LED packaging structure and LED light source

Abstract

The invention relates to an LED packaging structure and an LED light source, the LED packaging structure comprises an LED chip, a support electrically connected with the LED chip and a packaging colloid, a groove with a horizontal bottom surface is arranged in the support, the side wall of the groove is bent downwards from an opening end and forms a partially elliptical side wall with a reflecting surface, the lower end of the packaging colloid is assembled in the groove, the upper end of the packaging colloid protrudes out of the groove, and the packaging colloid is arranged in the groove. The shape of the groove in the support and the light emitting colloid part are limited to be partially oval, mirror surface treatment is conducted on the side wall of the support, direct light rays A and reflected light rays B emitted from the light emitting colloid part can be effectively regulated and controlled, and the light emitting effect of the light emitting colloid part is improved. By adjusting and controlling the focal length of the groove in the support and the ellipsoid where the light-emitting colloid is located, the shape of the groove in the support and the shape of the light-emitting colloid are adjusted, so that the device can adjust and control the direct incidence deflection angle beta 1 of linear light rays and the reflection deflection angle beta 2 of reflected light rays, and the light-emitting angle and range of the device can be adjusted and controlled according to actual working conditions.

Description

Technical Field

[0001] The present application relates to the field of LED packaging technology, and in particular to an LED packaging structure and an LED light source. Background Art

[0002] At present, miniaturization of LED light sources is an important development direction for achieving ultra-high-density light output. Compared with the cover lens process, the Molding process is now a commonly used process, which has the significant advantages of low cost, high process yield and high consistency.

[0003] At present, the light sources using molding technology basically adopt hemispherical or highly convex packaging glue design. Since the bracket is not designed to match the molding lens, a large amount of light is reflected at the bracket. When the reflected light enters the interface between the molding packaging glue and the air, effective angle control cannot be obtained.

[0004] Therefore, although the light source using the molding process is designed to emit light at a smaller angle, it is difficult to achieve precise control, resulting in a large angle deviation of the light and the inability to achieve effective control of the light. Summary of the invention

[0005] The present application provides an LED packaging structure, which can solve the problem that the bracket and the lens of the existing light source using the molding process are not well matched, resulting in the inaccurate range and angle of the light emitted by the light source.

[0006] The technical solution of the present application is as follows: an LED packaging structure, comprising: LED chips; A bracket electrically connected to the LED chip, wherein a groove with a horizontal bottom surface is provided inside the bracket, and the side wall of the groove is bent downward from the open end to form a partial elliptical side wall with a reflective surface, and a focus 1 close to the groove and a focus 2 far from the groove are defined on the ellipse where the partial elliptical side wall is located, and the LED chip is arranged on the bottom surface of the groove and coincides with the position of the focus 1; An encapsulating colloid, wherein the lower end of the encapsulating colloid is assembled in the groove, and the upper end protrudes out of the groove to form a light emitting colloid portion with a partially elliptical cross-section, and a focus three away from the light emitting colloid portion is defined on the ellipse where the light emitting colloid portion is located, and the focus three is located at any point on the line between the focus one and the focus two; The light emitted from the LED chip at one focus and emitted from the light emitting colloid part is defined as direct light, and the angle between the direct light and the line connecting the focus 1 and the focus 2 is defined as direct deflection angle β1; The light emitted from the LED chip at the first focus, reflected from the partial elliptical side wall, passes through the second focus, and is emitted from the light-emitting colloid portion is defined as the reflected light, and the angle between the reflected light and the line connecting the first focus and the second focus is defined as the reflection deflection angle β2; By adjusting the relative positions among the focus three, focus one and focus two, the angle of the direct deflection angle β1 of the direct light can be changed. At the same time, the shape of the bracket can be adjusted to change the angle of the reflected light entering the light emitting colloid part after being reflected by the partial elliptical side wall, and finally change the angle of the reflection deflection angle β2.

