Semiconductor wafer adsorption manipulator

By designing a semiconductor wafer adsorption robot with adjustable suction cup spacing, the problem that existing equipment cannot adapt to wafers of different diameters is solved, efficient adsorption and flexible adaptation are achieved, and work efficiency and versatility are improved.

CN119658730AActive Publication Date: 2025-03-21LIANSHUO SEMICON TECH (SUZHOU) CO LTD
5 Cites 0 Cited by

Patent Information

Application Number
CN202411935780.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-03-21
Estimated Expiration
2044-12-26

AI Technical Summary

Technical Problem

The existing robotic processing equipment cannot be adjusted according to the diameter of the semiconductor wafer, resulting in a decrease in the versatility of use. Liquid remaining on the wafer surface makes it difficult to adsorption of the suction cup, and even causes the wafer to fall off, and inconvenient to replace the suction cup when it is damaged, reducing working efficiency.

Method used

A semiconductor wafer adsorption robot is designed, adopting an adjustable suction cup spacing design, which realizes dynamic adjustment of suction cup spacing through electric telescopic rods and slider structures, adapts to wafers of different diameters, and improves adsorption stability and cleaning efficiency through vacuum pumps and fan blade structures.

Benefits of technology

It realizes flexible adaptation of wafers of different diameters, improves the versatility and efficiency of robots, improves adsorption stability and cleaning effect, and simplifies the suction cup replacement process.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses a semiconductor wafer adsorption manipulator, and relates to the technical field of semiconductors. The device comprises a bottom plate, a mechanical arm is arranged on the upper surface of the bottom plate, a connecting base is fixedly arranged on the mechanical arm, a vacuum pump is fixedly arranged on the upper surface of the connecting base, an air storage tank is fixedly arranged on the upper surface of the bottom plate, a first air guide pipe is connected to the air storage tank, and the other end of the first air guide pipe is connected with the vacuum pump. The distance between the symmetrically-arranged suction cups can be adjusted according to the size of a wafer, a connecting block at the output end of an electric telescopic rod can move by starting the electric telescopic rod, and therefore one sliding plate can be driven to move towards the middle of a connecting plate; the two sliding plates can move towards the middle of the connecting plate through the inclined plate and the rotating plate, so that the distance between the suction cups can be adjusted through cooperation of the rectangular guide pipe and the corrugated pipe, the suction cup can adapt to wafers with various diameters, and the use flexibility and universality are improved.
Need to check novelty before this filing date? Find Prior Art