A precision temperature control and energy management device for injection molding machines

Abstract

This invention discloses a precise temperature control and energy management device for injection molding machines. The device is installed on the barrel of the injection molding machine and includes a thermoelectric power generation system, a semiconductor refrigeration system, and a cooling system. The thermoelectric power generation system includes multiple thermoelectric generators to control the temperature of the high-temperature heating section of the barrel and absorb waste heat to generate electricity. These thermoelectric generators are connected in series to a voltage regulator circuit to power the injection molding machine's PLC. The semiconductor refrigeration system includes multiple semiconductor refrigeration chips to control the temperature of the low-temperature heating section of the barrel. The cooling system maintains a constant temperature difference between the hot and cold ends of the thermoelectric generators, improving the cooling efficiency of the semiconductor refrigeration chips. This invention has advantages such as simple structure, safety and reliability, long service life, no moving parts, no noise, and environmental friendliness. By controlling the heat dissipation of the cold end of the thermoelectric generators, continuous and precise temperature control of the high-temperature section of the barrel can be achieved. Changing the current supplied to the semiconductor refrigeration chips can precisely control the temperature of the low-temperature section of the barrel.

Description

Technical Field

[0001] This invention relates to the field of injection molding machine technology, and in particular to a device for precise temperature control and comprehensive energy management of injection molding machines. Background Technology

[0002] High efficiency, high quality, and high consistency are the main characteristics of injection molding. Injection molding is a highly automated and precisely controlled manufacturing process capable of producing plastic parts with extremely high precision and complex geometries. The key feature of this process lies in its meticulous control over materials, molds, and process parameters to ensure dimensional accuracy and surface quality of the parts. Through precise temperature control, pressure regulation, and optimized injection speed, injection molding achieves uniform material flow and filling, reducing internal stress and deformation, thereby improving the consistency and reliability of the parts.

[0003] However, current temperature control strategies are relatively simple and direct: heating is activated when the temperature is detected to be below the set value, and cooling is activated otherwise. This approach exhibits significant limitations in temperature control effectiveness. Specifically, it suffers from problems such as significant lag in regulation response, significant system nonlinearity, and frequent over-adjustment during temperature regulation.

[0004] In terms of physical structure, traditional cooling methods such as water cooling and air cooling cause a large amount of heat to be directly dissipated into the air during the melting process, resulting in huge heat loss.

[0005] The aforementioned problems not only lead to low energy efficiency but also severely affect the temperature control accuracy of the polymer molding process, resulting in inconsistent product quality. Therefore, seeking more efficient and precise temperature control methods and a more rational energy distribution structure has become an urgent problem to be solved in this field. Summary of the Invention

[0006] The purpose of this invention is to provide a device for precise temperature control and comprehensive energy management of injection molding machines to solve the problems existing in the prior art.

[0007] To achieve the above objectives, the present invention provides a precise temperature control and comprehensive energy management device for injection molding machines. This device is installed on the barrel of the injection molding machine and includes:

[0008] A semiconductor wafer, the semiconductor wafer including a thermoelectric generator and a semiconductor refrigeration wafer;

[0009] A thermoelectric power generation system is provided, which is used to control the temperature of the high-temperature heating section of the barrel and absorb waste heat to generate electricity. The thermoelectric power generation system includes multiple thermoelectric generators, which are disposed on the side of the barrel and the hot end of the thermoelectric generators is fixed to the barrel. The multiple thermoelectric generators are connected in series to a voltage regulator circuit and supply power to the PLC of the injection molding machine.

[0010] A semiconductor refrigeration system is provided for controlling the temperature of the low-temperature heating section of the barrel. The semiconductor refrigeration system includes a plurality of semiconductor refrigeration chips, which are disposed on the side of the barrel and the cold end of the semiconductor refrigeration chip is fixed to the barrel.

[0011] The cooling system is configured to maintain a constant temperature difference between the cold and hot ends of the thermoelectric generator and to keep the hot end of the thermoelectric cooler at a relatively stable temperature, thereby improving cooling efficiency and facilitating precise temperature control.

[0012] Preferably, the thermoelectric generator is a semiconductor thermoelectric generator.

[0013] Preferably, the barrel is a regular polygonal prism structure.