[0007] By adopting the above scheme, by limiting the shape of the internal groove of the bracket and the light-emitting colloid part to a partial ellipse and performing mirror treatment on the side walls, the direct light A and the reflected light B emitted from the light-emitting colloid part can be effectively regulated. By adjusting the focal length of the internal groove of the bracket and the ellipsoid where the light-emitting colloid is located, and then adjusting the shape of the internal groove of the bracket and the light-emitting colloid, the device can regulate the direct deflection angle β1 of the straight light and the reflection deflection angle β2 of the reflected light, so that the light output angle and range of the device can be regulated according to actual working conditions.

[0008] In one embodiment of the present application, the encapsulation colloid further includes: an assembly colloid portion and a plate-shaped connecting colloid portion, the assembly colloid portion is arranged in the groove, the connecting colloid portion is horizontally arranged at the upper end of the assembly colloid portion, and its horizontal cross-sectional area is equal to the horizontal cross-sectional area of ​​the bracket, and the light emitting colloid portion is arranged at the upper end of the connecting colloid portion.

[0009] By adopting the above solution, a plate-shaped connecting colloid part is provided to ensure that the light is transmitted normally and evenly, and both sides thereof extend to the upper end of the bracket, so that the encapsulated colloid is more stable during assembly.

[0010] In one embodiment of the present application, the reflectivity of the partial elliptical side wall is not less than 96%, and the refractive index n1 of the encapsulating colloid satisfies: 1.3≤n1≤1.5.

[0011] By adopting the above solution, the refractive index range of the encapsulating colloid is limited, thereby limiting the refractive index range of the ellipsoid where the light emitting colloid portion is located, thereby facilitating the control of the light emitting range of the device when the light is emitted.

[0012] In one embodiment of the present application, the LED packaging structure further includes a bracket soldering pad, and the bracket soldering pad is arranged on both sides of the bottom of the bracket.

[0013] By adopting the above solution, by setting a soldering pad under the bracket, the LED packaging structure can be assembled on the substrate of the external light source and electrically connected to the circuit layer of the external light source. The device can assemble multiple LED packaging structures in a dot matrix in different quantities according to actual needs to achieve an ideal light output effect.

[0014] In one embodiment of the present application, a fluorescent film is provided on the LED chip, and a thickness d of the fluorescent film satisfies: 10um≤d≤100um.

[0015] By adopting the above technical solution and limiting the thickness of the fluorescent film, the width of the side light emitting surface of the LED chip is further reduced, thereby reducing the impact on the light emitting range of the entire device, while ensuring a good light emitting effect.

[0016] In one embodiment of the present application, the thickness of the connecting colloid part is greater than 50um, and the upper and lower surfaces of the connecting colloid part form a circular first connecting circle and a second connecting circle with the assembly colloid part and the light emitting colloid part respectively. The first connecting circle is provided with a plurality of first connecting points, and the second connecting circle corresponds to a second connecting point with the shortest distance from each first connecting point, and the angle b between the first connecting point and the second connecting point and the focal point one is not greater than 10°.

[0017] By adopting the above solution, since the light emitted by the LED chip and outwardly through the connecting colloid part cannot converge with the light beam emitted by the device due to refraction, the thickness of the connecting part can be limited, so that the amount of light in this part can be effectively reduced, thereby effectively reducing the loss of light energy.

[0018] In one embodiment of the present application, the LED chip is a thin film chip, the width of the side light emitting surface of the LED chip is not greater than 10 um, and the length of the LED chip is not greater than 30% of the diameter of the circle where the opening end of the groove is located.

[0019] In one embodiment of the present application, the first connecting ring and the second connecting ring have the same area.

[0020] By adopting the above solution, a thin film chip with a smaller thickness is used, and the width of the side light and the size of the LED chip are further limited, thereby effectively avoiding the situation where the light type is affected due to more light from the side of the LED chip.

[0021] In one embodiment of the present application, an angle a between a line connecting the first connection point and the focus three and a normal direction of a tangent line where the first connection point is located is not greater than 30°.

[0022] By adopting the above scheme, the angle range of the light beam entering the luminescent colloid layer is limited, and then the range of the entire light beam is limited, the amount of light that is totally reflected when entering the luminescent colloid layer is reduced, the situation in which the light output angle is affected by total reflection is avoided, and the light output effect is optimized.

[0023] A second object of the present invention is to provide an LED light source.

