Metal plate
By forming a bonding structure with an uneven shape at the bonding interface between the insulating resin layer and the metal component, the problem of insufficient bonding between the insulating resin layer and the circuit layer in the insulating circuit substrate is solved, and an insulating circuit substrate with high bonding and insulating properties is realized.
Patent Information
- Application Number
- CN202510118040.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2020-09-25
- Filing Date
- 2021-03-29
- Publication Date
- 2025-03-18
AI Technical Summary
The conventional insulating circuit substrate has insufficient adhesion between the insulating resin layer and the circuit layer, and peeling is prone to occur, and the surface roughness of the metal plate is too large, resulting in a decrease in insulation.
By forming a bonding structure with concave and convex shapes of convex portions and concave portions at the bonding interface between the insulating resin layer and the metal component, the kurtosis and elongation of the profile curve at the bonding interface of the metal component are within a specific range, thereby improving the adhesion and insulating properties between the insulating resin layer and the circuit layer.
High bonding and insulating properties between the insulating resin layer and the metal parts are achieved, ensuring the stable use of the insulating circuit substrate.