Laser processing system, control method and laser

Abstract

The application discloses a kind of laser processing system, control method and laser, it is related to laser processing technical field, discloses a kind of laser processing system, comprising: acquisition module, control module and laser emission module;Acquisition module connects control module;Control module connects laser emission module.The acquisition module is used to detect the working data of laser processing, and the working data is transmitted to the control module, and the working data includes the temperature of laser processing point;The control module is used to receive the working data, and based on the working data, the corresponding adjustment instruction is output to the laser emission module;The laser emission module is used to receive the adjustment instruction, and the laser beam corresponding to the adjustment instruction is generated.By real-time online measurement of the temperature of laser processing point, the system can ensure the processing quality by high-precision temperature control, improve system stability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser processing system, a control method and a laser. BACKGROUND

[0002] Laser processing technology is a processing technology that uses the characteristics of laser beam and material interaction to cut, weld, surface treat, punch and micro-process materials. After focusing, the laser beam can produce extremely high energy density in a very small area, which can quickly melt, vaporize or chemically react the material, so as to realize the precise processing of the material.

[0003] Because laser processing technology depends on power, cutting path and other attributes, and the traditional laser processing technology has the problem of low precision, which can easily cause damage to the material to be processed or damage to the processing equipment. SUMMARY

[0004] The main purpose of the present application is to provide a laser processing system, a control method and a laser, which aims to solve the technical problems of low precision of traditional laser processing technology parameters and unstable system.

[0005] To achieve the above purpose, the present application provides a laser processing system, which comprises a collection module, a control module and a laser emission module; the collection module is connected to the control module; the control module is connected to the laser emission module; the collection module is used to detect the working data of laser processing and transmit the working data to the control module, the working data including the temperature of the laser processing point; the control module is used to output corresponding adjustment instructions to the laser emission module based on the working data after receiving the working data; the laser emission module is used to generate a laser beam corresponding to the adjustment instruction when receiving the adjustment instruction.

[0006] In an embodiment, the laser processing system further comprises a trajectory generation module; the collection module is further connected to the trajectory generation module; the trajectory generation module is connected to the control module; the working data further comprises processing area information and position information of the material to be processed; the collection module is further used to transmit the processing data to the trajectory generation module; the trajectory generation module is further used to generate a to-be-processed trajectory based on the processing data and transmit the to-be-processed trajectory to the control module; and the control module controls the movement of the laser emission module based on the to-be-processed trajectory.

[0007] In an embodiment, the laser processing system further comprises a trajectory correction module; the trajectory generation module is further connected to the trajectory correction module; the trajectory correction module is connected to the control module; the trajectory generation module is further configured to transmit the to-be-processed trajectory to the trajectory correction module; the trajectory correction module is configured to simulate laser processing based on the to-be-processed trajectory, correct the to-be-processed trajectory based on a result of the simulated laser processing, and transmit the corrected to-be-processed trajectory to the control module; and the control module is further configured to control the laser emission module to move based on the corrected to-be-processed trajectory.

[0008] In an embodiment, the laser processing system further comprises a communication module and an interaction module; the communication module is connected to the control module and the interaction module, respectively; the control module is further configured to transmit the received work data and the to-be-processed trajectory to the interaction module through the communication module; and the interaction module is configured to generate an interaction instruction based on a user behavior and transmit the interaction instruction to the control module to control the laser emission module.

[0009] In addition, to achieve the above object, the present application further provides a laser device, which applies the laser processing system as described above.

[0010] In addition, to achieve the above object, the present application further provides a laser processing control method, which applies the laser device as described above, and the method comprises the following steps: detecting a temperature of a laser processing point; determining whether the temperature of the laser processing point is within a preset temperature range; and adjusting a laser beam generated by a laser emission module to make the temperature of the laser processing point fall within the preset temperature range when the temperature of the laser processing point is outside the preset temperature range.