[0024] In order to achieve the above purpose, the technical solution of this application is as follows: An LED light source includes a plurality of LED packaging structures. By adjusting the angles and ranges of light beams emitted by the plurality of LED packaging structures, the range and angle of the light beams irradiated by the LED light source can be controlled and made more uniform.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. By limiting the shape, size and installation position of the light-emitting colloid part and the bracket, and performing mirror treatment on the inner wall of the bracket, the device can effectively control the angle of the reflected light reflected on the bracket and emitted from the light-emitting colloid part and the direct light emitted from the LED chip and directly emitted from the light-emitting colloid part, thereby limiting the light-emitting direction and light-emitting range of the entire device, and further controlling the light-emitting range of the entire light beam.

[0026] 2. By limiting the thickness of the connecting colloid part, the amount of light emitted by the LED chip and incident on the connecting colloid part is reduced, and the amount of light incident on the connecting colloid part but unable to emit light normally is reduced, thereby reducing the loss of light energy.

[0027] 3. By limiting the width of the side light-emitting surface of the chip, the amount of light emitted from the side light-emitting surface is reduced, thereby reducing the influence of this part of the light on the overall light-emitting range and light-emitting effect of the device.

[0028] 4. By limiting the range of the angle of the light beam entering the luminescent colloid layer, the range of the entire light beam is limited, and at the same time, the amount of light that is totally reflected when the light enters the luminescent colloid layer is reduced, thereby avoiding the situation where the light output angle is affected by total reflection and optimizing the light output effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a light path schematic diagram of an LED packaging structure provided in an embodiment of the present application; Figure 2 This is a light path diagram of the side light emission of an LED chip in an LED packaging structure provided in an embodiment of the present application; Figure 3 It is a light emitting schematic diagram of a thin film chip of an LED packaging structure provided in an embodiment of the present application; Figure 4 is a cross-sectional schematic diagram of a colloid portion connected to an LED packaging structure provided in an embodiment of the present application; Figure 5 This is a schematic diagram of the light path of an LED packaging structure provided in the first embodiment of the present application when light is emitted at three focal points.

[0030] Explanation of the reference numerals in the accompanying drawings: 1. bracket; 11. partially elliptical side wall; 12. groove; 2. encapsulating colloid; 21. assembling colloid part; 22. connecting colloid part; 221. first connecting ring; 222. second connecting ring; 23. light-emitting colloid part; 3. LED chip; 31. fluorescent film; 4. bracket pad; G1. focus one; G2. focus two; G3. focus three; L1. first connecting point; L2. second connecting point; A. direct light; B. reflected light. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-5 An LED packaging structure provided in the present application is further described in detail.

[0032] See also Figure 1 , is an LED packaging structure provided in an embodiment of the present application, comprising: an LED chip 3, a bracket 1 electrically connected to the LED chip 3, and a packaging colloid 2, wherein the bracket 1 is electrically connected to the LED chip 3, a groove 12 with a horizontal bottom surface is provided inside the bracket 1, the side wall of the groove 12 is bent downward from the open end, and forms a partially elliptical side wall 11 with a reflective surface, and a focus G1 close to the groove 12 and a focus G2 far away from the groove 12 are defined on the ellipse where the partially elliptical side wall 11 is located, the LED chip 3 is arranged on the bottom surface of the groove 12, and coincides with the focus G1, the lower end of the packaging colloid 2 is assembled in the groove 12, the upper end protrudes out of the groove, and forms a light emitting colloid part 23 with a partially elliptical cross-section, and a focus G3 far away from the light emitting colloid part 23 is defined on the ellipse where the light emitting colloid part 23 is located, and the focus G3 is located at any point on the line between the focus G1 and the focus G2; The light emitted by the LED chip 3 at the focus 1 G1 and emitted from the light emitting colloid part 23 is defined as a direct light ray A, and the angle between the direct light ray A and the line connecting the focus 1 G1 and the focus 2 G2 is defined as a direct deflection angle β1. The light emitted by the LED chip 3 at the focus 1 G1, after being reflected by the partial elliptical side wall 11, passes through the focus 2 G2 and is emitted from the light emitting colloid part 23 is defined as a reflected light ray B, and the angle between the reflected light ray B and the line connecting the focus 1 G1 and the focus 2 G2 is defined as a reflection deflection angle β2. The relative positions among the focus 3 G3, the focus 1 G1 and the focus 2 G2 are regulated to change the angle of the direct deflection angle β1 of the direct light ray A. Meanwhile, the shape of the bracket 1 can be regulated to change the angle at which the reflected light ray B enters the light emitting colloid part 23 after being reflected by the partial elliptical side wall 11, and finally the angle of the reflection deflection angle β2 is changed.