[0014] Preferably, the cooling system includes a cooling tower, the bottom of which is connected to two water pipes, a plasticized coil is wound around the outside of the semiconductor wafer, and both ends of the plasticized coil are connected to the two water pipes respectively. A water pump and a regulating valve are installed on the water pipes.

[0015] Preferably, the cooling system employs heat dissipation fins and a power-adjustable cooling fan.

[0016] Compared with the prior art, the present invention has the following advantages and technical effects:

[0017] 1. The precision temperature control and energy management device for injection molding machines provided by this invention has the advantages of simple structure, safety and reliability, long service life, no moving parts, no noise, and green environmental protection. A thermoelectric generator is used in the high-temperature section of the barrel to simultaneously control the barrel temperature and generate electricity. A semiconductor refrigeration chip is used in the low-temperature section of the barrel as a more efficient cooling method. By controlling the heat dissipation of the cold end of the thermoelectric generator, continuous and precise control of the temperature of the high-temperature heating section of the barrel can be achieved. Changing the current supplied to the semiconductor refrigeration chip can precisely control the temperature of the low-temperature heating section of the barrel. After absorbing waste heat, the thermoelectric generator can supply power to the PLC, optimizing the energy distribution structure.

[0018] 2. According to the Seebeck effect, semiconductor materials can generate a potential difference when a temperature difference exists. The temperature difference between the hot and cold ends of the thermoelectric generator and the output DC voltage are in a one-to-one correspondence. Therefore, when a stable output voltage is detected, it means that there is a constant temperature difference between the two ends of the thermoelectric generator. By controlling the heat dissipation of the cold end of the thermoelectric generator, continuous and precise control of the heat at the hot end of the thermoelectric generator can be achieved, thereby accurately controlling the barrel temperature.

[0019] 3. A thermoelectric cooler consists of multiple thermocouples made of P-type and N-type semiconductor materials. These thermocouples are connected together by electrodes and sandwiched between two ceramic electrodes. Based on the Peltier effect, when current passes through these thermocouples, one end absorbs heat and becomes cooler, while the other end releases heat and becomes hotter. This effect is reversible; changing the direction of the current will cause the hot and cold ends to exchange. The cooling or heating capacity of the thermoelectric cooler is directly proportional to the magnitude of the current passing through its thermocouples. Therefore, changing the magnitude of the current supplying the thermoelectric cooler allows for precise control of the barrel temperature.

[0020] 4. Semiconductor thermoelectric power generation technology has great potential in the utilization of low-grade energy sources such as industrial and domestic waste heat, automobile exhaust, and geothermal energy. It not only saves energy and protects the environment and improves energy utilization efficiency, but also reduces energy consumption and creates economic benefits for enterprises. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the precision temperature control and energy management device for injection molding machines of the present invention;

[0023] Figure 2 This is a PLC power supply control circuit diagram for the injection molding machine of the present invention;

[0024] Figure 3 This is a coupling diagram of the barrel, the semiconductor thermoelectric generator, and the cooling system of the present invention;

[0025] In the diagram: 1. Barrel; 2. Semiconductor wafer; 3. Plasticizing coil; 4. Cooling tower; 5. Water pipe; 6. Water pump; 7. Regulating valve; 8. Voltage stabilizing circuit; 10. Cooling channel. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this invention can be combined with each other. The described embodiments are merely some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention. The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] like Figure 1 As shown, Figure 1This is a schematic diagram of the structure of the precision temperature control and energy management device for injection molding machines according to the present invention. The present invention provides a precision temperature control and energy management device for injection molding machines, which is installed on the barrel 1 of the injection molding machine and includes:

[0028] Semiconductor chip 2, which includes a thermoelectric generator and a thermoelectric cooler;

[0029] Thermoelectric power generation system is used to control the temperature of the high-temperature heating section of barrel 1 and absorb waste heat to generate electricity; the thermoelectric power generation system includes multiple thermoelectric generators, which are set on the side of barrel 1 and the hot end of the thermoelectric generators is fixed to barrel 1; multiple thermoelectric generators are connected in series to voltage regulator circuit 8 and supply power to the PLC of injection molding machine.

[0030] A semiconductor refrigeration system is used to control the temperature of the low-temperature heating section of the barrel 1. The semiconductor refrigeration system includes multiple semiconductor refrigeration chips, which are disposed on the side of the barrel 1 and the cold end of the semiconductor refrigeration chip is fixed to the barrel 1.