[0011] In an embodiment, before the step of adjusting the laser beam generated by the laser emission module to make the temperature of the laser processing point fall within the preset temperature range when the temperature of the laser processing point is outside the preset temperature range, the method further comprises the following steps: collecting processing region information and position information of a to-be-processed material; generating a to-be-processed trajectory based on the processing region information and the position information of the to-be-processed material; and controlling the laser emission module to move based on the to-be-processed trajectory.

[0012] In an embodiment, the step of generating the to-be-processed trajectory based on the processing region information and the position information of the to-be-processed material comprises the following steps: generating a simulated processing trajectory based on the processing region information and the position information of the to-be-processed material; performing simulated processing based on the simulated processing trajectory and obtaining a simulated result; correcting the simulated processing trajectory based on the simulated result, and identifying the corrected simulated processing trajectory as the to-be-processed trajectory.

[0013] In addition, to achieve the above object, the application further provides a storage medium, which is a computer readable storage medium, and a computer program is stored on the storage medium, and the computer program is executed by a processor to implement the steps of the laser processing control method.

[0014] In addition, to achieve the above object, the application further provides a computer program product, which comprises a computer program, and the computer program is executed by a processor to implement the steps of the laser processing control method.

[0015] The one or more technical solutions provided by the application have at least the following technical effects: by measuring the temperature of the laser processing point in real time online, it is determined whether the temperature of the laser processing point reaches the required preset target, and when it does not reach the preset target, the power of the laser beam is adjusted to achieve the preset target, at this time, the system can ensure the processing quality through high-precision temperature control and improve the system stability. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the application and, together with the specification, serve to explain the principles of the application.

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0018] Figure 1 The structural block diagram of the first embodiment of the laser processing system of the application is provided;

[0019] Figure 2 The structural block diagram of the second embodiment of the laser processing system of the application is provided;

[0020] Figure 3 The flowchart of the third embodiment of the laser processing control method of the application is provided.

[0021] The object implementation, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0022] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the application, and are not used to limit the application.

[0023] In order to better understand the technical solutions of the application, the following will be described in detail in combination with the drawings and specific embodiments of the specification.

[0024] The effectiveness of laser processing technology is highly dependent on the precise control of laser power and the optimal design of cutting paths. In the current technical environment, if these key factors do not reach the ideal state, especially when facing the challenge of insufficient precision, a series of problems may be caused, such as the damage of the material to be processed due to excessive processing, or the damage of the processing equipment due to improper load, thereby affecting the overall processing quality and efficiency.

[0025] Therefore, in order to solve the technical problems of low precision of traditional laser processing technology parameters and unstable system, the present application provides a laser processing system, please refer to Figure 1 , Figure 1 The structural block diagram of the first embodiment of the laser processing system of the present application is provided.

[0026] In this embodiment, the laser processing system comprises a collection module 10, a control module 20 and a laser emission module 30. Among them, the collection module 10 is connected with the control module 20; the control module 20 is connected with the laser emission module 30.

[0027] It should be noted that the collection module 10 plays a crucial role in the laser processing system, which is specially designed to monitor and record the key working data in real time and accurately during the laser processing process, and transmit the working data to the control module 20 to ensure the processing quality and safety.

[0028] Specifically, the working data includes the temperature of the laser processing point. For the key parameter of the temperature of the laser processing point, the collection module 10 usually realizes the continuous monitoring of the temperature of the processing area through the integrated high-precision temperature sensor. These temperature sensors are usually placed near the laser emission module 30 or directly embedded on the processing path, so as to be able to directly perceive the temperature change generated when the laser interacts with the material. These sensors use thermal elements such as thermocouples, thermistors or infrared detectors, which can quickly respond and accurately convert temperature information into electrical signals.

[0029] It can be understood that the collection module 10 is not only responsible for receiving the electrical signals from the temperature sensor, but also has signal processing circuit and algorithm built-in, which is used for filtering, amplifying, analog-digital conversion and other processing of the original signal, so as to eliminate noise interference and improve the accuracy and reliability of the data.