[0033] After the LED chip 3 emits light, part of the light is reflected by the partial elliptical side wall 11 and emitted from the packaging colloid 2 . The reflective surface of the partial elliptical side wall 11 may be polished or coated with a high-reflection film.

[0034] In related technologies, generally speaking, there must be reflection between two heterogeneous interfaces, and its reflectivity follows the Fresnel reflection coefficient, that is: Among them, Rp and Rs are the reflection coefficients of p-polarized light and s-polarized light respectively, n0 and n1 are the refractive indices of the incident and refracting materials at the interface respectively, θi and θt are the incident angle and refraction angle of the light respectively; It can be obtained that, for the light emitting colloid part 23 in the present device, when the light is incident from the LED chip 3 to the light emitting colloid part 23, as the light deflects along the major axis direction of the ellipsoid where the light emitting colloid part 23 is located toward the minor axis direction, the incident angle will become larger and larger, thereby causing the refraction angle to become larger and larger, and then causing the reflection ratio caused by the interface refractive index difference to become larger and larger, and the reflected light will cause the generation of invalid light. Therefore, in order to control this proportion, it is necessary to control the incident angle of the light emitting colloid part 23. Since the light incident on the light emitting colloid part 23 is the direct light A and the reflected light B, regulating the direct light A and the reflected light B can effectively reduce the generation of invalid light. In the present embodiment, the eccentricity e of the ellipsoid where the light emitting colloid part 23 is located satisfies e=c / a=n0 / n1 (Formula 2), wherein c is the semi-focal length of the ellipsoid where the light emitting colloid part 23 is located, a is the long semi-axis of the ellipsoid where the light emitting colloid part 23 is located, n1 is the refractive index of the ellipsoid where the light emitting colloid part 23 is located, and n0 is the refractive index of air. Since the refractive index n0 of air is constant, and the refractive index n1 of the light emitting colloid part 23 can also be determined according to the material of the light emitting colloid part 23, it is only necessary to ensure that the light emitting colloid The shape of the body 23 can satisfy Formula 2, that is, the light emitting colloid portion 23 becomes a component with a partially elliptical cross-section, so that the focus of the light emitting colloid portion 23 can be defined, and the light emitted to the light emitting colloid portion 23 through the focus three G3 can be emitted in parallel. At the same time, the distance of the focus three G3 between the focus one G1 and the focus two G2 can be adjusted, so that the device can adjust the refraction angles of the direct light A and the reflected light B in the light emitting colloid portion 23 to change the range of the direct deflection angle β1 and the reflected deflection angle β2.

[0035] In this embodiment, the LED chip 3 is arranged at the focus 1 G1. According to the basic theorem of optics, the light emitted from the focus 1 of the ellipsoid will pass through another focus after being reflected by the surface of the ellipsoid. Therefore, in this device, the reflected light B emitted from the focus 1 G1 can definitely pass through the focus 2 G2. At this time, by adjusting the shape of the partial elliptical side wall 11 and the position of the focus 3 relative to the focus 1 and the focus 2, the angle of the reflected light B passing through the focus 2 G2 can be adjusted, thereby adjusting the incident angle and range of the reflected light B when it enters the air at the light emitting colloid portion 23, thereby changing the value of the reflection deflection angle β2, and then changing the light emitting angle and range of the reflected light B when it is emitted from the light emitting colloid portion 23; In addition, the direct light A emitted from the LED chip 3 to the light emitting colloid portion 23 can also control the light emitting angle and range of the direct light A when it is emitted from the light emitting colloid portion 23 by adjusting the position of the focus 3 relative to the focus 1 and the focus 2, and then adjusting the value of the direct deflection angle β1. The regulated reflected light B and the direct light A are combined to form a light beam emitted by the entire LED packaging structure, and then the angle and range of the entire light beam can be adjusted; It should be noted that in one of the embodiments, please refer to Figure 1 When the shape of the light emitting colloid portion 23 is adjusted so that the position of the focus three G3 is located at the midpoint of the line between the focus one G1 and the focus two G, the direct deflection angle β1 and the reflection deflection angle β2 are equal. At this time, more than 95% of the light emitted by the LED chip 3 can be emitted from the light emitting colloid portion 23 within the small angle range where the deflection angle is less than β1.