[0031] The cooling system is configured to correspond to the cold end of the thermoelectric generator and the hot end of the thermoelectric cooler. The cooling system is used to maintain a constant temperature difference between the cold end and the hot end of the thermoelectric generator and to keep the hot end of the thermoelectric cooler at a relatively stable temperature, thereby improving cooling efficiency and facilitating precise temperature control.

[0032] The solution was further optimized by using a semiconductor thermoelectric generator.

[0033] Further optimization of the design resulted in the barrel 1 being a regular hexagonal prism structure.

[0034] Further optimization of the scheme: the cooling system can be water-cooled or air-cooled and set up to correspond to the cold end of the thermoelectric generator and the hot end of the semiconductor refrigeration chip. The cooling system includes a cooling tower 4, with two water pipes 5 connected to the bottom of the cooling tower 4. A plasticized coil 3 is wrapped around the outside of the semiconductor chip 2. Both ends of the plasticized coil 3 are connected to the two water pipes 5 respectively. A water pump 6 and a regulating valve 7 are installed on the water pipes 5.

[0035] When the cooling system uses air cooling, it employs heat dissipation fins and a cooling fan with adjustable power.

[0036] In this embodiment, the cooling system uses water cooling.

[0037] like Figure 2 As shown, Figure 2This is a PLC power supply control circuit diagram for the injection molding machine of the present invention. In the initial heating stage of the high-temperature heating section of the barrel 1, the temperature difference between the hot and cold ends of the thermoelectric generator is small, resulting in a DC voltage of less than 24V. The undervoltage relay KV operates, its normally closed contact KV opens, and its normally open contact KV closes. The single-phase AC voltage of 220V is supplied to the PLC through a transformer and rectifier bridge. After the temperature of the high-temperature heating section of the barrel 1 rises to a certain level, the temperature difference between the hot and cold ends of the thermoelectric generator becomes larger, generating a voltage higher than 24V. The voltage regulator circuit 8 outputs a constant 24V DC voltage, the undervoltage relay KV stops operating, its normally closed contact KV closes, and its normally open contact KV opens. The thermoelectric generator then supplies power to the PLC. In the PLC power supply control circuit, the air switch QF and fuses FU1 / FU2 / FU3 provide overload and short-circuit protection, while the undervoltage relay KV provides undervoltage protection, promptly switching the PLC's power supply source when the thermoelectric generator experiences undervoltage.

[0038] like Figure 3 As shown, Figure 3 This is a coupling diagram of the barrel 1, semiconductor chip 2, and cooling system of the present invention. The hot end of the thermoelectric generator and the cold end of the semiconductor refrigeration chip are in contact with the heating zone of the barrel 1. The cold end of the thermoelectric generator and the hot end of the semiconductor refrigeration chip are in contact with the cooling channel 10 of the cooling system. The semiconductor chip 2 is arranged at equal intervals along the circumferential direction of the barrel 1 and can cover the entire outer wall of the barrel 1.

[0039] The precise temperature control and energy management device for injection molding machines provided by this invention has the following specific operating procedure:

[0040] In the thermoelectric power generation system, semiconductor chip 2 is a thermoelectric generator. The waste heat generated by the high-temperature heating section of the barrel 1 is transferred to the hot end of semiconductor chip 2 through the metal wall of the barrel 1. At this time, the temperature difference between the hot and cold ends of semiconductor chip 2 converts the waste heat into electrical energy. In the initial stage of heating, the temperature difference between the hot and cold ends of semiconductor chip 2 is small, and the generated DC voltage is less than 24V. The undervoltage relay KV works, the normally closed contact KV opens, and the normally open contact KV closes. The single-phase AC voltage of 220V is supplied to the PLC through the transformer and rectifier bridge. After the temperature of the high-temperature heating section of the barrel 1 rises to a certain level, the temperature difference between the hot and cold ends of semiconductor chip 2 becomes larger, and the generated voltage is higher than 24V. The voltage regulator circuit 8 outputs a constant DC voltage of 24V. The undervoltage relay KV stops working, the normally closed contact KV closes, and the normally open contact KV opens. The TEG supplies power to the PLC.