[0030] It can be understood that the processed working data, including the real-time temperature of the laser processing point and its related parameters, will be transmitted by the collection module to the control module 20 through a high-speed communication interface (such as RS-485, Ethernet, USB or wireless Wi-Fi / Bluetooth, etc.) safely and stably. This transmission process follows strict data protocol and encryption measures to ensure the integrity and security of the data.

[0031] It can be understood that the control module 20 as the processor of the laser processing system will immediately analyze and judge after receiving these data. The temperature information of the laser processing point in these data is the key basis for the control module 20 to evaluate the current processing state, predict future trends, and make corresponding adjustments. Therefore, the control module 20 is used to output corresponding adjustment instructions to the laser emitting module 30 based on the working data after receiving the working data.

[0032] It should be noted that the adjustment instructions are usually based on preset processing parameters and temperature thresholds to dynamically adjust laser power, processing speed, focal length and other parameters as targets to control the properties of the laser beam.

[0033] It can be understood that when the control module 20 issues adjustment instructions for the current processing state after a series of complex data processing and analysis, the laser emitting module 30 quickly enters a standby state and is ready to execute these instructions. The laser emitting module 30 is used to generate a laser beam corresponding to the adjustment instructions when receiving the adjustment instructions.

[0034] It should be noted that the entire adjustment process is a closed-loop control system, and the control module 20 continuously monitors the working data from the acquisition module and dynamically adjusts according to real-time feedback. This flexible and intelligent control method enables the laser processing system to adaptively cope with various processing conditions and changes, ensuring the stability and consistency of the processing process, and ultimately achieving the purpose of improving processing quality, efficiency and safety.

[0035] In this embodiment, the temperature of the laser processing point is measured in real time online, and it is judged whether the temperature of the laser processing point reaches the required preset target. If not, the power of the laser beam is adjusted to achieve the preset target. At this time, the system can ensure the processing quality and improve the system stability through high-precision temperature control.

[0036] Further, on the basis of the above-mentioned embodiment, the present application proposes a laser processing system, please refer to Figure 2 , Figure 2 The structural block diagram provided for the second embodiment of the laser processing system of the present application.

[0037] In this embodiment, the laser processing system further comprises a trajectory generation module 40. The acquisition module 10 is also connected to the trajectory generation module 40; and the trajectory generation module 40 is connected to the control module 20.

[0038] It should be noted that the acquisition module 10 is not only responsible for real-time detection and transmission of key working data of laser processing to the control module 20, but also undertakes the task of transmitting comprehensive information in the processing process to other important modules. In this embodiment, the acquisition module 10 is also used to transmit the processing data to the trajectory generation module 40, wherein the processing data focuses on the processing area information and the position information of the material to be processed, which are collected and transmitted to the trajectory generation module 40.

[0039] It should be noted that the processing area information covers the size, shape, boundary conditions and possible obstacles or sensitive areas of the processing area. The acquisition of processing area information is crucial to ensure the accuracy and safety of the processing process. These information is usually obtained by high-precision sensors such as laser range finder, infrared camera or machine vision system, and preprocessed and integrated by the acquisition module 10.

[0040] It should be noted that the position information of the material to be processed relates to the accurate position, posture and possible slight deviation of the material on the processing platform or clamp, which is also indispensable data in the processing process. In order to accurately capture these information, the acquisition module usually may be integrated with multiple positioning technologies such as mechanical encoder, photoelectric switch, RFID tag reader or high-precision GPS (in specific application scenarios). By real-time monitoring and calibration of material position, the acquisition module 10 ensures that the trajectory generation module 40 can generate a processing path highly matched with the actual position of the material, thereby improving the processing precision and efficiency.

