Dual-purpose butt joint mold for sealing strip EPDM rubber sheet and rubber cement

The dual-purpose mold system with cold and heat components addresses the issues of pressure indentation and joint failure in automotive components by managing thermal expansion, enhancing the assembly process and reducing damage.

CN119659029APending Publication Date: 2025-03-21SHANGHAI RONGNAN TECH CO LTD +3
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Patent Information

Application Number
CN202411914637.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-03-21

AI Technical Summary

Technical Problem

Existing interface molds for automotive components suffer from issues such as pressure indentation, paint scorch, and joint failure due to thermal expansion and material shrinkage during assembly, which are not effectively addressed by current technologies.

Method used

A dual-purpose mold system combining a cold mold for initial pressure tightening and a heat mold for subsequent expansion, featuring symmetrical designs and specialized features like sliding blocks and enlarged cavities to manage thermal expansion and prevent damage.

Benefits of technology

The solution significantly reduces pressure-induced damage, paint scorch, and joint failure, improving the appearance and reliability of the interface by accommodating thermal expansion and preventing material distortion.

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Abstract

The invention relates to a sealing strip EPDM (Ethylene-Propylene-Diene Monomer) rubber sheet and rubber cement dual-purpose butt joint mold which comprises cold mold pressing molds and hot mold heating molds, the cold mold pressing molds are symmetrically arranged, and the two symmetrical hot mold heating molds are arranged between the cold mold pressing molds; according to the method, the phenomena of part appearance bruising, coating scalding and cracking caused by a hot mold are improved, the appearance state of a joint is improved, and the problem of technological limitation of an old mold is solved.
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