[0041] In the heating environment, the cold end of the semiconductor chip 2 gradually heats up. Cold water from the cooling tower 4 flows into the plasticizing coil 3. Through the coupling of convective and conductive heat transfer, the heat from the cold end of the semiconductor chip 2 is transferred to the cold water in the cooling channel 10. The hot water then flows back into the cooling tower 4 via the water pump 6. During this process, the flow rate of water into the plasticizing coil 3 can be controlled by the regulating valve 7, thereby controlling the temperature of the cold end of the semiconductor chip 2. This ensures a constant temperature difference and power output between the hot and cold ends of the semiconductor chip 2, achieving precise temperature control of the surface of the high-temperature heating section of the injection molding machine barrel 1.

[0042] In the semiconductor cooling system, semiconductor chip 2 is a semiconductor cooling chip. When semiconductor chip 2 on the low-temperature heating section of the injection molding machine barrel 1 is energized, its cold end absorbs heat and cools down, while its hot end releases heat and becomes hot again. Through the coupling effect of convection and conduction, the heat released by the hot end of semiconductor chip 2 is absorbed by the cold water in the cooling channel 10 of the water cooling system. The hot water is then pumped back into the cooling tower 4 by the water pump 6. The water cooling system helps to maintain better heat dissipation at the hot end of semiconductor chip 2, keeping it at a relatively stable temperature, improving cooling efficiency, and facilitating precise temperature control. By adjusting the current supplying semiconductor chip 2, the temperature of the low-temperature heating section of the injection molding machine barrel 1 can be precisely controlled.

[0043] The thermoelectric power generation system of this invention is based on Seebeck's principle of thermoelectric effect. It uses semiconductor thermoelectric power generation technology to control the temperature of the high-temperature heating section of the barrel 1, absorbs waste heat to power the PLC, and optimizes the energy distribution structure. The thermoelectric power generation system uses water cooling or air cooling as the cooling system to create a constant temperature difference between the hot and cold ends of the semiconductor thermoelectric generator. While recovering waste heat to generate electricity, it precisely controls the temperature of the high-temperature heating section of the barrel 1.

[0044] The semiconductor refrigeration system of the present invention is based on the Peltier principle of thermoelectric effect. The semiconductor refrigeration system uses water cooling or air cooling as the cooling system to keep the hot end of the semiconductor refrigeration chip at a relatively stable temperature, thereby improving the refrigeration efficiency and facilitating precise temperature control. By adjusting the current supplied to the semiconductor refrigeration chip, the temperature of the low-temperature heating section of the barrel 1 can be precisely controlled.

[0045] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A precision temperature control and energy management device for an injection molding machine, the device being installed on the barrel (1) of the injection molding machine, characterized in that, include: Semiconductor wafer (2), the semiconductor wafer (2) comprising a thermoelectric generator and a thermoelectric cooler; Thermoelectric power generation system, the thermoelectric power generation system is used to control the temperature of the high temperature heating section of the barrel (1) and absorb waste heat to generate electricity; the thermoelectric power generation system includes a plurality of thermoelectric generators, the thermoelectric generators are disposed on the side of the barrel (1) and the hot end of the thermoelectric generators is fixed to the barrel (1); the plurality of thermoelectric generators are connected in series to a voltage regulator circuit (8) and supply power to the PLC of the injection molding machine; A semiconductor refrigeration system is used to control the temperature of the low-temperature heating section of the barrel (1); the semiconductor refrigeration system includes a plurality of semiconductor refrigeration chips, which are disposed on the side of the barrel (1) and the cold end of the semiconductor refrigeration chip is fixed to the barrel (1); The cooling system is configured to maintain a constant temperature difference between the cold end and the hot end of the thermoelectric generator.

2. The precision temperature control and energy management device for injection molding machines according to claim 1, characterized in that, The thermoelectric generator is a semiconductor thermoelectric generator.

3. The precision temperature control and energy management device for injection molding machines according to claim 1, characterized in that, The barrel (1) is a regular polygonal prism structure.

4. The precision temperature control and energy management device for injection molding machines according to claim 1, characterized in that, The cooling system includes a cooling tower (4), the bottom of which is connected to two water pipes (5). A plasticized coil (3) is wrapped around the outside of the semiconductor chip (2). Both ends of the plasticized coil (3) are connected to the two water pipes (5). A water pump (6) and a regulating valve (7) are installed on the water pipes (5).

5. The precision temperature control and energy management device for injection molding machines according to claim 1, characterized in that, The cooling system uses heat sinks and cooling fans.

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