[0041] It can be understood that the trajectory generation module 40 can generate the to-be-processed trajectory based on the above processing data through algorithm, and transmit the to-be-processed trajectory to the control module 20. The control module 20 can control the movement of the laser emission module 30 based on the to-be-processed trajectory.

[0042] It should be noted that the algorithm used by the trajectory generation module 40 may include path shortest, energy efficiency maximization, processing time minimization and other objective functions, aiming to generate to-be-processed trajectory that meets the processing requirements and has excellent performance. Subsequently, the control module 20 will analyze these data, and accurately control the execution mechanism such as laser emission module and mechanical motion system according to the trajectory information, to realize the automatic execution of the processing process.

[0043] In a possible implementation, the laser processing system further comprises a trajectory correction module 50. The trajectory generation module 40 is further connected to the trajectory correction module 50; the trajectory correction module 50 is connected to the control module.

[0044] It should be noted that the purpose of introducing the trajectory correction module into the laser processing system is to further ensure the processing precision and efficiency. The function of the trajectory correction module 50 is to further optimize and adjust the preliminary generated processing trajectory based on the processing trajectory output by the trajectory generation module 40. The module is used to simulate laser processing based on the processing trajectory, correct the processing trajectory based on the result of simulating laser processing, and transmit the corrected processing trajectory to the control module 20.

[0045] It can be understood that through the process of simulating laser processing, the feasibility, efficiency and possible challenges of the trajectory are pre-evaluated, and necessary corrections are made to the original trajectory to ensure that the finally executed processing trajectory can perfectly match the processing requirements.

[0046] It should be noted that the process of simulating laser processing usually utilizes simulation technology to construct a virtual processing scene based on multi-dimensional information such as processing trajectory, material properties, material position information, laser parameters and processing area information. In this scene, the laser beam is simulated to process according to the preset trajectory, and the system calculates and feeds back the key indicators such as temperature distribution, stress change and material removal rate in the processing process in real time.

[0047] It can be understood that after the simulation processing is completed, the trajectory correction module 50 will deeply analyze the simulation results, including the key indicators described above, to identify possible processing defects, efficiency bottlenecks or safety risks. In view of these problems, the trajectory correction module will use intelligent algorithms and preset models to correct the original trajectory locally or globally. The correction content may include adjusting the direction of the trajectory, optimizing the smoothness of the trajectory, adjusting the laser power or scanning speed and other parameters, so as to ensure that the corrected trajectory can more effectively achieve the processing goal, while reducing the uncertainty and risk in the processing process.

[0048] It can be understood that after the trajectory correction is completed, the trajectory correction module 50 will transmit the corrected processing trajectory to the control module in a standard format or a specific protocol. The control module 20 can control the movement of the laser emission module 30 based on the corrected processing trajectory.

[0049] In addition, the laser processing system also includes a communication module 60 and an interaction module 70. The communication module 60 is connected to the control module 20 and the interaction module 70, respectively.

[0050] It should be noted that the control module 20 is also used to transmit the received working data and the to-be-processed trajectory to the interaction module 70 through the communication module 60; the interaction module 70 is used to generate an interaction instruction based on a user behavior and transmit the interaction instruction to the control module 20 to control the laser emission module.

[0051] It should be noted that the transmission process of the working data and the to-be-processed trajectory to the interaction module 70 is to enable the user to comprehensively understand the current processing state and trajectory information through the interaction module 70, and also provides rich data support for subsequent user interaction. The interaction module 70 can use the data to intuitively display the processing progress, predict the remaining time, analyze the processing quality, and even simulate the processing effect through visualization to help the user better understand the processing process.

[0052] It can be understood that the interaction module 70, as a bridge between the user and the system, has a core role of generating corresponding interaction instructions according to user behaviors. These instructions can come from commands input by the user through a touch screen, a keyboard, a mouse, or voice recognition input devices, or can be biological feature signals such as user gestures and eye contact that are automatically recognized by the system. The interaction module 70 can intelligently analyze these instructions and convert them into a format that the control module 20 can understand, and then accurately control the execution mechanism such as the laser emission module 30.