[0036] In another embodiment, please refer to Figure 5When the shape of the light emitting colloid part 23 is adjusted so that the focus three G3 of the ellipsoid where it is located coincides with the focus one G1 of the ellipsoid where the bracket is located, the direct light A is emitted from the focus three G3 of the light emitting colloid part 23, so it can emit light parallel to the long axis direction of the light emitting colloid part 23; After the reflected light B is emitted from the focus three G3, since the focus three G3 coincides with the focus one G1, that is, relative to the bracket 1, the light is emitted at the focus one G1, and after being reflected at the partial elliptical side wall 11, it can pass through the focus two G2. At this time, relative to the light emitting colloid part 23, the light that passes through the focus two G2 and is emitted into the surface of the light emitting colloid part 23, since the elliptical focus of the light emitting colloid part 23 is at the position G1 at this time, and the position G2 is far away from G1, the reflected light B will be emitted at a larger angle when it is emitted from the light emitting colloid part 23, resulting in a larger beam angle of the light reflected by this part of the reflection cup, and the light source presents a light distribution with strong light intensity at the middle parallel angle and weak light emission in a large angle range, which is suitable for far-field point light source application environment.

[0037] The packaging colloid 2 also includes: an assembly colloid portion 21 and a plate-shaped connecting colloid portion 22, the assembly colloid portion 21 is arranged in the groove 12, the connecting colloid portion 22 is horizontally arranged at the upper end of the assembly colloid portion 21, and its horizontal cross-sectional area is equal to the horizontal cross-sectional area of ​​the bracket 1, and the light emitting colloid portion 23 is arranged at the upper end of the connecting colloid portion 22. When the light is emitted from the LED chip 3, the light can be directly emitted or reflected, and pass through the assembly colloid portion 21 and the connecting colloid portion 22 in sequence to reach the light emitting colloid portion 23, thereby realizing stable propagation of light.

[0038] In this embodiment, the material of the packaging colloid 2 can be organic silica gel or organic resin material, wherein the organic resin material can be silicone resin, epoxy resin or fluororesin.

[0039] The reflectivity of the partial elliptical side wall 11 is not less than 96%, and the refractive index n1 of the encapsulation colloid 2 satisfies: 1.3≤n1≤1.5, wherein the bottom surface of the groove 12 can be coated with a light-absorbing material coating, which can effectively absorb the stray light emitted from the side of the LED chip 3, avoid the light from being reflected at this place and thus affecting the light-emitting effect of the entire device, so that the device can emit light at a small angle; in addition, the bottom surface of the groove 12 can also be set as a scattering surface, so that the stray light emitted from the side of the LED chip 3 is evenly scattered in all directions on the scattering surface, which is low in cost and can ensure the light-emitting efficiency of the device.

[0040] In this embodiment, for the actual application of high-efficiency white light LED light source products, a coating with high reflectivity can also be added to the bottom surface of the groove 12. By reducing the absorption of light by the bracket, even if reflection occurs at the bottom surface of the groove 12, it will not affect the light output effect of the entire device.

[0041] See also Figure 1 The LED packaging structure also includes a bracket pad 4, which is arranged on both sides of the bottom of the bracket 1. When the device needs to be assembled in a light source, the bracket pad 4 is coated with a welding layer and reflow-soldered on the circuit layer of an external light source to achieve integration and circuit connection between multiple LED packaging structures.

[0042] In this embodiment, the LED chip 3 and the bracket 1 are electrically connected by welding and electrically connecting the LED chip 3 and the bracket 1 using electrode pads.

