrically connected to the processor 310 for displaying the image before and after white balance processing. The middle frame 350 is used to support the display screen 340. The back cover 360 is arranged on the side of the middle frame 350 away from the display screen 340. The middle frame 350 and the back cover 360 enclose a receiving space for receiving components of the image processing device 200 such as the color temperature detection module 100 and the processor 310.

[0136] Optionally, the display screen 340 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0137] Optionally, when the camera module 320 is a rear camera module 320, the back cover 360 has a first window portion 361 and a second window portion 363 that are spaced apart. The first window portion 361 corresponds to the color temperature detection module 100, and receives ambient light through the first window portion 361 and detects the color temperature of the ambient light. The second window portion 363 is set corresponding to the camera module 320, and images are captured through the second window portion 363.

[0138] It can be understood that when the camera module 320 is a front camera module, the first window portion 361 and the second window portion 363 can be set on the display screen 340.

[0139] Optionally, the first window portion 361 may be a hollow portion or a solid portion, and the second window portion 363 may also be a hollow portion or a solid portion, which is not specifically limited in this application.

[0140] It can be understood that the electronic device 300 described in this embodiment is merely one form of the electronic device 300 used by the color temperature detection module 100, and should not be understood as a limitation on the electronic device 300 provided in this application, nor should it be understood as a limitation on the color temperature detection module 100 provided in each embodiment of this application.

[0141] Mentioning "embodiments" and "implementation methods" in this application means that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, unless there is a contradiction between them.

[0142] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred implementation modes, ordinary technicians in this field should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A color temperature detection module, characterized in that: include: a diffusion element, the diffusion element comprising a stacked microstructure layer and a base layer, the microstructure layer being configured to diffuse light entering the diffusion element, the base layer comprising a plurality of first light-transmitting portions and a plurality of light-shielding portions, the light-shielding portion being disposed between any two adjacent first light-transmitting portions; and A color temperature sensor is stacked on one side of the diffusion element, and the color temperature sensor includes a plurality of photosensitive portions arranged at intervals, each of the first light-transmitting portions corresponds to one of the photosensitive portions and is at least partially stacked, and the plurality of photosensitive portions are used to receive the light diffused by the microstructure layer and passing through the plurality of first light-transmitting portions and obtain the color temperature of the light.

2. The color temperature detection module according to claim 1, characterized in that: The base layer has a groove, and the light shielding portion is arranged in the groove.

3. The color temperature detection module according to claim 2, characterized in that: The base layer further includes a light-transmitting connecting portion, which is located on a side of the plurality of first light-transmitting portions facing the microstructure layer, is connected to the plurality of first light-transmitting portions, and defines the groove with the plurality of first light-transmitting portions.

4. The color temperature detection module according to claim 1, characterized in that: The base layer further includes a plurality of second light-transmitting portions, wherein the second light-transmitting portions are arranged between the first light-transmitting portions and the light-shielding portions, and the refractive index of the first light-transmitting portions is greater than the refractive index of the second light-transmitting portions.

5. The color temperature detection module according to any one of claims 1 to 4, characterized in that: The ratio of the width w1 of the first light-transmitting portion to the line width w2 of the light-shielding portion is in the range of 2≤w1 / w2≤100.

6. The color temperature detection module according to any one of claims 1 to 4, characterized in that: The line width w2 of the light shielding portion is in the range of 4 μm≤w2≤500 μm.

7. The color temperature detection module according to claim 3, characterized in that: Along the stacking direction of the diffusion element and the color temperature sensor: the thickness of the base layer is H1, and the thickness of the light-transmitting connecting portion is H2, wherein 1 / 20≤H2 / H1≤1 / 3.

8. The color temperature detection module according to claim 7, characterized in that: Along the stacking direction of the diffusion element and the color temperature sensor: the thickness H2 of the light-transmitting connecting portion is in the range of 0.05 mm ≤ H2 ≤ 0.1 mm.

9. The color temperature detection module according to claim 4, characterized in that: The refractive index of the first light-transmitting portion is n1, and the refractive index of the second light-transmitting portion is n2, wherein 0.7≤n2 / n1≤0.

875.

10. The color temperature detection module according to claim 4, characterized in that: The line width w3 of the second light-transmitting portion is in the range of 4 μm≤w3≤250 μm.

11. The color temperature detection module according to claim 1, characterized in that: The number of the microstructure layer is one or two; when the microstructure layer is one, the microstructure layer is arranged on the surface of the base layer facing away from the color temperature sensor; when the microstructure layer is two, the two microstructure layers are respectively arranged on the surface of the base layer facing the color temperature sensor and the surface facing away from the color temperature sensor.

12. The color temperature detection module according to any one of claims 1-4 and 7-11, characterized in that: The color temperature detection module further includes a lens, which is arranged on a side of the diffusion element away from the color temperature sensor, and is used to increase the field of view of the color temperature detection module.

13. The color temperature detection module according to any one of claims 1-4 and 7-11, characterized in that: The color temperature detection module also includes a carrier, which includes a first supporting portion and a second supporting portion connected to each other, the first supporting portion having a through hole, the second supporting portion being arranged in the through hole and protruding from the inner wall of the first supporting portion, the diffusion element and the color temperature sensor being arranged in the through hole with intervals, the diffusion element being arranged on one side of the second supporting portion and supported by the second supporting portion, and the color temperature sensor being arranged on a side of the second supporting portion away from the diffusion element and supported by the first supporting portion.

14. The color temperature detection module according to claim 13, characterized in that: The range of the distance d between the diffusion element and the color temperature sensor is: 0.15 mm≤d≤1 mm.

15. An image processing device, characterized in that: include: The color temperature detection module according to any one of claims 1 to 14; as well as A processor is electrically connected to the color temperature sensor of the color temperature detection module, and is used to perform white balance processing on an image captured at the color temperature according to the color temperature detected by the color temperature detection module.

16. An electronic device, characterized in that: include: The color temperature detection module according to any one of claims 1 to 14; A camera module, wherein the camera module is used to capture images; as well as A processor is electrically connected to the color temperature sensor of the color temperature detection module and the camera module, respectively. The processor is used to control the camera module to capture images and to perform white balance processing on the image captured at the color temperature according to the color temperature detected by the color temperature detection module.

Images