[0053] In a feasible implementation manner, when the interaction module 70 receives the interaction instruction of the user, it immediately transmits the instruction back to the control module 20. After receiving the instruction, the control module 20 performs corresponding logical judgment and decision, and then drives the laser emission module to move, adjust the laser parameter, or perform other processing actions according to the user's will. This process realizes seamless connection and instant feedback between the user and the system, greatly improves the flexibility and operability of the laser processing system.

[0054] In the embodiment, by monitoring the working data in real time, the trajectory generation module and the trajectory correction module finely depict the to-be-processed trajectory and accurately control the laser emission module, so that the system can ensure the high accuracy of the processing process and reduce errors. The processing efficiency is improved, and the processing cycle is shortened. In addition, the simulation of the laser processing process, the real-time monitoring of the processing state, and the integrated safety protection measures effectively reduce the safety risk in the processing process. The introduction of the interaction module and the communication module enables the user to intuitively understand the processing state and control the processing process through a simple interaction mode, thereby improving the operation convenience and user experience.

[0055] In addition, the application further provides a laser device adopting the laser processing system in the above embodiment, which can solve the technical problems of low precision of technical parameters and instability of system in the conventional laser processing technology. Compared with the conventional laser processing system, the laser device provided by the application has the same beneficial effects as the laser processing system provided by the above embodiment, and other technical features in the laser device are the same as the features disclosed in the above embodiment, which will not be repeated here.

[0056] On the basis of the above embodiment, the application provides a laser processing control method, which refers to Figure 3 , Figure 3 The flowchart of the third embodiment provided by the laser processing control method of the application is shown in the figure.

[0057] In the embodiment, the laser processing control method comprises steps S10 to S30.

[0058] Step S10, detecting the temperature of the laser processing point.

[0059] Step S20, judging whether the temperature of the laser processing point is located in the preset temperature range.

[0060] It should be noted that the temperature of the laser processing point is a parameter that needs to be focused on in the laser processing process, and therefore the temperature of the laser processing point needs to be detected, and the temperature of the processing area can be continuously monitored through a temperature sensor. These temperature sensors are usually placed near the laser emission module or directly embedded on the processing path, so as to be able to directly perceive the temperature change generated when the laser interacts with the material.

[0061] It can be understood that after the accurate temperature data of the laser processing point is obtained, whether the laser beam needs to be adjusted is judged by whether the temperature is located in the preset temperature range. The preset temperature range is set according to the characteristics of the processing material, the performance of the laser device and the required processing effect, and generally, different processing materials correspond to different ranges.

[0062] Step S30, when the temperature of the laser processing point is located outside the preset temperature range, adjusting the laser beam generated by the laser emission module so that the temperature of the laser processing point falls within the preset temperature range.

[0063] It can be understood that when the temperature of the laser processing point is located outside the preset temperature range, it means that the laser beam is not enough to cut the material or has excessively damaged the material, and therefore the laser beam generated by the laser emission module needs to be adjusted so that the temperature of the laser processing point falls within the preset temperature range to match the working requirements.

[0064] Further, before real-time control of the laser processing point temperature, the laser processing trajectory needs to be confirmed to control the laser processing. Therefore, in a feasible implementation, step S10 is preceded by steps S01 to S03:

[0065] Step S01, collect processing area information and position information of the material to be processed.

[0066] It can be explained that the system needs to perform information collection tasks to obtain processing area information such as the specific size, shape, boundary conditions, and possible obstacle information of the processing area, while determining the precise position and attitude of the material to be processed on the processing platform or clamp as the position information of the material to be processed.

[0067] Step S02, based on the processing area information and the position information of the material to be processed, generate a processing trajectory.