[0043] See also Figure 3 The LED chip 3 is provided with a fluorescent film 31, and the thickness d of the fluorescent film 31 satisfies: 10um≤d≤100um, wherein the thickness of the fluorescent film 31 can be 50um.

[0044] In this embodiment, when the device is required to emit monochromatic light, the LED chip 3 may be a chip corresponding to emitting monochromatic light; When the device needs to emit white light, the LED chip 3 can be provided with a fluorescent film 31 of other colors on the monochromatic light chip, and the fluorescent film 31 is mixed with the monochromatic light emitted by the LED chip 3 to form white light.

[0045] See also Figure 4 The thickness of the connecting colloid part 22 is greater than 50um, and the upper and lower surfaces of the connecting colloid part 22 respectively form a circular first connecting circle 221 and a second connecting circle 222 with the assembly colloid part 21 and the light emitting colloid part 23. The first connecting circle 221 is provided with a plurality of first connecting points L1, and the second connecting circle 222 corresponds to a second connecting point L2 with the shortest distance from each first connecting point L1. The angle b between the first connecting point L1 and the second connecting point L2 and the focal point G1 is not greater than 10°. By limiting the thickness of the connecting colloid part 22, the entire packaging colloid 2 can be well bonded while minimizing the amount of light emitted by the LED chip 3 and shot into the connecting colloid part 22 to reduce the loss of light energy.

[0046] In this embodiment, under the premise that the thickness of the connecting colloid part 22 is greater than 50um, the angle b must be less than 10°. According to experiments, when the angle b is 5°, the light energy lost by the entire device is about 3%, thereby effectively reducing the loss of light energy.

[0047] See also Figure 2 and Figure 3The LED chip 3 is a thin film chip, the width of the side light emitting surface of the LED chip 3 is not greater than 10 um, and the length of the LED chip 3 is not greater than 30% of the diameter of the circle where the opening end of the groove 12 is located.

[0048] The first connecting ring 221 and the second connecting ring 222 have equal areas, use thin-film chips with smaller thickness, and limit the size of the entire LED chip 3. By utilizing the effect of the narrower width of the side light-emitting surface, the situation in which the light-emitting range of the device is affected by the side light-emitting is reduced.

[0049] The angle a between the line connecting the first connection point L1 and the focus three G3 and the normal direction of the tangent line at the first connection point L1 is not greater than 30°. By limiting the range of angles at which the light beam is incident on the luminescent colloid layer, the amount of light that is totally reflected when entering the luminescent colloid layer is reduced, thereby avoiding the situation in which the light output angle is affected by total reflection and optimizing the light output effect.

[0050] In this embodiment, since the total reflection angle of the air interface is about 45°, we can find that according to the above Fresnel reflection coefficient formula: Its reflectivity is about 3% at an incident angle of 10°; Its reflectivity is about 4% when the incident angle is 20°; When the incident angle is 30°, its reflectivity increases significantly to 7%; Therefore, it is controlled that the angle a is preferably less than 20°, and the minimum value of the entire light beam is determined. It can be further determined that the incident angle of the entire light beam will not cause total reflection, thereby reducing the impact on the light-emitting effect of the entire device, so that the device can emit light at a small angle.

[0051] A second object of the present invention is to provide an LED light source.

[0052] In order to achieve the above purpose, the technical solution of this application is as follows: An LED light source includes a plurality of LED packaging structures. By adjusting the angles and ranges of light beams emitted by the plurality of LED packaging structures, the range and angle of the light beams irradiated by the LED light source can be controlled and made more uniform.

