Preparation method of w-cu composition continuous gradient structure contact and contact
By using a three-screw, two-component, single-nozzle 3D printer and a solvent degreasing sintering process, a W-Cu compositionally gradient structure contact was prepared, which solved the performance mismatch problem of existing W-Cu alloy contact materials and achieved an optimized match between arc erosion resistance and conductivity.
Patent Information
- Application Number
- CN202510100350.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2026-05-29
- Estimated Expiration
- 2045-01-22
AI Technical Summary
The ablation performance and conductivity of existing W-Cu alloy contact materials are mutually restrictive. The interfacial thermal stress of the layered discontinuous gradient structure reduces the service life of the material. Moreover, existing functionally graded materials have discontinuous gradient structures, and the differences in composition lead to performance mismatch.
A continuous gradient structure of W-Cu composition was prepared using a three-screw dual-component single-nozzle 3D printer. By mixing feed A and feed B in an internal mixer, combined with solvent degreasing and sintering processes, a continuous gradient change of W-Cu composition was achieved, which improved the interfacial bonding strength and conductivity.
A reasonable match between the arc erosion resistance and overall conductivity of the W-Cu composition continuous gradient structure contact was achieved, improving the arc erosion resistance of the arc end while ensuring that the overall conductivity was not reduced.
Smart Images

Figure CN119663034B_ABST
Abstract
Citation Information
Patent Citations
Gradient structure hard alloy additive manufacturing method
CN117282978A
Polycrystalline diamond compact with continuous gradient transition layer and 3D printing preparation method thereof
CN117464010A
Method for preparing Cu-W / Mo composite material with bicontinuous structure through powder extrusion forming
CN118023519A