[0068] It can be understood that the system uses algorithms and models to generate an efficient processing trajectory based on the processing area information and the position information of the material to be processed to maximize processing efficiency while ensuring stability and accuracy during processing.

[0069] Step S03, control the movement of the laser emission module based on the processing trajectory.

[0070] It can be understood that the system accurately controls the movement of the laser emission module and its supporting mechanical motion system along the specified path according to the generated processing trajectory. During the movement, the laser emission module will perform laser processing according to the preset parameters, execute steps S10 to S30, and real-time control the temperature of the laser processing point to achieve accurate processing of the material to be processed.

[0071] Further, in a feasible implementation, step S02 includes: based on the processing area information and the position information of the material to be processed, generating a simulated processing trajectory; based on the simulated processing trajectory, performing simulated processing and obtaining simulation results; based on the simulation results, correcting the simulated processing trajectory, and identifying the corrected simulated processing trajectory as the processing trajectory.

[0072] It can be understood that possible processing defects, efficiency bottlenecks, or safety risks are identified through simulation. Intelligent algorithms and preset models are used to correct the original trajectory locally or globally. The correction may include adjusting the direction of the trajectory, optimizing the smoothness of the trajectory, adjusting laser power or scanning speed, etc. to ensure that the corrected trajectory can more effectively achieve the processing goal while reducing uncertainty and risk during processing.

[0073] In the embodiment, a laser processing control method is provided, which adopts the laser device in the above embodiment, and can solve the technical problems of low precision and unstable system of traditional laser processing technology. Compared with the traditional laser processing system, the laser processing control method has the same beneficial effects as the laser device in the above embodiment, and other technical features in the laser processing control method are the same as the features disclosed in the above embodiment, which will not be repeated here.

[0074] It should be noted that the above examples are only used for understanding the present application, and do not constitute a limitation on the laser processing control method of the present application. Based on this technical concept, more forms of simple transformation are within the protection scope of the present application.

[0075] The present application provides a computer readable storage medium having computer readable program instructions (i.e. computer programs) stored thereon, which are used to execute the laser processing control method in the above embodiment.

[0076] The computer readable storage medium provided by the present application may, for example, be a U disk, but is not limited to an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, system or device, or any combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to: an electrical connection with one or more conductive wires, a portable computer disk, a hard disk, a random access memory (RAM: Random Access Memory), a read-only memory (ROM: Read Only Memory), an erasable programmable read-only memory (EPROM: Erasable Programmable Read Only Memory or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM: CD-Read Only Memory), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the embodiment, the computer readable storage medium can be any tangible medium containing or storing a program, which can be used by or in conjunction with an instruction execution system, system or device. The program code contained on the computer readable storage medium can be transmitted by any appropriate medium, including but not limited to: electrical wires, optical cables, RF (Radio Frequency: Radio Frequency), etc., or any suitable combination of the above.

[0077] Computer program code for carrying out operations of the present application can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, through the Internet using an Internet Service Provider).

[0078] The flow diagrams and the block diagrams in the drawings are illustrations of architectures, functionalities, and operations of possible implementations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flow diagrams or block diagrams can represent a module, a segment, or a portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may

[0079] The modules involved in the embodiments of the present application can be implemented in the form of software or in the form of hardware. In some cases, the name of the module does not constitute a limitation on the module itself.

[0080] The readable storage medium provided by the present application is a computer readable storage medium, which stores computer readable program instructions (i.e., a computer program) for executing the above laser processing control method, and can solve the technical problems of low precision and unstable system of traditional laser processing technology. Compared with the traditional laser processing system, the computer readable storage medium provided by the present application has the same beneficial effects as the laser processing control method provided in the above embodiments, and will not be described here.

[0081] The application further provides a computer program product comprising a computer program which, when executed by a processor, implements the steps of the laser processing control method as described above.