[0053] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An LED packaging structure, characterized in that: include: LED chips (3); A bracket (1) electrically connected to an LED chip (3), wherein a groove (12) with a horizontal bottom surface is provided inside the bracket (1), the side wall of the groove (12) is bent downward from an open end to form a partial elliptical side wall (11) with a reflective surface, and a focus 1 (G1) close to the groove (12) and a focus 2 (G2) far from the groove (12) are defined on the ellipse where the partial elliptical side wall (11) is located, and the LED chip (3) is arranged on the bottom surface of the groove (12) and coincides with the position of the focus 1 (G1); A packaging colloid (2), wherein the lower end of the packaging colloid (2) is assembled in the groove (12), and the upper end protrudes out of the groove (12) to form a light emitting colloid portion (23) having a partially elliptical cross-section, and a third focus (G3) away from the light emitting colloid portion (23) is defined on the ellipse where the light emitting colloid portion (23) is located, and the third focus (G3) is located at any point on the line between the first focus (G1) and the second focus (G2); The light emitted by the LED chip (3) at the focal point 1 (G1) and emitted from the light emitting colloid portion (23) is defined as a direct light (A), and the angle between the direct light (A) and the line connecting the focal point 1 (G1) and the focal point 2 (G2) is defined as a direct deflection angle β1; The light emitted by the LED chip (3) at the first focal point (G1), after being reflected by the partial elliptical side wall (11), passes through the second focal point (G2), and is emitted from the light emitting colloid portion (23) is defined as a reflected light (B), and the angle between the reflected light (B) and the line connecting the first focal point (G1) and the second focal point (G2) is defined as a reflection deflection angle β2; The relative positions among the focus three (G3), the focus one (G1) and the focus two (G2) are adjusted, thereby changing the angle of the direct deflection angle β1 of the direct light (A). At the same time, the shape of the bracket (1) can be adjusted, thereby changing the angle at which the reflected light (B) enters the light emitting colloid portion (23) after being reflected by the partially elliptical side wall (11), and finally changing the angle of the reflection deflection angle β2.

2. The LED packaging structure according to claim 1, characterized in that: The encapsulating colloid (2) further comprises: an assembling colloid portion (21) and a plate-shaped connecting colloid portion (22); the assembling colloid portion (21) is arranged in the groove (12); the connecting colloid portion (22) is horizontally arranged at the upper end of the assembling colloid portion (21), and its horizontal cross-sectional area is equal to the horizontal cross-sectional area of ​​the bracket (1); and the light emitting colloid portion (23) is arranged at the upper end of the connecting colloid portion (22).

3. The LED packaging structure according to claim 1, characterized in that: The reflectivity of the partially elliptical side wall (11) is not less than 96%, and the refractive index n1 of the encapsulating colloid (2) satisfies: 1.3≤n1≤1.

5.

4. The LED packaging structure according to claim 1, characterized in that: The LED packaging structure also includes a bracket soldering pad (4), and the bracket soldering pad (4) is arranged on both sides of the bottom of the bracket (1).

5. The LED packaging structure according to claim 1, characterized in that: A fluorescent film (31) is provided on the LED chip (3), and the thickness d of the fluorescent film (31) satisfies: 10 um≤d≤100 um.

6. The LED packaging structure according to claim 2, characterized in that: The thickness of the connecting colloid part (22) is greater than 50 um, and the upper and lower surfaces of the connecting colloid part (22) respectively form a circular first connecting circle (221) and a second connecting circle (222) with the assembly colloid part (21) and the light emitting colloid part (23), the first connecting circle (221) is provided with a plurality of first connecting points (L1), the second connecting circle (222) corresponds to a second connecting point (L2) with the shortest distance from each first connecting point (L1), and the angle b between the lines connecting the first connecting point (L1) and the second connecting point (L2) and the focus 1 (G1) is not greater than 10°.

7. The LED packaging structure according to claim 6, characterized in that: The LED chip (3) is a thin film chip, the width of the side light emitting surface of the LED chip (3) is not greater than 10 um, and the length of the LED chip (3) is not greater than 30% of the diameter of the circle where the opening end of the groove (12) is located.

8. The LED packaging structure according to claim 7, characterized in that: The first connecting ring (221) and the second connecting ring (222) have equal areas.

9. The LED packaging structure according to claim 7, characterized in that: An angle a between a line connecting the first connection point (L1) and the third focal point (G3) and a normal direction of a tangent line where the first connection point (L1) is located is not greater than 30°.

10. An LED light source, characterized in that: It comprises a plurality of LED packaging structures as described in any one of claims 1 to 9, and by adjusting the angle and range of the light beams emitted by the plurality of LED packaging structures, the range and angle of the light beam irradiated by the LED light source can be controlled and made more uniform.

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