[0082] The computer program product provided by the application can solve the technical problems of low precision and unstable system of traditional laser processing technology. Compared with the traditional laser processing system, the beneficial effects of the computer program product provided by the application are the same as those of the laser processing control method provided by the above-mentioned embodiments, and will not be repeated here.

[0083] The above-mentioned is only part of the embodiments of the application, and does not limit the patent scope of the application. Any equivalent structural transformation, direct / indirect application in other related technical fields based on the technical concept of the application, and the contents of the specification and drawings are included in the patent protection scope of the application.

Claims

1. A laser processing system characterized by, The laser processing system comprises a collection module, a control module, a trajectory generation module, a trajectory correction module and a laser emission module; The collection module is connected to the control module and the collection module; The control module is connected to the laser emission module; The trajectory generation module is connected to the control module and the trajectory correction module respectively; The trajectory correction module is connected to the control module; The collection module is used to detect working data of laser processing and transmit the working data to the control module, wherein the working data comprises temperature of laser processing points; The collection module is also used to transmit the working data to the trajectory generation module, wherein the working data further comprises processing region information and position information of materials to be processed; The processing region information comprises size, shape, boundary condition and obstacles of the processing region; The position information of the materials to be processed comprises position and attitude of the materials to be processed in the processing region and offset deviation; The trajectory generation module is also used to generate a trajectory to be processed based on the working data and transmit the trajectory to be processed to the control module; The trajectory generation module is also used to transmit the trajectory to be processed to the trajectory correction module; The trajectory correction module is used to simulate laser processing based on the trajectory to be processed, correct the trajectory to be processed based on results of the simulated laser processing and transmit the corrected trajectory to be processed to the control module; The control module is also used to control the laser emission module to move based on the corrected trajectory to be processed; The control module is used to output corresponding adjustment instructions to the laser emission module based on the working data after receiving the working data; The laser emission module is used to generate laser beams corresponding to the adjustment instructions when receiving the adjustment instructions.

2. The laser processing system of claim 1, wherein, The laser processing system further comprises a communication module and an interaction module; The communication module is connected to the control module and the interaction module respectively; The control module is also used to transmit the received working data and the trajectory to be processed to the interaction module through the communication module; The interaction module is used to generate interaction instructions based on user behaviors and transmit the interaction instructions to the control module to control the laser emission module.

3. A laser characterized by, The laser application is the laser processing system according to any one of claims 1 to 2.

4. A laser processing control method characterized by, The method application is the laser according to claim 3, and the method comprises: detecting temperature of laser processing points; judging whether the temperature of the laser processing points is in a preset temperature range; adjusting laser beams generated by the laser emission module to make the temperature of the laser processing points fall into the preset temperature range when the temperature of the laser processing points is out of the preset temperature range.

5. The method of claim 4, wherein, The step of adjusting laser beams generated by the laser emission module to make the temperature of the laser processing points fall into the preset temperature range when the temperature of the laser processing points is out of the preset temperature range further comprises: collecting processing region information and position information of materials to be processed; generating a trajectory to be processed based on the processing region information and the position information of the materials to be processed; Control the laser emitting module to move based on the to-be-processed trajectory.

6. The method of claim 5, wherein, The step of generating the to-be-processed trajectory based on the processing region information and the position information of the to-be-processed material comprises: Generating a simulated processing trajectory based on the processing region information and the position information of the to-be-processed material; Performing simulated processing based on the simulated processing trajectory and obtaining a simulated result; Correcting the simulated processing trajectory based on the simulated result, and identifying the corrected simulated processing trajectory as the to-be-processed trajectory.

7. A storage medium, characterized by The storage medium is a computer readable storage medium, and the storage medium stores a computer program. When the computer program is executed by the processor, the steps of the laser processing control method according to any one of claims 4 to 6 are implemented.

8. A computer program product, characterised in that, The computer program product comprises a computer program. When the computer program is executed by the processor, the steps of the laser processing control method according to any one of claims 4 to 6 are implemented.

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